WO2013189023A1 - Heat sink assembly with openable frame clip - Google Patents

Heat sink assembly with openable frame clip Download PDF

Info

Publication number
WO2013189023A1
WO2013189023A1 PCT/CN2012/077141 CN2012077141W WO2013189023A1 WO 2013189023 A1 WO2013189023 A1 WO 2013189023A1 CN 2012077141 W CN2012077141 W CN 2012077141W WO 2013189023 A1 WO2013189023 A1 WO 2013189023A1
Authority
WO
WIPO (PCT)
Prior art keywords
retaining device
heat source
free ends
opening
frame
Prior art date
Application number
PCT/CN2012/077141
Other languages
French (fr)
Inventor
Rui Sheng Tan
John Sommer
Xing Wen MU
Original Assignee
Aavid Thermalloy, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy, Llc filed Critical Aavid Thermalloy, Llc
Priority to CN201280074109.9A priority Critical patent/CN104472028B/en
Priority to PCT/CN2012/077141 priority patent/WO2013189023A1/en
Publication of WO2013189023A1 publication Critical patent/WO2013189023A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • aspects of the invention relate to a heat sink assembly, e.g., for holding parts together used in transferring heat from an electronic component heat source, such as an integrated circuit or other electronic component, to a heat sink.
  • an electronic component heat source such as an integrated circuit or other electronic component
  • Heat sink assemblies are widely used to dissipate or otherwise transfer heat from an electronic component, such as an integrated circuit, computer processor, printed circuit board, or other electronic component. Proper cooling of electronic components, particularly computer-related components, can be important for a variety of well-known reasons, such as preventing damage to components due to overheating, maintaining suitably high processing speed or other circuit component operation, and so on.
  • U.S. Patent Application Publications 2010/0200206 and 2010/0018670 describe various embodiments of heat sink assemblies used to cool electronic components.
  • a first retaining device used to hold a heat sink (such as a finned metal block) and heat source (such as a computer processor) together may include a frame that defines an opening to receive at least a portion of the heat sink and/or the heat source.
  • the frame may form an interrupted loop around the opening so as to extend around a part of the heat sink and include first and second free ends at the ends of the interrupted loop that are movable relative to each other so as to adjust a size of the opening.
  • the free ends may be moved away from each other to enlarge the opening, allowing the frame to receive a portion of the heat source. Thereafter, the free ends may be moved toward each other, thereby decreasing the size of the opening and engaging the frame with the heat source.
  • the frame may clamp a portion of the heat source or otherwise engage the heat source portion at the opening to restrain movement of the frame relative to the heat source.
  • movement of the free ends may be performed by hand, and without the use of tools, thus allowing for tool free engagement and/or disengagement of the retaining device with the heat source.
  • movement of the free ends may be restrained by engaging a second part of the retaining device (e.g., a second retaining device) with the first retaining device.
  • a hook or other engagement feature of the second retaining device may engage with the free ends to hold the free ends stationary relative to each other, thereby keeping the first retaining device engaged with the heat source and/or heat sink.
  • the second retaining device may also, or alternately, engage with the first retaining device and the heat sink to resiliently bias the heat sink into contact with the heat source, e.g., by applying a spring force to the heat sink to maintain thermal and physical contact between the heat sink and heat source.
  • an assembly for engaging a heat sink with an electrical component heat source includes a first retaining device arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions.
  • the first retaining device may include a frame defining an opening to receive the heat source such that portions of the frame at least partially surround a part of the heat source.
  • the frame may be arranged to define an interrupted loop around the opening with first and second free ends that are movable relative to each other such that movement of the free ends causes a change in size of the opening, allowing the frame to engage or disengage the heat source at the opening.
  • a second retaining device may be arranged to engage with the first retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening, and/or may be arranged to engage with the first retaining deviceand contact a heat sink to bias or urge the heat sink toward a heat source engaged by the first retaining device.
  • the second retaining device may be arranged to engage with the first retaining device to resist movement of a heat source engaged by the first retaining device and a heat sink in contact with the heat source relative to each other in a z direction.
  • one or more parts of the second retaining device may engage with the first retaining device and a central part of the second retaining device may contact a heat sink and resiliently bias the heat sink toward a heat source engaged by the first retaining device.
  • the second retaining device may include first and second engagement features at opposite ends of the second retaining device, where the first engagement feature is arranged to engage with the free ends of the first retaining device, and the second engagement feature is arranged to engage with a portion of the first retaining device on a side of the frame opposite the free ends, e.g., so that a central part of the second retaining device spans across a heat sink.
  • the engagement features may include, for example, a hook arranged to loop around portions of the first and second free ends (to resist movement of the free ends away from each other or otherwise resist movement that would enlarge and/or otherwise adjust a size of the opening) and/or to engage with other portions of the first retaining device.
  • the free ends each include a protrusion that may be engaged by the second retaining device, such as a hook or other engagement feature, to prevent movement of the free ends relative to each other to enlarge a size of the opening.
  • a gap may be present between the first and second free ends with the second retaining device engaged with the first retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening, or the free ends may be in contact or in other relative positions.
  • the frame includes a first frame portion with the first free end, a second frame portion with the second free end, and a hinge connecting the first and second frame portions together.
  • the hinge may allow movement of the first and second frame portions relative to each other and allow movement of the first and second free ends toward and away from each other, e.g., to adjust a size of the opening. Adjustment of the a size of the opening may allow the first retaining device to clamp or otherwise engage with a portion of a heat source in the opening by movement of the free ends relative to each other.
  • the frame may include four sidewalls that define the opening, and the opening may have a rectangular shape, e.g., to receive a rectangular shaped portion of a heat source.
  • the frame may include one or more holding features to engage with a heat source received in the opening, such as one or more tabs arranged to engage with a heat source in a space between a ball grid array substrate and a circuit board that is joined to the ball grid array substrate by an array of solder balls.
  • the first retaining device may be arranged to engage a heat sink with a variety of different heat source configurations, such as those that include a ball grid array, a computer processing chip and/or a printed circuit board.
  • the heat sink may be arranged to transfer heat away from a heat source and to engage with the second retaining device to be resiliently biased toward the heat source by the second retaining device.
  • the first retaining device may be arranged to allow enlargement of the size of the opening by moving the free ends relative to each other without plastic or elastic deformation of any portion of the first retaining device.
  • This may the first and second retaining devices to be both assembled with an electrical component heat source and heat sink to hold the heat source and heat sink together in thermal contact, and to be disassembled from the heat source and heat sink without the use of a mounting tool to deform the first retaining device.
  • a method for assembling a heat sink and an electrical component heat source includes providing a first retaining device including a frame defining an opening and arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions, enlarging the opening defined by the frame to receive a portion of a heat source without elastically deforming any portion of the frame, andreducing a size of the opening to engage the first retaining device with a portion of the heat source in the opening.
  • a method for assembling a heat sink and an electrical component heat source includes providing a first retaining device including a frame defining an opening and arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions, moving first and second free ends at a sidewall of the frame relative to each other to enlarge the opening defined by the frame to receive a portion of a heat source, and moving the first and second free ends of the frame relative to each other to reduce a size of the opening and to engage the first retaining device with a portion of the heat source in the opening.
  • the methods may include engaging a second retaining device with the first retaining device to prevent enlargement of the opening, and thus in some arrangements disengagement of the first retaining device from the heat source.
  • the opening may be enlarged by moving free ends of the frame relative to each other to enlarge the opening, and may be reduced by moving the free ends relative to each other to reduce the size of the opening.
  • enlarging of the opening may include moving a first portion of the frame relative to a second portion of the frame by employing a hinge that connects the first and second frame portions together.
  • the method may also include placing a heat sink in thermal contact with the heat source, and engaging a second retaining device with the first retaining device to both prevent movement of the first and second frame portions to enlarge the opening and to bias the heat sink into contact with the heat source.
  • the first and second retaining devices may cooperate to resist movement of the heat source and heat sink relative to each other in a z direction.
  • engaging of a first retaining device with a heat source and/or engaging a second retaining device with the first retaining device to prevent movement of the first and second free ends to enlarge the opening may be done by hand and without the use of tools.
  • FIG. 1 shows an exploded view of an embodiment of a heat sink assembly in accordance with aspects of the invention
  • FIG. 2 is a cross-sectional view of the FIG. 1 embodiment in an assembled condition
  • FIG. 3 is a top view of a first retaining device of the FIG. 1 embodiment
  • FIG. 4 shows an exploded view of an embodiment of a heat sink assembly having an alternate second retaining device configuration
  • FIG. 5 shows an exploded view of an embodiment of a heat sink assemblyhaving yet another second retaining device configuration
  • FIG. 6 shows a perspective view of a first retaining device having a hinge that connects first and second frame portions
  • FIG. 7 shows a top view of the FIG. 6 embodiment with the first retaining device in an open position
  • FIG. 8 shows atop view of the FIG. 6 embodiment with the first retaining device in a closed position
  • FIG. 9 shows a perspective view of another embodiment of a first retaining device having a hinge that connects first and second frame portions;
  • FIG. 10 shows a top view of the FIG. 9 embodiment with the first retaining device in an open position
  • FIG. 1 1 shows atop view of the FIG. 9 embodiment with the first retaining device in a closed position
  • FIG. 12 shows a perspective view of a first retaining device having a living hinge that connects first and second frame portions
  • FIG. 13 shows a perspective view of the FIG. 12 embodiment in an open position
  • FIG. 14 shows a perspective view of another embodiment of a first retaining device having a living hinge that allows first and second frame portions to pivot about two axes;
  • FIG. 15 shows a perspective view of the FIG. 14 embodiment with the first retaining device in a folded condition
  • FIG. 16 shows a top view of the FIG. 14 embodiment with the first retaining device in an open position
  • FIG. 17 shows atop view of the FIG. 14 embodiment with the first retaining device in a closed position
  • FIG. 18 shows an exploded view of an embodiment of a heat sink assembly having a first retaining device in which two pairs of free ends are movable relative to each other.
  • an embodiment of the invention includes a first retaining device with a frame arranged to engage with a portion of a heat source, such as an integrated circuit, computer processor, ball grid array substrate, a printed circuit board, or other component, such that portions of the frame at least partially surround a part of the heat source.
  • a heat source such as an integrated circuit, computer processor, ball grid array substrate, a printed circuit board, or other component
  • the frame may define an interrupted loop with first and second free ends at ends of the interrupted loop that can be moved to enlarge an opening defined by the frame, e.g., so that the heat source can be received into the opening without the use of special tools and/or without elastically or plastically deforming the frame.
  • the part of the frame defining an interrupted loop and the free ends may lie in a plane, e.g., a plane at which the frame is arranged to engage with a heat source.
  • the free ends may be moved relative to each other, e.g., toward each other, so that the opening may be reduced in size, allowing the frame to restrict its movement relative to the heat source in x and y directions (which may be in a plane of the frame).
  • the frame may also engage the heat source to restrict its movement in the z direction, e.g., so that the frame cannot move beyond a certain point in an upwarddirection relative to the heat source (which may be perpendicular to a plane of the frame).
  • a second retaining device such as a spring clip, may engage with the first retaining device so as to prevent movement of the free ends relative to each other in at least one direction.
  • the second retaining device may capture portions of the free ends, such as by looping part of a hook around the free ends, to effectively lock the free ends in place and prevent disengagement of the heat source from the first retaining device.
  • the second retaining device may alternately, or additionally, engage with the first retaining deviceand contact a heat sink to bias the heat sink toward a heat source engaged by the first retaining device.
  • the second retaining device may apply a resilient bias on the heat sink in a downward direction toward the heat source.
  • the resilient bias on the heat sink may bias the heat source and heat sink together.
  • the second retaining device it is possible for the second retaining device to function to both prevent enlargement of the frame opening and bias a heat sink and heat source together, e.g., to maintain proper thermal contact between the two components.
  • FIG. 1 shows an illustrative embodiment of a heat sink assembly 10 that includes a heat source 4, a heat sink 3, and first and second retaining devices 1, 2 that hold the heat source 4 and heat sink 2 in thermal contact with each other.
  • the heat source 4 may include any suitable component or components, in this illustrative embodiment the heat source 4 includes a printed circuit board (PCB) 41, a ball grid array support 43 and an integrated circuit 42.
  • PCB printed circuit board
  • Other components may be additionally or alternately included, such as a thermal interface material, such as a thermally conductive grease or oil to help with thermal transfer between the heat source 4 and the heat sink 3.
  • a heat source 4 that interacts with the first and second retaining devices 1, 2 need not necessarily be capable of itself generating heat, but instead may function to transfer heat from a heat generating component or other heat source to a heat sink.
  • the heat source 4 may include a heat pipe that is in thermal contact with an integrated circuit which generates heat, and transfers that heat to the heat pipe. The heat pipe may, in turn, transfer heat to the heat sink 3.
  • the heat sink 3 in this illustrative embodiment includes a contact plate 32 and a plurality of fins 31 that extend upwardly from the contact plate 32.
  • a lower surface of the contact plate 32 is arranged to make thermal contact with, or otherwise thermally communicate with an upper surface of the integrated circuit 42 so as to receive heat from the integrated circuit 42 and dissipate the heat via the fins 31.
  • the heat sink 3 may include any suitable additional or alternate components, such as one or more heat pipes, a thermoelectric cooling device, a phase-change based or other thermal transfer medium, a liquid- based heat exchanger, and so on.
  • the heat sink 3 may include any suitable component to receive and transfer heat away from a heat source 4.
  • the heat sink 3 in this embodiment may be formed in any suitable way, such as by casting, extruding, machining, forging, welding, or otherwise assembling portions made of any suitable material, such as conductive metals
  • the first retaining device 1 in this illustrative embodiment includes a frame clip with four sidewalls 15 that define an opening 18 arranged to receive a portion of the heat source 4.
  • the integrated circuit 42 and ball grid array substrate 43 may be received into the opening 18, and the sidewalls 15 may engage with edges of the ball grid array substrate 43 (e.g., by clamping, by engaging one or more tabs, grooves, hooks, teeth, wedges, barbs, or other holding features 14 with the substrate 43, etc.) to resist movement of the first retaining device 1 relative to the heat source 4 in x and y directions. (As can be seen in FIG.
  • the x and y directions may be directions in a plane of the first retaining device 1 and/or the opening 18.)
  • the first retaining device 1 is made incapable of any movement in x and/or y directions relative to the heat source 4, but rather the first retaining device 1 may be restrained in movement so as to prevent disengagement of the first retaining device 1 from the heat source 4 (absent forces that would deform or damage the heat source 4 and/or first retaining device 1).
  • the first retaining device 1 may be somewhat moveable in x and/or y directions relative to the heat source 4, but when suitably engaged with the heat source 4, may not be movable so as to disengage from the heat source 4.
  • the frame of the first retaining device 1 defines an interruptedloop with first and second free ends 11 , 12 that are moveable relative to each other so that the size of the opening 18 may be adjusted.
  • the part of the frame defining the interrupted loop and the free ends may lie in a plane of the opening 18, such as an x-y plane in which the first retaining device 1 is arranged to engage with the heat source 4.
  • the free ends 11 , 12 may be adjacent each other at a split or gap 16 in the loop at a sidewall of the first retaining device 1.
  • the free ends 11 , 12 may be moved away from each other so as to enlarge the size of the opening 18.
  • Such enlargement of the opening 18 may be done by moving the free ends 11, 12 by hand and without the use of specialized tools, and may allow the substrate 43 to be received into the opening 18 so that the tabs 14 are positioned below the substrate 43 (i.e., between the substrate 43 and the PCB 41).
  • FIG. 1 For example, FIG. 1
  • the ball grid array substrate 43 is joined to the PCB 41 by an array of solder balls 44 such that a space exists between the substrate 43 and the PCB 41.
  • the height of this space may vary, but is generally between about 0.25mm and 1mm.
  • the tabs and/or the frame be elastically and/or plastically deformed so as to allow the substrate 43 or other component to enter the frame opening so that the tabs are positioned below the substrate.
  • Such deformation required the use of specialized tools and could not be done by hand.
  • the opening 18 of the first retaining device 1 may be enlarged and/or a distance between the tabs or other holding features 14 increased by moving the free ends 11, 12 relative to each other by hand and without the use of tools.
  • other embodiments may require the use of a tool to move the free ends 11, 12 relative to each other to enlarge and/or reduce the size of the opening 18.
  • the first retaining device 1 is not limited to engaging with a heat source 4 in the specific way shown in FIGs. 1 and 2.
  • the heat source 4 may include fins or tabs that are received into grooves of the first retaining device 1 , the first retaining device 1 may engage the heat source 4 using only friction or an interference fit, and others.
  • FIG. 3 shows a top view of the first retaining device 1 of FIGs. 1 and 2, and illustrates how the free ends 11, 12 may be moved relative to each other to enlarge the size of the opening 18.
  • the free ends 11, 12 may be moved away from each other so as to enlarge a gap 16 between the free ends to enlarge the opening 18.
  • This may allow the first retaining device 1 to receive a portion of a heat source 4, such as the substrate 43 shown in FIGs. 1 and 2.
  • the first retaining device 1 is made with a construction and/or of a material that allows the first retaining device 1 to elastically and/or plastically deform with movement of the free ends 11, 12 relative to each other so that the opening 18 can be enlarged.
  • the first retaining device 1 may be made of a somewhat flexible material, or to have a portion that is somewhat flexible, to allow for the desired movement and opening size change. Flexing may be restricted to particular regions of the first retaining device 1 , such as at the comers of the frame, within one or more sidewalls 15, etc., or may not be restricted.
  • the free ends 11 , 12 may be moved towards each other to reduce the size of the opening 18 and engage the first retaining device 1 with the heat source 4.
  • movement of the free ends 11 , 12 may cause the first retaining device 1 to clamp the heat source 4 portion in the opening, although such clamping action is not required.
  • the heat source 4 portion may be suitably captured in the opening 18, e.g., so that movement of the first retaining device 1 relative to the heat source 4 in the x and y directions is suitably restricted.
  • the first retaining device 1 may be made of any suitable material, such as plastics, metals, composites and/or combinations of materials, and in any suitable way, such as by machining, molding, casting, forging, sintering, stereo lithography, 3D printing, etc.
  • a second retaining device 2 which may serve to engage with the first retaining device 1 to resist movement of the free ends 11 , 12 and prevent enlargement of the opening 18 to a degree that would cause disengagement of the first retaining device 1 and the heat source 4.
  • the second retaining device 2 includes an engagement feature 21 (e.g., a hook) that is configured to engage with the free ends 11, 12 so as to keep the free ends 11, 12 within a desired distance of each other. That is, in this embodiment, the engagement feature 21 at the left end of the second retaining device 2 (as viewed in FIG.
  • the second retaining device 2 may engage with the first retaining device 1 and the heat sink 3 so as to bias the heat sink 3 and the heat source 4 together.
  • a heat sink contacting portion 22 of the second retaining device 2 may contact a part of the heat sink 3 (see FIG. 2) so as to press downwardly on the heat sink 3.
  • the second retaining device 2 has an M-shape and may be made of a spring steel wire of round or other suitable cross sectional shape or other suitable material.
  • the M-shape of the second retaining device 2 may be sized so that, with the heat sink contacting portion 22 in contact with the heat sink 3, the device must be flexed to engage the engagement features 21 with the first retaining device 1 (e.g., with the engagement features 21 engaged with protrusions 13 at the free ends 11 , 12 on one side and with holes or slots on a sidewall 15 opposite the free ends 11, 12).
  • the heat sink contacting portion 22 will press downwardly on the heat sink 3 with a spring bias force that urges the heat sink 3 toward the heat source 4.
  • the first and second retaining devices 1 , 2 may cooperate to resiliently urge the heat sink 3 and heat source 4 together. This will help maintain suitable thermal contact or other communication between the heat sink 3 and heat source 4, e.g., a bottom surface of the contact plate 32 may be pressed against a top surface of the integrated circuit 42 so that heat can be suitably transferred between the two.
  • FIG. 4 shows an exploded view of another illustrative embodiment of a heat sink assembly 10. This embodiment is similar to that in FIG. 1, with one difference being that the second retaining device 2 is formed from a stamped, flat spring element (such as a die-cut steel) instead of from a bent wire element. Otherwise, operation of the second retaining device 2 is similar to that in FIG.
  • the engagement features 21a, 21b at opposite ends of the second retaining device 2 engage with protrusions 13 of the first retaining device 1.
  • the engagement feature 21a is arranged so that a hook (the U-shaped distal portion) captures the protrusions 13 on the free ends 11, 12 to restrain their movement away from each other.
  • the engagement feature 21b at the opposite end has a U-shaped hook like that of the engagement features 21a, rather than a pair of hooks formed by bent ends of wire in FIG. 1.
  • This arrangement of FIG. 4 may allow either engagement feature 21a or 21b to be used to engage with the free ends 11, 12, whereas the FIG. 1 embodiment may require that only one end of the device 2 can be used to engage the free ends 11, 12.
  • FIG. 5 shows another illustrative embodiment of a heat sink assembly.
  • This embodiment is again similar to that in FIG. 1 , with one difference being that the second retaining device 2 has a different shape.
  • the center part of the second retaining device 2 has an M-shape
  • the engagement features 21 are arranged as oppositely oriented open hook structures.
  • the engagement feature 21a at one end is arranged to engage with protrusions 13 of the free ends 11, 12 to restrain movement of the free ends 11, 12. Note that the location of the free ends 11, 12 and protrusions 13 are offset to cooperate with the engagement features 21 of the second retaining device 2.
  • FIG. 6 shows an embodiment in which the frame includes a hinge 17.
  • the hinge 17 includes a pin portion 17a and a knuckle portion 17b that are respectively formed on first and second frame portions la, lb.
  • the hinge portions 17a, 17b may be made in any suitable way, such as by machining, molding, attaching hinge elements to respective frame portions la, lb, etc. As can be seen in the top views of FIGs.
  • the hinge portions 17a and 17b may be engaged with each other (e.g., by inserting the pin portion 17a into a hole in the knuckle portion 17b) to allow the free ends 11, 12 to be moved relative to each other between an open position in FIG. 7 and a closed position in FIG. 8.
  • the first retaining device 1 of FIGs. 6-8 may be used with a second retaining device 2 like that in FIG. 5, for example, although other arrangements are possible.
  • Providing the hinge 17 at a sidewall 15 that is opposite the free ends 11, 12 may allow the first retaining device 1 to adopt a larger size opening 18 than providing the hinge 17 in other locations, but other such locations are possible.
  • a hinge 17 could be provided on the same sidewall 15 where the free ends 11, 12 are located, or at any other location.
  • two or more hinges 17 could be provided.
  • FIG. 9 shows an illustrative embodiment where a hinge 17 is provided relatively close to a corner of a frame having a rectangular shaped opening 18.
  • a hinge 17 may change the way in which the opening size and/or shape is changed, and the way in which a first retaining device 1 engages with a heat source 4.
  • a hinge 17 located near a center of a sidewall 15 as in FIGs. 6-8 may allow sidewalls 15a, 15b extending from the free end side to the hinge side of the opening 18 (top and bottom sidewalls as seen in FIGs. 7 and 8) to more positively clamp a heat source 4 than the other sidewalls 15.
  • a hinge 17 location like that in FIGs. 9-11 may allow the sidewalls 15 to more evenly apply a clamping force to the heat source 4.
  • FIGs. 12 and 13 show another illustrative embodiment of a first retaining device 1 having a hinge 17.
  • the hinge 17 is arranged as a "live" or “living” hinge. That is, the hinge 17 includes an element that is attached to both frame portions la and lb, and has a portion that flexes to allow the frame portions la, lb to be moved between the open position of FIG. 13 and the closed position of FIG. 12.
  • Such an arrangement may make assembly of the first retaining device 1 easier, e.g., the living hinge element may be co-molded with other parts of the first retaining device 1, or the living hinge element may be more simply made, e.g., molded or machined as a relatively thin and flexible part that interconnects the frame portions la, lb.
  • a second retaining device 2 engagement feature 21 may be used to stabilize the hinge 17, e.g., by having the engagement feature 21 capture protrusions 13 at the hinge 17 to hold the hinge portions together. Such an arrangement is shown in FIGs.
  • FIG. 8 shows a second retaining device 2 having a configuration like that shown in FIG. 5, and has the engagement feature 21b arranged to secure the protrusions 13 at the hinge 17.
  • FIG. 14 shows a second retaining device 2 having a configuration like that shown in FIG. 4and has the engagement feature 21b arranged to secure the protrusions 13 at the hinge 17.
  • FIGs. 14-17 show another illustrative embodiment of a first retaining device 1 that includes a hinge 17 in the form of a live or living hinge.
  • the hinge 17 allows for pivoting of the frame portions la, lb about a horizontal axis (e.g., an x or y axis) so that the frame portions la, lb can be moved between the positions shown in FIGs. 14 and 15, as well as pivoting of the frame portions la, lb about a vertical axis (e.g., the z axis) so that the frame portions la, lb can be moved between open and closed positions as shown in FIGs. 16 and 17, respectively.
  • a horizontal axis e.g., an x or y axis
  • a vertical axis e.g., the z axis
  • pivoting of the frame portions la, lb about a vertical axis may be more restricted than about a horizontal axis, e.g., because the portions la, lb may not need to move large amounts to receive a heat source 4 in the opening 18.
  • FIG. 18 shows yet another embodiment of a heat sink assembly 10.
  • the first retaining device 1 includes two frame portions la, lb.
  • a first frame portion la includes first free ends 11a, 1 lb at opposite ends of the frame portion la, and a second frame portion lb includes second free ends 12a, 12b at opposite ends of the frame portion lb.
  • the frame portions la, lb are independent of each other and are not necessarily attached to each other prior to assembly with the second retaining device 2.
  • the free ends 11, 12 are moveable relative to each other to adjust a size of an opening 18 defined by the frame portions la, lb, e.g., to enlarge a size of the opening 18 to engage with a portion of the heat source 4.
  • a heat sink 3 may be positioned so that a part of the contact plate 32 is received in the opening 18 and is put in contact with the integrated circuit 42 or other heat source portion. Thereafter, the second retaining portion 2 may be engaged with the heat sink 3 and the first retaining device 1. Specifically, with respect to this embodiment, a first engagement feature 21a of the second retaining portion 2 may be positioned under a protrusion 13a and under protrusions 13 on the first and second free ends 1 la, 12a. A heat sink contacting portion 22 may be positioned between fins 31 and in contact with an upper surface of the contact plate 32, e.g., to apply a downward force on the heat sink 3.
  • a second engagement feature 21b may then be positioned under a protrusion 13b and under protrusions 13 of the first and second free ends l ib, 12b.
  • the second retaining device 2 may resist movement of the first and second free ends 11a, 12a and l ib, 12b away from each other, thereby maintaining engagement of the first retaining device 1 with the heat source 4.
  • other arrangements are possible.
  • a single U-shaped clip may be engaged with the protrusions 13 for the first and second free ends 11a, 12a, and another U-shaped clip may be engaged with the protrusions 13 for the first and second free ends l ib, 12b rather than have a single piece second retaining device 2 engage with both pairs of free ends 11, 12.
  • another element e.g., having a configuration like that in FIG. 4, may engage with the protrusions 13a, 13b to urge the heat sink 3 into contact with the heat source 4.
  • the second retaining device 2 like the first retaining device 1 , may include two or more separable parts, as desired.
  • the free ends may each include a hole or slot, and the holes or slots may be aligned with each other when the first retaining device is properly engaged with a heat source and/or heat sink. Thereafter, a pin or other element (which may be part of a second retaining device 2) may be inserted into the aligned holes or slots to prevent movement of the free ends relative to each other.
  • one free end may include a pin, and the other free end may include a hole.
  • the pin and hole When adjusting the size of the opening of the frame, the pin and hole may be disengaged to allow movement of the free ends. However, when the first retaining element is engaged with the heat source and/or heat sink, the pin of one free end may be inserted into the hole of the other free end, thereby locking the two free ends together.
  • the free ends may be joined together by a bolt or screw, which may be operated to not only restrain movement of the free ends relative to each other, but also adjust their relative position as well. Other arrangements will occur to those of skill in the art.
  • the opening 18 has a generally rectangular shape
  • other shapes are possible, such as circular, oval, triangular or other closed loop shapes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An assembly for engaging a heat sink with an electrical component heat source includes a first retaining device with a frame that defines an opening to receive at least a portion of the heat sink and/or the heat source. The frame may form an interrupted loop around the opening with first and second free ends that are movable to adjust a size of the opening. Movement of the free ends may be performed by hand, and without the use of tools, allowing for tool free engagement/disengagement with the heat source. The free ends or other portion of the first retaining device may be engaged by a second retaining device to keep the first retaining device engaged with the heat source and/or heat sink. The second retaining device may also, or alternately, engage with the first retaining device to resiliently bias the heat sink into contact with the heat source.

Description

HEAT SINK ASSEMBLY WITH OPENABLE FRAME CLIP BACKGROUND
1. Field of Invention
Aspects of the invention relate to a heat sink assembly, e.g., for holding parts together used in transferring heat from an electronic component heat source, such as an integrated circuit or other electronic component, to a heat sink.
2. Related Art
Heat sink assemblies are widely used to dissipate or otherwise transfer heat from an electronic component, such as an integrated circuit, computer processor, printed circuit board, or other electronic component. Proper cooling of electronic components, particularly computer- related components, can be important for a variety of well-known reasons, such as preventing damage to components due to overheating, maintaining suitably high processing speed or other circuit component operation, and so on. U.S. Patent Application Publications 2010/0200206 and 2010/0018670 describe various embodiments of heat sink assemblies used to cool electronic components.
SUMMARY OF INVENTION
In some aspects of the invention, a first retaining device used to hold a heat sink (such as a finned metal block) and heat source (such as a computer processor) together may include a frame that defines an opening to receive at least a portion of the heat sink and/or the heat source. The frame may form an interrupted loop around the opening so as to extend around a part of the heat sink and include first and second free ends at the ends of the interrupted loop that are movable relative to each other so as to adjust a size of the opening. For example, the free ends may be moved away from each other to enlarge the opening, allowing the frame to receive a portion of the heat source. Thereafter, the free ends may be moved toward each other, thereby decreasing the size of the opening and engaging the frame with the heat source. For example, the frame may clamp a portion of the heat source or otherwise engage the heat source portion at the opening to restrain movement of the frame relative to the heat source.
In some embodiments, movement of the free ends may be performed by hand, and without the use of tools, thus allowing for tool free engagement and/or disengagement of the retaining device with the heat source. With the retaining device engaged with the heat source, movement of the free ends may be restrained by engaging a second part of the retaining device (e.g., a second retaining device) with the first retaining device. For example, a hook or other engagement feature of the second retaining device may engage with the free ends to hold the free ends stationary relative to each other, thereby keeping the first retaining device engaged with the heat source and/or heat sink. The second retaining device may also, or alternately, engage with the first retaining device and the heat sink to resiliently bias the heat sink into contact with the heat source, e.g., by applying a spring force to the heat sink to maintain thermal and physical contact between the heat sink and heat source.
In one aspect of the invention, an assembly for engaging a heat sink with an electrical component heat source includes a first retaining device arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions. The first retaining device may include a frame defining an opening to receive the heat source such that portions of the frame at least partially surround a part of the heat source. For example, the frame may be arranged to define an interrupted loop around the opening with first and second free ends that are movable relative to each other such that movement of the free ends causes a change in size of the opening, allowing the frame to engage or disengage the heat source at the opening. A second retaining device may be arranged to engage with the first retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening, and/or may be arranged to engage with the first retaining deviceand contact a heat sink to bias or urge the heat sink toward a heat source engaged by the first retaining device. Thus, the second retaining device may be arranged to engage with the first retaining device to resist movement of a heat source engaged by the first retaining device and a heat sink in contact with the heat source relative to each other in a z direction.
In one embodiment, one or more parts of the second retaining device may engage with the first retaining device and a central part of the second retaining device may contact a heat sink and resiliently bias the heat sink toward a heat source engaged by the first retaining device. For example, the second retaining device may include first and second engagement features at opposite ends of the second retaining device, where the first engagement feature is arranged to engage with the free ends of the first retaining device, and the second engagement feature is arranged to engage with a portion of the first retaining device on a side of the frame opposite the free ends, e.g., so that a central part of the second retaining device spans across a heat sink. The engagement features may include, for example, a hook arranged to loop around portions of the first and second free ends (to resist movement of the free ends away from each other or otherwise resist movement that would enlarge and/or otherwise adjust a size of the opening) and/or to engage with other portions of the first retaining device. In some embodiments, the free ends each include a protrusion that may be engaged by the second retaining device, such as a hook or other engagement feature, to prevent movement of the free ends relative to each other to enlarge a size of the opening. A gap may be present between the first and second free ends with the second retaining device engaged with the first retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening, or the free ends may be in contact or in other relative positions.
In one embodiment, the frame includes a first frame portion with the first free end, a second frame portion with the second free end, and a hinge connecting the first and second frame portions together. The hinge may allow movement of the first and second frame portions relative to each other and allow movement of the first and second free ends toward and away from each other, e.g., to adjust a size of the opening. Adjustment of the a size of the opening may allow the first retaining device to clamp or otherwise engage with a portion of a heat source in the opening by movement of the free ends relative to each other. For example, the frame may include four sidewalls that define the opening, and the opening may have a rectangular shape, e.g., to receive a rectangular shaped portion of a heat source. The frame may include one or more holding features to engage with a heat source received in the opening, such as one or more tabs arranged to engage with a heat source in a space between a ball grid array substrate and a circuit board that is joined to the ball grid array substrate by an array of solder balls.
The first retaining device may be arranged to engage a heat sink with a variety of different heat source configurations, such as those that include a ball grid array, a computer processing chip and/or a printed circuit board. Thus, the heat sink may be arranged to transfer heat away from a heat source and to engage with the second retaining device to be resiliently biased toward the heat source by the second retaining device.
In some embodiments, the first retaining device may be arranged to allow enlargement of the size of the opening by moving the free ends relative to each other without plastic or elastic deformation of any portion of the first retaining device. This may the first and second retaining devices to be both assembled with an electrical component heat source and heat sink to hold the heat source and heat sink together in thermal contact, and to be disassembled from the heat source and heat sink without the use of a mounting tool to deform the first retaining device.
In another aspect of the invention, a method for assembling a heat sink and an electrical component heat source includes providing a first retaining device including a frame defining an opening and arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions, enlarging the opening defined by the frame to receive a portion of a heat source without elastically deforming any portion of the frame, andreducing a size of the opening to engage the first retaining device with a portion of the heat source in the opening.
In another aspect of the invention, a method for assembling a heat sink and an electrical component heat source includes providing a first retaining device including a frame defining an opening and arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions, moving first and second free ends at a sidewall of the frame relative to each other to enlarge the opening defined by the frame to receive a portion of a heat source, and moving the first and second free ends of the frame relative to each other to reduce a size of the opening and to engage the first retaining device with a portion of the heat source in the opening.
In some arrangements, the methods may include engaging a second retaining device with the first retaining device to prevent enlargement of the opening, and thus in some arrangements disengagement of the first retaining device from the heat source. The opening may be enlarged by moving free ends of the frame relative to each other to enlarge the opening, and may be reduced by moving the free ends relative to each other to reduce the size of the opening.
Alternately, enlarging of the opening may include moving a first portion of the frame relative to a second portion of the frame by employing a hinge that connects the first and second frame portions together. The method may also include placing a heat sink in thermal contact with the heat source, and engaging a second retaining device with the first retaining device to both prevent movement of the first and second frame portions to enlarge the opening and to bias the heat sink into contact with the heat source. Accordingly, the first and second retaining devices may cooperate to resist movement of the heat source and heat sink relative to each other in a z direction. In some embodiments, engaging of a first retaining device with a heat source and/or engaging a second retaining device with the first retaining device to prevent movement of the first and second free ends to enlarge the opening may be done by hand and without the use of tools.
These and other aspects of the invention will be apparent from the following description and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
Aspects of the invention are described below with reference to the following drawings in which like numerals reference like elements, and wherein:
FIG. 1 shows an exploded view of an embodiment of a heat sink assembly in accordance with aspects of the invention;
FIG. 2 is a cross-sectional view of the FIG. 1 embodiment in an assembled condition;
FIG. 3 is a top view of a first retaining device of the FIG. 1 embodiment;
FIG. 4 shows an exploded view of an embodiment of a heat sink assembly having an alternate second retaining device configuration;
FIG. 5 shows an exploded view of an embodiment of a heat sink assemblyhaving yet another second retaining device configuration;
FIG. 6 shows a perspective view of a first retaining device having a hinge that connects first and second frame portions;
FIG. 7 shows a top view of the FIG. 6 embodiment with the first retaining device in an open position;
FIG. 8 shows atop view of the FIG. 6 embodiment with the first retaining device in a closed position;
FIG. 9 shows a perspective view of another embodiment of a first retaining device having a hinge that connects first and second frame portions;
FIG. 10 shows a top view of the FIG. 9 embodiment with the first retaining device in an open position;
FIG. 1 1 shows atop view of the FIG. 9 embodiment with the first retaining device in a closed position;
FIG. 12 shows a perspective view of a first retaining device having a living hinge that connects first and second frame portions;
FIG. 13 shows a perspective view of the FIG. 12 embodiment in an open position; FIG. 14 shows a perspective view of another embodiment of a first retaining device having a living hinge that allows first and second frame portions to pivot about two axes;
FIG. 15 shows a perspective view of the FIG. 14 embodiment with the first retaining device in a folded condition;
FIG. 16 shows a top view of the FIG. 14 embodiment with the first retaining device in an open position;
FIG. 17 shows atop view of the FIG. 14 embodiment with the first retaining device in a closed position; and
FIG. 18 shows an exploded view of an embodiment of a heat sink assembly having a first retaining device in which two pairs of free ends are movable relative to each other.
DETAILED DESCRIPTION
It should be understood that aspects of the invention are described herein with reference to certain illustrative embodiments and the figures. The illustrative embodiments described herein are not necessarily intended to show all aspects of the invention, but rather are used to describe a few illustrative embodiments. Thus, aspects of the invention are not intended to be construed narrowly in view of the illustrative embodiments. In addition, it should be understood that aspects of the invention may be used alone or in any suitable combination with other aspects of the invention.
As discussed above, an embodiment of the invention includes a first retaining device with a frame arranged to engage with a portion of a heat source, such as an integrated circuit, computer processor, ball grid array substrate, a printed circuit board, or other component, such that portions of the frame at least partially surround a part of the heat source. For example, the frame may define an interrupted loop with first and second free ends at ends of the interrupted loop that can be moved to enlarge an opening defined by the frame, e.g., so that the heat source can be received into the opening without the use of special tools and/or without elastically or plastically deforming the frame. The part of the frame defining an interrupted loop and the free ends may lie in a plane, e.g., a plane at which the frame is arranged to engage with a heat source. Once the heat source is received in the opening, the free ends may be moved relative to each other, e.g., toward each other, so that the opening may be reduced in size, allowing the frame to restrict its movement relative to the heat source in x and y directions (which may be in a plane of the frame). The frame may also engage the heat source to restrict its movement in the z direction, e.g., so that the frame cannot move beyond a certain point in an upwarddirection relative to the heat source (which may be perpendicular to a plane of the frame).
A second retaining device, such as a spring clip, may engage with the first retaining device so as to prevent movement of the free ends relative to each other in at least one direction. For example, the second retaining device may capture portions of the free ends, such as by looping part of a hook around the free ends, to effectively lock the free ends in place and prevent disengagement of the heat source from the first retaining device. The second retaining device may alternately, or additionally, engage with the first retaining deviceand contact a heat sink to bias the heat sink toward a heat source engaged by the first retaining device. For example, the second retaining device may apply a resilient bias on the heat sink in a downward direction toward the heat source. Since the first retaining device may be restricted in upward movement relative to the heat source, the resilient bias on the heat sink may bias the heat source and heat sink together. Thus, it is possible for the second retaining device to function to both prevent enlargement of the frame opening and bias a heat sink and heat source together, e.g., to maintain proper thermal contact between the two components.
FIG. 1 shows an illustrative embodiment of a heat sink assembly 10 that includes a heat source 4, a heat sink 3, and first and second retaining devices 1, 2 that hold the heat source 4 and heat sink 2 in thermal contact with each other. While the heat source 4 may include any suitable component or components, in this illustrative embodiment the heat source 4 includes a printed circuit board (PCB) 41, a ball grid array support 43 and an integrated circuit 42. Other components may be additionally or alternately included, such as a thermal interface material, such as a thermally conductive grease or oil to help with thermal transfer between the heat source 4 and the heat sink 3. It should be noted that a heat source 4 that interacts with the first and second retaining devices 1, 2 need not necessarily be capable of itself generating heat, but instead may function to transfer heat from a heat generating component or other heat source to a heat sink. For example, the heat source 4 may include a heat pipe that is in thermal contact with an integrated circuit which generates heat, and transfers that heat to the heat pipe. The heat pipe may, in turn, transfer heat to the heat sink 3.
The heat sink 3 in this illustrative embodiment includes a contact plate 32 and a plurality of fins 31 that extend upwardly from the contact plate 32. A lower surface of the contact plate 32 is arranged to make thermal contact with, or otherwise thermally communicate with an upper surface of the integrated circuit 42 so as to receive heat from the integrated circuit 42 and dissipate the heat via the fins 31. Of course, it should be understood that the heat sink 3 may include any suitable additional or alternate components, such as one or more heat pipes, a thermoelectric cooling device, a phase-change based or other thermal transfer medium, a liquid- based heat exchanger, and so on. In short, the heat sink 3 may include any suitable component to receive and transfer heat away from a heat source 4. The heat sink 3 in this embodiment may be formed in any suitable way, such as by casting, extruding, machining, forging, welding, or otherwise assembling portions made of any suitable material, such as conductive metals
(aluminum, copper, steel, etc.), plastics, composites and/or combinations of any such materials.
The first retaining device 1 in this illustrative embodiment includes a frame clip with four sidewalls 15 that define an opening 18 arranged to receive a portion of the heat source 4. In one embodiment, the integrated circuit 42 and ball grid array substrate 43 may be received into the opening 18, and the sidewalls 15 may engage with edges of the ball grid array substrate 43 (e.g., by clamping, by engaging one or more tabs, grooves, hooks, teeth, wedges, barbs, or other holding features 14 with the substrate 43, etc.) to resist movement of the first retaining device 1 relative to the heat source 4 in x and y directions. (As can be seen in FIG. 1 , the x and y directions may be directions in a plane of the first retaining device 1 and/or the opening 18.) This is not to say that in all embodiments the first retaining device 1 is made incapable of any movement in x and/or y directions relative to the heat source 4, but rather the first retaining device 1 may be restrained in movement so as to prevent disengagement of the first retaining device 1 from the heat source 4 (absent forces that would deform or damage the heat source 4 and/or first retaining device 1). Thus, in some embodiments, the first retaining device 1 may be somewhat moveable in x and/or y directions relative to the heat source 4, but when suitably engaged with the heat source 4, may not be movable so as to disengage from the heat source 4.
In accordance with an aspect of the invention, the frame of the first retaining device 1 defines an interruptedloop with first and second free ends 11 , 12 that are moveable relative to each other so that the size of the opening 18 may be adjusted. In some embodiments, the part of the frame defining the interrupted loop and the free ends may lie in a plane of the opening 18, such as an x-y plane in which the first retaining device 1 is arranged to engage with the heat source 4. The free ends 11 , 12 may be adjacent each other at a split or gap 16 in the loop at a sidewall of the first retaining device 1. For example, in this embodiment where,with the free ends 11, 12 relatively close together, the size of the opening 18 defined by the sidewalls 15 is close to the size of the substrate 43 and the distance between the tabs 14 is smaller than the width/length of the substrate 43, the free ends 11 , 12 may be moved away from each other so as to enlarge the size of the opening 18. Such enlargement of the opening 18 may be done by moving the free ends 11, 12 by hand and without the use of specialized tools, and may allow the substrate 43 to be received into the opening 18 so that the tabs 14 are positioned below the substrate 43 (i.e., between the substrate 43 and the PCB 41). For example, FIG. 2 shows a cross sectional view of the heat sink assembly 10 with the first and second retaining devices 1, 2, the heat sink 3 and the heat source 4 completely assembled. As can be seen in this view, the ball grid array substrate 43 is joined to the PCB 41 by an array of solder balls 44 such that a space exists between the substrate 43 and the PCB 41. The height of this space may vary, but is generally between about 0.25mm and 1mm. With the first retaining device 1 engaged with the heat source 4 in this embodiment, the tabs or other holding features 14 of the first retaining device 1 are positioned in the space between the substrate 43 and the PCB 41 and under the substrate 43 so that the substrate 43 is captured in the opening 18. As a result, the first retaining device 1 may be restricted in movement relative to the heat source 4 in x and y directions, as well as in the z direction.
In prior heat sink assembly arrangements, engagement of a retaining device having tabs similar to that shown in FIG. 1 , and as shown in U.S. Patent Application Publication
2010/0018670, required that the tabs and/or the frame be elastically and/or plastically deformed so as to allow the substrate 43 or other component to enter the frame opening so that the tabs are positioned below the substrate. Such deformation required the use of specialized tools and could not be done by hand. However, in accordance with this aspect of the invention, the opening 18 of the first retaining device 1 may be enlarged and/or a distance between the tabs or other holding features 14 increased by moving the free ends 11, 12 relative to each other by hand and without the use of tools. Of course, it should be understood, however, that other embodiments may require the use of a tool to move the free ends 11, 12 relative to each other to enlarge and/or reduce the size of the opening 18. Also, the first retaining device 1 is not limited to engaging with a heat source 4 in the specific way shown in FIGs. 1 and 2. Instead, for example, the heat source 4 may include fins or tabs that are received into grooves of the first retaining device 1 , the first retaining device 1 may engage the heat source 4 using only friction or an interference fit, and others.
FIG. 3 shows a top view of the first retaining device 1 of FIGs. 1 and 2, and illustrates how the free ends 11, 12 may be moved relative to each other to enlarge the size of the opening 18. In this illustrative embodiment, the free ends 11, 12 may be moved away from each other so as to enlarge a gap 16 between the free ends to enlarge the opening 18. This may allow the first retaining device 1 to receive a portion of a heat source 4, such as the substrate 43 shown in FIGs. 1 and 2. In this embodiment, the first retaining device 1 is made with a construction and/or of a material that allows the first retaining device 1 to elastically and/or plastically deform with movement of the free ends 11, 12 relative to each other so that the opening 18 can be enlarged. For example, the first retaining device 1 may be made of a somewhat flexible material, or to have a portion that is somewhat flexible, to allow for the desired movement and opening size change. Flexing may be restricted to particular regions of the first retaining device 1 , such as at the comers of the frame, within one or more sidewalls 15, etc., or may not be restricted.
However, as discussed in more detail below, other arrangements are possible that do not require elastic and/or plastic deformation of any portion of the first retaining device 1.
With the opening size enlarged and the portion of the heat source received, the free ends 11 , 12 may be moved towards each other to reduce the size of the opening 18 and engage the first retaining device 1 with the heat source 4. In some embodiments, movement of the free ends 11 , 12 may cause the first retaining device 1 to clamp the heat source 4 portion in the opening, although such clamping action is not required. Instead, the heat source 4 portion may be suitably captured in the opening 18, e.g., so that movement of the first retaining device 1 relative to the heat source 4 in the x and y directions is suitably restricted. It should be noted that the first retaining device 1 may be made of any suitable material, such as plastics, metals, composites and/or combinations of materials, and in any suitable way, such as by machining, molding, casting, forging, sintering, stereo lithography, 3D printing, etc.
Also included in the heat sink assembly 10 of FIG. 1 is a second retaining device 2, which may serve to engage with the first retaining device 1 to resist movement of the free ends 11 , 12 and prevent enlargement of the opening 18 to a degree that would cause disengagement of the first retaining device 1 and the heat source 4. For example, in this embodiment, the second retaining device 2 includes an engagement feature 21 (e.g., a hook) that is configured to engage with the free ends 11, 12 so as to keep the free ends 11, 12 within a desired distance of each other. That is, in this embodiment, the engagement feature 21 at the left end of the second retaining device 2 (as viewed in FIG. 1) includes a hook that is sized and shaped to clip over and receive protrusions 13 on the free ends 11 , 12 so that the free ends 11, 12 cannot move away from each other. This engagement can maintain the size of the opening 18 and help ensure that the heat source 4 remains engaged with the first retaining device 1.
In addition, or alternately, the second retaining device 2 may engage with the first retaining device 1 and the heat sink 3 so as to bias the heat sink 3 and the heat source 4 together. For example, a heat sink contacting portion 22 of the second retaining device 2 may contact a part of the heat sink 3 (see FIG. 2) so as to press downwardly on the heat sink 3. In this embodiment, the second retaining device 2 has an M-shape and may be made of a spring steel wire of round or other suitable cross sectional shape or other suitable material. The M-shape of the second retaining device 2 may be sized so that, with the heat sink contacting portion 22 in contact with the heat sink 3, the device must be flexed to engage the engagement features 21 with the first retaining device 1 (e.g., with the engagement features 21 engaged with protrusions 13 at the free ends 11 , 12 on one side and with holes or slots on a sidewall 15 opposite the free ends 11, 12). As a result, the heat sink contacting portion 22 will press downwardly on the heat sink 3 with a spring bias force that urges the heat sink 3 toward the heat source 4. Since the heat source 4 may be engaged by the first retaining device 1 in the z direction, e.g., by a clamping force, by tabs or other holding features 14 positioned below a portion of the heat source 4, or other arrangement, the first and second retaining devices 1 , 2 may cooperate to resiliently urge the heat sink 3 and heat source 4 together. This will help maintain suitable thermal contact or other communication between the heat sink 3 and heat source 4, e.g., a bottom surface of the contact plate 32 may be pressed against a top surface of the integrated circuit 42 so that heat can be suitably transferred between the two. While in this embodiment the second retaining device 2 serves to both engage the first retaining device 1 to restrain movement of the free ends 11, 12 and to provide a resilient bias to the heat sink 3, the second retaining device 2 need not perform both functions. For example, one clip or other element may be used to apply a resilient bias to the heat sink 3, and a separate clip, bolt, clamp or other arrangement may be used to restrain movement of the free ends 11, 12. FIG. 4 shows an exploded view of another illustrative embodiment of a heat sink assembly 10. This embodiment is similar to that in FIG. 1, with one difference being that the second retaining device 2 is formed from a stamped, flat spring element (such as a die-cut steel) instead of from a bent wire element. Otherwise, operation of the second retaining device 2 is similar to that in FIG. 1, i.e., the engagement features 21a, 21b at opposite ends of the second retaining device 2 engage with protrusions 13 of the first retaining device 1. The engagement feature 21a is arranged so that a hook (the U-shaped distal portion) captures the protrusions 13 on the free ends 11, 12 to restrain their movement away from each other. Another difference in this embodiment is that the engagement feature 21b at the opposite end has a U-shaped hook like that of the engagement features 21a, rather than a pair of hooks formed by bent ends of wire in FIG. 1. This arrangement of FIG. 4 may allow either engagement feature 21a or 21b to be used to engage with the free ends 11, 12, whereas the FIG. 1 embodiment may require that only one end of the device 2 can be used to engage the free ends 11, 12.
FIG. 5 shows another illustrative embodiment of a heat sink assembly. This embodiment is again similar to that in FIG. 1 , with one difference being that the second retaining device 2 has a different shape. Although the center part of the second retaining device 2 has an M-shape, the engagement features 21 are arranged as oppositely oriented open hook structures. As with the FIG. 1 embodiment, however, the engagement feature 21a at one end is arranged to engage with protrusions 13 of the free ends 11, 12 to restrain movement of the free ends 11, 12. Note that the location of the free ends 11, 12 and protrusions 13 are offset to cooperate with the engagement features 21 of the second retaining device 2.
While the embodiments above include a first retaining device 1 having a frame that is elastically and/or plastically deformed to adjust a size of an opening 18 to receive a heat source 4 (and/or a heat sink 3), other arrangements are possible. For example, FIG. 6 shows an embodiment in which the frame includes a hinge 17. In this embodiment, the hinge 17 includes a pin portion 17a and a knuckle portion 17b that are respectively formed on first and second frame portions la, lb. The hinge portions 17a, 17b may be made in any suitable way, such as by machining, molding, attaching hinge elements to respective frame portions la, lb, etc. As can be seen in the top views of FIGs. 7 and 8, the hinge portions 17a and 17b may be engaged with each other (e.g., by inserting the pin portion 17a into a hole in the knuckle portion 17b) to allow the free ends 11, 12 to be moved relative to each other between an open position in FIG. 7 and a closed position in FIG. 8. The first retaining device 1 of FIGs. 6-8 may be used with a second retaining device 2 like that in FIG. 5, for example, although other arrangements are possible. Providing the hinge 17 at a sidewall 15 that is opposite the free ends 11, 12 may allow the first retaining device 1 to adopt a larger size opening 18 than providing the hinge 17 in other locations, but other such locations are possible. For example, a hinge 17 could be provided on the same sidewall 15 where the free ends 11, 12 are located, or at any other location. Also, two or more hinges 17 could be provided.
FIG. 9 shows an illustrative embodiment where a hinge 17 is provided relatively close to a corner of a frame having a rectangular shaped opening 18. Such a location for a hinge 17 may change the way in which the opening size and/or shape is changed, and the way in which a first retaining device 1 engages with a heat source 4. For example, a hinge 17 located near a center of a sidewall 15 as in FIGs. 6-8 may allow sidewalls 15a, 15b extending from the free end side to the hinge side of the opening 18 (top and bottom sidewalls as seen in FIGs. 7 and 8) to more positively clamp a heat source 4 than the other sidewalls 15. On the other hand,as can be seen in the open position shown in FIG. 10 and the closed position shown in FIG. 1 1, a hinge 17 location like that in FIGs. 9-11 may allow the sidewalls 15 to more evenly apply a clamping force to the heat source 4.
FIGs. 12 and 13 show another illustrative embodiment of a first retaining device 1 having a hinge 17. In this illustrative embodiment, the hinge 17 is arranged as a "live" or "living" hinge. That is, the hinge 17 includes an element that is attached to both frame portions la and lb, and has a portion that flexes to allow the frame portions la, lb to be moved between the open position of FIG. 13 and the closed position of FIG. 12. Such an arrangement may make assembly of the first retaining device 1 easier, e.g., the living hinge element may be co-molded with other parts of the first retaining device 1, or the living hinge element may be more simply made, e.g., molded or machined as a relatively thin and flexible part that interconnects the frame portions la, lb. Note that if desired, a second retaining device 2 engagement feature 21 may be used to stabilize the hinge 17, e.g., by having the engagement feature 21 capture protrusions 13 at the hinge 17 to hold the hinge portions together. Such an arrangement is shown in FIGs. 8 and 14 and may be useful where the living hinge element is relatively weak and may not be capable of sustaining a desired clamping force or other positioning of the frame portions la, lb over an extended time, e.g., due to plastic creep or other failure. The living hinge element may include a flexible webbing, a thin plastic or metal strip, a wire, or other suitable element. FIG. 8 shows a second retaining device 2 having a configuration like that shown in FIG. 5, and has the engagement feature 21b arranged to secure the protrusions 13 at the hinge 17. FIG. 14 shows a second retaining device 2 having a configuration like that shown in FIG. 4and has the engagement feature 21b arranged to secure the protrusions 13 at the hinge 17.
FIGs. 14-17 show another illustrative embodiment of a first retaining device 1 that includes a hinge 17 in the form of a live or living hinge. However, in this embodiment, the hinge 17 allows for pivoting of the frame portions la, lb about a horizontal axis (e.g., an x or y axis) so that the frame portions la, lb can be moved between the positions shown in FIGs. 14 and 15, as well as pivoting of the frame portions la, lb about a vertical axis (e.g., the z axis) so that the frame portions la, lb can be moved between open and closed positions as shown in FIGs. 16 and 17, respectively. In some embodiments, pivoting of the frame portions la, lb about a vertical axis may be more restricted than about a horizontal axis, e.g., because the portions la, lb may not need to move large amounts to receive a heat source 4 in the opening 18.
FIG. 18 shows yet another embodiment of a heat sink assembly 10. In this illustrative embodiment, the first retaining device 1 includes two frame portions la, lb. A first frame portion la includes first free ends 11a, 1 lb at opposite ends of the frame portion la, and a second frame portion lb includes second free ends 12a, 12b at opposite ends of the frame portion lb. Thus, the frame portions la, lb are independent of each other and are not necessarily attached to each other prior to assembly with the second retaining device 2. Regardless, the free ends 11, 12 are moveable relative to each other to adjust a size of an opening 18 defined by the frame portions la, lb, e.g., to enlarge a size of the opening 18 to engage with a portion of the heat source 4. With the frame portions la, lb engaged with the heat source 4, a heat sink 3 may be positioned so that a part of the contact plate 32 is received in the opening 18 and is put in contact with the integrated circuit 42 or other heat source portion. Thereafter, the second retaining portion 2 may be engaged with the heat sink 3 and the first retaining device 1. Specifically, with respect to this embodiment, a first engagement feature 21a of the second retaining portion 2 may be positioned under a protrusion 13a and under protrusions 13 on the first and second free ends 1 la, 12a. A heat sink contacting portion 22 may be positioned between fins 31 and in contact with an upper surface of the contact plate 32, e.g., to apply a downward force on the heat sink 3. A second engagement feature 21b may then be positioned under a protrusion 13b and under protrusions 13 of the first and second free ends l ib, 12b. By engaging with the first and second free ends 11a and 12b, along with portions of the frame, the second retaining device 2 may resist movement of the first and second free ends 11a, 12a and l ib, 12b away from each other, thereby maintaining engagement of the first retaining device 1 with the heat source 4. Of course, other arrangements are possible. For example, a single U-shaped clip may be engaged with the protrusions 13 for the first and second free ends 11a, 12a, and another U-shaped clip may be engaged with the protrusions 13 for the first and second free ends l ib, 12b rather than have a single piece second retaining device 2 engage with both pairs of free ends 11, 12. In addition, another element, e.g., having a configuration like that in FIG. 4, may engage with the protrusions 13a, 13b to urge the heat sink 3 into contact with the heat source 4. Thus, the second retaining device 2, like the first retaining device 1 , may include two or more separable parts, as desired.
While in the embodiments above an element, such as an engagement portion 21 of a second retaining device 2, engage with protrusions of the free ends to restrain movement of the free ends relative to each other, other arrangements are possible. For example, the free ends may each include a hole or slot, and the holes or slots may be aligned with each other when the first retaining device is properly engaged with a heat source and/or heat sink. Thereafter, a pin or other element (which may be part of a second retaining device 2) may be inserted into the aligned holes or slots to prevent movement of the free ends relative to each other. In another embodiment, one free end may include a pin, and the other free end may include a hole. When adjusting the size of the opening of the frame, the pin and hole may be disengaged to allow movement of the free ends. However, when the first retaining element is engaged with the heat source and/or heat sink, the pin of one free end may be inserted into the hole of the other free end, thereby locking the two free ends together. In another embodiment, the free ends may be joined together by a bolt or screw, which may be operated to not only restrain movement of the free ends relative to each other, but also adjust their relative position as well. Other arrangements will occur to those of skill in the art.
Also, while the embodiments above describe arrangements in which the opening 18 has a generally rectangular shape, other shapes are possible, such as circular, oval, triangular or other closed loop shapes.
Having thus described several aspects of at least one embodiment of this invention, it is to be appreciated various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and scope of the invention. Accordingly, the foregoing description and drawings are by way of example only.
What is claimed is:

Claims

1. An assembly for engaging a heat sink with an electrical component heat source, comprising:
a first retaining device arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions, the first retaining device including a frame defining an opening to receive the heat source such that portions of the frame at least partially surround a part of the heat source, the frame arranged to define an interrupted loop around the opening with first and second free ends that are movable relative to each other, movement of the free ends relative to each other causing a change in size of the opening; and a second retaining device arranged to engage with the first retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening.
2. The assembly of claim 1, wherein the second retaining device is arranged to engage with the first retaining device to urge a heat sink toward a heat source engaged by the frame.
3. The assembly of claim 1, wherein the second retaining device includes a hook arranged to loop around portions of the free ends and resist movement of the free ends away from each other.
4. The assembly of claim 1, wherein the frame includes a first frame portion with the first free end, a second frame portion with the second free end, and a hinge connecting the first and second frame portions together, the hinge allowing movement of the first and second frame portions relative to each other and allowing movement of the first and second free ends toward and away from each other.
5. The assembly of claim 1, wherein the second retaining device is arranged to engage with the first retaining device to resist movement of a heat source engaged by the first retaining device and a heat sink in contact with the heat source relative to each other in a z direction.
6. The assembly of claim 5, wherein the second retaining device is arranged to apply a resilient bias to a heat sink to urge the heat sink toward the heat source.
7. The assembly of claim 1, wherein the frame includes four sidewalls that define the opening, and the opening has a rectangular shape.
8. The assembly of claim 1, wherein the frame includes one or more holding features to engage with a heat source received in the opening.
9. The assembly of claim 8, wherein the one or more holding features includes one or more tabs arranged to engage with a heat source in a space between a ball grid array substrate and a circuit board that is joined to the ball grid array substrate by an array of solder balls.
10. The assembly of claim 1 , wherein a gap is present between the first and second free ends with the second retaining device engaged with the first retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening.
11. The assembly of claim 1 , wherein the free ends each include a protrusion that is engaged by the second retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening.
12. The assembly of claim 1 , further comprising a heat sink arranged to transfer heat away from a heat source and to engage with the second retaining device to be resiliently biased toward the heat source by the second retaining device.
13. The assembly of claim 1 , wherein the first retaining device is arranged to engage a heat sink with a heat source that includes a ball grid array, a computer processing chip and/or a printed circuit board.
14. The assembly of claim 1 , wherein the first retaining device is arranged to allow enlargement of the size of the opening by moving the free ends relative to each other without plastic or elastic deformation of any portion of the first retaining device.
15. The assembly of claim 1 , wherein the first retaining device is arranged to clamp a portion of a heat source in the opening by movement of the free ends relative to each other.
16. The assembly of claim 1 , wherein the first and second retaining devices are arranged to be both assembled with an electrical component heat source and heat sink to hold the heat source and heat sink together in thermal contact, and to be disassembled from the heat source and heat sink without the use of a mounting tool to deform the first retaining device.
17. The assembly of claim 1 , wherein the second retaining device includes first and second engagement features at opposite ends of the second retaining device, the first engagement feature being arranged to engage with the free ends, and the second engagement feature being arranged to engage with a portion of the first retaining device on a side of the frame opposite the free ends.
18. The assembly of claim 17, wherein a central part of the second retaining device is arranged to contact a heat sink and bias the heat sink toward a heat source engaged by the first retaining device.
19. An assembly for engaging a heat sink with an electrical component heat source, comprising:
a first retaining device arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions, the first retaining device including a frame defining an opening to receive the heat source such that portions of the frame at least partially surround a part of the heat source, the frame arranged to define an interrupted loop with first and second free ends that are movable relative to each other, movement of the free ends relative to each other causing a change in size of the opening; and a second retaining device arranged to engage with the first retaining deviceand contact a heat sink to bias the heat sink toward a heat source engaged by the first retaining device.
20. The assembly of claim 19, wherein the second retaining device includes first and second engagement features at opposite ends of the second retaining device, the first engagement feature being arranged to engage with the first and second free ends, and the second engagement feature being arranged to engage with a portion of the first retaining device on a side of the frame opposite the first and second free ends.
21. The assembly of claim 19, wherein the second retaining device is arranged to engage with the first retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening.
22. The assembly of claim 21, wherein a gap is present between the first and second free ends with the second retaining device engaged with the first retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening
23. The assembly of claim 21, wherein the free ends each include a protrusion that is engaged by the second retaining device to prevent movement of the free ends relative to each other to enlarge a size of the opening.
24. A method for assembling a heat sink and an electrical component heat source, comprising:
providing a first retaining device including a frame defining an opening and arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions;
enlarging the opening defined by the frame to receive a portion of a heat source without elastically deforming any portion of the frame; and
reducing a size of the opening to engage the first retaining device with a portion of the heat source in the opening.
25. The method of claim 24, further comprising:
engaging a second retaining device with the first retaining device to prevent enlargement of the opening.
26. The method of claim 24, wherein the frame includes first and second free ends that are movable relative to each other, and the step of enlarging the opening includes moving the free ends relative to each other to enlarge the opening, and the step of reducing a size of the opening includes moving the free ends relative to each other to reduce the size of the opening.
27. The method of claim 24, wherein the step of enlarging the opening includes moving a first portion of the frame relative to a second portion of the frame by employing a hinge that connects the first and second frame portions together.
28. The method of claim 27, further comprising:
placing a heat sink in thermal contact with the heat source; and
engaging a second retaining device with the first retaining device to both prevent movement of the first and second frame portions to enlarge the opening and to bias the heat sink into contact with the heat source.
29. The method of claim 27, wherein the first and second retaining devices cooperate to resist movement of the heat source and heat sink relative to each other in a z direction.
30. A method for assembling a heat sink and an electrical component heat source, comprising:
providing a first retaining device including a frame defining an opening and arranged to engage with a heat source and resist movement of the heat source relative to the first retaining device in x and y directions;
moving first and second free ends at a sidewall of the frame relative to each other to enlarge the opening defined by the frame to receive a portion of a heat source; and moving the first and second free ends of the frame relative to each other to reduce a size of the opening and to engage the first retaining device with a portion of the heat source in the opening.
31. The method of claim 30, further comprising:
engaging a second retaining device with the first retaining device to prevent movement of the free ends to enlarge the opening.
32. The method of claim 30, wherein the step of moving first and second free ends of the frame relative to each other to enlarge the opening includes moving the free ends away from each other, and the step of moving the first and second free ends of the frame relative to each other to reduce a size of the opening includes moving the free ends toward each other.
33. The method of claim 30, wherein the steps of moving the first and second free ends include moving a first portion of the frame relative to a second portion of the frame by employing a hinge that connects the first and second frame portions together.
34. The method of claim 33, further comprising:
placing a heat sink in thermal contact with the heat source; and
engaging a second retaining device with the first retaining device to both prevent movement of the first and second free ends to enlarge the opening and to bias the heat sink into contact with the heat source.
35. The method of claim 34, wherein the first and second retaining devices cooperate to resist movement of the heat source and heat sink relative to each other in a z direction.
36. The method of claim 30, wherein the steps of moving the first and second free ends includes adjusting a size of the opening without elastically deforming any portion of the frame.
37. The method of claim 30, wherein the steps of moving the first and second free ends include adjusting a size of the opening of the frame by hand and without the use of tools.
38. The method of claim 37, further comprising:
placing a heat sink in thermal contact with the heat source; and
engaging a second retaining device with the first retaining device to both prevent movement of the first and second free ends to enlarge the opening and to bias the heat sink into contact with the heat source, engagement of the second retaining device with the first retaining device being done by hand and without the use of tools.
39. The method of claim 30, further comprising:
engaging a second retaining device with the first retaining device to prevent movement of the first and second free ends to enlarge the opening, engagement of the second retaining device with the first retaining device being done by hand and without the use of tools.
40. The method of claim 39, wherein the first and second free ends each include a protrusion, and the step of engaging a second retaining device includes engaging a hook of the second retaining device with the protrusions of the first and second free ends.
41. The method of claim 39, wherein a gap is present between the free ends with the second retaining device engaged with the first retaining device.
PCT/CN2012/077141 2012-06-19 2012-06-19 Heat sink assembly with openable frame clip WO2013189023A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280074109.9A CN104472028B (en) 2012-06-19 2012-06-19 With the radiating subassembly that can open framework folder
PCT/CN2012/077141 WO2013189023A1 (en) 2012-06-19 2012-06-19 Heat sink assembly with openable frame clip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/077141 WO2013189023A1 (en) 2012-06-19 2012-06-19 Heat sink assembly with openable frame clip

Publications (1)

Publication Number Publication Date
WO2013189023A1 true WO2013189023A1 (en) 2013-12-27

Family

ID=49768013

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/077141 WO2013189023A1 (en) 2012-06-19 2012-06-19 Heat sink assembly with openable frame clip

Country Status (2)

Country Link
CN (1) CN104472028B (en)
WO (1) WO2013189023A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106535584B (en) * 2016-12-23 2019-03-01 爱美达（上海）热能系统有限公司 A kind of retractable elastic locking device of radiator assembly
WO2022027566A1 (en) * 2020-08-07 2022-02-10 华为技术有限公司 Heat radiator, method for manufacturing heat radiator and radio remote unit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003031897A1 (en) * 2001-10-10 2003-04-17 Aavid Thermalloy Llc Heat collector with mounting plate
CN101203119A (en) * 2006-12-15 2008-06-18 富准精密工业(深圳)有限公司 Heat radiating device
CN101460040A (en) * 2007-12-13 2009-06-17 纬创资通股份有限公司 Heat radiating device and electronic device having the heat radiating device
CN101616563A (en) * 2008-06-27 2009-12-30 富准精密工业(深圳)有限公司 The heat abstractor combination

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2872801Y (en) * 2006-02-06 2007-02-21 番禺得意精密电子工业有限公司 Base of radiator
CN101018448A (en) * 2006-02-08 2007-08-15 富准精密工业(深圳)有限公司 Combination of heat radiator buckle and heat radiation device
CN100518457C (en) * 2006-05-26 2009-07-22 富准精密工业(深圳)有限公司 Buckler and heat radiation device using this buckler

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003031897A1 (en) * 2001-10-10 2003-04-17 Aavid Thermalloy Llc Heat collector with mounting plate
CN101203119A (en) * 2006-12-15 2008-06-18 富准精密工业(深圳)有限公司 Heat radiating device
CN101460040A (en) * 2007-12-13 2009-06-17 纬创资通股份有限公司 Heat radiating device and electronic device having the heat radiating device
CN101616563A (en) * 2008-06-27 2009-12-30 富准精密工业(深圳)有限公司 The heat abstractor combination

Also Published As

Publication number Publication date
CN104472028B (en) 2017-07-11
CN104472028A (en) 2015-03-25

Similar Documents

Publication Publication Date Title
US20160211191A1 (en) Heat sink assembly with frame clip for fully assembled attachment to heat generating component
US7885077B2 (en) Solderless heatsink anchor
US4054901A (en) Index mounting unitary heat sink apparatus with apertured base
US7924567B2 (en) Heat dissipation device
EP2737526B1 (en) Heat sink assembly for electronic components
US20080137301A1 (en) Heat dissipation device
US7385822B1 (en) Clip assembly
US20090244851A1 (en) Mounting device for mounting heat sink onto electronic component
US6977814B2 (en) Dual material heat sink core assembly
US20050225945A1 (en) Universal mountable heat sink with integral spring clip
WO2013189023A1 (en) Heat sink assembly with openable frame clip
US9169857B2 (en) Fastening structure for thermal module
US7841388B2 (en) Radiating fin assembly for thermal module
JP2002361410A (en) Jig for reflow soldering
US20050111196A1 (en) Fastening structure of heat sink
US7881061B2 (en) Mounting device for mounting heat sink onto electronic component
CN110914980B (en) Latch assembly, heat sink assembly, and computer product incorporating the same
JP5888882B2 (en) heatsink
US9560792B2 (en) Apparatus and method for heat sink assembly
US20120024495A1 (en) Heat dissipation apparatus
US10672684B2 (en) Heat sink hold down system for direct attachment to printed circuit board
JP5117299B2 (en) heatsink
TW201004550A (en) Heat dissipating device assembly and clip thereof
JP2007317723A (en) Heating element cooling apparatus, method for cooling heating element, and heat sink mounting structure
TWI581087B (en) Heat sink with a load spreading bar

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12879365

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12879365

Country of ref document: EP

Kind code of ref document: A1