WO2013127176A1 - 用于固定电子元件的绝缘结构、电子元件和组件 - Google Patents
用于固定电子元件的绝缘结构、电子元件和组件 Download PDFInfo
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- WO2013127176A1 WO2013127176A1 PCT/CN2012/082385 CN2012082385W WO2013127176A1 WO 2013127176 A1 WO2013127176 A1 WO 2013127176A1 CN 2012082385 W CN2012082385 W CN 2012082385W WO 2013127176 A1 WO2013127176 A1 WO 2013127176A1
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- insulating member
- electronic component
- mounting hole
- thin portion
- insulating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
Definitions
- Insulation structure Insulation structure, electronic component and component for fixing electronic components.
- This application is filed on February 27, 2012, the Chinese Patent Office, Application No. 201210047414.0, entitled “Insulation Structure, Electronic Components and Components for Fixing Electronic Components” The priority of the Chinese Patent Application, the entire contents of which is incorporated herein by reference.
- the present invention relates to the field of electronic circuits, and more particularly to an assembly for an insulating structure, an electronic component, and an electronic component for fixing electronic components.
- MOS Metal Oxide Semiconductor
- the MOS tube 20 is fixed to the circuit board by screws 30, and the heat dissipation insulating pad 40 and the heat dissipation plate 50 are laid on the circuit board.
- the screw 30 is separated from the MOS tube 20 by the insulating structure 1 1 .
- the length of the broken line A is the insulation distance between the MOS tube 20 and the screw 30.
- the insulation distance is short, the insulation strength is not enough, and short-circuit ignition is likely to occur, which damages the circuit board.
- the technical problem to be solved by the present invention is to provide an assembly for an insulating structure, an electronic component, and an electronic component for fixing an electronic component.
- the insulation distance can be increased, and the withstand voltage level can be achieved. Strengthen the requirements of insulation.
- An insulating structure for fixing an electronic component wherein the electronic component is provided with a mounting hole, and the mounting hole is used for inserting the mounting screw, and the method comprises: a hollow first insulating member, the first insulating member including a thick portion of the upper portion and a thin portion of the lower portion, an outer diameter of the thick portion being larger than an outer diameter of the thin portion, an inner diameter of the thick portion, and an inner diameter of the thin portion Equally, an outer diameter dimension of the thin portion of the first insulating member is satisfied, and an outer surface of the thin portion is attached to a mounting hole of the electronic component when the thin portion passes through the mounting hole of the electronic component;
- a second insulating member that is annular, the second insulating member is disposed in a mounting hole to be mounted on the heat dissipation plate, and the mounting screw passes through the hollow first insulating member, the detail of the first insulating member Passing through the mounting hole of the electronic component and the second insulating member, the second insulating member is overlaid on the detail of the first insulating member, and the inner surface of the second insulating member is in close contact with the first The outer surface of the detail of an insulating member.
- the embodiment of the present invention further provides an electronic component provided with an insulating structure, the electronic component is provided with a mounting hole, and the mounting hole is used for inserting a mounting screw, and the insulating structure comprises:
- the first insulating member including a thick portion of the upper portion and a thin portion of the lower portion, an outer diameter of the thick portion being larger than an outer diameter of the thin portion, an inner diameter of the thick portion, and an inner diameter of the thin portion Equally, an outer diameter dimension of the thin portion of the first insulating member is satisfied, and an outer surface of the thin portion is attached to a mounting hole of the electronic component when the thin portion passes through the mounting hole of the electronic component;
- a second insulating member that is annular, the second insulating member is disposed in a mounting hole to be mounted on the heat dissipation plate, and the mounting screw passes through the hollow first insulating member, the detail of the first insulating member Passing the mounting hole of the electronic component and the second insulating member to fix the electronic component on the heat dissipation plate, and the second insulating member is sheathed to the detail of the first insulating member An inner surface of the second insulating member abuts against an outer surface of the detail of the first insulating member.
- An embodiment of the present invention further provides an electronic component assembly, including: an electronic component, an insulating structure for fixing the electronic component, and a circuit board, wherein the electronic component is provided with a mounting hole, and the mounting hole is used for inserting
- the mounting screw fixes the electronic component on the circuit board, and the circuit board is provided with a heat dissipation plate
- the insulation structure comprises: a hollow first insulating member, the first insulating member including a thick portion of the upper portion and a thin portion of the lower portion, an outer diameter of the thick portion being larger than an outer diameter of the thin portion, an inner diameter of the thick portion, and an inner diameter of the thin portion Equally, an outer diameter dimension of the thin portion of the first insulating member is satisfied, and an outer surface of the thin portion is attached to a mounting hole of the electronic component when the thin portion passes through the mounting hole of the electronic component;
- a second insulating member that is annular, the second insulating member is disposed in a mounting hole to be mounted on the heat dissipation plate, and the mounting screw passes through the hollow first insulating member, the detail of the first insulating member Passing through the mounting hole of the electronic component and the second insulating member, the second insulating member is overlaid on the detail of the first insulating member, and the inner surface of the second insulating member is in close contact with The outer surface of the detail of the first insulating member.
- Embodiments of the present invention provide an assembly for an insulating structure, an electronic component, and an electronic component for fixing an electronic component.
- a second insulating member that is jacketed on the first insulating member is added for fixing the electronic component.
- the thickness of the insulating wall increases, and the degree of insulation increases, so that the withstand voltage level meets the requirements for reinforced insulation.
- FIG. 1 is a schematic view of a prior art insulating structure for fixing a MO S tube
- FIG. 2 is a schematic view 1 of an insulating structure in an embodiment of the present invention
- FIG. 3 is a schematic view of an insulating structure for fixing a MOS tube according to an embodiment of the present invention
- FIG. 4 is a partial enlarged view of FIG. 3;
- FIG. 5 is a second schematic view of an insulation structure according to an embodiment of the present invention.
- FIG. 6 is a schematic structural view of a first insulating member in an embodiment of the present invention.
- Embodiments of the present invention provide an assembly for an insulating structure, an electronic component, and an electronic component for fixing an electronic component, which can extend the insulation distance, increase the degree of insulation, and achieve the pressure resistance level to meet the requirements of reinforced insulation.
- Embodiments of the present invention provide an insulation structure of an electronic component. As shown in FIG. 2, the insulation structure includes:
- the hollow first insulating member 12 includes a thick portion 121 of the upper portion and a thin portion 122 of the lower portion.
- the outer diameter of the thick portion 121 is larger than the outer diameter of the thin portion 122, and the inner diameter of the thick portion 121 and the inner diameter of the thin portion 122 are equal.
- the first insulating member The outer diameter of the detail 122 of the 12 is such that when the detail 122 passes through the mounting hole of the electronic component, the outer surface of the detail 122 is attached to the mounting hole of the electronic component;
- An annular second insulating member 13 disposed in a mounting hole to be mounted on the heat radiating plate, the mounting screw passing through the hollow first insulating member 12, and the detail 122 of the first insulating member 12 passing through the electronic component
- the mounting hole and the second insulating member 13, the second insulating member 13 is sheathed to the detail 122 of the first insulating member 12, and the inner surface of the second insulating member 13 abuts against the outer surface of the detail 122 of the first insulating member 12.
- a mounting hole is first provided on the heat dissipation plate and the circuit board, and the size is equivalent to the outer diameter of the second insulating member 13, and then The second insulating member 13 is mounted in the mounting hole on the heat dissipation plate 50; the mounting screw 30 is sleeved on the first insulating member 12, passes through the mounting hole on the mounting surface of the electronic component (MOS tube 20), and then passes through the heat dissipation plate.
- the outer diameter of the second insulating member 13 is related to the size of the mounting hole of the circuit board and the heat dissipating plate thereon, and can be uniformly designed according to needs in practical applications.
- This embodiment extends the insulation distance by adding the second insulating member 13 and increases The degree of insulation is such that the withstand voltage level meets the requirements for reinforced insulation.
- the screw 30 passes through the first insulating member 12 and the second insulating member 13, and the MOS tube 20 is fixed, and the MOS tube 20 is separated from the heat radiating plate 50 by the heat insulating insulating pad 40. As shown in FIG. 3, the screw 30 passes through the first insulating member 12 and the second insulating member 13, and the MOS tube 20 is fixed, and the MOS tube 20 is separated from the heat radiating plate 50 by the heat insulating insulating pad 40. As shown in FIG.
- the newly added second insulating member 13 is jacketed on the detail of the first insulating member 12, and after installation, it is ensured that the inner surface of the second insulating member 13 abuts against the outer surface of the detail of the first insulating member 12. Therefore, the gap cannot be left.
- the insulation structure of the embodiment is designed for the convenience of installation, a split double layer design is adopted, but after installation, the second insulating member 13 is in close contact with the first insulating member 12, and the integral molding is achieved.
- the insulation distance between the MOS tube 20 and the screw 30 is the length of the broken line B in the figure, so the insulation distance in this embodiment is more than 2 times higher than the prior art, and the withstand voltage level reaches the reinforced insulation. Requirements.
- the insulation distance in the prior art is the length of the fold line A.
- the inner surface of the second insulating member 13 abuts against the outer surface of the detail of the first insulating member 12, so as to prevent entry of dust particles or other particles along the gap between the MO S tube and the first insulating member 12.
- the position shown by the broken line B reduces the degree of insulation of the MOS tube.
- the embedded first insulating member and the outer second insulating member adopt a split double layer design, when used for fixing electronic components, the mounting is convenient.
- the material of the second insulating member is an insulating rubber.
- the second insulating member is to be jacketed on the thin portion of the first insulating member, and the second insulating member is to be in close contact with the thin portion of the first insulating member, so the second insulating member is the most on the basis of ensuring insulation.
- a flexible insulation material such as insulating rubber.
- the inner diameter of the second insulating member is equal to the outer diameter of the thin portion, and the second insulating member that is sleeved on the detail of the first insulating member can also be closely attached to the first insulating member.
- the outer surface of the detail so that the insulation distance can become the fold line B, the insulation distance increases, and the withstand voltage increases.
- the height H2 of the second insulating member 13 is greater than or equal to the height H I of the thin portion 122.
- the height H2 of the second insulating member 13 is larger than the height H I of the thin portion 122, and the length of the broken line B, that is, the more the insulating distance is increased.
- the outer edge of the end portion 122 of the first insulating member 12 is inclined inwardly, so that the thin portion of the first insulating member can be sharpened to facilitate the sheathing in the second insulating member.
- the thin portion 122 of the first insulating member 12 is inserted into the second insulating member 13, and in order to ensure that the second insulating member 13 sleeved on the thin portion 122 can be closely attached thereto
- the outer surface of the thin portion 122, the outer diameter of the thin portion 122 and the inner diameter of the second insulating member are not too different, which makes the mounting difficult, so the detail of the first insulating member in the embodiment is designed to be sharpened. Easy to install.
- a fixed MOS transistor is taken as an example, but it can be seen that the actual application is not limited thereto.
- the insulating structure in the embodiment of the present invention is used for fixing electronic components. Since the second insulating member is added on the basis of the original first insulating member, the insulation distance between the electronic component and the screw or other grounding structural component is increased, and the dielectric strength is enhanced.
- the device or device using the insulating structure in the embodiment of the present invention is used to avoid short-circuit sparking, and the reliability is improved. Moreover, as the insulation distance increases, the withstand voltage level meets the requirements for reinforced insulation, and the degree of protection of the device or device package can be correspondingly reduced, resulting in a decrease in overall cost.
- the protection level of the device or device package can be reduced to IP3 or
- the embodiment of the invention further provides an electronic component, wherein the electronic component is provided with a mounting hole, the mounting hole is used for inserting the mounting screw, and the electronic component is provided with an insulating structure, and the insulating structure comprises:
- the hollow first insulating member includes a thick portion of the upper portion and a thin portion of the lower portion, the outer diameter of the thick portion is larger than the outer diameter of the thin portion, the inner diameter of the thick portion and the inner diameter of the thin portion are equal, and the outer diameter of the thin portion of the first insulating member is satisfied.
- a ring-shaped second insulating member disposed in a mounting hole to be mounted on the heat dissipation plate, the mounting screw passing through the hollow first insulating member, the thin portion of the first insulating member passing through the mounting hole of the electronic component, and the second
- the insulating member fixes the electronic component on the heat dissipation plate, the second insulating member is jacketed on the thin portion of the first insulating member, and the inner surface of the second insulating member is in close contact with the outer surface of the detail of the first insulating member.
- the inner diameter of the second insulating member is equal to the outer diameter of the thin portion.
- the height of the second insulating member is greater than or equal to the height of the detail.
- the outer edge of the end of the detail is inclined inwardly.
- the material of the second insulating member is an insulating rubber.
- the second insulating member is added, so the insulation distance between the electronic component and the screw or other grounded structural component is increased, and the dielectric strength is enhanced to avoid
- the short-circuit sparking phenomenon using the device or device of the electronic component in the embodiment of the present invention, improves the reliability.
- the withstand voltage level meets the requirements for reinforced insulation, and the degree of protection of the device or device package can be correspondingly reduced, resulting in a decrease in overall cost.
- An embodiment of the present invention further provides an electronic component assembly, including: an electronic component, an insulating structure for fixing the electronic component, and a circuit board, wherein the electronic component is provided with a mounting hole, and the mounting hole is used for inserting
- the mounting screw fixes the electronic component on the circuit board, and the circuit board is provided with a heat dissipation plate, and the insulation structure comprises:
- the first insulating member including a thick portion of the upper portion and a thin portion of the lower portion, an outer diameter of the thick portion being larger than an outer diameter of the thin portion, an inner diameter of the thick portion, and an inner diameter of the thin portion Equally, an outer diameter dimension of the thin portion of the first insulating member is satisfied, and an outer surface of the thin portion is attached to a mounting hole of the electronic component when the thin portion passes through the mounting hole of the electronic component;
- a second insulating member that is annular, the second insulating member is disposed in a mounting hole to be mounted on the heat dissipation plate, and the mounting screw passes through the hollow first insulating member, the detail of the first insulating member Passing through the mounting hole of the electronic component and the second insulating member, the second insulating member is overlaid on the detail of the first insulating member, and And an inner surface of the second insulating member abuts against an outer surface of the detail of the first insulating member.
- the electronic component used in the embodiment of the electronic device can increase the insulation distance, enhance the insulation strength, and avoid short-circuit and sparking, thereby improving the reliability of the electronic device, and the protection level of the device package can be correspondingly reduced, and the overall cost. decline.
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Abstract
一种用于固定电子元件的绝缘机构、电子元件和组件，可延长绝缘距离、增加绝缘程度，使耐压等级达到绝缘的要求。所述绝缘机构，包括中空的第一绝缘构件（12），包括上段的粗部（121）和下段的细部（122），粗部（121）的外径大于细部（122）的外径，内径与细部（122）的内径相等，细部（122）的外径尺寸满足穿过电子元件安装孔时，细部（122）外表面与安装孔贴合；呈环状的第二绝缘构件（13），设置在散热板（50）上待安装的安装孔内，安装螺钉（30）穿过第一绝缘构件（12），第一绝缘构件（12）的细部（122）穿过电子元件的安装孔和第二绝缘构件（13），第二绝缘构件（13）外套于第一绝缘构件（12）的细部（122），且第二绝缘构件（13）的内表面紧贴在第一绝缘构件（12）的细部（122）外表面。所述绝缘机构用于固定电子元件，改善电子元件的绝缘效果。
Description
用于固定电子元件的绝缘结构、 电子元件和组件 本申请要求于 2012 年 2 月 27 日提交中国专利局、 申请号为 201210047414.0、 发明名称为"用于固定电子元件的绝缘结构、 电子 元件和组件"的中国专利申请的优先权， 其全部内容通过引用结合在 本申请中。
技术领域
本发明涉及电子电路领域， 尤其涉及一种用于固定电子元件的 绝缘结构、 电子元件和电子元器件的组件。
背景技术
场效应晶体管（Metal Oxide Semiconductor , MOS)是一种现代工 业设计中常用的电子元件， 在数字逻辑电路中主要用于实现开关逻 辑， 即逻辑上的 0或 1。 在实际应用中， 通常需要通过螺钉将 MOS 管进行固定， 这时， MOS管必须与螺钉绝缘。
如图 1 所示， 现有技术中， 通过螺钉 30将 MOS管 20 固定电路 板上， 而电路板上铺设有散热绝缘垫 40及散热板 50。 螺钉 30通过 绝缘结构 1 1 与 MOS 管 20 隔开， 图中折线 A 的长度为 MOS 管 20 与螺钉 30的绝缘距离， 使用这种绝缘结构， 其耐压等级可达到一般 绝缘的要求。
在上述结构中至少存在如下问题：
绝缘距离短， 绝缘强度不够， 容易发生短路打火现象， 损坏电 路板。
发明内容
本发明所要解决的技术问题在于提供一种用于固定电子元件的 绝缘结构、 电子元件和电子元器件的组件， 使用本发明提供的绝缘 结构固定电子元件， 可增加绝缘距离， 使耐压等级达到加强绝缘的 要求。
为达到上述目 的， 本发明的实施例采用如下技术方案：
一种用于固定电子元件的绝缘结构， 所述电子元件上设置有安 装孔， 所述安装孔用于插入安装螺钉， 包括：
中空的第一绝缘构件， 所述第一绝缘构件包括上段的粗部和下 段的细部， 所述粗部的外径大于所述细部的外径， 所述粗部的内径 和所述细部的内径相等， 所述第一绝缘构件的所述细部的外径尺寸 满足， 在所述细部穿过所述电子元件的安装孔时， 所述细部的外表 面与所述电子元件的安装孔贴合；
呈环状的第二绝缘构件， 所述第二绝缘构件设置在散热板上待 安装的安装孔内， 安装螺钉穿过所述中空的第一绝缘构件， 所述第 一绝缘构件的所述细部穿过所述电子元件的安装孔和所述第二绝缘 构件， 所述第二绝缘构件外套于所述第一绝缘构件的细部， 并且所 述第二绝缘构件的内表面紧贴在所述第一绝缘构件的细部的外表 面。
本发明实施例还提供一种设置有绝缘结构的电子元件， 所述电 子元件上设置有安装孔， 所述安装孔用于插入安装螺钉， 所述绝缘 结构包括：
中空的第一绝缘构件， 所述第一绝缘构件包括上段的粗部和下 段的细部， 所述粗部的外径大于所述细部的外径， 所述粗部的内径 和所述细部的内径相等， 所述第一绝缘构件的所述细部的外径尺寸 满足， 在所述细部穿过所述电子元件的安装孔时， 所述细部的外表 面与所述电子元件的安装孔贴合；
呈环状的第二绝缘构件， 所述第二绝缘构件设置在散热板上待 安装的安装孔内， 安装螺钉穿过所述中空的第一绝缘构件， 所述第 一绝缘构件的所述细部穿过所述电子元件的安装孔和所述第二绝缘 构件， 将所述电子元件固定在所述散热板上， 所述第二绝缘构件外 套于所述第一绝缘构件的所述细部， 所述第二绝缘构件的内表面紧 贴在所述第一绝缘构件的所述细部的外表面。
本发明实施例还提供一种电子元器件的组件， 包括： 电子元件、 用于固定所述电子元件的绝缘结构和电路板， 所述电子元件上设置 有安装孔， 所述安装孔用于插入安装螺钉将所述电子元件固定在所 述电路板， 所述电路板上设置有散热板， 所述绝缘结构包括：
中空的第一绝缘构件， 所述第一绝缘构件包括上段的粗部和下 段的细部， 所述粗部的外径大于所述细部的外径， 所述粗部的内径 和所述细部的内径相等， 所述第一绝缘构件的所述细部的外径尺寸 满足， 在所述细部穿过所述电子元件的安装孔时， 所述细部的外表 面与所述电子元件的安装孔贴合；
呈环状的第二绝缘构件， 所述第二绝缘构件设置在散热板上待 安装的安装孔内， 安装螺钉穿过所述中空的第一绝缘构件， 所述第 一绝缘构件的所述细部穿过所述电子元件的安装孔和所述第二绝缘 构件， 所述第二绝缘构件外套于所述第一绝缘构件的所述细部， 并 且所述第二绝缘构件的内表面紧贴在所述第一绝缘构件的所述细部 的夕卜表面。
本发明实施例提供一种用于固定电子元件的绝缘结构、 电子元 件和电子元器件的组件， 相比现有技术， 新增了外套于第一绝缘构 件的第二绝缘构件， 用于固定电子元件时， 绝缘壁厚度增加， 绝缘 程度增加， 使耐压等级达到加强绝缘的要求。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下 面将对实施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面描述中的附图仅仅是本发明的一些实施例， 对于 本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以 根据这些附图获得其他的附图。
图 1 为现有技术的绝缘结构用于固定 MO S管的示意图； 图 2为本发明实施例中的绝缘结构的示意图一；
图 3为本发明实施例中的绝缘结构用于固定 MOS管的示意图； 图 4为图 3的局部放大图；
图 5为本发明实施例中的绝缘结构的示意图二；
图 6为本发明实施例中的第一绝缘构件的结构示意图。
附图标记说明
1 1 -绝缘结构， 12-第一绝缘构件， 121 -第一绝缘构件的粗部，
122-第一绝缘构件的细部， 13 -第二绝缘构件， 20-MO S管， 30-螺钉， 40-散热绝缘垫， 50-散热板。
具体实施方式
本发明实施例提供一种用于固定电子元件的绝缘结构、 电子元 件和电子元器件的组件， 可延长绝缘距离， 增加绝缘程度， 使耐压 等级达到加强绝缘的要求。
下面结合附图对本发明实施例进行详细描述。 此处所描述的具 体实施方式仅仅用以解释本发明， 并不用于限定本发明。
实施例
本发明实施例提供一种电子元件的绝缘结构， 如图 2所示， 该 绝缘结构包括：
中空的第一绝缘构件 12 , 包括上段的粗部 121 和下段的细部 122 , 粗部 121 的外径大于细部 122的夕卜径， 粗部 121 的内径和细部 122的内径相等， 第一绝缘构件 12的细部 122的外径尺寸满足， 在 细部 122 穿过电子元件的安装孔时， 细部 122 的外表面与电子元件 的安装孔贴合；
环状的第二绝缘构件 13 , 第二绝缘构件 13 设置在散热板上待 安装的安装孔内， 安装螺钉穿过中空的第一绝缘构件 12 , 第一绝缘 构件 12 的细部 122 穿过电子元件的安装孔和第二绝缘构件 13 , 第 二绝缘构件 13 外套于第一绝缘构件 12 的细部 122 , 并且第二绝缘 构件 13 的内表面紧贴在第一绝缘构件 12的细部 122的外表面。
如图 3所示， 本实施例中的绝缘结构用于固定电子元件 （ MOS 管 20 ) 时， 先在散热板及电路板上设置安装孔， 尺寸与第二绝缘构 件 13的外径相当， 再将第二绝缘构件 13安装在散热板 50上的安装 孔内； 安装螺钉 30 穿套上第一绝缘构件 12 , 穿过电子元件 （ MOS 管 20 ) 安装脚上的安装孔， 再穿过散热板 50 上安装孔内的第二绝 缘构件 13 , 将 MOS管 20 固定在散热板 50上， 第二绝缘构件 13外 套于第一绝缘构件 12 的细部 121 , 并且第二绝缘构件 13 的内表面 紧贴在第一绝缘构件 12的细部 121 的外表面。
第二绝缘构件 13 的外径大小与电路板及其上的散热板上的安 装孔的大小有关， 实际应用中可根据需要进行统一的设计。
用于固定电子元件如 MOS管时，由于电子元件安装孔的尺寸固 定， 难以通过增加绝缘结构 1 1 的厚度来增加绝缘距离， 本实施例通 过增加第二绝缘构件 13 , 延长了绝缘距离， 增加了绝缘程度， 使耐 压等级达到加强绝缘的要求。 如图 3所示， 螺钉 30穿过第一绝缘构 件 12及第二绝缘构件 13 , 将 MOS管 20 固定， MOS管 20通过散热 绝缘垫 40与散热板 50 隔开。 如图 4所示， 新增加的第二绝缘构件 13 外套在第一绝缘构件 12 的细部， 并且安装后要保证第二绝缘构 件 13 的内表面紧贴在第一绝缘构件 12 的细部的外表面， 不能留有 空隙， 这样， 虽然本实施例的绝缘结构为了安装方便， 采用了分体 双层设计， 但安装后第二绝缘构件 13 紧贴在第一绝缘构件 12上， 达到了与整体成型同样的绝缘效果， MOS管 20与螺钉 30之间的绝 缘距离为图中折线 B 的长度， 所以本实施例中的绝缘距离， 比现有 技术增加了 2 倍以上， 耐压等级达到了加强绝缘的要求。 现有技术 中的绝缘距离为折线 A的长度。
同时， 第二绝缘构件 13 的内表面紧贴在第一绝缘构件 12的细 部的外表面，这样亦可防止因灰尘颗粒或其它微粒沿 MO S管与第一 绝缘构件 12之间的空隙， 进入折线 B所示的地方而使得 MOS管的 绝缘程度降低。
本发明实施例提供的绝缘结构， 由于内嵌的第一绝缘构件和外 套的第二绝缘构件采用了分体双层设计， 用于固定电子元件时， 安 装方便。
其中， 第二绝缘构件的材质为绝缘橡胶。 本实施例中， 第二绝 缘构件要外套在第一绝缘构件的细部， 并且要保证第二绝缘构件紧 贴在第一绝缘构件的细部， 所以第二绝缘构件在保证绝缘性的基础 上， 最好选择有弹性的绝缘材料， 比如绝缘橡胶等。
进一步， 第二绝缘构件的内径等于细部的外径， 同样是为了保 证套在第一绝缘构件细部的第二绝缘构件， 能紧贴在第一绝缘构件
细部的外表面， 这样绝缘距离才能变为折线 B , 绝缘距离增加， 耐 压程度提高。
可选地， 如图 5所示， 第二绝缘构件 13的高度 H2大于等于细 部 122的高度 H I。 由图 4可看出， 第二绝缘构件 13 的高度 H2比细 部 122的高度 H I越大， 折线 B的长度即绝缘距离增加的越多。
可选地， 如图 6所示， 第一绝缘构件 12的细部 122末端外沿呈 内向倾斜状， 这样可使第一绝缘构件的细部呈削尖状， 便于穿套于 第二绝缘构件内。
当本实施例的绝缘结构用于固定电子元件时， 要将第一绝缘构 件 12的细部 122插入到第二绝缘构件 13 内， 而为了保证套在细部 122的第二绝缘构件 13能紧贴在细部 122的外表面， 细部 122的外 径和第二绝缘构件的内径又不能相差太大， 这样就给安装带来困难， 所以本实施例中的第一绝缘构件的细部设计成削尖状， 便于安装。
本发明实施例中以固定 MOS管为例，但可以看出实际应用中应 不限于此。
本发明实施例中的绝缘结构用于固定电子元件， 由于在原有第 一绝缘构件的基础上， 增加了第二绝缘构件， 所以电子元件与螺钉 或其它接地结构部件的绝缘距离增加， 增强绝缘强度， 避免短路打 火现象， 使用了本发明实施例中的绝缘结构的器件或设备， 可靠性 提高。 并且， 由于绝缘距离增加， 耐压等级达到了加强绝缘的要求， 器件或设备封装的防护等级可相应地降低， 使整体成本下降。
实际运用中， 器件或设备封装的防护等级可降低至 IP3 或者
IP4。
本发明实施例还提供一种电子元件，电子元件上设置有安装孔， 所述安装孔用于插入安装螺钉， 电子元件设置有绝缘结构， 所述绝 缘结构包括：
中空的第一绝缘构件， 包括上段的粗部和下段的细部， 粗部的 外径大于细部的外径， 粗部的内径和细部的内径相等， 第一绝缘构 件的细部的外径尺寸满足， 在细部穿过电子元件的安装孔时， 细部
的外表面与电子元件的安装孔贴合；
呈环状的第二绝缘构件， 设置在散热板上待安装的安装孔内， 安装螺钉穿过所述中空的第一绝缘构件， 第一绝缘构件的细部穿过 电子元件的安装孔和第二绝缘构件， 将电子元件固定在散热板上， 第二绝缘构件外套于第一绝缘构件的细部， 第二绝缘构件的内表面 紧贴在第一绝缘构件的细部的外表面。
其中， 可选地， 第二绝缘构件的内径等于细部的外径。
可选地， 第二绝缘构件的高度大于等于细部的高度。
可选地， 细部末端外沿呈内向倾斜状。
可选地， 第二绝缘构件的材质为绝缘橡胶。
本发明实施例中电子元件， 由于使用的绝缘结构在原有第一绝 缘构件的基础上， 增加了第二绝缘构件， 所以电子元件与螺钉或其 它接地结构部件的绝缘距离增加， 增强绝缘强度， 避免短路打火现 象， 使用了本发明实施例中电子元件的器件或设备， 可靠性提高。 并且， 由于绝缘距离增加， 耐压等级达到了加强绝缘的要求， 器件 或设备封装的防护等级可相应地降低， 使整体成本下降。
本发明实施例还提供一种电子元器件的组件， 包括： 电子元件、 用于固定所述电子元件的绝缘结构和电路板， 所述电子元件上设置 有安装孔， 所述安装孔用于插入安装螺钉将所述电子元件固定在所 述电路板， 所述电路板上设置有散热板， 所述绝缘结构包括：
中空的第一绝缘构件， 所述第一绝缘构件包括上段的粗部和下 段的细部， 所述粗部的外径大于所述细部的外径， 所述粗部的内径 和所述细部的内径相等， 所述第一绝缘构件的所述细部的外径尺寸 满足， 在所述细部穿过所述电子元件的安装孔时， 所述细部的外表 面与所述电子元件的安装孔贴合；
呈环状的第二绝缘构件， 所述第二绝缘构件设置在散热板上待 安装的安装孔内， 安装螺钉穿过所述中空的第一绝缘构件， 所述第 一绝缘构件的所述细部穿过所述电子元件的安装孔和所述第二绝缘 构件， 所述第二绝缘构件外套于所述第一绝缘构件的所述细部， 并
且所述第二绝缘构件的内表面紧贴在所述第一绝缘构件的所述细部 的夕卜表面。
电子设备选用本实施例所述的电子元件组件， 可使绝缘距离增 加， 绝缘强度增强， 避免短路打火现象， 从而提高电子设备的可靠 性， 同时设备封装的防护等级可相应地降低， 整体成本下降。
需要说明的是， 在不冲突的情况下， 本发明实施例中的特征可 以相互任意组合。
以上所述， 仅为本发明的具体实施方式， 但本发明的保护范围 并不局限于此， 任何熟悉本技术领域的技术人员在本发明揭露的技 术范围内， 可轻易想到变化或替换， 都应涵盖在本发明的保护范围 之内。 因此， 本发明的保护范围应所述以权利要求的保护范围为准。
Claims
1、 一种用于固定电子元件的绝缘结构， 所述电子元件上设置有 安装孔， 所述安装孔用于插入安装螺钉， 其特征在于， 所述绝缘结构 包括：
中空的第一绝缘构件，所述第一绝缘构件包括上段的粗部和下段 的细部， 所述粗部的外径大于所述细部的外径， 所述粗部的内径和所 述细部的内径相等， 所述第一绝缘构件的所述细部的外径尺寸满足， 在所述细部穿过所述电子元件的安装孔时， 所述细部的外表面与所述 电子元件的安装孔贴合；
呈环状的第二绝缘构件，所述第二绝缘构件设置在散热板上待安 装的安装孔内， 安装螺钉穿过所述中空的第一绝缘构件， 所述第一绝 缘构件的所述细部穿过所述电子元件的安装孔和所述第二绝缘构件， 所述第二绝缘构件外套于所述第一绝缘构件的所述细部， 并且所述第 二绝缘构件的内表面紧贴在所述第一绝缘构件的所述细部的外表面。
2、 根据权利要求 1所述的绝缘结构， 其特征在于，
所述第二绝缘构件的内径等于所述细部的外径。
3、 根据权利要求 1所述的绝缘结构， 其特征在于，
所述第二绝缘构件的高度大于等于所述细部的高度。
4、 根据权利要求 1所述的绝缘结构， 其特征在于，
所述细部末端外沿呈内向倾斜状。
5、 根据权利要求 1至 4任一项所述的绝缘结构， 其特征在于， 所述第二绝缘构件的材质为绝缘橡胶。
6、 一种电子元件， 所述电子元件上设置有安装孔， 所述安装孔 用于插入安装螺钉， 其特征在于， 所述电子元件设置有绝缘结构， 所 述绝缘结构包括：
中空的第一绝缘构件，所述第一绝缘构件包括上段的粗部和下段 的细部， 所述粗部的外径大于所述细部的外径， 所述粗部的内径和所 述细部的内径相等， 所述第一绝缘构件的所述细部的外径尺寸满足， 在所述细部穿过所述电子元件的安装孔时， 所述细部的外表面与所述 电子元件的安装孔贴合；
呈环状的第二绝缘构件，所述第二绝缘构件设置在散热板上待安 装的安装孔内， 安装螺钉穿过所述中空的第一绝缘构件， 所述第一绝 缘构件的所述细部穿过所述电子元件的安装孔和所述第二绝缘构件， 将所述电子元件固定在所述散热板上， 所述第二绝缘构件外套于所述 第一绝缘构件的所述细部， 所述第二绝缘构件的内表面紧贴在所述第 一绝缘构件的所述细部的外表面。
7、 根据权利要求 6所述的电子元件， 其特征在于，
所述第二绝缘构件的内径等于所述细部的外径。
8、 根据权利要求 6所述的电子元件， 其特征在于，
所述第二绝缘构件的高度大于等于所述细部的高度。
9、 根据权利要求 6所述的电子元件， 其特征在于，
所述细部末端外沿呈内向倾斜状。
10、 根据权利要求 6至 9任一项所述的电子元件， 其特征在于， 所述第二绝缘构件的材质为绝缘橡胶。
1 1、 一种电子元器件的组件， 包括： 电子元件、 用于固定所述电 子元件的绝缘结构和电路板， 所述电子元件上设置有安装孔， 所述安 装孔用于插入安装螺钉将所述电子元件固定在所述电路板， 所述电路 板上设置有散热板， 其特征在于， 所述绝缘结构包括：
中空的第一绝缘构件，所述第一绝缘构件包括上段的粗部和下段 的细部， 所述粗部的外径大于所述细部的外径， 所述粗部的内径和所 述细部的内径相等， 所述第一绝缘构件的所述细部的外径尺寸满足， 在所述细部穿过所述电子元件的安装孔时， 所述细部的外表面与所述 电子元件的安装孔贴合；
呈环状的第二绝缘构件，所述第二绝缘构件设置在散热板上待安 装的安装孔内， 安装螺钉穿过所述中空的第一绝缘构件， 所述第一绝 缘构件的所述细部穿过所述电子元件的安装孔和所述第二绝缘构件， 所述第二绝缘构件外套于所述第一绝缘构件的所述细部， 并且所述第 二绝缘构件的内表面紧贴在所述第一绝缘构件的所述细部的外表面。
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