WO2013162285A1 - Carrier plate for forming external electrode and method for manufacturing same - Google Patents

Abstract

The invention relates to a carrier plate on which a plurality of chip components are to be fixed so as to form external electrodes on the outer surfaces of chip components, comprising: a first metal plate having a plurality of first holes penetrating therethrough; a second metal plate having a plurality of second holes penetrating therethrough which correspond to the first holes; and a rubber plate interposed between the first metal plate and the second metal plate, the rubber plate being inserted into the first and second holes, respectively, so as to form support holes inside the first and second holes, the inner diameters of the support holes being smaller than the inner diameters of the first and second holes and enabling the outer and inner surfaces of the chip components to contact and be fixed in the support holes.

Description

Carrier plate for external electrode formation and manufacturing method

The present invention relates to a carrier plate used to form an external electrode on an outer surface of a chip component and a method of manufacturing the same.

In general, small chip components such as multi-layer ceramic capacitors (MLCCs), inductors, varistors, capacitors, and the like have become increasingly miniaturized in size due to the thin and thin components of electronic products.

One of various methods of forming an external electrode on an outer surface of the chip component to be electrically connected to an internal electrode formed inside the chip component and exposing an end thereof to the outer surface is a large amount of chips using a separate carrier plate. The process of apply | coating an electrode to a component simultaneously simultaneously is known.

That is, in the process of forming an external electrode on the outer surface of the chip component by using the carrier plate in a state in which each chip component is seated in a plurality of small holes formed in the carrier plate, respectively, using a vacuum pressure or a vibrator, The conductive paste was applied to the outer surface of the chip component and dried to form the external electrode 1a.

The operation of forming the external electrodes 1a on both ends of the chip component 1 using the conventional external electrode forming carrier plate 10 is performed by the thin metal plate 11 as illustrated in FIGS. 1A and 1B. The adhesive tape 15 attached to the rear surface of the metal plate 11 is inserted into the chip component 1 into a plurality of fixing holes 13 formed in a rectangular or circular shape larger than the chip component 1). As a result, the chip component 1 inserted into the fixing hole is fixed.

In this state, the metal plate 11 having the chip component inserted and fixed is lowered toward the settling tank 5 in which the conductive paste 5a is stored so that the conductive paste is applied to the lower end of the chip component 1 to form an external electrode. Work was performed.

In addition, as shown in FIGS. 2A and 2B, the operation of forming the external electrode 2a on the specific surface of the chip component 2 using the other external electrode forming carrier plate 20 is thin. The chip parts 2 are inserted into the plurality of fixing holes 23 formed through the metal plate 21 in a quadrangle having a larger size than the chip parts 2, and the chip parts 2 are placed on the basis of one edge of the fixing holes. After the alignment arrangement, the chip component 2 inserted into the fixing hole is fixed as the adhesive tape 25 attached to the rear surface of the metal plate 21.

In this state, as described above, the metal plate 21 into which the chip component is fixed is lowered to the base 6 side in which the conductive paste 6a is stored in the groove, and the conductive paste is applied to the specific outer surface of the chip component 2 so that the external The operation of forming the electrode 2a was performed.

However, in the process of adhering and fixing the chip parts 1 and 2 to the adhesive surfaces of the adhesive tapes 15 and 25, the chip parts are caused by the limitation of the adhesive force of the adhesive tapes 15 and 25 and the poor adhesive force. Frequently, process defects from separation and separation were generated.

In addition, after forming an external electrode on one end or one side of the chip component, and then separating the adhesive tape to form another external electrode on the other end or the other side, the other end of the chip component using another adhesive tape and Since the work to form the external electrode on the side has to be performed, the work process is very complicated, which acted as a major cause of lowering the work productivity.

In addition, in order to form the linear external electrode 2a at a specific position so as to be electrically connected to the internal electrode on a specific external side of the chip component 2 such as an array type low inductance ceramic capacitor (LICC), the metal plate 21 is formed on the metal plate 21. Since the chip parts 2 should be aligned in a mechanical manner based on an arbitrary edge of the formed fixing hole 23 and fixed in the correct position, the chip parts having the small size are precisely positioned in the fixing hole 23 which is a narrow space. Arrangement on the substrate is technically limited, and the position of the applied external electrode is misaligned, resulting in product defects.

In addition, the carrier plates 10 and 20 may be formed on the outer side surface of the chip component 2 in consideration of an electrode forming process or directionality in which the external electrodes 1a are formed on both ends of the chip component 1 without considering the orientation. There was a cumbersome problem of having to prepare a plurality of carrier plates in accordance with an electrode forming process of forming the external electrode 2a at a specific position.

(Patent Document 1) KR0934976 B1

Patent Document 1 discloses a carrier plate and a manufacturing method filed by the same applicant and registered on December 23, 2009. However, in the process of manufacturing such a conventional carrier plate, the thickness thereof is reduced in accordance with the chip component to be miniaturized. There was a limit.

The present invention is to solve the problems described above, the object is to prevent the separation of the chip component from the metal plate during the process of forming the external electrode, and does not consider the chip component and orientation considering the orientation The external electrode forming process can be performed in the same way by inserting and fixing all the chip parts, and the work of forming the external electrode on the outer surface of the chip part can be performed precisely without electrode defects in accordance with the miniaturization trend of the chip parts, and the product yield. It is possible to increase and increase the rigidity, and to provide a carrier plate and a manufacturing method for forming an external electrode that can extend the service life.

As a specific means for achieving the above object, the present invention is a carrier plate to which a plurality of chip components are fixed to form an external electrode on an outer surface, the carrier plate comprising: a first metal plate through which a plurality of first openings are formed; A second metal plate penetrating through the plurality of second opening holes corresponding to the first opening hole, the second metal plate being interposed between the first metal plate and the second metal plate and filled in the first and second opening holes, respectively; And a rubber plate having an inner diameter smaller than the inner diameter of the first and second openings in the two openings to form a support hole in which the outer surface and the inner circumferential surface of the chip component are inserted and fixed. Provided is a carrier plate for formation.

In addition, the present invention provides a carrier plate on which a plurality of chip components are fixed to form an external electrode on an outer surface, the carrier plate comprising: a first metal plate having a plurality of first openings formed through a first small diameter portion and a first large diameter portion; A second metal plate corresponding to the first opening hole and having a plurality of second opening holes formed through the second small diameter portion and the second large diameter portion, interposed between the first metal plate and the second metal plate; A rubber plate is formed in each of the opening holes and has an inner diameter smaller than the inner diameter of the first and second opening holes in the first and second opening holes to form a support hole in which the outer surface and the inner circumferential surface of the chip component are inserted and fixed. It provides a carrier plate for external electrode formation comprising a.

Preferably, the first opening hole and the second opening hole are formed through the same inner diameter size or provided in different sizes.

Preferably, the first metal plate, the second metal plate, and the rubber plate are provided with the same plate thickness or different plate thicknesses.

Preferably, at least one of a lower surface of the first metal plate in contact with the rubber plate, an upper surface of the second metal plate, and an inner surface of the first and second openings is provided with a rough surface.

Preferably, a plurality of gaps are formed at a lower surface of the first metal plate or an upper surface of the second metal plate to protrude a predetermined height such that an end portion is in contact with a surface of a corresponding metal plate so as to maintain a vertical gap between the first metal plate and the second metal plate. A holding projection is provided.

Preferably, the opening hole is formed through the circular or polygonal cross section, the support hole is provided with the same or different from the through shape of the opening hole.

Preferably, the first opening hole or the second opening hole is provided on the inner circumferential surface of the rubber plate in contact with the rubber plate with a groove formed in a cross-sectional shape of any one of circular, elliptical and polygonal.

Preferably, the first and second large diameter portions have at least one reinforcing jaw extending toward the first and second small diameter portions.

Preferably, the first and second large diameter portions are provided as truncated conical holes having an inner circumferential surface inclined at a predetermined angle with respect to the vertical inner circumferential surface of the first and second small diameter portions as the inner diameter gradually decreases toward the first and second small diameter portions.

Preferably, the first opening and the second opening are in contact with one surface of the first and second metal plates from the first and second large diameter portions to the first and second small diameter portions in contact with the other surfaces of the first and second metal plates. It is provided with a truncated cone that gradually decreases in diameter.

In addition, the present invention provides a method of manufacturing a carrier plate to which a plurality of chip components are fixed to form an external electrode on an outer surface, comprising: a first metal plate through which a plurality of first openings are formed; A preparation step of providing a second metal plate having a plurality of second openings formed therethrough; Laminating step of providing a laminate having a rubber plate disposed between the first metal plate and the second metal plate: the laminate is placed in a cavity between the upper and lower molds, at least one of the upper and lower molds at a predetermined temperature Heating and pressurizing to fill a portion of the body of the rubber plate that is thermally deformed by heating to a predetermined pressure between the outer surface of the core pin disposed inside the first and second openings and the inner surface of the first and second openings. Forming step; And a demolding step of separating the stack from the upper and lower molds, and separating the core pins from the first and second opening holes, wherein the core pins are separated and removed from the first and second opening holes. The present invention provides a method for manufacturing a carrier plate for forming an external electrode, comprising forming a support hole having an inner diameter smaller than an inner diameter of two openings and contacting and fixing the outer surface and the inner circumferential surface of the chip component.

In addition, the present invention provides a method of manufacturing a carrier plate to which a plurality of chip components are fixed to form an external electrode on an outer surface, comprising: a first metal plate through which a plurality of first openings are formed; A preparation step of providing a second metal plate having a plurality of second openings formed therethrough; Laminating step of providing a laminate having a rubber plate disposed between the first metal plate and the second metal plate: the laminate is placed in a cavity between the upper and lower molds, at least one of the upper and lower molds at a predetermined temperature A heating and pressure forming step of filling the inside of the first and second openings with a portion of the body of the rubber plate which is thermally deformed by heating at a predetermined pressure. A demolding step of separating a laminate in which rubber plates are filled in the first and second opening holes from upper and lower molds; And arranging a through pin having an outer diameter size relatively smaller than the inner diameter of the first and second openings to correspond to the first and second openings, and then filling the rubber plate filled in the first and second openings by the through pins. Including through the through; The first and second openings in which the through pin is separated, including the inner diameter of the size smaller than the inner diameter of the first and second openings in contact with the outer surface and the inner circumferential surface of the chip component is inserted and fixed It provides a method for manufacturing a carrier plate for forming an external electrode, characterized in that for forming a support hole.

In addition, the present invention provides a method of manufacturing a carrier plate to which a plurality of chip components are fixed to form an external electrode on an outer surface, comprising: a first metal plate through which a plurality of first openings are formed; A preparation step of providing a second metal plate formed therethrough with a corresponding second opening hole; Laminating step of providing a laminated body laminated to maintain a predetermined size of vertical gap between the first metal plate and the second metal plate: the laminate is placed in the cavity between the upper and lower molds, the liquid rubber in the vertical gap A rubber material injection molding step of filling a liquid rubber material between an outer surface of the core pins disposed in the first and second opening holes and an inner surface of the first and second opening holes to supply ash to form a rubber plate; And a demolding step of separating the laminate from the upper and lower molds and separating the core pins from the first and second opening holes. Including a core pin having an inner diameter of a size smaller than the inner diameter of the first and second openings in the separated first and second openings to form a support hole in contact with the outer surface and the inner circumferential surface of the chip component is inserted and fixed Provided is a method of manufacturing a carrier plate for forming an external electrode.

Preferably, the first opening is made of a first large diameter portion and a first small diameter portion having different inner diameter sizes, or the second opening is made of a second large diameter portion and a second small diameter portion having different inner diameter sizes.

Preferably, the laminating step is provided with a rubber layer on each side of the first metal plate and the second metal plate facing each other, and a rubber plate consisting of a rubber layer which is stacked up and down between them when the first and second metal plates are laminated; The laminate is formed by the first and second metal plates.

Preferably, the laminating step includes a rubber plate on either side of the first metal plate or the second metal plate facing each other, and the rubber plate and the first and second metal plate interposed therebetween when the first and second metal plates are laminated. The laminate is formed by.

Preferably, the laminating step is provided with a rubber plate or a rubber layer by a spray method for spraying a liquid resin solution or a printing method for printing a liquid resin solution applied to any one side of the first metal plate or the second metal plate. When the first and second metal plates are laminated, a laminate is formed by a rubber plate or a rubber layer interposed therebetween and the first and second metal plates.

Preferably, the laminating step is the upper surface of the rubber plate or the rubber layer is bonded to the lower surface of the first metal plate or the adhesive layer is applied to the lower surface of the first metal plate and the upper surface of the second metal plate The rubber plate or the lower surface of the rubber layer forms a laminate in which the upper surface of the second metal plate is bonded.

Preferably, the heating and pressure forming step is filled in the space between the outer surface of the core pin and the inner surface of the first and second opening holes and the body portion of the remaining rubber plate is formed through the first and second opening holes The first and second metal plates flow out into the free space recessed in the lower surface of the upper mold or the upper surface of the lower mold corresponding to the hole through area.

Preferably, the heating and pressure forming step is a state in which the first and second heat resistant sheets are provided to cover and seal the first and second opening holes on each outer surface of the first and second metal plates facing the upper and lower molds. Is done.

More preferably, the first and second heat resistant sheets corresponding to the first and second opening holes are formed to penetrate at least one exhaust hole located in the inner diameter range of the support hole.

Preferably, the heating and pressure forming step is filled with a portion of the body of the rubber plate or the rubber layer protrudes into a free space formed in the inner surface of any one of the upper and lower molds corresponding to the boundary region of the first and second metal plate. .

Preferably, the heating and pressure forming step is filled with a portion of the body of the rubber plate protrudes into a free space formed in the inner surface of any one of the upper and lower molds corresponding to the boundary region of the first and second metal plate.

Preferably, the rubber material injection molding step is to inject a liquid rubber material through the injection hole formed in any one of the upper and lower molds so as to correspond to the upper and lower intervals or the injection hole formed in the upper surface of the upper mold or the lower surface of the lower mold Injecting the liquid rubber material through the to form a rubber plate.

Preferably, the laminating step is a vertical interval between the first metal plate and the second metal plate by a spacing for holding the tip contacting the surface of the corresponding metal plate protruding a certain height from any one of the first metal plate and the second metal plate. The first and second metal plates are laminated to form a film.

(1) When the first metal plate and the second metal plate are made of small diameter parts and large diameter parts or penetrate straight first and second opening holes, respectively, and a part of the rubber plate interposed between the first and second metal plates is heated and pressed. Thermally deformed and filled in the first and second openings, penetrating the through pins through the first and second openings filled with the rubber plate, and smaller than the inner diameter of the small diameter portion constituting the first and second openings when the through pins are separated. By forming a support hole through which the outer surface and the inner circumferential surface of the chip component are inserted and fixed through the first and second opening holes, the rubber plate interposed between the first and second metal plates can be prevented from being peeled off from the metal plate. As a result, it is possible to prevent product defects caused by the peeling of the rubber plate fixing the chip component from the metal plate, and to extend the product life, thereby reducing the manufacturing cost.

(2) Increase the external force to fix the chip component inserted into the support hole of the metal plate to prevent separation of the chip component from the metal plate during the process of forming the external electrode, thereby increasing the product yield, chip considering the orientation It can be precisely positioned in the supporting hole without any separate process for aligning the position of the parts, and it is possible to precisely perform the task of forming the external electrode on the outer surface of the miniaturized chip parts according to the miniaturization trend of the chip parts without any electrode defect. It can increase the reliability of the product, reduce the manufacturing cost, and significantly improve the work productivity.

(3) By closing the opening hole so that the rubber plate thermally deformed by the heat-resistant sheet provided on the outer surface of the first and second metal plates does not flow out during the heating and press molding of the laminate consisting of the first and second metal plates and the rubber plates, Since the rubber plate heat-deformed on the outer surface of the metal plate is not leaked out, it is not necessary to cumbersomely remove the attached rubber plate, thereby improving the workability of manufacturing the carrier plate.

(4) By forming an exhaust hole in the heat resistant sheet corresponding to the opening hole, bubbles contained in the rubber plate heat-deformed during heating and press molding can be discharged to the outside through the exhaust hole, thereby preventing voids caused by bubbles. It is possible to prevent the defects of the carrier plate due to voids and to improve product reliability.

(5) Since the first metal plate and the second metal plate are laminated with the rubber plate in between, the rigidity of the carrier plate can be increased to extend the service life of the product.

1A and 1B are schematic views illustrating a process of forming an external electrode at an end of a non-directional chip product using a conventional carrier plate for external electrode formation.

2A and 2B are schematic views illustrating a process of forming an external electrode on a specific portion of an outer surface of a directional chip product using a conventional external electrode forming carrier plate.

3 is a plan view illustrating a carrier plate for forming an external electrode according to a first embodiment of the present invention.

4 is a cross-sectional view showing a carrier plate for forming an external electrode according to the first embodiment of the present invention.

5 is a plan view illustrating a carrier plate for forming an external electrode according to a second embodiment of the present invention.

6 is a cross-sectional view showing a carrier plate for forming an external electrode according to a second embodiment of the present invention.

7A to 7C are enlarged views illustrating first and second opening holes used in a carrier plate for forming an external electrode according to a second embodiment of the present invention.

8A to 8J are plan views illustrating various types of support holes used in the carrier plates for forming external electrodes according to the first and second embodiments of the present invention.

8K to 8M are plan views illustrating various forms of opening holes used in the carrier plates for forming external electrodes according to the first and second embodiments of the present invention.

9 is a flowchart illustrating a method of manufacturing a carrier plate for external electrode formation according to a first embodiment of the present invention.

10A to 10D are process diagrams illustrating a method of manufacturing a carrier plate for external electrode formation according to a first embodiment of the present invention.

11 is a flowchart illustrating a method of manufacturing a carrier plate for forming an external electrode according to a second embodiment of the present invention.

12A to 12D are process diagrams illustrating a method of manufacturing a carrier plate for external electrode formation according to a second embodiment of the present invention.

13 is a flowchart illustrating a method of manufacturing a carrier plate for external electrode formation according to a third embodiment of the present invention.

14A to 14E are flowcharts illustrating a method of manufacturing a carrier plate for external electrode formation according to a third embodiment of the present invention.

15A and 15B are diagrams illustrating a lamination step applied to a method of manufacturing a carrier plate for forming external electrodes according to first and third embodiments of the present invention.

16A and 16B illustrate an operation of forming external electrodes on non-directional chip products and directional chip products using a carrier plate for external electrode formation according to an exemplary embodiment of the present invention.

The objects, features and advantages of the present invention described above will become more apparent from the following detailed description. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 3 and 4, the carrier plate 100 for forming an external electrode according to the first embodiment of the present invention has an electrode forming conductivity on an outer surface such as an end or an outer surface of a chip component having a predetermined size. In order to form the external electrode by applying the paste, a plurality of chip parts, which are the workpieces, are inserted and fixed, and include the first metal plate 110, the second metal plate 120, and the rubber plate 130.

The first metal plate 110 is formed of a thin metal ultra-thin plate that penetrates the plurality of first openings 112 so as to be aligned at a predetermined interval, and the second metal plate 120 is the first opening. It is made of a thin metal ultra-thin plate that penetrates the plurality of second openings 122 with a predetermined interval so as to correspond to the hole 112 one-to-one.

The first and second metal plates 110 and 120 may be made of a metal material such as SUS. The first and second metal plates 110 and 120 may be formed of a thin plate having a thickness relatively thinner than the thickness or length of the chip component to be fixed.

The plurality of first and second openings 112 and 122, which are formed through the first and second metal plates 110 and 120 in a substantially circular or square hole form and are arranged, may be formed through a wet or dry etching process, but are not limited thereto. It is not intended to be formed through a separate machining process using a plurality of drills or punching dies.

Here, the first opening 112 formed through the first metal plate 110 and the second opening 122 formed through the second metal plate 120 are shown to be formed through the same inner diameter size. As described above, the present invention is not limited thereto, and may be provided with different inner diameter sizes while the center is positioned on the same virtual vertical axis.

The rubber plate 130 is disposed so as to be interposed between the first metal plate 110 and the second metal plate 120 to be filled in contact with the inner surfaces of the first and second openings 112 and 122, respectively. An elastic body such as silicon is formed in the two openings 112 and 122 to form the support hole 132 having an inner diameter relatively smaller than the inner diameter of the first and second openings 112 and 122.

Accordingly, when the first metal plate 110 and the second metal plate 120 are integrally coupled to each other via the rubber plate 130, and a chip component that is a fixed object is inserted into the support hole 132, The outer surface of the chip component elastically contacts the inner circumferential surface of the support hole 132 to generate a fixing force for positioning the chip component.

At this time, the rubber plate 130 is filled with the inside of the first and second openings (112, 122) during pressing and heat deformation while considering the total volume required to penetrate the support hole 132 of the silicon material that is prefabricated It is provided in a plate shape, but is not limited thereto, and is disposed between the first metal plate 110 and the second metal plate 120 at an upper and lower intervals in a cavity formed between upper and lower molds, and the first and second opening holes ( 112 and 122 may be made of a silicon filler filled by an injection molding process forcibly injecting liquid silicon at intervals formed between the first and second metal plates 110 and 120 in a state in which the core pins are disposed.

Here, the support hole 132 provided in the rubber plate 130 is provided in any one of the upper and lower molds, and has an outer diameter size relatively smaller than the inner diameter of the first and second opening holes 112 and 122. It is formed by the core pin is disposed in the center of the first and second openings (112, 122).

In addition, at least one of the lower surface of the first metal plate 110 in contact with the rubber plate 130, the upper surface of the second metal plate 120, and the inner surface of the first and second openings 112 and 122 may be provided. It is preferable to have a rough surface so as to increase the close bonding force with the (120) to prevent the peeling of the first and second metal plates (110, 120).

In addition, the lower surface of the first metal plate 110 or the upper surface of the second metal plate 120, the surface of the metal plate corresponding to maintain the vertical gap between the first metal plate 110 and the second metal plate 120 when laminated It is preferable to have a plurality of gap holding projections 145 are formed to protrude a predetermined height so that the end contact.

The plurality of gap maintaining protrusions 145 are independent structures provided on a lower surface of the first metal plate 110 or an upper surface of the second metal plate 120 in a circular, elliptical or polygonal cross-section.

In addition, the first and second metal plates 110 and 120 and the rubber plate 130 are illustrated and described as being provided with the same plate thickness, but the present invention is not limited thereto and may be provided with different plate thicknesses.

As shown in FIGS. 5 to 7C, the carrier plate 100a for forming an external electrode according to the second embodiment of the present invention may have the first metal plate 110, the second metal plate 120, and the like. It includes a rubber plate 130, the same reference numerals for the same configuration, and detailed description thereof will be omitted.

The first metal plate 110 is a thin metal ultra thin plate formed by penetrating a plurality of first openings 112 formed of a first small diameter portion 112a and a first large diameter portion 112b having different inner diameter sizes. Is done.

The second metal plate 120 is arranged at a predetermined interval so as to correspond one-to-one with the first opening hole 112, and to the second small diameter portion 122a and the second large diameter portion 122b having different inner diameter sizes. It consists of a thin metal ultra-thin plate formed by penetrating a plurality of second opening holes 122 formed therein.

The first and second small diameter parts 112a and 122a may have a straight hole shape having an inner diameter size relatively smaller than the first and second large diameter parts 112b and 122b having a straight hole shape. It is formed in close proximity to the surface of, the large diameter portion (112b, 122b) is formed in close proximity to the rubber plate (130).

Here, the first and second large diameter portions 112b and 122b have at least one reinforcing jaw 112c extending a predetermined length from the inner circumferential surface toward the first and second small diameter portions 112a and 122a, as shown in FIG. 7A. It is preferable to have (122c).

Accordingly, the first small diameter portions 112a and 122a may be structurally reinforced by the reinforcing jaws 112c and 122c extending from the first and second metal plates 110 and 120. Although illustrated and described as extending to have a forming length from the inner circumferential surface of the first and second large diameter portions 112b and 122b to the inner circumferential surface of the first and second small diameter portions 112a and 122a, the present invention is not limited thereto. It may be provided shorter than the length.

In addition, as shown in FIG. 7B, the first and second large diameter parts 112b and 122b are gradually smaller toward the first and second small diameter parts 112a and 122a in the form of straight holes, and the first and second large diameter parts 112b and 122b are gradually smaller. It may be provided in the form of a truncated cone having an inner circumferential surface inclined at a predetermined angle with respect to the vertical inner circumferential surface of the small diameter portion.

The first and second metal plates 110 and 120 are formed through the first and second small diameter portions 112a and 122a having different inner diameter sizes, and the first and second large diameter portions 112b and 122b. As shown in FIG. 7C, the second openings 112 and 122 are formed from the first and second large diameter parts 112b and 122b formed therethrough so as to contact one surface of the first and second metal plates 110 and 120. The inner diameter of the first and second small diameter portions 112a and 122a formed to penetrate to contact the other surfaces of the metal plates 110 and 120 may be provided as truncated conical holes that gradually decrease in diameter.

Here, the first opening 112 formed through the first metal plate 110 and the second opening 122 formed through the second metal plate 120 are centered on the same virtual vertical axis. Although shown and described as forming a stepped portion on the inner circumferential surface consisting of the first and second small diameter portion and the first and second large diameter portion having different inner diameter sizes, but not limited thereto. Three or more large diameter portions and small diameter portions may be formed to form a stepped portion.

The rubber plate 130 is in contact with each inner circumferential surface of the first and second small diameter portions 112a and 122a and the first and second large diameter portions 112b and 122b to be integrated with the first metal plate 110 and the second metal plate ( Interposed between the 120 and the support hole 132 having an inner diameter relatively smaller than the inner diameter of the first and second small holes 112a and 122a is provided inside the first and second openings 112 and 122. It is made of a resin elastomer such as silicone to form.

Accordingly, the first metal plate 110 and the second metal plate 120 are integrally coupled to each other via the rubber plate 130 as in the first embodiment, and are fixed objects into the support holes 132. When the chip component is inserted, the outer surface of the chip component elastically contacts the inner circumferential surface of the support hole 132 to generate a fixing force for positioning the chip component.

On the other hand, as the carrier plate (100, 100a) according to the first and second embodiments of the present invention, the support holes 132 into which the chip parts 1 and 2, which are to be fixed, are inserted and fixed, are provided in the first and second openings. It is preferable that the centers of the holes 112 and 122 coincide with each other.

The first and second openings 112 and 122 are formed in a circular or polygonal cross section, and the support holes 132 are the same as or different from each other in the through shape of the first and second openings 112 and 122. The through shape of the hole 132 is a cross-sectional shape of the through pin penetrating the rubber plate 130 filled in the first and second openings 112 and 122 or before the rubber plate is filled in the first and second openings 112 and 122. It is determined by the cross-sectional shape of the core pin which is removed after prepositioning.

That is, as shown in FIG. 8A, the support hole 132 into which the chip component as the fixing object is inserted and fixed has an outer edge and an inner surface of the chip component 1 to form the external electrode 1a at one end thereof. Line contact may be provided in a circular hole to generate a fixing force for fixing the chip component.

As shown in FIG. 8B, the support hole 132 is in surface contact with the outer surface and the inner surface of the chip component 2 for precisely forming the linear external electrode 2a at a specific position on one side of the outer surface. It may be provided as a square hole to generate a fixing force for fixing the.

As shown in FIGS. 8C and 8D, the support hole 132 partially contacts the outer surface of the chip component 2 to accurately form the linear external electrode 2a at a specific position on one outer surface of the support hole 132. At least one pair of embossed portions 132a are provided with a square hole protruding from the inner surfaces facing each other to generate a fixing force, or as shown in FIG. 8E, the inner surfaces facing the pair of grooves 132b. It may be provided with a square hole recessed in.

As shown in FIG. 8C, the embossing part 132a may be provided to partially contact the long side of the chip component, but is not limited thereto. The embossing unit 132a may be provided to partially contact the short side. As described above, both the long side and the short side of the chip component may be provided to partially contact each other.

As shown in FIGS. 8C and 8D, the embossing part 132a may be provided to protrude in a semicircular cross section or an arc cross section on the inner circumferential surface of the support hole 132 to partially contact the outer surface of the chip component. As shown in FIG. 8E, the recess 132b is recessed on the inner circumferential surface of the support hole 132 in a semi-circular cross section or an arc-shaped cross section so that the inner circumferential surface of the support hole 132 is partially in contact with the outer surface of the chip component. Can be.

As shown in FIGS. 8F to 8H, the support hole 132 includes at least one pair of cutout grooves 132c to partially contact the outer surface of the chip component to form the linear external electrode 2a at one side of the outer surface specific position. It may be provided with a square hole recessed in the inner surface facing each other.

As shown in FIG. 8F, the cutaway groove 132c is provided to partially recess the corner portion of the support hole 132, or as shown in FIG. 8G, to support the long side and the short side of the chip component. It may be provided to partially recess the inner surface of the hole, or as shown in FIG. 8H, may be provided to recess the whole of the inner surface of the support hole facing one of the long side and the short side of the chip component.

As shown in FIG. 8I, each of the support holes 132 contacts the outer edge of the chip component to form the linear external electrode 2a at a specific position on one side of the outer surface so as to generate a fixing force. It may be provided with a square hole formed in the corner portion.

As shown in FIG. 8J, the support hole 132 may be provided as a rhombic through hole in which the outer edge of the chip component is in contact with the straight portion.

On the other hand, the first and second openings 112 and 122 in which the support holes 132 are formed are circular, elliptical, and at regular intervals in the circumferential direction on the inner circumferential surface of the rubber plate 130 as shown in FIGS. 8K to 8M. The recesses 112d and 122d having a cross-sectional shape of any one of the polygons may be recessed so that the grooves 112d and 122d may be provided with circular holes filled with rubber plates.

Accordingly, the rubber plate 130 filled in the grooves 112d and 122d not only increases the bonding force between the first and second metal plates 110 and 120 and the rubber plate 130, but also protrudes to the surface of the metal plate during blade processing described later. It is possible to smoothly remove the old rubber plate.

The carrier plate manufacturing method according to the first embodiment of the present invention is a preparatory step (S1), lamination step (S2), heating and pressure forming step (S3) and demoulding, as shown in Figure 9 and 10a to 10d The carrier plates 100 and 100a having the plurality of support holes 132 for inserting and fixing the chip parts may be manufactured, including the step S4.

As shown in FIG. 10A, the preparation step S1 includes a first metal plate 110 having a substantially rectangular plate having a plurality of first openings 112 of a predetermined size formed therethrough, and the first openings 112. And a second rectangular metal plate 120 having a large rectangular plate through which a plurality of second openings 122 corresponding thereto are formed.

The first and second openings 112 and 122 may be penetrated so as to correspond to each other in a one-to-one correspondence with each other when the first and second metal plates 110 are stacked up and down.

In addition, a rubber plate 130 having an area substantially the same as the first and second metal plates 110 and 120 is provided, and the rubber plate 130 is preferably made of a thermoplastic silicone material deformed at a constant temperature and a constant pressure.

In the laminating step S2, as shown in FIG. 10B, three plates are stacked in a multi-layer by laminating a rubber plate 130 having a predetermined thickness between the first metal plate 110 and the second metal plate 120. It consists of one laminated body 140.

In the stack 140, the centers of the first opening 112 formed through the first metal plate 110 and the second opening 122 formed through the second metal plate 120 are located at the same vertical axis. It is preferable to laminate the laminate composed of the first and second metal plates 110 and 120 and the rubber plate 130 as much as possible.

At this time, the rubber plate 130 is applied between the lower surface of the first metal plate 110, which is the upper plate, and the adhesive layer (not shown) of a predetermined thickness, respectively, on the upper surface of the second metal plate 120, which is the lower plate. By laminating through the upper and lower surfaces of the rubber plate 130 is bonded through the lower surface of the first metal plate 110 and the adhesive layer and the upper surface and the adhesive layer of the second metal plate 120 are bonded through the It may be stacked in one stack 140.

The heating and pressure forming step (S3), as shown in FIG. 10C, prepares a mold including an upper mold 101 and a lower mold 102, and the laminate 140 between the upper mold and the lower mold. Place it.

In addition, the plurality of core pins 105 having a predetermined length protruding from one of the upper and lower molds 101 and 102 may be provided to correspond to the first and second opening holes 112 and 122 one-to-one.

Here, the core pin 105 is shown and described as extending vertically upward from a bottom surface of the lower mold vertically, but is not limited thereto. The core pin 105 may extend downwardly from a ceiling surface of the upper mold.

Subsequently, when the upper mold is pressed down to the lower mold side at a constant pressure P with respect to the lower mold positioned while heating one or both molds of the upper and lower molds 101 and 102 to a constant temperature, the core pin ( 105 may pass through the second opening 112, the rubber plate 130, and the first opening 112 of the second metal plate 120 to be disposed without interference in the first and second openings 112 and 122.

In this case, the core pin 105 penetrating the rubber plate 130 is disposed at the center of the first and second opening holes 112 and 122.

 Subsequently, the rubber plate 130 is thermally deformed by the heat transferred to the rubber plate 130 through the upper and lower molds, and at the same time, the upper and lower intervals between the first and second metal plates 110 and 120 are reduced. A portion of the body of the plate 130 is extended and between the outer surface of the core pin 150 disposed in the inner center of the first and second openings 112 and 122 and the inner surface of the first and second openings 112 and 122. It will fill in the empty space.

Here, any one of the upper and lower molds 101 and 102 may be provided with a built-in heater that generates heat transferred to the rubber plate 130 when power is applied.

At this time, the core pin 105 is formed on the lower surface of the upper mold or the upper surface of the lower mold corresponding to the hole through area of the first and second metal plates 110 and 120 through which the first and second openings 112 and 122 are formed. It is preferable to form a clearance 103 so that a portion of the body of the rubber plate filled in the space between the outer surface and the inner surfaces of the first and second openings 112 and 122 protrudes out of the metal plate.

As shown in FIG. 10C, the free space 103 is illustrated and described as being recessed in the lower surface of the upper mold 101 in which the core pin is not provided in correspondence with the first metal plate 110. It may not be formed in the upper surface of the lower mold 102 is not provided with a core pin corresponding to the second metal plate 120.

Accordingly, a portion of the body of the rubber plate made of a silicon material is filled in the space between the outer surface of the core pin 105 and the inner surfaces of the first and second openings 112 and 122.

Here, the rubber plate 130 is the plate thickness and the whole in consideration of the filling volume filled in the space between the body portion of the inner surface of the core pin 105 and the inner surface of the first and second openings (112, 122). It is desirable to determine the volume in advance.

As shown in FIG. 10D, the demolding step S4 stops heating and pressing the upper and lower molds, and stops the outer surface of the core pin 105 and the first and second openings 112 and 122. After cooling the rubber plate 130 filled between the inner surface and separating the stack 140 from the upper and lower molds (101, 102) and at the same time separate the core pin 105 from the first and second openings (112, 122) In this case, the core pin 105 has an inner diameter relatively smaller than the inner diameter of the first and second openings in the first and second openings 112 and 122 from which the core pin 105 is separated and removed. The carrier plates 100 and 100a having the support holes 132 fixed to the inner circumferential surface thereof are manufactured and completed.

On the other hand, the excess portion of the rubber plate 130 leaked into the free space 103 formed in any one of the upper, lower molds are removed by the blade (not shown) moved along the surface of the first and second metal plates. One portion of the rubber plate body may manufacture a carrier plate that does not protrude from the surface of the metal plate through the first and second openings 112 and 122.

In the carrier plate manufacturing method according to the second embodiment of the present invention, as shown in Figs. 11 and 12a to 12d, a preparation step (S01 '), a lamination step (S02'), a rubber material injection molding step (S03 '). ) And a carrier plate (100, 100a) having a plurality of support holes 132 for inserting and fixing the chip parts, including a demoulding step (S04 ').

As shown in FIG. 12A, the preparation step S01 ′ includes a substantially rectangular plate-shaped first metal plate 110 having a plurality of first openings 112 of a predetermined size formed therethrough, and the first openings 112. ) And a second rectangular metal plate 120 having a large rectangular plate formed by penetrating a plurality of second openings 122.

In any one of the first metal plate 110 and the second metal plate 120 facing each other to form a protrusion for maintaining the gap 145 to a predetermined height so as to maintain a constant vertical gap between them during lamination, such a bar The gap maintaining protrusion 145 is illustrated and described as being protruded from the lower surface of the upper first metal plate 110 corresponding to the second metal plate 120, but the present invention is not limited thereto. It may be protruded on the upper surface of the.

The first and second openings 112 and 122 may be penetrated so as to correspond to each other in a one-to-one correspondence with each other when the first and second metal plates 110 are stacked up and down.

As shown in FIG. 12B, the stacking step S02 ′ is a stack 140a in which two plates are stacked to have a predetermined size between the first metal plate 110 and the second metal plate 120. Is done.

In the laminate 140a, the vertical gap between the first metal plate 110 and the second metal plate 120 is controlled by the space maintaining protrusion 145 so that the tip contacts the surface of the corresponding metal plate. The thickness of the plate 130 may be determined by the formation height of the gap maintaining protrusion 145.

And, as in the manufacturing method according to the first embodiment, each center of the first opening hole 112 formed through the first metal plate 110 and the second opening hole 122 formed through the second metal plate 120 are formed. It is preferable to stack the first and second metal plates 110 and 120 to be positioned on the same vertical axis.

The rubber material injection molding step (S03 ′), as shown in FIG. 12C, prepares a mold including the upper mold 101 and the lower mold 102, and stacks the cavity between the upper mold and the lower mold. Sieve 140a is placed.

In addition, the plurality of core pins 105 having a predetermined length protruding from one of the upper and lower molds 101 and 102 penetrate through the first and second openings 112 and 122 and are inserted into the center thereof.

At this time, the core pin 105 is provided with an outer diameter size smaller than the inner diameter of the first and second opening holes 112 and 122 to form a gap therebetween.

Subsequently, when the liquid rubber material is pressurized and supplied through the injection hole 109 formed in any one of the molds 101 and 102 corresponding to the vertical gap between the first and second metal plates 110 and 120, the liquid rubber material is the first rubber sheet. Filled with the vertical gap between the metal plate 110 and the second metal plate 120 to form a rubber plate 130 and at the same time the inner surface of the first and second openings 112 and 122 and the outer surface of the core pin 105 It will fill in the space between them.

Here, the injection hole 109 is illustrated and described as being provided in the lower mold corresponding to the vertical gap between the first and second metal plates 110 and 120, but is not limited thereto and the vertical gap between the first and second metal plates is not limited thereto. In addition, a plurality of upper or lower molds may be selectively provided to inject and fill the liquid rubber material into the first and second opening holes.

In addition, the liquid rubber material injected at a pressing force of a predetermined strength through the injection hole 109 may be filled in the space between the inner surface of the first and second openings 112 and 122 and the outer surface of the core pin 105. do.

Here, the supply amount of the liquid rubber material forcedly injected through the injection hole 109 is the space between the upper and lower intervals between the first and second metal plates 110 and 120 and the outer surface of the core pin 105 and the first and second opening holes. It is desirable to determine in advance taking into account the filling volume filling the space between the inner surfaces of (112, 122).

At this time, when supplying the liquid rubber material through the injection hole 109, the upper and lower molds are relatively higher than the supply pressure of the rubber material so that the upper and lower molds do not open while maintaining the upper and lower intervals of the first and second metal plates in a constant manner. It is desirable to maintain the pressurized state until the supply of the rubber material is stopped at a pressing force of a certain intensity.

As shown in FIG. 12D, the demolding step S4 ′ stops the forced injection of the liquid rubber material through the injection hole 109, and naturally cools or forces the injected rubber material to the rubber plate 130. ), And then, when the stack 140a is separated from the upper and lower molds 101 and 102 and the core pin 105 is separated from the first and second openings 112 and 122, the first metal plate ( The first and second openings are formed in the first and second openings 112 and 122 in which the core pins 105 are separated and removed, together with the rubber plate 130 formed by filling the vertical gap between the 110 and the second metal plate 120. Carrier plates (100, 100a) having a smaller diameter than the inner diameter of the hole to form a support hole 132 is fixed to the outer surface and the inner circumferential surface is fixed when the chip component is inserted.

On the other hand, when the forced injection of the liquid rubber material through the injection hole, the margin of the rubber plate 130 flowing out to the surface of the metal plate through the first and second opening holes is moved along the surface of the first and second metal plate ( Scratching).

In the method of manufacturing a carrier plate according to a third embodiment of the present invention, as shown in FIGS. 13 and 14A to 14E, a preparation step (S1 ″), a lamination step (S2 ″), heating and press molding (S3) ''), And a carrier plate (100, 100a) having a plurality of support holes 132 for inserting and fixing the chip parts, including the demolding step (S4 ") and the penetrating step (S5").

As shown in FIG. 14A, the preparation step S1 ″ passes through a plurality of first openings 112 formed of a first large diameter portion 112b and a first small diameter portion 112a having different inner diameter sizes. A first rectangular plate formed of a substantially rectangular plate and a second large diameter portion 122b and a second small diameter portion 122a which correspond to the first opening 112 and have different inner diameter sizes. A second substantially rectangular metal plate 120 having a plurality of through holes 122 formed therethrough is provided.

The first and second openings 112 and 122 may be penetrated so as to correspond to each other in a one-to-one correspondence with each other when the first and second metal plates 110 and 120 are stacked up and down.

Herein, the first and second openings 112 and 122 including the first and second large diameter parts 112b and 122b and the first and second small diameter parts 112a and 122a are carrier plate manufacturing methods according to the first and second embodiments. The same applies to.

One side of each of the first metal plate 110 and the second metal plate 120 facing each other is made of a thermoplastic silicone material deformed by a constant temperature and a constant pressure, so as to form a rubber plate 130 of a predetermined thickness when laminated Relatively thin rubber layers 130a and 130b are provided, respectively.

As shown in FIG. 14A, the rubber layers 130a and 130b having substantially the same area as the first and second metal plates 110 and 120 may have lower surfaces and one side of the first metal plates 110 facing each other. The upper surface, which is one side of the metal plate 120 may be provided, but is not limited thereto. As shown in FIGS. 15A and 15B, one of the first and second metal plates may be selectively provided as one rubber layer. Can be.

In the laminating step S2 ″, as illustrated in FIG. 14B, the first metal plate 110 and the second metal plate 120 are stacked up and down by the rubber plate 130 or the rubber layers 130a and 130b. Thus, three or four layers are formed of one laminate 140b laminated in multiple layers.

In the stack 140b, the centers of the first opening 112 formed through the first metal plate 110 and the second opening 122 formed through the second metal plate 120 are located at the same vertical axis. The first and second metal plates 110 and 120 and a rubber plate 130 or a rubber layer 130a and 130b are interposed therebetween.

Here, as shown in FIG. 14B, the lower surface of the first metal plate 110, which is the upper plate, and the upper surface of the second metal plate 120, which is a rubber plate, is formed through an adhesive layer (not shown) having a predetermined thickness. By attaching the rubber layers 130a and 130b constituting the 130, when the first and second metal plates are laminated, the laminated body 140b in which the rubber plates 130 including upper and lower rubber layers are stacked therebetween can be formed. .

At this time, the rubber layers 130a and 130b facing each other may be adhered to each other through an adhesive layer applied to any one of the rubber layers 130a and 130b so as to be interposed therebetween.

In addition, as shown in FIGS. 15A and 15B, any one of a lower surface of the first metal plate 110, which is the upper plate, or an upper surface of the second metal plate 120, which is a lower plate, may have an adhesive layer having a predetermined thickness. By attaching the rubber plate 130 prepared through the above, when the first and second metal plates are laminated, the rubber body 130 may be formed in a multilayer body 140b in which the rubber plates 130 are stacked in multiple layers.

In addition, the rubber plate 130 or the rubber layers 130a and 130b may have a liquid silicone resin solution on an upper surface of the second metal layer 120, which is one side surface or a lower plate, which is a lower surface of the first metal plate 110. Spraying from the nozzle to form a rubber plate 130 or rubber layers 130a and 130b having a predetermined thickness.

In addition, the rubber plate 130 or the rubber layer (130a, 130b) is applied to the resin liquid to form a rubber plate or rubber layer of a certain thickness by rolling a liquid resin liquid on the outer peripheral surface of the roller and then rolling it on the metal plate surface Roller printing or liquid resin solution may be formed by a printing method in which the resin liquid is applied to the end of the brush or brush and then painted on the surface of the metal plate to form a rubber plate or a rubber layer having a predetermined thickness.

The heating and pressure forming step (S3 ″), as shown in FIG. 14C, prepares a mold including an upper mold 101 and a lower mold 102, and forms a mold formed between the upper mold and the lower mold. Between the first and second metal plates, a single rubber plate 130 or a laminated body 140b in which other rubber plates 130 in which upper and lower rubber layers 130a and 130b are stacked is interposed.

Subsequently, any one of the upper and lower molds 101 and 102 is fixed while heating one or both molds of the upper and lower molds 101 and 102 to a constant temperature, and the remaining mold is fixed to a fixed pressure P with respect to the fixed mold. When pressurized, the rubber material is thermally deformed by the heat transferred to the rubber plate 130 and the rubber layers 130a and 130b through the upper and lower molds, and at the same time, the vertical gap between the first and second metal plates 110 and 120 is reduced. Since the body portion of the rubber plate 130 or the rubber layer (130a, 130b) that is thermally deformed is formed to penetrate through the first and second metal plates, the first small diameter portion (112a) and the first large diameter portion (112b) It is filled in the internal empty space of the first opening hole 112, the second small diameter portion 122a and the second large diameter portion 122b consisting of a second large diameter portion (122b).

One of the upper and lower molds may be provided with a built-in or exterior heater for generating heat transferred to the rubber plate 130 when power is applied.

Here, the rubber plate 130 or the rubber layer (130a, 130b) is preferably determined in advance the layer thickness and the total volume in consideration of the filling volume of the body portion is filled in the first and second openings (112, 122). Do.

Accordingly, when the rubber material filled in the first and second openings 112 and 122 together with the rubber plate 130 or the rubber layers 130a and 130b interposed between the first and second metal plates 110 and 120 are cured, The first and second metal plates 110 and 120 are integrally coupled through the rubber material.

Meanwhile, the first and second heat resistant sheets 115 and 125 cover the first and second openings 112 and 122 on the outer surfaces of the first and second metal plates 110 and 120 facing the upper and lower molds. ) And the rubber material, which is a silicone resin of the rubber plate 130 and the rubber layers 130a and 130b, which are pressurized and thermally deformed in the heating and molding step described later, are integrally formed by bonding the first and second openings 112 and 122. The first and second small diameter portion (112a, 122a) of the outflow will be prevented.

The first and second heat resistant sheets 115 and 125 are heat resistant so as to cover and seal the first and second openings 112 and 122 without being deformed by the heat transferred from the upper and lower molds 101 and 102. It has a sheet | seat material which has.

Here, the first and second heat resistant sheets 115 and 125 corresponding to the first and second openings 112 and 122 may be formed of a rubber plate 130 or rubber layers 130a and 130b that are thermally deformed. In the process of filling the opening holes 112 and 122, the exhaust holes 115a and 125a are formed through the gas so that the gas contained in the rubber plate can be easily discharged to the outside.

The exhaust holes 115a and 125a are positioned within the inner diameter range of the support holes 132 formed through the central regions of the first and second openings 112 and 122, so that the support holes 132 are formed by the through pins in the penetrating step described later. ), It is preferable not to remain in the rubber plate 130 filled in the first and second openings 112 and 122 when forming the through hole.

In addition, the inner surface of any one of the upper and lower molds corresponding to the rubber plate 130 is filled in the first and second openings 112 and 122 in the heating and pressing molding step, and is interposed between the first and second metal plates. Due to thermal deformation of the rubber material, it is preferable to recess the free space 103 so that a part of the body protrudes through the boundary region between the first and second metal plates to be filled.

Here, the protrusion of the rubber plate formed while filling in the free space 103 is removed by removing the first and second heat resistant sheets 115 and 125 provided on the outer surfaces of the first and second metal plates 110 and 120 after the demolding step. At the same time it is cut off.

The demolding step (S4 ″) stops heating and pressurizing the upper and lower molds, the rubber plates interposed between the first and second metal plates 110 and 120 and filled in the first and second opening holes 112 and 122. After cooling 130 to harden, the laminate 140b is separated from the upper and lower molds 101 and 102.

In addition, the first and second heat resistant sheets 115 and 125 provided on the outer surfaces of the first and second metal plates of the laminate 140b are separated and removed by a tool such as a blade or by hand, and are filled with the free space 103. The protrusion formed by the rubber material is also cut and removed by a tool such as a blade.

In this case, when the first and second heat resistant sheets 115 and 125 having the exhaust holes 115a and 125a are removed from the first and second metal plates 110 and 120, the first and second small diameter portions 112a of the first and second opening holes may be removed. In 122a), the other protrusion is formed to the mold side by the rubber plate filled in the exhaust hole, but this protrusion is naturally removed when the support hole 132 is formed through.

In addition, the protruding portion due to the exhaust hole may serve as a positioning unit that determines the penetrating position during the penetrating operation using the penetrating pin described later.

In the penetrating step (S5 ″), as shown in FIG. 14D, the laminate 140b demolded from the upper and lower molds is fixed to the upper surface of the lower fixing stand 107, and the stack 140b of the laminate 140b is fixed. The upper movable table 108 having a through pin 106 having an outer diameter size smaller than the inner diameter size of the first and second small diameter portions 112a and 122a among the first and second openings 112 and 122 is disposed in the upper portion. It is done in one state.

That is, when the upper movable table 108 is lowered directly below the lower fixing table 107, it is moved along the vertical guide bar 104 connected between the lower fixing table 107 and the upper moving table 108. The rubber plate 130 filled in the first and second openings 112 and 122 in a state in which the through pin 106 of the upper movable plate 108 faces the center of the first and second small diameter portions 112a and 122a. Penetrates.

In addition, a portion of the rubber plate removed while being penetrated by the through pin 106 is naturally discharged to the outside through the discharge hole 107a formed through the lower fixing stand 107, and the through pin 106 is a solid pin. Or it may be made of a hollow pin.

Subsequently, when the through pin 106 penetrating the rubber plate 130 is separated by the upward return operation of the upper movable table 108, as shown in FIG. 14E, the first and second opening holes ( 112 and 122 have an inner diameter smaller than the inner diameter of the first and second small diameter portions 112a and 122a or the first and second openings 112 and 122 so that the outer surface and the inner circumferential surface of the chip component are inserted into and fixed to each other. The carrier plates 100 and 100a formed through the 132 are manufactured.

Chip parts 1 and 2 having small sizes, such as multi-layer ceramic capacitors (MLCCs), low inductance ceramic capacitors (LICCs), inductors, varistors, capacitors, etc., using the carrier plates 100 and 100a having the above configuration. The operation of forming the external electrodes 1a and 2a on the chip parts 1 and 2 by drying the electrode by applying the electrode to the entire outer surface of one end portion or one side of the external surface is performed as shown in FIGS. 16A and 16B. The chip parts 1 and 2, which are the workpieces, are provided with the support holes 132 provided in the first and second openings 112 and 122 formed through the first and second metal plates 110 and 120 to have an inner diameter smaller than the inner diameter of the opening holes, respectively. The chip component inserted into the support hole is fixed by the elastic force of the support hole 132 formed in the rubber plate 130 made of a silicon material.

In this state, as shown in FIG. 16A, the carrier plate on which the chip parts 1 are inserted and fixed to each of the support holes 132 is lowered toward the settling tank 5 in which the conductive paste 5a is stored. A coating operation may be performed to form the external electrode 1a by applying a conductive paste to the entire lower end of 1).

In addition, as shown in FIG. 16B, the base 6 in which the conductive paste 6a is stored in the groove 6b formed on the upper surface of the carrier plate on which the chip parts 2 are inserted and fixed to each of the support holes 132 is provided. The coating operation may be performed to form the linear external electrode 2a by lowering the side to a conductive paste on a specific portion of the external side of the chip component 2.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

Claims (26)

1. A carrier plate on which a plurality of chip components are fixed to form an external electrode on an outer surface,

   A first metal plate formed through the plurality of first opening holes;

   A second metal plate formed therethrough with a plurality of second openings corresponding to the first openings;

   The chip is interposed between the first metal plate and the second metal plate, and filled with the first and second openings, respectively, to have an inner diameter smaller than the inner diameter of the first and second openings. And a rubber plate forming a support hole in which the outer surface and the inner circumferential surface of the component are in contact with each other.
2. A carrier plate on which a plurality of chip components are fixed to form an external electrode on an outer surface,

   A first metal plate having a plurality of first openings formed through the first small diameter portion and the first large diameter portion;

   A second metal plate corresponding to the first opening and penetrating a plurality of second openings formed by the second small diameter portion and the second large diameter portion;

   The chip is interposed between the first metal plate and the second metal plate, and filled with the first and second openings, respectively, to have an inner diameter smaller than the inner diameter of the first and second openings. And a rubber plate forming a support hole in which the outer surface and the inner circumferential surface of the component are in contact with each other.
3. The method according to claim 1 or 2,

   The first opening hole and the second opening hole is formed through the same inner diameter size or the carrier plate for external electrode formation, characterized in that provided in different sizes.
4. The method according to claim 1 or 2,

   The first metal plate, the second metal plate and the rubber plate are provided with the same plate thickness of each other or the carrier plate for external electrode formation, characterized in that provided with different plate thickness.
5. The method according to claim 1 or 2,

   And at least one of a lower surface of the first metal plate in contact with the rubber plate, an upper surface of the second metal plate, and an inner surface of the first and second openings is provided with a roughness surface.
6. The method according to claim 1 or 2,

   A plurality of gap keeping protrusions are formed on the lower surface of the first metal plate or the upper surface of the second metal plate to protrude a predetermined height so as to contact an end portion with a surface of a corresponding metal plate so as to maintain a vertical gap between the first metal plate and the second metal plate. Carrier plate for forming an external electrode, characterized in that it comprises a.
7. The method according to claim 1 or 2,

   The opening hole is formed through the circular or polygonal cross section, the support hole is the external electrode forming carrier plate, characterized in that provided in the same or different from the through shape of the opening hole.
8. The method according to claim 1 or 2,

   The first opening hole or the second opening hole is formed on the inner circumferential surface in contact with the rubber plate with a predetermined interval in the circumferential direction has a groove formed in any one cross-sectional shape of a circle, oval or polygon plate.
9. The method of claim 2,

   And the first and second large diameter parts have at least one reinforcing jaw extending toward the first and second small diameter parts.
10. The method of claim 2,

    The first and second large diameter portions are provided as a truncated conical hole having an inner circumferential surface inclined at a predetermined angle with respect to the vertical inner circumferential surface of the first and second small diameter portions as the inner diameter gradually decreases toward the first and second small diameter portions. Carrier plate for external electrode formation.
11. The method of claim 2,

    The inner diameter of the first opening and the second opening is gradually increased from the first and second large diameter parts in contact with one surface of the first and second metal plates toward the first and second small diameter parts in contact with the other surface of the first and second metal plates. Carrier plate for external electrode formation, characterized in that it is provided with a gradually decreasing truncated cone.
12. A method of manufacturing a carrier plate on which a plurality of chip components are fixed to form an external electrode on an outer surface,

    Providing a first metal plate through which the plurality of first openings are formed and a second metal plate through which a plurality of second openings corresponding to the first opening are formed;

    Lamination step of providing a laminate in which a rubber plate is disposed between the first metal plate and the second metal plate:

    The laminated body is disposed in a cavity between upper and lower molds, and at least one of the upper and lower molds is heated to a constant temperature and pressurized to a constant pressure to partially heat the body of the rubber plate to the first and second openings. A heating and pressure forming step of filling between an outer surface of the core pin disposed inside the hole and an inner surface of the first and second opening holes; And

    Including a demolding step of separating the laminate from the upper, lower mold, and separating the core pin from the first and second opening holes

    The core pin has an inner diameter smaller than the inner diameter of the first and second openings in the first and second openings, in which the core pin is separated and formed, thereby forming a supporting hole in which the outer surface and the inner circumferential surface of the chip component are in contact with each other. Carrier plate manufacturing method for forming an external electrode.
13. In the method of manufacturing a carrier plate to which a plurality of chip components are fixed to form an external electrode on the outer surface

    Providing a first metal plate through which the plurality of first openings are formed and a second metal plate through which a plurality of second openings corresponding to the first opening are formed;

    Lamination step of providing a laminate in which a rubber plate is disposed between the first metal plate and the second metal plate:

    The laminated body is disposed in a cavity between upper and lower molds, and at least one of the upper and lower molds is heated to a constant temperature and pressurized to a constant pressure to partially heat the body of the rubber plate to the first and second openings. A heating and pressure forming step of filling the inside of the hole;

    A demolding step of separating a laminate in which rubber plates are filled in the first and second opening holes from upper and lower molds; And

    Through pins having an outer diameter that is relatively smaller than the inner diameter of the first and second openings are disposed corresponding to the first and second openings, and the rubber plate filled in the first and second openings by the through pins is disposed. Including penetrating step; including

    The inner and outer circumferential surfaces of the chip component may be formed in contact with the outer and inner circumferential surfaces of the chip component to form a supporting hole in the first and second openings in which the through pins are separated and removed. Carrier plate manufacturing method for forming an external electrode.
14. A method of manufacturing a carrier plate on which a plurality of chip components are fixed to form an external electrode on an outer surface,

    A preparatory step of providing a first metal plate through which a plurality of first openings are formed and a second metal plate through which a second opening corresponding to the first opening is formed;

    Lamination step of providing a laminated body laminated to maintain a constant size of the vertical gap between the first metal plate and the second metal plate:

    The laminate is disposed in the cavity between the upper and lower molds, and the outer surface and the first surface of the core pins disposed in the first and second opening holes to form a rubber plate by supplying a liquid rubber material at the upper and lower intervals. Rubber material injection molding step of filling the liquid rubber material between the inner surface of the two opening holes; And

    A demolding step of separating the laminate from the upper and lower molds and separating the core pins from the first and second opening holes; Including

    The core pin has an inner diameter smaller than the inner diameter of the first and second opening holes in the first and second opening holes to form a support hole in which the outer surface and the inner circumferential surface of the chip component are in contact with each other. Carrier plate manufacturing method for forming an external electrode.
15. The method according to any one of claims 12 to 14,

    The first opening is made of a first large diameter portion and the first small diameter portion having a different inner diameter size or the second opening is made of a second large diameter portion and a second small diameter portion having a different inner diameter size Method for producing a carrier plate for electrode formation.
16. The method according to claim 12 or 13,

    The laminating step may include a rubber layer on each side of each of the first metal plate and the second metal plate facing each other, and a rubber plate and a first layer comprising a rubber layer stacked up and down between the first and second metal plates. A method for producing a carrier plate for external electrode formation, characterized in that the laminate is formed by a metal plate.
17. The method according to claim 12 or 13,

    The laminating step may include a rubber plate on either side of the first metal plate or the second metal plate facing each other, and is laminated by the rubber plate and the first and second metal plates interposed therebetween when the first and second metal plates are laminated. Carrier plate manufacturing method for forming an external electrode, characterized in that to form a sieve.
18. The method according to claim 12 or 13,

    The laminating step may include a rubber plate or a rubber layer in a spray method for spraying a liquid resin solution or a printing method for printing and applying a liquid resin solution on either side of the first metal plate or the second metal plate. A method of manufacturing a carrier plate for external electrode formation, characterized in that the laminate is formed by a rubber plate or a rubber layer interposed therebetween when the 1,2 metal plate is laminated.
19. The method according to claim 12 or 13,

    In the laminating step, the rubber plate or the upper surface of the rubber layer is adhered to the lower surface of the first metal plate or the rubber plate or the adhesive layer is applied to the lower surface of the first metal plate and the upper surface of the second metal plate. A method of manufacturing a carrier plate for external electrode formation, characterized in that to form a laminate in which the lower surface of the rubber layer is bonded to the upper surface of the second metal plate.
20. The method of claim 12,

    The heating and pressure forming step may be performed by filling the space between the outer surface of the core pin and the inner surface of the first and second openings, and having a portion of the body of the remaining rubber plate penetrating the first and second openings. 2. A method of manufacturing a carrier plate for forming an external electrode, comprising: flowing into a free space recessed in a lower surface of an upper mold or an upper surface of a lower mold corresponding to a hole through area of a metal plate;
21. The method according to claim 12 or 13,

    The heating and pressure forming step may be performed in a state where the first and second heat resistant sheets are provided to cover and seal the first and second opening holes on each outer surface of the first and second metal plates facing the upper and lower molds. Carrier plate manufacturing method for forming an external electrode.
22. The method of claim 21,

    And forming at least one exhaust hole in the first and second heat resistant sheets corresponding to the first and second opening holes through at least one exhaust hole located in the inner diameter range of the support hole.
23. The method according to claim 12 or 13,

    In the heating and pressing molding step, a part of the body of the rubber plate or the rubber layer is protruded and filled with a free space formed in the inner surface of any one of the upper and lower molds corresponding to the boundary area of the first and second metal plates. Carrier plate manufacturing method for forming an external electrode.
24. The method according to claim 12 or 13,

    The heating and pressure forming step is characterized in that a part of the body of the rubber plate protrudes and fills with a free space formed in the inner surface of any one of the upper and lower molds corresponding to the boundary region of the first and second metal plates. Method for producing a carrier plate for electrode formation.
25. The method of claim 14,

    The rubber material injection molding step injects a liquid rubber material through an injection hole formed in one of the upper and lower molds so as to correspond to the upper and lower intervals, or through the injection hole formed in the upper surface of the upper mold or the lower surface of the lower mold. A method of manufacturing a carrier plate for external electrode formation, characterized in that to form a rubber plate by injecting a rubber material.
26. The method of claim 14,

    In the laminating step, the upper and lower intervals are formed between the first metal plate and the second metal plate by a gap keeping protrusion protruding a predetermined height from any one of the first metal plate and the second metal plate so that the tip contacts the surface of the corresponding metal plate. The first and second metal plate is laminated, characterized in that the carrier plate manufacturing method for forming an external electrode.

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