WO2014001957A1 - Ensemble destiné à transférer et dissiper la chaleur - Google Patents

Ensemble destiné à transférer et dissiper la chaleur Download PDF

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Publication number
WO2014001957A1
WO2014001957A1 PCT/IB2013/054972 IB2013054972W WO2014001957A1 WO 2014001957 A1 WO2014001957 A1 WO 2014001957A1 IB 2013054972 W IB2013054972 W IB 2013054972W WO 2014001957 A1 WO2014001957 A1 WO 2014001957A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
heat transferring
transferring element
coupling member
heat
Prior art date
Application number
PCT/IB2013/054972
Other languages
English (en)
Inventor
Bas Fleskens
Original Assignee
Koninklijke Philips N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips N.V. filed Critical Koninklijke Philips N.V.
Publication of WO2014001957A1 publication Critical patent/WO2014001957A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Definitions

  • the present invention relates to an assembly for transferring and dissipating heat generated by electrical devices.
  • the assembly comprises a substrate for holding electrical devices, a heat transferring element and a thermal interface material.
  • the heat sink cools the device by transferring and dissipating the heat into the surroundings.
  • Heat sinks are usually brought in thermal contact with a surface of the substrate holding the electrical devices, either on the same side as the device, or on a side opposite to the device.
  • thermal contact resistance may occur due to voids created by surface roughness effects, defects and misalignment of the interface, which might reduce the performance of heat transfer from the substrate to the heat sink via the interface.
  • One solution is thus to decrease the surface roughness while the interface pressure is increased.
  • TIMs are thermal grease, epoxy, pad, or a gap filler, that are applied between surfaces of the heat sink and the substrate.
  • the TIM may provide an improved thermal contact and enable heat transfer between the substrate and the heat sink.
  • Applying a contact pressure to the thermal interfaces might improve thermal performance with regard to lifetime and thermal cycles during operation.
  • screws or springs are used for generating the contact pressure and securing the parts together, an example of which can be found in US Patent No. 7,883,240 B2.
  • a drawback with such technology is that it is difficult to maintain a minimum contact pressure over lifetime, and thereby ensuring a stable thermal performance.
  • the relatively high production cost, including both cost of the material and cost of assembly, is another drawback.
  • a concern of the present invention is to provide an assembly capable of transferring and dissipating heat generated by electrical components and a method for producing an assembly, which may facilitate or even enable a more stable thermal performance over its lifetime compared to known assemblies.
  • a further concern of the present invention is to provide an assembly capable of transferring and dissipating heat generated by electrical components and a method for producing an assembly which may reduce production costs in terms of an easier assembly process and reduced bill of materials compared to known assemblies.
  • an assembly comprising a substrate adapted to support at least one electrical component, a heat transferring element, or heat conducting element, adapted to dissipate and/or absorb heat generated from operation of the at least one electrical component, and a thermal interface material arranged between the substrate and the heat transferring element and in thermal contact with at least a first surface of the substrate and at least a first surface of the heat transferring element, respectively.
  • the heat transferring element comprises at least one coupling member integrally formed with the heat transferring element and arranged to couple the heat transferring element to the substrate.
  • the at least one coupling member extends through a corresponding through hole in the substrate and has an extending portion that extends past the end of the through-hole.
  • the extending portion of the at least one coupling member comprises a lateral projection having an engaging end arranged for engaging at least one receiving surface portion on a second surface of the substrate so as to couple the heat transferring element and the substrate to each other such that movement of the substrate in at least a first direction parallel or substantially parallel to a normal of the substrate is impeded, the second surface of the substrate being arranged opposite to the first surface of the substrate.
  • substrate it is meant any unit or element suitable for mechanically supporting and possibly electrically connecting electrical components, such as high-power semiconductor devices, microprocessors, light-emitting diodes (LEDs) and other devices that may require cooling due to heat generated during their operation.
  • a substrate could for example include a printed circuit board (PCB).
  • the thermal contact between the thermal interface material (TIM) and the at least a first surface of the substrate and at least a first surface of the heat transferring element, respectively, may be achieved by the TIM being coupled directly to the at least a first surface of the substrate and/or at least a first surface of the heat transferring element, respectively, or indirectly via for example a thermally conductive element such as a thermally conductive inter layer or the like.
  • the TIM may for example be arranged in the form of a layer or layers.
  • the heat transferring element may include a first surface in thermal contact with the TIM, a thermally conductive material, and at least one second surface through which the transferred heat is dissipated.
  • heat transferring element should be interpreted broadly - in principle, the heat transferring element may refer to any thermally conductive component or element adapted to dissipate and/or absorb heat.
  • the heat transferring element may for example include a heat sink and/or a heat spreader.
  • the heat transferring element may for example comprise a metal sheet or layer or plate, or a sheet of layer of another material having a relatively high thermal conductivity.
  • the heat transferring element may advantageously comprise a sheet material of metal such as copper, a metal alloy such as an aluminum alloy, polymers, composites, and/or other suitable materials known in the art.
  • the coupling members can be integrally formed with the heat transferring element for example by means of a controllable stamping tool.
  • the stamping process may include a variety of material- forming processes such as for example punching, blanking, embossing, bending, flanging, or coining.
  • the lateral projection of the extending portion of the coupling member may be formed by for example a push tool. Thereby motion of the substrate in a direction parallel to a normal of the substrate may be impeded and the substrate may be coupled to the heat transferring element.
  • TIMs include thermal grease, such as silicone oil filled with aluminum oxide, zinc oxide, or boron nitride, thermally conductive compounds, elastomers, adhesive tapes, adhesive pads, liquid dispensed materials, and/or other materials known in the art.
  • the coupling members being integrally formed with the heat transferring element, there may be no need for extra, separate parts to fix or couple the heat transferring element and the substrate, e.g. a PCB, together. Thereby the bill-of-material may be reduced, which may facilitate or even enable a reduction of the costs for design, manufacture and stock-keeping.
  • Coupling members which are integrally formed with the heat transferring element may be formed in very thin heat transferring element, such as a heat spreader and/or a sheet metal plate, e.g. having a thickness of about 1-2 mm or even less, e.g. about 0.2 mm, with a reduced or even no risk of the coupling members becoming damaged during construction of the assembly.
  • This is in contrast to using separately arranged coupling members such as for example screw fixations, where screws may require a certain screw thread length in order to provide sufficient robustness for withstanding forces acting on the screw fixation during construction of the assembly.
  • the coupling between the heat transferring element and the substrate may involve substantially no force or only a small force between the heat transferring element and the substrate, or even no force at all between the heat transferring element and the substrate, in the finalized assembly.
  • a force between the heat transferring element and the substrate may only be required during the assembly process.
  • a substrate may be coupled with a relatively thin heat transferring element, e.g. a sheet metal plate having a thickness of about 1-2 mm or even less, e.g.
  • the present invention is also advantageous in that multiple substrates, both superposing each other and being positioned side-by-side, may be assembled at the same time and using the same or similar equipment.
  • the present invention may also enable other types of applications, such as housings and isolators, to be mounted to the heat transferring element, e.g. the heat sink or heat spreader, or possibly a heat spreader to be mounted to a heat sink.
  • the heat transferring element e.g. the heat sink or heat spreader, or possibly a heat spreader to be mounted to a heat sink.
  • the engaging end may be arranged for engaging at least one receiving surface portion on a second surface of the substrate so as to couple the heat transferring element and the substrate to each other such that movement of the substrate in at least a first direction parallel to a normal of the substrate is substantially prevented or restricted in a predefined manner.
  • the lateral projection is arranged such that the engaging end is biased towards the at least one receiving surface portion on the second surface of the substrate. This may be achieved by plastically and permanently deforming the extending portion of the coupling member.
  • the coupling member comprises a shoulder directly or indirectly abutting the first surface of the substrate, thereby providing a predetermined separating gap between the first surface of the substrate and the first surface of the heat transferring element.
  • the shoulder may abut the first surface of the substrate either directly, or indirectly via for example a separating interlayer such as a shim or spacer.
  • the shoulder acting as a stand-off, can be formed as the coupling member is formed, and can be designed to ensure a well controlled thermal gap. As heat transferring performance varies with the thickness of the thermal gap (i.e. the thickness of the TIM layer), a well controlled gap is advantageous. Such gap may provide a well controlled transmission or transfer of heat.
  • the substrate and the heat transferring element are arranged such that a cross section area of a through-hole is larger than a cross section area of the corresponding coupling member so as to allow for a predefined extent of relative motion of the substrate and the heat transferring element in a plane parallel or substantially parallel with the first surface of the substrate.
  • the heat transferring element comprises several coupling members, i.e. two or more coupling members, integrally formed with the heat transferring element and arranged to couple the heat transferring element to the substrate
  • the substrate and the heat transferring element may be arranged such that for at least one of the coupling members, a cross section area of the corresponding through-hole is larger than a cross section area of the coupling member so as to allow for a predefined extent of relative motion of the substrate and the heat transferring element in a plane parallel or substantially parallel with the first surface of the substrate.
  • the through-holes corresponding to the respective coupling members may have different cross section areas.
  • the cross section area of the corresponding through-hole may be substantially the same as or only slightly larger than the cross section area of the coupling member, while for other coupling members, the cross section areas of the corresponding through-holes may be larger than the cross section areas of the respective coupling members, so as to allow for a predefined extent of relative motion of the substrate and the heat transferring element in a plane parallel or substantially parallel with the first surface of the substrate.
  • the substrate comprises a PCB.
  • the substrate comprises at least one LED.
  • the at least one LED may for example comprise an organic or inorganic LED or any other type of LED.
  • the at least one LED may be a packaged LED or a naked die.
  • the method comprises providing a substrate adapted to support at least one electrical component, providing a heat transferring element, or heat conducting element, adapted to dissipate and/or absorb heat generated from operation of the at least one electrical component, and providing a thermal interface material arranged between the substrate and the heat transferring element and in thermal contact with at least a first surface of the substrate and at least a first surface of the heat transferring element, respectively.
  • the method comprises integrally forming at least one coupling member with the heat transferring element and arranging the coupling member to couple the heat transferring element to the substrate.
  • the method comprises arranging the at least one coupling member to extend through a corresponding through hole in the substrate such that an extending portion of the coupling member extends past the end of the through hole.
  • a lateral projection having an engaging end arranged for engaging at least one receiving surface portion on a second surface of the substrate is formed of the extending portion of the at least one coupling member, so as to couple the heat transferring element and the substrate to each other such that movement of the substrate in at least a first direction parallel or substantially parallel to a normal of the substrate is impeded, the second surface of the substrate being arranged opposite to the first surface of the substrate.
  • the forming of the coupling members and the coupling of the substrate to the heat transferring element can be performed in a well controlled and repeatable way, which may provide for a good heat transferring capacity and a stable performance during most or the entirety of the lifetime of the assembly.
  • a method for producing an assembly wherein the lateral projection is arranged such that the engaging end is biased towards the at least one receiving surface portion on the second surface of the substrate.
  • a method for producing an assembly wherein the at least one coupling member is integrally formed with the heat transferring element and arranged to couple the heat transferring element to the substrate such that the at least one coupling member comprises a shoulder directly or indirectly abutting the first surface of the substrate, thereby providing a predetermined separating gap between the first surface of the substrate and the first surface of the heat transferring element.
  • a method for producing an assembly wherein the substrate and the heat
  • a cross section area of a through-hole is larger than a cross section area of the corresponding coupling member so as to allow for a predefined extent of relative motion of the substrate and the heat transferring element in a plane parallel with the first surface of the substrate.
  • a method for producing an assembly wherein the substrate comprises a PCB.
  • a method for producing an assembly wherein the substrate comprises at least one LED.
  • the at least one LED may for example comprise an organic or inorganic LED or any other type of LED.
  • a method for producing an assembly comprising forming the lateral projection by means of a push tool, which may facilitate the assemblage procedure and enable various kinds of substrates to be mounted in a simplified way.
  • the lateral projection may for example be formed by plastically deforming at least one end portion of the at least one coupling member using at least one push tool.
  • the push tool may for example use a constant force or degree of deformation to obtain lateral projections in a repeatable way, which may then enable the substrate to be secured to the heat transferring element with a high accuracy and repeatability.
  • Fig. 1 is a vertical cross section of a portion of an assembly according to an embodiment of the present invention
  • Fig. 2 is an exploded perspective view of a heat transferring element and a substrate according to an embodiment of the present invention
  • Fig. 3 is a perspective view of an assembly according to an embodiment of the present invention.
  • Figs. 4a-4d illustrate a method according to an embodiment of the present invention.
  • exemplifying embodiments of the present invention is described with reference to an assembly for transferring and dissipating heat generated by an electrical component constituted by a light-emitting diode (LED) used in a lighting application.
  • LED light-emitting diode
  • the present invention is not limited to lighting applications but may be used in a number of different applications where dissipation and/or transfer of heat generated by one or several electrical components supported by a substrate is required or desired.
  • the number of electrical components on the substrate may in principle be any positive integer.
  • Fig. 1 schematically illustrates an assembly 15 comprising a substrate constituted by a printed circuit board (PCB) 1 adapted to support a light-emitting diode (LED, not shown) and/or another electrical component and having a through-hole 10 extending from a first surface 7 of the PCB 1 to a second surface 9.
  • the assembly 15 comprises a heat transferring element 2 constituted by a heat sink formed of a metal sheet, and a thermal interface material (TIM) 3 arranged as a layer between the substrate 1 and the heat sink 2 as illustrated in Fig. 1.
  • the TIM 3 is in thermal contact with the first surface 7 of the PCB 1 and a first surface 8 of the heat sink 2.
  • the heat transferring element 2 may include a heat spreader.
  • the heat sink 2 comprises a coupling member 4, constituted by a "rivet" 4, integrally formed with the heat sink 2 by means of e.g. a metal stamping tool.
  • the rivet 4 extends through the corresponding through-hole 10 in the PCB 1, having an extending portion 11 that extends past the end of the through-hole 10.
  • the extending portion 11 is provided with a lateral projection 5 that engages with the second surface 9 of the PCB 1, thereby coupling the PCB 1 to the heat sink 2 such that movement of the PCB 1 in a direction that is parallel to a normal of the surfaces 7, 9 of the PCB 1 is impeded or restricted to a predefined extent.
  • the through-hole 10 may be a straight through-hole.
  • the present invention is not limited to the case of the through-hole 10 being straight.
  • the through-hole 10 may have a curved configuration.
  • the rivet 4 further comprises a second lateral projection, or shoulder 6, arranged in abutment with the first surface 7 of the PCB 1.
  • This shoulder 6 provides, possibly in combination with other adjacent coupling members (not shown in Fig. 1) integrally formed with the heat sink 2, a stand-off that defines a separating distance between the first surface 7 of the PCB 1 and the first surface 8 of the heat sink 2; a gap wherein the TIM 3 can be arranged.
  • Thermal grease may be used as TIM 3 and is applied to the heat sink 2 prior to the positioning of the PCB 1.
  • the final thickness of the TIM layer 3 is determined by the height of the shoulder 6 and might be less dependent on the contact pressure applied during assemblage.
  • Fig. 2 is an exploded perspective view of an assembly comprising a heat transferring element 2 constituted by a heat sink 2 and a substrate 1 constituted by a PCB 1.
  • the heat transferring element 2 may include a heat spreader.
  • the heat sink 2 comprises five integrally formed coupling members or rivets 4, having respective length axes extending in a direction parallel to a normal of the first surface 8 of the heat sink 2. It is to be understood that the number of coupling members or rivets 4 shown in Fig. 2 is according to an example.
  • the heat sink 2 may in principle comprise any positive integer number of coupling members or rivets 4. Each of the rivets 4 has a shoulder 6 positioned close to the first surface 8 of the heat sink 2.
  • the PCB 1 comprises five corresponding through-holes 10 adapted to receive the rivets 4 during positioning of the PCB 1 on the heat sink 2.
  • the through-holes 10 exhibit a circular cross section area that is larger than the corresponding cross section area of the rivet 4, which may enable a motion in a plane parallel with the first surface 8 of the heat sink 2 so as to compensate for thermal expansion of the PCB 1 and/or the heat sink during operation of the assembly.
  • Fig. 3 is a perspective view of the assembly shown in Fig. 2.
  • the lateral projections 5 have been provided or formed by means of a push tool (not shown in Fig. 3, see Fig. 4c) and couple the PCB 1 with the heat sink 2.
  • Fig. 4a-4d schematically illustrate a method of producing an assembly according to an embodiment of the present invention.
  • Fig. 4a shows a PCB 1 being provided on a heat sink 2, such that the first surface 7 of the PCB 1 is facing the first surface 8 of the heat sink 2.
  • a rivet 4, integrally formed with the heat sink 2 extends through a through- hole 10 in the PCB 1, and has an extending portion 11 that extends past the end of the through-hole 10 positioned at the second surface 9 of the PCB 1.
  • a TIM 3 has been provided on the first surface 8 of the heat sink 2 or on the first surface 7 of the PCB 1 (cf. Fig. 1). At this point the rivet 4 and the through-hole
  • a tool 12 is used for generating a contact pressure force.
  • the tool 12 acts on the second surface 9 of the PCB 1.
  • an appropriate contact pressure can be achieved during assemblage, by which the first surface 7 of the PCB 1 abuts a shoulder 6 of the rivet 4 that creates a stand-off defining a separating gap between the first surfaces 7, 8 of the PCB 1 and the heat sink 2, respectively, such that thermal contact is achieved with the first surfaces 7, 8 as the PCB 1 is pressed by the tool 12.
  • a first push tool 13 is used to form the extending portion
  • a second push tool 14 is applied to form the lateral projection 5 into a shape suitable for securing the PCB 1 and the heat sink 2 together.
  • the second push tool 14 engages with the circumferential portion of the lateral projection 5 and plastically deforms it such that the circumferential portion is abutting the second surface 9 of the PCB 1.
  • the rivet 4 is provided with a head that couples the PCB 1 to the heat sink 2.
  • the tool 12 for generating the contact pressure, and the first and second push tools 13, 14, are removed.
  • the coupling between the heat sink 2 and the PCB 1 may involve substantially no force or only a small force between the heat sink 2 and the PCB 1 , or even no force at all between the heat sink 2 and the PCB 1 , in the finalized assembly. Force between the heat sink 2 and the PCB 1 may only be required during the assembly process, as described above with reference to Fig. 4b.
  • the lateral projection 5 By forming the lateral projection 5 such that it has a shape as illustrated in Figs. 4c and/or 4d (also see Fig. 1), there may be achieved a coupling between the coupling member or rivet 4 and the PCB 1 such that in the finalized assembly there is substantially no or even no force applied by the rivet 4 on the PCB 1 in a plane parallel to the first surfaces 7, 8 of the PCB 1 and/or in a plane perpendicular to the first surfaces 7, 8 of the PCB 1, e.g. in a radial direction and/or an axial direction, respectively, with respect to the rivet 4.
  • an assembly for transferring and dissipating heat generated by electrical devices comprises a substrate for holding electrical components, a heat transferring element and a thermal interface material.
  • the substrate is coupled to the heat transferring element by means of coupling members which are integrally formed with the heat transferring element.
  • the thermal interface material is arranged between the substrate and the heat transferring element and in thermal contact with surfaces of the substrate and the heat transferring element, respectively.

Abstract

La présente invention concerne un ensemble (15) destiné à transférer et dissiper la chaleur générée par des dispositifs électriques. L'ensemble comprend un substrat (1), destiné à maintenir des composants électriques, un élément (2) de transfert de chaleur et un matériau (3) d'interface thermique. Le substrat (1) est couplé à l'élément (2) de transfert de chaleur au moyen d'éléments (4) de couplage, intégrés dans l'élément (2) de transfert de chaleur. Le matériau (3) d'interface thermique est agencé entre le substrat (1) et l'élément (2) de transfert de chaleur et en contact thermique avec les surfaces (7, 8) du substrat (1) et de l'élément (2) de transfert de chaleur respectivement. Ainsi, l'invention peut concerner un ensemble montrant des performances thermiques plus stables sur toute sa durée de vie que les ensembles connus. L'invention concerne également un procédé de production d'un ensemble.
PCT/IB2013/054972 2012-06-28 2013-06-18 Ensemble destiné à transférer et dissiper la chaleur WO2014001957A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261665354P 2012-06-28 2012-06-28
US61/665,354 2012-06-28

Publications (1)

Publication Number Publication Date
WO2014001957A1 true WO2014001957A1 (fr) 2014-01-03

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PCT/IB2013/054972 WO2014001957A1 (fr) 2012-06-28 2013-06-18 Ensemble destiné à transférer et dissiper la chaleur

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163564A (ja) * 1997-11-25 1999-06-18 Canon Inc 電子機器及び電子機器の製造方法
US6347038B1 (en) * 1999-09-22 2002-02-12 Valeo Vision Electronic assemblies with a heat sink, especially for a control module of a motor-vehicle headlight discharge lamp
US6582100B1 (en) * 2000-08-09 2003-06-24 Relume Corporation LED mounting system
US20070188692A1 (en) * 2004-03-16 2007-08-16 Matsushita Electric Industrial Co., Ltd. Driver module structure
US20080296599A1 (en) * 2005-06-27 2008-12-04 Mazzochette Joseph B LED Package with Stepped Aperture
US7883240B2 (en) 2007-10-16 2011-02-08 Foxsemicon Integrated Technology, Inc. Light emitting diode based light source assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163564A (ja) * 1997-11-25 1999-06-18 Canon Inc 電子機器及び電子機器の製造方法
US6347038B1 (en) * 1999-09-22 2002-02-12 Valeo Vision Electronic assemblies with a heat sink, especially for a control module of a motor-vehicle headlight discharge lamp
US6582100B1 (en) * 2000-08-09 2003-06-24 Relume Corporation LED mounting system
US20070188692A1 (en) * 2004-03-16 2007-08-16 Matsushita Electric Industrial Co., Ltd. Driver module structure
US20080296599A1 (en) * 2005-06-27 2008-12-04 Mazzochette Joseph B LED Package with Stepped Aperture
US7883240B2 (en) 2007-10-16 2011-02-08 Foxsemicon Integrated Technology, Inc. Light emitting diode based light source assembly

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