WO2013174033A1 - 电路板、led灯条及led灯条的制造方法 - Google Patents

电路板、led灯条及led灯条的制造方法 Download PDF

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Publication number
WO2013174033A1
WO2013174033A1 PCT/CN2012/076315 CN2012076315W WO2013174033A1 WO 2013174033 A1 WO2013174033 A1 WO 2013174033A1 CN 2012076315 W CN2012076315 W CN 2012076315W WO 2013174033 A1 WO2013174033 A1 WO 2013174033A1
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Prior art keywords
circuit board
led light
light source
light bar
coated
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PCT/CN2012/076315
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English (en)
French (fr)
Inventor
黄冲
萧宇均
郭仪正
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深圳市华星光电技术有限公司
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Priority to US13/519,352 priority Critical patent/US20130314910A1/en
Publication of WO2013174033A1 publication Critical patent/WO2013174033A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the invention relates to the field of optoelectronics, and in particular to a method for manufacturing a circuit board, an LED light bar and an LED light bar.
  • LED light source is widely used in various lighting fields due to its long working life, low power consumption, fast response, small size, etc., especially in backlights used in liquid crystal displays.
  • an LED light source is fixed on a circuit board to form a light bar, and then the light bar is fixed on an aluminum extruded or aluminum back plate.
  • the main heat dissipation method of the circuit board is to conduct the heat generated by the LED light source to the aluminum extrusion or aluminum back plate, and then dissipate heat through the aluminum extrusion or aluminum back plate.
  • the heat dissipation effect of this design method does not achieve the best heat dissipation effect.
  • the technical problem to be solved by the present invention is to provide a method for manufacturing a circuit board, an LED light bar and an LED light bar, which can improve the heat dissipation effect of the LED light source mounted on the circuit board.
  • a technical solution adopted by the present invention is to provide an LED light bar comprising a circuit board and an LED light source fixed on the circuit board.
  • the circuit board is a metal-based printed circuit board and at least part of its surface is coated with a white heat-dissipating lacquer.
  • the white heat dissipating paint is applied to the surface of the circuit board for carrying the LED light source.
  • the surface of the circuit board is all coated with a white heat-dissipating paint.
  • the white heat dissipating paint is further coated on at least part of the surface of the LED light source.
  • the LED light source comprises a bracket, an LED chip disposed on the bracket, and a pin disposed on the bracket for supplying power to the LED chip, and the white heat dissipating paint is coated on the surface of the bracket and the lead.
  • another technical solution adopted by the present invention is to provide a circuit board for fixing an LED light source, at least part of the surface of the circuit board is coated with a radiation heat dissipation material.
  • the circuit board is a metal-based printed circuit board.
  • the radiation heat dissipation material is coated on the surface of the circuit board for carrying the LED light source.
  • the surface of the circuit board is entirely coated with a radiation heat dissipation material.
  • another technical solution adopted by the present invention is to provide a method for manufacturing an LED light bar, comprising: applying a radiation heat dissipation material to at least part of a surface of the circuit board; and fixing the LED light source to the circuit board.
  • the circuit board of the present invention is at least partially coated with a radiation heat dissipating material, which can improve the heat dissipation effect of the circuit board, thereby improving the heat dissipation of the LED light source mounted on the circuit board. effect.
  • FIG. 1 is a plan view of a circuit board according to a first embodiment of the present invention
  • Figure 2 is a plan view of an LED light bar according to a second embodiment of the present invention.
  • Figure 3 is a side elevational view of an LED light bar of a third embodiment of the present invention.
  • Figure 4 is a side view of an LED light bar of a fourth embodiment of the present invention.
  • Figure 5 is a side elevational view of an LED light bar of a fifth embodiment of the present invention.
  • Figure 6 is a flow chart showing a method of manufacturing an LED light bar according to a sixth embodiment of the present invention.
  • Fig. 7 is a flow chart showing a method of manufacturing an LED light bar according to a seventh embodiment of the present invention.
  • Figure 1 is a plan view of a circuit board in accordance with a first embodiment of the present invention.
  • part of the surface of the circuit board 110 is coated with radiation heat dissipating materials 120, 121.
  • the circuit board 110 is used to fix an LED light source (not shown), and the radiation heat dissipating materials 120 and 121 are used to improve the heat dissipation effect of the circuit board 110, thereby improving the heat dissipation effect of the LED light source mounted on the circuit board 110.
  • the radiation heat dissipating materials 120, 121 are applied to a partial region of the circuit board 110 for carrying the surface of the LED light source.
  • the radiant heat sink material 120 may be entirely coated on one or more surfaces of the circuit board 110.
  • Figure 2 is a plan view of an LED light bar in accordance with a second embodiment of the present invention.
  • part of the surface of the circuit board 210 is coated with radiation heat dissipating materials 220, 221.
  • the radiation heat dissipating materials 220, 221 are applied in the same manner as the radiation heat dissipating materials 120, 121 in the first embodiment.
  • the LED light sources 230, 231 are respectively fixed to the circuit board 210.
  • the LED light source 230 is partially disposed on the radiation heat dissipating material 220, and the LED light source 231 is disposed on the radiation heat dissipating material 221, and the above two methods can improve the heat dissipation effect of the LED light sources 230 and 231 on the circuit board 210.
  • the LED light source can also be fixed to other areas than the radiation heat dissipating materials 220, 221.
  • the circuit boards 110, 210 are preferably metal-based printed circuit boards (MCPCBs).
  • the metal-based printed circuit board itself has a certain thermal conductivity, and the radiation-dissipating material is applied at any position, which enhances the heat dissipation performance, improves the heat dissipation efficiency, and further improves the heat dissipation effect of the LED light source mounted thereon.
  • FIG. 3 there is shown a side view of an LED light bar in accordance with a third embodiment of the present invention.
  • the radiation heat dissipating material 320 is previously coated on the surface of the circuit board 310 for carrying the LED light source 330, and the radiation heat dissipating material 320 is entirely coated on the surface of the circuit board 310, which simplifies the coating complexity. degree.
  • the LED light source 330 is then fixed to the radiation heat sink material 320.
  • FIG. 4 there is shown a side view of an LED light bar in accordance with a fourth embodiment of the present invention.
  • the radiation heat dissipating material 420 is further coated on the other surface opposite to the surface except for being applied to the surface of the circuit board 410 for carrying the LED light source 430.
  • the LED light source 530 is pre-fixed to the circuit board 510, and the radiation heat dissipating material 520 is further coated on the circuit board 510 such that the radiation heat dissipating material 520 is further on at least a portion of the surface of the LED light source 530.
  • the LED light source 530 generally includes a bracket 531, an LED chip 532 disposed on the bracket 531, and a pin 533 disposed on the bracket 531 for supplying power to the LED chip 532.
  • the radiation heat dissipating material 520 is preferably coated on the surfaces of the holder 531 and the leads 532.
  • Figure 6 is a diagram of a method of fabricating an LED light bar in accordance with a sixth embodiment of the present invention.
  • the method for manufacturing the LED light bar includes:
  • step S11 the radiation heat dissipating material is coated on at least a portion of the surface of the circuit board.
  • step S12 the LED light source is fixed to the circuit board.
  • Figure 7 is a diagram of a method of fabricating an LED light bar in accordance with a seventh embodiment of the present invention.
  • the method for manufacturing the LED light bar includes:
  • step S21 the LED light source is fixed to the circuit board.
  • step S22 the radiation heat dissipating material is coated on at least a portion of the surface of the circuit board.
  • the radiation heat dissipating material may be further applied to at least a portion of the surface of the LED light source.
  • the circuit board, the LED light source, and the radiation heat dissipation material can refer to the first to fifth embodiments, and details are not described herein again.
  • the manufacturing method of the circuit board, the LED light bar and the LED light bar of the invention can improve the heat dissipation effect of the circuit board by coating the radiation heat dissipation material on at least part of the surface of the circuit board, thereby improving the mounting on the circuit board.
  • the heat dissipation effect of the LED light source can improve the heat dissipation effect of the LED light source.

Abstract

一种LED灯条及其制造方法，该LED灯条包括电路板（110，210，310，410，510）以及固定在电路板（110，210，310，410，510）上的LED光源（230，330，430，530）。电路板（110，210，310，410，510）的至少部分表面涂布有辐射散热材料（120，121，220，221，320，420，520），并且LED光源（230，330，430，530）的至少部分表面上涂布有辐射散热材料（120，121，220，221，320，420，520）。该LED灯条的制造方法包括步骤：将散热辐射材料（120，121，220，221，320，420，520）涂布于电路板（110，210，310，410，510）的至少部分表面，将LED光源（230，330，430，530）固定于电路板（110，210，310，410，510）上。通过在电路板（110，210，310，410，510）的至少部分表面以及LED光源（230，330，430，530）的至少部分表面涂布辐射散热材料（120，121，220，221，320，420，520），提高电路板（110，210，310，410，510）以及LED光源（230，330，430，530）的散热效果。

Description

电路板、LED灯条及LED灯条的制造方法
【技术领域】
本发明涉及光电领域，特别是涉及一种电路板、LED灯条及LED灯条的制造方法。
【背景技术】
LED光源因其工作寿命长、耗电低、响应快、体积小等优点，广泛应用于各个照明领域，尤其是被大量应用于液晶显示器的背光源中。在现有技术中，将LED光源固定于电路板上形成灯条，然后将灯条固定于铝挤或铝背板上。但是，电路板的主要散热方式是将LED光源产生的热传导至铝挤或铝背板上，再通过铝挤或铝背板进行散热。但是，由于电路板自身导热性能的限制，此种设计方式的散热效果并未达到最佳的散热效果。
【发明内容】
本发明主要解决的技术问题是提供一种电路板、LED灯条及LED灯条的制造方法，能够提高安装在电路板上的LED光源的散热效果。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种LED灯条，包括电路板以及固定于电路板上的LED光源。电路板为金属基印刷电路板，并且其至少部分表面涂布有白色散热漆。
其中，白色散热漆涂布于电路板的用于承载LED光源的表面。
其中，电路板的表面全部涂布有白色散热漆。
其中，白色散热漆进一步涂布于LED光源的至少部分表面上。
其中，LED光源包括支架、设置于支架上的LED芯片以及设置于支架上且用于为LED芯片供电的引脚，白色散热漆涂布于支架和引脚的表面上。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种电路板，用于固定LED光源，电路板的至少部分表面涂布有辐射散热材料。
其中，电路板为金属基印刷电路板。
其中，辐射散热材料涂布于电路板的用于承载LED光源的表面。
其中，电路板的表面全部涂布有辐射散热材料。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种LED灯条的制造方法，包括：将辐射散热材料涂布于电路板的至少部分表面上；将LED光源固定于电路板。
本发明的有益效果是：区别于现有技术的情况，本发明的电路板上至少部分涂布有辐射散热材料，能够提高电路板的散热效果，进而提高安装在电路板上的LED光源的散热效果。
【附图说明】
图1是本发明第一实施例的电路板的俯视图；
图2是本发明第二实施例的LED灯条的俯视图；
图3是本发明第三实施例的LED灯条的侧视图；
图4是本发明第四实施例的LED灯条的侧视图；
图5是本发明第五实施例的LED灯条的侧视图；
图6是本发明第六实施例的LED灯条的制造方法的流程图；
图7是本发明第七实施例的LED灯条的制造方法的流程图。
【具体实施方式】
参阅图1，图1是本发明第一实施例的电路板的俯视图。在本实施例中，电路板110的部分表面涂布有辐射散热材料120、121。电路板110用于固定LED光源（未图示），辐射散热材料120、121则用于提高电路板110的散热效果，进而提高安装在电路板110上的LED光源的散热效果。在本实施例中，辐射散热材料120、121涂布于电路板110的用于承载LED光源的表面的部分区域。然而，在其他实施例中，可以在电路板110的一个或多个表面全部涂布辐射散热材料120。
参阅图2，图2是本发明第二实施例的LED灯条的俯视图。在本实施例中，电路板210的部分表面涂布有辐射散热材料220、221。在本实施例中，辐射散热材料220、221的涂布方式与第一实施例中的辐射散热材料120、121的涂布方式相同。
LED光源230、231分别固定于电路板210上。其中，LED光源230部分设置于辐射散热材料220上，而LED光源231则全部设置于辐射散热材料221上，上述两种方式都能够提高在电路板210上的LED光源230、231的散热效果。当然，在其他实施例中，LED光源也可以固定于辐射散热材料220、221之外的其他区域。为了保证LED光源230、231的出光不受影响，因此优选使用白色散热漆作为辐射散热材料220、221。
在上述两个实施例中，电路板110、210优选为金属基印刷电路板（MCPCB）。金属基印刷电路板本身便有一定的导热能力，无论在任何位置涂布辐射散热材料，均会增强其散热性能，提高其散热效率，进一步提高安装于其上的LED光源的散热效果。
参阅图3，图3是本发明第三实施例的LED灯条的侧视图。在本实施例中，辐射散热材料320预先涂布于电路板310的用于承载LED光源330的表面，且在电路板310的该表面上全部涂布辐射散热材料320，可以简化涂布的复杂度。LED光源330则固定于辐射散热材料320上。
参阅图4，图4是本发明第四实施例的LED灯条的侧视图。在本实施例中，辐射散热材料420除了涂布于电路板410的用于承载LED光源430的表面外，进一步涂布于与该表面相对的另一表面上。
参阅图5，图5是本发明第五实施例的LED灯条的侧视图。在本实施例中，LED光源530预先固定于电路板510，并通过在电路板510上涂布辐射散热材料520，使得辐射散热材料520进一步LED光源530的至少部分表面上。具体来说，LED光源530一般包括支架531、设置于支架531上的LED芯片532以及设置于支架531上且用于为LED芯片532供电的引脚533。辐射散热材料520优选涂布于支架531和引脚532的表面上。
参阅图6，图6是本发明第六实施例的LED灯条的制造方法。在本实施例中，LED灯条的制造方法包括：
在步骤S11中，将辐射散热材料涂布于电路板的至少部分表面上。
在步骤S12中，将LED光源固定于电路板。
参阅图7，图7是本发明第七实施例的LED灯条的制造方法。在本实施例中，LED灯条的制造方法包括：
在步骤S21中，将LED光源固定于电路板。
在步骤S22中，将辐射散热材料涂布于电路板的至少部分表面上。
在本发明第七实施例中，可进一步将辐射散热材料涂布于LED光源的至少部分表面上。并且，电路板、LED光源以及辐射散热材料可参考第一至第五实施例，此处不再赘述。
区别于现有技术，本发明的电路板、LED灯条及LED灯条的制造方法通过在电路板至少部分表面涂布辐射散热材料，能够提高电路板的散热效果，进而提高安装在电路板上的LED光源的散热效果。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种LED灯条，其特征在于，所述LED灯条包括电路板以及固定于所述电路板上的LED光源，所述电路板为金属基印刷电路板，并且其至少部分表面涂布有白色散热漆。
  2. 根据权利要求1所述的LED灯条，其特征在于，所述白色散热漆涂布于所述电路板的用于承载所述LED光源的表面。
  3. 根据权利要求1所述的LED灯条，其特征在于，所述电路板的所述表面全部涂布有所述白色散热漆。
  4. 根据权利要求1所述的LED灯条，其特征在于，所述白色散热漆进一步涂布于所述LED光源的至少部分表面上。
  5. 根据权利要求4所述的LED灯条，其特征在于，所述LED光源包括支架、设置于所述支架上的LED芯片以及设置于所述支架上且用于为所述LED芯片供电的引脚，所述白色散热漆涂布于所述支架和所述引脚的表面上。
  6. 一种电路板，用于固定LED光源，其特征在于，所述电路板的至少部分表面涂布有辐射散热材料。
  7. 根据权利要求6所述的电路板，其特征在于，所述电路板为金属基印刷电路板。
  8. 根据权利要求6所述的电路板，其特征在于，所述辐射散热材料涂布于所述电路板的用于承载所述LED光源的表面。
  9. 根据权利要求6所述的电路板，其特征在于，所述电路板的所述表面全部涂布有所述辐射散热材料。
  10. 一种LED灯条的制造方法，其特征在于，所述制造方法包括：
    将辐射散热材料涂布于电路板的至少部分表面上；
    将LED光源固定于所述电路板。
PCT/CN2012/076315 2012-05-22 2012-05-31 电路板、led灯条及led灯条的制造方法 WO2013174033A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/519,352 US20130314910A1 (en) 2012-05-22 2012-05-31 Circuit Board, LED Light Strip and Method for Making the LED Light Strip

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2012101604476A CN102686019A (zh) 2012-05-22 2012-05-22 电路板、led灯条及led灯条的制造方法
CN201210160447.6 2012-05-22

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CN102946034B (zh) * 2012-11-16 2015-07-01 深圳市华星光电技术有限公司 一种连接器以及led灯条

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