WO2013189894A1 - Organische leuchtdiode - Google Patents
Organische leuchtdiode Download PDFInfo
- Publication number
- WO2013189894A1 WO2013189894A1 PCT/EP2013/062536 EP2013062536W WO2013189894A1 WO 2013189894 A1 WO2013189894 A1 WO 2013189894A1 EP 2013062536 W EP2013062536 W EP 2013062536W WO 2013189894 A1 WO2013189894 A1 WO 2013189894A1
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- electrode
- emitting diode
- metal layers
- organic light
- Prior art date
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- 239000010410 layer Substances 0.000 claims abstract description 248
- 239000012044 organic layer Substances 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 229910052755 nonmetal Inorganic materials 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 230000005855 radiation Effects 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 19
- 229910052709 silver Inorganic materials 0.000 claims description 17
- 239000002800 charge carrier Substances 0.000 claims description 9
- 150000002843 nonmetals Chemical class 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 4
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910001507 metal halide Inorganic materials 0.000 claims description 2
- 150000005309 metal halides Chemical class 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- -1 ZnO Chemical class 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000002927 oxygen compounds Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/816—Multilayers, e.g. transparent multilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
Definitions
- Organic light-emitting diode An organic light-emitting diode is specified.
- the organic light-emitting diode comprises a carrier substrate.
- the carrier substrate is preferably permeable to radiation.
- the carrier substrate may be clear.
- the carrier substrate is, for example, a glass plate, a glass sheet, a plastic sheet or a plastic sheet
- the carrier substrate may comprise a ceramic or consist of a ceramic.
- Carrier substrate may devices for electrical and / or mechanical contacting of the light emitting diode
- the light-emitting diode comprises a scattering layer.
- the scattering layer is adapted to scatter radiation generated during operation of the light-emitting diode.
- the scattering layer has a larger scattering effect in the lateral direction, that is to say parallel to the main extension directions of the carrier, than in the direction perpendicular to the direction of travel Carrier.
- Radiation that is perpendicular to the carrier substrate is preferably not or not significantly through the scattering layer
- the scattering layer can thus appear clear in plan view on the carrier substrate. This can be achieved by a relatively low concentration of scattering centers.
- the scattering layer can also have a more scattering effect, so that the light-emitting diode is opaque and / or diffusely reflective to a viewer when switched off.
- the organic light emitting diode a first electrode.
- the first electrode is an anode.
- the first electrode may also be formed as a cathode.
- the first electrode is preferably radiation-transparent, in particular clear-vision, for a radiation generated during operation of the light-emitting diode.
- the organic light-emitting diode has one or more organic layer sequences.
- the at least one organic layer sequence contains at least one active layer.
- the active layer is based or consists of at least one organic material and is adapted to operate during operation of the light emitting diode
- the organic compound in particular to produce visible radiation.
- the organic compound in addition to the at least one active layer, the organic
- Layer sequence also contain additional layers.
- additional layers are in particular Charge carrier injection layers,
- the organic light-emitting diode has a second electrode. At the second
- the electrode is preferably a cathode. It is the second electrode further preferred
- the light emitting diode in the off state can act as a mirror, preferably as specular
- the carrier substrate the scattering layer, the first electrode, the organic layer sequence with the organic layer and the second electrode. It is possible that the abovementioned components follow one another at least in part directly or that further layers are introduced between the abovementioned components.
- the said layers are preferably aligned parallel to one another and in each case shaped planar and planar.
- the scattering layer has a higher average refractive index than the organic layer sequence. This is valid for at least one
- the Peak wavelength is, for example, the wavelength at which a maximum spectral energy density of the
- the average refractive index is the average refractive index
- Litter layer at least a 1.1-compartment or at least a 1.2-compartment of the average refractive index of the organic layer sequence.
- the first comprises
- Electrode non-metal layers and metal layers are Electrode non-metal layers and metal layers.
- non-metal layers means that these layers are not predominantly based on a metal and their physical properties, in particular with regard to the radiation transmission, are not metallic
- a material of the non-metal layers is preferably a conductive, transparent oxide.
- Transparent conductive oxides English transparent conductive oxides or short TCO, are transparent, conductive
- metal oxides such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or indium tin oxide, ITO for short.
- metal oxides such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or indium tin oxide, ITO for short.
- binary oxides such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or indium tin oxide, ITO for short.
- binary oxides such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or indium tin oxide, ITO for short.
- Metal oxygen compounds such as ZnO, SnO 2 or ⁇ 2 O 3 also include ternary metal oxygen compounds, such as Zn 2 SnO 2, Cd SnO 3, Zn SnO 3, Mgln 2Ozi, GalnO 3, 2 ⁇ 5 or In 4 Sn 3 O 2, or mixtures of different transparent conductive oxides into the group of TCOs.
- ternary metal oxygen compounds such as Zn 2 SnO 2, Cd SnO 3, Zn SnO 3, Mgln 2Ozi, GalnO 3, 2 ⁇ 5 or In 4 Sn 3 O 2, or mixtures of different transparent conductive oxides into the group of TCOs.
- TCOs do not necessarily correspond to one
- metal layers can mean that these
- the metal layers to at least 95 atomic% or at least 99 atomic% or at least 99.8 atom% of metals.
- the metal layers preferably have a smaller average geometric thickness than the non-metal layers.
- the number of non-metal layers is exactly 1 or 2 or 3 or 4 versus the number of
- Non-metal layers alternately.
- the non-metal layers and the metal layers can each follow one another directly, so that adjacent metal layers and
- Touch non-metal layers Particularly preferably, there is no further layer between the non-metal layers and the metal layers and there are also no inclusions between the metal layers and the non-metal layers.
- the organic light-emitting diode comprises a carrier substrate, a scattering layer, a first electrode, an organic layer sequence with at least one active layer and a second electrode. All the above components follow in the specified
- the litter layer has a higher average refractive index than the organic layer Layer sequence.
- the first electrode contains at least n or at least n + 1 non-metal layers as well as n
- n is a natural number> 1 or> 2.
- Shaped electrode reflective and the first electrode is radiation-transparent to radiation generated during operation in the LED. A radiation extraction from the
- the metal layers are preferably made of silver or of a silver alloy.
- the metal layers each have a thickness of at least 1.0 nm or at least 1.5 nm or at least 2 nm.
- Metal layers in each case at most 10 nm or at most 7.5 nm or at most 5 nm.
- a thickness of the metal layers is preferably at most 0.5 or at most 0.25 of the so-called skin depth for a material of
- the metal layers are so thin that they are at least partially transparent to radiation.
- marginal non-metal layers are on the one hand that non-metal layer, which is located closest to the organic layer sequence, and further that of
- Non-metal layers closest to the carrier substrate each preferably have a thickness of at least 5 nm or at least 12.5 nm or at least 30 nm. Alternatively or additionally, the thickness of the marginal non-metal layers
- Non-metal layers not more than 70 nm or not more than 50 nm or not more than 25 nm. It is also possible that the said numerical values or a part of the said numerical values apply only to one of the marginal non-metal layers. Preferably, the closest to the carrier substrate
- Non-metal layer for example by at least a factor of 1.5, thicker than that of the organic layer sequence
- the non-marginal non-metal layers have a thickness of at least 50 nm or at least 70 nm or at least 100 nm. Alternatively or additionally, this thickness is at most 250 nm or at most 180 nm or at most 140 nm. It is possible here that all non-marginal
- Metal layers have the same thickness or different thicknesses.
- Non-metal layers have an optical thickness of (m ⁇ ) / 2, with a tolerance of at most 0.1 ⁇ or at most 0.05 ⁇ .
- m is a natural number> 1.
- ⁇ stands for the
- the first electrode it is possible for the first electrode to be similar to a Fabry-Perot device
- Electrode at least two or exactly two sub-layers.
- the partial layers are formed from different materials and / or from different material compositions.
- Partial layer which is closer to the organic layer sequence, a transparent conductive oxide and / or silver.
- the second sub-layer of the second electrode which is further away from the organic layer sequence, contains, alternatively or additionally, silver, a
- Silver alloy aluminum or an aluminum alloy.
- Partial layer has a thickness of at least 20 nm or of
- the Thickness of the first sub-layer is at most 60 nm or at most 50 nm.
- the first sub-layer preferably has a smaller thickness than the second sub-layer.
- a thickness of the second sub-layer is, for example, at least 40 nm or at least 70 nm and, for example, at most 200 nm or at most 150 nm.
- a metal selected from Ag, Al, Au, Ba, Ca, Cs, Cu, Ge, In, Li and Mg, and compounds,
- the second electrode or at least one sub-layer of the second electrode is formed from Ag, Al or alloys thereof, for example Ag: Mg, Ag: Ca, Ag: Ge, Mg: Al.
- Ag: Mg, Ag: Ca, Ag: Ge, Mg: Al is formed from Ag, Al or alloys thereof, for example Ag: Mg, Ag: Ca, Ag: Ge, Mg: Al.
- the second electrode may also be one of in
- TCO materials Having compound with the first electrode called TCO materials.
- the scattering layer has a matrix material and scattering centers embedded therein.
- a refractive index of the matrix material is preferably at least 1.65 or at least 1.8, or at least 1.85, or at least 1.9.
- the matrix material is, for example, an optically high-index glass or a polymer-based material.
- Polymeric materials include polycarbonate, PC for short,
- the scattering centers may be cavities in the
- the scattering centers by particles for example, from or with silicon dioxide, Titanium dioxide, zirconium dioxide, hafnium oxide, tantalum oxide or
- Alumina be formed.
- a mean diameter of the cavities or of the particles is, for example, between 0.15 ⁇ and 20 ⁇ , in particular between 0.3 ⁇ and 5 ⁇ .
- Scattering centers are preferably at least 0.1 or at least 0.2.
- the material of the scattering centers is, for example, a gas such as dried air or nitrogen or argon.
- the cavities may be evacuated. In this context, vacuum is also understood as a material.
- the scattering layer has an average geometric thickness of at least 2.5 ⁇ m or at least 1 ⁇ m. Alternatively or additionally, the average thickness of the litter layer is at most 50 ⁇ .
- the thickness of the litter layer is between the first and the second
- the organic layer sequence comprises at least two active layers, which in
- the various active layers may be used to generate radiation of the same wavelength or to generate
- the active layers are all active layers at an optical distance from the second electrode, which is an odd multiple of a quarter the peak wavelength of the radiation generated in the respective active layer is.
- the position of the respective active layer is preferably with a tolerance of at most 0.1 or at most 0.05 of the respective
- At least one or at least two of the active layers are at an optical distance of 3/4 ⁇ to the second electrode.
- organic light emitting diode at least one
- the carrier generation layer is preferably located between two adjacent active layers.
- the carrier generation layer is a distance between the adjacent active layers and a distance between the active layers and the second electrode adjustable.
- Carrier generation layer an n-type and a p-type layer. Between the n-type layer and the p-type layer is preferably a
- Intermediate layer has a thickness of at least 0.8 nm or at least 1.0 nm or at least 1.75 nm. Alternatively or additionally, the thickness of the intermediate layer is at most 4.5 nm or at most 3.5 nm. It is possible that the intermediate layer is formed from a radiopaque material, viewed macroscopically.
- the intermediate layer comprises or consists of a metal, a metal oxide and / or a metal halide.
- an optoelectronic semiconductor device described here will be explained in more detail with reference to the drawings based on embodiments. Same
- FIGS 1 to 3, 6 and 7 are schematic
- Figure 4 is a sectional view of a conventional
- FIG. 5 is a schematic illustration of in organic
- FIG. 1 illustrates an exemplary embodiment of an organic light-emitting diode 1.
- the light-emitting diode 1 comprises a carrier substrate 2. On the carrier substrate 2 is a
- Carrier substrate 2 follows the litter layer 3 a first
- Electrode 4 for example, an anode after.
- the first electrode 4 is followed by an organic layer sequence 5 with an active layer 55 provided for generating radiation.
- a second electrode 6 Optionally located between the litter layer 3 and the first electrode 4 and on the carrier substrate. 2
- Encapsulation layer 7 Through the encapsulation layer 7 is a protection of the organic layer sequence and the
- Electrodes 4, 6 can be achieved against environmental influences such as moisture and / or oxygen.
- environmental influences such as moisture and / or oxygen.
- Encapsulation layers 7 formed by an oxide or a nitride, which is in particular dielectric.
- a thickness of the encapsulant layers 7 is, for example, between 0.2 nm and 10 ym inclusive or between 1.5 nm and 1 ym inclusive or between 1.5 nm and 1.5 nm inclusive
- the encapsulation layer 7 is composed of several partial layers
- the litter layer 3 has a comparatively high
- the litter layer 3 has
- the second electrode 6 is reflective for in the
- organic layer sequence 5 generated radiation R designed.
- the radiation R is coupled out of the light-emitting diode 1 through the carrier substrate 2, through the scattering layer 3 and through the first electrode 4.
- the first electrode 4 has non-metal layers 41 and metal layers 42, separated in the figures by dashed lines.
- the layers 41, 42 follow each other alternately and directly.
- One of the non-metal layers 41 is located on either side of each of the metal layers 42. Peripheral layers of the first electrode 4 are thus formed by the non-metal layers 41.
- Non-metal layers 41 are preferably made of ITO.
- a preferred material for the metal layers 42 is silver.
- the metal layers 42 have, for example, a thickness of less than 5 nm, in particular approximately 3 nm. A thickness of the active layer 55 nearest
- Non-metal layer 41 is preferably between 5 nm and 20 nm inclusive.
- the middle one of non-metal layers 41 may have a thickness of between 100 nm and 140 nm
- non-metal layer 41 has a thickness between 40 nm and 60 nm inclusive.
- the second electrode 6 has a plurality of partial layers 61, 62.
- the second electrode 6 has exactly two partial layers 61, 62.
- the partial layer 61 closest to the organic layer sequence 5 is, for example, a silver layer or a silver-containing layer.
- the first sub-layer 61 has for example, a thickness between 30 nm and 50 nm inclusive.
- the second sub-layer 62 which is further removed from the organic layer sequence 5, is then formed, for example, from aluminum or an aluminum alloy and may have a thickness of approximately 100 nm.
- the second electrode 6 is formed only by a single layer.
- the second electrode 6 is preferably formed of silver or aluminum or alloys such as Ag: Mg, Ag: Ca, Ag: Ge or Mg: Al.
- the second electrode 6 can also have more than two partial layers, in particular three
- Partial layers exhibit.
- a metallic layer is preferably located between two layers of a transparent conductive oxide.
- the second electrode 6 is formed as a Bragg mirror having a sequence of many layers of alternately high and low refractive index.
- the first electrode 4 may also have material compositions and geometries, in particular as indicated in connection with the publication US 2010/0072884 AI, whose
- the first electrode 4 it is also possible, deviating from the illustration according to FIG. 1, for the first electrode 4 to have a number of non-metal layers 41 increased by two or more, relative to the number of metal layers 42. For example, two or three of the two are located between two adjacent metal layers 42 Non-metal layers 41, these being
- the first electrode 4 has only a total of three sub-layers, two non-metal layers 41 and one metal layer 42 which extends between the two non-metal layers 41
- a thickness of the metal layer 42 is then preferably increased.
- the thickness of the metal layer 41 is between, for example
- the non-metal layer 41 closest to the carrier substrate 2 is between 30 nm and 80 nm or between 40 nm and 50 nm inclusive.
- the non-metal layer 41 facing the organic layer sequence 5 has, for example, a thickness of between 10 nm and 40 nm or between and including 15 nm and 25 nm up.
- the two non-metal layers 41 are formed, in particular, from a TCO such as ITO.
- the metal layer 42 is preferably formed of silver. If materials other than silver and ITO are used, the layer thicknesses of the layers 41, 42 should be adapted accordingly.
- the organic layer sequence 5 is shown in more detail. The information given on individual layers of the organic layer sequence 5 can also be used for all others
- Embodiments are used.
- the electrodes 4, 6 according to FIG. 3 are shaped, in particular as in FIG.
- the organic layer sequence 5 has several active
- 55b, 55c may each be electron barrier layers 54e and / or hole barrier layers 54h. Between adjacent active layers 55a, 55b, 55c are respectively charge carrier generation layers 50a, 50b.
- Carrier-forming layers 50a, 50b may be formed as indicated in US 2008/0143249 A1 and / or US 2009/0146929 A1, the disclosure of which is incorporated by reference.
- the carrier generation layers 50a, 50b is a
- a distance between the active layers 55a, 55b, 55c depending on the reflective second electrode 6 is preferably at an odd multiple of a quarter of the peak wavelength of the radiation R generated in the respective active layer 55a, 55b, 55c.
- Electron injection layer 53e are located. At the first
- Electrode 4 is preferably a hole injection layer 53h attached. A thickness of the entire organic
- Layer sequence 5 is for example between 100 nm and 1 ⁇ or 200 nm and 700 nm.
- Layer sequence 5 can be doped.
- the individual layers preferably have a high radiation transmittance in the visible spectral range, ie in particular between 450 nm and 780 nm inclusive.
- these layers have an absorption coefficient of at most
- FIG. 4 shows a conventional organic light-emitting diode.
- the first electrode 4 is formed by a single layer.
- Loss channels occurring in light-emitting diodes are illustrated in connection with FIG.
- the relative power component L is compared with the distance D of the active layer 55 to
- the area 21 indicates the relative proportion of the active one
- the region 22 corresponds to the proportion of the radiation R, which is guided in the carrier substrate 2 by waveguiding.
- the area 23 indicates the relative
- the region 24 indicates the proportion of the radiation which is guided in the first electrode 4 and the organic layer sequence 5 by waveguiding effects.
- the region 25 finally identifies the radiation component which is due to the coupling of
- decoupled radiation component 21 shows a sine-like course with respect to the distance D to the second electrode 4. As the value of the distance D increases, the loss channel 25 caused by the plasmon coupling decreases.
- the fraction 25 of the plasmon loss channel for a value of D of greater than or equal to 150 nm is less than 10%.
- the active layer 55 is thus preferably in or near the maximum of the portion 21 at a distance D of approximately 210 nm
- indicated values refer to a refractive index of approximately 1.8. If the refractive index deviates from this, the stated values change accordingly.
- FIG. 6 shows a further exemplary embodiment of the invention
- planarization layer 8 Between the litter layer 3 and the first electrode 4, which is constructed, for example, as indicated in connection with FIGS. 1 to 3, there is a planarization layer 8. Other than illustrated, a plurality of planarization layers 8 may also be present.
- a planarization layer may also be located between the first
- Electrode 4 and the organic layer sequence 5 are located. Such planarization layers 8, as described in connection with FIG. 6, can also optionally be present in all other exemplary embodiments.
- both the first electrode 4 and the second electrode 6 are permeable to radiation R generated during operation of the light-emitting diode 1.
- the radiation R can be emitted at both main sides of the light-emitting diode 1.
- the second electrode 6 is preferably a multilayered one
- Electrode which may be constructed analogously to the first electrode 4.
- a further scattering layer 3b is optionally located on the side facing away from the carrier substrate 2 side of the second electrode 6 then a further scattering layer 3b.
- All other exemplary embodiments may also be embodied as LEDs emitting on both sides, with a corresponding modification of the second electrode 6 and possibly the encapsulation layer 7 and / or of further components of the light-emitting diode 1, which adjoin the carrier substrate 2
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DE102014107102A1 (de) * | 2014-05-20 | 2015-11-26 | Osram Opto Semiconductors Gmbh | Organisches lichtemittierendes Bauelement und Verfahren zum Herstellen eines organischen lichtemittierenden Bauelements |
KR20160116155A (ko) * | 2015-03-26 | 2016-10-07 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102377466B1 (ko) * | 2015-10-29 | 2022-03-21 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
DE102015119772A1 (de) * | 2015-11-16 | 2017-05-18 | Osram Oled Gmbh | Organische Leuchtdiode und Verfahren zur Herstellung einer organischen Leuchtdiode |
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US9761840B2 (en) | 2017-09-12 |
DE102012210494B4 (de) | 2023-12-28 |
DE102012210494A1 (de) | 2013-12-24 |
US20150144901A1 (en) | 2015-05-28 |
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