WO2014017856A1 - Method for manufacturing touch panel - Google Patents

Method for manufacturing touch panel Download PDF

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Publication number
WO2014017856A1
WO2014017856A1 PCT/KR2013/006691 KR2013006691W WO2014017856A1 WO 2014017856 A1 WO2014017856 A1 WO 2014017856A1 KR 2013006691 W KR2013006691 W KR 2013006691W WO 2014017856 A1 WO2014017856 A1 WO 2014017856A1
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WO
WIPO (PCT)
Prior art keywords
tempered glass
protective layer
touch panel
glass
manufacturing
Prior art date
Application number
PCT/KR2013/006691
Other languages
French (fr)
Korean (ko)
Inventor
천병순
조현일
정용운
김경호
전헌국
Original Assignee
주식회사 동진쎄미켐
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Publication date
Priority claimed from KR1020130087417A external-priority patent/KR20140015200A/en
Application filed by 주식회사 동진쎄미켐 filed Critical 주식회사 동진쎄미켐
Publication of WO2014017856A1 publication Critical patent/WO2014017856A1/en

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a method for manufacturing a touch panel.
  • the touch panel presses a screen displayed on the panel and inputs information corresponding to the screen.
  • touch panels have been actively applied to all display devices due to ease of use.
  • the touch panel extracts the coordinates of the pressed portion by using a capacitance method, a resistive film method, a surface ultrasonic method, an infrared method, and inputs information.
  • the capacitive method when the user touches the screen, the capacitive method detects a position by recognizing a change amount of current using the capacitance of the human body.
  • the present invention provides a method of manufacturing a touch panel that can improve durability by improving a masking method.
  • a method of manufacturing a touch panel comprising: preparing a tempered glass having a set cell area, forming a touch sensor on one surface of the tempered glass, and covering at least the touch sensor by using a first protective material. 1 forming a protective layer forming a second protective layer covering at least a first protective layer using a second protective material; cutting tempered glass to a size of a set cell area to form a thin tempered glass; Removing the second protective worm of the tempered glass , And removing the first protective layer of sal tempered glass.
  • the first protective material and the second protective material may be acid resistant materials, and the first protective material may be a photoresist.
  • the thickness of a 1st protective layer can be 10-20 micrometers.
  • the second protective material can be a film.
  • Forming the cell-reinforced glass by cutting the tempered glass may be carried out by a cross-sectional etching method.
  • Tempered glass may be formed of aluminosilicate series glass.
  • After removing the second protective layer of the cell-reinforced glass may further comprise the step of primary processing the sal steel glass, and the step of secondary processing the primary processed cell-reinforced glass.
  • Primary processing is a grinding process that processes the outer shape of the tempered glass surface with a dimension of about 0.1 ⁇ 0.2mm larger than the set product specification.
  • Secondary processing is the etching process of the microchip generated during the primary processing. It can be done in a healing process.
  • FIG. 1 is a schematic flowchart of a method of manufacturing a touch panel according to an exemplary embodiment of the present invention.
  • Figure 2 is a photograph showing the cut surface of the cell-reinforced glass in the state where the film is removed to measure under a microscope.
  • FIG. 3 is a photograph showing a processing surface of the cell-reinforced glass processed by the grinding process.
  • Figure 4 is a photograph showing the 3 ⁇ 4 section of the cell tempered glass cut by the cross-sectional spray process.
  • 5A and 5B show a state in which only photoresist is applied by single masking. It is a drawing comparing the image before etching and the image after etching.
  • 6A and 6B are diagrams comparing pre-etching images and post-etching images in a state in which only a film is applied by single masking.
  • a part When a part is referred to as being "on top” of another part, it may be directly on top of another part or may be accompanied by another part in between. In contrast, a part is said to be “directly above” another part. In this case, no other part is interposed therebetween.
  • a first step S100 of preparing tempered glass 10 having a set cell area is performed.
  • tempered glass 10 soda-lime, aluminosilicate glass may be applied.
  • Soda-lime has 10 ⁇ 15um compression depth (D0L) and 400 ⁇ 500MPa compressive stress, Wheel, Sandblast, Wet etching, Water Jet, Laser Cutting can be done in various ways.
  • the compressive strengthening depth (D0L) is 20-40um ( compressive stress is 600MPa or more, so it is not easy to cut by the usual method.
  • the alumina is made of tempered glass 10 because the cracks can be reduced by using a single-sided spray cutting process, which is a single-sided etching method, while applying a film and photoresist simultaneously. No silicide-based glass can be used.
  • the second step S102 of forming the touch sensor 12 on one surface of the tempered glass 10 is performed.
  • the second step S102 is forming each layer for driving the touch sensing.
  • the formation of the touch sensor 12 may use an insulating film when forming the X-axis and the Y-axis on the tempered glass 10. It is also possible to simultaneously form the X axis and the ⁇ axis. In addition, any one of the X-axis and the ⁇ -axis is formed first and the other axis is formed in the film (Film) Can be.
  • the third step S104 of forming the first protective layer 14 covering at least the touch sensor 12 using the first protective material is performed.
  • the first protective material may be an acid resistant material
  • the first protective material may be a photoresist.
  • Step 3 (S104) forms a photoresist for application to the grinding process, which is a primary process, and the healing process, which is a secondary process, respectively.
  • the photoresist is formed, foreign matter and scratches can be minimized in the grinding process.
  • a pattern is formed to be about 0.1 mm larger than the design value in consideration of the removal area in the healing process. Formation of photoresist includes film formation / exposure / development and heating processes.
  • Screen printing includes printing and drying processes.
  • the material formation can be applied to both sides of the tempered glass 10, the thickness is preferably formed to about 10 ⁇ 20um.
  • the thickness of the photoresist is formed to about 10 to 20um, cost reduction and process conditions can be easily maintained due to the lower thickness than the existing material, and the amount of lifting in the grinding process can be reduced.
  • tempered glass was processed using an acid-resistant material of about 100 photoresist or a screen printing paste.
  • the thickness of the photoresist is thin, there is a high risk of delamination during etching cutting, so it is difficult to optimize the alignment problem exposure dose by repeating the photoresist forming process.
  • the embodiment of the present invention simultaneously forms an acid resistant photoresist and an acid resistant film for the post-grinding and healing process.
  • the height of the acid resistant material can be formed as low as about 10 ⁇ 20um. Therefore, there is no need to repeat the photoresist formation process. If the photoresist is thickly formed as in the prior art, the photoresist may be lifted during the grinding process.
  • a photoresist may be formed, and a screen printing paste may be formed as necessary.
  • the fourth protective layer 16 is formed using the second protective material to form the second protective layer 16 covering at least the first protective layer 14.
  • Step S106 is performed.
  • the second protective material may be an acid resistant material, and the second protective material may be a film.
  • the fourth step S106 forms a film for application to the chemical cutting process. It is preferable to form a pattern about 1 mm larger than the design value for dimensional accuracy in film formation.
  • the film can be formed on both sides or on one side of the tempered glass 10.
  • the fifth step S108 is performed to cut the tempered glass 10 to the size of the set sal region to form the cell tempered glass 10a.
  • a cutting process may be performed using a chemical etching method. Etching methods can be sprayed on one side, sprayed on both sides, down flow, etc.
  • the hydrofluoric acid concentration is preferably 30 to 45%, and dimensional control is important according to the hydrofluoric acid concentration. Since the cut surface 20 of the sal tempered glass 10a is a region which has not been strengthened, it may be vulnerable to an outer layer gap. Therefore, it is possible to supplement the reinforcement treatment by applying a paste containing hydrofluoric acid on the side that is not reinforced.
  • the sixth step (S110) is a process of peeling the film in order to perform the primary processing process. Grinding is not easy due to overetching if the film is not peeled off.
  • a seventh step of primary processing the tempered glass 10a is performed.
  • a seventh step (S112) is a grinding (Grinding) tablets for processing the outer shape of the cut surface 20 of the cell-reinforced glass (10a) to form a machining surface (22). Grinding process is about 0.1 ⁇ 0.2mm larger than the product specification set during the primary processing.
  • Secondary processing may be a healing process that removes the microchips generated during grinding using an etching method. Secondary processing is the process of etching about 0.1 ⁇ 0.2 ⁇ to meet the desired product specification. Black matrix at secondary processing (BM; It prevents light leakage by etching to the area of black matrix, and etching using dipping method is suitable.
  • BM Black matrix at secondary processing
  • the relationship between the hydrofluoric acid concentration and the process time is inversely proportional.
  • step 9 removing the first protective layer 14 of the secondary tempered glass (10a) is carried out step 9 (S116).
  • the photoresist B which is an acid resistant material, is formed of the first protective layer 14 for the post-processing of grinding and healing, and the second protective layer 16 covering the first protective layer 14 is formed of an acid resistant film. .
  • the height of the photoresist can be formed as low as about 10-20um, and the risk of peeling during the etching cutting is high, thereby eliminating the problem of repeating the photoresist forming process.
  • a tempered glass 10 having a size of 370 mm x 470 mm and a thickness of 0.7 mm 3 was prepared.
  • the tempering depth was 40um and the compressive force was 645MPa aluminosilicate series tempered glass.
  • the touch sensor 12 formed a bridge having a characteristic value of 200 A of the first electrode layer and 45 / ⁇ of sheet resistance. After the first electrode layer was formed, an insulator was formed to a thickness of 1.5 um. The second electrode layers are X, Y layers, and 200 A, and the sheet resistance is 45? The trace portion was formed of molybdenum / aluminum / molybdenum (Mo / Al / Mo) and had a thickness of 2,400 A (Mo; 300 A, A1; 1600 A, Mo; 500 A). At this time, the sheet resistance was 0.4 / k. In the following process, the overcoat was formed to a thickness of 1.5 um to protect the electrode layer and the trace layer. The size of the touch sensor 12 is 120mm x 60mm, and arranged at intervals of 3mm to form 15 sheets.
  • Acid resistant materials were formed using photoresist.
  • acrylic resin was used.
  • the coating method was bar coating and the coating thickness was 20.
  • Exposure was carried out using a metal halide column, the irradiation amount was 100mJ / cm2.
  • the developing and post-exposure process was carried out for Na 2 CO 3, concentration 0.4%, and time for 150 seconds.
  • the post exposure process was carried out at l, 000 mJ / cm 2. After forming one side, the other side proceeded in the same way.
  • the dimension after the post-exposure process was 120.15 X 60.13 mm.
  • the film is a PVC film (PVC) film after lamination (Lamination) and then formed a pattern using a laser (Laser) to remove the etching portion.
  • PVC PVC film
  • Laser laser
  • the opposite side was formed in the same way.
  • the dimension was 122.1 X 62.1 mm 3.
  • the etching process was performed by horizontally spraying 30% blonic acid solution at 30 ° C. against the masked tempered glass 10 at a spray pressure of 1.0 to 1.5 kgf / cm 2 for 10 minutes to one surface.
  • etching was performed by spraying horizontally on another surface in the same manner. The etching process was performed to secure 15 cells without breakage. 2 is It was the photograph which showed the cut surface 20 of the sal tempered glass 10a in which the film was removed in order to measure with a microscope, and was 120.33 X 60.32 kPa on average.
  • the film was peeled off to proceed with the grinding process.
  • the film can be peeled off manually.
  • FIG. 3 is a photograph showing the processed surface 22 of the cell-reinforced glass 10a processed by the process per line.
  • the dimension measurement result was 120.15 X 60.15 mm.
  • the healing process was carried out using a dipping method, and the healing solution was evaluated as 15% hydrofluoric acid and 15 minutes.
  • the shape of the processing surface 22 was not significantly different from the grinding, it was confirmed that the chip (chip) is removed.
  • the dimension was 120.03 X 60.02 ⁇ and satisfied the design standard ⁇ 50um.
  • Photoresist stripping was performed at 12% sodium hydroxide (NaOH) at 60 ° C. for 2 minutes to remove residual photoresist. Meanwhile, the bending strength evaluation was conducted to secure the bending strength characteristics according to the healing process. The equipment was evaluated with a 3-axis bending machine, and the span length was 80 mm at the bottom, 40 mm at the top, and the speed was 100 mm / min. If only the grinding results are measured, Min. 11.04, Max 12.33kgf, the stiffness after healing was Min 28.7, Max. It was confirmed that the improvement was about 2 times or more to 40.36kgf. In case of sal tempered glass (10a), Min 29.40 and Max 34.17kgf were used.
  • FIG. 4 is a photograph showing the cut surface 20a of the cell tempered glass 10b cut by the cross-sectional spray process.
  • the cutting process time according to the second embodiment took 20 minutes. Is a cross-section etched in the upper portion of the cross-section of the spraying process, if i cross-section etched with the touch position sensor 12 in the lower region of the glass cell (10b) and Sal glass (10b) as described above. As described above, cross-sectional etching on the upper part of the tempered glass 10b was effective in protecting the touch sensor 12 in the lower region.
  • the cell-reinforced glass 10b is cut by a double masking process for simultaneously applying a film and a photoresist, but the following problems occur in a single masking process for applying only one film or photoresist. It was.
  • 5A and 5B show a comparison of an image before etching and an image after etching in a single masking state in which only one photoresist is coated.
  • the photoresist is not peeled off in the pre-etched image as shown in FIG. 5A, and the photoresist is peeled off in the post-etched image as shown in FIG. 5B.
  • the photoresist when only the photoresist, which is an acid resistant material, is applied and the film is not used, the photoresist is peeled off during the etching process, affecting the touch sensor, and then the process cannot be performed.
  • black matrix damage of about 100 to 150 um was induced after etching.
  • Figure 6a and Figure 6b is the "image with the image before etching after etching while applying only a single masking film ratio i sophisticated drawing.
  • the black matrix region is not damaged in the pre-quenching image, and the black matrix region is damaged in the post-etching image as in FIG. 6B.
  • the black matrix region may be damaged during the etching process. Also, when only the film was applied with a single masking, the film was peeled off in the grinding process, which could damage the touch sensor in a later process.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Surface Treatment Of Glass (AREA)
  • Position Input By Displaying (AREA)

Abstract

Provided is a method for manufacturing a touch panel, capable of improving durability by improving a masking method. The method for manufacturing a touch panel according to one embodiment of the present invention comprises the steps of: preparing tempered glass having a set cell region; forming a touch sensor on one side of the tempered glass; forming a first protective layer that covers at least the touch sensor using a first protective material; forming a second protective layer that covers at least the first protective layer using a second protective material; forming cellular tempered glass by cutting the tempered glass into the size of the set cell region; removing the second protective layer of the cellular tempered glass; and removing the first protective layer of the cellular tempered glass.

Description

【명세서】  【Specification】
【발명의 명칭】  [Name of invention]
터치패널의 제조방법  Manufacturing Method of Touch Panel
【기술분야】  Technical Field
본 '출원은 2012년 7월 27일에 출원한 한국특허출원 제 2012- This patent application is filed on July 27, 2012.
0082715호와 2013년 7월 24일에 출원한 한국특허출원 제 2013-0087417호를 기초로 한 우선권을 주장하여 출원하였으며, 상기 출원은 본 출원의 내용에 참조로 결부되어 있다. Priority was filed based on 0082715 and Korean Patent Application No. 2013-0087417 filed on July 24, 2013, which is incorporated by reference in the content of the present application.
본 발명은 터치패널의 제조방법에 관한 것이다.  The present invention relates to a method for manufacturing a touch panel.
【배경기술】  Background Art
터치패널은 패널에 표시된 화면을 가압하여 화면에 대응되는 정보를 입력한다. 사용상의 편의성으로 인해 최근들어 터치패널이 모든 디스플레이 장치에 활발하게 적용되고 있다.  The touch panel presses a screen displayed on the panel and inputs information corresponding to the screen. Recently, touch panels have been actively applied to all display devices due to ease of use.
일반적으로, 터치패널은 정전용량방식, 저항막방식, 표면초음파 방식, 적외선방식 등을 이용하여 가압된 부분의 좌표를 추출하고 정보를 입력한다. 여기서, 정전용량방식은 사용자가 화면을 터치하는 경우, 인체의 정전용량을 이용해 전류 변화량을 인식하여 위치를 검출한다.  In general, the touch panel extracts the coordinates of the pressed portion by using a capacitance method, a resistive film method, a surface ultrasonic method, an infrared method, and inputs information. Here, in the capacitive method, when the user touches the screen, the capacitive method detects a position by recognizing a change amount of current using the capacitance of the human body.
【발명의 내용】  [Content of invention]
【해결하려는 과제]  [Action to be solved]
마스킹 방법을 개선하여 내구성을 향상시킬 수 있는 터치패널의 제조방법을 제공한다.  The present invention provides a method of manufacturing a touch panel that can improve durability by improving a masking method.
【과제의 해결 수단】  [Measures of problem]
본 발명의 실시예에 따른 터치패널의 제조방법은 설정된 셀 영역을 갖는 강화유리를 준비하는 단계, 강화유리의 일면에 터치센서를 형성하는 단계, 제 1 보호 재료를 이용하여 적어도 터치센서를 덮는 제 1 보호층을 형성하는 단계 제 2 보호 재료를 이용하여 적어도 제 1 보호층을 덮는 제 2 보호층을 형성하는 단계, 강화유리를 설정된 셀 영역의 크기로 절단하여 샐강화유리를 형성하는 단계, 셀강화유리의 제 2 보호충을 제거하는 단계, 및 샐강화유리의 제 1보호층을 제거하는 단계를 포함한다. According to an aspect of the present invention, there is provided a method of manufacturing a touch panel, the method comprising: preparing a tempered glass having a set cell area, forming a touch sensor on one surface of the tempered glass, and covering at least the touch sensor by using a first protective material. 1 forming a protective layer forming a second protective layer covering at least a first protective layer using a second protective material; cutting tempered glass to a size of a set cell area to form a thin tempered glass; Removing the second protective worm of the tempered glass , And removing the first protective layer of sal tempered glass.
제 1 보호 재료와 제 2 보호 재료는 내산성 재료일 수 있으며, 제 1 보호 재료는 포토레지스트로 할 수 있다. 제 1 보호층의 두께는 10~20um로 할 수 있다. 제 2 보호 재료는 필름으로 할 수 있다. 강화유리의 절단으로 셀강화유리를 형성하는 단계는 단면에칭 공법으로 진행할 수 있다. 강화유리는 알루미노 실리케이트 계열 유리로 형성할 수 있다.  The first protective material and the second protective material may be acid resistant materials, and the first protective material may be a photoresist. The thickness of a 1st protective layer can be 10-20 micrometers. The second protective material can be a film. Forming the cell-reinforced glass by cutting the tempered glass may be carried out by a cross-sectional etching method. Tempered glass may be formed of aluminosilicate series glass.
셀강화유리의 제 2 보호층을 제거한 후 샐강 유리를 1차 가공하는 단계, 및 1차 가공된 셀강화유리를 2차 가공하는 단계를 더 포함할 수 있다. 1차 가공은 설정된 제품사양 보다 약 0.1~0.2mm 큰 치수로 강화유리면의 외곽 형상을 가공하는 그라인딩 (Grinding) 공정이며, 2차 가공은 1차 가공시 발생한 마이크로 칩 (Micro Chip)을 에칭 공법으로 계거하는 힐링 (Healing) 공정으로 할 수 있다.  After removing the second protective layer of the cell-reinforced glass may further comprise the step of primary processing the sal steel glass, and the step of secondary processing the primary processed cell-reinforced glass. Primary processing is a grinding process that processes the outer shape of the tempered glass surface with a dimension of about 0.1 ~ 0.2mm larger than the set product specification. Secondary processing is the etching process of the microchip generated during the primary processing. It can be done in a healing process.
【발명의 효과】  【Effects of the Invention】
포토레지스트 도막 두께를 기존 재료 대비 약 3~5배 정도 얇게 형성할 수 있어서 재료비 절감 및 공정조건을 간소'화할 수 있다. In the photoresist film thickness of about 3 to form ~ 5 times thinner than conventional materials can be simple hwahal, the material costs and process conditions.
또한, 그라인딩과 힐링 등의 가공공정에 적합하여 절단된 샐강화유리의 외곽부에 원하는 형상 및 치수를 얻을 수 있다.  In addition, it is possible to obtain a desired shape and dimensions on the outer portion of the cut tempered glass suitable for processing such as grinding and healing.
또한, 그라인딩 공정에서 들뜸에 대한 불량을 감소시킬 수 있다.  In addition, it is possible to reduce the failure to lift in the grinding process.
【도면의 간단한 설명】  [Brief Description of Drawings]
도 1은 본 발명의 실사예에 따른 터치패널의 제조방법의 개략적인 순서도이다.  1 is a schematic flowchart of a method of manufacturing a touch panel according to an exemplary embodiment of the present invention.
도 2는 현미경으로 측정하기 위하여 필름이 제거된 상태의 셀강화유리의 절단면을 나타낸 사진이다.  Figure 2 is a photograph showing the cut surface of the cell-reinforced glass in the state where the film is removed to measure under a microscope.
도 3은 그라인딩 공정으로 가공된 셀강화유리의 가공면을 나타낸 사진이다.  3 is a photograph showing a processing surface of the cell-reinforced glass processed by the grinding process.
도 4는 단면 스프레이 공정으로 절단된 셀강화유리의 ¾단면을 나타낸 사진이다.  Figure 4 is a photograph showing the ¾ section of the cell tempered glass cut by the cross-sectional spray process.
도 5a와 도 5b는 단일 마스킹으로 포토레지스트만 적용한 상태에서 에칭전 이미지와 에칭후 이미지를 비교한 도면이다. 5A and 5B show a state in which only photoresist is applied by single masking. It is a drawing comparing the image before etching and the image after etching.
도 6a와 도 6b는 단일 마스킹으로 필름만 적용한 상태에서 에칭전 이미지와 에칭후 이미지를 비교한 도면이다.  6A and 6B are diagrams comparing pre-etching images and post-etching images in a state in which only a film is applied by single masking.
【발명을 실시하기 위한 구체적인 내용】  [Specific contents to carry out invention]
어느 부분이 다른 부분의 "위에'' 있다고 언급하는 경우, 이는 바로 다른 부분의 위에 있을 수 있거나 그 사이에 다른 부분이 수반될 수 있다. 대조적으로 어느 부분이 다른 부분의 "바로 위에" 있다고 언급하는 경우, 그 사이에 다른 부분이 개재되지 않는다.  When a part is referred to as being "on top" of another part, it may be directly on top of another part or may be accompanied by another part in between. In contrast, a part is said to be "directly above" another part. In this case, no other part is interposed therebetween.
여기서 사용되는 전문용어는 단지 특정 실시예를 언급하기 위한 것이며, 본 발명을 한정하는 것을 의도하지 않는다. 여기서 사용되는 단수 형태들은 문구들이 이와 명백히 반대의 의미를 나타내지 않는 한 복수 형태들도 포함한다.. 명세서에서 사용되는 "포함하는' '의 의미는 특정 특성, 영역, 정수, 단계, 동작, 요소 및 /또는 성분을 구체화하며, 다른 특정 특성, 영역, 정수, 단계, 동작, 요소, 성분 및 /또는 군의 존재나 부가를 제외시키는 것은 아니다. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a,” “an,” and “the” include plural forms as well, unless the phrases clearly indicate the opposite. . As used herein, the meaning of "comprising" means to specify a particular characteristic, region, integer, step, operation, element and / or component, and other specific characteristics, region, integer, step, operation, element, component and / or component. It does not exclude the presence or addition of groups.
"아래 ", "위'' 등의 상대적인 공간을 나타내는 용어는 도면에서 도시된 한 부분의 다른 부분에 대한 관계를 좀더 쉽게 설명하기 위해 사용될 수 있다. 이러한 용어들은 도면에서 의도한 의미와 함께 사용중인 장치의 다른 의미나 동작을 포함하도록 의도된다. 예를 들면, 도면중의 장치를 뒤집으면, 다른 부분들의 "아래"에 있는 것으로 설명된 어느 부분들은 다른 부분들의 "위''에 있는 것으로 설명된다. 따라서 "아래''라는 예시적인 용어는 위와 아래 방향을 전부 포함한다. 장치는 90° 회전 또는 다른 각도로 희전할 수 있고, 상대적인 공간을 나타내는 용어도 이에 따라서 해석된다. Terms indicating relative spaces such as "below" and "above" may be used to more easily describe the relationship of one part to another shown in the drawings. These terms may be used together with their intended meanings in the drawings. It is intended to include other meanings or operations of the device, for example, by inverting the device in the figures, some parts described as being "below" of other parts are described as being "above" other parts. . Thus, the exemplary term “below” encompasses both up and down directions, wherein the device may be rotated at 90 ° or other angles, and terms representing relative space are also interpreted accordingly.
다르게 정의하지는 않았지만, 여기에 사용되는 기술용어 및 과학용어를 포함하는 모든 용어들은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 일반적으로 이해하는 의미와 동일한 의미를 가진다. 보통 사용되는 사전에 정의된 용어들은 관련기술문헌과현재 개시된 내용에 부합하는 의미를 가지는 것으로 추가 해석되고, 정의되지 않는 한 이상적이거나 매우 공식적인 의미로 해석되지 않는다. Although not defined otherwise, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Commonly defined terms used in the related literature and the presently disclosed contents It is additionally construed as having a matching meaning and is not construed in an ideal or very formal sense unless defined.
이하, 첨부한 도면을 참조하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다.  DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.
도 1은 본 발명의 실시예에 따른 터치패널의 제조방법을 개략적으로 나타낸 공정 흐름도이다. 도 1을 참조하면, 터치패널의 제조방법은 단지 본 발명을 예시하기 위한 것이며, 본 발명이 여기에 한정되는 것은 아니다. 먼저, 설정된 셀 영역을 갖는 강화유리 (10)를 준비하는 제 1 단계 (S100)를 수행한다. 강화유리 (10)의 경우 소다라임, 알루미노 실리케이트 유리를 적용할 수 있다. 소다라임의 경우 압축 강화 깊이 (D0L)가 10~15um, 압축응력이 400~500MPa로 휠 (Wheel), 샌드블라스트 (Sandblast), 습식에칭 (Wet etching), 워터제트 (Water Jet), 레이저 (Laser)등 다양한 방법으로 절단이 가능하다. 알루미노 실리케이트 계열 유리의 경우 압축 강화 깊이 (D0L)이 20~40um( 압축응력이 600MPa이상으로 일반적인 방법으로 절단이 용이하지 않다. 상기한 바와 같이 알루미노 실리케이트 계열 유리는 압축웅력이 높아서 크랙이 발생하기 쉬운 문제가 있다. 이러한 이유로 본 발명의 실시예에서는 필름과 포토레지스트를 동시에 적용하는 공정을 적용하면서 단면에칭 공법인 단면 스프레이 절단공정을 사용하면 크랙을 감소시킬 수 있기 때문에 강화유리 (10)로 알루미노 실리게이트 계열의 유리를 사용할 수 있다. 1 is a process flowchart schematically showing a method of manufacturing a touch panel according to an exemplary embodiment of the present invention. Referring to FIG. 1, the manufacturing method of the touch panel is merely for illustrating the present invention, and the present invention is not limited thereto. First, a first step S100 of preparing tempered glass 10 having a set cell area is performed. In the case of tempered glass 10, soda-lime, aluminosilicate glass may be applied. Soda-lime has 10 ~ 15um compression depth (D0L) and 400 ~ 500MPa compressive stress, Wheel, Sandblast, Wet etching, Water Jet, Laser Cutting can be done in various ways. In the case of aluminosilicate glass, the compressive strengthening depth (D0L) is 20-40um ( compressive stress is 600MPa or more, so it is not easy to cut by the usual method. For this reason, in the embodiment of the present invention, the alumina is made of tempered glass 10 because the cracks can be reduced by using a single-sided spray cutting process, which is a single-sided etching method, while applying a film and photoresist simultaneously. No silicide-based glass can be used.
전술한 제 1 단계 (S100)가 완료되면, 강화유리 (10)의 일면에 터치센서 (12)를 형성하는 제 2 단계 (S102)를 수행한다. 제 2 단계 (S102)는 터치센싱 구동을 위한 각 층 (Layer) 형성단계이다. 터치센서 (12)의 형성은 강화유리 (10)에 X축 및 Y축을 형성시 절연막을 이용할 수 있다. 또한, X축과 γ축을 동시에 형성할 수도 있다. 또한, X축과 γ축 가운데 어느 한축을 먼저 형성하고 나머지 축은 필름 (Film)에 형성하는 경우도 포함할 수 있다. When the above-described first step S100 is completed, the second step S102 of forming the touch sensor 12 on one surface of the tempered glass 10 is performed. The second step S102 is forming each layer for driving the touch sensing. The formation of the touch sensor 12 may use an insulating film when forming the X-axis and the Y-axis on the tempered glass 10. It is also possible to simultaneously form the X axis and the γ axis. In addition, any one of the X-axis and the γ-axis is formed first and the other axis is formed in the film (Film) Can be.
전술한 제 2 단계 (S102)가 완료되면, 제 1 보호 재료를 이용하여 적어도 터치센서 (12)를 덮는 제 1 보호층 (14)을 형성하는 계 3 단계 (S104)를 수행한다. 제 1 보호 재료는 내산성 재료일 수 있으며, 제 1 보호 재료는 포토레지스트로 할 수 있다. 계 3 단계 (S104)는 1차 가공인 그라인딩 공정과 2차 가공인 힐링 공정에 각각 적용하기 위한 포토레지스트를 형성한다. 포토레지스트를 형성함에 따라 그라인딩 공정에서 이물, 스크래치 (Scratch)를 최소화할 수 있다. 또한 포토레지스트를 형성시 힐링 공정에서의 제거영역을 고려하여 설계치 대비 약 0.1mm크게 패턴 (Pattern) 형성을 한다. 포토레지스트를 형성할 경우 막형성 /노광 /현상 및 가열 공정을 포함한다. 스크린 인쇄의 경우 인쇄 공정과 건조 공정을 포함한다. 또한 재료 양성은 강화유리 (10)의 양면에 적용할 수 있으며, 두께는 약 10~20um로 형성하는 것이 바람직하다. 포토레지스트의 두께를 약 10~20um로 형성함에 따라 기존 재료 대비 낮은 두께로 인해 비용 절감과 공정 조건을 간단하게 유지할 수 있고, 그라인딩공정에서 들뜸에 대한 블량을 줄일 수 있는 효과가 있다. 종래기술에서는 내산성 재료를 약 lOOum의 포토레지스트 또는 스크린 인쇄용 페이스트를 이용하여 강화유리를 가공하였다. 그러나, 포토레지스트의 두께가 얇을 경우 에칭 절단시 박리의 위험이 높아서 포토레지스트 형성 공정을 반복함으로써 얼라인 문제 노광량의 최적화가 난해하다. 본 발명의 실시예는 그라인딩, 힐링의 후 공정을 위해 내산성 재료인 포토레지스트와 내산성 필름을 동시에 형성한다. 내산성 재료의 높이는 약 10~20um로 낮게 형성할 수 있다. 따라서, 포토레지스트 형성 공정을 반복할 필요가 없다. 만약, 종래기술과 같이 포토레지스트를 두껍게 형성하는 경우에는 그라인딩 공정시 포토레지스트가 들뜨는 문제가 발생할 수 있다. 제 3 단계 (S104)에서 포토레지스트를 형성할 수 있으며, 필요에 따라 스크린 인쇄용 페이스트 (Paste)를 형성할 수도 있다.  When the above-described second step S102 is completed, the third step S104 of forming the first protective layer 14 covering at least the touch sensor 12 using the first protective material is performed. The first protective material may be an acid resistant material, and the first protective material may be a photoresist. Step 3 (S104) forms a photoresist for application to the grinding process, which is a primary process, and the healing process, which is a secondary process, respectively. As the photoresist is formed, foreign matter and scratches can be minimized in the grinding process. In addition, when the photoresist is formed, a pattern is formed to be about 0.1 mm larger than the design value in consideration of the removal area in the healing process. Formation of photoresist includes film formation / exposure / development and heating processes. Screen printing includes printing and drying processes. In addition, the material formation can be applied to both sides of the tempered glass 10, the thickness is preferably formed to about 10 ~ 20um. As the thickness of the photoresist is formed to about 10 to 20um, cost reduction and process conditions can be easily maintained due to the lower thickness than the existing material, and the amount of lifting in the grinding process can be reduced. In the prior art, tempered glass was processed using an acid-resistant material of about 100 photoresist or a screen printing paste. However, when the thickness of the photoresist is thin, there is a high risk of delamination during etching cutting, so it is difficult to optimize the alignment problem exposure dose by repeating the photoresist forming process. The embodiment of the present invention simultaneously forms an acid resistant photoresist and an acid resistant film for the post-grinding and healing process. The height of the acid resistant material can be formed as low as about 10 ~ 20um. Therefore, there is no need to repeat the photoresist formation process. If the photoresist is thickly formed as in the prior art, the photoresist may be lifted during the grinding process. In the third step S104, a photoresist may be formed, and a screen printing paste may be formed as necessary.
전술한 게 3 단계 (S104)가 완료되면, 제 2 보호 재료를 이용하여 적어도 제 1 보호충 (14)을 덮는 제 2 보호층 (16)을 형성하는 제 4 단계 (S106)를 수행한다. 제 2 보호 재료는 내산성 재료일 수 있으며, 제 2 보호 재료는 필름 (Film)으로 할 수 있다. 제 4 단계 (S106)는 화학적 절단 공정에 적용하기 위한 필름을 형성한다. 필름 형성시 치수 정밀도를 위해서 설계치 대비 약 1mm 크게 패턴을 형성하는 것이 바람직하다. 필름은 강화유리 (10)의 양면 또는 단면에 형성할 수 있다. When the above-described step 3 (S104) is completed, the fourth protective layer 16 is formed using the second protective material to form the second protective layer 16 covering at least the first protective layer 14. Step S106 is performed. The second protective material may be an acid resistant material, and the second protective material may be a film. The fourth step S106 forms a film for application to the chemical cutting process. It is preferable to form a pattern about 1 mm larger than the design value for dimensional accuracy in film formation. The film can be formed on both sides or on one side of the tempered glass 10.
전술한 제 4 단계 (S106)가 완료되면, 강화유리 (10)를 설정된 샐 영역의 크기로 절단하여 셀강화유리 (10a)를 형성하는 제 5 단계 (S108)를 수행한다. 제 5 단계 (S108)는 화학적 에칭 방법을 이용하여 절단 (Cutting)공정을 진행할 수 있다. 에칭 공법은 단면 스프레이 (Spray), 양면 스프레이, 다운 플로우 (Down Flow)등꾀 공법이 가능하다, 불산 농도는 30~45%가 바람직하며, 불산 농도에 따라 치수 제어가 중요하다. 샐강화유리 (10a)의 절단면 (20)은 강화 처리가 안된 영역이므로 외부 층격에 약해질 수 있다. 따라서 강화 처리되지 않은 측면에 불산이 포함된 페이스트를 도포한후 세척하여 강화 처리를 보완할 수 있다.  When the fourth step S106 described above is completed, the fifth step S108 is performed to cut the tempered glass 10 to the size of the set sal region to form the cell tempered glass 10a. In a fifth step S108, a cutting process may be performed using a chemical etching method. Etching methods can be sprayed on one side, sprayed on both sides, down flow, etc. The hydrofluoric acid concentration is preferably 30 to 45%, and dimensional control is important according to the hydrofluoric acid concentration. Since the cut surface 20 of the sal tempered glass 10a is a region which has not been strengthened, it may be vulnerable to an outer layer gap. Therefore, it is possible to supplement the reinforcement treatment by applying a paste containing hydrofluoric acid on the side that is not reinforced.
전술한 제 5 단계 (S108)가 완료되면, 샐강화유리 (10a)의 제 2 보호층 (16)을 제거하는 제 6 단계를 수행한다. 제 6 단계 (S110)는 1차 가공 공정을 수행하기 위해서 필름을 박리하는 공정이다. 필름을 박리하지 않을 경우 과에칭에 의하여 그라인딩이 용이하지 않다.  When the fifth step S108 is completed, the sixth step of removing the second protective layer 16 of the sal tempered glass 10a is performed. The sixth step (S110) is a process of peeling the film in order to perform the primary processing process. Grinding is not easy due to overetching if the film is not peeled off.
전술한 계 6 단계 (S110)가 완료되면, 샐강화유리 (10a)를 1차 가공하는 제 7 단계를 수행한다. 제 7 단계 (S112)는 셀강화유리 (10a)의 절단면 (20) 외곽 형상을 가공하여 가공면 (22)을 형성하는 그라인딩 (Grinding) 송정이다. 1차 가공시 설정된 제품 사양보다 약 0.1~0.2mm 크게 그라인딩 공정을 진행한다.  When the sixth step S110 described above is completed, a seventh step of primary processing the tempered glass 10a is performed. A seventh step (S112) is a grinding (Grinding) tablets for processing the outer shape of the cut surface 20 of the cell-reinforced glass (10a) to form a machining surface (22). Grinding process is about 0.1 ~ 0.2mm larger than the product specification set during the primary processing.
전술한 제 7 단계 (S112)가 완료되면, 1차 가공된 셀강화유리 (10a)를 2차 가공하는 게 8 단계 (S114)를 수행한다. 2차 가공은 에칭 공법을 이용하여 그라인딩시 발생한 마이크로 칩 (Micro Chip)을 제거하는 힐링 (Healing) 공정으로 할 수 있다. 2차 가공은 약 0.1~0.2瞧를 에칭하여 원하는 제품 사양에 맞추는 공정이다. 2차 가공시 블랙 메트릭스 (BM ; black matrix) 영역까지 에칭을 하여 빛샘을 방지하며, 디핑 (Dipping) 방식을 이용한 에칭이 적합하다. 참고로, 불산 농도와 공정 시간과의 관계는 반비례이다. When the seventh step (S112) described above is completed, the eighth step (S114) to perform the second step of the primary processed cell-reinforced glass (10a). Secondary processing may be a healing process that removes the microchips generated during grinding using an etching method. Secondary processing is the process of etching about 0.1 ~ 0.2 瞧 to meet the desired product specification. Black matrix at secondary processing (BM; It prevents light leakage by etching to the area of black matrix, and etching using dipping method is suitable. For reference, the relationship between the hydrofluoric acid concentration and the process time is inversely proportional.
전술한 제 8 단계 (S114)가 완료되면, 2차 가공된 셀강화유리 (10a)의 제 1 보호층 (14)을 제거하는 게 9 단계 (S116)를 수행한다.  When the eighth step (S114) described above is completed, removing the first protective layer 14 of the secondary tempered glass (10a) is carried out step 9 (S116).
상기한 바와 같아 강화유리 (10)로 패널을 형성한 후 복수의 셀강화유리 (10a)로 절단함에 따라 미리 '절단된 셀강화유리 (10a)로 패널을 형성할 때에 비해 동시에 여러 샐강화유리 (10a)에 동일한 공정을 적용할 수 있다. 따라서, 생산 시간을 단축시키고 공정을 효율적으로 관리할 수 있는 장점이 있다. 또한, 그라인딩과 힐링의 후 공정을 위해 내산성 재료인 포토레지스 B를 제 1 보호층 (14)으로 형성하고, 제 1 보호층 (14)을 덮는 제 2 보호층 (16)을 내산성 필름으로 형성한다. 따라서, 포토레지스트의 높이를 약 10-20um로 낮게 형성할 수 있으며, 에칭 절단시 박리의 위험이 높아서 포토레지스트 형성 공정을 반복하는 문제를 해소할 수 있다. 강화유리 (10)로 패널 형성 공정이 완료되면, 복수의 샐강화유리 (10a)로 절단하기 위해 마스크를 적용하고, 불소 에칭을 수행하여 강화유리 (10)를 샐강화유리 (10a)로 . 절단한다. 이후 제 2 보호층 (16)을 제거하고, 셀강화유리 (10a)의 절단면 (20)을 그라인딩 및 힐링 처리한 후 제 1 보호층 (14)을 제거하면 터치 패널의 제조가 완성된다. The one described like glass 10 to the after forming the panel at the same time than the formation of the panel to the 'cut-cell glass (10a) in advance, as cut into a plurality of cells glass (10a) several Sal glass ( The same process can be applied to 10a). Therefore, there is an advantage that can reduce the production time and efficiently manage the process. In addition, the photoresist B, which is an acid resistant material, is formed of the first protective layer 14 for the post-processing of grinding and healing, and the second protective layer 16 covering the first protective layer 14 is formed of an acid resistant film. . Therefore, the height of the photoresist can be formed as low as about 10-20um, and the risk of peeling during the etching cutting is high, thereby eliminating the problem of repeating the photoresist forming process. When the panel forming process of the tempered glass 10 is completed, a mask is applied to cut the plurality of sal tempered glass 10a, and fluorine etching is performed to convert the tempered glass 10 into the tempered glass 10a. Cut. Thereafter, the second protective layer 16 is removed, the cutting surface 20 of the cell tempered glass 10a is ground and healed, and then the first protective layer 14 is removed to manufacture the touch panel.
이하에서는 실험예를 통하여 본 발명을 좀더 상세하게 설명한다. 이러한 실험예는 단지 본 발명을 예시하기 위한 것이며, :본 발명이 여기에 한정되는 것은 아니다.  Hereinafter, the present invention will be described in more detail through experimental examples. These experimental examples are only for illustrating the present invention, and the present invention is not limited thereto.
제 1 실험예  Experimental Example 1
1) 제 1 단계 (S100)  1) First step (S100)
크기가 370mm X 470mm이며, 두께는 0.7隱인 강화유리 (10)를 준비하였다. 강화 깊이는 40um이며, 압축 웅력은 645MPa인 알루미노 실리케이트 계열의 강화유리였다.  A tempered glass 10 having a size of 370 mm x 470 mm and a thickness of 0.7 mm 3 was prepared. The tempering depth was 40um and the compressive force was 645MPa aluminosilicate series tempered glass.
2) 제 2 단계 (S102) 터치센서 (12)는 제 1 전극층 (ITO Layer)은 200A, 면저항은 45 /口의 특성치를 가진 브릿지 (Bridge)를 형성하였다. 게 1 전극층 형성 후 절연체 (Insulator)를 1.5um 두께로 형성하였다. 제 2 전극층은 X, Y층으로 200 A , 면저항은 45ΩΛ]의 특성치를 나타내었다. 트레이스 (Trace)부는 몰리브덴 /알루미늄 /몰리브덴 (Mo/Al/Mo)으로 형성하였으며, 두께는 2 ,400 A (Mo ; 300 A, A1 ; 1,600 A, Mo ; 500 A)을 형성하였다. 이때 면저항은 0.4 /ᄆ이었다. 다음 공정으로 오버코트 (Overcoat)를 1.5um 두께로 형성하여 전극층 (ΠΌ)과 트레이스 (Trace)층을 보호하였다. 터치센서 (12)의 크기는 120mm X 60mm이며, 3mm 간격으로 배치하여 15장을 형성하였다. 2) second step (S102) The touch sensor 12 formed a bridge having a characteristic value of 200 A of the first electrode layer and 45 / 口 of sheet resistance. After the first electrode layer was formed, an insulator was formed to a thickness of 1.5 um. The second electrode layers are X, Y layers, and 200 A, and the sheet resistance is 45? The trace portion was formed of molybdenum / aluminum / molybdenum (Mo / Al / Mo) and had a thickness of 2,400 A (Mo; 300 A, A1; 1600 A, Mo; 500 A). At this time, the sheet resistance was 0.4 / k. In the following process, the overcoat was formed to a thickness of 1.5 um to protect the electrode layer and the trace layer. The size of the touch sensor 12 is 120mm x 60mm, and arranged at intervals of 3mm to form 15 sheets.
3) 제 3 단계 (S104)  3) Third Step (S104)
내산성 재료는 포토레지스트를 사용하여 형성하였다. 내산성 재료는 아크릴 (Acryl) 계열의 수지를 사용하였으며, 막형성을 위해 도장방법은 바코팅, 도장 두께는 20 를 형성하였다. 노광은 메탈할라이드둥을 이용하였으며, 조사량은 100mJ/cm2로 하였다. 현상 및 후노광공정으로 현상액은 Na2C03, 농도는 0.4%, 시간은 150초 동안 진행하였다. 후노광공정은 l,000mJ/cm2로 진행하였다. 한면을 형성한 후 반대면도 같은 방법으로 진행하였다. 후노광공정 후 치수 측정시 120.15 X 60.13mm이었다.  Acid resistant materials were formed using photoresist. As the acid resistant material, acrylic resin was used. For the film formation, the coating method was bar coating and the coating thickness was 20. Exposure was carried out using a metal halide column, the irradiation amount was 100mJ / cm2. The developing and post-exposure process was carried out for Na 2 CO 3, concentration 0.4%, and time for 150 seconds. The post exposure process was carried out at l, 000 mJ / cm 2. After forming one side, the other side proceeded in the same way. The dimension after the post-exposure process was 120.15 X 60.13 mm.
4) 제 4 단계 (S106)  4) Fourth Step (S106)
필름은 피브이씨 (PVC) 필름으로 전면 라미네이션 (Lamination)후 레이저 (Laser)를 이용하여 패턴을 형성한 후 에칭부분을 제거하였다. 반대면도 같은 방법으로 형성하였다. 치수는 122.1 X 62.1瞧이었다.  The film is a PVC film (PVC) film after lamination (Lamination) and then formed a pattern using a laser (Laser) to remove the etching portion. The opposite side was formed in the same way. The dimension was 122.1 X 62.1 mm 3.
5) 제 5 단계 (S108)  5) The fifth step (S108)
에칭 공정은 마스킹한 강화유리 (10)에 대하여 30 °C에서 30%의 블산 용액을 1.0 내지 1.5 kgf/cm2의 스프레이 노즐의 분사 압력으로 10분 동안 한쪽 표면에 대하여 수평 분사하여 에칭을 수행하였다. 또한, 별도로 동일한 방법으로 다른 표면에 대하여 수평 분사하여 에칭을 수행하였다. 에칭 공정을 수행하여 파손 없이 15장의 셀 (Cell)을 확보하였다. 도 2는 현미경으로 측정하기 위하여 필름이 제거된 상태의 샐강화유리 (10a)의 절단면 (20)을 나타낸 사진이며, 치수 측정 결과 평균 120.33 X 60.32睡이었다. The etching process was performed by horizontally spraying 30% blonic acid solution at 30 ° C. against the masked tempered glass 10 at a spray pressure of 1.0 to 1.5 kgf / cm 2 for 10 minutes to one surface. In addition, etching was performed by spraying horizontally on another surface in the same manner. The etching process was performed to secure 15 cells without breakage. 2 is It was the photograph which showed the cut surface 20 of the sal tempered glass 10a in which the film was removed in order to measure with a microscope, and was 120.33 X 60.32 kPa on average.
6) 제 6 단계 (S110)  6) Sixth Step (S110)
그라인딩 공정을 진행하기 위하여 필름을 박리하였다. 필름은 수작업으로 박리할 수 있다.  The film was peeled off to proceed with the grinding process. The film can be peeled off manually.
7) 제 7 단계 (S112)  7) seventh step (S112)
그라인딩 공정시 휠 사이즈 (Wheel Size)는 800mesh, 회전 6,000rpm의 속도로 진행하여 칩사이즈를 50um 이하로 시편을 제작하였다. 도 3은 그라인당 공정으로 가공된 셀강화유리 (10a)의 가공면 (22)을 나타낸 사진이다. 치수 측정 결과 120.15 X 60.15mm 이었다.  In grinding process, the wheel size was 800mesh and the speed of rotation was 6,000rpm, and the chip size was made less than 50um. FIG. 3 is a photograph showing the processed surface 22 of the cell-reinforced glass 10a processed by the process per line. The dimension measurement result was 120.15 X 60.15 mm.
8) 제 8 단계 (S114)  8) Eighth Step (S114)
힐링공정은 디핑 (Dipping)방법을 이용하였으며, 힐링액으로는 불산 15%, 시간은 15min으로 평가하였다. 가공면 (22)의 형상은 그라인딩과 큰 차이가 없었으며, 미세 칩 (Chip)이 제거됨을 확인하였다. 치수는 120.03 X 60.02瞧로 설계치 기준 ±50um를 만족 하였다.  The healing process was carried out using a dipping method, and the healing solution was evaluated as 15% hydrofluoric acid and 15 minutes. The shape of the processing surface 22 was not significantly different from the grinding, it was confirmed that the chip (chip) is removed. The dimension was 120.03 X 60.02 瞧 and satisfied the design standard ± 50um.
9) 제 9 단계 (S116)  9) 9th step (S116)
포토레지스트 박리는 수산화나트륨 (NaOH) 12%, 공정온도 60도, 2분간 진행하여 잔류 포토레지스트를 제거하였다. 한편, 힐링공정에 따른 곡강도 특성 확보를 위해 곡강도 평가를 진행하였다. 장비는 3축 벤딩 (Bending)기로 평가하였으며, 스펜 (Span)길이는 하부는 80mm, 상부는 40mm이고, 속도 (Speed)는 lOmm/min으로 하였다. 측정 결과 그라인딩만 한 경우에는 Min. 11.04, Max 12.33kgf이었으며, 힐링 후 강성값은 Min 28.7, Max. 40.36kgf로 약 2배 이상 향상됨을 확인하였다. 샐강화유리 (10a) 제품의 경우 Min 29.40, Max 34.17kgf 이었다.  Photoresist stripping was performed at 12% sodium hydroxide (NaOH) at 60 ° C. for 2 minutes to remove residual photoresist. Meanwhile, the bending strength evaluation was conducted to secure the bending strength characteristics according to the healing process. The equipment was evaluated with a 3-axis bending machine, and the span length was 80 mm at the bottom, 40 mm at the top, and the speed was 100 mm / min. If only the grinding results are measured, Min. 11.04, Max 12.33kgf, the stiffness after healing was Min 28.7, Max. It was confirmed that the improvement was about 2 times or more to 40.36kgf. In case of sal tempered glass (10a), Min 29.40 and Max 34.17kgf were used.
제 2 실험예  Experimental Example 2
제 2 실험예에서 대부분의 공정은 제 1 실험예와 동일하며 절단 공정시 단면 스프레이 공정을 이용하여 강화유리를 절단하였다. 이하에서는 제 1 실험예에 따른 터치패널의 제조방법과 중복되는 상세 설명은 생략한다. 도In the second experimental example, most of the processes are the same as those of the first experimental example, and the tempered glass was cut by using a cross-sectional spray process during the cutting process. In the following, the first Detailed description overlapping with the manufacturing method of the touch panel according to the experimental example is omitted. Degree
4는 단면 스프레이 공정으로 절단된 셀강화유리 (10b)의 절단면 (20a)을 나타낸 사진이다. 제 2 실시예에 따른 절단 공정 시간은 20분 소요되었다. 상기한 바와 같이 단면 스프레이 공정으로 단면에칭을 하는 경우 셀강화유리 (10b)의 하부영역에 터치 센서 (12)를 위치시키고 샐강화유리 (10b)의 상부에서 단면에칭을 한다. 이와 같이 샐강화유리 (10b)의 상부에서 단면에칭을 하면 하부영역에 있는 터치 센서 (12)를 보호하는데 효과가 있었다. 4 is a photograph showing the cut surface 20a of the cell tempered glass 10b cut by the cross-sectional spray process. The cutting process time according to the second embodiment took 20 minutes. Is a cross-section etched in the upper portion of the cross-section of the spraying process, if i cross-section etched with the touch position sensor 12 in the lower region of the glass cell (10b) and Sal glass (10b) as described above. As described above, cross-sectional etching on the upper part of the tempered glass 10b was effective in protecting the touch sensor 12 in the lower region.
상기한 바와 같이 본 발명의 실시예에서는 필름과 포토레지스트를 동시에 적용하는 이중 마스킹 공정으로 셀강화유리 (10b)를 절단하였지만, 필름 또는 포토레지스트를 하나만 적용하는 단일 마스킹 공정에서는 다음과 같은 문제점들이 발생하였다.  As described above, in the embodiment of the present invention, the cell-reinforced glass 10b is cut by a double masking process for simultaneously applying a film and a photoresist, but the following problems occur in a single masking process for applying only one film or photoresist. It was.
도 5a와 도 5b는 포토레지스트를 1회만 코팅한 단일 마스킹 상태에서 에칭전 이미지와 에칭후 이미지를 비교한 도면이다.  5A and 5B show a comparison of an image before etching and an image after etching in a single masking state in which only one photoresist is coated.
도 5a와 같이 에칭전 이미지에서는 포토레지스트가 박리되지 않은 상태를 보이고 있으며, 도 5b와 같이 에칭후 .이미지에서는 포토레지스트가 박리된 상태를 보이고 있다. 도 5a와 도 5b에 도시된 바와 같이 내산성 재료인 포토레지스트만 적용하고 필름을 사용하지 않을 경우에는 에칭과정에서 포토레지스트가 박리되어 터치 센서에 영향을 주고, 이후 공정 진행이 불가하다. 한편, 포토레지스트를 2회 반복하여 코팅할 경우에는 에칭후 100~150um정도의 블랙 매트릭스 손상을 유발하였다.  The photoresist is not peeled off in the pre-etched image as shown in FIG. 5A, and the photoresist is peeled off in the post-etched image as shown in FIG. 5B. As shown in FIGS. 5A and 5B, when only the photoresist, which is an acid resistant material, is applied and the film is not used, the photoresist is peeled off during the etching process, affecting the touch sensor, and then the process cannot be performed. On the other hand, in the case of coating the photoresist twice repeatedly, black matrix damage of about 100 to 150 um was induced after etching.
도 6a와 도 6b는 단일 마스킹으로 필름만 적용한 상태에서 에칭전 이미지와 에칭후 '이미지를 비교한 도면이다. Figure 6a and Figure 6b is the "image with the image before etching after etching while applying only a single masking film ratio i sophisticated drawing.
도 6a와 같이 께칭전 이미지에서는 블랙 매트릭스 영역이 손상되지 않은 상태를 보이고 있으며, 도 6b와 같이 에칭후 이미지에서는 블랙 매트릭스 영역이 손상된 상태를 보이고 있다. 도 6a와 도 6b에 도시된 바와 같이 필름만 적용하고 내산성 재료인 포토레지스트를 사용하지 않을 경우에는 에칭과정에서 불랙 매트릭스 영역이 손상됨을 알 수 있었다. 또한, 단일 마스킹으로 필름만 적용하는 경우 그라인딩 공정에서 필름이 박리되어 이후 공정에서 터치 센서를 손상시킬 수 있었다. As shown in FIG. 6A, the black matrix region is not damaged in the pre-quenching image, and the black matrix region is damaged in the post-etching image as in FIG. 6B. As shown in FIGS. 6A and 6B, when only the film is applied and the photoresist, which is an acid resistant material, is not used, the black matrix region may be damaged during the etching process. Also, When only the film was applied with a single masking, the film was peeled off in the grinding process, which could damage the touch sensor in a later process.
본 발명을 앞서 기재한 바에 따라 설명하였지만, 다음에 기재하는 특허청구범위의 개념과 범위를 벗어나지 않는 한, 다양한 수정 및 변형이 가능하다는 .것을 본 발명이 속하는 기술 분야에 종사하는 자들은 쉽게 이해할 것이다. Although the present invention has been described above, various modifications and variations are possible without departing from the spirit and scope of the claims set out below . Those skilled in the art to which the present invention belongs will readily understand.
【부호의 설명]  [Description of code]
10 ; 강화유리 10a ; 셀강화유리  10; tempered glass 10a; cell tempered glass
12 ; 터치센서 14 ; 제 1보호층  12; touch sensor 14; first protective layer
16 ; 제 2보호층  16; second protective layer

Claims

【특허청구범위】 [Patent Claims]
【청구항 1】  [Claim 1]
설정된 셀 영역을 갖는 강화유리를 준비하는 단계;  Preparing a tempered glass having a set cell area;
상기 강화유리의 일면에 터치센서를 형성하는 단계;  Forming a touch sensor on one surface of the tempered glass;
제 1 보호 재료를 이용하여 적어도 상기 터치센서를 덮는 제 1 보호층을 형성하는 단계 ;  Forming a first protective layer covering at least the touch sensor using a first protective material;
제 2 보호 재료를 이용하여 적어도 상기 제 1 보호층을 덮는 제 2 보호층을 형성하는 단계 ;  Forming a second protective layer covering at least the first protective layer using a second protective material;
상기 강화유리를 설정된 샐 영역의 크기로 절단하여 셀강화유리를 형성하는 단계 ;  Cutting the tempered glass to a size of a set sal region to form cell-reinforced glass;
상기 샐강화유리의 제 2 보호층을 제거하는 단계, 및  Removing the second protective layer of the sal tempered glass; and
상기 셀강화유리의 제 1 보호층을 제거하는 단계  Removing the first protective layer of the cell tempered glass
를 포함하는 터치패널의 제조방법 .  Method of manufacturing a touch panel comprising a.
【청구항_2】  [Claim 2]
계 1항에 있어서,  The method according to claim 1,
상기 제 1 보호 재료와 상기 제 2 보호 재료는 내산성 재료인 터치패널의 제조방법.  And the first protective material and the second protective material are acid resistant materials.
【청구항 .3】  【Claims .3】
제 2항에 있어서,  The method of claim 2,
상기 제 1 보호 재료는 포토레지스트인 터치패널의 제조방법.  And said first protective material is a photoresist.
【청구항 4】  [Claim 4]
제 1항에 있어서,  The method of claim 1,
상기 제 1 보호층의 두께는 10~20um인 터치패널의 제조방법.  The thickness of the first protective layer is a manufacturing method of the touch panel 10 ~ 20um.
【청구항 5】  [Claim 5]
제 2항에 있어서,  The method of claim 2,
상기 제 2 보호 재료는 필름인 터치패널의 제조방법.  And the second protective material is a film.
【청구항 6】  [Claim 6]
제 1항에 있어서, 상기 강화유리의 절단으로 셀강화유리를 형성하는 단계는 단면에칭 공법으로 진행하는 터치패널의 제조방법. The method of claim 1, Forming the cell-reinforced glass by cutting the tempered glass is a method of manufacturing a touch panel to proceed by the cross-sectional etching method.
【청구항 7]  [Claim 7]
제 6항에 있어서,  The method of claim 6,
상기 강화유리는 알루미노 실리케이트 계열 유리인 터치패널의 제조방법 ·  The tempered glass is alumino silicate-based glass manufacturing method of the touch panel
【청구항 8】  [Claim 8]
제 1항에 있어서,  The method of claim 1,
상기 셀강화유리의 제 2 보호층을 제거한 후 상기 셀강화유리를 1차 가공하는 단계, 및  Removing the second protective layer of the cell tempered glass and first processing the cell tempered glass; and
상기 1차 가공된 셀강화유리를 2차 가공하는 단계  Second step of the primary processed cell-reinforced glass
를 더 포함하는 터치패널의 제조방법.  Method of manufacturing a touch panel further comprising.
【청구항 9】  [Claim 9]
게 8항에 있어서,  According to claim 8,
상기 1차 가공은 설정된 제품사양 보다 약 0.1~0.2隱 큰 치수로 상기 강화유리면의 외곽 형상을 가공하는 그라인딩 (Grinding) 공정인 터치패널의 제조방법.  The primary processing is a manufacturing method of a touch panel, which is a grinding process for processing the outer shape of the tempered glass surface to a dimension of about 0.1 ~ 0.2 隱 larger than the set product specifications.
【청구항 10]  [Claim 10]
제 8항에 있어서,  The method of claim 8,
상기 2차 가공은 상기 1차 가공시 발생한 마이크로 칩 (Micro Chip)을 에칭 공법으로 제거하는 힐링 (Healing) 공정인 터치패널의 제조방법 .  The secondary processing is a method of manufacturing a touch panel which is a healing process of removing the microchips generated during the first processing by a etching method.
PCT/KR2013/006691 2012-07-27 2013-07-25 Method for manufacturing touch panel WO2014017856A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2012-0082715 2012-07-27
KR20120082715 2012-07-27
KR10-2013-0087417 2013-07-24
KR1020130087417A KR20140015200A (en) 2012-07-27 2013-07-24 Touch panel manufacturing method

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100084257A (en) * 2009-01-16 2010-07-26 삼성모바일디스플레이주식회사 Touch screen panel and fabricating method for the same
KR20100094798A (en) * 2009-02-19 2010-08-27 한국세라믹기술원 Fabrication method for thin film silicon solar cell
KR20120036708A (en) * 2010-10-09 2012-04-18 이대천 Method of manufacturing tempered glass for display
KR20120053191A (en) * 2010-11-17 2012-05-25 삼성모바일디스플레이주식회사 Touch screen panel and fabricating method for the same
KR20120071195A (en) * 2010-12-22 2012-07-02 삼성모바일디스플레이주식회사 Panel protective film unit and method of assembling panel using thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100084257A (en) * 2009-01-16 2010-07-26 삼성모바일디스플레이주식회사 Touch screen panel and fabricating method for the same
KR20100094798A (en) * 2009-02-19 2010-08-27 한국세라믹기술원 Fabrication method for thin film silicon solar cell
KR20120036708A (en) * 2010-10-09 2012-04-18 이대천 Method of manufacturing tempered glass for display
KR20120053191A (en) * 2010-11-17 2012-05-25 삼성모바일디스플레이주식회사 Touch screen panel and fabricating method for the same
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