WO2013150575A1

WO2013150575A1 - Light-emitting device and producing method therefor

Info

Publication number: WO2013150575A1
Application number: PCT/JP2012/058828
Authority: WO
Inventors: 秀隆大峡
Original assignee: パイオニア株式会社; 東北パイオニア株式会社
Priority date: 2012-04-02
Filing date: 2012-04-02
Publication date: 2013-10-10

Abstract

The present invention provides a light-emitting device, wherein a light-emitting region, which includes a light-emitting element, and a terminal led out from the light-emitting region are provided on a substrate. A mounting member is mounted on the substrate. A conductive member is disposed opposite to the terminal on the mounting member. Part of the conductive member on the surface side is welded to the terminal.

Description

Light emitting device and manufacturing method thereof

The present invention relates to a light-emitting device in which a light-emitting element such as an organic EL element is formed on a substrate and used as, for example, various display devices or illumination devices, and a method for manufacturing the same.

An organic EL panel is a self-luminous panel having an organic EL element as a light emitting element on a substrate such as a transparent substrate. For example, a display screen of a mobile phone, a monitor screen of an in-vehicle or household electronic device, a personal computer or a television It is used as various display devices such as an information display screen of an image receiving device and a lighting panel for advertisement. Alternatively, it is also used as an illumination device used for general illumination, a backlight of a liquid crystal display device, and a light source used for a printer.

By the way, in recent years, for the purpose of reducing the size of a device on which an organic EL panel is mounted or displaying a large screen by arranging a plurality of organic EL panels in a tile shape, the organic EL at the periphery of the organic EL panel is used. There is a growing demand for a so-called narrow frame in which the width dimension of a non-light-emitting region in which no element is formed (referred to as a frame for convenience) is reduced.
However, conventionally, when the drive circuit board (mounting member) is mounted on the organic EL panel, terminals (electrodes) led out from the light emitting region including the organic EL element in the organic EL panel and the drive circuit board, Were connected via a flexible cable or the like. Therefore, a space for arranging the flexible cable or the like is required in the frame (around the light emitting region), and the frame width cannot be sufficiently narrowed.

As a configuration capable of solving the above-described problem, Patent Document 1 discloses a configuration in which an ITO electrode (light emitting element electrode) on a light emitting panel and a take-out electrode on a drive circuit side are connected by a conductive sphere (conductive sphere). Has been.
The configuration disclosed in Patent Document 1 will be described with reference to FIG. In FIG. 1, ITO electrodes 52 (anodes) are provided in a lattice shape on a glass substrate 51 forming a light emitting panel, and a hole transport material 53 and an electron transport material 54 made of an organic material are deposited thereon. Further, a cathode metal electrode 55 is disposed on the electron transport material 54.
Further, a drive circuit extraction electrode 56 is disposed on the lower surface of the electrode base material 57 above the ITO electrode 52. A conductive sphere 60 is provided between the ITO electrode 52 and the drive circuit extraction electrode 56 to electrically connect them.

According to this configuration, it is not necessary to draw a flexible cable or the like to the side of the light emitting panel when connecting the light emitting panel side (ITO electrode 52) and the drive circuit side (drive circuit take-out electrode 56). It can be a frame configuration.
Japanese Patent Laid-Open No. 10-241861

However, in the configuration shown in FIG. 1, the step of fixing the conductive sphere 60 on the ITO electrode 52 on the light emitting panel side and the conductive sphere 60 fixed on the light emitting panel side and the drive circuit extraction electrode 56 are combined. Thermal stress is given to the light emitting element twice in total with the process (mounting process). Therefore, there is a problem that the light emitting element of the light emitting panel is easily damaged.
Further, in the process of fixing the conductive sphere 60 as described above, it is difficult to say that the work is easy, and since the light emitting element is easily damaged by the mounting process, there is a possibility of causing a large loss to the light emitting panel. . And when the loss given to the light emission panel was large and the light emission panel had to be discarded, there existed a subject that cost increased.

Patent Document 1 discloses that an insulating layer is provided on a light-emitting element of a light-emitting panel, a hole is provided in the insulating layer as a current extraction portion, and the conductive sphere 60 is embedded in the hole to fix the conductive sphere 60. However, there is a problem that it is difficult to form the hole, and a thick insulating layer has to be formed for fixing the conductive sphere 60, which increases the cost.

The present invention has been made paying attention to the above points, and in a light emitting device in which a mounting member is mounted on a light emitting panel in which a light emitting region is formed on a substrate by a light emitting element, the non-light emitting region of the light emitting panel is provided. It is an object of the present invention to provide a light-emitting device that can be remarkably narrowed and that can easily mount the mounting member on the light-emitting panel, and a method for manufacturing the same.

In order to solve the above-described problems, a light-emitting device according to the present invention is provided with a light-emitting region including a light-emitting element and a terminal derived from the light-emitting region on a substrate as described in claim 1. In the light emitting device, a mounting member is mounted on the substrate, a conductive member facing the terminal is disposed on the mounting member, and a part of the surface side of the conductive member is welded to the terminal. It has the feature in being.
With this configuration, it is only necessary to provide a width around the light emitting region in the base body so that a terminal derived from the light emitting region is provided, and a narrow frame with a significantly narrow width of the non-light emitting region is realized. Can do.

In order to solve the above-described problems, a method for manufacturing a light-emitting device according to the present invention is a method for manufacturing a light-emitting device having a light-emitting region including a light-emitting element on a substrate, as described in claim 14. A step of providing a terminal derived from the light emitting region on the base, a step of fixing a conductive member corresponding to the terminal to a mounting member to be mounted on the base, the base and the mounting member And a step of aligning the position of the terminal with the position of the conductive member fixed to the mounting member, and welding a part of the conductive member to the terminal. Have.
According to such a method, since the conductive member that connects the mounting member side and the substrate side is fixed to the mounting member side in advance, the conductive member is welded to the terminal on the substrate side by a single heat treatment. For this reason, the thermal stress given to light emitting elements, such as a some organic EL element formed in the light emission area | region of a base | substrate, can be made small. Further, since there is no need for complicated processing for fixing the conductive member on the substrate side, the mounting member can be easily mounted on the substrate.

According to the present invention, in a light-emitting device in which a mounting member is mounted on a light-emitting panel in which a light-emitting region is formed on a substrate by a light-emitting element, the width of the non-light-emitting region of the light-emitting panel is significantly reduced, and The mounting member can be easily mounted.

FIG. 1 is a cross-sectional view showing a connection configuration example between a conventional light emitting panel and a mounting member side. FIG. 2 is a plan view of a light emitting panel constituting the light emitting device according to the present invention and a wiring board (mounting member) mounted on the light emitting panel. FIG. 3 is a partially enlarged cross-sectional view of the light emitting device showing a joint portion in a state in which a wiring board is mounted on the light emitting panel of FIG. FIG. 4 is a flowchart showing a flow of steps of the method for manufacturing a light emitting device according to the present invention. FIG. 5 is a partially enlarged cross-sectional view of the light-emitting device showing a state in which a conductive member is fixed to the through hole of the wiring board of FIG. FIG. 6 is a partially enlarged cross-sectional view of the light-emitting device showing a state in which the lower end of the conductive member in FIG. FIG. 7 is a plan view of a light-emitting panel showing another embodiment of the light-emitting device according to the present invention. FIG. 8 is a partially enlarged cross-sectional view of a light-emitting device showing another embodiment of the light-emitting device according to the present invention.

1 Light-emitting panel 2 Transparent substrate (base)
3 Wiring board (mounting material)
5 Light emitting area 6 Terminal 7 Through hole (hole)
9 Wiring pattern 10 Conductive member 11 Core material 12 Cover member 13 Conductive adhesive 14 Terminal 15 Terminal

Hereinafter, embodiments of a light emitting device and a method for manufacturing the same according to the present invention will be described with reference to the drawings. FIG. 2 is a plan view of the light emitting panel 1 constituting the light emitting device according to the present invention and the wiring board 3 (mounting member) mounted on the light emitting panel 1. FIG. 3 is a partially enlarged cross-sectional view of the light-emitting device showing the joint portion in a state where the wiring board 3 is mounted on the light-emitting panel 1.

A light-emitting panel 1 shown in FIG. 2 has a light-emitting region 5 including, for example, a plurality of organic EL elements (light-emitting elements) on a transparent substrate 2 such as a glass substrate as a base, and is derived from the organic EL elements at the periphery. A plurality of terminals 6 are formed along the circumferential direction (edge).

On the other hand, when the wiring board 3 is mounted on the light-emitting panel 1, the wiring board 3 is disposed so as to face the light-emitting panel 1. A through hole 7 (through hole) is provided on the peripheral edge of the wiring board 3 at a position corresponding to the plurality of terminals 6 provided on the peripheral edge of the transparent substrate 2 (the same position in plan view). The wall surface of the through hole 7 is plated with a conductive material (for example, copper) as shown in FIG.

Further, for example, a spherical conductive member 10 is inserted into the through hole 7 as shown in the drawing, and the conductive member 10 is fixed in a state where the lower side protrudes below the through hole 7.
The conductive member 10 includes a spherical core material 11 and a covering member 12 that covers the core material 11. The core material 11 is made of a material having a high melting point, for example, copper, and the covering member 12 is made of a material having a melting point lower than that of the core material 11, for example, solder.
A part of the conductive member 10 is melted and welded to the terminal 6 of the light emitting panel 1. Specifically, as shown in FIG. 3, a part of the covering member 12 protruding downward from the through hole 7 is welded to the terminal 6.

On the other hand, the upper side of the conductive member 10 is accommodated in the through hole 7. In the through hole 7, a conductive adhesive 13 such as a conductive paste is filled on the conductive member 10. While being fixed reliably, the electrical connection between the wiring pattern 9 and the conductive member 10 is ensured.
According to the light emitting device configured as described above, it is sufficient that the width of the terminal 6 is provided around the light emitting region 5 in the light emitting panel 1, and a narrow frame with a significantly narrow width of the non-light emitting region is realized. be able to.

Next, a process of manufacturing the light emitting device shown in FIGS. 2 and 3 will be described along the flow of FIG.
First, a plurality of terminals 6 led out from the light emitting region 5 are formed on the peripheral edge of the transparent substrate 2 in the light emitting panel 1 (around the light emitting region 5).
Further, a plurality of through holes 7 corresponding to the plurality of terminals 6 provided in the light emitting panel 1 are formed in the wiring board 3 (step S1 in FIG. 4).

Next, the conductive member 10 is inserted into the through hole 7 of the wiring board 3, and a conductive paste or the like is placed on the upper portion of the through hole 7 with the lower side of the conductive member 10 protruding below the through hole 7 as shown in FIG. The conductive adhesive 13 is filled, and the conductive member 10 is fixed to the through hole 7 (step S2 in FIG. 4).
For example, the conductive member 10 inserted into the plurality of through holes 7 is electrically conductive on a work table (not shown) whose upper surface is horizontal, for example, so as to uniformly protrude below the through holes 7 by a predetermined dimension. The wiring board 3 may be arranged with a gap smaller than the height dimension of the member 10, and the conductive member 10 may be inserted into the through hole 7 in that state. By doing so, it is possible to make the lower portions of the conductive members 10 evenly project below the through holes 7 with the lower ends of all the conductive members 10 in contact with the upper surface of the work table.

Next, the wiring substrate 3 is disposed opposite to the light emitting panel 1, and the position of the plurality of terminals 6 on the light emitting panel 1 side and the position of the through hole 7 (conductive member 10) on the wiring substrate 3 side are aligned (alignment). (Step 3 in FIG. 4).
At this time, as shown in FIG. 6, the lower end of the conductive member 10 (covering member 12) protruding below the through hole 7 of the wiring board 3 is brought into contact with the terminal 6 on the light emitting panel 1 side.

When the light emitting panel 1 and the wiring board 3 are aligned, they are accommodated in an oven (for example, a reflow furnace) and heated at a predetermined temperature for a predetermined time.
This heating temperature is raised to a temperature higher than the melting temperature of the covering member 12 (for example, solder) of the conductive member 10 and lower than the melting point of the core material 11 (for example, copper), whereby only the covering member 12 is dissolved. As shown in FIG. 3, it is welded to the terminal 6 of the light emitting panel 1 (step S4 in FIG. 4). Further, the core member 11 is lowered by its own weight due to the dissolution of the covering member 12, and the lower end thereof contacts the terminal 6 of the light emitting panel 1.
Here, in all the conductive members 10, since the covering member 12 is heated and welded to the terminals 6 of the light emitting panel 1 as described above, the wiring patterns 9 of all the through holes 7 on the wiring board 3 side, All the terminals 6 on the corresponding light emitting panel 1 side are electrically connected substantially simultaneously.

As described above, according to the embodiment of the light emitting device according to the present invention, the light emitting device includes the light emitting panel 1 in which a plurality of terminals 6 are provided around the light emitting region 5 of the transparent substrate 2, and the light emitting panel. Wiring board 3 (mounting member) provided with a plurality of through holes 7 corresponding to a plurality of terminals 6 on one side, and a plurality of conductive members 10 inserted and fixed in the plurality of through holes 7, A part of the surface side (covering member 12) of the conductive member 10 is welded to the terminal 6 on the light emitting panel 1 side.
With this configuration, it is only necessary to provide a width enough to provide the terminal 6 around the light emitting region 5 in the light emitting panel 1, and a narrow frame with a significantly narrow width of the non-light emitting region can be realized.

Further, according to the manufacturing method described above, the conductive member 10 that connects the wiring board 3 (mounting member) side and the light emitting panel 1 side is fixed to the wiring board 3 side first, and the conductive member 10 is subjected to a single heat treatment. Is welded to the terminal 6 on the light emitting panel 1 side.
For this reason, the thermal stress given to light emitting elements, such as a some organic EL element currently formed in the light emission area | region 5 of the light emission panel 1, can be made small before mounting of the wiring board 3 (mounting member).
Further, in fixing the conductive member 10, since the conductive member 10 is inserted into the through hole 7 and fixed by the conductive adhesive 13, complicated processing for fixing the conductive member 10 on the light emitting panel 1 side is necessary. Therefore, the wiring board 3 (mounting member) can be easily mounted on the light emitting panel 1.

In the above-described embodiment, the through-hole 7 that is a through hole is formed in the wiring board 3, the wall surface thereof is plated with a conductive material, and the lower portion of the conductive member 10 projects below the through-hole 7. In this state, the conductive member 10 is fixed, but the configuration is not limited thereto.
For example, even if the wall surface of the through hole 7 is not plated with a conductive material, the conductive member 10 is fixed with the lower portion of the conductive member 10 protruding below the through hole 7, It is only necessary that the conductivity between the member 10 and the wiring board 3 side (wiring pattern 9) is ensured.

In addition, in the wiring board 3, not a through-hole such as the through-hole 7, but a concave hole (not shown) having the same diameter as the conductive member 10 is provided on the lower surface side, for example, and a conductive adhesive such as a conductive paste The conductive member 10 may be fixed to the recess-shaped hole using.
Further, when the conductive member 10 is fixed to the hole such as the through hole 7, the conductive member 10 is fixed by fitting the conductive member 10 into the hole such as the through hole 7 instead of using a conductive adhesive. The electrical connection may be ensured.

Moreover, in the said embodiment, although the shape of the electrically-conductive member 10 was made into the spherical shape, the shape is not limited and another shape (for example, column body, polyhedron) may be sufficient.
Further, the mounting member 10 may have a shape (for example, a bar-shaped member made of a hexahedron) that matches the

linear terminals

14 and 15 formed on the light-emitting panel 1 as shown in FIG. 7 (plan view). As such a configuration, for example, an organic EL element is formed in a solid state in the light emitting region 5 of the glass substrate 2, and an anode terminal 14 and a cathode terminal 15 are drawn out on both sides thereof. It is done.
When the mounting member 10 is, for example, a rod-shaped hexahedron or a columnar body as described above, the cross-section of the mounting member 10 fixed to the through hole 7 is as shown in FIG.

Moreover, in the said embodiment, in step S4 of FIG. 4, the whole light emission panel 1 and the wiring board 3 shall be heated, and only the coating | coated member 12 of the electrically-conductive member 10 shall be melt | dissolved.
However, the present invention is not limited to this, and only the conductive member 10 (a part) may be heated, or only the covering member 12 (a part) may be heated.
Alternatively, the core member 11 of the conductive member 10 may be made of a magnetic material, and the conductive member 10 may be induction heated (Induction Heating, IH) to heat only the core member 11. According to such a configuration, only the covering member 12 is heated by the high-temperature core material 11, and the covering member 12 can be melted and welded to the terminal 6 on the light emitting panel 1 side.

Moreover, in the said embodiment, although the terminal 6 by the side of the light emission panel 1 shall be derived | led-out around the light emission area | region 5 in the transparent substrate 2, the position is not limited, For example, You may form the terminal 6 in the center part of the light emission area | region 5, etc. FIG.

In the above embodiment, the wiring board 3 has been described as an example of the mounting member. However, the mounting member is not limited thereto, and may be a member other than the board (for example, an IC).

In the above embodiment, the light emitting panel using a substrate such as a transparent substrate as the substrate has been described as an example. However, the substrate is not limited to the substrate, and may be a member other than a plate-like body, or a member such as a flexible substrate Good.

Claims

A light emitting device comprising a light emitting region including a light emitting element and a terminal derived from the light emitting region on a substrate,
A mounting member is mounted on the substrate,
The mounting member is provided with a conductive member facing the terminal,
A part of the surface side of the conductive member is welded to the terminal.
The conductive member is composed of a core material and a conductive covering member that covers the core material,
The light emitting device according to claim 1, wherein a part of the covering member is welded to the terminal.
The mounting member has a surface facing the terminal and a hole formed in the facing surface;
The light emitting device according to claim 2, wherein the conductive member is inserted into and fixed to the hole.
The light-emitting device according to claim 3, wherein the mounting member is a wiring board.
The light emitting device according to claim 4, wherein the hole is a through hole penetrating the wiring board.
The light emitting device according to claim 5, wherein the hole is a through hole in which a layer made of a conductive material is formed on a wall surface thereof.
4. The light emitting device according to claim 3, wherein the conductive member inserted into the hole is fixed by a conductive adhesive.
The light emitting device according to any one of claims 2 to 7, wherein the core material of the conductive member is formed in a spherical shape.
The light emitting device according to any one of claims 2 to 7, wherein the core material of the conductive member is formed in a columnar shape.
The light emitting device according to any one of claims 2 to 7, wherein the core member of the conductive member is formed in a polyhedron.
The light emitting device according to any one of claims 2 to 7, wherein the core member of the conductive member is formed of a material having a melting point higher than that of the covering member.
The light emitting device according to any one of claims 2 to 7, wherein a core material of the conductive member is formed of a magnetic material.
The light-emitting device according to claim 1, wherein the light-emitting element is an organic EL element.
A method of manufacturing a light emitting device having a light emitting region including a light emitting element on a substrate,
Providing a terminal derived from the light emitting region on the substrate;
Fixing a conductive member corresponding to the terminal to a mounting member for mounting on the substrate;
Arranging the base and the mounting member opposite to each other, and aligning the position of the terminal with the position of the conductive member fixed to the mounting member;
Welding a part of the conductive member to the terminal.
In the step of fixing the conductive member corresponding to the terminal to the mounting member,
The method for manufacturing a light emitting device according to claim 14, wherein the conductive member is inserted and fixed in a hole corresponding to the terminal formed in the mounting member.
Welding a part of the conductive member to the terminal;
The method of manufacturing a light emitting device according to claim 14 or 15, wherein the conductive member is heated to partially melt and weld the conductive member to the terminal.
The conductive member is formed of a material containing a magnetic material,
Welding a part of the conductive member to the terminal;
The method of manufacturing a light emitting device according to claim 14 or 15, wherein the conductive member is induction-heated, a part thereof is melted and welded to the terminal.