WO2013180092A1 - Engine control unit - Google Patents

Engine control unit Download PDF

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Publication number
WO2013180092A1
WO2013180092A1 PCT/JP2013/064697 JP2013064697W WO2013180092A1 WO 2013180092 A1 WO2013180092 A1 WO 2013180092A1 JP 2013064697 W JP2013064697 W JP 2013064697W WO 2013180092 A1 WO2013180092 A1 WO 2013180092A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
resin
mold
connector
Prior art date
Application number
PCT/JP2013/064697
Other languages
French (fr)
Japanese (ja)
Inventor
辻　一郎
義隆 古賀
Original Assignee
株式会社ミクニ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ミクニ filed Critical 株式会社ミクニ
Publication of WO2013180092A1 publication Critical patent/WO2013180092A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Definitions

  • the present invention relates to an engine control unit that includes a printed circuit board sealed with a resin and can be used in a vehicle such as a motorcycle and various general-purpose machines including an engine.
  • an engine control unit (hereinafter sometimes abbreviated as ECU) is used to control a fuel injection system.
  • ECU engine control unit
  • the ECU controls the fuel injection system, for example, the control of the fuel injection timing in the fuel injection device, the amount of fuel injection, the control of the ignition timing of the ignition mechanism (ignition plug), and the idle speed ( (Idle speed control) is controlled.
  • the control of the fuel system including fuel injection and the control of the ignition mechanism for example, the intake / exhaust system, the valve mechanism, the start control, and other controls may be performed depending on the type of vehicle including the four-wheeled vehicle.
  • An ECU that performs such control includes, for example, a printed circuit board on which a microcontroller (microcomputer) is mounted and a side edge portion is a male connector portion having a plurality of connection terminals, and the printed circuit A case is provided that covers and stores a portion other than the connector portion of the substrate (see, for example, Patent Document 1).
  • the connector part of the printed circuit board of the ECU is connected to a female connector on the vehicle side.
  • the vehicle-side connector is connected to various sensors that are provided in the vehicle and output signals, and wiring from a vehicle device (controlled device) to be controlled.
  • a sealing resin shrinks during molding to cause distortion.
  • a resin that has a low shrinkage rate and is unlikely to warp. If the size is up to a certain level, the printed circuit board is sealed with the resin. It became possible to stop.
  • Sealing with resin is performed using two upper and lower molds by transfer molding, for example.
  • the lower mold of the two molds is, for example, a fixed mold that does not move, and the upper mold is a movable mold that can move up and down. After injecting the resin into the mold cavity with these two molds combined and the resin is cured, for example, the movable mold is moved and the molded resin is released and taken out. .
  • the movable mold is matched with the fixed mold.
  • the connector portion is not sealed by the resin, it is disposed outside the cavity of the mold. That is, the connector part of the printed circuit board and the other part (the part where the wiring pattern is provided and the electronic component is mounted) are arranged in the cavity up to the boundary between the connector part and the cavity part. .
  • the printed circuit board may be displaced.
  • the printed circuit board may be tilted or displaced so that the printed circuit board is pushed out of the cavity.
  • the present invention has been made in view of the above circumstances, and has a structure that determines the position with respect to the mold when molding the sealing resin without affecting the arrangement of the connection terminals of the wiring pattern and connector part.
  • An object of the present invention is to provide an engine control unit including a printed circuit board sealed with a resin.
  • an engine control unit of the present invention is an engine control unit including a printed circuit board on which electronic components for control are mounted, By providing a plurality of connection terminals side by side on one side edge of the printed circuit board, the side edge becomes a connector part, and a locked part is provided at each end of the connector part.
  • the entire part of the circuit board except the connector part is sealed with resin, When the locked portion is molded by the member on the mold side used for molding the resin when the resin for sealing the printed circuit board is molded, the printed circuit board is positioned. And held at a position positioned during molding of the resin.
  • the sealing resin when the sealing resin is molded on the portion of the printed circuit board excluding the connector portion, the connector portion comes out of the cavity of the mold, and the resin is placed in the mold cavity.
  • the printed circuit board When the mold is injected, the printed circuit board may be tilted or pushed out to the connector side. However, the mold side member is locked to the locked parts at the left and right ends of the connector part of the printed circuit board. By doing so, the printed circuit board is positioned and held at the positioned position, so that the sealing resin can be molded on the printed circuit board with high accuracy.
  • the locked portion as a structure for positioning the printed circuit board and holding it at the positioned position is formed at the end of the connector portion that is not sealed by the resin of the printed circuit board.
  • the locked portion does not interfere with the layout of the printed circuit board wiring pattern and electronic components, and the arrangement of the wiring pattern and electronic components is made as space efficient as possible without considering the locked portion arrangement. Can be designed to
  • the connector portion for example, only concave portions (or convex portions) are provided as locked portions at both ends, so that there is almost no influence on the number of connection terminals that can be formed and the arrangement of connection terminals.
  • the locked portion is provided in the connector portion that is not sealed with resin, the member on the mold side that locks the locked portion is disposed outside the cavity, and the locked portion The member on the mold side for locking the resin does not obstruct resin molding.
  • the connector portion is provided with a recess at a position eccentric with respect to the centers of both ends of the connector portion.
  • the member that engages with the concave portion on the mold side by providing the member that engages with the concave portion on the mold side, it is possible to prevent the printed circuit board from being mistaken when the printed circuit board is set in the mold. That is, if the front and back sides are mistaken, the member that engages with the concave portion on the mold side becomes an obstacle and the printed circuit board cannot be set.
  • the concave portion can be used for positioning the printed circuit board and holding the position of the printed circuit board when the resin for sealing the printed circuit board is molded.
  • the locked portions are provided at both ends of the connector portion of the printed circuit board installed in the mold. As a result, the positional deviation of the printed circuit board with respect to the mold can be prevented.
  • the ECU is, for example, a vehicle FI system as an engine device including an engine, a fuel injection timing and a fuel injection amount of a fuel injection device, an ignition timing of an ignition mechanism, and an idling speed (idle speed control valve).
  • the ECU which controls).
  • the ECU is connected to controlled devices such as a fuel injection device, a fuel pump, an idle speed control valve drive device, and an ignition coil drive circuit.
  • a crank angle sensor Sensors such as an intake air temperature sensor, an intake air pressure sensor, an engine temperature sensor, and a throttle sensor are connected.
  • Such an ECU includes a printed circuit board 1 shown in FIG. 1.
  • the printed circuit board 1 has a mold for covering and sealing a portion excluding a connector portion 2 described later. Resin 3 is provided by transfer molding.
  • the printed circuit board 1 has two side surfaces, a circuit pattern is formed on each side surface, and electronic components are mounted.
  • one side surface of the printed circuit board 1 is a front surface, and the other side surface is a back surface. Note that the front surface and the back surface may be interchanged.
  • the ECU also has a front surface and a back surface, similar to the printed circuit board. Also in the ECU, the front surface and the back surface may be interchanged.
  • the printed circuit board 1 is a four-layer board.
  • the printed circuit board 1 includes two layers that are two exposed side surfaces and two inner layers, and a wiring pattern is provided on the two exposed layers. Electronic components are mounted.
  • the inner two layers are layers having patterns for power supply and ground, respectively.
  • the printed circuit board 1 is substantially rectangular (rectangular), and a long side is, for example, 1.1 times or more with respect to a short side, and in this embodiment, about 1.8 times (from 1.6 times to 2 times). However, it may be larger than that.
  • One side edge portion (long side edge portion) along the longitudinal direction of the substantially rectangular printed circuit board 1 is a connector portion 2.
  • the connector portion 2 is provided with a plurality of connection terminals 5 arranged at equal intervals along the longitudinal direction of the printed circuit board 1 on both sides thereof.
  • semicircular cutouts 8 are provided on the left and right sides of the connector part 2 of the printed circuit board 1, and the side of the printed circuit board 1 on the connector part 2 side from the cutout part 8.
  • the connector portion 2 extends to the edge and is exposed from the mold resin 3.
  • the notch 8 is used when the mold resin 3 is molded as will be described later.
  • the connector part 2 is opened to the side edge side of the connector part 2 at a position slightly deviated from the center in the vicinity of the center part in the longitudinal direction of the printed circuit board 1 and is orthogonal to the longitudinal direction of the printed circuit board 1.
  • a long slit (concave portion) 6 is provided along the direction.
  • the longitudinal direction of the slit 6 is along the moving direction of ECU when connecting the connector part 2 to a vehicle side connector.
  • the width of the slit 6 along the longitudinal direction of the printed circuit board 1 is such that one connection terminal 5 can be arranged.
  • connection terminal 5 is not arranged, and the slit 6
  • the interval between the connection terminals 5 arranged so as to be sandwiched is longer than that of the other portions.
  • the connector part 2 is a plate-shaped member as a part of the printed circuit board 1, and the connection terminals 5 provided on both surfaces (front and back surfaces) of the connector part 2 are, for example, metal thin films such as copper plating. The front and back surfaces of the connector part 2 are fixed.
  • the slit 6 can distinguish the front and back surfaces of the printed circuit board 1 when molding the mold resin 3 on the printed circuit board 1 or when connecting the connector portion 2 of the printed circuit board 1 to the vehicle side connector.
  • the connector part 2 is arranged offset at a position slightly shifted from the longitudinal center of the printed circuit board 1. That is, the slit 6 is provided eccentrically with respect to a position that is the center of both end portions having the notch portion 8 of the connector portion 2.
  • the portions other than the connector portion 2 are covered with the mold resin 3 as shown in FIGS.
  • the printed circuit board 1 has a board body 9 as a part other than the connector part 2 having wiring patterns formed on the front and back surfaces and electronic components mounted thereon.
  • the substrate body 9 is covered and sealed with the mold resin 3.
  • the inside of the mold resin 3 is basically molded so that there is no gap as much as possible, that is, it is molded solidly.
  • the mold resin 3 is formed so as to cover the front and back surfaces of the printed circuit board 1 excluding the connector portion 2 and the three side edges excluding the connector portion 2.
  • the mold resin 3 is formed into a thick plate shape, and the side surface of the short side edge portion of the printed circuit board is curved into a substantially semi-cylindrical shape. Therefore, when the mold resin 3 is viewed from the front side where the connector portion 2 of the printed circuit board 1 is exposed, the left and right side surfaces are semicircular.
  • a printed circuit board is disposed at a position that is approximately half the thickness of the mold resin 3.
  • a locking hole of a cylindrical cover provided on a vehicle-side connector (not shown) to which the connector portion 2 of the ECU is connected is provided on the surface (upper surface) of the mold resin 3 and covers the outer periphery of the mold resin 3 of the ECU.
  • a locking convex portion 7 is provided to be locked to. Thereby, the connector part 2 of ECU is prevented from being detached from the vehicle side connector.
  • rib-shaped guide convex portions 12 are provided on the inner peripheral surface of the cover and guided by a guide portion for guiding the insertion of the ECU into the cover. It has been. Further, a pair of convex portions 10 are provided on the surface of the mold resin 3, and a pair of convex portions 11 are provided on the back surface of the mold resin 3, and these convex portions 10, 11 and the above-described guide convex portion 12 are arranged inside the cover. It is in a state of being substantially in contact with the peripheral surface. These convex portions 10, 11. The movement of the ECU in the cover (swing) is regulated by the guide convex portion 12 and the locking convex portion 7.
  • FIG. 7 schematically shows the lower fixed mold 22 on which the printed circuit board 1 is set
  • FIG. 8 shows the lower fixed mold 22 and the upper movable mold 21 with the printed circuit board 1 set. The outline of the state in which resin is injected into the cavities 23 and 24 of these molds 21.22 is shown.
  • the mold resin 3 is formed on the printed circuit board 1.
  • the lower mold 22 is a fixed mold 22 that does not move, and the upper mold 21 is moved upward from a state in which the lower mold 22 is covered when the molded resin is released. It is possible to take out the ECU in which the mold resin 3 is formed on the printed circuit board 1 from the mold.
  • the printed circuit board 1 is set on the lower mold 22, and the upper mold 21 and the lower mold 22 are combined, and the upper mold 21 is The cavity 23 and the cavity 24 of the lower mold 22 are combined to form a space having the same shape as the mold resin 3.
  • the mold resin 3 can be molded by injecting a resin to be the mold resin 3 into this space.
  • notches 8 are provided at both ends of the connector portion 2 exposed from the mold resin 3 of the printed circuit board 1.
  • a slit 6 is provided in the approximate center between the pair of cutout portions 8 of the connector portion 2. As described above, the slit 6 is disposed at a position that is eccentric with respect to the center of both ends where the notch 8 of the connector 2 is provided.
  • the connector portion 2 is disposed in the lower fixed mold 22, and on the outer side of the cavity 24, the portion corresponding to the notch portion 8 of the connector portion 2.
  • An engagement portion 26 having a diameter substantially the same as that of the semicircular cutout portion 8 is provided, and the engagement portion 26 is inserted into the semicircular cutout portion 8, thereby the connector portion 2. Is determined.
  • the slit 6 of the connector portion 2 resin is filled in a portion on the base end side (substrate body 9 side) of the slit 6, and the resin is closed so as not to leak from this portion.
  • An engaging portion 28 to be engaged is provided.
  • the left and right engaging portions 26 are disposed on the mold 22 corresponding to the left and right cutout portions 8, and the mold 22 is configured corresponding to the slit 6.
  • the printed circuit board 1 can be positioned and disposed on the mold 22 by arranging the engaging portion 28 on the mold 22.
  • the connector part 2 of the printed circuit board 1 protrudes outside the cavities 23 and 24 in a state where the two molds 21 and 22 are combined, at least the base end side of the connector part 2 has two molds 21 and 22.
  • the printed circuit board 1 is held in a horizontal state.
  • the upper and lower molds 21 and 22 are combined, and the resin is injected into the cavities 23 and 24 from the plunger through, for example, sprues, runners, and gates.
  • pressure from the resin acts on the printed circuit board 1, but the engaging portions 26 of the mold 22 are engaged with the notches 8 on both the left and right ends of the connector portion 2 of the printed circuit board 1, and the connector portion Since the engagement portion 28 is engaged with the slit 6 at the substantially central portion 2 and the connector portion 2 is sandwiched between the upper and lower molds 21 and 22, the printed circuit board 1 is positioned as described above. It is held in the state.
  • the printed circuit board 1 is positioned not with the board body 9 of the printed circuit board 1 on which the wiring pattern is formed and the electronic components are mounted, but with the notch portions 8 at the left and right ends of the connector portion 2
  • the slit 6 in the substantially central portion of the connector portion 2, and the engaging portions 26 and 28 on the mold 22 side that engage with the notch 8 and the slit 6 are also arranged outside the cavities 23 and 24.
  • the structure for positioning the printed circuit board 1 with respect to the molds 21 and 22 does not affect the wiring pattern of the board body 9 of the printed circuit board 1 and the mounting position of the electronic components, and the arrangement is as optimal as possible. As described above, the arrangement of the wiring pattern and the electronic component can be determined.
  • the front and back of the printed circuit board 1 must be aligned. That is, when the printed circuit board 1 is set on the mold 22, if the front and back sides are reversed, the position of the engaging portion 28 that is inserted into the slit 6 does not match the slit 6, and the printed circuit board 1 cannot be set.
  • the mold resin 3 is formed so as to cover three side edges excluding the side edge that becomes the connector portion 2 of the substantially rectangular printed circuit board 1, whereas the side edge that becomes the connector portion 2. For example, when a force is applied to the mold resin 3 to pull the printed circuit board 1 to the connector side, an extra force (for example, the electronic component mounted on the printed circuit board 1 (for example, There is a risk of shearing force) acting.
  • the resin that covers the front surface of the printed circuit board 1 and the resin that covers the back surface are integrally joined at the base end side portion of the slit 6 of the connector portion 2 of the printed circuit board 1.
  • this force is transmitted from the mold resin portion in the slit 6 to the front and back mold resins 3. Can do. Therefore, it is possible to suppress the stress from acting on the component mounted on the printed circuit board 1.
  • the engaging portion 26 is drawn in a columnar shape, but the engaging portion 26 is not necessarily a columnar shape, and enters the semicircular cutout portion 8 to position the printed circuit board 1. It suffices if the configuration can prevent the movement. Moreover, although a pair of metal mold
  • the pair of molds 21 and 22 may be arranged on the left and right instead of the upper and lower sides, one mold 21 and 22 may be fixed, and the other mold 21 and 22 may be movable. In this case, when the printed circuit board 1 is set on the mold 22, if the connector portion 2 side is set upward, the printed circuit board 1 can be prevented from being inclined due to its own weight during setting.
  • the ECU of the present invention can be used for engine control in various general-purpose machines such as mowers, chainsaws, agricultural chemical spreaders, and private power generators, in addition to being used in vehicles.

Abstract

Provided is an engine control unit equipped with a printed circuit board (1) sealed with a resin, and having a structure for determining position in relation to a mold when forming the sealing resin, without obstructing the arrangement of the connection terminals of the connector unit or the wiring pattern. An engine control unit has a printed circuit board (1) sealed with a resin. One lateral edge section of the printed circuit board (1) is made to be a connector unit (2) by arranging a plurality of connection terminals (5) in the lateral edge section. Semicircular notches (8) are positioned on both ends of the connector unit (2). The entirety of the printed circuit board (1), except for the connector unit (2), is sealed with a resin. When forming the resin for sealing the printed circuit board (1), the notches (8) engage members (engaging parts (26)) of the mold (22) used for forming the resin. As a result, the position of the printed circuit board is determined, and the printed circuit board is held in this determined position while the resin is being formed.

Description

エンジンコントロールユニットEngine control unit
　本発明は、樹脂により封止されたプリント回路基板を備え、オートバイ等の車両や、エンジンを備える各種汎用機で使用可能なエンジンコントロールユニットに関する。 The present invention relates to an engine control unit that includes a printed circuit board sealed with a resin and can be used in a vehicle such as a motorcycle and various general-purpose machines including an engine.
　自動車のＦＩ（フューエル インジェクション）システムでは、燃料噴射系の制御にエンジンコントロールユニット（以下、ＥＣＵと略す場合がある）が用いられる。近年、オートバイ（例えば自動二輪車、原動機付自転車）でもＥＣＵが用いられるようになっているとともに、より小型なオートバイでもＥＣＵが用いられるようになった。なお、ＥＣＵは、燃料噴射系の制御として、例えば、燃料噴射装置における燃料噴射タイミングの制御と、燃料の噴射量を制御するとともに、点火機構（点火プラグ）の点火時期の制御とアイドル回転数（アイドルスピードコントロール）の制御を行う。また、四輪自動車を含む車両の車種によって、燃料噴射を含む燃料系統の制御、点火機構の制御以外に、例えば、吸排気系統、動弁機構、始動制御、その他の制御を行う場合がある。 In an automobile FI (fuel injection) system, an engine control unit (hereinafter sometimes abbreviated as ECU) is used to control a fuel injection system. In recent years, ECUs have been used for motorcycles (for example, motorcycles and motorbikes), and ECUs have also been used for smaller motorcycles. The ECU controls the fuel injection system, for example, the control of the fuel injection timing in the fuel injection device, the amount of fuel injection, the control of the ignition timing of the ignition mechanism (ignition plug), and the idle speed ( (Idle speed control) is controlled. In addition to the control of the fuel system including fuel injection and the control of the ignition mechanism, for example, the intake / exhaust system, the valve mechanism, the start control, and other controls may be performed depending on the type of vehicle including the four-wheeled vehicle.
　このような制御を行うＥＣＵは、例えば、マイクロコントローラ（マイコン）が実装されるとともに、一つの側縁部が複数の接続端子を有する雄型のコネクタ部とされたプリント回路基板と、このプリント回路基板のコネクタ部以外の部分を覆って収納するケースを備える（例えば、特許文献１参照）。 An ECU that performs such control includes, for example, a printed circuit board on which a microcontroller (microcomputer) is mounted and a side edge portion is a male connector portion having a plurality of connection terminals, and the printed circuit A case is provided that covers and stores a portion other than the connector portion of the substrate (see, for example, Patent Document 1).
　ＥＣＵのプリント基板のコネクタ部は、車両側の雌型のコネクタに接続される。車両側のコネクタは、車両に設けられて信号を出力する各種センサや、制御される車両の装置（被制御装置）からの配線がまとめて接続されている。 The connector part of the printed circuit board of the ECU is connected to a female connector on the vehicle side. The vehicle-side connector is connected to various sensors that are provided in the vehicle and output signals, and wiring from a vehicle device (controlled device) to be controlled.
特開平８－３１６６５０号公報JP-A-8-316650
　ところで、車両に搭載されるＥＣＵ、特にオートバイに搭載されるＥＣＵにおいては、雨水の侵入、走行時の振動や衝撃、走行時等に接触する虞のある薬品の問題がある。雨水や薬品の侵入を防止するために密閉性の高いケースでＥＣＵを構成するプリント回路基板のコネクタ部以外の部分を覆う必要があり、ケースに高い寸法精度や、高いシール性が要求される。この場合に、ケースにかかるコストが高くなったり、プリント回路基板にケースを取り付ける作業が煩雑になる可能性がある。 By the way, in an ECU mounted on a vehicle, particularly an ECU mounted on a motorcycle, there is a problem of chemicals that may come into contact with rainwater intrusion, vibration or impact during traveling, traveling, or the like. In order to prevent intrusion of rainwater and chemicals, it is necessary to cover a portion other than the connector portion of the printed circuit board constituting the ECU with a highly airtight case, and the case is required to have high dimensional accuracy and high sealing performance. In this case, the cost for the case may increase, and the work of attaching the case to the printed circuit board may be complicated.
　ケースの代用として小型の電子部品（各種集積回路等）と同様に、プリント回路基板のコネクタ部以外の部分を樹脂により封止することが考えらえる。従来、封止用の樹脂は、成形時に収縮してひずみが生じ、一般に樹脂に封止される電子部品よりもかなり大きなプリント回路基板の封止を行うと、成形時の収縮に基づいて生じる応力によって、反りが生じる問題があったが、封止用の樹脂として、収縮率が低く、反りが生じ難い樹脂を用いることが可能になり、ある程度までの大きさならばプリント回路基板を樹脂で封止することが可能になった。 As a substitute for the case, it is conceivable to seal a portion other than the connector portion of the printed circuit board with a resin, as in the case of small electronic components (various integrated circuits). Conventionally, a sealing resin shrinks during molding to cause distortion. Generally, when a printed circuit board that is considerably larger than an electronic component sealed in the resin is sealed, the stress generated due to the shrinkage during molding. However, as a sealing resin, it is possible to use a resin that has a low shrinkage rate and is unlikely to warp. If the size is up to a certain level, the printed circuit board is sealed with the resin. It became possible to stop.
　樹脂による封止は、例えば、トランスファ成形により上下二つの金型を用いて行われる。二つの金型のうちの下側の金型は、例えば、移動しない固定金型で、上側の金型は上下動可能な可動金型となっている。これら二つの金型を合わせた状態で金型のキャビティ内に樹脂を注入し、樹脂が硬化した後に、例えば、可動金型を移動させて、成形された樹脂を離型して取り出すことになる。 Sealing with resin is performed using two upper and lower molds by transfer molding, for example. The lower mold of the two molds is, for example, a fixed mold that does not move, and the upper mold is a movable mold that can move up and down. After injecting the resin into the mold cavity with these two molds combined and the resin is cured, for example, the movable mold is moved and the molded resin is released and taken out. .
　また、略長方形状のプリント回路基板の一つの側縁部のコネクタ部を除く部分を封止するように樹脂を成形する必要があることから、例えば、固定金型にプリント回路基板をセットした状態で、可動金型を固定金型に合わせることになる。この際にコネクタ部は、樹脂に封止されないことから、金型のキャビティの外側に配置されることになる。すなわち、プリント回路基板のコネクタ部とその他の部分（配線パターンが設けられ、電子部品が実装される部分）である基板本体との境界までがキャビティ内で、コネクタ部がキャビティの外に配置される。 In addition, since it is necessary to mold the resin so as to seal a portion other than the connector portion on one side edge of the substantially rectangular printed circuit board, for example, a state where the printed circuit board is set in a fixed mold Thus, the movable mold is matched with the fixed mold. At this time, since the connector portion is not sealed by the resin, it is disposed outside the cavity of the mold. That is, the connector part of the printed circuit board and the other part (the part where the wiring pattern is provided and the electronic component is mounted) are arranged in the cavity up to the boundary between the connector part and the cavity part. .
　この場合に、樹脂に圧力をかけてキャビティに注入すると、プリント回路基板が位置ずれする可能性がある。例えば、プリント回路基板が傾いたり、プリント回路基板がキャビティから押し出されるように位置ずれしたりする可能性がある。この場合に、金型側とプリント回路基板とにそれぞれ互いに係合してプリント回路基板の位置を決めて保持する構造を設けることが考えられるが、成形時の反り防止のため、プリント回路基板をできるだけ小さくしたという要望があり、設計時にできるだけ最適なスペース効率となるように配置された配線パターンやコネクタ部の接続端子を避け、かつ、コネクタ部以外の部分全体を樹脂で封止した状態とするように、上述の位置を決めて保持する構造を配置することが困難であった。 In this case, if the resin is pressurized and injected into the cavity, the printed circuit board may be displaced. For example, the printed circuit board may be tilted or displaced so that the printed circuit board is pushed out of the cavity. In this case, it is conceivable to provide a structure in which the mold side and the printed circuit board are engaged with each other to determine and hold the position of the printed circuit board. There is a demand to make it as small as possible, avoid wiring patterns and connector connection terminals arranged to be as space efficient as possible at the time of design, and keep all parts other than the connector part sealed with resin As described above, it is difficult to arrange the structure for determining and holding the above-described position.
　本発明は、前記事情に鑑みて為されたものであり、配線パターンやコネクタ部の接続端子の配置に影響を及ぼすことなく、封止用樹脂の成形時に金型に対する位置を決める構造を有し、樹脂で封止されたプリント回路基板を備えるエンジンコントロールユニットを提供することを目的とする。 The present invention has been made in view of the above circumstances, and has a structure that determines the position with respect to the mold when molding the sealing resin without affecting the arrangement of the connection terminals of the wiring pattern and connector part. An object of the present invention is to provide an engine control unit including a printed circuit board sealed with a resin.
　前記目的を達成するために、本発明のエンジンコントロールユニットは、制御用の電子部品が実装されたプリント回路基板を備えるエンジンコントロールユニットであって、
　前記プリント回路基板の一つの側縁部に複数の接続端子が並んで設けられることにより前記側縁部がコネクタ部とされ、前記コネクタ部の両端部にそれぞれ被係止部が設けられ、前記プリント回路基板の前記コネクタ部を除く部分全体が樹脂で封止され、
　前記被係止部が、前記プリント回路基板を封止する前記樹脂を成形する際に、前記樹脂の成形に用いられる金型側の部材に係止されることにより、前記プリント回路基板が位置決めされるとともに前記樹脂の成形中に位置決めされた位置に保持されることを特徴とする。 In order to achieve the above object, an engine control unit of the present invention is an engine control unit including a printed circuit board on which electronic components for control are mounted,
By providing a plurality of connection terminals side by side on one side edge of the printed circuit board, the side edge becomes a connector part, and a locked part is provided at each end of the connector part. The entire part of the circuit board except the connector part is sealed with resin,
When the locked portion is molded by the member on the mold side used for molding the resin when the resin for sealing the printed circuit board is molded, the printed circuit board is positioned. And held at a position positioned during molding of the resin.
　このような構成によれば、プリント回路基板のコネクタ部を除く部分に封止用樹脂を成形する際に、コネクタ部が金型のキャビティの外側に出た状態となり、金型のキャビティ内に樹脂を注入した際に、プリント回路基板が傾いたり、コネクタ部側に押し出されたりする虞があるが、プリント回路基板のコネクタ部の左右端部の被係止部に金型側の部材が係止されることにより、プリント回路基板が位置決めされるとともに、位置決めされた位置に保持されるので、プリント回路基板に精度高く封止用の樹脂を成形することができる。 According to such a configuration, when the sealing resin is molded on the portion of the printed circuit board excluding the connector portion, the connector portion comes out of the cavity of the mold, and the resin is placed in the mold cavity. When the mold is injected, the printed circuit board may be tilted or pushed out to the connector side. However, the mold side member is locked to the locked parts at the left and right ends of the connector part of the printed circuit board. By doing so, the printed circuit board is positioned and held at the positioned position, so that the sealing resin can be molded on the printed circuit board with high accuracy.
　また、プリント回路基板を位置決するとともに位置決めされた位置に保持するための構造としての被係止部がプリント回路基板の樹脂によって封止されることがないコネクタ部の端部に形成されることから、被係止部がプリント回路基板の配線パターンや電子部品の配置の邪魔にならず、被係止部の配置を考慮することなく、配線パターンおよび電子部品の配置をできるだけスペース効率が良くなるように設計することができる。 Further, the locked portion as a structure for positioning the printed circuit board and holding it at the positioned position is formed at the end of the connector portion that is not sealed by the resin of the printed circuit board. The locked portion does not interfere with the layout of the printed circuit board wiring pattern and electronic components, and the arrangement of the wiring pattern and electronic components is made as space efficient as possible without considering the locked portion arrangement. Can be designed to
　また、コネクタ部においても、両端部の被係止部として例えば凹部（または凸部）が設けられるだけなので、形成可能な接続端子の数や接続端子の配置にほとんど影響がない。また、被係止部が樹脂に封止されないコネクタ部に設けられているので、被係止部を係止する金型側の部材がキャビティの外側に配置されることになり、被係止部を係止する金型側の部材が樹脂の成形の邪魔になることがない。 Also, in the connector portion, for example, only concave portions (or convex portions) are provided as locked portions at both ends, so that there is almost no influence on the number of connection terminals that can be formed and the arrangement of connection terminals. In addition, since the locked portion is provided in the connector portion that is not sealed with resin, the member on the mold side that locks the locked portion is disposed outside the cavity, and the locked portion The member on the mold side for locking the resin does not obstruct resin molding.
　本発明の上記構成において、前記コネクタ部には、このコネクタ部の両端の中心に対して偏心した位置に、凹部が設けられていることが好ましい。 In the above-described configuration of the present invention, it is preferable that the connector portion is provided with a recess at a position eccentric with respect to the centers of both ends of the connector portion.
　このような構成によれば、金型側に前記凹部に係合する部材を設けることで、金型にプリント回路基板をセットする際に、プリント回路基板の表裏を間違えるのを防止できる。
　すなわち、表裏を間違えると、金型側の凹部に係合する部材が邪魔になってプリント回路基板をセットできない。また、凹部は、プリント回路基板を封止する樹脂を成形する際に、プリント回路基板の位置決めと、位置決めされたプリント回路基板の位置の保持に用いることができる。 According to such a configuration, by providing the member that engages with the concave portion on the mold side, it is possible to prevent the printed circuit board from being mistaken when the printed circuit board is set in the mold.
That is, if the front and back sides are mistaken, the member that engages with the concave portion on the mold side becomes an obstacle and the printed circuit board cannot be set. The concave portion can be used for positioning the printed circuit board and holding the position of the printed circuit board when the resin for sealing the printed circuit board is molded.
　本発明によれば、エンジンコントロールユニットのプリント回路基板のコネクタ部を除く部分を樹脂で封止する場合に、金型に設置されるプリント回路基板のコネクタ部の両端部に被係止部を設けたことにより、金型に対するプリント回路基板の位置ずれを防止できる。 According to the present invention, when the portion other than the connector portion of the printed circuit board of the engine control unit is sealed with resin, the locked portions are provided at both ends of the connector portion of the printed circuit board installed in the mold. As a result, the positional deviation of the printed circuit board with respect to the mold can be prevented.
本発明の実施形態のＥＣＵのプリント回路基板を示す平面図である。It is a top view which shows the printed circuit board of ECU of embodiment of this invention. 前記ＥＣＵを示す斜視図である。It is a perspective view which shows the said ECU. 前記ＥＣＵを示す上面図である。It is a top view which shows the said ECU. 前記ＥＣＵを示す底面図である。It is a bottom view showing the ECU. 前記ＥＣＵを示す正面図である。It is a front view showing the ECU. 前記ＥＣＵを示す側面図である。It is a side view which shows the said ECU. 前記プリント回路基板を封止する樹脂を成形する一対の金型のうちの固定金型にプリント回路基板がセットされている状態を示す概略平面図である。It is a schematic plan view which shows the state by which the printed circuit board is set to the stationary metal mold | die of a pair of metal mold | die which shape | molds resin which seals the said printed circuit board. 前記プリント回路基板を封止する樹脂を成形する一対の金型を示す概略断面図である。It is a schematic sectional drawing which shows a pair of metal mold | die which shape | molds resin which seals the said printed circuit board.
　以下、本発明の実施の形態を図面を参照して説明する。
　この実施形態はＥＣＵは、例えば、エンジンを備えるエンジン装置としての車両のＦＩシステムで燃料噴射装置の燃料噴射タイミングおよび燃料の噴射量と、点火機構の点火時期とアイドル回転数（アイドルスピードコントロ－ルバルブ）を制御するＥＣＵである。このＥＣＵには、例えば、燃料噴射装置、燃料ポンプ、アイドルスピードコントロ－ルバルブの駆動装置、イグニッションコイルの駆動回路等の被制御装置が接続され、これらの制御のために、例えば、クランク角センサ、吸気温度センサ、吸気圧センサ、エンジン温度センサ、スロットルセンサ等のセンサが接続されている。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, the ECU is, for example, a vehicle FI system as an engine device including an engine, a fuel injection timing and a fuel injection amount of a fuel injection device, an ignition timing of an ignition mechanism, and an idling speed (idle speed control valve). ECU which controls). The ECU is connected to controlled devices such as a fuel injection device, a fuel pump, an idle speed control valve drive device, and an ignition coil drive circuit. For example, a crank angle sensor, Sensors such as an intake air temperature sensor, an intake air pressure sensor, an engine temperature sensor, and a throttle sensor are connected.
　このようなＥＣＵは、図１に示すプリント回路基板１を備え、図２～図６に示すように、このプリント回路基板１には、後述のコネクタ部２を除く部分を覆って封止するモールド樹脂３がトランスファ成形により設けられている。なお、図１には、図示されていないが、プリント回路基板１が、二つの側面を有し、各側面に回路パターンが形成されているとともに、電子部品が実装されている。なお、ここでは、プリント回路基板１の一方の側面を表面とし、他方の側面を裏面とする。なお、表面と裏面とを入れ替えてもよい。また、ＥＣＵもプリント回路基板と同様に表面と裏面とを有する。ＥＣＵにおいても、表面と裏面を入れ替えてもよい。 Such an ECU includes a printed circuit board 1 shown in FIG. 1. As shown in FIGS. 2 to 6, the printed circuit board 1 has a mold for covering and sealing a portion excluding a connector portion 2 described later. Resin 3 is provided by transfer molding. Although not shown in FIG. 1, the printed circuit board 1 has two side surfaces, a circuit pattern is formed on each side surface, and electronic components are mounted. Here, one side surface of the printed circuit board 1 is a front surface, and the other side surface is a back surface. Note that the front surface and the back surface may be interchanged. The ECU also has a front surface and a back surface, similar to the printed circuit board. Also in the ECU, the front surface and the back surface may be interchanged.
　プリント回路基板１は、４層基板であり、例えば、２つの露出する側面である２つの層と、内部の２層とを備え、露出している２つの層には、配線パターンが設けられるとともに電子部品が実装されている。内部の２層は、それぞれ電源およびグラウンド用のパターンを備える層となっている。 The printed circuit board 1 is a four-layer board. For example, the printed circuit board 1 includes two layers that are two exposed side surfaces and two inner layers, and a wiring pattern is provided on the two exposed layers. Electronic components are mounted. The inner two layers are layers having patterns for power supply and ground, respectively.
　プリント回路基板１は、略長方形（矩形）であり、短い辺に対して長い辺が例えば１．１倍以上となっており、この実施形態では、１．８倍程度（１．６倍から２倍程度）となっているが、それ以上の倍率であってもよい。 The printed circuit board 1 is substantially rectangular (rectangular), and a long side is, for example, 1.1 times or more with respect to a short side, and in this embodiment, about 1.8 times (from 1.6 times to 2 times). However, it may be larger than that.
　この略長方形のプリント回路基板１の長手方向に沿った側縁部（長い方の側縁部）の一つがコネクタ部２となっている。コネクタ部２には、その両面に、プリント回路基板１の長手方向に沿って複数の接続端子５が等間隔に並んで設けられている。また、プリント回路基板１のコネクタ部２の左右には、半円状の切欠部８（凹部：被係止部）が設けられ、この切欠部８からプリント回路基板１のコネクタ部２側の側縁までがコネクタ部２とされ、モールド樹脂３から露出するようになっている。なお、この切欠部８は、後述するようにモールド樹脂３の成形時に用いられる。 One side edge portion (long side edge portion) along the longitudinal direction of the substantially rectangular printed circuit board 1 is a connector portion 2. The connector portion 2 is provided with a plurality of connection terminals 5 arranged at equal intervals along the longitudinal direction of the printed circuit board 1 on both sides thereof. Also, semicircular cutouts 8 (recesses: locked portions) are provided on the left and right sides of the connector part 2 of the printed circuit board 1, and the side of the printed circuit board 1 on the connector part 2 side from the cutout part 8. The connector portion 2 extends to the edge and is exposed from the mold resin 3. The notch 8 is used when the mold resin 3 is molded as will be described later.
　また、コネクタ部２には、プリント回路基板１の長手方向の中央部の近傍で、中央から少しずれた位置に、コネクタ部２の側縁側に開放し、プリント回路基板１の長手方向と直交する方向に沿って長いスリット（凹部）６が設けられている。なお、スリット６の長手方向は、コネクタ部２を車両側コネクタに接続する際のＥＣＵの移動方向に沿っている。スリット６のプリント回路基板１の長手方向に沿った幅は、接続端子５が一つ配置可能な長さとなっているが、スリット６があるので、接続端子５が配置されず、このスリット６を挟んで配置される接続端子５どうしの間隔は、他の部分より長くなっている。また、コネクタ部２はプリント回路基板１の一部として板状の部材であり、コネクタ部２の両面（表裏面）にそれぞれ設けられる接続端子５は、例えば、銅メッキ等の金属の薄膜であり、コネクタ部２の表裏面に固定されている。 Further, the connector part 2 is opened to the side edge side of the connector part 2 at a position slightly deviated from the center in the vicinity of the center part in the longitudinal direction of the printed circuit board 1 and is orthogonal to the longitudinal direction of the printed circuit board 1. A long slit (concave portion) 6 is provided along the direction. In addition, the longitudinal direction of the slit 6 is along the moving direction of ECU when connecting the connector part 2 to a vehicle side connector. The width of the slit 6 along the longitudinal direction of the printed circuit board 1 is such that one connection terminal 5 can be arranged. However, since the slit 6 exists, the connection terminal 5 is not arranged, and the slit 6 The interval between the connection terminals 5 arranged so as to be sandwiched is longer than that of the other portions. Moreover, the connector part 2 is a plate-shaped member as a part of the printed circuit board 1, and the connection terminals 5 provided on both surfaces (front and back surfaces) of the connector part 2 are, for example, metal thin films such as copper plating. The front and back surfaces of the connector part 2 are fixed.
　なお、スリット６は、プリント回路基板１へのモールド樹脂３の成形時や、プリント回路基板１のコネクタ部２の車両側コネクタへの接続時に、プリント回路基板１の表裏面を判別できるように、コネクタ部２のプリント回路基板１の長手方向の中央に対して少しずれた位置にオフセットして配置されている。すなわち、スリット６は、コネクタ部２の切欠部８を有する両端部の中心となる位置に対して偏心して設けられている。 In addition, the slit 6 can distinguish the front and back surfaces of the printed circuit board 1 when molding the mold resin 3 on the printed circuit board 1 or when connecting the connector portion 2 of the printed circuit board 1 to the vehicle side connector. The connector part 2 is arranged offset at a position slightly shifted from the longitudinal center of the printed circuit board 1. That is, the slit 6 is provided eccentrically with respect to a position that is the center of both end portions having the notch portion 8 of the connector portion 2.
　コネクタ部２以外の部分は、図２～図６に示すように、モールド樹脂３で覆われている。プリント回路基板１のコネクタ部２以外の部分といての基板本体９は、その表裏面に配線パターンが形成されているとともに、電子部品が実装されている。この基板本体９がモールド樹脂３により覆われて封止されている。 The portions other than the connector portion 2 are covered with the mold resin 3 as shown in FIGS. The printed circuit board 1 has a board body 9 as a part other than the connector part 2 having wiring patterns formed on the front and back surfaces and electronic components mounted thereon. The substrate body 9 is covered and sealed with the mold resin 3.
　モールド樹脂３内部は、基本的にできるだけ空隙がないように成形され、すなわち、中実に成形されている。モールド樹脂３は、プリント回路基板１のコネクタ部２を除く部分の表裏面とコネクタ部２を除く、三つの側縁部を覆うように形成されている。 The inside of the mold resin 3 is basically molded so that there is no gap as much as possible, that is, it is molded solidly. The mold resin 3 is formed so as to cover the front and back surfaces of the printed circuit board 1 excluding the connector portion 2 and the three side edges excluding the connector portion 2.
　モールド樹脂３は、肉厚の板状に成形されるとともに、プリント回路基板の短い側の側縁部の側面が略半円柱状に湾曲した形状とされている。したがって、モールド樹脂３をプリント回路基板１のコネクタ部２が露出する正面側から見ると、左右の側面が半円状になっている。
　また、モールド樹脂３の厚さの略半分となる位置にプリント回路基板が配置されている。 The mold resin 3 is formed into a thick plate shape, and the side surface of the short side edge portion of the printed circuit board is curved into a substantially semi-cylindrical shape. Therefore, when the mold resin 3 is viewed from the front side where the connector portion 2 of the printed circuit board 1 is exposed, the left and right side surfaces are semicircular.
A printed circuit board is disposed at a position that is approximately half the thickness of the mold resin 3.
　また、モールド樹脂３の表面（上面）には、ＥＣＵのコネクタ部２が接続される車両側コネクタ（図示略）に設けられ、ＥＣＵのモールド樹脂３の外周を覆う筒状のカバーの係止孔に係止される係止用凸部７が設けられている。これにより、ＥＣＵのコネクタ部２が車両側コネクタから外れないようにされている。 Further, a locking hole of a cylindrical cover provided on a vehicle-side connector (not shown) to which the connector portion 2 of the ECU is connected is provided on the surface (upper surface) of the mold resin 3 and covers the outer periphery of the mold resin 3 of the ECU. A locking convex portion 7 is provided to be locked to. Thereby, the connector part 2 of ECU is prevented from being detached from the vehicle side connector.
　また、モールド樹脂３の左右側面には、それぞれ、前記カバーの内周面に設けられ、カバー内へのＥＣＵの挿入をガイドするためのガイド部にガイドされるリブ状のガイド凸部１２が設けられている。また、モールド樹脂３の表面に一対の凸部１０が設けられ、モールド樹脂３の裏面に一対の凸部１１が設けられ、これら凸部１０，１１と上述のガイド凸部１２は、カバーの内周面に略当接した状態とされている。これら凸部１０，１１．と、ガイド凸部１２と、係止用凸部７とにより、カバー内のＥＣＵの移動（振れ）が規制されている。 Further, on the left and right side surfaces of the mold resin 3, rib-shaped guide convex portions 12 are provided on the inner peripheral surface of the cover and guided by a guide portion for guiding the insertion of the ECU into the cover. It has been. Further, a pair of convex portions 10 are provided on the surface of the mold resin 3, and a pair of convex portions 11 are provided on the back surface of the mold resin 3, and these convex portions 10, 11 and the above-described guide convex portion 12 are arranged inside the cover. It is in a state of being substantially in contact with the peripheral surface. These convex portions 10, 11. The movement of the ECU in the cover (swing) is regulated by the guide convex portion 12 and the locking convex portion 7.
　このようなＥＣＵにおいて、プリント回路基板１の基板本体９を封止する樹脂の成形方法を説明する。 A resin molding method for sealing the board body 9 of the printed circuit board 1 in such an ECU will be described.
　図７はプリント回路基板１がセットされた下側の固定金型２２の概略を示し、図８は、プリント回路基板１をセットした状態で、下の固定金型２２と上の可動金型２１とを合わせ、これら金型２１．２２のキャビティ２３，２４内に樹脂を注入した状態の概略を示している。 FIG. 7 schematically shows the lower fixed mold 22 on which the printed circuit board 1 is set, and FIG. 8 shows the lower fixed mold 22 and the upper movable mold 21 with the printed circuit board 1 set. The outline of the state in which resin is injected into the cavities 23 and 24 of these molds 21.22 is shown.
　図８に示すように、プリント回路基板１のコネクタ部２を除く基板本体９を樹脂により封止する際に、一対の金型２１，２２を用いて周知のトランスファ成形を行う。これにより、プリント回路基板１にモールド樹脂３が形成される。ここでは、下側の金型２２が移動しない固定の金型２２であり、上側の金型２１が、成形された樹脂を離型する際に下側の金型２２に被せられた状態から上方に移動することにより、金型からプリント回路基板１にモールド樹脂３を形成したＥＣＵを取り出すことができる。 As shown in FIG. 8, when the substrate body 9 excluding the connector portion 2 of the printed circuit board 1 is sealed with resin, a well-known transfer molding is performed using a pair of molds 21 and 22. Thereby, the mold resin 3 is formed on the printed circuit board 1. Here, the lower mold 22 is a fixed mold 22 that does not move, and the upper mold 21 is moved upward from a state in which the lower mold 22 is covered when the molded resin is released. It is possible to take out the ECU in which the mold resin 3 is formed on the printed circuit board 1 from the mold.
　また、例えば、図７に示すように下側の金型２２にプリント回路基板１をセットして、上側の金型２１と下側の金型２２を合わせた状態で、上側の金型２１のキャビティ２３と下側の金型２２のキャビティ２４が合わさり、モールド樹脂３と同じ形状の空間が形成される。この空間にモールド樹脂３となる樹脂を注入することでモールド樹脂３を成形することができる。 Further, for example, as shown in FIG. 7, the printed circuit board 1 is set on the lower mold 22, and the upper mold 21 and the lower mold 22 are combined, and the upper mold 21 is The cavity 23 and the cavity 24 of the lower mold 22 are combined to form a space having the same shape as the mold resin 3. The mold resin 3 can be molded by injecting a resin to be the mold resin 3 into this space.
　図７に示すように、プリント回路基板１のモールド樹脂３から露出した状態になるコネクタ部２の両端部には切欠部８が設けられている。また、コネクタ部２の一対の前記切欠部８どうしの略中央には、スリット６が設けられている。スリット６は、上述のようにコネクタ部２の切欠部８が設けられた両端部の中心に対して偏心した位置に配置されている。 As shown in FIG. 7, notches 8 are provided at both ends of the connector portion 2 exposed from the mold resin 3 of the printed circuit board 1. A slit 6 is provided in the approximate center between the pair of cutout portions 8 of the connector portion 2. As described above, the slit 6 is disposed at a position that is eccentric with respect to the center of both ends where the notch 8 of the connector 2 is provided.
　このようなプリント回路基板１に対して、下側の固定の金型２２には、コネクタ部２が配置され、キャビティ２４の外側となる側に、コネクタ部２の切欠部８に対応する部分に、半円状の切欠部８と略同様の径を有する係合部２６が設けられ、この係合部２６が半円状の切欠部８内に挿入された状態となることで、コネクタ部２の位置が決められる。 With respect to such a printed circuit board 1, the connector portion 2 is disposed in the lower fixed mold 22, and on the outer side of the cavity 24, the portion corresponding to the notch portion 8 of the connector portion 2. An engagement portion 26 having a diameter substantially the same as that of the semicircular cutout portion 8 is provided, and the engagement portion 26 is inserted into the semicircular cutout portion 8, thereby the connector portion 2. Is determined.
　また、コネクタ部２のスリット６の位置には、スリット６の基端側（基板本体９側）の部分に樹脂が充填され、かつ、この部分から樹脂が漏出しないように塞ぐとともに、スリット６に係合する係合部２８が設けられている。このように、例えば、下側の金型２２の上で、左右それぞれの切欠部８に対応して金型２２に左右それぞれの係合部２６が配置され、スリット６に対応して金型２２に係合部２８が配置されるようにすることにより、金型２２上にプリント回路基板１を位置決めして配置することができる。 Further, at the position of the slit 6 of the connector portion 2, resin is filled in a portion on the base end side (substrate body 9 side) of the slit 6, and the resin is closed so as not to leak from this portion. An engaging portion 28 to be engaged is provided. Thus, for example, on the lower mold 22, the left and right engaging portions 26 are disposed on the mold 22 corresponding to the left and right cutout portions 8, and the mold 22 is configured corresponding to the slit 6. Thus, the printed circuit board 1 can be positioned and disposed on the mold 22 by arranging the engaging portion 28 on the mold 22.
　この状態では、プリント回路基板１のコネクタ部２の反対側となる側縁部側を支持する部材が無いので、プリント回路基板１のコネクタ部２の反対側が自重で下がってプリント回路基板１が斜めになる虞がある。 In this state, since there is no member that supports the side edge portion side opposite to the connector portion 2 of the printed circuit board 1, the opposite side of the connector portion 2 of the printed circuit board 1 is lowered by its own weight, and the printed circuit board 1 is inclined. There is a risk of becoming.
　しかし、二つの金型２１，２２を合わせた状態で、プリント回路基板１のコネクタ部２がキャビティ２３，２４の外側に出る状態なので、コネクタ部２の少なくとも基端側が二つの金型２１，２２に挟まれた状態となり、プリント回路基板１が水平な状態に保持される。 However, since the connector part 2 of the printed circuit board 1 protrudes outside the cavities 23 and 24 in a state where the two molds 21 and 22 are combined, at least the base end side of the connector part 2 has two molds 21 and 22. The printed circuit board 1 is held in a horizontal state.
　このようにプリント回路基板１を金型２２にセットした状態で上下の金型２１，２２を合わせ、キャビティ２３，２４内にプランジャから例えば、スプルー、ランナー、ゲートを介して樹脂を注入する。この際に、プリント回路基板１に樹脂からの圧力が作用するが、プリント回路基板１のコネクタ部２の左右両端部の切欠部８に金型２２の係合部２６が係合し、コネクタ部２の略中央部のスリット６に係合部２８が係合し、さらに、コネクタ部２が上下の金型２１，２２に挟まれた状態なので、プリント回路基板１は、上述のように位置決めされた状態で保持される。 With the printed circuit board 1 set in the mold 22 as described above, the upper and lower molds 21 and 22 are combined, and the resin is injected into the cavities 23 and 24 from the plunger through, for example, sprues, runners, and gates. At this time, pressure from the resin acts on the printed circuit board 1, but the engaging portions 26 of the mold 22 are engaged with the notches 8 on both the left and right ends of the connector portion 2 of the printed circuit board 1, and the connector portion Since the engagement portion 28 is engaged with the slit 6 at the substantially central portion 2 and the connector portion 2 is sandwiched between the upper and lower molds 21 and 22, the printed circuit board 1 is positioned as described above. It is held in the state.
　したがって、成形されたモールド樹脂３に対して、プリント回路基板１の位置がずれるのを防止することができる。また、プリント回路基板１を位置決めしているのが、配線パターンが形成されるとともに電子部品が実装されるプリント回路基板１の基板本体９ではなく、コネクタ部２の左右端部の切欠部８とコネクタ部２の略中央部のスリット６であり、これら切欠部８およびスリット６に係合する金型２２側の係合部２６、２８も、キャビティ２３，２４の外側に配置される。 Therefore, it is possible to prevent the position of the printed circuit board 1 from deviating from the molded mold resin 3. The printed circuit board 1 is positioned not with the board body 9 of the printed circuit board 1 on which the wiring pattern is formed and the electronic components are mounted, but with the notch portions 8 at the left and right ends of the connector portion 2 The slit 6 in the substantially central portion of the connector portion 2, and the engaging portions 26 and 28 on the mold 22 side that engage with the notch 8 and the slit 6 are also arranged outside the cavities 23 and 24.
　したがって、プリント回路基板１を金型２１，２２に対して位置決めする構造がプリント回路基板１の基板本体９の配線パターンや電子部品の実装位置に影響を与えることがなく、できるだけ最適な配置となるように、配線パターンや電子部品の配置を決めることができる。 Therefore, the structure for positioning the printed circuit board 1 with respect to the molds 21 and 22 does not affect the wiring pattern of the board body 9 of the printed circuit board 1 and the mounting position of the electronic components, and the arrangement is as optimal as possible. As described above, the arrangement of the wiring pattern and the electronic component can be determined.
　また、コネクタ部２の中央から偏心した位置にあるスリット６を係合部２８に係合する際には、プリント回路基板１の表と裏の配置が合っている必要がある。すなわち、金型２２にプリント回路基板１をセットする際に、表裏が逆になっていると、スリット６に挿入された状態となる係合部２８の位置がスリット６と合わず、プリント回路基板１をセットできない。 Also, when the slit 6 located at a position eccentric from the center of the connector portion 2 is engaged with the engaging portion 28, the front and back of the printed circuit board 1 must be aligned. That is, when the printed circuit board 1 is set on the mold 22, if the front and back sides are reversed, the position of the engaging portion 28 that is inserted into the slit 6 does not match the slit 6, and the printed circuit board 1 cannot be set.
　スリット６は、その基端側がキャビティ２３，２４に入り込んでいるが、スリット６に係合する係合部２８はキャビティ２３，２４の外にあり、モールド樹脂３の成形に際し、スリット６の基端部に樹脂が入り込むようになっている。これにより、モールド樹脂３からプリント回路基板１がコネクタ部２側に移動するのが規制される。すなわち、モールド樹脂３は、略長方形のプリント回路基板１のコネクタ部２となる側縁部を除く３つの側縁部を覆うように形成されているのに対して、コネクタ部２となる側縁部が露出しているので、例えば、モールド樹脂３に対して、プリント回路基板１をコネクタ側に引き出すような力がかかると、プリント回路基板１上に実装された電子部品に余計な力（例えばせん断力）が作用してしまう恐れがある。 Although the base end side of the slit 6 enters the cavities 23 and 24, the engaging portion 28 that engages the slit 6 is outside the cavities 23 and 24, and the base end of the slit 6 is formed when the mold resin 3 is molded. Resin enters the part. This restricts the printed circuit board 1 from moving from the mold resin 3 to the connector portion 2 side. That is, the mold resin 3 is formed so as to cover three side edges excluding the side edge that becomes the connector portion 2 of the substantially rectangular printed circuit board 1, whereas the side edge that becomes the connector portion 2. For example, when a force is applied to the mold resin 3 to pull the printed circuit board 1 to the connector side, an extra force (for example, the electronic component mounted on the printed circuit board 1 (for example, There is a risk of shearing force) acting.
　この実施形態では、プリント回路基板１のコネクタ部２のスリット６の基端側の部分でプリント回路基板１の表面を覆う樹脂と、裏面を覆う樹脂とが一体に接合された状態となっており、このスリット６内で硬化した樹脂により、上述のようなプリント回路基板１を引き出すような力を受けた場合に、この力をスリット６内のモールド樹脂部分から表裏のモールド樹脂３に伝達することができる。したがって、プリント回路基板１に実装された部品に応力が作用するのを抑制することができる。 In this embodiment, the resin that covers the front surface of the printed circuit board 1 and the resin that covers the back surface are integrally joined at the base end side portion of the slit 6 of the connector portion 2 of the printed circuit board 1. When the resin cured in the slit 6 receives a force for pulling out the printed circuit board 1 as described above, this force is transmitted from the mold resin portion in the slit 6 to the front and back mold resins 3. Can do. Therefore, it is possible to suppress the stress from acting on the component mounted on the printed circuit board 1.
　なお、図７において係合部２６を円柱状に描いたが、係合部２６は必ずしも円柱状の必要はなく、半円状の切欠部８内に入り込んで、プリント回路基板１の位置決めと、移動防止を行うことが可能な構成になっていればよい。
　また、一対の金型２１，２２を上下に配置し、下側の金型２２を固定で上側の金型を可動としたが、上下を逆にしてもよいし、固定と可動とを入れ替えてもよい。 In FIG. 7, the engaging portion 26 is drawn in a columnar shape, but the engaging portion 26 is not necessarily a columnar shape, and enters the semicircular cutout portion 8 to position the printed circuit board 1. It suffices if the configuration can prevent the movement.
Moreover, although a pair of metal mold | dies 21 and 22 were arrange | positioned up and down, the lower metal mold | die 22 was fixed and the upper metal mold | die was movable, it may be made upside down, and fixed and movable are replaced Also good.
　また、一対の金型２１，２２を上下ではなく、左右に配置し、一方の金型２１，２２を固定とし、他方の金型２１，２２を可動としてもよい。この場合に金型２２にプリント回路基板１をセットする際に、コネクタ部２側を上とすれば、セット時にプリント回路基板１が自重により傾くのを防止できる。 Alternatively, the pair of molds 21 and 22 may be arranged on the left and right instead of the upper and lower sides, one mold 21 and 22 may be fixed, and the other mold 21 and 22 may be movable. In this case, when the printed circuit board 1 is set on the mold 22, if the connector portion 2 side is set upward, the printed circuit board 1 can be prevented from being inclined due to its own weight during setting.
　この発明のＥＣＵは、車両で用いられる以外に、例えば、草刈り機、チェーンソー、農薬散布機、自家発電機等の各種汎用機でエンジン制御に用いることが可能である。 The ECU of the present invention can be used for engine control in various general-purpose machines such as mowers, chainsaws, agricultural chemical spreaders, and private power generators, in addition to being used in vehicles.
１　　　プリント回路基板
２　　　コネクタ部
３　　　モールド樹脂（封止樹脂）
５　　　接続端子
６　　　スリット（凹部）
８　　　切欠部（被係止部）
２１　　金型（上側）
２２　　金型（下側）
２６　　係合部（金型側の切欠部を係止する部材） DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Connector part 3 Mold resin (sealing resin)
5 Connection terminal 6 Slit (recess)
8 Notch (locked part)
21 Mold (upper side)
22 Mold (lower side)
26 Engaging part (member for locking the notch part on the mold side)

Claims (2)

  1. 　制御用の電子部品が実装されたプリント回路基板を備えるエンジンコントロールユニットであって、
    　前記プリント回路基板の一つの側縁部に複数の接続端子が並んで設けられることにより前記側縁部がコネクタ部とされ、前記コネクタ部の両端部にそれぞれ被係止部が設けられ、前記プリント回路基板の前記コネクタ部を除く部分全体が樹脂で封止され、
    　前記被係止部が、前記プリント回路基板を封止する前記樹脂を成形する際に、前記樹脂の成形に用いられる金型側の部材に係止されることにより、前記プリント回路基板が位置決めされるとともに前記樹脂の成形中に位置決めされた位置に保持されることを特徴とするエンジンコントロールユニット。     An engine control unit comprising a printed circuit board on which electronic components for control are mounted,
    By providing a plurality of connection terminals side by side on one side edge of the printed circuit board, the side edge becomes a connector part, and a locked part is provided at each end of the connector part. The entire part of the circuit board except the connector part is sealed with resin,
    When the locked portion is molded by the member on the mold side used for molding the resin when the resin for sealing the printed circuit board is molded, the printed circuit board is positioned. And an engine control unit that is held at a position positioned during molding of the resin.
  2. 　前記コネクタ部には、このコネクタ部の両端の中心に対して偏心した位置に、凹部が設けられていることを特徴とする請求項１に記載のエンジンコントロールユニット。 2. The engine control unit according to claim 1, wherein the connector portion is provided with recesses at positions eccentric with respect to the centers of both ends of the connector portion.
PCT/JP2013/064697 2012-05-31 2013-05-28 Engine control unit WO2013180092A1 (en)

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JPS59203382A (en) * 1983-05-02 1984-11-17 キヤノン電子株式会社 Conversion connector
JPS63239093A (en) * 1987-03-27 1988-10-05 日本電気株式会社 Card module
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