WO2013135206A1 - 腔体滤波器、功放模块及信号收发装置 - Google Patents

腔体滤波器、功放模块及信号收发装置 Download PDF

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Publication number
WO2013135206A1
WO2013135206A1 PCT/CN2013/072757 CN2013072757W WO2013135206A1 WO 2013135206 A1 WO2013135206 A1 WO 2013135206A1 CN 2013072757 W CN2013072757 W CN 2013072757W WO 2013135206 A1 WO2013135206 A1 WO 2013135206A1
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WO
WIPO (PCT)
Prior art keywords
inner conductor
cavity
connector
circuit board
signal transmission
Prior art date
Application number
PCT/CN2013/072757
Other languages
English (en)
French (fr)
Inventor
吴文敬
Original Assignee
深圳市大富科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201210069861.6A external-priority patent/CN102593560B/zh
Priority claimed from CN201220710710XU external-priority patent/CN203039057U/zh
Application filed by 深圳市大富科技股份有限公司 filed Critical 深圳市大富科技股份有限公司
Priority to US14/385,771 priority Critical patent/US9503037B2/en
Publication of WO2013135206A1 publication Critical patent/WO2013135206A1/zh

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
    • H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/04—Coaxial resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19—High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/165—A filter circuit coupled to the input of an amplifier
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/171—A filter circuit coupled to the output of an amplifier
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/294—Indexing scheme relating to amplifiers the amplifier being a low noise amplifier [LNA]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/20—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F2203/21—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F2203/211—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers
    • H03F2203/21112—A filter circuit being added at the input of a power amplifier stage
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H04B2001/0408—Circuits with power amplifiers
    • H04B2001/045—Circuits with power amplifiers with means for improving efficiency

Definitions

  • Embodiments of the present invention relate to the field of communications technologies, and in particular, to a connection manner between a connector inner conductor and an external circuit board in a cavity filter, and a power amplifier module and a signal transceiver device.
  • the cavity filter As a frequency selection device, the cavity filter is widely used in the field of communication. Due to the special requirements of the cavity filter for signal transmission, the accuracy of interconnection between components and external connectors is required.
  • FIG. 1 there is shown a partial cross-sectional view of a prior art cavity filter in which an external circuit board partially connected to the cavity filter is also shown.
  • the cavity filter includes a cavity 100, a cover plate 110, a connector outer conductor 120, and a connector inner conductor 130.
  • the cover plate 110 covers the cavity 100.
  • the connector outer conductor 120 is coupled to the cover plate 110, the connector inner conductor 130 is disposed within the connector outer conductor 120, and the connector inner conductor 130 passes through the cover plate 110 for signal transmission with the cavity filter external circuit board 150.
  • Point connection, in general, the connector outer conductor 120 and the connector inner conductor 130 are coaxially designed to constitute a signal transmission structure.
  • the connector outer conductor 120 is further provided with a conductive spacer 124 for preventing signal leakage.
  • the inventors of the present invention have found that in the above prior art, the inner conductor 130 and the circuit board 150 are inferior to the assembly datum when the height of the inner conductor 130 is lower due to manufacturing and device errors. There is usually a gap h.
  • the circuit board is deformed.
  • the board 150 may be jacked up to cause the circuit board 150 to be generated. The deformation does not ensure good contact between the inner conductor 130 of the connector and the signal transmission point of the outer circuit board 150 of the cavity filter.
  • the invention provides a cavity filter, a power amplifier module and a signal transceiver device, which can solve the problems in the prior art well.
  • the present invention provides a cavity filter including a cavity, a cover plate, and a connector inner conductor disposed in the cavity, the connector inner conductor connecting to the external circuit board through the cover plate, the connection
  • the inner conductor includes a first inner conductor and a second inner conductor, the first inner conductor is connected to a signal transmission point on the external circuit board, and the second inner conductor is connected to an internal signal transmission point in the cavity.
  • the first inner conductor and the second inner conductor are gap-fitted to form a structural capacitor, and the internal signal transmission point is connected to a signal transmission point on the external circuit board through the structural capacitor.
  • the present invention provides a cavity filter including a cavity, a cover plate, and a connector inner conductor disposed in the cavity, the connector inner conductor passing through the cavity and being connected to an external circuit board, the connection
  • the inner conductor includes a first inner conductor and a second inner conductor, the first inner conductor is connected to a signal transmission point on the external circuit board, and the second inner conductor is connected to an internal signal transmission point in the cavity.
  • the first inner conductor and the second inner conductor are gap-fitted to form a structural capacitor, and the internal signal transmission point is connected to a signal transmission point on the external circuit board through the structural capacitor.
  • the invention also provides a power amplifier module, comprising a cavity filter and a power amplifier board, the cavity filter comprising a cavity, a cover plate and a connector inner conductor disposed in the cavity, the inner conductor of the connector is worn Connecting the cover plate to the power amplifier board, the connector inner conductor includes a first inner conductor and a second inner conductor, and the first inner conductor is connected to a signal transmission point on the power amplifier board, the second inner The conductor is connected to an internal signal transmission point in the cavity, the first inner conductor and the second inner conductor are clearance-fitted to form a structural capacitor, and the internal signal transmission point is transmitted through the structural capacitor and the signal on the power amplifier board Point connection.
  • the present invention further provides a signal transceiving device comprising the above cavity filter, connected to a receiving antenna, and filtering a received signal; a radio frequency low noise amplifier connected to a signal output end of the cavity filter; And a signal output end of the low noise amplifier; a combiner connected to the circulator; a radio frequency power amplifier, an input end connected to the signal output end of the combiner, an output end and the cavity
  • the body filter is connected; the transmitting antenna receives the output signal of the cavity filter and transmits the signal.
  • the invention adopts a structure for adding structural capacitance on the inner conductor of the connector, and when the inner conductor of the connector and the circuit board are butted, the telescopic expansion of the structural capacitor portion compensates for the height difference between the inner conductor of the connector and the circuit board, thereby avoiding the present
  • the problem of damaging the circuit board caused by the error of the circuit board compensation error, and the disassembly is convenient, so that the processing cost of the product is significantly reduced, because the cavity filter of the present invention is used for filtering high frequency signals. Therefore, when the connector transmits a high-frequency signal, increasing the structure capacitance will not affect the signal transmission, and at the same time, by adjusting the capacitance value of the structure capacitor, the signal can be first-stage filtered and optimized.
  • the cavity filter, the power amplifier module and the signal transceiving device provided by the embodiments of the invention provide an improved scheme for the connection manner between the circuit board and the inner conductor of the connector, and can eliminate the relative relationship between the inner conductor of the connector and the signal transmission point of the circuit board.
  • the position error ensures good contact between the inner conductor of the connector and the signal transmission point of the external circuit board of the cavity filter.
  • the invention divides the inner conductor of the connector into the first inner conductor and the second inner conductor of the connector, and the structural capacitance is formed by the gap between the first inner conductor and the second inner conductor, thereby greatly improving the inner conductor of the connector in the cavity filter.
  • the reliability of the connection of the board is not easy to damage the board, and the signal can be transmitted well.
  • FIG. 1 is a partial cross-sectional view showing a connection between a cavity filter and a circuit board in the prior art
  • FIG. 2 is a partial cross-sectional view showing a connection between a cavity filter and a circuit board in an embodiment of the present invention
  • FIG. 3 is a partial cross-sectional view showing another cavity filter connected to a circuit board in an embodiment of the present invention
  • FIG. 4 is a partial cross-sectional view showing another connection of a cavity filter and a circuit board in an embodiment of the present invention
  • Figure 5 is a frequency-delay diagram of a prior art signal transmitted from a circuit board through an inner conductor to a cavity;
  • FIG. 6 is a frequency-delay diagram of signals transmitted from a circuit board through an inner conductor to a cavity in accordance with an embodiment of the present invention
  • FIG. 7 is a structural block diagram of a signal transmitting and receiving apparatus according to Embodiment 4 of the present invention.
  • a cavity filter as shown in FIG. 2, includes a cavity 200, a cover plate 210, and a connector inner conductor 230 disposed in the cavity 200, the connector inner conductor 230 passing through the cover plate 210 is connected to an external circuit board 250.
  • the connector inner conductor 230 includes a first inner conductor 2301 and a second inner conductor 2302.
  • the first inner conductor 2301 is connected to a signal transmission point on the external circuit board 250.
  • the second inner conductor 2302 is connected to an internal signal transmission point in the cavity 200, and the first inner conductor 2301 and the second inner conductor 2302 are clearance-fitted to form a structural capacitance, and the internal signal transmission point passes through the structural capacitor Connected to a signal transmission point on the external circuit board 250.
  • the cover plate 210 covers the cavity 200.
  • the connector outer conductor 220 is connected to the cover plate 210, the connector inner conductor 230 is disposed in the connector outer conductor 220, and the connector inner conductor 230 passes through the cover plate 110, and is connected to the cavity filter external circuit board 250, and is connected.
  • the outer conductor 220 and the inner conductor 230 of the connector are coaxially designed to constitute a signal transmission structure.
  • the connector outer conductor 220 is further provided with a conductive spacer 224 for preventing signal leakage.
  • the first inner conductor 2301 and the second inner conductor 2302 are gap-fitted to form a structural capacitance between the first inner conductor 2301 and the second inner conductor 2302, and further the capacitor 200 and the circuit board 250 are capacitively coupled. Way to transmit signals.
  • An internal signal transmission point within the cavity 200 can be disposed on the cavity 200 or on a resonant rod within the cavity 200, the second inner conductor 2302 being coupled to the cavity 200 or to the resonant rod.
  • the second inner conductor 2302 is provided with a cavity, the second inner conductor 2302 is fixed on the cavity 200, and the first inner conductor 2301 is inserted into the cavity of the second inner conductor 2302.
  • the first inner conductor 2301 and the second inner conductor 2302 are clearance-fitted.
  • the second inner conductor 2302 can be integrally formed with the cavity 200.
  • the first inner conductor 2301 is inserted into the cavity of the second inner conductor 2302, and the first inner conductor 2301 and the second inner conductor 2302. Clearance fit.
  • a cavity may be opened in the first inner conductor 2301 to insert the second inner conductor 2302 into the cavity of the first inner conductor 2301, the first inner The conductor 2301 and the second inner conductor 2302 are clearance-fitted, and the first inner conductor 2301 and the second inner conductor 2302 are clearance-fitted.
  • the second inner conductor 2302 can also be coupled to the resonant rod for transmitting signals between the circuit board 250 and the resonant rod.
  • the first inner conductor 2301 and the outer circuit board 250 may be connected together by bolts 260.
  • the first inner conductor 2301 and the outer circuit board 250 may also be connected by soldering.
  • the first inner conductor 2301 and the outer circuit board 250 may also be connected by a nut 270.
  • the maximum compression height of the structural capacitor portion of the inner conductor 230 of the connector is lower than the mounting height of the circuit board 250, at the capacitance value. Allowable (to meet signal transmission requirements and filtering requirements), the maximum extension height of the structural capacitance of the inner conductor 230 of the connector can meet the connection requirements.
  • the design of the capacitance value of the specific structural capacitor design is optimized and adjusted according to the parameter design requirements of the actual situation, so as to meet the tolerance requirement of the present invention and obtain the best filtering optimization.
  • the hard-connected inner conductor in the prior art is split into the first inner conductor 2301 and the second inner conductor 2302, and the second inner conductor 2302 is first assembled on the cavity 200, and then the first inner conductor is assembled.
  • 2301, the first inner conductor 2301 and the circuit board 250 are connected by screws, nuts or solder.
  • the first inner conductor 2301 and the second inner conductor 2302 body adopt a clearance fit
  • the first inner conductor 2301 and the second inner conductor 2302 are The axial direction may have a small range of relative movement, and the gap or interference between the first inner conductor 2301 and the circuit board 250 is eliminated by this small range of movement, while the first inner conductor 2301 and the second inner conductor 2302
  • the capacitance is formed and the signal is transmitted by capacitive coupling.
  • the cavity filter provided by the embodiment of the present invention provides an improved solution for the connection manner between the circuit board 250 and the inner conductor 230 of the connector, and can eliminate the relative position error between the inner conductor 230 of the connector and the signal transmission point of the circuit board 250. Good contact between the inner conductor 230 of the connector and the signal transfer point of the outer circuit board 250 of the cavity filter can be ensured.
  • the invention divides the inner conductor 230 of the connector into the first inner conductor 2301 and the second inner conductor 2302 of the connector. The first inner conductor 2301 and the second inner conductor 2302 form a structural capacitance through the gap, which greatly improves the cavity filter.
  • the connection reliability of the connector inner conductor 230 and the circuit board 250 is not easy to damage the circuit board 250, and the signal can be well transmitted.
  • an insulating medium 2303 is disposed between the first inner conductor 2301 and the second inner conductor 2302, and the first inner conductor 2301, the second inner conductor 2302, and the insulating medium 2303 form a structural capacitance.
  • the insulating medium 2303 is located on the first inner conductor 2301 or the second inner conductor 2302.
  • the insulating medium 2303 may be disposed on the first inner conductor 2301 or the second inner conductor 2302 by means of machining, injection molding or surface spraying.
  • the insulating medium 2303 can be any insulating material, preferably PTFE (polytetrafluoroethylene) material.
  • the circuit board 250 is provided with a final output capacitor, and a structural capacitor formed between the first inner conductor 2301 and the second inner conductor 2302 can replace the final output capacitor on the circuit board 250, the first inner conductor 2301 and
  • the structural capacitance formed between the second inner conductors 2302 may be adjusted according to the magnitude of the frequency, such as changing the length, size or thickness of the first inner conductor 2301 and the second inner conductor 2302, or changing the material of the insulating medium 2303 and the like.
  • FIG. 5 is a frequency-delay diagram of a signal transmitted from a circuit board through an inner conductor to a cavity in the prior art
  • the horizontal axis is the frequency value
  • the vertical axis is the delay time
  • the frequency value is When it is 2.59 GHz
  • the maximum delay value is 11.22 ns.
  • the frequency-delay diagram of the signal transmitted from the circuit board 250 through the first inner conductor 2301, the structural capacitor and the second inner conductor 2302 to the cavity is shown in the figure.
  • the horizontal axis is The frequency value
  • the vertical axis is the delay time.
  • the delay value is up to 11.66 ns.
  • the inner conductor is divided into a first inner conductor 2301 and a second inner conductor 2302, and an insulating medium 2303 is disposed between the first inner conductor 2301 and the second inner conductor 2302, so that the first An inner conductor 2301, a second inner conductor 2302 and the insulating medium 2303 form a structural capacitance, which eliminates a relative position error between the inner conductor 230 of the connector and the signal transmission point of the circuit board 250, and can ensure the inner conductor 230 and the cavity of the connector.
  • the physical filter external circuit board 250 has good contact between the signal transmission points, and can replace the final output capacitor on the original circuit board, reducing the manufacturing cost of the circuit board, and does not affect the signal transmission effect.
  • the cavity filter in this embodiment may be a frequency selective device such as a duplexer, a combiner, a tower top amplifier, or the like.
  • a cavity filter includes a cavity, a cover plate, and a connector inner conductor disposed in the cavity, the connector inner conductor is connected to the external circuit board through the cavity, the connector inner conductor
  • the first inner conductor and the second inner conductor are connected, and the first inner conductor is connected to a signal transmission point on the external circuit board, and the first inner conductor and the outer circuit board can be riveted, crimped, and sleeved Connect, solder or threaded connections.
  • the second inner conductor is connected to an internal signal transmission point in the cavity, the first inner conductor and the second inner conductor are clearance-fitted to form a structural capacitance, and the internal signal transmission point passes through the structural capacitor and the external The signal transmission point on the board is connected.
  • the first inner conductor and the second inner conductor are gap-fitted to form a structural capacitance between the first inner conductor and the second inner conductor, and further, the cavity and the power amplifier board transmit signals by capacitive coupling.
  • the cavity is in an inverted form, the cover plate is located below the cavity, and the bottom of the cavity is provided with a hole through which the inner conductor passes, and the inner internal signal transmission point of the cavity can be set on the cavity or the resonance in the cavity
  • the second inner conductor is connected to the cavity or to the resonant rod or to the cover.
  • the second inner conductor is provided with a cavity, the second inner conductor is fixed on the cavity, the first inner conductor is inserted into the cavity of the second inner conductor, the first inner conductor and The second inner conductor is clearance fit.
  • the second inner conductor is provided with a cavity, the second inner conductor is integrally formed with the cavity, and the first inner conductor is inserted into the cavity of the second inner conductor, the first inner conductor Interspersed with the second inner conductor.
  • the first inner conductor is provided with a cavity
  • the second inner conductor is inserted into a cavity of the first inner conductor
  • the first inner conductor and the second inner conductor are gap-fitted
  • the first inner conductor and the second inner conductor are in clearance fit.
  • the second inner conductor may also be coupled to the resonant rod for transmitting signals between the power amplifier board and the resonant rod.
  • an insulating medium is disposed in a gap between the first inner conductor and the second inner conductor, and the first inner conductor, the second inner conductor, and the insulating medium form a structural capacitor.
  • the insulating medium is located on the first inner conductor or the second inner conductor, and the insulating medium may be disposed on the first inner conductor or the second inner conductor by means of machining, injection molding or surface spraying.
  • the insulating medium may be any insulating material, preferably PTFE (polytetrafluoroethylene) material.
  • the cavity filter provided by the embodiment of the invention provides an improved solution for the connection manner between the power amplifier board and the inner conductor of the connector, which can eliminate the relative position error between the inner conductor of the connector and the signal transmission point of the power amplifier board, and can ensure the connector. Good contact between the inner conductor and the signal transfer point of the external power amplifier board of the cavity filter.
  • the invention divides the inner conductor of the connector into the first inner conductor and the second inner conductor of the connector, and the structural capacitance is formed by the gap between the first inner conductor and the second inner conductor, thereby greatly improving the inner conductor of the connector in the cavity filter.
  • the reliability of the connection of the power amplifier board is not easy to damage the power amplifier board, and the signal can be well transmitted.
  • a power amplifier module can be referred to FIG. 2, which includes the cavity filter and the power amplifier board shown in FIG. 2 (refer to the circuit board 250 shown in FIG. 2), the cavity filter includes a cavity 200, a cover a board 210 and a connector inner conductor 230 disposed in the cavity 200, the connector inner conductor 230 is connected to the power amplifier board through the cover plate 210, and the connector inner conductor 230 includes a first inner conductor 2301 and a second inner conductor 2302, the first inner conductor 2301 is connected to a signal transmission point on the power amplifier board 2302, and the second inner conductor 2302 is connected to an internal signal transmission point in the cavity 200, the first An inner conductor 2301 and the second inner conductor 2302 are clearance-fitted to form a structural capacitor, and the internal signal transmission point is connected to a signal transmission point on the power amplifier board through the structural capacitor.
  • the power amplifier board is provided with a final output capacitor, and the final output capacitor is used for filtering the transmission signal.
  • first inner conductor 2301 and the second inner conductor 2302 are gap-fitted to form a structural capacitor, which is only used for transmitting signals entering the cavity, and eliminating the relative relationship between the inner conductor of the connector and the signal transmission point of the power amplifier board. Position error.
  • the structural capacitor can replace the final output capacitor on the power amplifier board for filtering the transmission signal.
  • the first inner conductor 2301 and the second inner conductor 2302 can be formed by providing a suitable length and spacing for the first inner conductor 2301 and the second inner conductor 2302, and selecting a suitable material such as polytetrafluoroethylene for the insulating medium.
  • the structural capacitor replaces the original final output capacitor on the power amplifier board, that is, eliminates the relative position error between the inner conductor of the connector and the signal transmission point of the power amplifier board, and reduces the manufacturing cost of the power amplifier board.
  • the final output capacitor and the structural capacitor are matched to filter the transmission signal, and the first inner conductor 2301 and the second inner conductor 2302 are clearance-fitted to form a structural capacitor, using a structural capacitor and The final output capacitor on the power amplifier board is matched. Since the final output capacitor is relatively expensive, the price offset capacitor can be used instead of the final output capacitor, that is, the relative position between the inner conductor of the connector and the signal transmission point of the power amplifier board is eliminated. The error reduces the manufacturing cost of the power amplifier board.
  • a signal transceiving device as shown in FIG. 7, includes the cavity filter 1 described above, is connected to the receiving antenna 5, and filters the received signal; the RF low noise amplifier 2, and the cavity filter 1 a signal output terminal is connected; a circulator 4 is connected to the signal output end of the low noise amplifier 2; a combiner 7 is connected to the circulator 4; a radio frequency power amplifier 3, an input end and the combiner 7
  • the signal output terminal is connected, the output terminal is connected to the cavity filter 1; the transmitting antenna 6 receives the output signal of the cavity filter 1 and transmits the signal.
  • the cavity filter in the signal transceiving device of the embodiment of the present invention divides the inner conductor 230 into a first inner conductor 2301 and a second inner conductor 2302, and in the first inner conductor 2301 and the second inner An insulating medium 2303 is disposed between the body 2302, so that the first inner conductor 2301, the second inner conductor 2302 and the insulating medium 2303 form a structural capacitance, and the signal transmission point of the inner conductor 230 of the connector and the circuit board 250 is eliminated.
  • the relative position error between the two can ensure good contact between the inner conductor 230 of the connector and the signal transmission point of the external circuit board 250 of the cavity filter, and can replace the final output capacitance on the original circuit board 250, and the reduced circuit board.
  • the production cost of 250 does not affect the transmission of signals.

Abstract

本发明公开了一种腔体滤波器，包括腔体、盖板以及设于腔体内的连接器内导体，连接器内导体穿过盖板与外部电路板连接，连接器内导体包括第一内导体和第二内导体，第一内导体与外部电路板上的信号传输点连接，第二内导体与腔体内的内部信号传输点连接，第一内导体和第二内导体间隙配合形成结构电容，内部信号传输点通过结构电容与外部电路板上的信号传输点连接。本发明还公开了一种功放模块及一种信号收发装置，其针对电路板与连接器内导体的连接方式提出了改进方案，可以消除连接器内导体与电路板的信号传递点之间的相对位置误差，能够保证连接器内导体与腔体滤波器外部电路板的信号传递点之间良好接触。

Description

腔体滤波器、功放模块及信号收发装置
【技术领域】
本发明实施例涉及通信技术领域，特别涉及腔体滤波器中连接器内导体与外部电路板的连接方式，还涉及一种功放模块以及一种信号收发装置。
【背景技术】
腔体滤波器作为一种频率选择装置被广泛应用于通信领域，由于腔体滤波器对信号传递的特殊要求，其各组件之间以及与外部连接件之间相互连接的精准度要求较高。
请参见图1，图1显示了现有技术中一种腔体滤波器的局部截面示意图，其中还显示了部分与腔体滤波器连接的外部电路板。
如图1所示，该腔体滤波器包括腔体100、盖板110、连接器外导体120以及连接器内导体130。
简单而言，盖板110封盖腔体100。连接器外导体120与盖板110相连接，连接器内导体130设于连接器外导体120内，且连接器内导体130穿过盖板110，与腔体滤波器外部电路板150的信号传递点连接，一般情况下，连接器外导体120和连接器内导体130采用同轴设计，构成信号传递的结构。连接器外导体120进一步设有导电隔离胶124，用于防止信号泄露。
在对现有技术的研究和实践过程中，本发明的发明人发现，上述现有技术中：内导体130与电路板150由于制造和装置误差，当内导体130的高度低于装配基准面时，通常会存在间隙h，内导体与电路板连接后会使电路板产生变形，而当内导体130的高度高于装配基准面时，则可能将电路板150顶起同样会使电路板150产生变形，不能够保证连接器内导体130与腔体滤波器外部电路板150的信号传递点之间的良好接触。
【发明内容】
为了解决现有技术中内导体与电路板连接时导致电路板变形的缺陷，本发明提供了一种腔体滤波器、功放模块及信号收发装置，可以很好的解决现有技术中存在的问题。
本发明提供一种腔体滤波器，包括腔体、盖板以及设于所述腔体内的连接器内导体，所述连接器内导体穿过所述盖板与外部电路板连接，所述连接器内导体包括第一内导体和第二内导体，所述第一内导体与所述外部电路板上的信号传输点连接，所述第二内导体与腔体内的内部信号传输点连接，所述第一内导体和所述第二内导体间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述外部电路板上的信号传输点连接。
本发明提供一种腔体滤波器，包括腔体、盖板以及设于所述腔体内的连接器内导体，所述连接器内导体穿过所述腔体与外部电路板连接，所述连接器内导体包括第一内导体和第二内导体，所述第一内导体与所述外部电路板上的信号传输点连接，所述第二内导体与腔体内的内部信号传输点连接，所述第一内导体和所述第二内导体间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述外部电路板上的信号传输点连接。
本发明还提供一种功放模块，包括腔体滤波器和功放板，所述腔体滤波器包括腔体、盖板以及设于所述腔体内的连接器内导体，所述连接器内导体穿过所述盖板与功放板连接，所述连接器内导体包括第一内导体和第二内导体，所述第一内导体与所述功放板上的信号传输点连接，所述第二内导体与腔体内的内部信号传输点连接，所述第一内导体和所述第二内导体间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述功放板上的信号传输点连接。
本发明还提供一种信号收发装置，包括上述的腔体滤波器，与接收天线相连接，并对接收信号进行滤波；射频低噪声放大器，与所述腔体滤波器的信号输出端连接；环行器，与所述低噪声放大器的信号输出端连接；合路器，与所述环行器连接；射频功率放大器，输入端与所述合路器的信号输出端相连接，输出端与所述腔体滤波器连接；发射天线，接收所述腔体滤波器的输出信号并将信号发射。
本发明采用在连接器内导体上增加结构电容的结构，在连接器内导体和电路板进行对接时，通过结构电容部分的伸缩，对连接器内导体和电路板高度差的弥补，避免了现有技术中，通过电路板的弹性弥补误差导致的装配时，损坏电路板的问题，并且拆卸方便，使得产品的加工成本显著降低，因本发明腔体滤波器是用于对高频信号进行过滤，因此在连接器传输高频信号时，增加结构电容不但不会影响信号传输，同时通过调整结构电容的电容值，还可以对信号进行一级滤波优化。
本发明实施例提供的腔体滤波器、功放模块及信号收发装置针对电路板与连接器内导体的连接方式提出了改进方案，可以消除连接器内导体与电路板的信号传递点之间的相对位置误差，能够保证连接器内导体与腔体滤波器外部电路板的信号传递点之间良好接触。本发明将连接器内导体分成连接器第一内导体和第二内导体，第一内导体和第二内导体之间通过间隙形成结构电容，大大提高了腔体滤波器中连接器内导体与电路板的连接可靠性，不易损坏电路板，并且能够保证信号良好传递。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中一种腔体滤波器与电路板连接的局部截面剖视图；
图2为本发明实施例中的一种腔体滤波器与电路板连接的局部截面剖视图；
图3为本发明实施例中的另一种腔体滤波器与电路板连接的局部截面剖视图；
图4为本发明实施例中的再一种腔体滤波器与电路板连接的局部截面剖视图；
图5为现有技术中信号从电路板通过内导体传输到腔体的频率-时延图；
图6为本发明实施例信号从电路板通过内导体传输到腔体的频率-时延图；
图7为本发明实施例四信号收发装置结构框图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例一、
一种腔体滤波器，如图2所示，包括腔体200、盖板210以及设于所述腔体200内的连接器内导体230，所述连接器内导体230穿过所述盖板210与外部电路板250连接，所述连接器内导体230包括第一内导体2301和第二内导体2302，所述第一内导体2301与所述外部电路板250上的信号传输点连接，所述第二内导体2302与腔体200内的内部信号传输点连接，所述第一内导体2301和所述第二内导体2302间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述外部电路板250上的信号传输点连接。
所述盖板210封盖腔体200。连接器外导体220与盖板210相连接，连接器内导体230设于连接器外导体220内，且连接器内导体230穿过盖板110，与腔体滤波器外部电路板250连接，连接器外导体220和连接器内导体230采用同轴设计，构成信号传递的结构。连接器外导体220进一步设有导电隔离胶224，用于防止信号泄露。
所述第一内导体2301和所述第二内导体2302间隙配合，可以使第一内导体2301和第二内导体2302之间形成结构电容，进一步使腔体200和电路板250通过电容耦合的方式来传输信号。
所述腔体200内的内部信号传输点可以设置在腔体200上或腔体200内的谐振杆上，所述第二内导体2302连接在腔体200上或者连接在谐振杆上。
在本实施方式中，所述第二内导体2302设有空腔，所述第二内导体2302固定在腔体200上，所述第一内导体2301插入第二内导体2302的空腔内，所述第一内导体2301和所述第二内导体2302间隙配合。其中，所述第二内导体2302可与腔体200一体成型，所述第一内导体2301插入第二内导体2302的空腔内，所述第一内导体2301和所述第二内导体2302间隙配合。通过采用第二内导体2302与腔体200一体成型，可以使第二内导体2302和腔体200很好的连接在一起，并且使制作工艺更加简单方便。
本领域技术人员容易想到，在其他实施方式中，可在所述第一内导体2301开设空腔，使所述第二内导体2302插入第一内导体2301的空腔内，所述第一内导体2301和所述第二内导体2302间隙配合，所述第一内导体2301和所述第二内导体2302间隙配合。
所述第二内导体2302还可以连接在谐振杆上，用于使电路板250和谐振杆之间传输信号。
所述第一内导体2301与所述外部电路板250可通过螺栓260连接在一起。
如图3所示，所述第一内导体2301与所述外部电路板250还可以通过焊接方式进行连接。
如图4所示，所述第一内导体2301与所述外部电路板250还可以通过螺母270进行连接。
当所述第一内导体2301与所述外部电路板250通过螺栓260或螺母270进行连接时，连接器内导体230的结构电容部分的最大压缩高度低于电路板250的安装高度，在电容值允许（满足信号传输要求和滤波要求）的情况下，连接器内导体230的结构电容的最大伸展高度可以满足连接要求。
具体的结构电容的设计的电容值设计本领域技术人员根据实际情况的参数设计要求，进行优化和调整，达到即满足本发明容差要求同时，获得最好的滤波优化。
本发明实施例将原有技术方案中的硬连接内导体分拆成第一内导体2301和第二内导体2302，首先将第二内导体2302装配在腔体200上，然后装配第一内导体2301，将第一内导体2301与电路板250通过螺钉、螺母或焊接连接，由于第一内导体2301和第二内导2302体采用间隙配合，所以第一内导体2301和第二内导体2302在轴向方向可以有小范围的相对移动，通过这小范围的移动来消除第一内导体2301与电路板250之间的间隙或过盈，同时，第一内导体2301和第二内导体2302之间形成电容，信号的传递通过电容耦合的方式传递。
本发明实施例提供的腔体滤波器针对电路板250与连接器内导体230的连接方式提出了改进方案，可以消除连接器内导体230与电路板250的信号传递点之间的相对位置误差，能够保证连接器内导体230与腔体滤波器外部电路板250的信号传递点之间良好接触。本发明将连接器内导体230分成连接器第一内导体2301和第二内导体2302，第一内导体2301和第二内导体2302之间通过间隙形成结构电容，大大提高了腔体滤波器中连接器内导体230与电路板250的连接可靠性，不易损坏电路板250，并且能够保证信号良好传递。
进一步的，所述第一内导体2301和所述第二内导体2302之间设有绝缘介质2303，所述第一内导体2301、第二内导体2302和所述绝缘介质2303形成结构电容。所述绝缘介质2303位于第一内导体2301或第二内导体2302上，所述绝缘介质2303可以通过机加、注塑或表面喷涂等方式设置在第一内导体2301或第二内导体2302上。所述绝缘介质2303可以为任何绝缘材料，优选为PTFE (聚四氟乙烯)材料。
电路板250上设有末级输出电容，所述第一内导体2301和第二内导体2302之间形成的结构电容可以代替电路板250上的末级输出电容，所述第一内导体2301和第二内导体2302之间形成的结构电容可以根据频率的大小进行调整，比如改变第一内导体2301和第二内导体2302的长度、大小或厚度，或者改变绝缘介质2303的材料等。
下面根据具体的仿真实验来说明将内导体230分成第一内导体2301和第二内导体2302形成结构电容的结构对信号传输的影响。
如图5所示，为现有技术中信号从电路板通过内导体传输到腔体的频率-时延图，从图中可知，横轴为频率值，纵轴为时延时间，当频率值为2.59GHZ时，时延值最大为11.22ns。
如图6所示，为本发明实施例信号从电路板250通过第一内导体2301、结构电容和第二内导体2302传输到腔体的频率-时延图，从图中可知，横轴为频率值，纵轴为时延时间，当频率值为2.59GHZ时，时延值最大为11.66ns。
从上述仿真实验结果可知，本发明实施例与现有技术的时延值的差距为0.44ns，而在滤波器的信号传输中，通过内导体230的信号时延值在1ns之内可以忽略不计，对腔体200内的信号传输没有影响。
本发明实施例将内导体分成第一内导体2301和第二内导体2302，并在所述第一内导体2301和所述第二内导2302体之间设有绝缘介质2303，使所述第一内导体2301、第二内导体2302和所述绝缘介质2303形成结构电容，消除连接器内导体230与电路板250的信号传递点之间的相对位置误差，能够保证连接器内导体230与腔体滤波器外部电路板250的信号传递点之间良好接触，并且可以替代原有电路板上的末级输出电容，减少的电路板的制作成本，同时并不影响信号的传输效果。
本实施例中的腔体滤波器可以为双工器、合路器、塔顶放大器等选频设备。
实施例二、
一种腔体滤波器，包括腔体、盖板以及设于所述腔体内的连接器内导体，所述连接器内导体穿过所述腔体与外部电路板连接，所述连接器内导体包括第一内导体和第二内导体，所述第一内导体与所述外部电路板上的信号传输点连接，所述第一内导体与所述外部电路板可通过铆接、压接、套接、焊接或螺纹联接方式进行连接。所述第二内导体与腔体内的内部信号传输点连接，所述第一内导体和所述第二内导体间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述外部电路板上的信号传输点连接。
所述第一内导体和所述第二内导体间隙配合，可以使第一内导体和第二内导体之间形成结构电容，进一步使腔体和功放板通过电容耦合的方式来传输信号。
所述腔体采用倒置的形式，盖板位于腔体的下方，腔体底部设有供内导体穿过的孔，所述腔体内部内部信号传输点可以设置在腔体上或腔体内的谐振杆上或者盖板上，所述第二内导体连接在腔体上或者连接在谐振杆上或者盖板上。
一种实施方式所述第二内导体设有空腔，所述第二内导体固定在腔体上，所述第一内导体插入第二内导体的空腔内，所述第一内导体和所述第二内导体间隙配合。
另一种实施方式所述第二内导体设有空腔，所述第二内导体与腔体一体成型，所述第一内导体插入第二内导体的空腔内，所述第一内导体和所述第二内导体间隙配合。通过采用第二内导体与腔体一体成型，可以使第二内导体和腔体很好的连接在一起，并且使制作工艺更加简单方便。
再一种实施方式所述第一内导体设有空腔，所述第二内导体插入第一内导体的空腔内，所述第一内导体和所述第二内导体间隙配合，所述第一内导体和所述第二内导体间隙配合。
所述第二内导体还可以连接在谐振杆上，用于使功放板和谐振杆之间传输信号。
进一步的，所述第一内导体和所述第二内导体之间的间隙内设有绝缘介质，所述第一内导体、第二内导体和所述绝缘介质形成结构电容。所述绝缘介质位于第一内导体或第二内导体上，所述绝缘介质可以通过机加、注塑或表面喷涂等方式设置在第一内导体或第二内导体上。所述绝缘介质可以为任何绝缘材料，优选为PTFE (聚四氟乙烯)材料。
本发明实施例提供的腔体滤波器针对功放板与连接器内导体的连接方式提出了改进方案，可以消除连接器内导体与功放板的信号传递点之间的相对位置误差，能够保证连接器内导体与腔体滤波器外部功放板的信号传递点之间良好接触。本发明将连接器内导体分成连接器第一内导体和第二内导体，第一内导体和第二内导体之间通过间隙形成结构电容，大大提高了腔体滤波器中连接器内导体与功放板的连接可靠性，不易损坏功放板，并且能够保证信号良好传递。实施例三、
一种功放模块，可参考图2，其包括图2所示的腔体滤波器和功放板（可参考图2中所示的电路板250），所述腔体滤波器包括腔体200、盖板210以及设于所述腔体200内的连接器内导体230，所述连接器内导230体穿过所述盖板210与功放板连接，所述连接器内导体230包括第一内导体2301和第二内导体2302，所述第一内导体2301与所述功放板2302上的信号传输点连接，所述第二内导体2302与腔体200内的内部信号传输点连接，所述第一内导体2301和所述第二内导体2302间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述功放板上的信号传输点连接。
所述功放板上设有末级输出电容，所述末级输出电容用于对传输信号进行过滤。
本实施方式中，第一内导体2301和第二内导体2302间隙配合形成结构电容，只用于对进入腔体的信号进行传输，消除连接器内导体与功放板的信号传递点之间的相对位置误差。
在一种实施方式中，所述结构电容可替换所述功放板上的末级输出电容，用于对传输信号进行过滤。通过对第一内导体2301和第二内导体2302设置合适的长度和间距，以及对绝缘介质选取合适的材料如聚四氟乙烯，可以使第一内导体2301和第二内导体2302之间形成的结构电容替换功放板上的原有末级输出电容，即消除连接器内导体与功放板的信号传递点之间的相对位置误差，又减少了功放板的制作成本。
在另一种实施方式中，所述末级输出电容与所述结构电容相互匹配用于对传输信号进行过滤，第一内导体2301和第二内导体2302间隙配合形成结构电容，采用结构电容和功放板上的末级输出电容进行匹配，由于末级输出电容比较昂贵，可以采用价格偏移的电容代替末级输出电容，即消除连接器内导体与功放板的信号传递点之间的相对位置误差，又减少了功放板的制作成本。
实施例四、
一种信号收发装置，如图7所示，包括上述的腔体滤波器1，与接收天线5相连接，并对接收信号进行滤波；射频低噪声放大器2，与所述腔体滤波器1的信号输出端连接；环行器4，与所述低噪声放大器2的信号输出端连接；合路器7，与所述环行器4连接；射频功率放大器3，输入端与所述合路器7的信号输出端相连接，输出端与所述腔体滤波器1连接；发射天线6，接收所述腔体滤波器1的输出信号并将信号发射。
本发明实施例信号收发装置中的腔体滤波器（参考图2）将内导体230分成第一内导体2301和第二内导体2302，并在所述第一内导体2301和所述第二内导2302体之间设有绝缘介质2303，使所述第一内导体2301、第二内导体2302和所述绝缘介质2303形成结构电容，消除连接器内导体230与电路板250的信号传递点之间的相对位置误差，能够保证连接器内导体230与腔体滤波器外部电路板250的信号传递点之间良好接触，并且可以替代原有电路板250上的末级输出电容，减少的电路板250的制作成本，同时并不影响信号的传输效果。
本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (19)

  1. 一种腔体滤波器，其中：包括腔体、盖板以及设于所述腔体内的连接器内导体，所述连接器内导体穿过所述盖板与外部电路板连接，所述连接器内导体包括第一内导体和第二内导体，所述第一内导体与所述外部电路板上的信号传输点连接，所述第二内导体与腔体内的内部信号传输点连接，所述第一内导体和所述第二内导体间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述外部电路板上的信号传输点连接。
  2. 根据权利要求1所述的腔体滤波器，其中：所述第二内导体设有空腔，所述第一内导体插入第二内导体的空腔内或所述第一内导体设有空腔，所述第二内导体插入第一内导体的空腔内。
  3. 根据权利要求1所述的腔体滤波器，其中：所述第二内导体连接在所述腔体上或者连接在谐振杆上。
  4. 根据权利要求1所述的腔体滤波器，其中：所述第二内导体与所述腔体一体成型。
  5. 根据权利要求1所述的腔体滤波器，其中：所述第一内导体和所述第二内导体之间的间隙内设有绝缘介质，所述第一内导体、第二内导体和所述绝缘介质形成结构电容。
  6. 根据权利要求5所述的腔体滤波器，其中：所述绝缘介质为聚四氟乙烯材料。
  7. 根据权利要求1所述的腔体滤波器，其中：所述第一内导体与所述外部电路板通过铆接、压接、套接、焊接或螺纹联接方式进行连接。
  8. 一种腔体滤波器，其中：包括腔体、盖板以及设于所述腔体内的连接器内导体，所述连接器内导体穿过所述腔体与外部电路板连接，所述连接器内导体包括第一内导体和第二内导体，所述第一内导体与所述外部电路板上的信号传输点连接，所述第二内导体与腔体内的内部信号传输点连接，所述第一内导体和所述第二内导体间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述外部电路板上的信号传输点连接。
  9. 根据权利要求8所述的腔体滤波器，其中：所述第二内导体设有空腔，所述第一内导体插入第二内导体的空腔内或所述第一内导体设有空腔，所述第二内导体插入第一内导体的空腔内。
  10. 根据权利要求8所述的腔体滤波器，其中：所述第二内导体连接在所述腔体上或者连接在谐振杆上。
  11. 根据权利要求8所述的腔体滤波器，其中：所述第二内导体与所述腔体一体成型。
  12. 根据权利要求8所述的腔体滤波器，其中：所述第一内导体和所述第二内导体之间的间隙内设有绝缘介质，所述第一内导体、第二内导体和所述绝缘介质形成结构电容。
  13. 根据权利要求12所述的腔体滤波器，其中：所述绝缘介质为聚四氟乙烯材料。
  14. 根据权利要求8所述的腔体滤波器，其中：所述第一内导体与所述外部电路板通过铆接、压接、套接、焊接或螺纹联接方式进行连接。
  15. 一种功放模块，其中：包括腔体滤波器和功放板，所述腔体滤波器包括腔体、盖板以及设于所述腔体内的连接器内导体，所述连接器内导体穿过所述盖板与所述功放板连接，所述连接器内导体包括第一内导体和第二内导体，所述第一内导体与所述功放板上的信号传输点连接，所述第二内导体与腔体内的内部信号传输点连接，所述第一内导体和所述第二内导体间隙配合形成结构电容，所述内部信号传输点通过所述结构电容与所述功放板上的信号传输点连接。
  16. 根据权利要求15所述的功放模块，其中：所述功放板上设有末级输出电容，所述末级输出电容用于对传输信号进行过滤。
  17. 根据权利要求15所述的功放模块，其中：所述结构电容替换所述功放板上的末级输出电容，用于对传输信号进行过滤。
  18. 根据权利要求15所述的功放模块，其中：所述末级输出电容与所述结构电容相互匹配用于对传输信号进行过滤。
  19. 一种信号收发装置，其中：
    包括权利要求1所述的腔体滤波器，与接收天线相连接，并对接收信号进行滤波；
    射频低噪声放大器，与所述腔体滤波器的信号输出端连接；
    环行器，与所述低噪声放大器的信号输出端连接；
    合路器，与所述环行器连接；
    射频功率放大器，输入端与所述合路器的信号输出端相连接，输出端与所述腔体滤波器连接；
    发射天线，接收所述腔体滤波器的输出信号并将信号发射。
PCT/CN2013/072757 2012-03-16 2013-03-15 腔体滤波器、功放模块及信号收发装置 WO2013135206A1 (zh)

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