WO2014015891A1

WO2014015891A1 - A component handling head

Info

Publication number: WO2014015891A1
Application number: PCT/EP2012/064442
Authority: WO
Inventors: Yuri Lopez De Meneses; Thierry EME
Original assignee: Ismeca Semiconductor Holding Sa
Priority date: 2012-07-23
Filing date: 2012-07-23
Publication date: 2014-01-30
Also published as: TW201404486A

Abstract

A component handling head comprising a recess defined therein, wherein the recess is configured such that a volume of liquid can be held in cooperation with the handling head by capillary force and such that a meniscus of the volume of liquid can extend outside of the recess so the volume of liquid can adhere to an electronic component by capillary force so that the electronic component can be held on the component handling head by capillary force. There is further provided a component handling assembly which comprises the component handling head, and a corresponding method of handling an electrical component comprising the step of holding an electrical component on a handling head by means of capillary force.

Description

A COMPONENT HANDLING HEAD

Field of the invention

[0001] The present invention concerns a component handling head, in particularly, but not exclusive, to a component handling head which can hold an electronic component by means of capillary force. Description of related art

[0002] It is known to handle small components on component handling heads by means of capillary forces. Typically, a meniscus of liquid will adhere to a component to hold the component by means of a capillary force. [0003] Liquids which are used to handle small components on

component handling heads by means of capillary forces, would damage electrical components. For example, typical liquids include water, oil or ethanol, all of which would damage an electrical component if the electrical component would come into contact with the liquid. Accordingly, the use of capillary forces to handle electrical components has never before been considered.

[0004] Moreover, it was also believed that the adhesion force which can be achieved with capillarity is not sufficient to held an electric component in a test machine is not sufficient to withstand the very high accelerations which are achieved in modern component test machines.

[0005] Release of the components from the component handling heads requires the component to be first inserted into a holder and then moving the handling head laterally; such methods for releasing the components restrict where the component can be set-down as the component must always be set-down into the holder. Other removal techniques include vibration of the handling head and aspirations of liquid from the handling head; however using these techniques it is difficult to set the component down at a precise set-down position. It is also known to remove a

component by evaporating the liquid which adheres to the component; however evaporation of the liquid is slow and consumes large amounts of energy. [0006] Additionally, in existing component handling heads which hold component by means of capillary forces, the position at which the components are held is not controlled. This can result in the component being held at an unstable position, for example at the edge or corner of the component. If the component is held at its edge or corner the component may easily fall from the handling head during handling.

[0007] Therefore, component handling assemblies which handle electrical components, typically use a plurality of component handling heads each of which can hold an electrical component by means of a vacuum. Large amounts of energy and power is required to provide a vacuum at each of the component handling heads.

[0008] It is an aim of the present invention to obviate, or mitigate, at least some of the above-mentioned disadvantages.

Brief summary of the invention

[0009] A component handling head comprising a recess defined therein, wherein the recess is configured such that a volume of liquid can be held in cooperation with the handling head by capillary force and such that a meniscus of the volume of liquid can extend outside of the recess so the volume of liquid can adhere to an electronic component by capillary force so that the electronic component can be held on the component handling head by capillary force.

[0010] The component handling head of the present invention uses the capillarity of a liquid volume to apply micro-forces to electronic

components which hold the electronic components, without requiring a vacuum, in cooperation with the component handling head. The absence of a vacuum substantially reduces the maintenance costs of the component handling head and also reduces the energy consumption of the component handling head. Furthermore the accuracy of placement and positioning which can be achieved using the component handling head according to the present invention is as good as handling devices which use vacuum to hold electronic components.

[0011] A portion of the liquid may extend out of the recess so that it can adhere to the electrical component under test.

[0012] The particular dimensions and/or the shape of the recess may be adapted to improve the adhesion of the liquid with the recess and the adhesion of the liquid with the component under test. The dimensions and shape of the recess may be adapted so that a large portion of the outer surface of the liquid is either in contact with surfaces of the recess or in contact with the component under test. The dimensions and shape of the recess is adapted so that a concave, non planar portion of the recess is in contact with the liquid.

[0013] The surface of the recess may be adapted to improve the adhesion of the liquid with the recess. The rugosity of the recess may be increased to improve this adhesion. A hydrophilic surface treatment or layer may be provided on the surface of the recess to increase adhesion.

[0014] The dimensions and/or shape of the recess may be adapted to the dimension, weight and/or shape of the component to test. Different heads with recesses of different dimensions and/or shape may be mounted on a same machine to adapt it to different components. The dimensions and/or shape of the recess may be adaptable to the components.

[0015] Preferably the recess is configured such that a predefined volume of liquid can be held in cooperation with the component handling head by capillary force. The capillary force applied to the electronic component will be proportional to the volume of liquid which cooperate with the component handling head. The electronic component can be held on the component handling head by desired capillary force by using the required volume of liquid.

[0016] The component handling head may further comprise a

positioning mean which is configured such that it can position an electronic component, which is held on the component handling head by capillary force, into a predetermined position.

[0017] The positioning means may comprise one or more walls, wherein the one or more walls are arranged such that an electronic component held on the component handling head by capillary force can cooperate with the one or more walls so that the electronic component is orientated in a predefined orientation on the component handling head.

[0018] Preferably the electronic component will cooperate with the one or more walls by abutting the one or more walls.

[0019] Preferably the positioning mean define the position and/or orientation of the electronic component in an horizontal plane only.

[0020] Preferably the positioning means comprises two walls. The two walls may be arranged orthogonal to one another. When a square, or rectangular electronic component, is to be held on the component handling head by capillary force, two orthogonal sides of the electronic component will abut the respective two orthogonal walls on the handling head. The walls will force the electronic component into a predefined orientation whereby the two orthogonal sides of the electronic component will be parallel to the respective two orthogonal walls.

[0021] Additionally the one or more walls will prevent rotation of the electronic component when it is held on the component handling head. For example, when the two orthogonal sides of a square or rectangular electronic component abut the respective two orthogonal walls on the component handling head, one of the two walls will prevent the electronic component from rotating in a clockwise direction and the other will prevent the electronic component from rotating in an anti-clockwise direction.

[0022] Advantageously, only two walls are provided on the component handling head an electronic component may be easily slid away from the component handling head by sliding the electronic component in a direction which is away from the two walls. The absence of walls opposite the two orthogonal walls allows the electronic component to be slid in a direction which is away from the two walls.

[0023] The one or more walls may be located at an opening of the recess. The one or more walls may be located at a perimeter of an opening of the recess. The one or more walls may be located at a tip of the component handling head. The one or more walls may be located at a border of the recess.

[0024] A component handling head may comprise a first wall and a second wall, arranged orthogonal to one another.

[0025] The recess may be pyramidal shaped. The recess preferably comprises a square cross section. The recess preferably comprises a triangular longitudinal section.

[0026] A component handling head may further comprise a volume of liquid held in cooperation with the handling head by capillary force and wherein a meniscus of the volume of liquid extends outside of the recess so that the volume of liquid can adhere to an electronic component by capillary force so that the electronic component can be held on the handling head by capillary force. [0027] The liquid may be at least one of oil, water or ethanol.

[0028] The temperature of the volume of liquid which is in cooperation with the handling head is preferably at ambient temperature. Preferably, the temperature of the volume of liquid is between 20-25°C. The component handling device may further comprise a temperature controller which is configured to control the temperature of a volume of liquid which cooperates with the component handling head.

[0029] The component handling head may be configured to have a planar, spherical, or truncated cone, geometry. The component handling head may comprise metal.

[0030] The positioning means may be configured to position an electronic component such that a volume of liquid can to adhere to a centre of the electronic component by capillary force so that the electronic component is held on the handling head at a centre of the electronic component. For example, the one or more walls may be arranged such that when electronic component abuts the one or more walls, the electronic component will be centered over the recess. Thus when the component handling head is provided with a volume of liquid which held in

cooperation with the handling head by capillary force, then this volume of liquid hold the electronic component, using capillary force, at the center of the electronic component.

[0031] The positioning means may be configured such that it is adjustable to accommodate difference sized and/or difference shaped components. For example, the position of the one or more walls may be adjustable so that different sized and/or difference shaped components can be centered over the recess. The length of the one or more walls may be adjustable so that different sized components can be centered over the recess. [0032] The component handling head may further comprise a stopper means to prevent the electronic component from rotating when held on the component handling head. The positioning means may provide the stopper means. For example, the one or more walls may act to prevent the electronic component from rotating when held on the component handling head. [0033] The component handling head may further comprise a column defined therein wherein the column is in fluid communication with the recess. The column may arrangeable to be in fluid communication with a liquid source such that liquid, usable to adhere to an electronic component by capillary force so that the electronic component can be held on the component handling head by capillary force, can be supplied to the recess via the column.

[0034] The component handling head may further comprise a liquid supply controller which is configured to control the supply of liquid the recess, of the handling head, so that the capillary force exerted on the electronic component can be controlled.

[0035] According to a further aspect of the present invention there is provided a component handling head comprising a column defined therein, wherein the column is suitable for holding a volume of liquid by capillary action such that a meniscus of the volume of liquid can extend outside of the column so that a volume of the liquid can cooperate with an electronic component to adhere to the electronic component by capillary force, so that the electronic component is held on the component handling head. [0036] The component handling head may further comprise a liquid supply controller which is configured to control the supply of liquid to the column, of the component handling head, so that the capillary force exerted on the electronic component can be controlled.

[0037] According to a further aspect of the present invention there is provided a component handling device comprising a component handling head according to any one or the above-mentioned component handling heads, and a releasing means which can co-operate with a electronic component held on the component handling head be capillary force, to release the electronic component from the component handling head. [0038] The releasing means may be a means for moving the electronic component laterally relative to the component handling head. Preferably, the releasing means is a means for moving the electronic component laterally, relative to the component handling head, in a direction away from the one or more walls. The releasing means may comprise a holder which can hold an electronic component while the component handling head on which the electronic component is held is moved laterally relative to the electronic component.

[0039] The releasing means may comprise a means for rotating the electronic component relative to the component handling head so that the component is released from the component handling head.

[0040] The releasing means may comprise one or more separating members, which can be selectively moved between the component handling head and an electronic component held on the component handling head, to release the electronic component from the component handling head. Preferably, the releasing means may comprises two separating members, which can be selectively moved, in opposite directions, between the handling head and a component held on the component handling head, to release the component from the component handling head. The two separating members may be arranged to move towards one another as they move between the component handling head and a component held on the component handling head. The two separating members may be arranged to abut one another. The one or more separating member may be configured to have a tapered profile. [0041] The component handling device may further comprise a guide means which can guide an electronic component after it has been released from the component handling head, so that the electronic component can be set-down in a predetermined orientation.

[0042] According to a further aspect of the present invention there is provided a component testing device having one or more component handling heads according to any one of the above-mentioned component handling heads. According to a further aspect of the present invention there is provided a component testing device having one or more

component handling devices according to any one of the above-mentioned component handling devices. According to a further aspect of the present invention there is provided a component pick-and-place device having one or more component handling heads according to any one of the above- mentioned component handling heads. According to a further aspect of the present invention there is provided a component pick-and-place device having one or more component handling devices according to any one of the above-mentioned component handling devices.

[0043] According to a further aspect of the present invention there is provided a component handling assembly comprising one or more component handling heads according to any one of the above mentioned component handling heads, and a liquid source which comprises a liquid usable to hold an electronic component on the handling head by capillary force, and a means to provide at least some of the liquid in the liquid source to the component handling head so that the electronic component can be held on the component handling head by capillary force.

[0044] The mans to provide some liquid to the component handling head may be that the component handling head is configured such that it can be dipped into the liquid source to provide a volume of liquid which is held in cooperation with the handling head by capillary force. The source may be configured such that the component handling head can be dipped into the liquid. [0045] The component handling assembly may comprise a turret, wherein the turret comprises a plurality of said component handling heads.

[0046] According to a further aspect of the present invention, there is provided a component handling device suitable for handling electronic components; comprising a component handling head in which a column is defined, a liquid contained in the column wherein a meniscus of the liquid extends outside of the column so that a volume of the liquid extends outside of the column, wherein the component handling head is arranged such that the volume of the liquid which extends outside of the column can cooperate with an electronic component to adhere to the electronic component by capillary force, so that the electronic component is held on the component handling head.

[0047] The component handling head may be configured to have a planar, spherical, or truncated cone, geometry.

[0048] The component handling head may comprise metal.

[0049] The liquid may be at least one of oil, water or ethanol. [0050] The temperature of the volume of liquid which extends outside of the column may be in at ambient T°. Preferably, the temperature of the volume of liquid which extends outside of the column is between 20-25°C.

[0051] The component handling head may further comprise a

positioning means which positions a component into a predetermined position on the head.

[0052] The positioning means may be configured to position a

component such that the liquid can adhere to a centre of the component by capillary force so that component is held on the component handling head at a centre of the component. [0053] The component handling head may further comprise a stopper means to prevent the component from rotating when held on the component handling head.

[0054] The component handling head may further comprise an element which defines a recess suitable for receiving a component to which the liquid adheres by capillary force, wherein the element is arranged such that when the component is received into the recess the component is in a predetermined position and wherein walls which define the recess define a stopper means which prevents the component from rotating.

[0055] A component handling device may further comprise a releasing means which can co-operate with the component to release the component from the component handling head.

[0056] The releasing means may comprise a means for rotating the component relative to the component handling head so that the

component is released from the component handling head.

[0057] The releasing means may comprise one or more separating members, which can be selectively moved between the component handling head and a component held on the component handling head, to release the component from the component handling head. The releasing means may comprise two separating members, which can be selectively moved between the component handling head and a component held on the component handling head, to release the component from the component handling head. Preferably, the releasing means may comprises two separating members, which can be selectively moved, in opposite directions, between the component handling head and a component held on the component handling head, to release the component from the component handling head. The two separating members may be arranged to move towards one another as they move between the component handling head and a component held on the component handling head. The two separating members may be arranged to abut one another.

[0058] The one or more separating member may be configured to have a tapered profile.

[0059] A component handling device may further comprise a guide means which can guide the component after it has been released from the component handling head, so that the component can be set-down in a predetermined position and/or orientation. [0060] A component handling device may further comprise a liquid supply controller which is configured to control the supply of liquid to the column of the component handling head, so that a component can be held on the component handling head with predetermined capillary force. By controlling the amount of liquid to the column the volume of liquid which extends from the column may be controlled and thus the level of capillary force exerted on the component can be controlled.

[0061] The component handling device may further comprise a temperature controller which is configured to control the temperature of the liquid so that volume of liquid which extends outside of the column may has a temperature which is equal to ambient T°. The component handling device may further comprise a temperature controller which is configured to control the temperature of the liquid so that volume of liquid which extends outside of the column has a temperature which is between 20-25°C.

[0062] A component handling device may be a component testing device or a component pick-and-place device.

[0063] According to a further aspect of the present invention there is provided a component handling assembly comprising one or more of said component testing devices or a component pick-and-place devices.

[0064] According to a further aspect of the present invention there is provided a turret comprising a component handling device according to any one of afore-mentioned component handling devices.

[0065] According to a further aspect of the present invention there is provided a component handling assembly comprising, a turret wherein the turret comprise a plurality of component handling devices according to any one of the afore-mentioned component handling devices, wherein the component handling assembly further comprises a liquid supply controller which is configured to control the supply of liquid to the column of each component handling head, so that components can be held on each component handling head with predetermined capillary forces.

[0066] The predetermined capillary force provided at least two of the component handling heads may be different. The predetermined capillary force provided at each of the component handling heads may be different. The predetermined capillary force provided at all of the component handling heads may be equal.

[0067] According to a further aspect of the present invention there is provided a method of handling an electrical component comprising the step of holding an electronic component on a component handling head by means of capillary force, wherein the capillary force is provided by a volume of liquid which is held, by capillary force, in a recess defined in the component handling head and which has meniscus which extends outside of the recess so that the volume of the liquid can cooperate with the electronic component to hold the electronic component on the component handling head by means of capillary force.

[0068] The meniscus also helps to keep the components in accurate position when rotating or transfer from module to module. The meniscus may protrude out of the recess. [0069] The method may further comprise the step of dipping the component handling head into a source of liquid to provide the volume of liquid.

[0070] The method may comprise the step of controlling the volume of liquid provided on the component handling head. [0071] The method may comprise the step of controlling the

temperature of the liquid provided on the component handling head.

[0072] The method may further comprise the step of using a positioning means to position the electrical component into a predetermined position and/or orientation on the component handling head. The positioning means may comprise one or more walls. Preferably the positioning means comprises two walls which are arranged orthogonal to one another.

[0073] The method may further comprise the step of adjusting the positioning means according to the size and/or shape of the electronic component which is to be held on the component handling head. This step may comprise adjusting the position of one or more walls on the

component handling head. The step may further comprise adjusting the length of the one or more walls on the component handling head. [0074] The method may further comprise the step of adjusting the positioning means according to the size and/or shape of the electronic component which is to be held on the component handling head, so that the electrical component is centered over the recess when held on the component handling head. The method may further comprise the step of using a positioning means to position the electrical component so that the electrical component is held on the component handling head at a centre of the electrical component.

[0075] The method may further comprise the step of using a stopper means to prevent an electrical component from rotating when held on the component handling head.

[0076] The method may further comprise the step of using a releasing means which can co-operate with the electrical component, to release the electrical component from the component handling head. The method may comprise the step of moving the component laterally relative to the component handling head, in a direction which is away from one or more walls on the component handling head, so that the component is released from the component handling head. The component may be moved laterally relative to the component handling head or vice versa. [0077] The method may comprise the step of rotating the component relative to the head to release the electrical component from the

component handling head.

[0078] The method may comprise the step of selectively moving one or more separating members between the component handling head and an electrical component held on the component handling head, to release the electrical component from the component handling head. The method may comprises moving two separating members, in opposite directions, between the component handling head and an electrical component held on the component handling head, to release the electrical component from the component handling head.

[0079] The method may further comprise the step of using a guide means to guide an electrical component after it has been released from the component handling head, so that the electrical component can be set down in a predetermined orientation and/or position.

[0080] According to a further aspect of the present invention there is provided a method of handling an electrical component comprising the step of holding an electrical component on a component handling head by means of capillary force. The capillary force may be provided by a liquid provided in a column of the component handling head, wherein a meniscus of the liquid extends outside of a column so that the volume of liquid can adhere to the electrical component by capillary force.

[0081] The method may further comprise the step of controlling the liquid supplied to the column of the component handling head so that components can be held on the component handling head with a

predetermined capillary force.

[0082] The method may further comprise the step of controlling the liquid supplied to the columns of a plurality of component handling heads on a turret, so that components can be held on each component handling head with predetermined capillary forces. [0083] The method may further comprise the step of using a positioning means to position the electrical component into a predetermined position and/or orientation on the component handling head.

[0084] The method may further comprise the step of using a positioning means to position the electrical component so that the electrical

component is held on the component handling head at a centre of the electrical component.

[0085] The method may further comprise the step of using a stopper member to prevent an electrical component from rotating when held on the component handling head.

[0086] The method may further comprise the step of using an element which defines a recess suitable for receiving an electrical component held on the component handling head, to position the electrical component into a predetermined position and/or orientation and to prevent the electrical component from rotating.

[0087] The method may further comprise the step of using a releasing means which can co-operate with the electrical component to release the electrical component from the component handling head.

[0088] The method may further comprise the step of using a releasing means which comprises a means for rotating the electrical component relative to the head to release the electrical component from the

component handling head.

[0089] The releasing means comprises a one or more separating members, which can be selectively moved between the component handling head and an electrical component held on the handling head, to release the electrical component from the component handling head.

[0090] The method may comprises moving two separating members, in opposite directions, between the component handling head and an electrical component held on the component handling head, to release the electrical component from the component handling head.

[0091] The method may further comprise the step of using a guide means to guide an electrical component after it has been released from the component handling head, so that the electrical component can be set down in a predetermined orientation and/or position.

[0092] The method may further comprise the step of controlling the volume of liquid supplied to the column of the handling head so that the capillary force is sufficient for maintaining and lifting an electronic component of a given weight.

[0093] The method may comprise the step of controlling the supply of liquid to the column of the handling head so that the volume of the liquid which extends outside of the column is in the range of a few nanoliters, preferably less than 100 nanoliters, more preferably between 10 and 50 nanoliters. The method may comprise the step of controlling the supply of liquid to the column of the handling head so that the volume of the liquid which extends outside of the column depends on the weight of the component.

[0094] The method may further comprise the step of controlling the temperature of the liquid in the column of the handling head so that the liquid which extends outside of the column has a temperature which is equal to ambient temperature. The method may further comprise the step of controlling the temperature of the liquid in the column of the

component handling head so that the liquid which extends outside of the column has a temperature which is between 20-25°C.

Brief Description of the Drawings

[0095] The invention will be described, by way of example only, with reference to the following figures, in which: Fig. 1 A provides a side view of a component handling head according to a first embodiment of the present invention;

Fig. 1 B provides an aerial view of the component handling head shown in Fig. 1 A. Fig. 2 provides a perspective view of a component handling head according to a further embodiment of the present invention;

Fig. 3 provides a perspective view of a component handling assembly according to an embodiment of the present invention.

Detailed Description of possible embodiments of the Invention [0096] Referring to Figures 1 A and 1 B; Figure 1 A provides a side view of a component handling head 100 according to a first embodiment of the present invention and Fig. 1 B provides an aerial view of the component handling head shown in Fig. 1 A.

[0097] A component handling head 100 comprising a recess 101 defined therein. The recess 101 is configured such that a predefined volume of liquid can be held in cooperation with the component handling head 100 by capillary force and such that a meniscus 105 of the volume of liquid can extend outside of the recess so the volume of liquid can adhere to an electronic component by capillary force so that the electronic component can be held on the component handling head 100 by capillary force. In this embodiment, the recess 101 is pyramidal shaped and thus comprises a square cross section and a triangular longitudinal section. This pyramidal, concave shape provides a large surface of contact between the liquid and the recess, and thus a good adhesion of the liquid to the surfaces of the recess. Other concave shapes may be provided.

[0098] A predefined volume of liquid 103 is held in cooperation with the handling head 100 by capillary force. The volume of liquid 103 fills the recess 101 and has a meniscus 105 which extends outside of the recess 101 so the volume of liquid 103 can adhere to an electronic component (not shown) by capillary force so that the electronic component can be held on the component handling head 100 by capillary force. The capillary force applied to the electronic component will depend on the volume of liquid 103; therefore a desired force to hold the electronic component can be ensured by configuring the recess 101 such that an appropriate volume of liquid is held in cooperation with the component handling head 100 by capillary force.

[0099] The predefined volume of liquid 103 is provided by a liquid source 1 1 1 ; the liquid source comprises a reservoir of liquid 1 13 which is useable to hold an electronic component on the component handling head 100 by capillary force. To provide the predefined volume of liquid 103 to the component handling head 100 is dipped into the reservoir of liquid 1 13. The dimensions and configuration of the recess 101 in the component handling head 100 will ensure that when the component handling head 100 is removed from the reservoir of liquid 1 13, a predefined volume of liquid will remain in cooperation with the component handling head by capillary force; this predefined volume of liquid 103 is useable to adhere to an electronic component by capillary force so that an electronic component can be held on the component handling head 100 by capillary force.

[00100] The component handling head 100 further comprises a

positioning mean in the form of a first and second walls 105a,b. The first and second walls 105a,b are arranged orthogonal to one another. The first and second walls 105a,b located at a tip 109 of the component handling head 100 and at an opening 107 of the recess 101 .

[00101] When a square, or rectangular electronic component, is to be held on the component handling head by capillary force, two orthogonal sides of the electronic component will abut the respective first and second walls 105a,b on the component handling head 100. The walls 105a,b will force the electronic component into a predefined orientation whereby the two orthogonal sides of the electronic component will be parallel to the respective first and second walls 105a,b on the component handling head 100.

[00102] The first and second walls 105a,b are arranged such that the volume of liquid 103 can adhere to a centre of an electronic component by capillary force so that the electronic component is held on the component handling head 101 at a centre of the electronic component; the first and second walls 105a,b are arranged such that when an electronic component abuts the first and second walls 105a,b, the electronic component will be centered over the recess 101 . The volume of liquid 103 can thus hold an electronic component, using capillary force, at the center of the electronic component. The position and/or length of the first and second walls 105a,b is be adjustable so that different sized and/or difference shaped electronic components can be centered over the recess 101 .

[00103] Additionally the first and second walls 105a,b will act as a stopper to prevent rotation of the electronic component when it is held on the component handling head 100. For example, when the two orthogonal sides of a square or rectangular electronic component abut the respective first and second walls 105a,b on the component handling head, one of the first wall 105a will prevent the electronic component from rotating in a clockwise direction and the second wall 105b will prevent the electronic component from rotating in an anti-clockwise direction.

[00104] The walls 105a,b are preferably provided in the direction of maximal acceleration or deceleration of the component handling heads, to prevent the components from leaving the recess when the component handling head is accelerated or decelerated.

[00105] Advantageously, as a first and second wall 105a,b are provided only, an electronic component which is held on the component handling head by capillary force, may be easily slid away from the component handling head 100 by sliding the electronic component in a direction which is away from the first and second wall 105a,b; the absence of walls opposite the first and second wall 105a,b allows the electronic component to be slid in a direction which is away from the first and second wall 105a,b. This allows an electronic component to be easily removed from the component handling head 100 when desired.

[00106] During use the component handling head 100 is dipped into the reservoir of liquid 1 13 to provide a predefined volume of liquid 103 to the component handling head 100. The predefined volume of liquid 103 fills the recess 101 and has a meniscus 105 which extends outside of the recess 101 so the volume of liquid 103 is available to adhere to an electronic component by capillary force. The predefined volume of liquid 103 is held on the component handling head by capillary force which occurs largely due to the recess 101 .

[00107] The component handling head 100 is then moved so that the predefined volume of liquid 103 touches, and adheres to an electronic component which is to be handled by capillary force. The volume of liquid 103 thus holds the electronic component on the component handling head 100 by capillary force. When held on the component handling head 100, the electronic component will abut the first and second walls 105a,b so that the electronic component is orientated into a predefined orientation.

When the electronic component abuts the first and second walls 105a,b the electronic component will be centered above the recess 103; this will ensure that the electronic component is held on the component handling head 100, by the volume of liquid, at its center point. The first and second walls 105a,b will also act to stop the electronic component from rotating while held on the component handling head 100. [00108] A releasing means (not shown in Figures 1 A and 1 B; but an example 27 of which is described in more detail with respect to Figure 2) may be provided to release the electronic component from the component handling head. The releasing means may take any suitable form; for example the releasing means may be a means for moving the electronic component laterally relative to the component handling head. The releasing means may be operable to slide the electronic component, laterally relative to the component handling head, in a direction away from the first and second walls 105a,b. This can be achieved using any suitable means; for example the electronic component may be held using a holder and the pulled, pushed or blown, in a direction away from the first and second walls 105a,b, or, the electronic component may be held by a holder and the component handling head 100 may be moved laterally away from the component handling head 100. The absence of walls opposite the first and second walls 105a,b, allows the electronic component to be moved laterally relative to the component handling head 100. Alternatively the releasing means may comprise a means for rotating the electronic component relative to the component handling head 100 so that the component is released from the component handling head. Or the releasing means may comprise one or more separating members, which can be selectively moved between the component handling head and an electronic component held on the component handling head, to release the electronic component from the handling head.

[00109] A guide means (not shown in Figures 1 A and 1 B; but an example of which is described in more detail with respect to Figure 2), which is configured to guide an electronic component after it has been released from the handling head, so that the electronic component can be set-down in a predetermined orientation, may also be provided. The guide means may take any suitable form; for example, the guide mean may be a track, or one or more guide members which extend from the component handling head.

[00110] In an alternative embodiment (not shown) a column is defined in the component handling head 100. The column is configured to be in fluid communication with the recess 101 , and the column is arrangeable to be in fluid communication with a liquid source such that liquid, usable to adhere to an electronic component by capillary force so that the electronic component can be held on the component handling head 100 by capillary force, can be supplied to the recess via the column. A controller which is configured to control the supply of liquid to the column, and thus control the volume of liquid used to hold the electronic component on the component handling head 100, may also be provided. [00111] The liquid's adhesion to the electrical component 10 can be controlled by the volume of liquid 7 which extends outside of the column 5. Preferably, the volume of liquid 7 which extends outside of the column 5 is a few nanoliters, preferably less than 100 nanoliters, most preferably between 10 and 50 nanoliters. Most preferably the volume of liquid which extends outside of the column is such that volume of liquid in the recess depends on the weight of the component under test. Different volumes may be provided for lifting components of different weights and sizes.

Moreover, different sizes and/or shapes of recesses may be provided on a same machine, at the same time or at different time, for lifting components of different weights and sizes.

[00112] In case of sub-millimetric components under test, the volume of the drop of liquid could be for example within 1 5 to 35 nanoliters. This volume is directly related to the device weight and to the contact surface between the head and the component under test.

[00113] The liquid's adhesion to the electrical component 10 can also be influenced by the temperature of the volume of liquid 7 which extends outside of the column 5. Preferably, the temperature of the volume of liquid 7 which extends outside of the column 5 is at ambient temperature, or at least between 20-25°C.

[00114] Figure 2 provides a perspective view of a component handling head 20 according to a further embodiment of the present invention. The component handling head 20 has many of the same features as the component handling head 1 shown in Figure 1 and like features are awarded the same reference numerals.

[00115] The component handling head 20 further comprises a liquid supply controller 31 which is configured to control the supply of liquid 7 to the column 5 of the handling head 3. By controlling the supply of liquid 7 to the handling head 3, the size of the volume of liquid 7 which extends outside of the column 5 can be controlled and thus the level of capillary force which is exerted on the electrical component 10 can be controlled. The liquid supply controller 31 may also be configured to control the temperature of the liquid 7.

[00116] The component handling head 20 comprises a positioning means in the form of a positioning element 21 , which can position an electrical component 10 into a predetermined position on the handling head 3. The positioning element 21 comprises a recess 23 which is defined by two arm members 21 a, 21 b. The recess 23 is suitable for receiving the electrical component 10 to which the liquid 7 adheres by capillary force. The length of each arm member 21 a, 21 b may be adjustable. This will enable the size of the recess 23 to be adjusted so that the recess can receive electrical components 10 of different sizes.

[00117] The positioning element 21 may be selectively swivelled about an axis A' and secured; this enables a user to pre-select the position or orientation in which the electrical component will be held on the handling head 3. The positioning element 21 can thus be arranged so that once the electrical component 10 is received into the recess 23, the electrical component 10 will be arranged into a predetermined, desired, position or orientation on the handling head 3.

[00118] The positioning element 21 will also facilitate centring of the electrical component 10 on the handling head 3 as the arm members 21 a, 21 b will restrict the transverse movement of the electrical component 10 relative to the handling head 3. As the electrical component 10 is centred on the handling head 3, the liquid 7 can adhere to the centre of the electrical component 10; this will reduce the possibility of the component falling from the handling head 3 during handling. It will be understood that the positioning element 21 could be provided with any number of arm members; for example the positioning element 21 could be provided with four arm members; two arm members similar to arm members 21 a, 21 b which restrict transverse movement of an electrical component 10 relative to the handling head 3, and two further arm members, which are arranged to extend perpendicular to the other two arm members, which restrict longitudinal movement of the electrical component 10 relative to the handling head 3.

[00119] Walls 25 of the positioning element 21 further define a stopper which prevents the electrical component 10 from rotating when held on the handling head 3.

[00120] The component handling head 20 further comprises a releasing means 27 which is operable to release the electrical component 10 from the handling head 3. In this particular embodiment the releasing means 27 takes the form of a mechanical separating member 27. The separating member 27 can be selectively moved between the handling head 3 and the electrical component 10, to release the electrical component 10 from the handling head 3. The separating member 27 comprises a tapered profile to facilitate its movement between the electrical component 10 and handling head 3. The tapered profile will further limit the lateral displacement imparted on the electrical component 10 as the separating member 27 is moved between the handling head 3 and an electrical component 10; this will facilitate more accurate set-down of the electrical component 10.

[00121] It will be understood that component handling head 20 may have any number of separating members 27; for example the component handling head 20 may comprise two separating members 27 each of which can be selectively moved between the handling head 3 and electrical component 10. Preferably, the two separating members will be arranged opposite one another, so that they move in opposite directions between the electrical component 10 and handling head 3, to release the electrical component 10 from the handling head 3. The two separating members may move to abut one another. Advantageously, using two separating members will further limit the lateral displacement imparted on the electrical component 10, as the lateral displacement imparted on the electrical component 10 by one of the separating members will be offset by the lateral displacement imparted on the electrical component 10 by the other separating member. The speed at which the two separating members move the electrical component 10 and handling head 3 can be independently adjusted. Preferable both separating member will move at the same speed.

[00122] It will be understood that the releasing means may take any suitable form and is not limited to the separating member 27 illustrated in figure 2; for example the releasing means may comprises a means for rotating the electrical component 10 relative to the handling head 3 so that the electrical component 10 is released from the handling head 3.

[00123] The component handling head 20 further comprises a guide means 29 which can guide the electrical component 10 after it has been released from the handling head 3, so that the electrical component 10 can be set-down in a predetermined orientation. The guide means 29 will also facilitate the accurate set-down of the electrical component 10 at a set- down position.

[00124] During use a user operates the liquid supply controller 31 so that component handling head 20 is configured so that a desired level of capillary force can be achieved at the handling head 3. The liquid supply controller 31 controls the capillary force provided at a handling head 3 by controlling, for example, the volume of liquid 7 which extends outside of the column 5. The volume of liquid 7 which extends outside of the column 5 will be supported outside of the column 5 by the surface tension of the liquid 7.

[00125] The user also rotates the positioning element 10 about the axis A' and fixes the positioning element 10 at a desired position so that electrical component 10 will be held on the handling head 3 in a desired position and orientation.

[00126] The handling head 3 is then moved towards the electrical component 10 until the volume of liquid 7 which extends outside of the column 5 cooperates with the electrical component 10. As the liquid cooperates with an electronic component the liquid 7 will adhere to the electronic component 10 by capillary force so that the electronic component 10 is held on the handling head 3. As the handling head 3 is moved towards the electrical component 10, the electrical component 10 is received into the recess 23 of the positioning element 21 ; the positioning element 23 will thus force the component into the desired position and orientation. The positioning element 21 will also facilitate centring of the electrical component on the handling head 3 so that the liquid adheres to the centre of the electrical component 10; this will enable the electrical component 10 to be held on the handling head 3 at its most stable position. Furthermore the walls 25 of the positioning element 10 will act as a stopper, to prevent the electrical component 10 from rotating on the handling head 3.

[00127] Once the electrical component 10 is held on the handling head 3 by capillary force, the handling head 3 may then be moved to a position above a desired set-down point. The capillary force exerted on the electrical component 10 will be sufficient to ensure that the electrical component 10 remains held on the handling head 3 as the handling head 3 is moved. Furthermore, the positioning element 21 maintains the

orientation and position of the electrical component 10 on the handling head 3 as the handling head 3 is moved. Thus, the electrical component 10 will remain in its predefined desired position and orientation as the handling head 3 is moved.

[00128] Once the handling head 3 has been moved to a position above a desired set-down point; the electrical component 10 can be released from the handling head 3. To release the electrical component 10 from the handling head 3 the separating member 27 is moved laterally, between the handling head 3 and the electrical component 10. As the separating member 27 moves laterally between the handling head 3 and electrical component 10 the tapered profile of the separating member 27 will ensure that the electrical component 10 is gradually forced further away from the handling head 3. Eventually the electrical component 10 will be moved far enough away from the handling head 3 that the capillary force exerted on the electrical component 10 by the liquid 7 will be overcome and the electrical component 10 will fall away from the handling head 3. [00129] As the electrical component 10 falls away from the handling head 3 towards the set-down point, the orientation of the electrical component 10 is maintained by the guide means 29. The guide means 29 thus enables the component to be accurately set-down in a predefined orientation at a predefined set-down point.

[00130] Figure 3 provides a perspective view of a component handling assembly 30 according to an embodiment of the present invention. The component handling 30 assembly comprises a turret 33. The turret comprises a plurality of component handling heads 35 located at regular intervals along the periphery of the turret 33. Each of the component handling heads 35 have the features of the component handling heads shown in Figures 1 or 2.

[00131] Located adjacent the periphery of the turret 33 are a plurality of processing stations 39 which define an electrical component processing line 41 . These processing stations 39 include stations which can perform testing or manufacturing steps on electrical components 10.

[00132] The component handling assembly 30 further comprises a central liquid supply controller 37 which is configured to control the supply of liquid 7 to the column 5 of the handling head 3 of each component handling head 35. By controlling the liquid 7 supplied to each component handling head 35, the central liquid supply controller 37 can control the volume of liquid 7 which extends outside of the column 5 in each

component handling head 35; thus the central liquid supply controller 37 can control the capillary force exerted on each electrical component at each handling head 3. The central liquid supply controller 37 is operable to ensure that the capillary forces exerted on the electrical components 10 differ between component handling heads 35, alternatively the central liquid supply controller 37 is operable to ensure that the capillary forces exerted on the electrical components are the same at each component handling head 35. [00133] The central liquid supply controller 37 is also configured to control the temperature of the liquid which extends outside of the column 5 of each component handling head 35. The central liquid supply controller 37 is operable to provide different liquid temperatures at different component handling heads 35, or, to provide the same liquid temperature at each component handling heads 35.

[00134] During operation, electrical components 10 are held at the handling head 3 of each component handling head 35 in the same manner as described for the component handling heads 100, 10, 20 shown in Figures 1 or 2 respectively. As the electrical components 10 are held at the handling heads 3 of each component handling head 35, the turret 33 may then be rotated until the handling heads 3 are positioned above the next processing station 39 in the processing line 41 . The electrical components 10 are then each released from their respective handling head 3 using a separating means (as described above for the handling device 20 shown in Figure 2), so that each electrical components 10 can be delivered to the processing stations 39 which is beneath the handling heads 3. The positioning members 25 on each handling head 3 will ensure that the electrical components 10 are in a suitable position to be received by the processing stations 39, prior to the electrical components 10 being released from the handling heads 3; this will facilitate accurate delivery of the electrical component 10 to a predefined position on the processing station 39 and will also help ensure that the components are delivered to the processing stations 39 in the correct orientation. Once released from the handling heads 3 the electrical components 10 are directed to the processing stations 9 by means of the guide means 29. The guide means 29 will also facilitate accurate delivery of the electrical components 10 to a predefined position on the processing stations 39 and will also ensure that the components are delivered to the processing stations 39 in the correct orientation. Delivering the electrical components 10 to the correct position on the processing stations 39 and in the correct orientation is preferred; if an electrical component 39 is not delivered in the correct orientation and to the correct position on the processing station 39, then the electrical component 10 can become damaged during processing at the processing station 39.

[00135] Various modifications and variations to the described

embodiments of the invention will be apparent to those skilled in the art without departing from the scope of the invention as defined in the appended claims. Although the invention has been described in connection with specific preferred embodiments, it should be understood that the invention as claimed should not be unduly limited to such specific embodiment

Claims

1 . A component handling head (100, 20) comprising a recess (101 ) defined therein, wherein the recess is configured such that a volume of liquid (103) can be held in cooperation with the handling head (100) by capillary force and such that a meniscus (105) of the volume of liquid can extend outside of the recess so the volume of liquid can adhere to an electronic component (10) by capillary force so that the electronic component (10) can be held on the component handling head by capillary force.

2. A component handling device according to claim 1 wherein the handling head (100, 20) further comprises a positioning mean (105a,b) which is configured such that it can position an electronic component (10), which is held on the component handling head by capillary force, into a predetermined position.

3. A component handling head according to claim 2 wherein the positioning means comprises one or more walls (105a, b), wherein the one or more walls are arranged such that an electronic component held on the component handling head by capillary force can cooperate with the one or more walls so that the electronic component is orientated in a predefined orientation on the component handling head.

4. A component handling head according to claim 3, wherein the one or more walls are located at an opening of the recess.

5. A component handling head according to claim 4 comprising a first wall and a second wall (105a,b), arranged orthogonal to one another.

6. A component handling device according to any one of claims

2 to 5 wherein the positioning means is configured to positions an electronic component such that a volume of liquid can to adhere to a centre of the electronic component (10) by capillary force so that the electronic component is held on the handling head at a centre of the electronic component.

7. A component handling device according to any one of claims 2 to 6 wherein the positioning means is configured to be adjustable to accommodate difference sized and/or difference shaped electrical components.

8. A component handling head according to any one of the preceding claims wherein the handling head further comprises a stopper means to prevent the electronic component from rotating when held on the component handling head.

9. A component handling device comprising a component handling head (100,20) according to any one or claims 1 to 8 and a releasing means (27) which can co-operate with an electronic component (10) held on the component handling head by capillary force, to release the electronic component from the component handling head.

10. A component handling device according to claim 9 wherein the releasing means (37) is a means for moving the electronic component laterally, relative to the component handling head, in a direction away from one or more walls which define a positioning means on the

component handling head.

1 1 . A component handling device according to claim 9 or 10, further comprising a guide means which can guide an electronic

component after it has been released from the component handling head, so that the electronic component can be set-down in a predetermined orientation.

12. A component handling assembly comprising one or more component handling heads (100,20) according to any one of claims 1 to 8, and a liquid source (1 1 1 ) which comprises a liquid usable to hold an electronic component (10) on the handling head by capillary force, and a means to provide at least some of the liquid in the liquid source to the component handling head so that an electronic component can be held on the component handling head by capillary force.

13. A method of handling an electrical component (10), comprising the step of holding an electronic component on a handling head (100,20) by means of capillary force, wherein the capillary force is provided by a volume of liquid which is held, by capillary force, in a recess (101 ) defined in the component handling head (100,20) and wherein the volume of liquid has a meniscus (105) which extends outside of the recess so that the volume of the liquid can cooperate with the electronic component to hold the electronic component on the component handling head by means of capillary force.

14. A method of handling an electrical component according to claim 13 comprising the step of dipping the component handling head into a source of liquid to provide the volume of liquid on the component handling head which is used to hold the electronic component on the component handling head by capillary force.