WO2013160356A1 - Method for manufacturing a semiconductor thin film - Google Patents
Method for manufacturing a semiconductor thin film Download PDFInfo
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- WO2013160356A1 WO2013160356A1 PCT/EP2013/058509 EP2013058509W WO2013160356A1 WO 2013160356 A1 WO2013160356 A1 WO 2013160356A1 EP 2013058509 W EP2013058509 W EP 2013058509W WO 2013160356 A1 WO2013160356 A1 WO 2013160356A1
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- thin film
- annealing
- film
- precursor
- etching
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- 239000010409 thin film Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 6
- 229910052745 lead Inorganic materials 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 238000000137 annealing Methods 0.000 claims description 46
- 238000005530 etching Methods 0.000 claims description 22
- 239000012298 atmosphere Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000002243 precursor Substances 0.000 abstract description 35
- 239000010408 film Substances 0.000 abstract description 33
- 239000010949 copper Substances 0.000 description 32
- 239000011669 selenium Substances 0.000 description 27
- 239000006096 absorbing agent Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 description 5
- 229910052711 selenium Inorganic materials 0.000 description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 229910018038 Cu2ZnSnSe4 Inorganic materials 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- 239000005864 Sulphur Substances 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910002475 Cu2ZnSnS4 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005424 photoluminescence Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910008772 Sn—Se Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910001417 caesium ion Inorganic materials 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000224 chemical solution deposition Methods 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- -1 for example Cu2SnSe3 Chemical class 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004549 pulsed laser deposition Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02557—Sulfides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/0256—Selenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0326—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising AIBIICIVDVI kesterite compounds, e.g. Cu2ZnSnSe4, Cu2ZnSnS4
Definitions
- the present invention relates to a method for manufacturing semiconductor thin films.
- it relates to the manufacturing of (Ag x Cui_ x ) 2 ZnZ(SySei_ y )4 thin films, wherein x and y can be selected between 0 and 1 , and wherein Z is selected from Sn, Pb, Ge and Si.
- a Cu 2 ZnSn(SySei_ y )4 absorber layer is considered the leading candidate to replace a Cu(ln,Ga)(S,Se) 2 absorber layer in thin films solar cells because it only contains cheap, and abundant elements.
- Cu 2 ZnSn(SySei_y) 4 solar cells have reached power conversion efficiencies of 10.1 %, clearly showing the potential of the material (Aaron et al. , Prog. Photovolt. Res. Appl., 201 1. DOI: 10.1002/pip.1 160).
- Cu 2 ZnSn(SySei_ y )4 thin films for solar cell applications can be produced by a variety of different techniques.
- deposition techniques e.g. evaporation techniques, sputtering, E-beam, electrodeposition, spray pyrolisis, photo-chemical deposition, spin coating, the iodine transport method, printing, pulsed laser deposition etc.
- a first possibility is to deposit all elements or binary compounds at elevated temperatures such that the absorber is formed in one step.
- a further technique involves all elements or binary compounds being deposited at once (at room or elevated temperature) and then heated to re-crystallize. Finally, all elements or binary compounds may be deposited sequentially, and then heated to intermix and crystallize.
- the Cu 2 ZnSn(SySei_ y ) 4 semiconductor compound is spontaneously formed on a heated substrate (e.g. coevaporation, sputtering technique) in a single step.
- the metals or binaries are first deposited near room temperature and are then, in a further step, annealed in a furnace comprising a S/Se atmosphere in order to form
- a precursor film containing the metals or the metals together with selenium and/or sulphur is provided in a first step.
- the precursor film is annealed, or heat- treated, in an S/Se atmosphere according to the proposal by Katagiri et al., Solar Energy Materials and Solar Cells 49 (1997) 407-414.
- High quality material is typically achieved through heating the precursor film at high temperatures of 500°C to 600°C.
- Annealing in furnaces is typically performed in an S/Se vapour together with different gases: Ar, N 2 , H 2 , H 2 /N 2 .
- Annealing in N 2 gas plus elemental sulfur vapour has been described by Araki et al., Thin Solid Films, 517 (2008) 1457-1460.
- Annealing in N 2 and 5wt% H 2 S gas is disclosed in Katagiri et al., Solar Energy Materials and Solar Cells, 49 (1997) 407-414.
- Annealing in N 2 and 20wt% H 2 S gas is described in Katagiri et al., Applied Physics Express, 1 (2008) 041201 .
- Annealing in Ar and elemental S vapour and, alternatively, annealing in Ar and 5wt% H2S gas has been suggested by Scragg et al., Thin Solid Films, 517 (2009) 2481-2484. Annealing in N 2 + 10wt%H 2 and elemental S vapor has been disclosed in Scragg et al., Journal of Electroanalytical Chemistry, 646 (2010) 52-59. Some annealing experiments have also been carried out under vacuum.
- Solar cells based on co-evaporated (Ag x Cui_ x ) 2 ZnSn(SySei_y) 4 thin films which are produced in a single step without annealing, have been recently shown to achieve an efficiency of 9.15%.
- the corresponding thin films have a Cu-rich growth period, (I. Repins, et al., Solar Energy Materials and Solar Cells, 2012).
- the Cu-rich growth period is achieved while tuning the fluxes during the co-evaporation process.
- the elements are deposited at higher temperature in order to avoid the annealing step.
- a Cu-rich growth period of the thin film appears to be beneficial for the efficiency of solar cells.
- using a precursor thin film that is characterized by a Cu-rich growth period has so far not lead to promising solar cells using the two-step fabrication process, wherein the precursor thin film is subsequently annealed at high temperature.
- a method for manufacturing a (Ag x Cui_ x ) 2 ZnZ(S y Sei_ y )4 thin film wherein both x and y are selected in between 0 and 1 , and wherein Z is selected from Sn, Ge, Si, Pb.
- the method comprises the following steps:
- a thin film comprising Ag and/or Cu, the thin film further comprising Zn and Z, the thin film further comprising S and/or Se,
- the thin film presents a (Ag x Cui -x ) / (Zn + Z) ratio that is greater than 1 ;
- the annealing of the thin film may occur at a temperature between 450 and 600 °C. In an embodiment, the annealing occurs at 500 °C. The annealing may occur at a temperature range of between 300 and 1000 °C, preferably between 400 and 800 °C, and more preferably between 500 and 600 °C.
- the etching solution may preferably comprise KCN, and more preferably 10% KCN.
- the step of annealing may comprise annealing the thin film in an atmosphere, which more preferably may comprise S and/or Se.
- the step of annealing further may comprise enclosing the thin film, together with said atmosphere, in an inert enclosure.
- An opening may preferably be provided in the enclosure, through which S and/or Se is supplied.
- the thin film may preferably be provided on a substrate, which may preferably be molybdenum.
- a semiconductor thin film is provided, which is produced using the described method.
- a device comprising a semiconductor thin film produced using the described method is provided.
- the device may preferably be a photovoltaic cell, which may preferably exhibit an efficiency of at least 6 %.
- the method according to the present invention provides an efficient way of producing (Ag x Cui_ x ) 2 ZnZ(SySei_y)4 semiconductor thin films from Cu-rich precursor films whereby the formation of Cu-Sn-Se compounds, such as for example Cu 2 SnSe 3 , on the surface of the annealed film is largely inhibited.
- Solar cells that incorporate semiconductor thin films manufactured according to the present invention exhibit an improved open circuit voltage and efficiency as compared to solar cells that incorporate known (Ag x Cui_ x ) 2 ZnZ(S y Sei_ y )4 thin films produced from Cu- rich precursors, which are annealed at high temperature..
- Figure 1 is a flow chart illustrating a preferred embodiment of the method according to the present invention.
- Figure 2 is a schematic illustration of a preferred embodiment according to the present invention.
- Figure 3 shows experimental results of a precursor film produced according to a preferred embodiment of the method according to the present invention, prior to etching and annealing.
- Figure 4 shows experimental results of thin film after annealing, without prior etching.
- Figure 5a and 5b show experimental results of a device produced according to a preferred embodiment of the method according to the present invention. Detailed Description
- a method for manufacturing a (Ag x Cui -x ) 2 ZnZ(S y Sei- y )4 thin film is provided.
- Z is selected to be one of Sn, Pb, Ge or Si while both x and y are select in between 0 and 1.
- a precursor thin film 20 is provided in a first step, 100.
- the precursor thin film comprises Ag and/or Cu, comprises Zn and Z, and further comprises S and/or Se.
- the film may be produced by any methods known in the art.
- the precursor presents an (Ag x Cui -x ) / (Zn+Z) ratio that is greater than 1 , it is therefore (Ag x Cui -x )-rich.
- the method further comprises the sequential steps of etching the thin film with an etching solution, 200, prior to annealing the film at a high temperature 300.
- the precursor film may be provided on a substrate 10.
- the annealing of the thin film may preferably take place in an atmosphere comprising S and/or Se.
- Both the thin film and the atmosphere may be enclosed in an inert enclosure 30. At least one opening is provided in the enclosure, through which S and/or Se or other compounds may be introduced into the atmosphere.
- the composition of the corresponding precursor thin film is described by Cu 2 ZnSnSe 4 , CZTSe.
- the Cu excess in the Cu-rich precursor film has been shown to lead to a copper selenide, Cu-Se, phase at the surface of the precursor film.
- the copper selenide phase incorporates tin and turns into secondary phases, the most likely being the ternary Cu 2 SnSe 3 .
- the ternary Cu 2 SnSe 3 phase is suspected to limit the open circuit voltage of a solar cell using the resulting semiconductor thin film.
- KCN is known to be able to remove copper selenide, Cu-Se, compounds. Examples of such compounds are CuSe and Cu 2 Se.
- Cu-Se copper selenide
- Cu 2 Se copper selenide
- the Cu-Se phases on the surface of the thin film are largely removed.
- the removed Cu-Se phases can no longer act as sources for the production of new secondary phases during annealing. It has been observed that after annealing, the pre-etched thin film presents less of the detrimental secondary phases on its surface.
- a solar cell incorporating the resulting thin film presents an improved efficiency and open circuit voltage as compared to solar cells using known thin films produced from Cu-rich precursor films.
- Etching the precursor film prior to annealing has the further advantage that the Cu-Se phases at the surface of the Cu-rich precursor film do not interdiffuse into the thin film during annealing.
- Etching the film only after annealing can only remove the Cu-Se secondary phases that are present on the surface of the film after annealing.
- the secondary phases may diffuse deeper into the film.
- the precursor film is etched before being annealed, less of the Cu-Se secondary phases are formed during the annealing, and therefore less of these secondary phases tend to diffuse into the film.
- the proposed method is efficient in producing thin film semiconductors with less Cu-Se secondary phases throughout the film than known methods. This outlines the underlying principle of the present invention in general terms. Further specific embodiments according to the present invention are described without further limiting the scope of the invention.
- a CZTSe precursor film is first produced in a molecular beam epitaxy system with Cu, Zn, Sn evaporation sources and Se is supplied via a valved source.
- the deposition temperature is set to 320 °C and all four elements are coevaporated on a molybdenum coated soda lime glass substrate. This corresponds to step 100.
- the CZTSe precursor film does not decompose. Indeed CZTSe is known to decompose according to the following equation at temperatures higher than 350°C.
- Fig 3 shows a secondary ion mass spectrometry, SI MS, analysis of the Cu-rich precursor film according to sample A, which has neither been etched nor annealed.
- the sputtering time on the x-axis corresponds to different depths of the layer from the surface of the thin film (left) to the molybdenum substrate (right). It can be concluded that a copper selenide phase is present at the surface of the precursor film.
- Fig 4 shows a SI MS analysis of sample A after it has been annealed at a high temperature of 500-600 °C in a graphite box, without prior etching of the sample.
- the annealing takes place in an H 2 /N 2 atmosphere at a pressure of 1 mbar.
- the atmosphere further contains 15mg of SnSe and 20 mg of Se in order to avoid the decomposition according to equation (1 ) to take place.
- the annealed absorber presents a Cu- and Sn-rich interface. This leads to the model that during annealing, the copper selenide phase at the surface of the precursor film incorporates tin and turns into secondary phases, the most likely being the ternary Cu 2 SnSe 3 phases.
- the ternary Cu 2 SnSe 3 phase is suspected to limit the open circuit voltage of a solar cell using the resulting semiconductor thin film.
- sample A and B have been etched during 30 seconds to 1 minute in a 10% KCN etching solution, corresponding to step 200. This is done before proceeding to annealing, which corresponds to step 300.
- the films have been characterized at various stages of the production process using scanning electron microscopy, SEM, equipped with an energy dispersive X-Ray, EDX, analyser. The resulting composition ratios are given in Table I for sample A and Table II for sample B.
- Solar cells have been built as follows using the semiconductor thin films resulting from the above production method, based on sample A and B.
- the annealed thin film is etched in KCN for 30 seconds in order to remove any remaining Cu x Se or Se impurities. This step is followed by chemical bath deposition of CdS.
- the n-type window layer is sputtered via RF-magnetron sputtering from intrinsic and Al-doped ZnO, followed by e-beam evaporation of Aluminium grids.
- the resulting solar cells have been characterised with current-voltage, IV, measurements and quantum efficiency, QE, measurements, as usual in the art.
- the current-voltage measurements have been performed with a halogen lamp, which has been adjusted to 100 mW/cm 2 .
- Photoluminescence at room temperature is used to determine the bandgap of the resulting absorber layer in the near surface region. Photoluminescence is performed with an Ar-lon Laser with a spotsize of 1 ⁇ . For SIMS analysis, an area with a diameter of 250 ⁇ has been analysed and 8 keV Cs + ions have been used. The solar cell results based on pre-etched sample A are shown in Fig 5a and 5b. The solar cell parameters based on pre-etched sample A are given in Table I I I. A maximum solar cell efficiency of 6.1 % has been achieved. A maximum open circuit voltage of 353 mV has been achieved. It is noted that a solar cell produced from the annealed precursor of sample A without etching prior to the annealing step, did not result in a working solar cell.
- the present invention provides a method for manufacturing a (Ag x Cui_ x )2ZnZ(SySei_ y )4 thin film, wherein Z is selected from Sn, Ge, Si, Pb.
- the method comprises the steps of providing a Cu-rich precursor film, etching the precursor film and subsequently annealing the etched film.
- the method results in thin film semiconductors that allow to increase the efficiency of solar cells which incorporate them.
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Abstract
The present invention relates to a method for manufacturing semiconductor thin films. In particular, it relates to the manufacturing of (Ag x Cu1-
x )2ZnZ(S y Se1-
y )4 thin films, wherein x and y can be selected between 0 and 1, and wherein Z is selected from Sn, Pb, Ge and Si. The method according to the present invention provides an efficient way of producing (Ag x Cu1-
x )2ZnZ(S y Se1-
y )4 semiconductor thin films from Cu-rich precursor films.
Description
METHOD FOR MANUFACTURING A SEMICONDUCTOR THIN FILM
Field of the invention The present invention relates to a method for manufacturing semiconductor thin films. In particular, it relates to the manufacturing of (AgxCui_x)2ZnZ(SySei_y)4 thin films, wherein x and y can be selected between 0 and 1 , and wherein Z is selected from Sn, Pb, Ge and Si. Technical Background of the invention
A Cu2ZnSn(SySei_y)4 absorber layer is considered the leading candidate to replace a Cu(ln,Ga)(S,Se)2 absorber layer in thin films solar cells because it only contains cheap, and abundant elements. Cu2ZnSn(SySei_y)4 solar cells have reached power conversion efficiencies of 10.1 %, clearly showing the potential of the material (Aaron et al. , Prog. Photovolt. Res. Appl., 201 1. DOI: 10.1002/pip.1 160).
Cu2ZnSn(SySei_y)4 thin films for solar cell applications can be produced by a variety of different techniques. For the production of thin films a large number of different deposition techniques are used (e.g. evaporation techniques, sputtering, E-beam, electrodeposition, spray pyrolisis, photo-chemical deposition, spin coating, the iodine transport method, printing, pulsed laser deposition etc.). A first possibility is to deposit all elements or binary compounds at elevated temperatures such that the absorber is formed in one step. A further technique involves all elements or binary compounds being deposited at once (at room or elevated temperature) and then heated to re-crystallize. Finally, all elements or binary compounds may be deposited sequentially, and then heated to intermix and crystallize.
In some cases the Cu2ZnSn(SySei_y)4 semiconductor compound is spontaneously formed on a heated substrate (e.g. coevaporation, sputtering technique) in a single step. In other cases the metals or binaries are first deposited near room temperature and are then, in a further step, annealed in a furnace comprising a S/Se atmosphere in order to form
Cu2ZnSn(SySei_y)4.
In state of the art (AgxCui_x)2ZnSn(SySei_y)4 (x, y = 0...1 ) absorber layer fabrication, in a first step a precursor film containing the metals or the metals together with selenium and/or sulphur is provided. In a second step, the precursor film is annealed, or heat-
treated, in an S/Se atmosphere according to the proposal by Katagiri et al., Solar Energy Materials and Solar Cells 49 (1997) 407-414. High quality material is typically achieved through heating the precursor film at high temperatures of 500°C to 600°C. Annealing in furnaces is typically performed in an S/Se vapour together with different gases: Ar, N2, H2, H2/N2. Annealing in N2 gas plus elemental sulfur vapour has been described by Araki et al., Thin Solid Films, 517 (2008) 1457-1460. Annealing in N2 and 5wt% H2S gas is disclosed in Katagiri et al., Solar Energy Materials and Solar Cells, 49 (1997) 407-414. Annealing in N2 and 20wt% H2S gas is described in Katagiri et al., Applied Physics Express, 1 (2008) 041201 . Annealing in Ar and elemental S vapour and, alternatively, annealing in Ar and 5wt% H2S gas has been suggested by Scragg et al., Thin Solid Films, 517 (2009) 2481-2484. Annealing in N2 + 10wt%H2 and elemental S vapor has been disclosed in Scragg et al., Journal of Electroanalytical Chemistry, 646 (2010) 52-59. Some annealing experiments have also been carried out under vacuum.
K.Timmo et al. (Proceedings PVSC, 2010 35th IEEE DOI: 10.1 109/PVSC.2010.561641 1 ) have studied the chemical etching of manufactured absorbers for solar cells.
Solar cells based on co-evaporated (AgxCui_x)2ZnSn(SySei_y)4 thin films, which are produced in a single step without annealing, have been recently shown to achieve an efficiency of 9.15%. The corresponding thin films have a Cu-rich growth period, (I. Repins, et al., Solar Energy Materials and Solar Cells, 2012). The Cu-rich growth period is achieved while tuning the fluxes during the co-evaporation process. The elements are deposited at higher temperature in order to avoid the annealing step.
A Cu-rich growth period of the thin film appears to be beneficial for the efficiency of solar cells. However, using a precursor thin film that is characterized by a Cu-rich growth period, has so far not lead to promising solar cells using the two-step fabrication process, wherein the precursor thin film is subsequently annealed at high temperature.
Schubert, B.-A. et al. "Cu2ZnSnS4 thin film solar cells by fast coevaporation", Prog. Photovolt: Res. Appl. (2010) is an example of a number of disclosures which describe the formation of a Cu-rich thin film and etching the thin film where subsequent drying may be contemplated (but is not disclosed). However, it is to be realised that annealing and drying are substantially different chemical processes.
It is therefore an object of the present invention to overcome or alleviate at least some of the disadvantages of the known methods of manufacturing (AgxCui_x)2ZnSn(SySei_y)4 semiconductor thin films. Summary of the invention
According to a first aspect of the present invention, there is provided a method for manufacturing a (AgxCui_x)2ZnZ(SySei_y)4 thin film, wherein both x and y are selected in between 0 and 1 , and wherein Z is selected from Sn, Ge, Si, Pb. The method comprises the following steps:
providing a thin film comprising Ag and/or Cu, the thin film further comprising Zn and Z, the thin film further comprising S and/or Se,
wherein the thin film presents a (AgxCui-x) / (Zn + Z) ratio that is greater than 1 ;
etching the thin film with an etching solution; and
- subsequent to the etching, annealing the thin film.
The annealing of the thin film may occur at a temperature between 450 and 600 °C. In an embodiment, the annealing occurs at 500 °C. The annealing may occur at a temperature range of between 300 and 1000 °C, preferably between 400 and 800 °C, and more preferably between 500 and 600 °C.
The etching solution may preferably comprise KCN, and more preferably 10% KCN.
Preferably, the step of annealing may comprise annealing the thin film in an atmosphere, which more preferably may comprise S and/or Se.
Even more preferably, the step of annealing further may comprise enclosing the thin film, together with said atmosphere, in an inert enclosure. An opening may preferably be provided in the enclosure, through which S and/or Se is supplied.
The thin film may preferably be provided on a substrate, which may preferably be molybdenum.
According to a further aspect of the present invention, a semiconductor thin film is provided, which is produced using the described method.
According to a third aspect of the present invention, a device comprising a semiconductor thin film produced using the described method is provided.
The device may preferably be a photovoltaic cell, which may preferably exhibit an efficiency of at least 6 %.
The method according to the present invention provides an efficient way of producing (AgxCui_x)2ZnZ(SySei_y)4 semiconductor thin films from Cu-rich precursor films whereby the formation of Cu-Sn-Se compounds, such as for example Cu2SnSe3, on the surface of the annealed film is largely inhibited.
Solar cells that incorporate semiconductor thin films manufactured according to the present invention exhibit an improved open circuit voltage and efficiency as compared to solar cells that incorporate known (AgxCui_x)2ZnZ(SySei_y)4 thin films produced from Cu- rich precursors, which are annealed at high temperature..
Brief description of the drawings
These and other aspects of the invention will now be further described, by way of example only, with reference to the accompanying figures.
Figure 1 is a flow chart illustrating a preferred embodiment of the method according to the present invention. Figure 2 is a schematic illustration of a preferred embodiment according to the present invention.
Figure 3 shows experimental results of a precursor film produced according to a preferred embodiment of the method according to the present invention, prior to etching and annealing.
Figure 4 shows experimental results of thin film after annealing, without prior etching.
Figure 5a and 5b show experimental results of a device produced according to a preferred embodiment of the method according to the present invention.
Detailed Description
According to the present invention, a method for manufacturing a (AgxCui-x)2ZnZ(SySei-y)4 thin film is provided. Z is selected to be one of Sn, Pb, Ge or Si while both x and y are select in between 0 and 1. With reference to Fig 1 and Fig 2, a precursor thin film 20 is provided in a first step, 100. The precursor thin film comprises Ag and/or Cu, comprises Zn and Z, and further comprises S and/or Se. The film may be produced by any methods known in the art. The precursor presents an (AgxCui-x) / (Zn+Z) ratio that is greater than 1 , it is therefore (AgxCui-x)-rich. The method further comprises the sequential steps of etching the thin film with an etching solution, 200, prior to annealing the film at a high temperature 300.
The precursor film may be provided on a substrate 10. The annealing of the thin film may preferably take place in an atmosphere comprising S and/or Se. Both the thin film and the atmosphere may be enclosed in an inert enclosure 30. At least one opening is provided in the enclosure, through which S and/or Se or other compounds may be introduced into the atmosphere.
Without loss of generality, the invention is described on the basis that Z is selected to be Sn, x = 0 and y = 0. The composition of the corresponding precursor thin film is described by Cu2ZnSnSe4, CZTSe.
The Cu excess in the Cu-rich precursor film has been shown to lead to a copper selenide, Cu-Se, phase at the surface of the precursor film. During annealing, the copper selenide phase incorporates tin and turns into secondary phases, the most likely being the ternary Cu2SnSe3. The ternary Cu2SnSe3 phase is suspected to limit the open circuit voltage of a solar cell using the resulting semiconductor thin film.
KCN is known to be able to remove copper selenide, Cu-Se, compounds. Examples of such compounds are CuSe and Cu2Se. By etching the precursor thin film prior to annealing, the Cu-Se phases on the surface of the thin film are largely removed. The removed Cu-Se phases can no longer act as sources for the production of new secondary phases during annealing. It has been observed that after annealing, the pre-etched thin film presents less of the detrimental secondary phases on its surface. Also, a solar cell incorporating the resulting
thin film presents an improved efficiency and open circuit voltage as compared to solar cells using known thin films produced from Cu-rich precursor films.
Etching the precursor film prior to annealing has the further advantage that the Cu-Se phases at the surface of the Cu-rich precursor film do not interdiffuse into the thin film during annealing. Etching the film only after annealing can only remove the Cu-Se secondary phases that are present on the surface of the film after annealing. However, during the annealing step the secondary phases may diffuse deeper into the film. As according to the present invention the precursor film is etched before being annealed, less of the Cu-Se secondary phases are formed during the annealing, and therefore less of these secondary phases tend to diffuse into the film. The proposed method is efficient in producing thin film semiconductors with less Cu-Se secondary phases throughout the film than known methods. This outlines the underlying principle of the present invention in general terms. Further specific embodiments according to the present invention are described without further limiting the scope of the invention.
In a preferred embodiment, a CZTSe precursor film is first produced in a molecular beam epitaxy system with Cu, Zn, Sn evaporation sources and Se is supplied via a valved source. The deposition temperature is set to 320 °C and all four elements are coevaporated on a molybdenum coated soda lime glass substrate. This corresponds to step 100. At this temperature, the CZTSe precursor film does not decompose. Indeed CZTSe is known to decompose according to the following equation at temperatures higher than 350°C.
Cu2ZnSnSe4(s)→ Cu2Se(s)+ ZnSe(s)+ SnSe(g)+ ½ Se2(g) (1 )
The equation applies for selenium, sulphur or mixed selenium/sulphur thin films.
Two sample precursor films are produced. For sample A, the stoichiometry of the precursor is set to Cu/(Zn+Sn) = 1.39 and Zn/Sn = 1 .27. For sample B, the stoichiometry of the precursor is set to Cu/(Zn+Sn) = 1.10 and Zn/Sn = 1.13.
Fig 3 shows a secondary ion mass spectrometry, SI MS, analysis of the Cu-rich precursor film according to sample A, which has neither been etched nor annealed. The sputtering time on the x-axis corresponds to different depths of the layer from the surface of the thin film (left) to the molybdenum substrate (right). It can be concluded that a copper selenide phase is present at the surface of the precursor film.
Fig 4 shows a SI MS analysis of sample A after it has been annealed at a high temperature of 500-600 °C in a graphite box, without prior etching of the sample. The annealing takes place in an H2/N2 atmosphere at a pressure of 1 mbar. The atmosphere further contains 15mg of SnSe and 20 mg of Se in order to avoid the decomposition according to equation (1 ) to take place. It can be observed that the annealed absorber presents a Cu- and Sn-rich interface. This leads to the model that during annealing, the copper selenide phase at the surface of the precursor film incorporates tin and turns into secondary phases, the most likely being the ternary Cu2SnSe3 phases. The ternary Cu2SnSe3 phase is suspected to limit the open circuit voltage of a solar cell using the resulting semiconductor thin film.
Therefore, sample A and B have been etched during 30 seconds to 1 minute in a 10% KCN etching solution, corresponding to step 200. This is done before proceeding to annealing, which corresponds to step 300. The films have been characterized at various stages of the production process using scanning electron microscopy, SEM, equipped with an energy dispersive X-Ray, EDX, analyser. The resulting composition ratios are given in Table I for sample A and Table II for sample B.
Table II
It is observed that the etched precursors have a similar Cu-poor composition after the annealing as compared to the non-etched precursors.
Solar cells have been built as follows using the semiconductor thin films resulting from the above production method, based on sample A and B. The annealed thin film is etched in KCN for 30 seconds in order to remove any remaining CuxSe or Se impurities. This step is followed by chemical bath deposition of CdS. Finally, the n-type window layer is sputtered via RF-magnetron sputtering from intrinsic and Al-doped ZnO, followed by e-beam evaporation of Aluminium grids. The resulting solar cells have been characterised with current-voltage, IV, measurements and quantum efficiency, QE, measurements, as usual in the art. The current-voltage measurements have been performed with a halogen lamp, which has been adjusted to 100 mW/cm2.
Photoluminescence at room temperature is used to determine the bandgap of the resulting absorber layer in the near surface region. Photoluminescence is performed with an Ar-lon Laser with a spotsize of 1 μηη. For SIMS analysis, an area with a diameter of 250 μηη has been analysed and 8 keV Cs+ ions have been used. The solar cell results based on pre-etched sample A are shown in Fig 5a and 5b. The solar cell parameters based on pre-etched sample A are given in Table I I I. A maximum solar cell efficiency of 6.1 % has been achieved. A maximum open circuit voltage of 353 mV has been achieved. It is noted that a solar cell produced from the annealed precursor of sample A without etching prior to the annealing step, did not result in a working solar cell.
Table II I
Similar results have been observed for the solar cell based on sample B, which is slightly Cu-rich. The solar cell based on the annealed precursor without prior etching resulted in a working cell having an efficiency of 3.2 % and an open circuit voltage of 270 mV. The solar cell based on sample B, which was etched prior to the annealing step, resulted in a working cell having an improved efficiency of 5.8 % and an improved open circuit voltage of 342 mV.
Devices made according to embodiments of the invention have been annealed at a temperature of 500 °C. However, it is to be realised that a range of temperatures in the annealing are permissible and dependent on various factors. In further embodiments, the annealing occurs at a temperature range of between 300 and 1000 °C, preferably between 400 and 800 °C, and more preferably between 450 and 600 °C.
The present invention provides a method for manufacturing a (AgxCui_x)2ZnZ(SySei_y)4 thin film, wherein Z is selected from Sn, Ge, Si, Pb. The method comprises the steps of providing a Cu-rich precursor film, etching the precursor film and subsequently annealing the etched film. The method results in thin film semiconductors that allow to increase the efficiency of solar cells which incorporate them.
No doubt many other effective alternatives will occur to the skilled person. It will be understood that the invention is not limited to the embodiments described herein and encompasses modifications apparent to those skilled in the art lying within the spirit and scope of the claims appended hereto.
References
[1 ] Todorov, T. K., Reuter, K. B. & Mitzi, D. B. High-Efficiency Solar Cell with Earth- Abundant Liquid-Processed Absorber Adv. Mater. 22, 1-4 (2010).
[2] Friedlmeier, T., Wieser, N., Walter, T., Dittrich, H. & Schock, H. Heterojunctions based on Cu2ZnSnS4 and Cu2ZnSnSe4 thin films Proceedings of the 14th European Photovotlaic Specialists Conference, Barcelona, 1242-1245 (1997).
[3] Ahn, S. et al. Determination of band gap energy (Eg) of Cu2ZnSnSe4 thin films: On the discrepancies of reported band gap values Appl. Phys. Lett. 97, 021905 (2010).
[4] Weber, A., Mainz, R. & Schock, H. W. On the Sn loss from thin films of the material system Cu-Zn-Sn-S in high vacuum J. Appl. Phys. 107, 013516 (2010).
[5] Redinger, A. & Siebentritt, S. Coevaporation of Cu2ZnSnSe4 thin films Appl. Phys. Lett. 97, 0921 1 1 (2010).
[6] Lewis, N. Toward Cost-Effective Solar Energy Use Science 315, 798 (2007).
[7] Wang, K. et al. Thermally evaporated Cu2ZnSnS4 solar cells Appl. Phys. Lett. 97, 143508 (2010).
[8] Schubert, B.-A. et al. Cu2ZnSnS4 thin film solar cells by fast coevaporation Prog. Photovolt: Res. Appl. (2010).
[9] Katagiri, H. et al. Enhanced Conversion Efficiencies of Cu2ZnSnS4-Based Thin Film Solar Cells by Using Preferential Etching Technique Applied Physics Express 1 , 041201 (2008).
[10] Probst, V. et al. New developments in Cu(ln,Ga)(S,Se)2 thin film modules formed by rapid thermal processing of stacked elemental layers Solar Energy Materials and Solar Cells 90, 31 15-3123 (2006).
[1 1 ] Piacente, V., Foglia, S. & Scardala, P. Sublimation study of the tin sulphides SnS2, Sn2S3 and SnS Journal of Alloys and Compounds 177, 17 (1991 ).
[12] Zocchi F, & Piacente V. Sublimation enthalpy of tin monoselenide J. Mater. Sci. Lett. 14, 235 (1995).
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10.1 109/PVSC.2010.561641 1
Claims
1 . A method for manufacturing a (AgxCui_x)2ZnZ(SySei_y)4 thin film, wherein
0 < x,y < 1 , and wherein Z is selected from Sn, Ge, Si, Pb, the method comprising - providing a thin film(10) comprising Ag and/or Cu, the thin film further comprising
Zn and Z, the thin film further comprising S and/or Se,
wherein the thin film presents a (AgxCui-x) / (Zn + Z) ratio that is greater than 1 (100);
the method further comprising
- etching (200) the thin film with an etching solution; and
- subsequent to the etching, annealing (300) the thin film.
2. The method according to claim 1 wherein annealing (300) of the thin film occurs at a temperature between 500 and 600 °C.
3. The method according to claim 1 , wherein the etching solution comprises KCN.
4. The method according to claim 2, wherein the etching solution comprises 10% KCN.
5. The method according to any of the preceding claims, wherein the step of annealing comprises annealing the thin film in an atmosphere.
6. The method according to claim 5, wherein the atmosphere comprises S and/or Se.
7. The method according to claim 5 or claim 6, wherein the step of annealing further comprises enclosing the thin film (20), together with said atmosphere, in an inert enclosure (30).
8. The method in accordance with claim 7, wherein at least one opening is provided in the enclosure, through which S and/or Se is supplied.
9. The method in accordance any one of the preceding claims, wherein the thin film (20) is provided on a substrate (10).
10. The method in accordance with claim 9, wherein the substrate (10) is molybdenum.
1 1 . A semiconductor thin film produced using the method according to any of the preceding claims.
12. A device comprising a semiconductor thin film produced using the method according to any of claims 1 to 10.
13. A device according to claim 12 wherein said device is a photovoltaic cell.
14. A device according to claim 13 wherein said device is a photovoltaic cell having an efficiency of at least 6 %.
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CN106960906A (en) * | 2017-02-24 | 2017-07-18 | 江苏理工学院 | A kind of Cu Sn Se nano phase change thin-film materials and its production and use |
US20180006173A1 (en) * | 2016-06-30 | 2018-01-04 | International Business Machines Corporation | Technique for Achieving Large-Grain Ag2ZnSn(S,Se)4 Thin Films |
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US10079321B2 (en) * | 2016-06-30 | 2018-09-18 | International Business Machines Corporation | Technique for achieving large-grain Ag2ZnSn(S,Se)4thin films |
CN106960906A (en) * | 2017-02-24 | 2017-07-18 | 江苏理工学院 | A kind of Cu Sn Se nano phase change thin-film materials and its production and use |
CN106960906B (en) * | 2017-02-24 | 2019-02-19 | 江苏理工学院 | A kind of Cu-Sn-Se nano phase change thin-film material and its preparation method and application |
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