WO2013156444A1

WO2013156444A1 - Laser diode apparatus

Info

Publication number: WO2013156444A1
Application number: PCT/EP2013/057810
Authority: WO
Inventors: Karsten Auen; Uwe Strauss; Thomas Hoefer
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2012-04-16
Filing date: 2013-04-15
Publication date: 2013-10-24
Also published as: DE102012103257A1

Abstract

The invention specifies a laser diode apparatus comprising - a housing (10) having a mounting surface (11) in a cavity (19) in the housing (10), - at least one laser diode chip (1) which, during operation, emits electromagnetic radiation through a radiation exit surface (1a), - at least one covering element (20) which is transparent, at least at points, to the electromagnetic radiation which is generated by the laser diode chip (1) during operation, and - a deflection element (2) which deflects, in the direction of the covering element (20), at least a portion of the electromagnetic radiation which is generated by the laser diode chip (1) during operation, wherein - the radiation exit surface (1a) of the laser diode chip (1) runs transversely or perpendicularly to the mounting surface (11) and/or to the covering element (20), - the covering element (20) is connected to the housing (10), and - the covering element (20) closes the housing (10) in a sealed manner.

Description

description

Laser Diode Device A laser diode device is specified.

The documents WO 2004/107511 A2 and WO 2010/069282 A2 describe laser diode devices. One problem to be solved is one

Specify laser diode device, which is characterized by a

particularly high optical output power.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises a housing. In the housing, the components of the

Laser diode device can be arranged.

The housing has a cavity. The cavity can

For example, be formed as a recess or as a recess in a main body of the housing. The cavity of the housing is bounded on its bottom surface by a mounting surface of the housing. The mounting surface is provided for mounting components of the laser diode device to it. The cavity may also be delimited, in addition to the bottom surface, by side surfaces which run perpendicular or obliquely to the mounting surface of the cavity. The cavity of the housing is adapted to receive the components of the laser diode device.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises a laser diode chip, the electromagnetic in operation Radiation emitted by a radiation exit surface. The laser diode chip is in particular designed to be in

Operation to emit electromagnetic radiation in the spectral range between UV radiation and infrared radiation. For example, the laser diode chip can be configured to emit UV radiation, blue light, green light, red light or infrared radiation during operation. In particular, the laser diode chip is a

Laser diode chip based on a nitride compound semiconductor material.

Based on nitride compound semiconductor material means in the present context that a

Semiconductor layer sequence of the laser diode chip or at least a part thereof, more preferably at least one active zone and / or a growth substrate wafer, a nitride compound semiconductor material, preferably Al _n Ga _m In _] __ _n _ _m N or consists of this, where 0 ^ n <1 , 0 ^ m <1 and n + m <1. In this case, this material does not necessarily have to have a mathematically exact composition according to the above formula. Rather, it may, for example, have one or more dopants and additional constituents. For the sake of simplicity, however, the above formula contains only the essential constituents of the crystal lattice (Al, Ga, In, N), even if these can be partially replaced and / or supplemented by small amounts of further substances.

In particular, the laser diode chip may have an epitaxially grown semiconductor layer sequence comprising an active layer, which is formed for example on the basis of AlGalnN and / or InGaN. The active layer is then configured to operate in electromagnetic mode

Radiation from the spectral range of ultraviolet To emit radiation up to green light. As an active layer, the laser diode chip may have, for example, a conventional pn junction, a double heterostructure or a quantum well structure, particularly preferably one

Have multiple quantum well structure. The name

Quantum well structure unfolds here no meaning

in terms of the dimensionality of the quantization. It thus includes quantum wells, quantum wires and quantum dots and any combination of these structures.

The laser diode chip is characterized in particular by a high optical output power. For example, the optical output power of the laser diode chip is at least 1 W, in particular at least 3 W.

The laser diode chip comprises a radiation exit surface. The radiation exit surface is that surface of the

Laser diode chips, through which at least a majority of the radiation emitted during operation of the laser diode chip the radiation

Laser diode chip leaves. The radiation exit surface is, for example, through the part of a side surface of

Semiconductor layer sequence formed. The laser diode chip is then in particular a

edge-emitting laser diode chip.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises a cover, which is at least locally permeable to the electromagnetic radiation generated by the laser diode chip in operation. That is, in the operation of the

Laser diode chip generated radiation leaves the

Laser diode device by the cover, preferably exclusively by the cover. The cover element may have areas that are suitable for the

Laser diode chip in operation generated electromagnetic

Radiation are permeable and areas responsible for this

Radiation are impermeable.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises a deflection element, the at least a part of the

Laser diode chip generated in operation generates electromagnetic radiation in the direction of the cover. The

For example, electromagnetic radiation exits from the radiation exit surface of the laser diode chip and subsequently strikes the deflection element. From the deflection element, the radiation is conducted by optical refraction and / or reflection to the cover. That is, the deflecting element changes the main radiation direction of the electromagnetic radiation generated by the laser diode chip in operation, for example by an angle between 80 ° and 100 °. According to at least one embodiment of the

Laser diode device extends the radiation exit surface of the laser diode chip transverse or perpendicular to the mounting surface and / or the cover. In other words, the laser diode chip emits its radiation such that it is partially parallel to the mounting surface and / or to the

Main extension plane of the cover extends. Furthermore, part of the laser diode chip runs during operation

generated radiation such that it intersects the plane of the mounting surface in extension. In particular, the

Radiation exit surface of the laser diode chip is not arranged parallel to the mounting surface. The electromagnetic radiation generated by the laser diode chip in operation is not directly on the radiation exit surface of the mounting surface, for example, in the direction of the cover, directed.

Rather, a deflection of at least a large part of the radiation in the direction of the cover element takes place through the

Deflection element of the laser diode device, which in a

Distance from the radiation exit surface is arranged.

According to at least one embodiment of the

Laser diode device, the cover is connected to the housing. For example, the cover is at a distance from the mounting surface. The cover element, that is to say its main extension plane, can then be at least

in places parallel to the mounting surface of the housing

run. The cover member closes the housing

for example, on its top.

According to at least one embodiment of the

Laser diode device seals the cover the housing tight. In particular, the cover closes the housing tightly against atmospheric gases and / or

Humidity. As part of the manufacturing possibilities

the cover closes the housing in particular hermetically. That is, the cover member covers

For example, the cavity of the housing completely and closes the cavity and thus the components of

Laser diode device in the cavity, such as the laser diode chip and the deflector, close to the environment. The cavity can also be filled with a protective gas, for example a noble gas, which is prevented from leaving the cavity by the cover element sealing the housing in a sealed manner. Alternatively, it is possible that the cavity is evacuated. In particular, the housing is preferably sealed so tightly that the leak rate for incoming or outgoing gas is at most 5 * 10 ^A (-8) Pa m ^A (3) / s.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises a housing having a mounting surface in a cavity of the housing. Furthermore, the laser diode device comprises at least one laser diode chip which is in operation

electromagnetic radiation through a

Emitted radiation exit surface. Furthermore, the

Laser diode device at least one cover element, which generated for the laser diode chip in operation

electromagnetic radiation at least in places

is permeable. The laser diode device further comprises a deflection element, which at least part of the

Laser diode chip in operation deflects generated electromagnetic radiation in the direction of the cover, wherein the radiation exit surface of the laser diode chip transversely or perpendicular to the mounting surface and / or the cover extends, the cover is connected to the housing, and the cover sealingly closes the housing.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises at least two, preferably a plurality of laser diode chips. The laser diode chips can be designed identically. That is, the laser diode device then includes, for example, only identical laser diode chips. By mounting the laser diode chips on the mounting surface of the housing, the laser diode chips can be very well thermally connected to the housing. This enables an efficient dissipation of heat generated during operation. In conventional laser diode devices, the

For example, include a TO housing, this results

Problem of a relatively poor thermal connection of the laser diode chip to the housing and thus to the environment. If, for example, two laser diode chips of high optical output power of at least 1 W are mounted in such a TO package, they show a poorer optical output power than a single one of these laser diode chips, since the two laser diode chips are mutually strong

heat up that electro-optical efficiency

disproportionately decreases.

A solution to this problem could be the use of enclosures, such as those for

High-performance light-emitting diodes are used. In these

Housing, however, it is necessary to overmold the laser diode chip with a plastic. These housings are thus not suitable for laser diode chips of high optical output power, since these plastics do not withstand the optical power densities and / or the short wavelengths of the radiation generated by the laser diode chip during operation. Furthermore, it is not possible with such plastics to close the laser diode chips tightly in the housings.

According to at least one embodiment of the

Laser diode device, the at least one laser diode chip is non-poured. That is, the cavity of the housing is not with a potting material, such as a

Plastic for silicone, backfilled, but especially the

Radiation exit surface of the laser diode chip is adjacent to the cavity of the housing filling gas, such as a protective gas or air. Furthermore, it is possible that the Housing is totally free of a plastic material and, for example, with metallic and / or ceramic

Materials is formed. According to at least one embodiment of the

Laser diode device has the cover a

Mount on which frame a window element

encloses. The enclosure is with another

Material formed as the window element. For example, the enclosure is formed with a material that is generated for the at least one laser diode chip in operation

electromagnetic radiation is not permeable. The

Window element, however, is formed with a material which is permeable to at least a portion of the electromagnetic radiation generated by the laser diode chip in operation.

In this case, the enclosure may be formed, for example, with a metal such as stainless steel. The window element is formed with a radiation-transmissive material. For example, the material of the window element comprises one of the following materials or consists of one of the following materials: glass, sapphire, ceramic. The window element can do this

be transparent, clear or translucent milky. In addition, it is possible that in the base material of the window element at least one other material such as

For example, a luminescence conversion material or a radiation-scattering material is introduced. The

Window element may in this case have radiation-scattering or radiation-converting properties.

According to at least one embodiment of the

Laser diode device is the mount by soldering or Welding connected to the housing. For example, the housing, at least in the area in which it to the

Covering borders, be formed with a metal. In this case, it is possible that the casing and housing are connected by welding. This allows a particularly temperature-stable and tight connection between the two elements. Alternatively, it is possible that the cover member and the housing by soldering together

are connected, wherein as a connecting means, a metallic solder or a glass solder can be used.

According to at least one embodiment of the

Laser diode device is attached to the cover element of at least one of the following optical elements:

Luminescence conversion element, lens, scattering element. It is particularly possible that several of these elements are attached to the cover. The elements may in this case both on the side of the cover element facing the at least one laser diode chip, and on the side of the cover element which faces away from the at least one laser diode chip

be attached. The elements can be immediate or

be indirectly attached to the cover. For example, on the side facing away from the laser diode chip side of

Covering a Lumineszenzkonversionselement be arranged, on which in turn a lens is arranged. The lens is then indirectly attached to the cover, whereas the luminescence conversion element is attached directly to the cover.

In the event that the cover a

Comprises luminescence conversion material and / or a

Lumineszenzkonversionselement is attached to the cover, the laser diode device may be adapted to in Operation to generate white light. For example, the at least one laser diode chip generates blue light or UV radiation in this case. The luminescence conversion material

and / or the luminescence conversion element convert at least a portion of this light into electromagnetic radiation of longer wavelengths.

According to at least one embodiment of the

Laser diode device, the deflection element is formed by one of the following optical elements or comprises at least one of the following optical elements: mirror, prism. That is, deflection of the generated by at least one laser diode chip in operation electromagnetic radiation in the direction of the cover can be done by reflection and / or optical refraction.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises at least one heat conducting element, which between the

Mounting surface of the housing and the at least one

Laser diode chip is arranged. The heat-conducting element can serve, in particular, to widen or spread apart the heat flow generated during operation of the laser diode chip between the laser diode chip and the mounting surface in order to form a large transition surface during heat transfer from

Laser diode chip to reach the case. The housing can then be mounted with its side facing away from the mounting surface directly on a heat sink. In this way, a particularly short distance between the laser diode chip and

Heatsink allows, so that the heat from the laser diode chip can be dissipated effectively. The use of the

Wärmeleitelements then ensures that the from

Laser diode chip generated heat to a particularly large Area can be distributed. Thus, the use of multiple laser diode chips in the housing is possible without causing a significant deterioration of the thermal connection of the individual laser diode chips.

In particular, the mutual heating of the

Laser diode chips can be reduced in this way.

The heat-conducting element can furthermore be used to reduce or compensate for thermal stresses between the laser diode chip and the housing, which are caused, for example, by different thermal expansion coefficients. The heat-conducting element can be fastened, for example, by means of soldering to the laser diode chip and to the mounting surface.

The heat-conducting element may in particular be formed by at least one of the following materials or consist of one of the following materials: silicon carbide, boron nitride, copper tungsten, diamond, aluminum nitride.

Moreover, it is possible that the heat conducting element is formed with an electrically conductive material and an electrical connection of the laser diode chip through the

Wärmeleitelement takes place.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises at least two laser diode chips, wherein each laser diode chip, a heat conducting element is uniquely associated. That is, in this case, not all the laser diode chips are arranged on a common heat conduction member, but each

Laser diode chip is arranged on its own heat conducting element. The laser diode chips can in this case already be attached before mounting in the cavity of the housing on their associated heat conducting and as

Composite of laser diode chip and heat conducting element to be mounted on the mounting surface.

According to at least one embodiment of the

Laser diode device, the housing is formed with a metallic material. For example, the housing comprises a housing base, which consists of a metallic material. For example, the housing may have one

Housing body consisting of a FeNiCo alloy and / or a WCu alloy. The housing base body can be covered or locally covered with a metallic layer, for example of Ni / Au or Au. In which

Housing may be a housing that is similar to a so-called butterfly housing. In deviation from conventional butterfly housings, the present

Housing, however, a cover, which closes the housing cavity on a housing top and is formed with a material, at least in places

is radiolucent.

According to at least one embodiment of the

Laser diode device, the housing has at least one

Sidewall up. The sidewall or sidewalls define the housing in a lateral direction that is parallel to the mounting surface, for example. The side wall of the housing is inclined or perpendicular to the mounting surface. For example, the side wall of the housing connects the mounting surface with the cover. In particular, the cover may be attached to the mounting surface facing away from the side wall. According to at least one embodiment of the

Laser diode device, the side wall has at least one opening through which an electrical connection element is guided, with which the laser diode chip is electrically conductively connected. In the event that the housing and thus also the side wall is formed with a metallic material, the electrical connection element, which is guided through the opening into the cavity of the housing, is fixed in an electrically insulating manner in the opening of the side wall.

The electrical connection element is formed, for example, as a pin or pin made of an electrically conductive material, such as a metal, which projects from outside the housing through the opening into the cavity of the housing. There, in the housing cavity, the connection element can then be electrically conductively connected to a laser diode chip, for example, by means of a connecting wire.

It is particularly possible that the number of

Connection elements corresponds at least to the number of laser diode chips. By way of example, each laser diode chip is electrically conductively connected to precisely one connection element. The laser diode device may then comprise, for example, ten, twelve, fourteen or more connection elements and an equal number of laser diode chips. But it is also conceivable that the laser diode chips within the housing in series

are interconnected and then only two connection elements are required for several laser diode chips, so that the number of connection elements is smaller than the number of

Laser diode chip.

According to at least one embodiment of the

Laser diode device is between the Radiation exit surface of the at least one

Laser diode chips and the deflecting a beam-shaping optical element arranged. In the jet-forming

For example, the optical element may be a lens, such as a cylindrical lens. Furthermore, a plurality of beam-shaping optical elements can be arranged between the radiation exit surface and the deflecting element, which are passed through in succession by the electromagnetic radiation which is emitted by the laser diode chip during operation. The one or more deflection elements, for example, for slow axis and / or fast axis collimation of the laser radiation

Find use. In this way, several can

Laser diode chips are arranged in the housing of the laser diode device relatively close to each other, without overlapping the beam lobes of the individual laser diode chips within the housing.

Is the cover a scattering element or a

Used luminescence conversion element, so is a

particularly uniform illumination of this element

desirable. In this case it turns out to be

advantageous if the beam lobes overlap each other at least at the element at their half width. If the beam lobes are to be guided separately outside the housing, the beam lobes should at least be superimposed on the exit from the housing by no more than 10%.

It can all components of the laser diode device, if they are present, that is, the at least one

Laser diode chip, the at least one deflecting element, and the at least one beam-forming optical element on the

Mounting surface of the housing to be attached. The deflecting element and the beam-shaping optical element may be attached to the mounting surface, for example by gluing.

According to at least one embodiment of the

Laser diode device, the laser diode device comprises at least two laser diode chips, wherein the

Radiation exit surfaces of two of the laser diode chips face each other and between the two

Laser diode chips at least one deflection element is arranged. The deflecting element is thus arranged between two laser diode chips facing each other. The deflecting element is designed such that laser radiation from one of

Laser diode chips can not get to the other of the laser diode chips.

The optically active surfaces of the deflecting element are

for example, axisymmetric to a central axis

arranged, relative to which also the laser diode chips

are arranged axially symmetrically on both sides of the deflecting element. By way of example, the laser diode device in this case comprises a single deflecting element extending along it

Center axis extends. Left and right of the deflecting the laser diode chips can then be arranged axially symmetrical or offset from each other.

Below is the one described here

Laser diode device explained in more detail with reference to embodiments and the accompanying figures. FIG. 1A shows a schematic perspective view of a first exemplary embodiment of a laser diode device described here. FIG. 1B shows an associated schematic

Sectional view.

Figures 2, 3, 4, 5 and 6 show schematic

Sectional views of further embodiments of laser diode devices described herein.

The same, similar or equivalent elements are provided in the figures with the same reference numerals. The figures and the proportions in the figures

Elements shown with each other are not as

to scale. Rather, individual elements for better presentation and / or for better

Comprehensibility must be exaggerated.

A first exemplary embodiment of a laser diode device described here is shown in a schematic perspective illustration in FIG. 1A. FIG. 1B shows an associated sectional view along the section line A-A '.

The laser diode device comprises a housing 10. In the present case, the housing 10 is formed with a metal. The housing 10 has a cavity 19 in which the components of

Laser diode device are arranged.

In the present case, fourteen nitride-based laser diode chips 1 are mounted in the cavity 19 of the housing 10 on the mounting surface 11 of the housing. Between the mounting surface 11 and the laser diode chips 1, a respective heat conducting element 3 is arranged, wherein each laser diode chip 1 a

Wärmeleitelement 3 is uniquely associated. The laser diode chips 1 each have

Radiation exit surfaces la, through the generated during operation electromagnetic radiation leaves the laser diode chips 1. The laser diode chips 1 are in two rows

on both sides of a single optical deflecting element 2

arranged. In the present case, the optical deflecting element 2 is a deflecting mirror which has two mirrored surfaces which respectively face the radiation exit surfaces 1a of the laser diode chips 1. From the optical deflection element 2 is the laser diode chips 1 in the

Operation generated radiation reflected toward a cover 20.

The laser diode chips 1 can be fastened to the heat-conducting element 3 by means of a solder material. The heat-conducting element 3 in turn is fastened to the mounting surface 11 on its side facing away from the associated laser diode chip 1, in each case by means of a solder material. The housing 10 has side walls 12, which are the cavity 19, in which the components of the laser diode device

are arranged to limit in a lateral direction.

The housing 10 is formed in one piece and has, in addition to the mounting surface 11 and the side walls 12, a fastening device 16, which is presently designed as a projection on two sides of the housing. The

Fastening device 16 may have openings 18, by means of which the housing 10 is arranged and fastened, for example, by screws or rivets to an unillustrated heat sink on the underside of the housing 10 facing away from the mounting surface 11. The housing wall 12 has in the present embodiment, a plurality of openings 13. Through each opening 13, a connection element 14 is guided from outside the housing into the housing cavity. The connection elements 14 are

in the present case designed as metallic pins or pins, which are fixed electrically insulating in the housing wall. That is, the connection elements are each electrically isolated from the housing 10. Each connection element 14 is electrically conductively connected in the housing cavity 19 by means of a connecting wire 15 with an associated laser diode chip 1. Via the connection elements 14, the laser diode chips 1 in the housing cavity 19 can be controlled individually.

Spaced to the mounting surface 11, the housing cavity 19 is covered by the cover 20. The cover member 20 includes a skirt 21 made of a metallic material. The enclosure 21 surrounds a window element 22. The enclosure 21 is for the laser diode chips 1 in the

Operation does not produce electromagnetic radiation

permeable, only through the window member 22, the radiation can leave the housing 10. The window element 22 is presently formed, for example, with glass.

The enclosure 21 is connected to a support surface 17, which bounds the side walls 12 at the top of the housing, in a connecting region 23 with the side walls 12 of the housing. The compound can, for example, a metallic solder, a glass solder, or a

Welded connection, wherein the connecting portion 23 is then designed accordingly. At the LED chips 1 side facing the

Cover element 20 is optionally a scattering element 32

arranged for the diffuse scattering of the

Laser diode chips 1 is provided in operation generated electromagnetic radiation. In this way, it is possible that the electromagnetic radiation is distributed homogeneously over the surface of the window member 22 at the exit from the cover 20 and exits uniformly from the housing 10. The cover 20 closes the housing tightly.

In particular, the housing may be hermetically sealed, so that the laser diode chips 1 are protected against atmospheric gases and moisture. The housing 10 may be a type of butterfly housing, in which, unlike conventional housings of this type, the cover 20 is at the top of the housing

Housing is radiation permeable. In the present case via the heat conducting element 3 a

Spreading the heat generated during operation in the laser diode chip 1, which can thus be delivered over a large area to the mounting surface 11 of the housing 10. From there, the heat is released via a relatively short heat conduction path to the environment. In this way, it is possible to arrange a plurality of laser diode chips in a single housing, without the efficiency of the individual laser diode chips being lowered too much by the waste heat of the surrounded laser diode chips.

Thus, a laser diode device is provided, which may have an optical output power of several watts, wherein the optical output power by increasing the Housing and adding further laser diode chips in

easily scalable.

In contrast to the embodiment of Figures 1A and 1B, the schematic sectional view of Figure 2 shows an embodiment in which laser diode chips are arranged in a single row next to each other in the housing. The emitted light is reflected by the single deflecting element, in this case a deflecting mirror, to the covering element 20.

In conjunction with FIG. 3, an exemplary embodiment is shown in which a distinction is made between the radiation exit surface 1a of the laser diode chips 1 and the deflecting element 2

beam-shaping optical element 4, in this case a

Cylindrical lens is arranged. The beam-shaping optical element 4 serves to collimate the radiation. In this way, the laser diode chips 1 can be arranged as close to each other as possible, without overlapping the beam lobes of the individual laser diode chips already within the housing.

In conjunction with FIG. 4, an exemplary embodiment is shown, in which the exemplary embodiment of FIGS. 1A and 1B surround the beam-shaping optical elements 4 of FIG

Embodiment of Figure 3 is completed. In this case, the beam-shaping optical elements 4 are each arranged between the radiation exit surfaces 1 a and the deflecting element 2. The beam-shaping optical elements 4 can extend parallel to the deflection element 2 on both sides of this. In this way, a particularly space-saving arrangement of the laser diode chips 1 in the housing is possible without overlapping the beam lobes of the individual laser diode chips within the housing. In conjunction with FIG. 5, an exemplary embodiment is shown with reference to a schematic sectional view, in which, unlike the exemplary embodiment of FIGS. 1A and 1B, each of the two rows of laser diode chips 1 is assigned its own optical deflecting element 2. At the

Laser diode chips 1 side facing away from the cover 20 are optical elements, in the present case lenses 31, arranged, which provide for beam shaping outside of the housing. On the scattering element 32 is omitted.

In conjunction with FIG. 6, an embodiment is described in more detail with reference to a schematic sectional illustration

explained, in which at the laser diode chips 1 facing away from the outside of the cover 20 a

Lumineszenzkonversionselement 30 is arranged. Such a luminescence conversion element 30 can also be present, for example, in the exemplary embodiments of FIGS. 1A, 1B, 2, 3 and 4. By means of the luminescence conversion element 30, it is possible, for example, that the

Laser diode device for emitting white light

is, for example, mixed light, which consists of a converted portion of the electromagnetic radiation generated by the laser diode chips 1 in operation and the electromagnetic radiation generated during operation

composed.

This patent application claims the priority of German Patent Application 102012103257.2, the disclosure of which is hereby incorporated by reference.

The invention is not limited by the description based on the embodiments of these. Rather, it includes The invention relates to any novel feature as well as any combination of features, which in particular includes any combination of features i the claims, even if this feature or this combination itself is not explicitly in the

Claims or embodiments is given.

Claims

claims

Laser diode device with

a housing (10) having a mounting surface (11) in a cavity (19) of the housing (10),

- At least one laser diode chip (1), the electromagnetic radiation during operation by a

Emitted radiation exit surface (la),

- At least one cover member (20), which generated for the laser diode chip (1) in operation

electromagnetic radiation is at least partially permeable,

- A deflecting element (2), the at least a part of the laser diode chip (1) generated in operation

electromagnetic radiation in the direction of

Covering element (20) directs, wherein

- The radiation exit surface (la) of the

Laser diode chips (1) transversely or perpendicular to

Mounting surface (11) and / or the cover (20) extends,

- The cover (20) is connected to the housing (10), and

- The cover (20) the housing (10) tight

closes.

Laser diode device according to the previous claim with

- At least two laser diode chips (1), wherein the

Radiation exit surfaces (la) of two of the

Laser diode chips (1) facing each other and between the two radiation exit surfaces (la) at least one deflecting element (2) is arranged. Laser diode device according to the preceding claim with exactly one deflection element (2).

Laser diode device according to one of the previous

Claims,

in which the at least one laser diode chip (1)

is not poured.

Laser diode device according to one of the previous

Claims,

in which the cover element (20) seals the housing (10) so tightly that a leak rate is at most 5 * 10 ^A (- 8) (Pa * m ^A 3) / s.

Laser diode device according to one of the previous

Claims,

in which the cover element (20) has a surround (21) which surrounds a window element (22) like a frame, wherein the window element (22) is permeable to at least part of the electromagnetic radiation generated by the laser diode chip (1) during operation

A laser diode device according to the preceding claim, wherein the enclosure (21) is formed with a metal and the window member (22) comprises one of the following materials or any one of the following

Materials consists of: glass, sapphire, ceramics.

Laser diode device according to one of the two preceding claims,

wherein the enclosure (21) is connected to the housing by soldering or welding. Laser diode device according to one of the previous

Claims,

in which at least one of the following optical elements is attached to the cover element (20):

Luminescence conversion element (30), lens (31),

Scattering element (32).

Laser diode device according to one of the previous

Claims,

in which the deflection element (2) is formed by one of the following optical elements or comprises one of the following optical elements: mirror, prism.

Laser diode device according to one of the previous

Claims with

at least one heat-conducting element (3), which between the mounting surface (11) and the at least one

Laser diode chip (1) is arranged.

Laser diode device according to the preceding claim, in which each laser diode chip (1) is uniquely associated with a heat conducting element (3).

Laser diode device according to one of the previous

Claims,

wherein the housing (10) is formed with a metallic material.

Laser diode device according to one of the previous

Claims,

in which the housing (10) has at least one side wall (12) which is oblique or perpendicular to the mounting surface (11) extends, wherein the side wall (12) has at least one opening (13) through which an electrical

Connection element (14) is guided, with the

Laser diode chip (1) is electrically connected.

Laser diode device according to one of the previous

Claims,

in which between the radiation exit surface (la) of the at least one laser diode chip (1) and the

Deflection element (2) a beam-shaping optical element (4) is arranged.