WO2013174005A1 - 背光系统、背光系统的制造方法及平板显示装置 - Google Patents

背光系统、背光系统的制造方法及平板显示装置 Download PDF

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Publication number
WO2013174005A1
WO2013174005A1 PCT/CN2012/076038 CN2012076038W WO2013174005A1 WO 2013174005 A1 WO2013174005 A1 WO 2013174005A1 CN 2012076038 W CN2012076038 W CN 2012076038W WO 2013174005 A1 WO2013174005 A1 WO 2013174005A1
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WO
WIPO (PCT)
Prior art keywords
assembling piece
primary assembling
primary
piece
splicing
Prior art date
Application number
PCT/CN2012/076038
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English (en)
French (fr)
Inventor
萧宇均
郭仪正
黄冲
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/518,865 priority Critical patent/US8992066B2/en
Publication of WO2013174005A1 publication Critical patent/WO2013174005A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133325—Assembling processes

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a backlight system, a method of manufacturing a backlight system, and a flat panel display device.
  • the prior art liquid crystal display device includes a front frame, a panel, and a backlight system, wherein the backlight system includes a back frame, a reflective sheet, a light guide plate, a light group, and the like.
  • the size of the liquid crystal panel includes 31.5, 42, 46, 48 or 55 inches, and it is necessary to set different back frame molds according to liquid crystal panels of different sizes.
  • FIG. 1 is a schematic structural diagram of a back frame of a liquid crystal display device in the prior art.
  • the back frame 10 adopts an integral back frame, and the integral back frame 10 is usually produced by metal stamping or plastic injection.
  • the integral back frame 10 needs to consume too much material. The material cost is high.
  • the large-sized back frame 10 needs to use a large punching device, and the corresponding frame of the back frame 10 has a large size, a complicated structure, and a high cost of the back frame mold. Therefore, the back frame of the prior art is costly.
  • the light source encapsulates the LED on a metal-based printed circuit board (MCPCB), and then attaches it to the aluminum that is in contact with the back frame 10 or directly attaches it to the back frame 10.
  • MCPCB metal-based printed circuit board
  • the bracket design is used to package the LED on the bracket, the heat generated during the operation of the LED cannot be dissipated in time, which may affect The optical effect of the liquid crystal display device.
  • the technical problem to be solved by the present invention is to provide a backlight system, a manufacturing method of the backlight system, and a flat panel display device, which can reduce material cost, mold cost, and solve heat dissipation problems.
  • a technical solution adopted by the present invention is to provide a flat panel display device including a backlight system, the backlight system including a back frame and an LED light source, wherein the back frame includes at least first and second Two primary assembling pieces, wherein one end of the first primary assembling piece is provided with at least two joints, and the structure of each joint is matched with one end of the corresponding second primary assembling piece, the first main The splicing piece is spliced with one end of the corresponding second splicing piece by a splicing portion thereof; the first main splicing piece or the second main splicing piece comprises a bottom plate and a side plate extending upward from a long side of the bottom plate;
  • the backlight system includes a package holder disposed inside the side plate of the first primary assembling piece or the second primary assembling piece; the number of the LED light sources is multiple, and is directly packaged in the package
  • the bracket is partially or entirely provided with a heat dissipation layer.
  • the back frame includes a third primary assembling piece and a fourth primary assembling piece; the first primary assembling piece, the second primary assembling piece, the third primary assembling piece, and the fourth primary assembling piece are all straight strips. And stitching end to end to surround the rectangular main frame forming the back frame.
  • a backlight system including a back frame and a semiconductor light source
  • the back frame includes at least first and second main splices.
  • One end of the first primary assembling piece is provided with at least two splicing portions, and the structure of each splicing portion is matched with one end of the corresponding second primary splicing piece, and the first primary splicing piece is spliced by one The portion is spliced with one end of the corresponding second primary assembling piece;
  • the backlight system includes a package bracket, and the package bracket is disposed on the first primary assembling piece or the second primary assembling piece, the semiconductor light source Directly packaged on the package holder.
  • the package bracket is partially or entirely provided with a heat dissipation layer.
  • the first primary assembling piece or the second primary assembling piece includes a bottom plate and a side plate extending upward from a long side of the bottom plate, and the package bracket is disposed at an inner side of the side plate.
  • the semiconductor light source is an LED light source, and the number thereof is plural.
  • the at least two joint portions are arranged at intervals along the length direction of the first primary assembling piece.
  • the splicing portion is a recess provided on a surface of the first primary assembling piece and adapted to an end of the second primary assembling piece to receive one end of the second primary assembling piece.
  • the splicing portion is a concave portion disposed on a surface of the first primary assembling piece, the surface of the second primary assembling piece is provided with a protrusion at a corresponding position, and the protrusion is embedded in the concave portion to splicing the first primary assembling piece And a second primary splicing piece.
  • one end surface of the second primary assembling piece is provided with at least two protrusions arranged at intervals along the length direction of the second primary assembling piece.
  • the back frame includes a fixing member, and the fixing member passes through The first through hole and the second through hole splicing the first primary assembling piece and the second primary assembling piece.
  • the back frame includes a third primary assembling piece and a fourth primary assembling piece;
  • the first primary assembling piece, the second primary assembling piece, the third primary assembling piece and the fourth primary assembling piece are all straight strips and are stitched end to end to surround the rectangular main frame forming the back frame.
  • the back frame includes a secondary assembling piece disposed in the main frame, and the auxiliary assembling piece is spliced with the main frame.
  • the auxiliary splicing component includes a first auxiliary splicing component and a second secondary splicing component, and the two ends of the first secondary splicing component are respectively associated with the first primary splicing component, the second primary splicing component, and the third primary splicing component, and At least two primary splicing members of the fourth primary splicing member are spliced, and two ends of the second secondary splicing member are respectively associated with the first primary splicing component, the second primary splicing component, the third primary splicing component, and the fourth primary splicing component At least two primary splices are spliced.
  • the two ends of the first auxiliary assembling piece are respectively spliced with the adjacent first primary assembling piece and the second primary assembling piece, and the two ends of the second auxiliary assembling piece are adjacent to the adjacent third primary assembling piece,
  • the fourth primary assembling piece is spliced; or the two ends of the first auxiliary assembling piece are respectively spliced with the first primary assembling piece and the third primary assembling piece, and the two ends of the second auxiliary assembling piece are oppositely disposed first
  • the primary assembling piece and the third primary assembling piece are spliced.
  • the back frame includes at least one bracket, and is detachably fixed to the first primary assembling piece, the second primary assembling piece, the third primary assembling piece, the fourth primary assembling piece, the first auxiliary assembling piece, and the second auxiliary One or more of the splicing members, the bracket is provided with a convex hull.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a backlight system, comprising: fabricating at least a first and a second primary assembling piece, wherein one end of the first primary assembling piece is provided There are at least two splicing portions, and the structure of each splicing portion is matched with one end of the corresponding second main splicing piece; the package bracket is prepared, and the package bracket is disposed on the first main splicing piece or the second main splicing piece; The light source is directly packaged on the package holder; after the semiconductor light source is packaged, a splice portion of the at least two splice portions is spliced to one end of the corresponding second main splice member according to the size of the back frame.
  • the heat dissipation layer is disposed on a part or the whole of the corresponding package semiconductor light source.
  • the step of disposing the heat dissipation layer in a part or the whole of the corresponding packaged semiconductor light source is specifically: applying a heat dissipation material to a part or the whole of the corresponding packaged semiconductor light source to form the heat dissipation layer.
  • one of the at least two stitching portions is selected according to the size of the back frame Before or after the step of splicing the splicing portion with the end of the corresponding second primary splicing member, the other splicing portions of the first primary splicing member located outside the splicing position of the second primary splicing member are cut off.
  • the invention has the beneficial effects that the backlight system, the backlight manufacturing system and the flat panel display device of the present invention are provided with at least two primary assembling pieces, wherein at least two are provided on the first primary assembling piece, different from the prior art.
  • a splicing portion the first main splicing piece is spliced with one end of the corresponding second main splicing piece through a splicing portion thereof, so that the mold structure of the back frame is simple, the cost of the back frame mold is reduced, and the material of the back frame is saved, Reduce the production cost of the flat panel display device.
  • the semiconductor light source is also packaged directly on the package holder, which saves material costs.
  • the package bracket is partially or entirely coated with a heat dissipating material, so that it can better solve the heat dissipation problem of the semiconductor light source.
  • FIG. 1 is a schematic structural view of a back frame of a liquid crystal display device in the prior art
  • FIG. 2 is a schematic structural view of a flat panel display device according to a first embodiment of the present invention
  • FIG. 3 is a schematic structural view of a back frame of a backlight system according to a second embodiment of the present invention.
  • Figure 4 is a side elevational view showing the package of the package according to the present invention.
  • FIG. 5 is a schematic structural view of a back frame of a backlight system according to a third embodiment of the present invention.
  • FIG. 6 is a schematic structural view of a back frame of a backlight system according to a fourth embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a splicing manner of a backlight system according to a fifth embodiment of the present invention.
  • FIG. 8 is a schematic view showing a diagonal arrangement of a first auxiliary splicing member of a backlight system according to a sixth embodiment of the present invention on a main frame;
  • FIG. 9 is a schematic diagram of a first auxiliary assembling piece and a second auxiliary assembling piece of a backlight system according to a seventh embodiment of the present invention.
  • FIG. 10 is a schematic structural view of a joint portion of a back frame of a backlight system according to an eighth embodiment of the present invention.
  • Figure 11 is a cross-sectional view showing the first embodiment of the joint portion of Figure 10;
  • FIG. 12 is a schematic diagram of a splicing manner of a splicing portion of a back frame of a backlight system according to a ninth embodiment of the present invention.
  • FIG. 13 is a schematic diagram of a splicing manner of a joint portion of a back frame of a backlight system according to a tenth embodiment of the present invention.
  • FIG. 14 is a schematic diagram of a splicing manner of a joint portion of a back frame of a backlight system according to an eleventh embodiment of the present invention.
  • FIG. 15 is a schematic structural view of a joint portion of a back frame of a backlight system according to a twelfth embodiment of the present invention.
  • 16 is a schematic structural view of a joint portion of a back frame of a backlight system according to a thirteenth embodiment of the present invention.
  • 17 is a flow chart of a method of fabricating a backlight system in accordance with a fourteenth embodiment of the present invention.
  • FIG. 18 is a schematic structural diagram of a flat panel display device with a touch screen according to a fifteenth embodiment of the present invention.
  • FIG. 19 is a schematic structural view of a stereoscopic display device according to a sixteenth embodiment of the present invention.
  • Figure 20 is a schematic structural view of a plasma display device in accordance with a seventeenth embodiment of the present invention.
  • the flat panel display device 20 of the present embodiment includes a backlight system 21 and a display panel 22 .
  • the backlight system 21 is disposed on the back surface of the display panel 22 and provides illumination for the display panel 22 .
  • the backlight system 21 includes a semiconductor light source 25, a light homogenizing mechanism 24, a package holder 210, and a back frame 23.
  • the back frame 23 carries the semiconductor light source 25 and the light homogenizing mechanism 24.
  • the light homogenizing mechanism 24 is a light guide plate; when the backlight system 21 is of a direct type, the light homogenizing mechanism 24 is a diffusing plate.
  • the back frame 23 includes at least a first primary assembling piece and a second primary assembling piece, and at least the first and second primary assembling pieces form a main frame 27 of the back frame 23, and the package bracket 210 is disposed on the first primary assembling piece or The semiconductor light source 25 is directly packaged on the package holder 210 on the second primary assembling piece.
  • the first embodiment of the back frame 23 includes a first primary splice 261 and a second primary splice 262.
  • One end of the first primary assembling piece 261 is spliced with one end of the second primary assembling piece 262, and the other end of the first primary assembling piece 261 is spliced with the other end of the second primary assembling piece 262 to form the main frame 27 of the back frame 23.
  • the first primary splicing member 261 and the second primary splicing member 262 are both aluminum or galvanized steel.
  • the first primary assembling piece 261 and the second primary assembling piece 262 are L-shaped.
  • the package holder 210 is disposed on the first primary assembling piece 261, and the package holder 210 and the first primary assembling piece 261 are separately manufactured, and the package holder 210 is fixedly assembled to the first main assembly. On the splicing piece 261.
  • the package holder 210 can also be non-destructively removed from the first primary assembly 261 as needed.
  • the package holder 210 is fixedly connected to the first primary assembling piece 261, and the package holder 210 is directly packaged with one or more semiconductor light sources.
  • the first primary assembling piece 261 includes a bottom plate (not shown) and a side plate (not shown) extending upward from a long side of the bottom plate, and the inner wall of the package bracket 210 and the side plate Fixed connection.
  • the semiconductor light source 25 is an LED, and the number thereof may be one or more.
  • the number of the package holders 210 may be one or more, and each package holder 210 is directly packaged with one or more semiconductor light sources 25, depending on the light-emitting brightness requirements and the shape of the corresponding light-smoothing mechanism 24.
  • the package holders 210 may be disposed on the same side of the light homogenizing mechanism 24, or may be disposed on multiple sides of the light homogenizing mechanism 24, respectively.
  • the material of the package holder 210 is not limited.
  • the package holder 210 may be made of various suitable materials such as metal, alloy or plastic.
  • the package holder 210 is partially or entirely provided with a heat dissipation layer (not shown). Show). For example, a portion or all of the area of the package holder 210 is coated with a heat dissipating material. Further, a heat dissipating material may be applied to the package holder 210 before the package holder 210 is connected to the first main assembly. For example, a plurality of the package holders 210 may be arranged together, and then the package holder 210 may be sprayed separately or simultaneously. In addition, in order to ensure the physical strength of the package holder 210 and prevent it from being accidentally deformed to affect the optical effect of the backlight system 21, the package holder 210 is further provided with one or more reinforcing ribs 2102.
  • the second embodiment of the back frame 23 includes a first primary splicing member 281, a second primary splicing member 282, and a third primary splicing member 283.
  • the three primary assembling pieces 281, 282, and 283 are joined to form the main frame 27 of the back frame 23.
  • the three primary splices 281, 282, and 283 are either aluminum or galvanized steel.
  • the first primary assembling piece 281 is L-shaped, and the second and third primary assembling pieces 282, 283 are all straight.
  • the package holder can be disposed on the first primary assembling piece 281, the second primary assembling piece 282 or the third primary assembling piece 283.
  • the structure of the packaging bracket is similar to that of the first embodiment, and details are not described herein again.
  • the back frame 23 may further include a secondary splicing piece disposed in the splicing frame 27 and spliced thereto.
  • the back frame 23 of the backlight system 21 of the present invention will be described in detail below with four primary assembling pieces and two secondary assembling pieces.
  • FIG. 6 is a schematic structural diagram of a back frame of a backlight system according to a fourth embodiment of the present invention.
  • the back frame 23 includes: a first primary assembling piece 231 , a second primary assembling piece 232 , a third primary assembling piece 233 , a fourth primary assembling piece 234 , and a first auxiliary assembling piece 235 .
  • the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233, and the fourth primary assembling piece 234 are formed into a rectangular main frame 27 of the back frame 23 by end-to-end stitching.
  • the first auxiliary splicing piece 235 and the second auxiliary splicing piece 236 are provided as auxiliary splicing pieces, are disposed in the main frame 27, and are spliced with the main frame 27.
  • the package holder may be disposed on the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233 or the fourth primary assembling piece 234, and the structure of the packaging bracket is similar to that of the first embodiment. I will not repeat them here.
  • first primary assembling piece 231 is spliced with one end of the second primary assembling piece 232, and the other end of the second primary assembling piece 232 is spliced with one end of the third primary assembling piece 233, and the third primary assembling piece 233 is The other end is spliced with one end of the fourth primary assembling piece 234, and the other end of the fourth primary assembling piece 234 is spliced with the other end of the first primary assembling piece 231 to form a rectangular main frame 27.
  • the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233 and the fourth primary assembling piece 234 are all aluminum parts or galvanized steel pieces.
  • the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233, and the fourth primary assembling piece 234 are all straight strips.
  • the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233, and the fourth primary assembling piece 234 may all be disposed in an L shape, or partially disposed in a straight strip shape, and the remaining ones are disposed in an L shape.
  • the first primary assembling piece 261 and the second primary assembling piece 262 are all disposed in an L shape; in FIG. 5, the first primary assembling piece 281 is disposed in an L shape, and the second and third primary assembling pieces 282 are provided.
  • And 283 is set to a straight strip.
  • the back frame 23 of the backlight system 21 is spliced and fixed by using a splicing connection.
  • one end of the first primary assembling piece 231 and one end of the second primary assembling piece 232 are spliced and connected, and one end of the second primary assembling piece 232 is spliced on one end of the first primary assembling piece 231 .
  • one end of the second primary assembling piece 232 is spliced on one end of the first primary assembling piece 231 by means of screwing, fastening or welding.
  • the first auxiliary assembling piece 235 and the second auxiliary assembling piece 236 are disposed in the main frame 27 of the back frame 23 .
  • One end of the first auxiliary assembling piece 235 is spliced with the first primary assembling piece 231
  • the other end of the first auxiliary assembling piece 235 is spliced with the third primary assembling piece 233
  • the other end of the second auxiliary assembling piece 236 is spliced with the third primary assembling piece 233, and between the second primary assembling piece 232, the fourth primary assembling piece 234, the first auxiliary assembling piece 235, and the second auxiliary assembling piece 236.
  • one of ordinary skill in the art provides at least one secondary splice within the main frame 27, such as only the first secondary splice 235 disposed within the main frame 27.
  • the two ends of the first auxiliary assembling piece 235 can be respectively spliced with at least two primary assembling pieces of the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233, and the fourth primary assembling piece 234.
  • the first sub-assembler 235 is diagonally disposed within the main frame 27 as shown in FIG.
  • the two ends of the second auxiliary assembling piece 236 may be respectively combined with at least two of the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233, and the fourth primary assembling piece 234.
  • Splicing pieces are spliced.
  • the two ends of the first auxiliary assembling piece 235 are respectively spliced with the adjacent first primary assembling piece 231 and the second primary assembling piece 232, and the two ends of the second auxiliary assembling piece 236 are respectively disposed adjacent to the third main assembly.
  • the splicing member 233 and the fourth main splicing member 234 are spliced, as shown in FIG.
  • the back frame 23 includes seven brackets 2371, 2372, 2373, 2374, 2375, 2376, and 2377.
  • the bracket 2371 is fixed on the fourth primary assembling piece 234, the brackets 2372 and 2373 are respectively fixed on the first auxiliary assembling piece 235, the bracket 2374 is fixed on the second auxiliary assembling piece 236, and the bracket 2375 is fixed on the second primary assembling piece.
  • the two ends of the brackets 2376 and 2377 are respectively fixed to the first auxiliary assembling piece 235 and the second auxiliary assembling piece 236.
  • the bracket may be fixed to one of the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233, the fourth primary assembling piece 234, the first auxiliary assembling piece 235, and the second auxiliary assembling piece 236. or above.
  • those skilled in the art can fully provide other numbers of brackets, such as a bracket or more, on the back frame 23.
  • the bracket can be detachably fixed to one of the first primary assembling piece 231, the second primary assembling piece 232, the third primary assembling piece 233, the fourth primary assembling piece 234, the first auxiliary assembling piece 235, and the second auxiliary assembling piece 236. or above.
  • a convex package (not shown) is disposed on the brackets 2371, 2372, 2373, 2374, 2375, 2376, and 2377, and the back frame 23 can fix the circuit board or the like through the convex package.
  • the first primary assembling piece 231 and the third primary assembling piece 233 are the same in size, the same shape, and are stamped using the same mold.
  • the second primary assembling piece 232, the fourth primary assembling piece 234, the first auxiliary assembling piece 235 and the second auxiliary assembling piece 236 have the same size and the same shape, and are stamped and produced by the same die to realize mold sharing. Therefore, the back frame 23 of the present invention can be produced by stamping using two small-sized molds.
  • the back frame 10 requires a large-sized mold, and the mold structure of the back frame 23 of the present invention is simple and small, thereby reducing The cost of the back frame 23 mold.
  • the back frame 23 of the present invention can greatly save material compared to the overall back frame of the back frame 10 in the prior art, thereby reducing the production cost of the flat panel display device 20.
  • FIG. 10 is a schematic structural diagram of a joint portion of a back frame of a backlight system according to an eighth embodiment of the present invention.
  • one end of the first primary assembling piece is provided with two splicing portions, and the structure of the splicing portion is matched with one end of the corresponding second main splicing portion, so that the first primary assembling piece is Stitching with one end of the corresponding second primary assembling piece.
  • one end of the first primary assembling piece 231 is provided with the splicing portions 2311, 2312, and the splicing portions 2311, 2312 are arranged along the length direction of the first primary assembling piece 231, and the splicing portions 2311, 2312 are in the first main splicing.
  • the piece 231 is provided with a recess shaped to fit one end of the second primary assembling piece 232 to receive one end of the second primary assembling piece 232.
  • the splicing portion 2311 is a recessed portion that does not penetrate the opposite ends of the first primary assembling piece 231 .
  • the concave portion has a rectangular shape
  • the second primary splicing member 232 has a straight strip shape.
  • the joint portion 2311 closer to the end of the first primary assembling piece 231 is first selected, and the second primary assembling piece 232 of the corresponding width is selected. Then, one end of the second primary assembling piece 232 is placed on the concave portion of the joint portion 2311. Then, one end of the second primary assembling piece 232 is spliced and fixed on the joint portion 2311 by screwing, fastening or welding.
  • the splicing portion 2312 that is farther from the end of the first primary splicing member 231 is first selected, and the second primary splicing member 232 of the corresponding width is selected.
  • one end of the second primary assembling piece 232 is placed on the concave portion of the joint portion 2312. Then, one end of the second primary assembling piece 232 is spliced and fixed on the joint portion 2312 by screwing, fastening or welding.
  • a protrusion is disposed at a corresponding position on the surface of the second primary assembling piece 232, wherein the protrusion of the second primary assembling piece 232 is embedded in the corresponding position of the first primary assembling piece 231 to splicing the first primary assembling piece. 231 and the second primary assembling piece 232, as shown in FIG.
  • one end of the second primary assembling piece 232 may be provided with at least two protrusions spaced along the length direction of the second primary assembling piece 232, such as two, three or four or the like.
  • the concave portion of the first primary assembling piece 231 is a concave portion of a multi-step structure
  • the second primary assembling piece 232 is provided with a convex portion of a multi-step structure adapted to the concave portion, as shown in FIG.
  • the bottom portion of the concave portion of the first primary assembling piece 231 is provided with a first through hole 2313
  • the second primary assembling piece 232 is provided with a second position corresponding to the joint portion 2311.
  • the back frame 23 further includes a fixing member 240.
  • the fixing member 240 passes through the first through hole 2313 and the second through hole 2321 to splicing the first primary assembling piece 231 and the second primary assembling piece 232.
  • the concavities of the splices 2311, 2312 of the first main splicing member 231 are circular in shape.
  • those skilled in the art can completely set the shape of the recess to other polygonal shapes such as a triangle.
  • the splice portions 2311, 2312 are recesses penetrating through opposite sides of the first main splice member 231 such that one end of the second main splice member 232 is The splicing portions 2311, 2312 move up. For example, after the end of the second primary assembling piece 232 passes through the joint portion 2312 and is spliced and fixed, the through portion can be cut off, thereby adjusting the length of the second primary assembling piece 232 as the main frame of the back frame.
  • the other end of the first primary assembling piece 231 and the two ends of the third primary assembling piece 233 are provided with two splice portions, the structure of which is the same as that of the splice portions 2311, 2312; and in the second main stitching Both ends of the member 232 and the two ends of the fourth primary assembling member 234 are correspondingly designed or not designed corresponding to different situations, such as:
  • the two ends of the second primary assembling piece 232 and the two ends of the fourth primary assembling piece 234 may not be designed in any way, that is, the ends are identical in structure to other parts.
  • the different splicing portions 2311 (2312) at one end of the first primary assembling piece 231 are selected for splicing (the other end is also processed)
  • the width of the back frame 23 is correspondingly changed
  • the length of the splicing member 234 is also selected accordingly.
  • the second primary splicing member 232 and the fourth primary splicing member 234 are not cut, or the cut portion is shorter; if the selection is farther away from the first
  • the second main splicing piece 232 and the fourth main splicing piece 234 are both cut, according to the distance of the splicing part from the end of the first main splicing piece 231, and the cutting is performed.
  • the part is also longer or shorter;
  • the second primary assembling piece 232 and the fourth primary assembling piece 234 are respectively separated from the first primary assembling piece 231 by the different protrusions.
  • the three main assembling pieces 233 cooperate to realize the change of the width of the back frame 23; likewise, if the splicing portion 2312 other than the first splicing portion 2311 closest to the end of the first main splicing piece 231 is selected for splicing, after splicing or Before splicing, the excess second primary splicing piece 232 and the fourth primary splicing piece 234 are partially cut.
  • the first main splicing member of the back frame 23 of the present invention is provided with at least two splicing portions, and the number of splicing portions is set according to user requirements.
  • two splicing portions 2311 and 2312 are selected. description. Therefore, when setting the mold of the back frame 23, only two sets of molds, that is, the mold of the first main assembling piece and the mold of the second main assembling piece are disposed, and a plurality of splices are arranged on the first main assembling piece to be spliced.
  • Back frame 23 of various sizes.
  • the corresponding splicing portion may be selected according to the size of the back frame 23, and the second main splicing piece is spliced on the splicing portion of the first main splicing piece through the splicing portion, and the first main splicing piece is The other splices located outside the splice location of the second primary splice are cut to obtain the back frame 23 of the desired size.
  • different back frame molds are provided according to different sizes of the back frame 10.
  • the back frame 23 of the present invention only needs to set the mold of the first primary assembling piece and the second primary assembling piece 28 to meet various sizes.
  • the molds required by the product are shared, and the mold structure is simple, which can reduce the cost of the back frame mold.
  • the package brackets may be disposed on one or more of the respective primary assembling pieces.
  • the present invention also provides a method of manufacturing a backlight system, the method comprising the following steps:
  • Step 501 Manufacture at least the first and second primary assembling pieces, wherein one end of the first primary assembling piece is provided with at least two joints, and the structure of each joint is matched with one end of the corresponding second primary assembling piece.
  • Step 502 The package bracket is prepared, and the package bracket is disposed on the first primary assembling piece or the second primary assembling piece, and the semiconductor light source is directly packaged on the first primary assembling piece or the second primary assembling piece;
  • Step 503 After packaging the semiconductor light source, select a joint portion of the at least two joint portions according to the size of the back frame to splicing with one end of the corresponding second primary assembling piece.
  • a joint of at least two joints is selected according to the size of the back frame.
  • the other splicing portions of the first primary splicing member located outside the splicing position of the second primary splicing member are cut off.
  • the first primary assembling piece is the first primary assembling piece
  • the second primary assembling piece is the second primary assembling piece, which will not be described herein.
  • the method includes: disposing a heat dissipation layer locally or entirely in a corresponding package semiconductor light source.
  • the step of disposing the heat dissipation layer in a part or the whole of the corresponding packaged semiconductor light source is specifically: applying a heat dissipation material to a part or the whole of the corresponding packaged semiconductor light source to form the heat dissipation layer.
  • the flat panel display device 20 of the present invention further includes a touch screen 29 which is disposed on the light emitting surface of the display panel 22 of the flat panel display device 20.
  • the flat panel display device 20 includes a backlight system 21 and the above-described display panel 22 .
  • the backlight system 21 is disposed on the back surface of the display panel 22 and provides illumination for the display panel 22 .
  • the backlight system 21 includes a semiconductor light source 25, a light homogenizing mechanism 24, and a back frame 23.
  • the back frame 23 carries the semiconductor light source 25 and the light homogenizing mechanism 24.
  • the light homogenizing mechanism 24 is a light guide plate; when the backlight system 21 is of a direct type, the light homogenizing mechanism 24 is a diffusing plate.
  • the back frame 23 includes at least a first primary assembling piece and a second primary assembling piece, and at least the first and second primary assembling pieces form the main frame 27 of the back frame 23.
  • the backlight system 21 can also be a structure in any of the foregoing backlight system embodiments.
  • the flat panel display device 20 of the present invention may be a liquid crystal display device or a liquid crystal television set.
  • the present invention also provides a stereoscopic display device 30.
  • the stereoscopic display device 30 includes a liquid crystal lens grating 31, a backlight system 32, and a display panel 33.
  • the liquid crystal lens grating 31 is disposed on the light emitting surface of the display panel 33.
  • the backlight system 32 is the backlight system of the above embodiments, such as the backlight system 32 including the back frame 23.
  • the back frame 23 includes at least a first primary assembling piece and a second primary assembling piece, and at least the first and second primary assembling pieces form a main frame of the back frame.
  • the backlight system 32 can also be the structure in any of the foregoing backlight system embodiments, and details are not described herein again.
  • the present invention also provides a plasma display device 40.
  • the plasma display device 40 includes a plasma display panel 41 and a back frame 42, and the back frame 42 is disposed on the back surface of the plasma display panel 41.
  • the back frame 42 may be the back frame of any of the foregoing embodiments, and details are not described herein again.
  • the backlight system, the backlight system manufacturing method, and the flat panel display device of the present invention can reduce material cost, mold cost, and solve the heat dissipation problem of the semiconductor light source.

Abstract

提供了一种背光系统（21）、背光系统（21）的制造方法及平板显示装置（20）。所述背光系统（21）包括封装支架（210）、至少第一、第二两个主拼接件（231，232），其中第一主拼接件（231）的一端设有至少两个拼接部（2311，2312），每个拼接部（2311，2312）的结构与相应的第二主拼接件（232）的一端适配，第一主拼接件（231）通过其一拼接部（2311，2312）与相应的第二主拼接件（232）的一端拼接。所述封装支架（210）设置在所述第一主拼接件（231）或所述第二主拼接件（232）上，所述半导体光源（25）直接封装于所述封装支架（210）上。从而，能够降低材料成本、模具成本和解决半导体光源（25）的散热问题。

Description

背光系统、背光系统的制造方法及平板显示装置
【技术领域】
本发明涉及显示技术领域，特别是涉及一种背光系统、背光系统的制造方法及平板显示装置。
【背景技术】
现有技术中液晶显示装置包括前框、面板以及背光系统，其中背光系统包括背框、反射片、导光板以及灯组等。
目前，市场上有多种显示面板尺寸以满足人们的不同需求。例如在电视领域中，液晶面板的尺寸包括31.5、42、46、48或55寸，需要根据不同尺寸的液晶面板进行设置不同的背框模具。
请参见图1，图1是现有技术中液晶显示装置的背框结构示意图。如图1所示，现有技术中背框10均采用整体式的背框，通常通过金属冲压或者塑料注射方式生产整体式的背框10，整体式的背框10需要消耗过多的材料，材料成本高。此外大尺寸的背框10需要使用较大的冲压设备，背框10对应的模具尺寸很大，结构复杂，背框模具的成本高。因此现有技术的背框成本高。
此外，若采用LED（light emitting diode，发光二极管）光源，则将LED封装在金属基印刷电路板（MCPCB）上，再贴附到与背框10接触的铝挤或直接贴附到背框10上。这种方式由于使用的元件较多，增加液晶显示装置的元件材料成本；此外，如果采用支架设计，将LED封装在支架上，则会由于LED工作时散发的热量不能及时散发出去，而可能影响液晶显示装置的光学效果。
【发明内容】
本发明主要解决的技术问题是提供一种背光系统、背光系统的制造方法及平板显示装置，能够降低材料成本、模具成本和解决散热问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种平板显示装置，包括背光系统，所述背光系统包括背框和LED光源，其中，所述背框包括至少第一、第二两个主拼接件，其中所述第一主拼接件的一端设有至少两个拼接部，每个拼接部的结构与相应的所述第二主拼接件的一端适配，所述第一主拼接件通过其一拼接部与相应的所述第二主拼接件的一端拼接；所述第一主拼接件或第二主拼接件包括底板以及自底板的长边一侧向上延伸的侧板；所述背光系统包括封装支架，所述封装支架设置在所述第一主拼接件或所述第二主拼接件的侧板内侧；所述LED光源数量为多个，并且直接封装于所述封装支架上；所述封装支架的局部或整体设置有散热层。
其中，所述背框包括第三主拼接件以及第四主拼接件；所述第一主拼接件、第二主拼接件、第三主拼接件以及第四主拼接件皆为直条形，并且首尾拼接，以围绕形成所述背框的矩形主框架。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种背光系统，所述背光系统包括背框和半导体光源，所述背框包括至少第一、第二两个主拼接件，其中所述第一主拼接件的一端设有至少两个拼接部，每个拼接部的结构与相应的所述第二主拼接件的一端适配，所述第一主拼接件通过其一拼接部与相应的所述第二主拼接件的一端拼接；所述背光系统包括封装支架，所述封装支架设置在所述第一主拼接件或所述第二主拼接件上，所述半导体光源直接封装于所述封装支架上。
其中，所述封装支架的局部或整体设置有散热层。
其中，所述第一主拼接件或第二主拼接件包括底板以及自底板的长边一侧向上延伸的侧板，所述封装支架设置在所述侧板的内侧。
其中，所述半导体光源是LED光源，数量为多个。
其中，所述至少两个拼接部沿第一主拼接件的长度方向上间隔排列。
其中，所述拼接部是第一主拼接件表面上设置的形状与第二主拼接件的一端适配的凹部，以收容第二主拼接件的一端。
其中，所述拼接部是第一主拼接件表面上设置的凹部，所述第二主拼接件的表面相应位置设有凸起，所述凸起嵌入凹部，以拼接所述第一主拼接件和第二主拼接件。
其中，所述第二主拼接件的一端表面设有至少两个沿第二主拼接件长度方向上间隔排列的凸起。
其中，所述第一主拼接件的凹部底部设有第一贯穿孔，所述第二主拼接件的相应位置设有第二贯穿孔，所述背框包括固定件，所述固定件穿过第一贯穿孔和第二贯穿孔以将第一主拼接件和第二主拼接件拼接。
其中，所述背框包括第三主拼接件以及第四主拼接件；
所述第一主拼接件、第二主拼接件、第三主拼接件以及第四主拼接件皆为直条形，并且首尾拼接，以围绕形成所述背框的矩形主框架。
其中，所述背框包括设置于主框架内的辅拼接件，所述辅拼接件与主框架拼接。
其中，所述辅拼接件包括第一辅拼接件和第二辅拼接件，所述第一辅拼接件的两端分别与第一主拼接件、第二主拼接件、第三主拼接件以及第四主拼接件中的至少两个主拼接件拼接，所述第二辅拼接件的两端分别与第一主拼接件、第二主拼接件、第三主拼接件以及第四主拼接件中的至少两个主拼接件拼接。
其中，所述第一辅拼接件的两端分别与相邻设置的第一主拼接件、第二主拼接件拼接，第二辅拼接件的两端与相邻设置的第三主拼接件、第四主拼接件拼接；或所述第一辅拼接件的两端分别与相对设置的第一主拼接件、第三主拼接件拼接，第二辅拼接件的两端与相对设置的第一主拼接件、第三主拼接件拼接。
其中，所述背框包括至少一个支架，可拆卸固定于所述第一主拼接件、第二主拼接件、第三主拼接件、第四主拼接件、第一辅拼接件以及第二辅拼接件之一或以上，所述支架设有凸包。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种制造背光系统的方法，其包括：制作至少第一、第二两个主拼接件，其中第一主拼接件的一端设有至少两个拼接部，每个拼接部的结构与相应的第二主拼接件一端适配；制作封装支架，并将封装支架设置于第一主拼接件或第二主拼接件上；将半导体光源直接封装于封装支架上；在封装所述半导体光源后根据背框的尺寸选择所述至少两个拼接部的一拼接部与相应的第二主拼接件的一端拼接。
其中，所述制作封装支架的步骤中或之后，包括：在对应封装半导体光源的局部或整体设置散热层。
其中，所述在对应封装半导体光源的局部或整体设置散热层的步骤具体为：在对应封装半导体光源的局部或整体涂布散热材料，形成所述散热层。
其中，当所述第二主拼接件的拼接位置与所述第一主拼接件的相邻端部之间存在其他拼接部时，在根据背框的尺寸选择所述至少两个拼接部的一拼接部与相应的第二主拼接件的一端拼接的步骤之前或之后，将所述第一主拼接件中位于所述第二主拼接件的拼接位置外侧的所述其他拼接部裁切掉。
本发明的有益效果是：区别于现有技术的情况，本发明的背光系统、背光系统的制造方法及平板显示装置通过设置最少两个主拼接件，其中第一主拼接件上设有至少两个拼接部，第一主拼接件通过其一拼接部与相应的第二主拼接件的一端拼接，以使背框的模具结构简单，降低背框模具的成本，并且节省背框的材料，以降低平板显示装置的生产成本。此外，还将半导体光源直接封装于封装支架上，从而其可以节省材料成本。
此外，所述封装支架的局部或整体涂布有散热材料，因此其可以更好的解决半导体光源的散热问题。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1是现有技术中液晶显示装置的背框结构示意图；
图2是根据本发明第一实施例的平板显示装置的结构示意图；
图3是根据本发明第二实施例的背光系统的背框的结构示意图；
图4是根据本发明封装支架的侧视结构示意图；
图5是根据本发明第三实施例的背光系统的背框的结构示意图；
图6是根据本发明第四实施例的背光系统的背框的结构示意图；
图7是根据本发明第五实施例的背光系统的拼接方式的结构示意图；
图8是根据本发明第六实施例的背光系统的第一辅拼接件对角设置在主框架上的示意图；
图9是根据本发明第七实施例的背光系统的第一辅拼接件以及第二辅拼接件在主框架上的示意图；
图10是根据本发明第八实施例的一种背光系统的背框中拼接部的结构示意图；
图11是图10中拼接部的第一实施例的截面示意图；
图12是根据本发明第九实施例的一种背光系统的背框中拼接部的拼接方式的示意图；
图13是根据本发明第十实施例的一种背光系统的背框中拼接部的拼接方式的示意图；
图14是根据本发明第十一实施例的一种背光系统的背框中拼接部的拼接方式的示意图；
图15是根据本发明第十二实施例的一种背光系统的背框中拼接部的结构示意图；
图16是根据本发明第十三实施例的一种背光系统的背框中拼接部的结构示意图；
图17是根据本发明第十四实施例的一种制造背光系统的方法的流程图；
图18是根据本发明第十五实施例的一种具有触摸屏的平板显示装置的结构示意图；
图19是根据本发明第十六实施例的立体显示装置的结构示意图；
图20是根据本发明第十七实施例的等离子显示装置的结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参见图2-4，如图2所示，本实施例的平板显示装置20包括：背光系统21以及显示面板22，背光系统21设置于显示面板22的背面，并且为显示面板22提供照明。
在本实施例中，背光系统21包括半导体光源25、匀光机构24、封装支架210以及背框23。其中，背框23承载半导体光源25和匀光机构24。在背光系统21为侧光式时，匀光机构24是导光板；在背光系统21为直下式时，匀光机构24是扩散板。背框23包括至少第一主拼接件和第二主拼接件，至少第一、第二两个主拼接件形成背框23的主框架27，所述封装支架210设置在第一主拼接件或第二主拼接件上，所述半导体光源25直接封装于所述封装支架210上。
一起参阅图3，背框23的第一实施例包括第一主拼接件261以及第二主拼接件262。第一主拼接件261的一端与第二主拼接件262的一端拼接，第一主拼接件261的另一端与第二主拼接件262的另一端拼接，以形成背框23的主框架27。第一主拼接件261和第二主拼接件262均为铝件或镀锌钢件。在本实施例中，第一主拼接件261和第二主拼接件262为L形。
以所述封装支架210设置在第一主拼接件261上为例，所述封装支架210和所述第一主拼接件261单独制造，再将所述封装支架210固定装配到所述第一主拼接件261上。当然，在需要时，所述封装支架210也可以从所述第一主拼接件261无损拆除。
所述封装支架210与所述第一主拼接件261固定连接，且所述封装支架210上直接封装有一个或多个半导体光源。在本实施例中，所述第一主拼接件261包括底板（图未示）及自底板的长边一侧向上延伸的侧板（图未示），所述封装支架210与侧板的内壁固定连接。所述半导体光源25为LED，其数量可以为一个或多个。
根据发光亮度需求、所对应的匀光机构24的形状不同，所述封装支架210的数量可以为一个或多个，且每个封装支架210上都直接封装有一个或多个半导体光源25。例如，所述封装支架210可以设置在匀光机构24的同一侧，也可以分别设置在匀光机构24的多侧。所述封装支架210的材料不限，例如所述封装支架210可以为金属、合金或塑料等多种合适的材料制得。
由于半导体光源25直接封装在封装支架210上，且半导体光源25在工作时会产生热量，为了将半导体光源25产生的热量及时散发出去，所述封装支架210的局部或整体设置散热层（图未示）。例如，在所述封装支架210的部分区域或全部区域都涂覆有散热材料。进一步的，在将所述封装支架210与所述第一主拼接件连接之前，可以先将散热材料涂覆到所述封装支架210上。例如，可以将多个所述封装支架210一并排列，然后分别或同时对所述封装支架210进行散热材料的喷涂。此外，为了保证所述封装支架210的物理强度，防止其产生意外形变而影响所述背光系统21的光学效果，所述封装支架210上还设置有一个或多个加强筋2102。
一起参阅图5，背框23的第二实施例包括第一主拼接件281、第二主拼接件282以及第三主拼接件283。三个主拼接件281、282以及283拼接形成背框23的主框架27。三个主拼接件281、282以及283均为铝件或镀锌钢件。在本实施例中，第一主拼接件281为L形，第二、三主拼接件282、283均为直条形。在本实施例中，封装支架可以设置在第一主拼接件281、第二主拼接件282或第三主拼接件283上，封装支架的结构与第一实施例类似，在此不再赘述。
此外，背框23还可以包括设置于主框架27内并与之拼接的辅拼接件。
以下以四个主拼接件和两个辅拼接件详细说明本发明背光系统21的背框23。
请参见图6，图6根据本发明第四实施例的背光系统的背框的结构示意图。如图6所示，在本实施例中背框23包括：第一主拼接件231、第二主拼接件232、第三主拼接件233、第四主拼接件234、第一辅拼接件235、第二辅拼接件236以及支架2371、2372、2373、2374、2375、2376及2377。第一主拼接件231、第二主拼接件232、第三主拼接件233以及第四主拼接件234通过首尾拼接形成背框23的矩形主框架27。第一辅拼接件235和第二辅拼接件236作为辅拼接件，设置于主框架27内，并且与主框架27拼接。在本实施例中，封装支架可以设置在第一主拼接件231、第二主拼接件232、第三主拼接件233或第四主拼接件234，封装支架的结构与第一实施例类似，在此不再赘述。
具体而言，第一主拼接件231的一端与第二主拼接件232的一端拼接，第二主拼接件232的另一端与第三主拼接件233的一端拼接，第三主拼接件233的另一端与第四主拼接件234的一端拼接，第四主拼接件234的另一端与第一主拼接件231的另一端拼接，以形成长方形的主框架27。其中，第一主拼接件231、第二主拼接件232、第三主拼接件233以及第四主拼接件234均为铝件或镀锌钢件。在本实施例中，第一主拼接件231、第二主拼接件232、第三主拼接件233以及第四主拼接件234均为直条形，在其他实施例中，本领域技术人员完全可以将第一主拼接件231、第二主拼接件232、第三主拼接件233以及第四主拼接件234全部设置为L形，或部分设置为直条形，剩余的设置为L形。例如，在图3中，第一主拼接件261和第二主拼接件262全部设置为L形；在图5中，第一主拼接件281设置为L形，第二、三主拼接件282以及283设置为直条形。
在本实施例中，背光系统21的背框23均采用拼接连接方式进行拼接固定。如图7所示，以第一主拼接件231的一端与第二主拼接件232的一端拼接连接方式为例，将第二主拼接件232的一端拼接在第一主拼接件231的一端上，比如，采用螺接、扣接或焊接等方式将第二主拼接件232的一端拼接在第一主拼接件231的一端上。
在本实施例中，第一辅拼接件235和第二辅拼接件236设置于背框23的主框架27内。第一辅拼接件235的一端与第一主拼接件231拼接，第一辅拼接件235的另一端与第三主拼接件233拼接，第二辅拼接件236的一端与第一主拼接件231拼接，第二辅拼接件236的另一端与第三主拼接件233拼接，并且第二主拼接件232、第四主拼接件234、第一辅拼接件235以及第二辅拼接件236之间平行设置。在其它实施例中，本领域技术人员在主框架27内设置至少一个辅拼接件，例如在主框架27内仅仅设置第一辅拼接件235。此外，第一辅拼接件235的两端可以分别与第一主拼接件231、第二主拼接件232、第三主拼接件233以及第四主拼接件234中的至少两个主拼接件拼接，例如第一辅拼接件235对角设置在主框架27内，如图8所示。同理可知，第二辅拼接件236的两端亦可以分别与第一主拼接件231、第二主拼接件232、第三主拼接件233以及第四主拼接件234中的至少两个主拼接件拼接。例如，第一辅拼接件235的两端分别与相邻设置的第一主拼接件231、第二主拼接件232拼接，第二辅拼接件236的两端分别与相邻设置的第三主拼接件233、第四主拼接件234拼接，如图9所示。
在本实施例中，背框23包括七个支架2371、2372、2373、2374、2375、2376及2377。其中，支架2371固定于第四主拼接件234上，支架2372、2373分别固定于第一辅拼接件235上，支架2374固定在第二辅拼接件236上，支架2375固定在第二主拼接件232上，支架2376、2377的两端分别固定于第一辅拼接件235和第二辅拼接件236上。实际上，支架可以固定于第一主拼接件231、第二主拼接件232、第三主拼接件233、第四主拼接件234、第一辅拼接件235以及第二辅拼接件236之一或以上。在其他实施例中，本领域技术人员完全可以在背框23上设置其他数量的支架，比如一个支架或以上。此外，支架可以拆卸固定于第一主拼接件231、第二主拼接件232、第三主拼接件233、第四主拼接件234、第一辅拼接件235以及第二辅拼接件236之一或以上。
在支架2371、2372、2373、2374、2375、2376及2377上均设有凸包（未标示），背框23可以通过该凸包固定电路板等器件。
以下进一步说明上述背框23相应的模具。在本实施例中，第一主拼接件231和第三主拼接件233的尺寸相同，形状相同，使用相同的模具冲压制得。第二主拼接件232、第四主拼接件234、第一辅拼接件235以及第二辅拼接件236的尺寸相同，形状相同，使用相同的模具冲压制得，实现模具共用。因此，本发明的背框23可以通过使用两种小尺寸模具冲压制得，相比于现有技术中背框10需要大尺寸模具，本发明的背框23的模具结构简单且小，进而降低背框23模具的成本。此外，本发明的背框23相对于现有技术中背框10的整体背框，能够大幅节省材料，以降低平板显示装置20的生产成本。
请参见图10，图10是根据本发明第八实施例的一种背光系统的背框中拼接部的结构示意图。如图10所示，在本实施例中，第一主拼接件的一端设有两个拼接部，拼接部的结构与相应的第二主拼接部的一端适配，以使第一主拼接件与相应的第二主拼接件的一端拼接。
具体而言，第一主拼接件231的一端设有拼接部2311、2312，拼接部2311、2312沿第一主拼接件231的长度方向上间隔排列，拼接部2311、2312是在第一主拼接件231设置的形状与第二主拼接件232的一端适配的凹部，以收容第二主拼接件232的一端。如图11所示，以拼接部2311为例，拼接部2311为未贯穿第一主拼接件231的一端相对两侧面的凹部，凹部的形状为矩形，第二主拼接件232为一直条形。
在拼装较大尺寸背框23时，首先选择较邻近第一主拼接件231的端部的拼接部2311，并选择相应宽度的第二主拼接件232。随后将第二主拼接件232的一端设置在拼接部2311的凹部上。随后通过螺接、扣接或焊接等方式将第二主拼接件232的一端拼接固定在拼接部2311上。在拼装较小尺寸背框23时，首先选择较远离第一主拼接件231的端部的拼接部2312，并选择相应宽度的第二主拼接件232。随后将第二主拼接件232的一端设置在拼接部2312的凹部上。随后通过螺接、扣接或焊接等方式将第二主拼接件232的一端拼接固定在拼接部2312上。具体上，例如在第二主拼接件232的表面相应位置设有凸起，其中第二主拼接件232的凸起嵌入第一主拼接件231相对应位置的凹部，以拼接第一主拼接件231和第二主拼接件232，如图12所示。此外，所述第二主拼接件232的一端可以设有至少两个沿第二主拼接件232长度方向上间隔排列的凸起，比如两个、三个或四个等。
更进一步，第一主拼接件231的凹部为多阶梯结构的凹部，第二主拼接件232相对应位置设有与凹部适配的多阶梯结构的凸部，如图13所示。此外，如图14所示，以拼接部2311为例，第一主拼接件231的凹部底部设有第一贯穿孔2313，第二主拼接件232相应于拼接部2311的位置上设有第二贯穿孔2321，背框23进一步包括固定件240，固定件240穿过第一贯穿孔2313和第二贯穿孔2321，以将第一主拼接件231和第二主拼接件232拼接。
如图15，在本发明背光系统的背框的另一实施例中，第一主拼接件231的拼接部2311、2312的凹部形状为圆形。但是，在其他实施例中，本领域技术人员完全可以将凹部的形状设置成三角形等其他多边形形状。
如图16，在本发明背光系统的背框的另一实施例中，拼接部2311、2312为贯穿第一主拼接件231的相对两侧的凹部，以使第二主拼接件232的一端在拼接部2311、2312上移动。比如在第二主拼接件232的一端穿出拼接部2312并拼接固定后，可裁切掉穿出部分，进而调节第二主拼接件232在作为背框主拼接件时的长度。
在实际应用中，第一主拼接件231的另一端以及第三主拼接件233的两端均设有两个拼接部，其结构与拼接部2311、2312的结构相同；而在第二主拼接件232的两端和第四主拼接件234的两端，对应于不同的情况，也相应进行设计或不设计，比如：
1）第一种情况，如图11所示，第二主拼接件232的两端和第四主拼接件234的两端可以不进行任何设计，即端部与其他部位的结构相同，这时候在选择第一主拼接件231一端的不同拼接部2311（2312）进行拼接时（另一端同样处理），若想背框23的宽度相应变化，则相应的第二主拼接件232和第四主拼接件234的长度也作相应的选择。即，若选邻近第一主拼接件231一端的拼接部2311进行拼接，则不对第二主拼接件232和第四主拼接件234进行裁剪，或裁剪掉的部分较短；若选择较远离第一主拼接件231一端的拼接部2312进行拼接时，则对第二主拼接件232和第四主拼接件234均进行裁剪，按照拼接部距离第一主拼接件231一端的远近，裁剪掉的部分也较长或较短；
2）第二种情况，类似前述第一种情况，如图12所示，只不过第二主拼接件232和第四主拼接件234以不同的凸起来分别与第一主拼接件231和第三主拼接件233配合，实现背框23的宽度变化；同样，若选择除离第一主拼接件231一端最近的第一拼接部2311之外的其他拼接部2312进行拼接时，在拼接后或拼接前，将多出的第二主拼接件232和第四主拼接件234部分进行裁剪。
以上情况也适用于仅用两个L形主拼接件进行拼接而得到背框23的主框架27。
综上所述，本发明的背框23的第一主拼接件上设有至少两个拼接部，根据用户需求进行设置拼接部的数量，在本实施例中选取两个拼接部2311、2312进行描述。因此，在设置背框23的模具时，仅需设置两组模具，即第一主拼接件的模具以及第二主拼接件的模具，在第一主拼接件上设置多个拼接部以拼接得到各种尺寸的背框23。在拼装背框23时，可以根据背框23的尺寸，选择相应的拼接部，通过拼接部将第二主拼接件拼接在第一主拼接件的拼接部上，并将第一主拼接件中位于第二主拼接件的拼接位置外侧的其他拼接部裁切掉，以获取所需尺寸的背框23。相对于现有技术中根据不同尺寸的背框10设置不同背框模具，本发明的背框23仅需设置第一主拼接件的模具和第二主拼接件28的模具，实现满足各种尺寸产品要求的模具共用，并且模具结构简单，能够降低背框模具的成本。
在以上各实施例中，封装支架都可以设置各个主拼接件的其中一个或多个上。
如图17所示，本发明还提供一种制造背光系统的方法，该方法包括以下步骤：
步骤501：制作至少第一、第二两个主拼接件，其中第一主拼接件的一端设有至少两个拼接部，每个拼接部的结构与相应的第二主拼接件一端适配。
步骤502：制作封装支架，并将封装支架设置于第一主拼接件或第二主拼接件上，将半导体光源直接封装于第一主拼接件或第二主拼接件上；
步骤503：在封装所述半导体光源后根据背框的尺寸选择至少两个拼接部的一拼接部与相应的第二主拼接件的一端拼接。
在本实施例中，当第二主拼接件的拼接位置与第一主拼接件的相邻端部之间存在其他拼接部时，在根据背框的尺寸选择至少两个拼接部的一拼接部与相应的第二主拼接件的一端拼接的步骤之前或之后，将第一主拼接件中位于第二主拼接件的拼接位置外侧的其他拼接部裁切掉。其中第一主拼接件为上述第一主拼接件，第二主拼接件为上述第二主拼接件，在此不再赘述。
所述制作封装支架的步骤中或之后，包括：在对应封装半导体光源的局部或整体设置散热层。
所述在对应封装半导体光源的局部或整体设置散热层的步骤具体为：在对应封装半导体光源的局部或整体涂布散热材料，形成所述散热层。
如图18所示，本发明的平板显示装置20进一步包括一触摸屏29，触摸屏29设置在平板显示装置20的显示面板22的出光面上。其中，平板显示装置20包括：背光系统21以及上述的显示面板22，背光系统21设置于显示面板22的背面，并且为显示面板22提供照明。
背光系统21包括半导体光源25、匀光机构24以及背框23。其中，背框23承载半导体光源25和匀光机构24。在背光系统21为侧光式时，匀光机构24是导光板；在背光系统21为直下式时，匀光机构24是扩散板。背框23包括至少第一主拼接件和第二主拼接件，至少第一、第二两个主拼接件形成背框23的主框架27。
当然，背光系统21还可以是前述任一背光系统实施例中的结构。
值得注意的是，本发明的平板显示装置20可以为液晶显示装置或液晶电视机。
本发明还提供一种立体显示装置30，如图19所示，立体显示装置30包括液晶透镜光栅31、背光系统32以及显示面板33。其中，液晶透镜光栅31设置于显示面板33的出光面上。背光系统32为上述各实施例的背光系统，比如背光系统32包括背框23。其中，背框23包括至少第一主拼接件和第二主拼接件，至少第一、第二两个主拼接件形成背框的主框架。背光系统32还可以是前述任一背光系统实施例中的结构，在此不再赘述。
本发明还提供一种等离子显示装置40，如图20所示，等离子显示装置40包括等离子显示面板41以及背框42，背框42设置在等离子显示面板41的背面。其中，背框42可以为前述任一实施例的背框，在此也不再赘述。
通过上述方式，本发明背光系统、背光系统的制造方法及平板显示装置能够降低材料成本、模具成本和解决半导体光源的散热问题。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种平板显示装置，包括背光系统，所述背光系统包括背框和LED光源，其中，
    所述背框包括至少第一、第二两个主拼接件，其中所述第一主拼接件的一端设有至少两个拼接部，每个拼接部的结构与相应的所述第二主拼接件的一端适配，所述第一主拼接件通过其一拼接部与相应的所述第二主拼接件的一端拼接；
    所述第一主拼接件或第二主拼接件包括底板以及自底板的长边一侧向上延伸的侧板；
    所述背光系统包括封装支架，所述封装支架设置在所述第一主拼接件或所述第二主拼接件的侧板内侧；
    所述LED光源数量为多个，并且直接封装于所述封装支架上；
    所述封装支架的局部或整体设置有散热层。
  2. 根据权利要求1所述的平板显示装置，其中，
    所述背框包括第三主拼接件以及第四主拼接件；
    所述第一主拼接件、第二主拼接件、第三主拼接件以及第四主拼接件皆为直条形，并且首尾拼接，以围绕形成所述背框的矩形主框架。
  3. 一种背光系统，包括背框和半导体光源，其中，
    所述背框包括至少第一、第二两个主拼接件，其中所述第一主拼接件的一端设有至少两个拼接部，每个拼接部的结构与相应的所述第二主拼接件的一端适配，所述第一主拼接件通过其一拼接部与相应的所述第二主拼接件的一端拼接；
    所述背光系统包括封装支架，所述封装支架设置在所述第一主拼接件或所述第二主拼接件上，所述半导体光源直接封装于所述封装支架上。
  4. 根据权利要求3所述的背光系统，其中，所述封装支架的局部或整体设置有散热层。
  5. 根据权利要求4所述的背光系统，其中，所述第一主拼接件或第二主拼接件包括底板以及自底板的长边一侧向上延伸的侧板，所述封装支架设置在所述侧板的内侧。
  6. 根据权利要求3所述的背光系统，其中，所述半导体光源是LED光源，数量为多个。
  7. 根据权利要求3所述的背光系统，其中，所述至少两个拼接部沿第一主拼接件的长度方向上间隔排列。
  8. 根据权利要求7所述的背光系统，其中，所述拼接部是第一主拼接件表面上设置的形状与第二主拼接件的一端适配的凹部，以收容第二主拼接件的一端。
  9. 根据权利要求7所述的背光系统，其中，所述拼接部是第一主拼接件表面上设置的凹部，所述第二主拼接件的表面相应位置设有凸起，所述凸起嵌入凹部，以拼接所述第一主拼接件和第二主拼接件。
  10. 根据权利要求9所述的背光系统，其中，所述第二主拼接件的一端表面设有至少两个沿第二主拼接件长度方向上间隔排列的凸起。
  11. 根据权利要求8所述的背光系统，其中，所述第一主拼接件的凹部底部设有第一贯穿孔，所述第二主拼接件的相应位置设有第二贯穿孔，所述背框包括固定件，所述固定件穿过第一贯穿孔和第二贯穿孔以将第一主拼接件和第二主拼接件拼接。
  12. 根据权利要求3所述的背光系统，其中，
    所述背框包括第三主拼接件以及第四主拼接件；
    所述第一主拼接件、第二主拼接件、第三主拼接件以及第四主拼接件皆为直条形，并且首尾拼接，以围绕形成所述背框的矩形主框架。
  13. 根据权利要求12所述的背光系统，其中，所述背框包括设置于主框架内的辅拼接件，所述辅拼接件与主框架拼接。
  14. 根据权利要求13所述的背光系统，其中，
    所述辅拼接件包括第一辅拼接件和第二辅拼接件，所述第一辅拼接件的两端分别与第一主拼接件、第二主拼接件、第三主拼接件以及第四主拼接件中的至少两个主拼接件拼接，所述第二辅拼接件的两端分别与第一主拼接件、第二主拼接件、第三主拼接件以及第四主拼接件中的至少两个主拼接件拼接。
  15. 根据权利要求14所述的背光系统，其中，所述第一辅拼接件的两端分别与相邻设置的第一主拼接件、第二主拼接件拼接，第二辅拼接件的两端与相邻设置的第三主拼接件、第四主拼接件拼接；或所述第一辅拼接件的两端分别与相对设置的第一主拼接件、第三主拼接件拼接，第二辅拼接件的两端与相对设置的第一主拼接件、第三主拼接件拼接。
  16. 根据权利要求14所述的背光系统，其中，所述背框包括至少一个支架，可拆卸固定于所述第一主拼接件、第二主拼接件、第三主拼接件、第四主拼接件、第一辅拼接件以及第二辅拼接件之一或以上，所述支架设有凸包。
  17. 一种制造背光系统的方法，其中，
    制作至少第一、第二两个主拼接件，其中第一主拼接件的一端设有至少两个拼接部，每个拼接部的结构与相应的第二主拼接件一端适配；
    制作封装支架，并将封装支架设置于第一主拼接件或第二主拼接件上；将半导体光源直接封装于封装支架上；
    在封装所述半导体光源后根据背框的尺寸选择所述至少两个拼接部的一拼接部与相应的第二主拼接件的一端拼接。
  18. 根据权利要求17所述的方法，其中，所述制作封装支架的步骤中或之后，包括：在对应封装半导体光源的局部或整体设置散热层。
  19. 根据权利要求18所述的方法，其中，所述在对应封装半导体光源的局部或整体设置散热层的步骤具体为：在对应封装半导体光源的局部或整体涂布散热材料，形成所述散热层。
  20. 根据权利要求17所述的方法，其中，当所述第二主拼接件的拼接位置与所述第一主拼接件的相邻端部之间存在其他拼接部时，在根据背框的尺寸选择所述至少两个拼接部的一拼接部与相应的第二主拼接件的一端拼接的步骤之前或之后，将所述第一主拼接件中位于所述第二主拼接件的拼接位置外侧的所述其他拼接部裁切掉。
PCT/CN2012/076038 2012-05-22 2012-05-25 背光系统、背光系统的制造方法及平板显示装置 WO2013174005A1 (zh)

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