WO2014015561A1 - 一体化集成型led模组 - Google Patents

一体化集成型led模组 Download PDF

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Publication number
WO2014015561A1
WO2014015561A1 PCT/CN2012/082010 CN2012082010W WO2014015561A1 WO 2014015561 A1 WO2014015561 A1 WO 2014015561A1 CN 2012082010 W CN2012082010 W CN 2012082010W WO 2014015561 A1 WO2014015561 A1 WO 2014015561A1
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WO
WIPO (PCT)
Prior art keywords
led
integrated
heat
led module
module according
Prior art date
Application number
PCT/CN2012/082010
Other languages
English (en)
French (fr)
Inventor
曾垂通
贾良才
徐小良
李宝泉
鲁多·卡诺延西斯
斯杰夫·德·克里爵
Original Assignee
上海亚明照明有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201210258443.1A external-priority patent/CN102818152B/zh
Priority claimed from CN2012203889911U external-priority patent/CN202733806U/zh
Application filed by 上海亚明照明有限公司 filed Critical 上海亚明照明有限公司
Priority to US14/416,882 priority Critical patent/US9482418B2/en
Priority to EP12881584.2A priority patent/EP2878876A4/en
Publication of WO2014015561A1 publication Critical patent/WO2014015561A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/46—Details of LED load circuits with an active control inside an LED matrix having LEDs disposed in parallel lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/355—Power factor correction [PFC]; Reactive power compensation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/36—Circuits for reducing or suppressing harmonics, ripples or electromagnetic interferences [EMI]

Definitions

  • the invention relates to the field of LED illumination, in particular to an integrated integrated LED module. Background technique
  • the light source used in street lighting includes incandescent lamps, high-pressure mercury lamps, high-pressure sodium lamps, metal halide lamps, fluorescent lamps, etc.
  • These street lamps are generally not environmentally friendly (containing heavy metals such as mercury, lead, and arsenic, which are harmful to the environment), high energy consumption, and short Shortcomings such as longevity, therefore, with the increasing awareness of global environmental protection, the application of green lighting will become more and more popular in countries all over the world, especially in developed countries and regions. These street lamps will gradually be replaced by green light sources.
  • the 3 ⁇ 5V forward voltage LED module is a green, environmentally friendly light source with high efficiency, energy saving and long illuminating life, which is of great significance for protecting the environment, saving energy and protecting human health.
  • the brightness of the T5V forward voltage LED module is achieved by adjusting the current flowing through the LED, so the brightness control of the LED is generally achieved by controlling the output current of the LED drive circuit.
  • the products are mixed, some in order to reduce the cost, the circuit is very simple, the power factor is only about 0.5, the luminous efficiency is very low, and the market can not meet the high efficiency.
  • the traditional LED drive power supply includes : EMI unit 121, A/D conversion unit 122, input and output isolation unit 123, constant voltage constant current output and overvoltage and overcurrent (open circuit short circuit) protection unit 124, and PFC power factor adjustment power supply 125, etc.
  • EMI unit 121 A/D conversion unit 122
  • A/D conversion unit 122 input and output isolation unit 123
  • constant voltage constant current output and overvoltage and overcurrent (open circuit short circuit) protection unit 124 constant voltage constant current output and overvoltage and overcurrent (open circuit short circuit) protection unit 124, and PFC power factor adjustment power supply 125, etc.
  • the line is very cumbersome, the line is difficult to be small, and the cost is greatly improved.
  • the specific circuits of different products are also different, and the development of the circuit is relatively difficult. , increased development time, due to the complexity of the part of the drive power line, so The relatively large size of LED luminaires seriously affects the overall design of the luminaire and the flexibility of the application.
  • the LED module In the current LED lighting scheme, in order to drive the LED module to emit light, it is necessary to add a driving circuit to generate a suitable driving current, and the LED module generates a large amount of heat when continuously emitting light, and a heat sink needs to be added. (Heat sink)
  • the LED module is not overheated, but in the current general luminaire structure, its LED module, drive circuit part and heat sink are independent.
  • FIG. 2 it is shown as a schematic exploded view of a conventional LED lamp. As shown in the figure, the LED lamp structure is composed of an LED module 10 and a heat sink for dissipating heat on the back of the LED module 10 .
  • a power supply case 12 for accommodating a driving power source, a transparent cover 13 covering the light emitting surface of the LED module, a cover body 14 for sealing the power supply case, and a cover body
  • the suspension member 15 and the like are composed.
  • Due to LED lamps Part of the circuit of the driving power supply is complicated, and its components have to be packaged and integrated by the bulky power supply casing 12. Because the components are independent in construction, not only material cost is wasted, but also the LED lamps displayed after assembly are large in structure and Bulk, not conducive to the construction of the luminaire connected to it, will also generate additional processing and assembly time, resulting in waste of production costs. Summary of the invention
  • an object of the present invention is to provide an integrated integrated LED module, which is used to solve the complexity of some lines in the prior art due to the driving power supply in the LED lamp, and is displayed after assembly.
  • the LED luminaires are large and cumbersome.
  • a further object of the present invention is to provide an integrated integrated LED module for solving the prior art, because the components of the LED lamp are independently constructed, which not only causes material cost waste, but also generates additional processing and assembly. Time, the problem of wasting production costs.
  • the LED module includes at least: a light transmissive plate having a heat conductive substrate and a built-in space for fastening the heat conductive substrate a transparent package; an LED array disposed on a circuit board, sealed in the transparent plate by the transparent package; a driving circuit disposed on the circuit board, sealed by the package body
  • the transparent board is electrically connected to the LED array through the circuit board for converting an external power source into a forward voltage of 12V to 75V for driving each LED in the LED array; and dissipating heat
  • the device has a heat conducting surface attached to the light transmissive plate and a plurality of fins integrally formed with the heat conducting surface.
  • the integrated integrated LED module of the present invention further includes a control board disposed on the heat sink, electrically connected to the driving circuit, and configured to output a control command to the driving circuit to adjust an execution point of the LED array On, off, brightness adjustment or color temperature adjustment.
  • the plurality of heat sinks of the heat sink have notches thereon, and a card slot for clamping the control board is formed.
  • the periphery of the transparent package has a folded edge, and the four corners of the folded edge are provided with a through hole, and the heat conducting surface of the heat sink has a screw hole corresponding to each of the through holes.
  • a sealing ring is further disposed on the periphery of the circuit board and the heat-conducting substrate, and is press-fitted between the transparent package and the heat sink to seal the gap therebetween.
  • the light-transmitting plate is attached to the heat-conducting surface of the heat sink by screwing, bonding, and fastening.
  • a heat conducting medium is disposed between the heat conducting surface of the heat sink and the light transmitting plate, and the guiding
  • the heat medium is a thermal conductive adhesive, a thermal grease, or a thermal conductive gasket.
  • the power of each LED in the LED array is 1W ⁇ 4W, and the LED array is arranged in a plurality of single packaged LEDs into a square, a rectangle, a circle, or a strip.
  • the array, or array of L EDs packaged by LED COB, is arranged in a square, rectangular, circular, or elongated array.
  • the LED array includes a plurality of parallel groups connected in parallel by a plurality of LEDs, and each of the parallel groups is connected in series.
  • the driving circuit includes: a power module, an external AC or DC power source and the LED array, including a rectifying unit, and an overcurrent and overvoltage protection unit connected to the rectifying unit, Converting an external power source into a forward voltage of 12V ⁇ 75V for driving each LED in the LED array; a control module connected between the power module and the LED array, including corresponding to each of the parallel group settings for guiding And a plurality of gate switches for cutting off the parallel group power supply loops, and a control unit for controlling each of the gate switches to perform an on or off operation according to the detected input voltage.
  • the control module further includes a detecting unit for outputting different strobe commands to the control unit after detecting the different input voltages.
  • the integrated integrated LED module of the present invention has the following beneficial effects:
  • the assembly can be assembled with the heat sink through a simple connection method, and the result of the three-in-one is achieved, so that the overall size and weight are greatly reduced, thereby effectively reducing the Corresponding lamp size, saving materials and saving costs.
  • the drive circuit reduces many electronic components, removes the electrolytic components and inductors of the restricted components, so that there is an opportunity to make the line and the load together, and to make a standardized light source, which can reduce the size of the entire product, the lamp
  • This standard light source can be combined into different power products, which reduces design cost, shortens product development cycle and cost, shortens product time to market, and controls product quality.
  • Figure 1 shows the schematic diagram of the conventional 3 ⁇ 5V forward voltage LED module driver circuit.
  • Figure 2 shows a schematic exploded view of a conventional LED luminaire.
  • FIG. 3 is a schematic exploded view showing the integrated integrated LED module of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing the assembly of the integrated integrated LED module of the present invention.
  • FIG. 5 shows a top view of the integrated integrated LED module of the present invention.
  • FIG. 6 shows a circuit schematic diagram of the integrated integrated LED module of the present invention.
  • FIG. 7 is a schematic exploded view showing another embodiment of the integrated integrated LED module of the present invention.
  • Figure 8 is a schematic view showing a circuit board in which an LED array and a driving circuit are disposed in the present invention.
  • FIG. 9 is a cross-sectional view showing the assembled structure of another embodiment of the integrated integrated LED module of the present invention.
  • FIG. 10 is a top plan view showing another embodiment of the integrated integrated LED module of the present invention.
  • FIG. 3 is a schematic exploded view showing the integrated integrated LED module of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing the assembly of the integrated integrated LED module of the present invention.
  • the present invention provides an integrated integrated LED module for use in street lighting, working lighting, and commercial lighting, specifically, for outdoor venue lighting such as stadiums, event squares, parks, or for urban use.
  • the integrated integrated LED module of the present invention can be assembled into a lamp to realize the convenience and diversification of LED lamp design and manufacture.
  • the LED module includes at least: a light transmissive plate 20, an LED array 21, a driving circuit 22, a heat sink 24, and a control board 27.
  • the transparent plate 20 has a heat-conducting substrate 25 and a transparent package that has the built-in space 200.
  • the transparent package includes plastic, glass, etc.
  • the material is, for example, metal, FR4, ceramic, silicon, or the like.
  • the heat conductive substrate 25 is, for example, an aluminum alloy material plate having good thermal conductivity
  • the transparent package is, for example, a transparent plastic cover with good light transmission characteristics.
  • the transparent plastic cover It can be a translucent cover with focusing or diffuse reflection.
  • FIG. 5 a top view of the integrated integrated LED module of the present invention is shown.
  • the LED array 2 is shown. 1 is disposed on a circuit board 23, and is sealed in the transparent plate 20 by the transparent package; in this embodiment, the LEDs of the LED array 21 have a power of 1W ⁇ 4W of the LED 210, In this embodiment, an LED of 1.5 W is preferably taken as an example.
  • a plurality of LEDs 210 are connected in parallel to form one or more parallel groups, and then each of the parallel groups is connected in series to form the LED array. twenty one.
  • the LED array 21 is arranged in a rectangular array by a plurality of single-package LEDs 210, but is not limited thereto. In other embodiments, the LED array 21 is also The array of LEDs arranged in a plurality of single packages may be arranged in a square, rectangular, circular, or elongated shape, or the LEDs encapsulated by the LED COB may be arranged in a square, rectangular, circular, or elongated shape.
  • the driving circuit 22 is disposed on the circuit board 23, is sealed in the transparent board 20 by the package body, and is electrically connected to the LED array 21 through the circuit board 23, and is used for The external power source is converted into a forward voltage of 12V to 75V for driving each LED 210 of the LED array to drive each of the LEDs 210 to perform a lighting operation.
  • the driving circuit 22 is preferably Each of the LEDs 210 in the L ED array 21 is driven to convert an external power source to a forward voltage of 50V.
  • FIG. 6, shows a circuit schematic diagram of the integrated integrated LED module of the present invention.
  • the drive circuit 22 includes a plurality of electronic components 220, and the plurality of electronic components 220 constitute a power module 221 and a control module 222.
  • the power module 221 is connected to an external AC or DC power source and the LED array 21, and includes a rectifying unit, and an overcurrent and overvoltage protection unit connected to the rectifying unit, for converting an external power source into driving the LED array.
  • Each of the L ED210s has a forward voltage of 12V to 75V to drive each of the LEDs 210 to perform a lighting operation.
  • the power module 221 is directly connected to the main power. For example, it is 220V AC for general purpose in China, 230V AC for general use in Europe, 110V AC for general use in North America, or 277V AC for general use in other fields.
  • the control module 222 is connected between the power module 221 and the LED array 21, and includes a plurality of gate switches corresponding to the parallel groups for turning on and off each of the parallel group power supply circuits, according to the detection.
  • the input voltage controls a control unit in which each of the gate switches performs an on or off operation, and a detection unit that outputs a different gate command to the control unit after detecting the different input voltages.
  • the control unit is, for example, a control chip including its peripheral circuit, and the plurality of gate switches are a transistor Q1, a transistor Q2, a transistor Q3, and a transistor Q4.
  • the LED array 21 is a series circuit composed of a plurality of parallel groups (e.g., parallel groups D1, D2, D3, D4 shown in Fig. 6).
  • the plurality of gate switches are the transistor Q1, the transistor Q2, the transistor Q3, and the transistor Q4, and the driving voltage input to the LED array 21 can be divided into four stages to be controlled.
  • the control unit turns on the transistor Q1. Grounding, the LED D1 is turned on to the ground.
  • the control unit turns off the transistor Q1, and the transistor Q2 is grounded to make the LED D1.
  • And D2 is turned on to the ground
  • the control unit turns off the transistor Q1, the transistor Q2, and the transistor Q3 is grounded to make the LED D1 D2 and D3 are turned on to ground.
  • the control unit turns off the transistor Q1, the transistor Q2 and the transistor Q3, and the transistor Q4 is turned on. Grounding, LED Dl, D2, D3 and D4 are turned on at the same time.
  • the heat sink 24 has a heat conducting surface 240 attached to the light transmissive plate 20 and a plurality of fins 241 integrally formed with the heat conducting surface 240.
  • the material of the heat sink 24 is, for example, aluminum having good thermal conductivity, and the molding thereof is, for example, aluminum extrusion, aluminum die casting, and aluminum profile lamp.
  • the light-transmitting plate 20 is attached to the heat-conducting surface 240 of the heat sink 24 by screwing, bonding, and clamping.
  • a heat conducting medium (not shown) is disposed between the heat conducting surface 240 of the heat sink 24 and the light transmitting plate 20, and the heat conducting medium is a heat conductive adhesive, a thermal grease, or a thermal conductive gasket.
  • the control board 27 is disposed on the heat sink 241 and electrically connected to the driving circuit 22 for outputting a control command to the driving circuit 22 to adjust the execution lighting, extinction, and brightness of the LED array 21. Adjustment or color temperature adjustment work.
  • the control board 27 includes a wired or wireless communication module for controlling the performing lighting, extinction, brightness adjustment or color temperature adjustment operation of the LED array 21 according to a control command sent by the remote control center.
  • the plurality of fins 241 of the heat sink 24 have notches (not shown) thereon, and a card slot (not shown) for locking the control board 27 is formed.
  • the control board 27 can also be fixed at other locations of the L ED module, for example, integrated in the light transmissive plate 20.
  • FIG. 7 is a schematic exploded view showing another embodiment of the integrated integrated LED module of the present invention.
  • the LED module comprises at least: a light transmissive plate 20, an LED array 21, a driving circuit 22, a circuit board 23, a heat sink 24, a heat conducting substrate 25, and a sealing ring 26.
  • the transparent plate 20 has a heat-conducting substrate 25 and a transparent package that has the built-in space 200.
  • the transparent package includes plastic, glass, etc.
  • the thermally conductive substrate 25 is, for example, an aluminum alloy plate having good thermal conductivity.
  • the periphery of the transparent package has a flange 201, and the four corners of the flange 201 are provided with a through hole 202.
  • the transparent package is, for example, a transparent plastic cover with good light transmission characteristics.
  • the transparent plastic cover can be Think of a translucent cover with focusing or diffuse reflection.
  • FIG. 8 a schematic diagram of a circuit board provided with an LED array and a driving circuit in the present invention.
  • the LED array 21 is disposed on a circuit board 23, and is sealed in the transparent board 20 by the transparent package.
  • the LEDs in the LED array 21 are The LED 210 having a power of 1 W to 4 W is preferably 1. 5 W of the LED as an example.
  • the plurality of LEDs 210 are connected in parallel to form one or more parallel groups, and then the parallel groups are respectively The series are connected in series to form the LED array 21.
  • the LED array 21 is arranged in a rectangular array by a plurality of single-packaged LEDs 210.
  • the LED array 21 is not limited thereto. In other embodiments, the LED array may also be a plurality of single
  • the packaged LEDs are arranged in a square, rectangular, circular, or elongated array, or arrays of LEDs encapsulated by LED COB arranged in a square, rectangular, circular, or elongated shape.
  • the driving circuit 22 is disposed on the circuit board 23, is sealed in the transparent board 20 by the package body, and is electrically connected to the LED array 21 through the circuit board 23, and is used for The external power source is converted into a forward voltage of 12V to 75V for driving each LED 210 of the LED array to drive each of the LEDs 210 to perform a lighting operation.
  • the driving circuit 22 is preferably Each of the LEDs 210 in the L ED array 21 is driven to convert an external power source to a forward voltage of 50V.
  • the driving circuit 22 includes a plurality of electronic components 220, and the plurality of electronic components 220 constitute a power module and a control module. It should be noted that the principle of the driving circuit in this embodiment is the same as that of the first embodiment described above, and the description thereof will be omitted in order to simplify the description.
  • the heat sink 24 has a heat conducting surface 240 attached to the light transmissive plate 20 and a plurality of fins 241 integrally formed with the heat conducting surface 240.
  • the material of the heat sink 24 is, for example, aluminum having good thermal conductivity, and the molding thereof is, for example, aluminum extrusion, aluminum die casting, and aluminum profile lamp.
  • the heat conducting surface 240 of the heat sink 24 has a screw hole 242 corresponding to each of the through holes 202.
  • the light-transmitting plate 20 is attached to the heat sink 24 by screws 28, which will be described in detail later.
  • FIG. 9 is a schematic cross-sectional structural view showing another embodiment of the integrated integrated LED module of the present invention.
  • FIG. 10 is a top plan view showing another embodiment of the integrated integrated LED module of the present invention.
  • the sealing ring 26 is disposed around the periphery of the circuit board 23 and the heat-conducting substrate 25, and is pressed between the transparent package and the heat sink 24 for sealing the gap therebetween.
  • the seal ring 26 is, for example, a rubber material or a silica gel material having elastic properties and high temperature resistance.
  • the sealing ring 26 is press-fitted between the folded edge of the transparent package and the heat conducting surface 240 of the heat sink 24 to seal the gap therebetween.
  • the sealing ring 26 The through hole 202 is disposed in the through hole 202 of the transparent package by the screw 28 and is locked in the screw hole 242 of the heat sink 24 so as to be pressed into the transparent package and the heat sink 24 .
  • Used to seal the gap between the two because the sealing ring is directly placed on the LED module inside the lamp, and then avoid It avoids the situation that the traditional lamp damages its internal circuit due to the water seepage of the cover. Compared with the traditional lamp, the drive circuit is complicated and bulky, and it is not easy to directly waterproof the LED light source.
  • the lamp composed of the inventive LED module has good performance. Waterproof performance.
  • the LED module of the present invention changes the traditional waterproof concept.
  • the concept of directly waterproofing the structure on the built-in module of the lamp is proposed, thereby avoiding the situation that the traditional lamp damages its internal circuit due to water leakage of the cover. Occurs, so that the luminaire having the LED module of the present invention can be applied to more environments.
  • the integrated integrated LED module of the present invention combines the LED array and the driving circuit into one, and can be assembled with the heat sink through a simple connection manner, thereby achieving the result of three-in-one, so that the overall size, Therefore, the weight is greatly reduced, thereby effectively reducing the size of the corresponding lamp, saving materials, and saving costs.
  • the driving circuit reduces many electronic components, removes the electrolytic capacitors and inductors of the limiting components, and thus has the opportunity to By connecting the line and the load together and making a standardized light source, the size of the entire product can be reduced.
  • the luminaire can be combined into a different power product by using this standard light source, thereby reducing the design cost and shortening the development cycle and cost of the product. , shortened the time to market of products, and the quality of products can also be controlled. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

Abstract

一种一体化集成型LED模组，至少包括：具有导热基板（25）以及透明封装体的透光板（20）；密封在透光板（20）中的LED阵列（21）；与LED阵列（21）电性连接，用于将外部电源转换为12V-75V正向电压以驱动LED阵列（21）中每一颗LED（210）的驱动电路（22）；以及贴合于透光板（20）上的散热器（24）。一体化集成型LED模组解决了现有技术中由于LED灯具中驱动电源部分线路复杂，造成组装后的LED灯具结构大且笨重的问题，且一体化集成型，节约材料成本和加工与装配时间，降低生产成本。

Description

一体化集成型 LED模组
技术领域
本发明涉及 LED照明领域， 特别是涉及一种一体化集成型 LED模组。 背景技术
目前路灯照明所采用光源有白炽灯、 高压汞灯、 高压钠灯、 金属卤化物灯、 荧光灯等， 这些路灯普遍存在不够环保 （含有汞、 铅、 砷等重金属物质对环境有害）、 高能耗、 短寿命等 缺点， 所以， 伴随着全球性环保意识的增强， 在世界各国， 尤其是发达国家和地区， 绿色照 明的应用将越来越普及， 这些路灯将逐渐被绿色环保的光源所取代。 3~5V正向电压的 LED模 组是一种高效、 节能、 发光寿命长的绿色环保光源， 对于保护环境、 节约能源、 保护人类健 康都具有重大意义。
诚如业界所知， 所述的； T5V正向电压的 LED 模组 的亮度是通过调节流过 LED 的电流来 实现， 所以对 LED的亮度控制一般通过控制 LED 驱动电路的输出电流来实现。 目前， 在； T5V 正向电压的 LED 驱动器领域， 产品良莠不齐， 有的为了降低成本， 线路做的十分简单， 功率 因数只做到 0. 5左右， 发光效率很低， 无法满足市场上对高效节省产品的需求， 有的为了追 求高性能要求， 电路十分复杂， 请参阅图 1， 显示为传统的; T5V正向电压的 LED 模组驱动电 路原理示意图， 如图所示， 传统的 LED驱动电源包括： EMI单元 121， A/D转换单元 122， 输 入和输出隔离单元 123， 恒压恒流输出及过压过流 （开路短路） 保护单元 124 ， 以及 PFC功 率因数调整电源 125等， 由于上述的驱动电路中用到大量的电解电容和电感等限制性器件， 所以在线路上十分繁琐， 线路很难做小， 成本大大提高； 再者， 不同产品的具体电路也不相 同， 电路的开发难度也比较大， 增加了开发时间， 由于驱动电源的部分线路复杂， 因而制得 的 LED灯具的体积相对较大， 严重影响灯具产品的整体设计以及应用的灵活性。
目前的 LED照明方案中， 为了驱动 LED模组 （LED Module ) 发光， 需要增加一个驱动电 路 ， 产生合适的驱动电流， 而 LED模组在持续发光时， 会产生大量的热， 需要增加一个散热 器 （Heat sink) 使 LED模组不至于过热， 但目前通用的灯具结构中， 其 LED模组、 驱动电路 部分、 散热器均是各自独立的。 请参阅图 2， 显示为传统的 LED灯具结构分解示意图， 如图所 示， 所述的 LED灯具结构由 LED模组 10， 合在所述 LED模组 10背面上用于对其散热的散热器 11， 用于容置驱动电源的电源壳体 12， 罩设于所述 LED模组出光面的透光罩 13， 贴用于密封 所述电源壳体的盖体 14， 以及连接所述盖体的悬挂件 15等组成。 呈如上述， 由于 LED灯具中 驱动电源的部分线路复杂， 其组成部件不得不采用体积庞大的电源壳体 12予以封装整合， 因 为各组成部件构造独立， 不但会造成材料成本浪费， 而且组装后所显示出来的 LED灯具结构 大且笨重， 不利于与之相连接的灯具构造， 也会产生额外的加工与装配时间， 造成生产成本 的浪费。 发明内容
鉴于以上所述现有技术的缺点， 本发明的目的在于提供一种一体化集成型 LED模组， 用 于解决现有技术中由于 LED灯具中驱动电源的部分线路复杂， 造成组装后所显示出来的 LED 灯具结构大且笨重等问题。
本发明的再一目的在于提供一种一体化集成型 LED模组， 用于解决现有技术中由于 LED 灯具中各组成部件构造独立， 不但会造成材料成本浪费， 也会产生额外的加工与装配时间， 造成生产成本的浪费的问题。
为实现上述目的及其他相关目的， 本发明提供一种一体化集成型 LED模组， 所述 LED模 组至少包括： 透光板， 具有一导热基板以及扣合所述导热基板且具有内置空间的透明封装体; LED阵列， 布设于一电路板上， 藉由所述透明封装体密封在所述透光板中； 驱动电路， 布设于 所述电路板上， 藉由所述封装体密封在所述透光板中， 并透过所述电路板与所述 LED 阵列电 性连接， 用于将外部电源转换为驱动所述 LED阵列中每一颗 LED的 12V~75V的正向电压； 以 及散热器， 具有贴合于所述透光板的导热面以及与所述导热面一体成型的多个散热片。
本发明的一体化集成型 LED模组还包括设置在所述散热片上的控制板， 电性连接所述驱 动电路， 用于输出控制指令给所述驱动电路令其调节所述 LED 阵列的执行点亮、 熄灭、 亮度 调节或色温调节作业。
在本发明的 LED模组中， 所述散热器的多个散热片上具有缺口， 形成一用于卡固所述控 制板的卡槽。
在本发明的 LED模组中， 所述透明封装体的周缘具有折边， 所述折边的四角开设有穿孔， 所述散热器的导热面上具有对应各该穿孔的螺孔。
在本发明的 LED模组中还包括密封圈， 环设于所述电路板及导热基板周缘， 并被压合于 所述透明封装体及所述散热器之间密封二者间隙。
在本发明的 LED模组中， 所述透光板藉由螺丝锁附、 黏合、 卡固的方式贴合于所述散热 器的导热面。
在本发明的 LED模组中， 所述散热器的导热面与所述透光板之间具有导热介质， 所述导 热介质为导热胶、 导热脂、 或者导热垫片。
在本发明的 LED模组中， 所述 LED阵列中各 LED的功率为 1W~4W， 且所述 LED阵列为由多 个单颗封装的 LED排列成正方形、 矩形、 圆形、 或长条形的阵列， 或者为由 LED COB封装的 L ED排列成正方形、 矩形、 圆形、 或长条形的阵列。
在本发明的 LED模组中， 所述 LED阵列包括由多个 LED并联连接的多个并联组， 各该并 联组之间串联连接。
在本发明的 LED模组中， 所述驱动电路包括： 电源模块， 连接外部交流或直流电源及所 述 LED 阵列， 包括一整流单元， 以及连接所述整流单元的过流过压保护单元， 用于将外部电 源转换为驱动所述 LED阵列中每一颗 LED的 12V~75V的正向电压； 控制模块， 连接于所述电 源模块以及 LED 阵列之间， 包括对应各该并联组设置用于导通及切断各该并联组供电回路的 多个选通开关， 以及用于依据检测到的输入电压控制各该选通开关执行导通或切断作业的控 制单元。 所述控制模块中还包括用于将检测到的不同输入电压后输出不同选通指令给所述控 制单元的检测单元。
如上所述， 本发明的一体化集成型 LED模组， 具有以下有益效果：
首先， 由于 LED模组、 驱动电路二合为一， 就可以通过简单的连接方式与散热器装配， 达到三合为一的结果， 使得整体尺寸、 重量也因此大大縮小， 进而有效地縮小了与之对应的 灯具尺寸， 节约材料， 节省成本。
而且， 驱动电路减少很多的电子元件， 去除了限制性元件电解电容和电感等， 这样就有 机会把线路和负载做到一起， 并做成一个标准化的光源， 就可以降低整个产品的尺寸， 灯具 可以利用这个标准的光源组合成不同功率的产品， 从而降低了设计成本， 縮短产品的开发周 期和成本， 縮短了产品的上市时间， 产品的质量也可以控制。 附图说明
图 1显示为传统的 3~5V正向电压的 LED 模组驱动电路原理示意图。
图 2显示为传统的 LED灯具结构分解示意图。
图 3显示为本发明一体化集成型 LED模组的分解结构示意图。
图 4显示为本发明一体化集成型 LED模组的组装剖视结构示意图。
图 5显示为本发明一体化集成型 LED模组的俯视图。
图 6显示为本发明一体化集成型 LED模组的电路原理图。
图 7显示为本发明一体化集成型 LED模组的另一实施例的分解结构示意图。 图 8显示为本发明中布设有 LED阵列和驱动电路的电路板示意图。
图 9显示为本发明一体化集成型 LED模组的另一实施例的组装剖视结构示意图。 图 10显示为本发明一体化集成型 LED模组的另一实施例的俯视图。 元件标号说明
10 LED模组
11、 24 散热器
12 电源壳体
121 EMI单元
122 A/D转换单元
123 输入和输出隔离单元
124 保护单元
125 PFC功率因数调整电源
13 透光罩
14 盖体
15 悬挂件
20 透光板
200 内置空间
201 折边
202 穿孔
21 LED阵列
210 LED
22 驱动电路
220 电子元件
221 电源模块
222 控制模块
23 电路板
240 导热面
241 散热片 242 螺孔
25 导热基板
26 密封圈
27 控制板
28 螺丝 具体实施方式
以下由特定的具体实施例说明本发明的实施方式， 熟悉此技术的人士可由本说明书所揭 露的内容轻易地了解本发明的其他优点及功效。
请参阅图 3至图 6。 须知， 本说明书所附图式所绘示的结构、 比例、 大小等， 均仅用以配 合说明书所揭示的内容， 以供熟悉此技术的人士了解与阅读， 并非用以限定本发明可实施的 限定条件， 故不具技术上的实质意义， 任何结构的修饰、 比例关系的改变或大小的调整， 在 不影响本发明所能产生的功效及所能达成的目的下， 均应仍落在本发明所揭示的技术内容得 能涵盖的范围内。 同时， 本说明书中所引用的如 "上"、 "下" 、 "左" 、 "右"、 "中 间"及 "一"等的用语， 亦仅为便于叙述的明了， 而非用以限定本发明可实施的范围， 其相 对关系的改变或调整， 在无实质变更技术内容下， 当亦视为本发明可实施的范畴。
实施例一
请参阅图 3及图 4， 图 3显示为本发明一体化集成型 LED模组的分解结构示意图。 图 4显 示为本发明一体化集成型 LED模组的组装剖视结构示意图。 如图所示， 本发明提供一种一体 化集成型 LED模组， 应用于路灯照明、 工况照明和商业照明中， 具体的， 例如体育场、 活动 广场、 公园等户外场地照明、 或者用于城市美化的建筑物灯光渲染等多种场合及领域， 具体 地， 本发明中的一体化集成型 LED模组可以组装成灯具从而实现 LED灯具设计、 制造的便捷 化、 多样化。 所述 LED模组至少包括： 透光板 20， LED阵列 21， 驱动电路 22， 散热器 24， 控 制板 27。
所述透光板 20具有一导热基板 25以及扣合所述导热基板 25且具有内置空间 200的透明 封装体； 具体地， 所述透明封装体要包含塑料， 玻璃等， 所述导热基板 25的材质例如为金属， FR4, 陶瓷， 硅等。 于本实施例中， 所述导热基板 25例如为具有良好导热性能的铝合金材质 板， 所述透明封装体例如为良好透光特性的透明塑料罩壳， 更详细地， 所述透明塑料罩壳可 以为具有聚焦或漫反射功能的透光罩。
请参阅图 5， 显示为本发明一体化集成型 LED模组的俯视图， 如图所示， 所述 LED阵列 2 1布设于一电路板 23上， 藉由所述透明封装体密封在所述透光板 20中； 于本实施例中， 所述 LED阵列 21中各 LED的功率为 1W~4W的 LED210, 在本实施例中， 优选为 1. 5W功率为的 LED 为例进行说明， 由多个 LED210并联连接组成一个或多个并联组， 再将各该并联组之间串联连 接以形成所述的 LED阵列 21。
请参阅图 5， 于本实施例中， 所述 LED阵列 21为由多个单颗封装的 LED210排列成矩形阵 列， 但并不局限于此， 于其他的实施方式中， 所述 LED阵列 21亦可为由多个单颗封装的 LED 排列成正方形、 矩形、 圆形、 或长条形的阵列， 或者为由 LED COB封装的 LED排列成正方形、 矩形、 圆形、 或长条形的阵列。
所述驱动电路 22布设于所述电路板 23上， 藉由所述封装体密封在所述透光板 20中， 并 透过所述电路板 23与所述 LED阵列 21电性连接， 用于将外部电源转换为驱动所述 LED阵列 中每一颗 LED210的 12V~75V的正向电压 (Forward Voltage ) ， 以驱动各该 LED210执行点亮 作业， 在本实施例中， 所述驱动电路 22优选为将外部电源转换为 50V的正向电压驱动所述 L ED阵列 21中每一颗 LED210。请参阅图 6，显示为本发明一体化集成型 LED模组的电路原理图。 如图所示， 所述驱动电路 22包括多个电子元件 220， 藉由所述的多个电子元件 220组成电源 模块 221和控制模块 222。
所述电源模块 221连接外部交流或直流电源及所述 LED阵列 21， 包括一整流单元， 以及 连接所述整流单元的过流过压保护单元，用于将外部电源转换为驱动所述 LED阵列中每一颗 L ED210的 12V~75V的正向电压 (Forward Voltage ) ， 以驱动各该 LED210执行点亮作业； 于本 实施例中， 所述电源模块 221直接接入交流市电 （Main power) ， 例如为中国通用的 220V交 流电，欧洲通用的 230V交流电，北美通用的 110V交流电，或者其他领域通用的 277V交流电。
所述控制模块 222连接于所述电源模块 221以及 LED阵列 21之间， 包括对应各该并联组 设置用于导通及切断各该并联组供电回路的多个选通开关， 用于依据检测到的输入电压控制 各该选通开关执行导通或切断作业的控制单元， 以及用于将检测到的不同输入电压后输出不 同选通指令给所述控制单元的检测单元。 于实际的应用实例中， 所述控制单元例如为一包含 其外围电路的控制芯片， 所述的多个选通开关为晶体管 Ql、 晶体管 Q2、 晶体管 Q3、 晶体管 Q 4。 所述 LED阵列 21藉由多个并联组 （例如图 6所示的并联组 Dl、 D2、 D3、 D4) 组成的串联 电路。
在图 6所显示的示例中， 所述的多个选通开关为晶体管 Ql、 晶体管 Q2、 晶体管 Q3、 晶体 管 Q4可以将输入至所述 LED阵列 21的驱动电压划分为 4个阶段予以控制， 当检测单元检测 到输入至所述 LED阵列 21的驱动电压达到第一段 LED的电压时， 控制单元令晶体管 Q1开通 接地， 使 LED D1对地导通， 当检测单元检测到输入至所述 LED阵列 21的驱动电压达到第二 段 LED的电压时， 控制单元令晶体管 Q1断开， 晶体管 Q2开通接地， 使 LED D1和 D2对地导 通， 当检测单元检测到输入至所述 LED阵列 21的驱动电压达到第三段 LED的电压时， 控制 单元令晶体管 Ql， 晶体管 Q2断开， 晶体管 Q3开通接地， 使 LED Dl , D2和 D3对地导通， 当检测单元检测到输入至所述 LED阵列 21的驱动电压达到第四段 LED的电压时， 控制单元令 晶体管 Ql， 晶体管 Q2和晶体管 Q3断开， 晶体管 Q4开通接地， 使 LED Dl， D2， D3和 D4同时 对地导通， 通过这种控制方式， 可以提高电源的效率和功率因数。
所述散热器 24具有贴合于所述透光板 20的导热面 240以及与所述导热面 240—体成型 的多个散热片 241。 于本实施例中， 所述散热器 24的材质例如为具有良好导热性能的铝， 其 成型例如为铝挤出， 铝压铸， 铝型材灯多种方式。
于本实施例中， 所述透光板 20藉由螺丝锁附、 黏合、 卡固的方式贴合于所述散热器 24 的导热面 240。且所述散热器 24的导热面 240与所述透光板 20之间具有导热介质（未图示）， 所述导热介质为导热胶、 导热脂、 或者导热垫片。
所述控制板 27设置在所述散热片 241上， 电性连接所述驱动电路 22， 用于输出控制指令 给所述驱动电路 22令其调节所述 LED阵列 21的执行点亮、 熄灭、 亮度调节或色温调节作业。 具体地， 所述控制板 27包括有通过有线或无线通信模块， 用于依据远程控制中心发送的控制 指令控制所述 LED阵列 21的执行点亮、 熄灭、 亮度调节或色温调节作业。
于本实施例中， 所述散热器 24的多个散热片 241上具有缺口 （未图示） ， 形成一用于卡 固所述控制板 27的卡槽（未图示） 。 在其他的实施方式中， 所述控制板 27亦可以固定于该 L ED模组的其他位置， 例如在集成在所述透光板 20中。
实施例二
请参阅图 7， 显示为本发明一体化集成型 LED模组的另一实施例的分解结构示意图。如图 所示， 所述 LED模组至少包括： 透光板 20， LED阵列 21， 驱动电路 22， 电路板 23、 散热器 2 4， 导热基板 25、 以及密封圈 26。
所述透光板 20具有一导热基板 25以及扣合所述导热基板 25且具有内置空间 200的透明 封装体； 具体地， 所述透明封装体包含塑料， 玻璃等， 所述导热基板 25的材质例如为金属， FR4, 陶瓷， 硅等。 于本实施例中， 所述导热基板 25例如为具有良好导热性能的铝合金材质 板。
在本实施例中， 所述透明封装体的周缘具有折边 201， 所述折边 201的四角开设有穿孔 2 02。 所述透明封装体例如为良好透光特性的透明塑料罩壳， 更详细地， 所述透明塑料罩壳可 以为具有聚焦或漫反射功能的透光罩。
请配合参阅图 8，显示为本发明中布设有 LED阵列和驱动电路的电路板示意图。如图所示， 所述 LED阵列 21布设于一电路板 23上， 藉由所述透明封装体密封在所述透光板 20中； 于本 实施例中， 所述 LED阵列 21中各 LED的功率为 1W~4W的 LED210, 在本实施例中， 优选为 1. 5 W功率为的 LED为例进行说明， 由多个 LED210并联连接组成一个或多个并联组， 再将各该并 联组之间串联连接以形成所述的 LED阵列 21。
于本实施例中， 所述 LED阵列 21为由多个单颗封装的 LED210排列成矩形阵列， 但并不 局限于此， 于其他的实施方式中， 所述 LED阵列亦可为由多个单颗封装的 LED排列成正方形、 矩形、 圆形、 或长条形的阵列， 或者为由 LED COB封装的 LED排列成正方形、 矩形、 圆形、 或长条形的阵列。
所述驱动电路 22布设于所述电路板 23上， 藉由所述封装体密封在所述透光板 20中， 并 透过所述电路板 23与所述 LED阵列 21电性连接， 用于将外部电源转换为驱动所述 LED阵列 中每一颗 LED210的 12V~75V的正向电压 ( Forward Voltage ) ， 以驱动各该 LED210执行点亮 作业， 在本实施例中， 所述驱动电路 22优选为将外部电源转换为 50V的正向电压驱动所述 L ED阵列 21中每一颗 LED210。 所述驱动电路 22包括多个电子元件 220， 藉由所述的多个电子 元件 220组成电源模块和控制模块。 需要说明的是， 本实施例中的驱动电路原理与上述的实 施例一相同， 为简化说明， 于本实施例中不予赘述， 特此述明。
所述散热器 24具有贴合于所述透光板 20的导热面 240以及与所述导热面 240—体成型 的多个散热片 241。 所述散热器 24的材质例如为具有良好导热性能的铝， 其成型例如为铝挤 出， 铝压铸， 铝型材灯多种方式。 在本实施例中， 所述散热器 24的导热面 240上具有对应各 该穿孔 202的螺孔 242。 所述透光板 20藉由螺丝 28锁附在所述散热器 24上， 容后详述。
请配合参阅图 9及图 10， 图 9显示为本发明一体化集成型 LED模组的另一实施例的组装 剖视结构示意图。 图 10显示为本发明一体化集成型 LED模组的另一实施例的俯视图。 如图所 示， 所述密封圈 26环设于所述电路板 23及导热基板 25周缘， 并被压合于所述透明封装体及 所述散热器 24之间用来密封二者间隙， 在应用的实例中， 所述密封圈 26例如为具有弹性性 能且耐高温的橡胶材质或硅胶材质。
具体地， 所述密封圈 26被压合于所述透明封装体的折边及所述散热器 24的导热面 240 之间以密封二者间隙， 在本实施例中， 所述密封圈 26的设置是藉由螺丝 28穿设于所述透明 封装体的穿孔 202并锁附于所述散热器 24的螺孔 242中， 以使其被压合于所述透明封装体及 所述散热器 24之间用来密封二者间隙， 由于密封圈直接设置在灯具内的 LED模组上， 进而避 免了传统的灯具因罩壳渗水而损坏其内部电路的情况发生， 相对于传统的灯具因驱动电路复 杂、 体积大， 不易直接对 LED光源进行防水， 由发明的 LED模组组成的灯具具有良好的防水 性能。
由上可知， 本发明的 LED模组改变了传统的防水理念， 首先提出将防水结构直接做在灯 具内置模组上的概念， 进而避免了传统的灯具因罩壳渗水而损坏其内部电路的情况发生， 因 而可以使得具有本实用新型的 LED模组的灯具能够应用到更多的环境中。
综上所述， 本发明的一体化集成型 LED模组将 LED阵列及驱动电路二合为一， 就可以通 过简单的连接方式与散热器装配， 达到三合为一的结果， 使得整体尺寸、 重量也因此大大縮 小， 进而有效地縮小了与之对应的灯具尺寸， 节约材料， 节省成本； 而且， 驱动电路减少很 多的电子元件， 去除了限制性元件电解电容和电感等， 这样就有机会把线路和负载做到一起， 并做成一个标准化的光源， 就可以降低整个产品的尺寸， 灯具可以利用这个标准的光源组合 成不同功率的产品， 从而降低了设计成本， 縮短产品的开发周期和成本， 縮短了产品的上市 时间， 产品的质量也可以控制。 所以， 本发明有效克服了现有技术中的种种缺点而具高度产 业利用价值。
上述实施例仅例示性说明本发明的原理及其功效， 而非用于限制本发明。 任何熟悉此技 术的人士皆可在不违背本发明的精神及范畴下， 对上述实施例进行修饰或改变。 因此， 举凡 所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等 效修饰或改变， 仍应由本发明的权利要求所涵盖。

Claims

权利要求书 、 一种一体化集成型 LED模组， 其特征在于， 所述 LED模组至少包括：
透光板， 具有一导热基板以及扣合所述导热基板且具有内置空间的透明封装体；
LED阵列， 布设于一电路板上， 藉由所述透明封装体密封在所述透光板中； 驱动电路， 布设于所述电路板上， 藉由所述封装体密封在所述透光板中， 并透过所 述电路板与所述 LED阵列电性连接， 用于将外部电源转换为驱动所述 LED阵列中每一颗
LED的 12V 75V的正向电压；
散热器， 具有贴合于所述透光板的导热面以及与所述导热面一体成型的多个散热 片。 、 根据权利要求 1所述的一体化集成型 LED模组， 其特征在于： 还包括设置在所述散热片 上的控制板， 电性连接所述驱动电路， 用于输出控制指令给所述驱动电路令其调节所述 LED阵列的执行点亮、 熄灭、 亮度调节或色温调节作业。 、 根据权利要求 2所述的一体化集成型 LED模组， 其特征在于： 所述散热器的多个散热片 上具有缺口， 形成一用于卡固所述控制板的卡槽。 、 根据权利要求 1所述的一体化集成型 LED模组， 其特征在于： 所述透明封装体的周缘具 有折边， 所述折边的四角开设有穿孔， 所述散热器的导热面上具有对应各该穿孔的螺 孔。 、 根据权利要求 4所述的一体化集成型 LED模组， 其特征在于： 还包括密封圈， 环设于所 述电路板及导热基板周缘， 并被压合于所述透明封装体及所述散热器之间密封二者间 隙。 、 根据权利要求 5所述的一体化集成型 LED模组， 其特征在于： 还包括多个穿设于所述透 明封装体的穿孔并锁附于所述散热器的螺孔中的螺丝。 、 根据权利要求 1 所述的一体化集成型 LED 模组， 其特征在于： 所述透光板藉由螺丝锁 附、 黏合、 卡固的方式贴合于所述散热器的导热面。 、 根据权利要求 1所述的一体化集成型 LED模组， 其特征在于： 所述散热器的导热面与所 述透光板之间具有导热介质， 所述导热介质为导热胶、 导热脂、 或者导热垫片。 、 根据权利要求 1所述的一体化集成型 LED模组， 其特征在于： 所述 LED阵列中各 LED 的功率为 1W~4W， 且所述 LED阵列为由多个单颗封装的 LED排列成正方形、 矩形、 圆 形、 或长条形的阵列， 或者为由 LED COB封装的 LED排列成正方形、 矩形、 圆形、 或 长条形的阵列。 0、 根据权利要求 9所述的一体化集成型 LED模组， 其特征在于： 所述 LED阵列包括由 多个 LED并联连接的多个并联组， 各该并联组之间串联连接。 1、 根据权利要求 10所述的一体化集成型 LED模组， 其特征在于： 所述驱动电路包括： 电源模块， 连接外部交流或直流电源及所述 LED阵列， 包括一整流单元， 以及连 接所述整流单元的过流过压保护单元， 用于将外部电源转换为驱动所述 LED阵列中每 一颗 LED的 12V 75V的正向电压；
控制模块， 连接于所述电源模块以及 LED阵列之间， 包括对应各该并联组设置用 于导通及切断各该并联组供电回路的多个选通开关， 以及用于依据检测到的输入电压 控制各该选通开关执行导通或切断作业的控制单元。 、 根据权利要求 11 所述的一体化集成型 LED模组， 其特征在于： 所述控制模块中还包 括用于将检测到的不同输入电压后输出不同选通指令给所述控制单元的检测单元。
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CN112325246A (zh) * 2020-07-08 2021-02-05 海洋王（东莞）照明科技有限公司 壳体结构及灯具

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