WO2013094658A1 - Unité de lentille, et unité de réseau - Google Patents

Unité de lentille, et unité de réseau Download PDF

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Publication number
WO2013094658A1
WO2013094658A1 PCT/JP2012/082976 JP2012082976W WO2013094658A1 WO 2013094658 A1 WO2013094658 A1 WO 2013094658A1 JP 2012082976 W JP2012082976 W JP 2012082976W WO 2013094658 A1 WO2013094658 A1 WO 2013094658A1
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WO
WIPO (PCT)
Prior art keywords
lens
spacer
substrate
resin
spacer plate
Prior art date
Application number
PCT/JP2012/082976
Other languages
English (en)
Japanese (ja)
Inventor
青木健太郎
江黒孝一
Original Assignee
コニカミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Publication of WO2013094658A1 publication Critical patent/WO2013094658A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G02B3/0068—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means

Definitions

  • the present invention relates to a lens unit used for an imaging lens and the like, and an array unit for producing the lens unit.
  • the lens unit in order to ensure the space between the lens part and the cover glass or between the lens part and the lens part, it is necessary to insert a member such as glass having a hole in a position corresponding to the lens part as a spacer.
  • a wafer-like spacer having a plurality of holes corresponding to the position of each lens portion such as a wafer lens having a plurality of lens portions formed of resin or the like on the surface of the substrate is sandwiched between a pair of wafer lenses.
  • a large amount of lens units can be manufactured at once by pasting them together and finally cutting them (see, for example, Patent Document 1).
  • the spacer is formed with a hole having a shape that does not interfere with the structure such as the lens portion, but in the case of a wafer lens formed by molding on a substrate with a resin, a convex shape is formed.
  • a resin convex portion is always provided to form an optical surface by applying resin on the substrate. Will be. Therefore, if the gap between the spacer and the lens portion is narrow, the resin convex portion tends to interfere with the spacer, making it difficult to manufacture the lens unit.
  • Patent Document 2 does not describe forming a lens by applying a resin on a substrate.
  • 28A to 28G (corresponding to FIGS. 1 to 7 of Patent Document 2), it is presumed that molding is performed with one material. With such a molding method, it is unlikely that the above-mentioned problems will occur because the convex portions are not necessarily formed by the resin getting on the substrate.
  • FIGS. 28A to 28C and 28F (corresponding to FIGS. 1 to 3 and 6 of Patent Document 2), even if the optical surface is concave, the optical surface is formed without a convex portion. Therefore, Patent Document 2 is unlikely to have a problem of avoiding spacer interference.
  • Patent Document 2 the lens portion and the substrate are integrally formed. Therefore, as the area of the entire wafer lens is increased and the number of lenses is increased, problems such as warpage of the substrate and the like increase.
  • the optical surface as described in Patent Document 2 is concave, it is desirable from the viewpoint of thinning to reduce the thickness of the lens unit by omitting the spacer.
  • the shape of the hole of the spacer when any of the pair of lens portions has a convex optical surface is not considered.
  • both of the pair of lens parts are convex, when a spacer is attached to a wafer lens having a plurality of lens parts, the spacer strength is maintained while securing a certain clearance (clearance) between the lens part and the spacer. It is necessary to keep.
  • the spacer is placed around the lens unit (particularly the lens unit in the case of a convex shape). Difficult to join to.
  • the space between the holes is increased in order to maintain the strength of the spacer, the number of lens units to be manufactured is reduced, making it unsuitable for mass production of lens units.
  • it is necessary to increase the number of holes in the spacer which increases the probability of breakage of the spacer, which may result in an increase in cost.
  • the bonding area between the spacer and the object to be bonded decreases, and as a result, the spacer is cut out in a process such as cutting out the lens unit. There is a possibility that peeling and breakage of the object to be bonded will occur.
  • An object of the present invention is to provide a lens unit capable of maintaining the strength of a spacer or the like while appropriately securing a gap between the lens portion and the spacer.
  • the present invention provides a lens array that can maintain the strength of the spacer plate while appropriately securing the gap between the lens portion and the spacer plate, and can produce a large number of lens units while suppressing the overall thickness.
  • the purpose is to provide.
  • a first lens unit according to the present invention is provided so as to surround a substrate, a resin lens portion provided on at least one surface of the substrate, and the periphery of the lens portion. It is a lens unit having a spacer, the edge portion of the spacer facing the lens portion has a tapered surface on the inside, and a joint portion formed of an adhesive is provided between the spacer and the substrate, The joining portion adheres to at least a part of the tapered surface.
  • the edge part of a spacer means inner parts, such as a hole formed in the spacer.
  • a resin or the like different from the bonding portion may be interposed between the substrate and the spacer. In this case, the bonding portion is also bonded to resin or the like.
  • the adhesive adheres to the tapered surface of the spacer, thereby increasing the contact area of the joint formed by the adhesive and adhering between the flat surfaces of the substrate and the spacer.
  • the adhesive strength between the spacer and the substrate can be significantly increased.
  • the number of holes in the spacer can be increased. In other words, mass production of the lens unit is enabled by improving the adhesive strength of the spacer.
  • the joint portion is disposed so as to fill a gap between the tapered surface and the substrate.
  • the adhesive strength between the substrate and the spacer can be further improved.
  • the lens portion is formed by individual dropping.
  • the lens accuracy can be improved in that it is not necessary to cut the resin portion as compared with the whole dropping type lens unit.
  • the individual dropping method it is difficult to control the outermost shape of the lens part, but by providing a joint part between the tapered surface and the substrate, a large contact area of the joint part can be secured, The adhesive strength between the spacer and the substrate can be improved.
  • the joint portion fills a gap between the tapered surface and the lens portion.
  • the strength of the joint portion in the direction parallel to the end surface of the spacer is increased, and even if the gap is somewhat wide, the spacer and the lens portion
  • the adhesive strength with the outer edge can be improved.
  • the spacer is a plate-like member having an opening corresponding to the lens portion, and the lens portion protrudes into the opening at the position of the opening.
  • the lens portion and the spacer do not interfere with each other while maintaining the adhesive strength of the spacer even if the lens portion protrudes into the opening. A gap can be secured.
  • the spacer has a pair of tapered surfaces that narrow from the one end surface side and the other end surface side of the edge portion toward the center side in the thickness direction of the edge portion.
  • taper surfaces from both end surfaces of the spacer are provided by providing tapered surfaces (both side tapered surfaces) from one side of the spacer and both sides of the other end surface toward the center side at the edge portion that is the inner portion of the spacer hole. Adhesive can be applied to the surface.
  • the spacer strength can be improved compared to the case where a taper surface is not provided when a hole is made in the spacer with the same inner diameter, or when the taper surface is provided only from one end surface side. it can.
  • the spacer is such that the tip position of the innermost protrusion is the center in the thickness direction of the spacer in the cross section of the edge portion (specifically, the cross section including the optical axis of the lens portion). It is formed on one end face side or the other end face side.
  • the position of the tip of the protrusion is arranged in a direction where the thickness of the spacer is thinner than the center of the thickness or the lens portion is not present (for example, on the image sensor side), so that the spacer interferes with the lens portion. Can be easily avoided.
  • the base portion of the spacer is directly or indirectly bonded to the substrate.
  • the base portion of the spacer is a surface in contact with the substrate or the resin on the side where the focused joint portion is present among the pair of end surfaces of the spacer.
  • Direct means a state where there is nothing other than an adhesive between the base and the substrate, or a state where the base and the substrate are in direct contact.
  • Indirect means a state where a resin or the like is interposed between the base and the substrate or a state where the base is not in direct contact with the substrate.
  • the entire lens part formed on the substrate faces the hole-like opening part of the spacer, but the spacer hole has a tapered surface on both sides to avoid interference between the lens part and the spacer. Can do.
  • the spacer is a plate-like member having an opening corresponding to the lens portion, and the edge portion extends in the thickness direction of the edge portion from one end surface side and the other end surface side. It has a pair of tapered surfaces that narrow toward the center side, and the inner diameter of the edge portion is different between one end face side and the other end face side, and at least a part of the lens part is more than the base part of the spacer in the thickness direction of the spacer. Also protrudes into the opening.
  • the pair of tapered surfaces narrows toward the center in the thickness direction of the portion, and at least a part of the first or second lens portion protrudes into the opening portion from the base portion of the spacer in the thickness direction of the spacer.
  • the inner diameter of the edge portion is different between one end face side and the other end face side.
  • the first lens portion and the second lens portion are disposed between the first substrate and the second substrate.
  • a first array unit surrounds a substrate, a resin portion having a plurality of lens portions provided on at least one surface of the substrate, and the periphery of the lens portion.
  • An array unit having a spacer plate provided, and the edge portion of the spacer plate facing the lens portion has a tapered surface inside, and a joint portion formed of an adhesive between the spacer plate and the substrate Is provided, and the joining portion adheres to at least a part of the tapered surface.
  • the resin portion refers to the entire resin portion including the lens portion formed on the substrate before cutting the array unit.
  • the adhesive adheres to the tapered surface of the spacer plate, thereby increasing the contact area of the joint portion and bonding the flat surfaces of the substrate and the spacer plate to each other at a certain angle. Bonding is possible even in a range having a three-dimensional bonding. Therefore, the adhesive strength between the spacer plate and the substrate can be significantly increased. Thereby, when it obtains through the process etc. which cut
  • the resin portion is separated into a plurality of element regions each having a lens portion.
  • the spacer having an adhesive attached to the tapered surface, it is possible to prevent damage to the spacer plate even if the array unit is cut in units of each lens unit in order to produce a lens unit.
  • a second lens unit includes a first substrate and a first lens portion made of resin provided on at least one surface of the first substrate.
  • a spacer provided between the first and second compound lenses, the spacer having an opening corresponding to at least one of the first and second lens portions of the first or second compound lens.
  • a pair of tapered surfaces that are plate-shaped members and narrow toward the center in the thickness direction of the edge portion from one end surface side and the other end surface side of the edge portion facing the first or second lens portion.
  • the compound lens means a lens that is cut into individual pieces after forming a plurality of resin lens portions on a substrate.
  • the edge part of a spacer means inner parts, such as a hole formed in the spacer.
  • the base portion of the spacer is a surface that contacts the substrate or the resin.
  • the second lens unit in the case where the first or second lens portion protrudes from the base portion of the spacer, an edge that is an inner portion of the hole is provided between the stacked first and second compound lenses.
  • a spacer having a tapered surface hereinafter referred to as a double-sided tapered surface
  • the area of the support surface of the spacer can be increased,
  • the strength of the spacer can be improved without increasing the thickness. Thereby, it can prevent that the thickness of the whole lens unit becomes large.
  • a tapered surface is provided only from the spacer that is not provided with a tapered surface when a hole is drilled with the same inner diameter or from one end surface side.
  • the strength of the spacer can be increased more than in the case.
  • the spacer has a tapered surface on both sides, the hole diameter of the spacer does not have to be increased compared to a spacer that has no tapered surface or a spacer that has a tapered surface only from one end surface. While avoiding interference with the lens portion, the cut-out portion removed from the spacer can be reduced. Therefore, the strength of the spacer can be improved.
  • the spacer when the lens unit is cut out from the array unit, the spacer may be damaged or peeled off if the strength of the spacer is insufficient, but the strength is increased by inserting spacers with tapered surfaces on both sides between the compound lenses. be able to. Further, for example, in the case of a multi-piece lens unit, the number of holes in the spacer also increases, so that the strength of the spacer is improved, thereby enabling mass production of the lens unit.
  • a convex portion (protrusion) is generated on the substrate regardless of whether the optical surface is convex or concave. If the periphery of the lens portion is filled with resin so that the convex portion does not occur, the thickness of the compound lens increases, and consequently the thickness of the entire lens unit increases. In addition, the amount of resin to be used increases, and the substrate or the like warps or the manufacturing cost increases. By using spacers having tapered surfaces on both sides, even when a compound lens for forming a resin lens portion is laminated on a substrate, the lens unit has a relatively thin overall thickness and maintains strength.
  • the first and second lens portions are formed by individual dropping.
  • the lens accuracy can be improved in that it is not necessary to cut the resin portion as compared with the whole dropping type lens unit.
  • the lens part and the spacer are made to escape so that they do not interfere with each other.
  • the wall thickness between the holes can be increased. Thereby, the intensity
  • the tip position of the innermost protrusion is formed on one end face side or the other end face side from the center in the thickness direction of the spacer.
  • the tip of the protrusion by arranging the tip of the protrusion on the side where the thickness of the lens part is thinner than the center of the thickness in the thickness direction of the spacer or where there is no lens part (for example, on the image sensor side), the spacer interferes with the lens part. Can be easily avoided.
  • the base is directly or indirectly bonded to the substrate.
  • “directly” means a state where there is nothing other than an adhesive between the base and the substrate, or a state where the base and the substrate are in direct contact.
  • Indirect means a state where a resin or the like is interposed between the base and the substrate or a state where the base is not in direct contact with the substrate.
  • the entire lens part formed on the substrate faces the hole-like opening part of the spacer, but the spacer hole has a tapered surface on both sides to avoid interference between the lens part and the spacer. Can do.
  • the spacer has a diaphragm function.
  • a spacer having a tapered surface on both sides inserted between the lens portions is provided with a light-shielding material or a light-shielding coating, and serves as an optical diaphragm.
  • the protrusions are formed at the edge portions of the spacers by the tapered surfaces on both sides, the diaphragm effect can be provided to the limit of the effective diameter of the lens portion.
  • the spacer with a tapered surface on both sides to serve as an intermediate diaphragm, it is possible to reduce the cost of parts compared to newly manufacturing and inserting an intermediate diaphragm.
  • the first lens portion and the second lens portion are disposed between the first substrate and the second substrate.
  • a second array unit includes a first wafer lens having a first substrate and a first resin portion provided on at least one surface of the first substrate. And a second wafer, a second wafer lens having a second resin portion provided on at least one surface of the second substrate, and between the first wafer lens and the second wafer lens A plurality of first or second lens parts constituting at least one first or second resin part of the first or second wafer lens.
  • a plate-like member having an opening corresponding to the first or second lens portion, from one end surface side and the other end surface side to the center side in the thickness direction of the edge portion.
  • a pair of tapered surfaces At least a portion of the first or second lens unit, projecting into the opening portion than the base portion of the spacer plate in the thickness direction of the spacer plate.
  • the wafer lens is a substrate in which a plurality of resin lens portions are formed on a substrate, and a plurality of the above-described compound lenses are collected before cutting.
  • the resin portion refers to the entire resin portion including the lens portion formed on the substrate before cutting the wafer lens.
  • both side tapered surfaces are provided at the edge portion between the stacked first and second wafer lenses.
  • the resin portion is separated into a plurality of element regions each having the first or second lens portion.
  • the spacer by using a spacer with tapered surfaces on both sides, it is possible to prevent the spacer from being damaged even if the array unit is cut for each lens unit in order to produce a lens unit.
  • a third lens unit is provided so as to surround a substrate, a resin lens portion provided on at least one surface of the substrate, and the periphery of the lens portion.
  • a spacer unit, and the spacer is a plate-like member having an opening corresponding to the lens unit, and is edged from one end surface side and the other end surface side of the edge portion facing the lens unit. It has a pair of tapered surfaces that narrow toward the center in the thickness direction of the portion, the inner diameter of the edge portion is different on one end surface side and the other end surface side, and at least part of the lens portion is in the thickness direction of the spacer Projecting from the base of the spacer into the opening.
  • the edge part of a spacer means inner parts, such as a hole formed in the spacer.
  • the inner diameter of the edge portion includes not only a circle but also an ellipse or a rectangle. In the case of an ellipse or a rectangle, the inner diameter of the edge portion refers to the length of the long side.
  • the base portion of the spacer is a surface that contacts the substrate or the resin.
  • the size of the inner diameter of the edge portion is increased according to the contour and outer shape of the desired lens unit.
  • a sufficient gap (clearance) between the spacer and the structure such as the lens portion can be secured. This makes it possible to improve the strength of the spacer that may be lowered in order to ensure the clearance, while making the spacer conform to the specifications of the contours and outer shapes of various lens portions.
  • the edge portion of the spacer is a pair of tapered surfaces (both side tapered surfaces) narrowing toward the center side in the thickness direction, and the inner diameter of the edge portion of the spacer is The difference between the one end face side and the other end face side makes it possible to narrow the size of the inner diameter of the edge portion on one end face side, thereby improving the strength of the spacer.
  • the spacer may be damaged or peeled off, but spacers with tapered surfaces on both sides with different inner diameters on the front and back sides are inserted between the lens parts. By doing so, the strength can be increased.
  • the number of holes in the spacer also increases, so that the strength of the spacer is improved, thereby enabling mass production of the lens unit.
  • a convex portion (protrusion) is generated on the substrate regardless of whether the optical surface is convex or concave. If the periphery of the lens part is filled with resin so that the convex part does not occur, the thickness of the entire lens unit increases. In addition, the amount of resin to be used increases, and the substrate or the like warps or the manufacturing cost increases. By using spacers with tapered surfaces on both sides with different inner diameters on the front and back edges, even when laminating resin lens parts (for example, compound lenses) on a substrate, the overall thickness is relatively thin. In addition, the lens unit maintains strength.
  • the spacer in the third lens unit, in the cross section of the edge portion, has a tip position of the innermost projection portion of the edge portion that is one side away from the center in the thickness direction of the spacer. Is formed on the end face side or the other end face side.
  • the tip of the protrusion on the side where the thickness of the lens part is thinner than the center of the thickness in the thickness direction of the spacer or where there is no lens part (for example, on the image sensor side), the spacer interferes with the lens part. Can be easily avoided.
  • the edge portion faces the lens portion on one end surface side, and the inner diameter of the edge portion on one end surface side is larger than the inner diameter of the edge portion on the other end surface side.
  • the strength of the spacer can be improved while ensuring a gap with the lens portion.
  • the edge portion faces the first lens portion on one end face side, faces the second lens portion on the other end face side, and is outside the first and second lens portions.
  • the inner diameter of the edge portion facing the lens portion having a large diameter is larger than the inner diameter of the edge portion facing the lens portion having a small outer diameter.
  • the inner diameter of the edge portion of the spacer can be adjusted according to the desired outer dimensions and contour size of the lens, and the strength of the spacer can be improved while avoiding interference between the spacer and the lens portion.
  • the lens portion is formed by individual dropping.
  • the lens accuracy can be improved in that it is not necessary to cut the resin portion as compared with the whole dropping type lens unit.
  • the lens part and the spacer do not interfere with each other by using spacers with tapered surfaces on both sides with different inner diameters on the front and back edges.
  • the thickness between each hole of the spacer can be increased while making a relief. Thereby, the intensity
  • the base is directly or indirectly bonded to the substrate.
  • “directly” means a state where there is nothing other than an adhesive between the base and the substrate, or a state where the base and the substrate are in direct contact.
  • Indirect means a state where a resin or the like is interposed between the base and the substrate or a state where the base is not in direct contact with the substrate.
  • the entire lens portion formed on the substrate will face the hole-shaped open portion of the spacer, but the spacer hole has a tapered surface on both sides with different inner diameters of the front and back edge portions. Interference with the spacer can be avoided.
  • the spacer has a diaphragm function.
  • a light-shielding material or a light-shielding coating is applied to the spacers with tapered surfaces on both sides that have different inner diameters between the front and back edge portions inserted between the lens portions and the like, and serve as an optical diaphragm.
  • the protrusions are formed on the edge portion or the opening portion of the spacer by the tapered surfaces on both sides, the diaphragm effect can be provided to the limit of the effective diameter of the lens portion.
  • the spacer with a tapered surface on both sides to serve as an intermediate diaphragm, it is possible to reduce the cost of parts compared to newly manufacturing and inserting an intermediate diaphragm.
  • a third array unit surrounds a substrate, a resin portion having a plurality of lens portions provided on at least one surface of the substrate, and the periphery of the lens portion.
  • the spacer unit is a plate-like member having an opening corresponding to the lens portion, and one end surface side and the other of the edge portions facing each lens portion.
  • a pair of tapered surfaces that narrow from the end surface side toward the center in the thickness direction of the edge portion, and the inner diameter of the edge portion is different between one end surface side and the other end surface side, and at least a part of the lens portion Protrudes into the opening from the base of the spacer plate in the thickness direction of the spacer plate.
  • the third array unit it is possible to improve the strength of the spacer plate that may be lowered in order to ensure the clearance while the spacer plate corresponds to the specifications of various lens outlines and external shapes. .
  • the lens part protrudes from the base part of the spacer plate, by using a spacer plate with tapered surfaces on both sides with different inner diameters on the front and back edges, the size of the inner diameter of the edge part is narrowed on one end face side.
  • the strength of the spacer plate can be improved. As described above, a large number of lens units can be manufactured by improving the strength of the spacer plate.
  • the resin portion is separated into a plurality of element regions each having a plurality of lens portions.
  • the spacer plate may be damaged even if the array unit is cut in units of lens units in order to produce a lens unit. Can be prevented.
  • FIG. 5A to 5E are views for explaining a manufacturing procedure of the spacer plate shown in FIG. 5A to 5E are diagrams for explaining a part of the manufacturing procedure of the laminated structure shown in FIG. 1 and the like.
  • 6A and 6B are diagrams for explaining a part of the manufacturing procedure of the laminated structure shown in FIG. 1 and the like.
  • 7A to 7C are diagrams for explaining a part of the manufacturing procedure of the laminated structure shown in FIG. 1 and the like.
  • FIGS. 8A and 8B are diagrams illustrating a stacked structure and an imaging device according to the second embodiment.
  • 9A to 9E are diagrams for explaining a part of the manufacturing procedure of the laminated structure shown in FIG. 8A.
  • 10A and 10B are diagrams illustrating a stacked structure and an imaging apparatus according to the third embodiment. It is a figure explaining the manufacturing procedure of the spacer board of FIG. 10A. 12A and 12B are diagrams illustrating a multilayer structure and an imaging apparatus according to the fourth embodiment.
  • 16A and 16B are diagrams for explaining a part of the manufacturing procedure of the laminated structure shown in FIG. 1 and the like.
  • 17A to 17C are diagrams for explaining a part of the manufacturing procedure of the laminated structure shown in FIG. 18A and 18B are views for explaining a laminated structure and an imaging apparatus according to the sixth embodiment, and
  • FIG. 18C is a partially enlarged sectional view of an edge portion of an opening.
  • 19A and 19B are views for explaining a laminated structure and an imaging apparatus according to the seventh embodiment. It is a top view explaining the laminated structure containing the array unit which concerns on 8th Embodiment. It is sectional drawing explaining the laminated structure of FIG. It is sectional drawing explaining the imaging device containing the lens unit which concerns on 8th Embodiment.
  • FIGS. 23A to 23D are views for explaining a manufacturing procedure of the spacer substrate shown in FIG. 24A to 24C are diagrams for explaining a part of the manufacturing procedure of the laminated structure shown in FIG. 1 and the like.
  • 25A and 25B are views for explaining a laminated structure and an imaging apparatus according to the ninth embodiment, and FIG. 25C is a partially enlarged sectional view of an edge portion of an opening.
  • FIGS. 26A and 26B are views for explaining a laminated structure and an imaging apparatus according to the tenth embodiment.
  • 27A and 27B are views for explaining a laminated structure and the like according to the eleventh embodiment.
  • 28A to 28G are diagrams corresponding to FIGS. 1 to 7 of Patent Document 2.
  • the laminated structure 1000 includes a first wafer lens 100, a first spacer plate 200, a second wafer lens 300, a second spacer plate 400, and an imaging element array 500. Laminated in the Z-axis direction.
  • an imaging device 700 in which the lens unit 800 and the imaging element 530 are laminated can be obtained.
  • the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500 each extend in parallel to the XY plane and have a laminated structure.
  • the entire body 1000 also extends parallel to the XY plane.
  • a laminate of the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 is referred to as an array unit 600 for convenience in this specification. Included in wafer lens.
  • the first wafer lens 100 in the laminated structure 1000 has, for example, a disk shape, and includes a substrate 101, an upper resin portion 102, and a lower resin portion 103.
  • the upper and lower resin portions 102 and 103 are bonded to the substrate 101 in alignment with each other with respect to translation in the XY plane perpendicular to the axis AX and rotation around the axis AX.
  • a large number of first compound lenses 10 are formed as optical elements constituting them, and are secondarily arranged along the XY plane. That is, the first wafer lens 100 is a group of a plurality of first compound lenses 10 before cutting (the same applies to the second wafer lens 300).
  • the first compound lens 10 includes a lens body 10a that forms an optical surface, and a flange 10b that exists around the lens body 10a.
  • the substrate 101 of the first wafer lens 100 is a flat plate extending over the entire first wafer lens 100, and is formed of, for example, glass.
  • the thickness of the substrate 101 is basically determined by optical specifications, but is such a thickness that the first wafer lens 100 is not damaged when the first wafer lens 100 is released.
  • the substrate 101 constitutes the center portion of the lens body 10a of the first compound lens 10 and the flange 10b.
  • the substrate 101 has a first flange surface 11b and a second flange surface 12b on surfaces 101a and 101b corresponding to the flange 10b, respectively.
  • As the material of the substrate 101 a glass, a thermosetting resin, a photocurable resin, a thermoplastic resin, or the like can be used, and glass is particularly preferable.
  • substrate 101 is based also on a use, it shall be 0.2 mm or more and 1.5 mm or less, for example.
  • the upper resin portion 102 is made of resin and is formed on one surface 101 a of the substrate 101.
  • the upper resin part 102 has a plurality of upper lens parts 11. That is, the upper resin portion 102 refers to the entire resin portion including the upper lens portion 11 formed on the substrate 101 before the first wafer lens 100 is cut (the same applies to the lower lens portion 12).
  • Each upper lens portion 11 constitutes an upper portion of the lens body 10 a of the first compound lens 10.
  • Each upper lens unit 11 is two-dimensionally arranged in the XY plane on the substrate 101.
  • each upper lens portion 11 is independently arranged on the substrate 101. That is, each upper lens portion 11 is not connected to the adjacent upper lens portion 11 by resin, and the substrate 101 is exposed between the upper lens portions 11.
  • the upper lens unit 11 has, for example, a convex shape, and has a convex aspherical first optical surface 11a and a first non-optical surface 11c as shown in FIG.
  • the first optical surface 11a and the first non-optical surface 11c serve as a first molding surface 102a that is collectively molded by transfer.
  • the first optical surface 11a has an effective area AR1 (an optically effective area of the lens), and the first non-optical surface 11c has an ineffective area AR2 (an area that does not affect the optical function of the lens).
  • the upper resin portion 102 is made of a photocurable resin.
  • the photocurable resin contains a photopolymerization initiator that initiates polymerization of the photocurable resin.
  • a photocurable resin an acrylic resin, an allyl ester resin, an epoxy resin, a vinyl resin, or the like can be used.
  • acrylic resin, allyl ester resin, or vinyl resin it can be cured by reaction, for example, by radical polymerization of a photopolymerization initiator, and when epoxy resin is used, it is reacted by, for example, cationic polymerization of a photopolymerization initiator. It can be cured.
  • the lower resin portion 103 is made of resin, like the upper resin portion 102, and is formed on the other surface 101b of the substrate 101.
  • the lower resin portion 103 has a plurality of lower lens portions 12.
  • Each lower lens portion 12 constitutes a lower portion of the lens body 10 a of the first compound lens 10.
  • the lower lens portions 12 are two-dimensionally arranged in the XY plane on the substrate 101.
  • the position of each lower lens portion 12 corresponds to the position of each upper lens portion 11 on the opposite side of the substrate 101.
  • each lower lens portion 12 is independently arranged on the substrate 101. That is, each lower lens portion 12 is not connected to the adjacent lower lens portion 12 by resin, and the substrate 101 is exposed between the lower lens portions 12.
  • the lower lens portion 12 has, for example, a convex shape, and has a concave aspherical second optical surface 12a and a second non-optical surface 12c as shown in FIG.
  • the lower lens portion 12 has a concave second optical surface 12a and protrudes from the base portion 200a on the base side (upper part of the drawing) of the first spacer plate 200.
  • the second optical surface 12a and the second non-optical surface 12c are first molding surfaces 103a that are collectively molded by transfer.
  • the second optical surface 12a has an effective area AR3 (an optically effective area of the lens), and the second non-optical surface 12c has an ineffective area AR4 (an area that does not affect the optical function of the lens).
  • the photocurable resin used for the lower resin portion 103 is the same as the photocurable resin of the upper resin portion 102. However, it is not necessary to form both the resin parts 102 and 103 with the same photocurable resin, and it can form with another photocurable resin.
  • the second wafer lens 300 is, for example, a disk shape, and includes a substrate 301, an upper resin portion 302, and a lower resin portion 303.
  • the configuration of the second wafer lens 300 is substantially the same as the configuration of the first wafer lens 100.
  • a large number of second compound lenses 20 are formed as optical elements constituting the second lens, and are secondarily arranged along the XY plane.
  • the second compound lens 20 includes a lens body 20a that forms an optical surface, and a flange 20b that exists around the lens body 20a.
  • the upper lens part 11 constitutes the upper part of the lens body 20a of the second compound lens 20, and the lower lens part 12 constitutes the lower part of the lens body 20a.
  • the upper lens unit 11 has, for example, a convex shape, and includes a concave aspherical first optical surface 21a and a first non-optical surface 21c as shown in FIG. Have.
  • the lower lens portion 12 has, for example, a convex shape, and has a concave aspherical second optical surface 22a and a second optical surface 22c as shown in FIG.
  • the substrate 301 has a first flange surface 21b and a second flange surface 22b on the surfaces 101a and 101b corresponding to the flange 20b.
  • the upper and lower lens portions 11 and 12 constituting the first and second wafer lenses 100 and 300 are separated in units of the first and second compound lenses 10 and 20 including the element region.
  • a plurality of lens units 800 can be obtained.
  • the first spacer plate 200 functions as a support portion for the first wafer lens 100.
  • the first spacer plate 200 is a flat plate member made of glass, ceramics, resin, or the like, and has holes formed in an array corresponding to the first compound lens 10. As shown in FIG. 3, the first spacer plate 200 is divided into a plurality of spacers 10c by dicing. Each spacer 10c has a cylindrical support 6a and an opening 6b having a circular cross section. The opening 6b extends along the optical axis OA so as to pass the optical axis OA parallel to the Z-axis of the lens body 10a.
  • the opening 6 b is formed by the edge portion S facing the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300.
  • the edge portion S is an inner portion of a hole formed in the first spacer plate 200.
  • the edge portion S is formed in a substantially circular shape so as to surround the outer shapes of the upper and lower lens portions 11 and 12.
  • the support 6a is fixed to a flange 10b around the lens body 10a while avoiding the lens body 10a. That is, an appropriate gap is formed between the opening 6b and the lens body 10a.
  • the edge portion S of the opening 6b opens from one end face of the first spacer plate 200 on the base side (upper side in the drawing) 206a and the other end face on the front end side (lower side in the drawing) 206b. Both side tapered surfaces TP narrow toward the center side in the thickness direction (Z direction in the drawing) of the portion 6b.
  • the tip end position of the projection 91 located on the innermost side of the opening 6b is formed at substantially the center in the thickness direction.
  • An end surface 206a on the base side (upper side in the drawing) of the support 6a is bonded to a second flange surface 12b (the other surface 101b of the substrate 101) on the lower side in the drawing via an adhesive 81a. That is, the base portion 200a of the first spacer plate 200 is directly bonded to the substrate 101 without using a resin.
  • the end surface 206b on the front end side (lower side of the drawing) of the first spacer plate 200 is a first flange surface 21b (upper side of the drawing) of the second compound lens 20 constituting the second wafer lens 300 via the adhesive 81b. Bonded to one surface 101a) of the substrate 301. That is, the base portion 200b on the distal end side of the first spacer plate 200 is directly bonded to the substrate 301 without using a resin.
  • the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300 protrude into the opening 6b at the position of the corresponding opening 6b in the first spacer plate 200. It will be.
  • a joint part CE1 formed of an adhesive 81a is provided between the end face 206a on the root side of the first spacer plate 200 and the other face 101b of the substrate 101 of the first wafer lens 100.
  • the joint portion CE1 has a protruding portion 85 on the side of the end surface 206a on the root side, and is attached to a part of both side tapered surfaces TP. Further, the joint portion CE1 is provided so as to fill the gap GA between the both side tapered surfaces TP and the upper lens portion 11.
  • the joint part CE1 is not only bonded between the planes of the substrate 101 and the first spacer plate 200, but is also bonded within a certain angle range, and has a three-dimensional shape.
  • a joint portion CE2 formed of an adhesive 81b is provided between the end surface 206b on the front end side of the first spacer plate 200 and one surface 101a of the substrate 301 of the second wafer lens 300.
  • the joint portion CE2 has a protruding portion 85 at the end face 206b on the distal end side, and adheres to a part of the both side tapered surfaces TP.
  • the joint portion CE2 is provided so as to fill the gap GA between the both side tapered surfaces TP and the lower lens portion 12.
  • the tapered surfaces TP on both sides are formed so as to maintain a certain gap GA with the upper and lower lens portions 11 and 12, and the support 6a of the first spacer plate 200 and the upper and lower lens portions.
  • the distances d1 and d2 with the outer edge portions 61c and 61d of the protruding portion are 0 or more, and the edge portion S of the opening 6b can keep a predetermined distance from the upper and lower lens portions 11 and 12.
  • the distance is about.
  • the inclination angle ⁇ of the tapered surfaces TP on both sides is 0 ° ⁇ ⁇ 45 ° with respect to the thickness direction of the first spacer plate 200.
  • the roughness of the tapered surfaces TP on both sides is greater than the roughness of at least one of the one end surface 206a and the other end surface 206b of the first spacer plate 200.
  • the gap GA between the convex upper and lower lens portions 11 and 12 and the tapered surfaces TP on both sides needs to be adjusted more strictly than in the case where the lens portion is concave.
  • the first spacer plate 200 may not be attached to the first and second wafer lenses 100 and 300 with higher accuracy than when the lens portion has a concave shape.
  • the first spacer plate 200 and the spacer 10c obtained therefrom are members for adjusting the distance between the first wafer lens 100 and the second wafer lens 300, and the two first and second composites that constitute the imaging device 700. It has a role of adjusting the distance between the lenses 10 and 20.
  • the support 6a is made of a light-shielding material or has a light-shielding coating applied to the inner surface of the opening or the like, and also serves as an optical diaphragm.
  • the second spacer plate 400 functions as a support portion for the second wafer lens 300.
  • the second spacer plate 400 has the same configuration as the first spacer plate 200.
  • the second spacer plate 400 is divided into a plurality of spacers 20c by dicing.
  • the end surface 406a on the base side of the support 6a of the second spacer plate 400 is bonded to the second flange surface 22b on the lower side of the drawing of the second compound lens 20 constituting the second wafer lens 300 via an adhesive 81c. ing. That is, the base 400a on the base side of the second spacer plate 400 is directly bonded to the substrate 301 without using a resin.
  • a joint portion CE3 formed of an adhesive 81c is provided between the end surface 406a on the root side of the second spacer plate 400 and the other surface 101b of the second wafer lens 300. Further, the end surface 406b on the front end side of the second spacer plate 400 is bonded to the imaging element array 500 via an adhesive 81d.
  • the second spacer plate 400 and the spacer 20 c are members for adjusting the distance between the second wafer lens 300 and the image sensor array 500, and are between the second compound lens 20 and the image sensor 530 constituting the image pickup apparatus 700. It has a role to adjust the distance.
  • the thickness of the first spacer plate 200 is set to a value that appropriately maintains the distance between the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300.
  • the thickness of the second spacer plate 400 is set to a value that appropriately maintains the distance between the lower lens portion 12 of the second wafer lens 300 and the image sensor 530 of the image sensor array 500.
  • the specific thickness of the first and second spacer plates 200 and 400 depends on the optical characteristics of the upper and lower lens portions 11 and 12, the performance of the image sensor 530, the functions and applications required for the imaging lens, and the like. However, generally 0.1 mm or more and 0.8 mm or less are preferable, and 0.2 mm or more and 0.6 mm or less are more preferable. When the thickness is 0.1 mm or more, handling is easy, stress relaxation is high, and failures such as peeling and cracking are unlikely to occur. Moreover, it is preferable that it is 0.8 mm or less because the transmittance is high.
  • Specific materials of the first and second spacer plates 200 and 400 are soft glass, resin, organic-inorganic hybrid material, and the like, and are not particularly limited. However, heat-resistant resin or heat-resistant organic-inorganic hybrid is used. Good material. As the organic / inorganic hybrid material, heat-resistant glass fiber reinforced resin, filler reinforced resin, organic-silica hybrid, and the like are preferable. In particular, an organic silica-hybrid is preferable. Among them, an epoxy resin-silica hybrid and an acrylic-silica hybrid are preferable because they have good adhesion to the upper and lower resin portions 102 and 103.
  • the openings 6b of the first and second spacer plates 200 and 400 are formed by, for example, etching or blasting.
  • etching or blasting For example, wet etching or the like is used as the etching method, and microblasting or the like is used as the blasting method.
  • the lens unit 800 and the imaging device 700 will be described with reference to FIG.
  • the imaging device 700 includes a lens unit 800 and an imaging element 530.
  • the lens unit 800 includes a first compound lens 10, a first spacer 10c, a second compound lens 20, and a second spacer 20c.
  • the first compound lens 10 includes the upper lens portion 11, the lower lens portion 12, and the flat plate portion 13 sandwiched therebetween.
  • the flat plate portion 13 is a portion obtained by cutting out the substrate 101. That is, the first compound lens 10 is a lens that is cut into individual pieces after forming a plurality of resin upper and lower lens portions 11 and 12 on the substrate 101 (the same applies to the second compound lens 20). .
  • the shapes of the upper and lower lens portions 11 and 12 may be the same or different.
  • the second compound lens 20 includes an upper lens unit 11, a lower lens unit 12, and a flat plate unit 13 sandwiched therebetween.
  • the first spacer 10 c is provided between the first compound lens 10 and the second compound lens 20.
  • the second spacer 20 c is provided between the second compound lens 20 and the image sensor 530.
  • the first and second spacers 10c and 20c have openings 6b corresponding to the upper and lower lens portions 11 and 12, respectively.
  • a double-sided tapered surface TP that narrows toward the center in the thickness direction of the first and second spacers 10c and 20c is formed at the edge portion S of the opening 6b. In the cross section in the thickness direction of the opening 6b (edge portion S), the tip position of the protrusion 91 is formed at the approximate center in the thickness direction.
  • joints CE1 and CE2 formed by adhesives 81a and 81b are provided between the first and second compound lenses 10 and 20 and the first spacer 10c.
  • the joint portions CE1 and CE2 are provided so as to fill the gap GA between the tapered surfaces TP on both sides and the substrate 101 or the upper and lower lens portions 11 and 12.
  • a joint portion CE3 formed of an adhesive 81c is provided between the second compound lens 20 and the second spacer 20c.
  • the imaging device 700 has a rectangular outline when viewed from the optical axis OA direction. Note that the imaging device 700 is housed in, for example, a separately prepared holder and bonded to the imaging circuit board as an imaging lens.
  • FIGS. 4A to 4D An example of a method for manufacturing the first spacer plate 200 will be described with reference to FIGS. 4A to 4D.
  • the method for producing the second spacer plate 400 is the same as that for the first spacer plate 200.
  • masks MA are formed on both surfaces of a spacer substrate SS which is a material of the first and second spacer plates 200 and 400.
  • a pattern of circular holes OP is formed at positions corresponding to the openings 6 b of the first spacer plate 200.
  • a material that can withstand the etching solution as a mask MA that is adjusted by changing the size of the diameter of the hole OP and the etching and blasting time for each surface of the spacer substrate SS is used.
  • a resist a metal mask such as stainless steel, chromium, or the like is used.
  • the spacer substrate SS on which the mask MA is formed is immersed in the etching solution ES.
  • the etching solution ES For example, hydrofluoric acid or ammonium fluoride is used as the etching solution.
  • the spacer substrate SS is gradually etched from the portion where the mask MA is not formed, that is, from the exposed portion of the both end faces 206a and 206b, and finally, as shown in FIG.
  • the opening 6b having a desired size is formed in the substrate SS.
  • a blast projection is projected onto the spacer substrate SS on which the mask MA is formed.
  • the spacer substrate SS is gradually removed from the exposed portions of the both end faces 206a and 206b as shown in FIG. 4C, and finally the spacer substrate SS has a desired size as shown in FIG. 4D.
  • An opening 6b is formed.
  • a master mold 30 (see FIG. 5A) corresponding to the final shape of the upper resin portion 102 is manufactured by grinding or the like.
  • the resin material 41 b is individually dropped on the transfer surface corresponding to each upper lens portion 11 of the first transfer surface 31 of the master mold 30.
  • ultraviolet rays are irradiated by a UV generator (not shown) while pressing the sub-master substrate 42 from above the master mold 30, and the resin material 41b sandwiched therebetween is photocured.
  • the first transfer surface 31 of the master mold 30 is transferred to the resin material 41b, and the second transfer surface 43 (second optical transfer surface and second flange transfer surface) is formed on the resin material 41b.
  • the sub master molding part 41 is formed.
  • the second transfer surface 43 may be further formed in an array by changing the transfer position on the sub-master substrate 42 and repeating the sub-master type curing step in this step and the sub-master type release step in the next step. .
  • the sub-master mold 40 is manufactured by releasing the sub-master molding portion 41 and the sub-master substrate 42 as a single unit from the master mold 30. Note that a release agent may be applied on the second transfer surface 43 of the sub master molding unit 41.
  • the sub-master mold 50 is manufactured using the sub-master mold 40 obtained in the above process.
  • the resin material 51 b is individually dropped on the transfer surface corresponding to each upper lens portion 11 of the second transfer surface 43 of the sub-master mold 40.
  • ultraviolet rays are irradiated by a UV generator (not shown) while pressing the sub-submaster substrate 52 from above the sub-master mold 40, and the resin material 51b sandwiched therebetween is photocured.
  • the second transfer surface 43 of the sub master mold 40 is transferred to the resin material 51b, and a third transfer surface 53 (a third optical transfer surface and a third flange transfer surface) is formed on the resin material 51b.
  • the sub-submaster molding part 51 is formed on the sub-sub master substrate 52, as the sub-sub master molding portion 51, transfer portions corresponding to the upper lens portions 11 are arranged in an independent state.
  • the sub-submaster mold 50 is manufactured by separating the sub-submaster molding part 51 and the sub-submaster substrate 52 as a single unit from the submaster mold 40. Note that a release agent may be applied on the third transfer surface 53 of the sub-submaster molding unit 51.
  • the wafer lens 100 is manufactured using the sub-submaster mold 50 obtained in the above process.
  • resin materials 102b photocurable resins forming the upper resin portion 102 are individually applied on the transfer surfaces corresponding to the upper lens portions 11 of the third transfer surface 53 of the sub-submaster mold 50. Dripping into. Thereafter, ultraviolet rays are irradiated by a UV generator (not shown) while pressing the substrate 101 from above the sub-sub master mold 50, and the resin material 102b sandwiched therebetween is photocured.
  • the third transfer surface 53 of the sub-submaster mold 50 is transferred to the resin material 102b, and the first molding surface 102a (the first optical surface 11a and the first flange surface 11b in FIG. 3) is formed on the resin material 102b. .
  • the upper resin part 102 is formed.
  • the upper lens portions 11 are arranged as independent upper resin portions 102. In addition, you may make it harden
  • the other sub-master master 150 having the same structure as that of the sub-sub master mold 50 but having a different transfer surface is used to perform the other process of the substrate 101 in the same process as described above.
  • the lower resin portion 103 is formed on the surface 101b.
  • the pair of sub-submaster molds 50 and 150 are separated to release the substrate 101 and the resin portions 102 and 103 as a single unit.
  • the first wafer lens 100 is manufactured.
  • the second wafer lens 300 is similarly manufactured.
  • a sheet-shaped or wafer-shaped first spacer plate 200 is attached to the other surface 101b of the substrate 101 of the first wafer lens 100.
  • the adhesive 81 a is applied to one side of the first spacer plate 200 or the first wafer lens 100.
  • the first spacer plate 200 or the first wafer lens 100 is aligned with respect to the substrate 101 and the lower resin portion 103, and the bonding surface of the first spacer plate 200, that is, the end surface 206 a on the root side is used as the other surface 101 b of the substrate 101.
  • the adhesive is cured by irradiating it with UV light.
  • the application amount of the adhesive 81a slightly leaks when the first spacer plate 200 and the substrate 101 are attached, and the gap GA between the tapered surfaces TP on both sides of the first spacer plate 200 and the upper lens portion 11 is filled.
  • the amount is about.
  • an adhesive 81a may be applied to both side tapered surfaces TP of the edge portion S of the first spacer plate 200 in order to further strengthen the adhesion.
  • the application amount is the same for the adhesives 81b and 81c described below.
  • the second spacer plate 400 is attached to the second wafer lens 300 using the adhesive 81c in the same process as the above process.
  • the second spacer plate 400 may be attached to the second wafer lens 300 after the first spacer plate 200 and the second wafer lens 300 are attached.
  • the first wafer lens 100 with the first spacer plate 200 attached and the second wafer lens 300 with the second spacer plate 400 attached are joined to produce the array unit 600. That is, the adhesive 81b is applied to the end face 206b of the first spacer plate 200 fixed to the first wafer lens 100 or the second wafer lens 300, and is bonded to the second wafer lens 300 or the first spacer plate 200. Irradiate with UV light. Accordingly, the second wafer lens 300 is fixed or bonded to the first wafer lens 100 via the first spacer plate 200. Next, the image sensor array 500 is attached to the second wafer lens 300 on the opposite side of the first wafer lens 100.
  • the adhesive 81d is applied to the end face of the second spacer plate 400 fixed to the second wafer lens 300, and is bonded to the image pickup device array 500 to irradiate UV light.
  • the image sensor array 500 is fixed or bonded to the second wafer lens 300 via the second spacer plate 400.
  • the laminated structure 1000 in which the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500 are laminated is completed.
  • the first and second wafer lenses 100, 300, etc. are cut, that is, diced, along the cut line DX shown in FIGS.
  • the first and second wafer lenses 100, 300, etc. are cut out into a quadrangular prism shape to form an imaging device 700 having a structure in which the first and second compound lenses 10, 20, etc. are stacked.
  • the laminated structure 1000 has been described as including the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500.
  • the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 may be used.
  • the laminated structure 1000 is constituted by the array unit 600 in which the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 are laminated.
  • Such an array unit 600 can be separated into pieces by dicing and joined to an individual image pickup device 530 separately manufactured.
  • the imaging element array 500 is included in the stacked structure 1000, but the imaging element array 500 may be omitted and the array unit 600 may be configured.
  • one side taper surface TP of the first and second spacer plates 200 and 400 (in the case of a lens unit, the first and second spacers 10c and 20c).
  • the adhesives 81a, 81b, and 81c adhere to the portions, the contact areas of the joints CE1, CE2, and CE3 formed by the adhesives 81a, 81b, and 81c increase.
  • the substrates 101 and 301 the flat plate portion 13 in the case of a lens unit
  • the planes of the first and second spacer plates 200 and 400 adhered to each other but they are also adhered within a certain angle range and are three-dimensional. Jointly becomes possible.
  • the adhesive strength between the first and second spacer plates 200 and 400 and the substrates 101 and 301 of the first and second wafer lenses 100 and 300 can be significantly increased. Further, the gap GA between the tapered surfaces TP formed on the edge portions S of the first and second spacer plates 200 and 400 and the substrates 101 and 301 and the upper lens portion 11 is filled with the joint portions CE1, CE2, and CE3. As a result, the adhesive strength can be further improved. Thereby, when it obtains through the process etc. which cut
  • the number of holes of the first and second spacer plates 200 and 400, that is, the opening 6b can be increased. That is, the adhesive strength of the first and second spacer plates 200 and 400 is improved, thereby enabling mass production of lens units.
  • the lens does not need to cut the upper and lower resin portions 102 and 103, which are resin portions, as compared with the whole dripping type lens unit.
  • the accuracy can be improved.
  • the outermost shape of the upper and lower lens portions 11 and 12 with respect to the third transfer surface 53 and the like for forming all the upper and lower lens portions 11 and 12 is accurately reflected between shots. Difficult to control.
  • the hole diameter of the spacer plate ensures the gap (clearance) between the lens part and the inside of the opening. If the inner diameter of the opening is widened, the strength of the spacer plate is reduced by that amount. There are concerns about strength such as the spacer plate being damaged in the step of laminating the spacer, the step of cutting the laminated structure, and the like.
  • the optical surfaces 11a, 12a, 21a, and 22a are formed by applying resin on the substrates 101 and 301, and the thickness of the substrate is equal to the thickness of the lens portion. Is not dependent. Therefore, there is an advantage that a large amount of lens parts (upper and lower lens parts 11 and 12) can be formed on the substrate 101. However, since it is necessary to separately apply a resin on the substrate, a convex portion (protrusion) made of resin always occurs on the substrate.
  • the lens unit 800 The lens portion (upper and lower lens portions 11 and 12) and the first and second spacer plates 200 and 400 can be arranged with high accuracy while suppressing the overall thickness.
  • the upper and lower lens portions 11 and 12 are formed by connecting the resin on the substrates 101 and 301.
  • the upper and lower flange portions 15 and 16 made of resin are formed around the upper and lower lens portions 11 and 12 made of resin. That is, the first and second flange surfaces 11b, 12b, 21a, and 22b are formed on the upper and lower resin portions 102, 103, 302, and 303, respectively.
  • the base portion 200 a on the base side of the first spacer plate 200 is indirectly bonded to the substrate 101 via the adhesive 81 a and the upper flange portion 15.
  • the thickness in the cutting position of the upper side and lower side resin parts 102, 103, 302, and 303 shall be 0.01 mm or more and 0.3 mm or less, for example.
  • the upper and lower resin portions 102 and 103 of the first and second wafer lenses 100 of the present embodiment are formed by an entire dropping method.
  • the manufacturing process of the second wafer lens 300 is the same as the manufacturing process of the first wafer lens 100.
  • a sub-master die 40 is manufactured using the master die 30.
  • the resin material 41 b is applied on the first transfer surface 31 of the master mold 30.
  • the sub master substrate 42 is pressed against the master mold 30 through the resin material 41b.
  • the sub master mold 40 is released from the master mold 30 as shown in FIG. 9B.
  • a sub-sub master mold 50 is manufactured using the manufactured sub-master mold 40.
  • the resin material 51 b is applied on the second transfer surface 43 of the sub master mold 40.
  • the sub-master substrate 52 is pressed against the sub-master mold 40 through the resin material 51b.
  • the sub-sub master mold 50 is released from the sub-master mold 40 as shown in FIG. 9D.
  • the first wafer lens 100 is manufactured using the manufactured sub-submaster mold 50.
  • the resin material 102 b is applied to the third transfer surface 53 of the sub-sub master mold 50.
  • the substrate 101 is pressed against the sub-sub master mold 50 through the resin material 102b.
  • the resin material 102b is cured, the substrate 101 and the upper resin portion 102 are integrally released from the sub-sub master mold 50.
  • FIGS. 6A and 6B and FIGS. 7A to 7E of the first embodiment is performed.
  • FIG. 8B an imaging device 700 including the lens unit 800 is obtained.
  • the first spacer plate 200 has a tip end position of the projection 91 on the innermost side of the opening 6b in the cross section of the opening 6b. In the thickness direction, it is formed on the end surface 206b side on the tip side from the center. In other words, the height h1 in the thickness direction from the end face 206a on the base side of the support 6a to the protrusion 91 is larger than the height h2 in the thickness direction from the end face 206b on the tip side of the support 6a to the protrusion 91. ing.
  • the tip position of the protrusion 91 may be formed closer to the end face 206a on the root side than the center in the thickness direction of the first spacer plate 200.
  • the position of the protrusion 91 in the thickness direction changes the size of the diameter of the hole OP of the mask MA of the spacer substrate SS shown in FIG. 4A or the like, or the processing time of the end surfaces 206a and 206b of the spacer substrate SS. Adjust by. Specifically, as shown in FIG. 11, the diameter x1 of the hole OP1 of the mask MA1 formed on one end surface 206a of the spacer substrate SS is set to the diameter of OP2 of the mask MA2 formed on the other end surface 206b. It is larger than the diameter x2.
  • the processing time on the end face 206a side is made shorter than that on the end face 206b side.
  • the manufacturing method of the spacer board 200 in this embodiment is demonstrated in detail in the following 5th Embodiment etc.
  • the tip position of the protrusion 91 of the first spacer plate 200 is formed closer to the end face 206b side of the tip side than the center in the thickness direction of the first spacer plate 200.
  • the protrusion 91 is disposed on the upper lens portion 11 side of the second wafer lens 300 having a small lens thickness. Thereby, it is possible to easily avoid the first spacer plate 200 from hitting the upper lens portion 11.
  • the second spacer plate 400 does not have a tapered surface on both sides, but has a single-sided tapered surface PP that narrows in one direction from one end surface 406a to the other end surface 406b.
  • the adhesive 81c adheres to a portion of the one-side tapered surface PP where the inner angle ⁇ formed by the one-side tapered surface PP and the substrate 301 is an acute angle. That is, the adhesive 81c adheres to a part of the one-side tapered surface PP on the side where the inner diameter of the opening 6b is larger among the entrances of the pair of openings 6b of the second spacer plate 400.
  • the first spacer plate 200 may be provided with a one-side tapered surface PP.
  • the laminated structure 1000 includes a first wafer lens 100, a first spacer plate 200, a second wafer lens 300, a second spacer plate 400, and an image sensor array 500. Laminated in the Z-axis direction.
  • an imaging device 700 in which the lens unit 800 and the imaging element 530 are laminated can be obtained.
  • the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500 each extend in parallel to the XY plane and have a laminated structure.
  • the entire body 1000 also extends parallel to the XY plane.
  • a laminate of the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 is referred to as an array unit 600 for convenience in this specification. Included in wafer lens.
  • the first wafer lens 100 in the laminated structure 1000 has, for example, a disk shape, and includes a substrate 101, an upper resin portion 102, and a lower resin portion 103.
  • the upper and lower resin portions 102 and 103 are bonded to the substrate 101 in alignment with each other with respect to translation in the XY plane perpendicular to the axis AX and rotation around the axis AX.
  • a large number of first compound lenses 10 are formed as optical elements constituting them, and are secondarily arranged along the XY plane. That is, the first wafer lens 100 is a group of a plurality of first compound lenses 10 before cutting (the same applies to the second wafer lens 300).
  • the first compound lens 10 includes a lens body 10a that forms an optical surface, and a flange 10b that exists around the lens body 10a.
  • the lens body 10 a and the flange 10 b include not only a part of the upper and lower resin parts 102 and 103 but also a part of the substrate 101.
  • the substrate 101 of the first wafer lens 100 is a flat plate extending over the entire first wafer lens 100, and is formed of, for example, glass.
  • the thickness of the substrate 101 is basically determined by optical specifications, but is such a thickness that the first wafer lens 100 is not damaged when the first wafer lens 100 is released.
  • the substrate 101 constitutes the center portion of the lens body 10a of the first compound lens 10 and the flange 10b.
  • a glass, a thermosetting resin, a photocurable resin, a thermoplastic resin, or the like can be used, and glass is particularly preferable.
  • substrate 101 is based also on a use, it shall be 0.2 mm or more and 1.5 mm or less, for example.
  • the upper resin portion 102 is made of resin and is formed on one surface 101 a of the substrate 101.
  • the upper resin portion 102 includes a plurality of upper lens portions 11 and an upper flange portion 15 formed around each upper lens portion 11. That is, the upper resin portion 102 refers to the entire resin portion including the upper lens portion 11 formed on the substrate 101 before the first wafer lens 100 is cut (the same applies to the lower lens portion 12).
  • Each upper lens portion 11 constitutes an upper portion of the lens body 10 a of the first compound lens 10.
  • Each upper lens unit 11 is two-dimensionally arranged in the XY plane on the substrate 101.
  • the upper lens unit 11 has, for example, a convex shape, and has a convex aspherical first optical surface 11a as shown in FIG.
  • the upper flange portion 15 constitutes the upper portion of the flange 10b.
  • the upper flange portion 15 has a first flange surface 11b as shown in FIG.
  • the first optical surface 11a and the first flange surface 11b serve as a first molding surface 102a that is collectively molded by transfer.
  • the thickness of the upper resin part 102 at the cutting position is, for example, 0.01 mm or more and 0.3 mm or less.
  • the upper resin portion 102 is made of a photocurable resin.
  • the photocurable resin contains a photopolymerization initiator that initiates polymerization of the photocurable resin.
  • a photocurable resin an acrylic resin, an allyl ester resin, an epoxy resin, a vinyl resin, or the like can be used.
  • acrylic resin, allyl ester resin, or vinyl resin it can be cured by reaction, for example, by radical polymerization of a photopolymerization initiator, and when epoxy resin is used, it is reacted by, for example, cationic polymerization of a photopolymerization initiator. It can be cured.
  • the lower resin portion 103 (first resin portion) is made of resin and is formed on the other surface 101 b of the substrate 101, similar to the upper resin portion 102.
  • the lower resin portion 103 includes a plurality of lower lens portions 12 (first lens portions) and a lower flange portion 16.
  • Each lower lens portion 12 constitutes a lower portion of the lens body 10 a of the first compound lens 10.
  • the lower lens portions 12 are two-dimensionally arranged in the XY plane on the substrate 101.
  • the position of each lower lens portion 12 corresponds to the position of each upper lens portion 11 on the opposite side of the substrate 101.
  • the lower lens unit 12 has a convex shape, for example, and has a concave aspherical second optical surface 12a as shown in FIG.
  • the lower lens portion 12 protrudes toward the molding surface side of the lower resin portion 103 while having the concave second optical surface 12a.
  • the lower lens portion 12 protrudes from the base portion 200a on the base side (lower side in the drawing) of the first spacer plate 200.
  • the lower flange portion 16 constitutes a lower portion of the flange 10b.
  • the lower flange portion 16 has a second flange surface 12b as shown in FIG.
  • the second optical surface 12a and the second flange surface 12b form a second molding surface 103a that is collectively molded by transfer.
  • the thickness of the upper resin part 102 at the cutting position is, for example, 0.01 mm or more and 0.3 mm or less.
  • the photocurable resin used for the lower resin portion 103 is the same as the photocurable resin of the upper resin portion 102. However, it is not necessary to form both the resin parts 102 and 103 with the same photocurable resin, and it can form with another photocurable resin.
  • the second wafer lens 300 has a disk shape, for example, and includes a substrate 301, an upper resin portion 302 (second resin portion), and a lower resin portion 303.
  • the configuration of the second wafer lens 300 is substantially the same as the configuration of the first wafer lens 100.
  • a large number of second compound lenses 20 are formed as optical elements constituting the second lens, and are secondarily arranged along the XY plane.
  • the second compound lens 20 includes a lens body 20a that forms an optical surface, and a flange 20b that exists around the lens body 20a.
  • the lens body 20 a and the flange 20 b include not only a part of the upper and lower resin parts 302 and 303 but also a part of the substrate 301.
  • the upper lens part 11 (second lens part) constitutes the upper part of the lens body 20a of the second compound lens 20, and the lower lens part 12 constitutes the lower part of the lens body 20a.
  • the upper lens portion 11 has a convex shape, for example, and has a concave aspherical first optical surface 21a as shown in FIG.
  • the lower lens portion 12 has a convex shape, for example, and has a concave aspherical second optical surface 22a as shown in FIG.
  • the upper flange portion 15 constitutes the upper portion of the flange 20b of the second compound lens 20, and the lower flange portion 16 constitutes the lower portion of the flange 20b. As shown in FIG. 15, the upper flange portion 15 has a first flange surface 21b, and the lower flange portion 16 has a second flange portion 22b.
  • the upper and lower lens portions 11 and 12 constituting the first and second wafer lenses 100 and 300 are separated in units of the first and second compound lenses 10 and 20 including the element region.
  • a plurality of lens units 800 can be obtained.
  • the first spacer plate 200 functions as a support portion for the first wafer lens 100.
  • the first spacer plate 200 is a flat plate member made of glass, ceramics, resin, or the like, and has holes formed in an array corresponding to the first compound lens 10.
  • the first spacer plate 200 is divided into a plurality of spacers 10c by dicing.
  • Each spacer 10c has a cylindrical support 6a and an opening 6b having a circular cross section.
  • the opening 6b extends along the optical axis OA so as to pass the optical axis OA parallel to the Z-axis of the lens body 10a.
  • the opening 6 b is formed by the edge portion S facing the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300.
  • the edge portion S is an inner portion of a hole formed in the first spacer plate 200.
  • the edge portion S is formed in a substantially circular shape so as to surround the outer shapes of the upper and lower lens portions 11 and 12.
  • the support 6a is fixed to a flange 10b around the lens body 10a while avoiding the lens body 10a. That is, an appropriate gap is formed between the opening 6b and the lens body 10a.
  • the edge portion S of the opening 6b opens from one end face of the first spacer plate 200 on the base side (upper side in the drawing) 206a and the other end face on the front end side (lower side in the drawing) 206b. Both side taper surfaces TP that narrow toward the center side in the thickness direction (Z direction in the drawing) of the portion 6b are formed.
  • the tip end position of the projection 91 located on the innermost side of the opening 6b is formed at the approximate center in the thickness direction.
  • An end surface 206a on the base side (upper side in the drawing) of the support 6a is bonded to the second flange surface 12b on the lower side in the drawing via an adhesive 81a. That is, the base portion 200a of the first spacer plate 200 is bonded to the substrate 101 via the upper resin portion 102, that is, indirectly.
  • an end surface 206b on the front end side (lower side of the drawing) of the first spacer plate 200 is formed on the first flange surface 21b on the upper side of the drawing of the second compound lens 20 constituting the second wafer lens 300 via the adhesive 81b. It is glued. That is, the base portion 200 b of the first spacer plate 200 is indirectly bonded to the substrate 301. Thus, the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300 protrude into the opening 6b at the position of the corresponding opening 6b in the first spacer plate 200. It will be.
  • the tapered surfaces TP on both sides are formed so as to maintain a certain gap with the lens portions 11 and 12, so that the support 6a of the first spacer plate 200 and the lens portions 11 and 12 do not interfere with each other.
  • the distances d1 and d2 with the outer edge portions 61c and 61d of the portions protruding from the respective sides are 0 or more, and the edge portion S of the opening 6b keeps a predetermined distance from the upper and lower lens portions 11 and 12.
  • the inclination angle ⁇ of the tapered surfaces TP on both sides is 0 ° ⁇ ⁇ 45 ° with respect to the thickness direction of the first spacer plate 200.
  • the gap between the convex upper and lower lens portions 11 and 12 and the both side tapered surfaces TP needs to be adjusted more strictly than when the lens portion is concave.
  • the first spacer plate 200 may not be attached to the first and second wafer lenses 100 and 300 with higher accuracy than when the lens portion has a concave shape.
  • the first spacer plate 200 and the spacer 10c obtained therefrom are members for adjusting the distance between the first wafer lens 100 and the second wafer lens 300, and the two first and second composites that constitute the imaging device 700. It has a role of adjusting the distance between the lenses 10 and 20.
  • the support 6a is made of a light-shielding material or has a light-shielding coating applied to the inner surface of the opening or the like, and also serves as an optical diaphragm.
  • the second spacer plate 400 functions as a support portion for the second wafer lens 300.
  • the second spacer plate 400 has the same configuration as the first spacer plate 200.
  • the second spacer plate 400 is divided into a plurality of spacers 20c by dicing.
  • the end surface 406a on the base side of the support 6a of the second spacer plate 400 is bonded to the second flange surface 22b on the lower side of the drawing of the second compound lens 20 constituting the second wafer lens 300 via an adhesive 81c. ing. That is, the base 400 a on the base side of the second spacer plate 400 is indirectly bonded to the substrate 301.
  • the second spacer plate 400 and the spacer 20 c are members for adjusting the distance between the second wafer lens 300 and the image sensor array 500, and are between the second compound lens 20 and the image sensor 530 constituting the image pickup apparatus 700. It has a role to adjust the distance.
  • the thickness of the first spacer plate 200 is set to a value that appropriately maintains the distance between the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300.
  • the thickness of the second spacer plate 400 is set to a value that appropriately maintains the distance between the lower lens portion 12 of the second wafer lens 300 and the image sensor 530 of the image sensor array 500.
  • the specific thickness of the first and second spacer plates 200 and 400 depends on the optical characteristics of the upper and lower lens portions 11 and 12, the performance of the image sensor 530, the functions and applications required for the imaging lens, and the like. However, generally 0.1 mm or more and 0.8 mm or less are preferable, and 0.2 mm or more and 0.6 mm or less are more preferable. When the thickness is 0.1 mm or more, handling is easy, stress relaxation is high, and failures such as peeling and cracking are unlikely to occur. Moreover, it is preferable that it is 0.8 mm or less because the transmittance is high.
  • Specific materials of the first and second spacer plates 200 and 400 are soft glass, resin, organic-inorganic hybrid material, and the like, and are not particularly limited. However, heat-resistant resin or heat-resistant organic-inorganic hybrid is used. Good material. As the organic / inorganic hybrid material, heat-resistant glass fiber reinforced resin, filler reinforced resin, organic-silica hybrid, and the like are preferable. In particular, an organic silica-hybrid is preferable. Among them, an epoxy resin-silica hybrid and an acrylic-silica hybrid are preferable because they have good adhesion to the upper and lower resin portions 102 and 103.
  • the openings 6b of the first and second spacer plates 200 and 400 are formed by, for example, etching or blasting.
  • etching or blasting For example, wet etching or the like is used as the etching method, and microblasting or the like is used as the blasting method.
  • the lens unit 800 and the imaging device 700 will be described with reference to FIG.
  • the imaging device 700 includes a lens unit 800 and an imaging element 530.
  • the lens unit 800 includes a first compound lens 10, a first spacer 10c, a second compound lens 20, and a second spacer 20c.
  • the first compound lens 10 includes the upper lens portion 11, the lower lens portion 12, and the flat plate portion 13 sandwiched therebetween.
  • the flat plate portion 13 is a portion obtained by cutting out the substrate 101. That is, the first compound lens 10 is a lens that is cut into individual pieces after forming a plurality of resin upper and lower lens portions 11 and 12 on the substrate 101 (the same applies to the second compound lens 20). .
  • the shapes of the upper and lower lens portions 11 and 12 may be the same or different.
  • the second compound lens 20 includes an upper lens unit 11, a lower lens unit 12, and a flat plate unit 13 sandwiched therebetween.
  • the first spacer 10 c is provided between the first compound lens 10 and the second compound lens 20.
  • the second spacer 20 c is provided between the second compound lens 20 and the image sensor 530.
  • the first and second spacers 10c and 20c have openings 6b corresponding to the upper and lower lens portions 11 and 12, respectively.
  • a double-sided tapered surface TP that narrows toward the center in the thickness direction of the first and second spacers 10c and 20c is formed at the edge portion S of the opening 6b. In the cross section in the thickness direction of the opening 6b (edge portion S), the tip position of the protrusion 91 is formed at the approximate center in the thickness direction.
  • the imaging device 700 has a rectangular outline when viewed from the optical axis OA direction. Note that the imaging device 700 is housed in, for example, a separately prepared holder and bonded to the imaging circuit board as an imaging lens.
  • the manufacturing method of the first spacer plate 200 is the same as that described in the first embodiment (see FIGS. 4A to 4D), and thus the description thereof is omitted.
  • the method for producing the second spacer plate 400 is the same as that for the first spacer plate 200.
  • a master mold 30 (see FIG. 9A) corresponding to the final shape of the upper resin portion 102 is manufactured by grinding or the like.
  • a resin material 41b is applied on the master die 30, and ultraviolet rays are irradiated by a UV generator (not shown) while pressing the sub-master substrate 42 from above the master die 30, and the resin material 41b sandwiched therebetween is applied. Light cure.
  • the first transfer surface 31 of the master mold 30 is transferred to the resin material 41b, and the second transfer surface 43 (second optical transfer surface and second flange transfer surface) is formed on the resin material 41b.
  • the sub master molding part 41 is formed.
  • the second transfer surface 43 may be further formed in an array by changing the transfer position on the sub-master substrate 42 and repeating the sub-master type curing step in this step and the sub-master type release step in the next step. .
  • the sub-master mold 40 is manufactured by releasing the sub-master molding part 41 and the sub-master substrate 42 integrally from the master mold 30.
  • a release agent may be applied on the second transfer surface 43 of the sub master molding unit 41.
  • the sub-master mold 50 is manufactured using the sub-master mold 40 obtained in the above process.
  • a resin material 51b is applied on the sub master mold 40, and UV light is irradiated by a UV generator (not shown) while pressing the sub sub master substrate 52 from above the sub master mold 40.
  • the resin material 51b sandwiched between the layers is photocured.
  • the second transfer surface 43 of the sub master mold 40 is transferred to the resin material 51b, and a third transfer surface 53 (a third optical transfer surface and a third flange transfer surface) is formed on the resin material 51b.
  • the sub-submaster molding part 51 is formed.
  • the sub-submaster mold 50 is manufactured by separating the sub-submaster molding part 51 and the sub-submaster substrate 52 as a single unit from the submaster mold 40. Note that a release agent may be applied on the third transfer surface 53 of the sub-submaster molding unit 51.
  • the wafer lens 100 is manufactured using the sub-submaster mold 50 obtained in the above process.
  • a resin material 102b (a photocurable resin that forms the upper resin portion 102) is applied onto the sub-sub master mold 50, and the substrate 101 is pressed from above the sub-sub master mold 50, not shown.
  • the ultraviolet ray is irradiated by the UV generator and the resin material 102b sandwiched therebetween is photocured.
  • the third transfer surface 53 of the sub-submaster mold 50 is transferred to the resin material 102b, and the first molding surface 102a (the first optical surface 11a and the first flange surface 11b in FIG. 15) is formed on the resin material 102b. .
  • the upper resin part 102 is formed.
  • the other sub-master master 150 having the same structure as that of the sub-sub master mold 50 but having a different transfer surface is used to perform the other process of the substrate 101 in the same process as described above.
  • the lower resin portion 103 is formed on the surface 101b.
  • the pair of sub-sub master molds 50 and 150 are separated to release the substrate 101 and the upper and lower resin portions 102 and 103 as a single unit.
  • the first wafer lens 100 is manufactured.
  • the second wafer lens 300 is similarly manufactured.
  • a sheet-shaped or wafer-shaped first spacer plate 200 is attached to the lower resin portion 103 of the first wafer lens 100.
  • the adhesive 81 a is applied to one side of the first spacer plate 200 or the first wafer lens 100.
  • the first spacer plate 200 or the first wafer lens 100 is aligned with respect to the substrate 101 or the lower resin portion 103, and the bonding surface of the first spacer plate 200, that is, the end surface 206 a on the root side, is the surface of the lower resin portion 103.
  • the adhesive is cured by irradiating it with UV light.
  • the second spacer plate 400 is attached to the second wafer lens 300 using the adhesive 81c in the same process as the above process.
  • the second spacer plate 400 may be attached to the second wafer lens 300 after the first spacer plate 200 and the second wafer lens 300 are attached.
  • the first wafer lens 100 with the first spacer plate 200 attached and the second wafer lens 300 with the second spacer plate 400 attached are joined to produce the array unit 600. That is, the adhesive 81b is applied to the end face 206b of the first spacer plate 200 fixed to the first wafer lens 100 or the second wafer lens 300, and is bonded to the second wafer lens 300 or the first spacer plate 200. Irradiate with UV light. Accordingly, the second wafer lens 300 is fixed or bonded to the first wafer lens 100 via the first spacer plate 200. Next, the image sensor array 500 is attached to the second wafer lens 300 on the opposite side of the first wafer lens 100.
  • the adhesive 81d is applied to the end face of the second spacer plate 400 fixed to the second wafer lens 300, and is bonded to the image pickup device array 500 to irradiate UV light.
  • the imaging element array 500 is fixed or bonded to the second wafer lens 300 via the second spacer plate 400.
  • the laminated structure 1000 in which the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500 are laminated is completed.
  • the first and second wafer lenses 100, 300, etc. are cut, that is, diced, along the cut line DX shown in FIGS.
  • the first and second wafer lenses 100, 300, etc. are cut out into a quadrangular prism shape to form an imaging device 700 having a structure in which the first and second compound lenses 10, 20, etc. are stacked.
  • the laminated structure 1000 has been described as including the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500.
  • the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 may be used.
  • the laminated structure 1000 is constituted by the array unit 600 in which the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 are laminated.
  • Such an array unit 600 can be separated into pieces by dicing and joined to an individual image pickup device 530 separately manufactured.
  • the imaging element array 500 is included in the stacked structure 1000, but the imaging element array 500 may be omitted and the array unit 600 may be configured.
  • the upper and lower lens portions 11 and 12 as lens portions are the first and second spacer plates 200 and 400 (first and second in the case of a lens unit).
  • the second spacers 10c, 20c protrude from the base portions 200a, 200b, 400a, the stacked first and second wafer lenses 100, 300 (in the case of a lens unit, the first and second compound lenses 10, 20).
  • the edge portion S opening 6b which is the inner portion of the holes of the first and second spacer plates 200, 400.
  • the area of the support surface of the spacer plate can be increased or the spacer plate can be made thicker.
  • Ku can also improve the strength of the first and second spacer plates 200, 400 and. Thereby, it can prevent that the thickness of the whole lens unit 800 becomes large.
  • a spacer plate that is not provided with a tapered surface or one of the spacer plates when a hole is drilled with the same inner diameter, a spacer plate that is not provided with a tapered surface or one of the spacer plates. The strength of the spacer plate can be increased as compared with the case where the tapered surface is provided only from the end surface side.
  • the spacer plate provided with no tapered surface or the spacer plate provided with the tapered surface only from one end surface In comparison, the first and second spacer plates 200 and 400 are removed from the first and second spacer plates 200 and 400 while avoiding interference with the upper and lower lens portions 11 and 12 without increasing the hole diameter.
  • the cut-out portion can be reduced. Therefore, the strength of the first and second spacer plates 200 and 400 can be improved.
  • the spacer plate may be damaged or peeled off.
  • the strength can be increased by inserting the first and second spacer plates 200, 400 with the tapered surfaces TP on both sides. Further, for example, in the case of a multi-piece lens unit 800, the number of holes in the first and second spacer plates 200 and 400 is also increased, so that the strength of the first and second spacer plates 200 and 400 is improved. 800 mass production is possible.
  • the hole diameter of the spacer plate is increased to allow a sufficient clearance between the shape of the lens portion and the spacer plate (clearance)
  • the ratio of the area of the hole occupying the spacer plate increases and the strength decreases.
  • the number of holes in the spacer plate is also increased, which raises further concerns regarding strength.
  • the pitch of the lens portions and the pitch of the holes in the spacer plate are increased, the number of lens units is reduced and mass production cannot be performed.
  • the optical surface is formed by applying resin on the substrate, and the thickness of the substrate does not depend on the thickness of the lens portion. Therefore, there is an advantage that a large amount of lens parts (upper and lower lens parts 11 and 12) can be formed on the substrate 101.
  • a convex portion (protrusion) made of resin always occurs on the substrate.
  • the lens unit 800 is entirely formed by providing resin on the substrate 101 by forming both side tapered surfaces TP in the openings 6b of the first and second spacer plates 200 and 400, the entire lens unit 800 is formed.
  • the lens portions (upper and lower lens portions 11 and 12) and the first and second spacer plates 200 and 400 can be arranged with high accuracy while suppressing the thickness.
  • the upper resin portions 102 and 302 and the lower resin portions 103 and 303 are provided with substrates 101 and 301, respectively.
  • Upper and lower lens portions 11 and 12 are independently arranged on the upper side. That is, the lens units 11 and 12 are not connected to the adjacent lens units 11 and 12, and the substrates 101 and 301 are exposed between the lens units 11 and 12.
  • End surfaces 206a, 206b, and 406a of the support 6a are bonded to the substrates 101 and 301 via adhesives 81a, 81b, and 81c, respectively. That is, the base portions 200a, 200b, and 400a of the first and second spacer plates 200 and 400 are directly bonded to the substrates 101 and 301, respectively, without using a resin.
  • the manufacturing process of the first wafer lens 100 of this embodiment is the same as that described in the first embodiment (see FIGS. 5A to 5E).
  • the upper and lower resin portions 102, 103, 302, and 303 of the first and second wafer lenses 100 of the present embodiment are formed by an individual dropping method.
  • the manufacturing process of the second wafer lens 300 is the same as the manufacturing process of the first wafer lens 100.
  • a sub-master die 40 is produced using the master die 30.
  • the resin material 41 b is individually dropped onto the transfer surface corresponding to each upper lens portion 11 of the first transfer surface 31 of the master mold 30.
  • the sub master substrate 42 is pressed against the master mold 30 through the resin material 41b.
  • the sub-master mold 40 is released from the master mold 30 as shown in FIG. 5B.
  • a sub-sub master mold 50 is manufactured using the manufactured sub-master mold 40.
  • the resin material 51b is individually dropped onto the transfer surface corresponding to each upper lens portion 11 of the second transfer surface 43 of the sub master mold 40.
  • the sub-master substrate 52 is pressed against the sub-master mold 40 through the resin material 51b.
  • the sub-sub master mold 50 is released from the sub-master mold 40 as shown in FIG. 5D.
  • the first wafer lens 100 is manufactured using the manufactured sub-submaster mold 50.
  • the resin material 102 b is individually dropped on the transfer surface corresponding to each upper lens portion 11 of the third transfer surface 53 of the sub-submaster mold 50.
  • the substrate 101 is pressed against the sub-sub master mold 50 through the resin material 102b.
  • the resin material 102b is cured, the substrate 101 and the upper resin portion 102 are integrally released from the sub-sub master mold 50.
  • FIG. 18B an imaging device 700 including the lens unit 800 is obtained.
  • the upper and lower resin portions 102, 103 and the like are cut in the multi-piece individual dropping type lens unit 800 as compared with the whole dropping type lens unit.
  • the lens accuracy can be improved from the point that it is not necessary.
  • the outermost shape of the upper and lower lens portions 11 and 12 with respect to the third transfer surface 53 and the like for forming all the upper and lower lens portions 11 and 12 is accurately reflected between shots. Difficult to control.
  • the hole diameter of the spacer plate ensures the gap (clearance) between the lens part and the inside of the opening. If the inner diameter of the opening is widened, the strength of the spacer plate is reduced by that amount. There are concerns about strength such as the spacer plate being damaged in the step of laminating the spacer, the step of cutting the laminated structure, and the like. Therefore, by providing both side tapered surfaces TP on the first and second spacer plates 200 and 400, the upper and lower lens portions 11 and 12 and the first and second spacer plates 200 and 400 can escape so as not to interfere with each other. While making, the thickness between the openings 6b of the first and second spacer plates 200, 400, that is, the thickness of the support 6a can be increased, and the strength of the first and second spacer plates 200, 400 is improved. be able to.
  • the laminated structure according to the seventh embodiment will be described.
  • the structure and manufacturing method of the laminated structure of the seventh embodiment is a modification of the structure and manufacturing method of the laminated structure of the fifth or sixth embodiment, and parts that are not particularly described are the fifth embodiment and the like. It shall be the same.
  • the protruding adhesive 81 b slightly adheres to the both-side tapered surfaces TP in the vicinity of the end surface 206 b on the tip side of the opening 6 b in the both-side tapered surfaces TP of the first spacer plate 200.
  • the adhesive 81b sandwiched between the first spacer plate 200 and the second wafer lens 300 protrudes from the first spacer plate 200 support 6a and is tapered on both sides.
  • the strength of the first spacer plate 200 and the adhesive strength between the first spacer plate 200 and the second wafer lens 300 can be further improved.
  • the adhesive 81b not only the adhesive 81b but also the adhesive 81a between the first wafer lens 100 and the first spacer plate 200, or the adhesion between the second wafer lens 300 and the second spacer plate 400.
  • the agent 81c may protrude from the support 6a of the first or second spacer plate 200, 400.
  • portions of the upper and lower lens portions 11 and 12 that protrude from the base portions 200a, 200b, and 400a of the first and second spacer plates 200 and 400 are openings of the first and second spacer plates 200 and 400. When it is close to the edge of the portion 6b, the strength is further increased.
  • the laminated structure 1000 includes a first wafer lens 100, a first spacer plate 200, a second wafer lens 300, a second spacer plate 400, and an imaging element array 500. Laminated in the Z-axis direction.
  • an imaging device 700 in which the lens unit 800 and the imaging element 530 are laminated can be obtained.
  • the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500 each extend in parallel to the XY plane and have a laminated structure.
  • the entire body 1000 also extends parallel to the XY plane.
  • a laminate of the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 is referred to as an array unit 600 for convenience in this specification. Included in wafer lens.
  • the first wafer lens 100 in the laminated structure 1000 has, for example, a disk shape, and includes a substrate 101, an upper resin portion 102, and a lower resin portion 103.
  • the upper and lower resin portions 102 and 103 are bonded to the substrate 101 in alignment with each other with respect to translation in the XY plane perpendicular to the axis AX and rotation around the axis AX.
  • a large number of first compound lenses 10 are formed as optical elements constituting them, and are secondarily arranged along the XY plane. That is, the first wafer lens 100 is a group of a plurality of first compound lenses 10 before cutting (the same applies to the second wafer lens 300).
  • the first compound lens 10 includes a lens body 10a that forms an optical surface, and a flange 10b that exists around the lens body 10a.
  • the substrate 101 of the first wafer lens 100 is a flat plate extending over the entire first wafer lens 100, and is formed of, for example, glass.
  • the thickness of the substrate 101 is basically determined by optical specifications, but is such a thickness that the first wafer lens 100 is not damaged when the first wafer lens 100 is released.
  • the substrate 101 constitutes the center portion of the lens body 10a of the first compound lens 10 and the flange 10b.
  • the substrate 101 has a first flange surface 11b and a second flange surface 12b on surfaces 101a and 101b corresponding to the flange 10b, respectively.
  • As the material of the substrate 101 a glass, a thermosetting resin, a photocurable resin, a thermoplastic resin, or the like can be used, and glass is particularly preferable.
  • substrate 101 is based also on a use, it shall be 0.2 mm or more and 1.5 mm or less, for example.
  • the upper resin portion 102 is made of resin and is formed on one surface 101 a of the substrate 101.
  • the upper resin part 102 has a plurality of upper lens parts 11. That is, the upper resin portion 102 refers to the entire resin portion including the upper lens portion 11 formed on the substrate 101 before the first wafer lens 100 is cut (the same applies to the lower lens portion 12).
  • Each upper lens portion 11 constitutes an upper portion of the lens body 10 a of the first compound lens 10.
  • Each upper lens unit 11 is two-dimensionally arranged in the XY plane on the substrate 101.
  • each upper lens portion 11 is independently arranged on the substrate 101. That is, each upper lens portion 11 is not connected to the adjacent upper lens portion 11 by resin, and the substrate 101 is exposed between the upper lens portions 11.
  • the upper lens unit 11 has, for example, a convex shape, and has a convex aspherical first optical surface 11a and a first non-optical surface 11c as shown in FIG.
  • the first optical surface 11a and the first non-optical surface 11c serve as a first molding surface 102a that is collectively molded by transfer.
  • the first optical surface 11a has an effective area AR1 (an optically effective area of the lens), and the first non-optical surface 11c has an ineffective area AR2 (an area that does not affect the optical function of the lens).
  • the upper resin portion 102 is made of a photocurable resin.
  • the photocurable resin contains a photopolymerization initiator that initiates polymerization of the photocurable resin.
  • a photocurable resin an acrylic resin, an allyl ester resin, an epoxy resin, a vinyl resin, or the like can be used.
  • acrylic resin, allyl ester resin, or vinyl resin it can be cured by reaction, for example, by radical polymerization of a photopolymerization initiator, and when epoxy resin is used, it is reacted by, for example, cationic polymerization of a photopolymerization initiator. It can be cured.
  • the lower resin portion 103 is made of resin, like the upper resin portion 102, and is formed on the other surface 101b of the substrate 101.
  • the lower resin portion 103 has a plurality of lower lens portions 12.
  • Each lower lens portion 12 constitutes a lower portion of the lens body 10 a of the first compound lens 10.
  • the lower lens portions 12 are two-dimensionally arranged in the XY plane on the substrate 101.
  • the position of each lower lens portion 12 corresponds to the position of each upper lens portion 11 on the opposite side of the substrate 101.
  • each lower lens portion 12 is independently arranged on the substrate 101. That is, each lower lens portion 12 is not connected to the adjacent lower lens portion 12 by resin, and the substrate 101 is exposed between the lower lens portions 12.
  • the lower lens portion 12 has, for example, a convex shape, and has a concave aspherical second optical surface 12a and a second non-optical surface 12c as shown in FIG.
  • the lower lens portion 12 has a concave second optical surface 12a and protrudes from the base portion 200a on the base side (upper part of the drawing) of the first spacer plate 200.
  • the second optical surface 12a and the second non-optical surface 12c are first molding surfaces 103a that are collectively molded by transfer.
  • the second optical surface 12a has an effective area AR3 (an optically effective area of the lens), and the second non-optical surface 12c has an ineffective area AR4 (an area that does not affect the optical function of the lens).
  • the photocurable resin used for the lower resin portion 103 is the same as the photocurable resin of the upper resin portion 102. However, it is not necessary to form both the resin parts 102 and 103 with the same photocurable resin, and it can form with another photocurable resin.
  • the second wafer lens 300 is, for example, a disk shape, and includes a substrate 301, an upper resin portion 302, and a lower resin portion 303.
  • the configuration of the second wafer lens 300 is substantially the same as the configuration of the first wafer lens 100.
  • a large number of second compound lenses 20 are formed as optical elements constituting the second lens, and are secondarily arranged along the XY plane.
  • the second compound lens 20 includes a lens body 20a that forms an optical surface, and a flange 20b that exists around the lens body 20a.
  • the upper lens part 11 constitutes the upper part of the lens body 20a of the second compound lens 20, and the lower lens part 12 constitutes the lower part of the lens body 20a.
  • the upper lens unit 11 has, for example, a convex shape, and includes a concave aspherical first optical surface 21a and a first non-optical surface 21c as shown in FIG. Have.
  • the lower lens portion 12 has, for example, a convex shape, and has a concave aspherical second optical surface 22a and a second non-optical surface 22c as shown in FIG.
  • the substrate 301 has a first flange surface 21b and a second flange surface 22b on the surfaces 101a and 101b corresponding to the flange 20b.
  • the upper and lower lens portions 11 and 12 constituting the first and second wafer lenses 100 and 300 are separated in units of the first and second compound lenses 10 and 20 including the element region.
  • a plurality of lens units 800 can be obtained.
  • the first spacer plate 200 functions as a support portion for the first wafer lens 100.
  • the first spacer plate 200 is a flat plate member made of glass, ceramics, resin, or the like, and has holes formed in an array corresponding to the first compound lens 10.
  • the side on which light is incident (the end surface 206a side on the root side) is the front side
  • the side on which the light is emitted is the back side.
  • the first spacer plate 200 is divided into a plurality of spacers 10c by dicing. Each spacer 10c has a cylindrical support 6a and an opening 6b having a circular cross section.
  • the opening 6b extends along the optical axis OA so as to pass the optical axis OA parallel to the Z-axis of the lens body 10a.
  • the opening 6 b is formed by the edge portion S facing the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300.
  • the edge portion S is an inner portion of a hole formed in the first spacer plate 200.
  • the edge portion S is formed in a substantially circular shape so as to surround the outer shapes of the upper and lower lens portions 11 and 12.
  • the inner diameter D1 of the entrance on the base end face 206a side is larger than the inner diameter D2 of the entrance on the end face 206b side.
  • the support 6a is fixed to a flange 10b around the lens body 10a while avoiding the lens body 10a. That is, an appropriate gap is formed between the opening 6b and the lens body 10a.
  • the edge portion S of the opening 6b opens from one end face of the first spacer plate 200 on the base side (upper side in the drawing) 206a and the other end face on the front end side (lower side in the drawing) 206b. Both side taper surfaces TP that narrow toward the center side in the thickness direction (Z direction in the drawing) of the portion 6b are formed.
  • the tip position of the projection 91 located on the innermost side of the opening 6b is formed on the end face 206b side on the tip side from the center.
  • the height h1 in the thickness direction from the end face 206a on the base side of the support 6a to the protrusion 91 is larger than the height h2 in the thickness direction from the end face 206b on the tip side of the support 6a to the protrusion 91.
  • the positions of the protrusions 91 are determined so that the support 6a of the first spacer plate 200 and the upper and lower lens portions 11 and 12 do not interfere with each other in consideration of the shapes of the upper and lower lens portions 11 and 12. Is set.
  • the distances d1 and d2 with the outer edge portions 61c and 61d of the protruding portion are 0 or more, and the edge portion S of the opening 6b can keep a predetermined distance from the upper and lower lens portions 11 and 12. The distance is about.
  • the inclination angles ⁇ 1 and ⁇ 2 of the tapered surfaces TP on both sides are 0 ° ⁇ ⁇ 45 ° with respect to the thickness direction of the first spacer plate 200, respectively.
  • the gap between the convex upper and lower lens portions 11 and 12 and the tapered surfaces TP on both sides needs to be adjusted more strictly than in the case where the lens portion is concave.
  • the first spacer plate 200 may not be attached to the first and second wafer lenses 100 and 300 with higher accuracy than when the lens portion has a concave shape.
  • the end surface 206a on the base side (upper side of the drawing) of the support 6a is bonded to the second flange surface 12b (the other surface 101b of the substrate 101) on the lower side of the drawing via an adhesive 81a. That is, the base portion 200a of the first spacer plate 200 is directly bonded to the substrate 101 without using a resin. Further, the end surface 206b on the front end side (lower side of the drawing) of the first spacer plate 200 is a first flange surface 21b (upper side of the drawing) of the second compound lens 20 constituting the second wafer lens 300 via the adhesive 81b. Bonded to one surface 101a) of the substrate 301.
  • the base portion 200b of the first spacer plate 200 is directly bonded to the substrate 301 without using a resin.
  • the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300 protrude into the opening 6b at the position of the corresponding opening 6b in the first spacer plate 200. It will be.
  • the first spacer plate 200 and the spacer 10c obtained therefrom are members for adjusting the distance between the first wafer lens 100 and the second wafer lens 300, and the two first and second composites that constitute the imaging device 700. It has a role of adjusting the distance between the lenses 10 and 20.
  • the support 6a is made of a light-shielding material or has a light-shielding coating applied to the inner surface of the opening or the like, and also serves as an optical diaphragm.
  • the second spacer plate 400 functions as a support portion for the second wafer lens 300.
  • the second spacer plate 400 has the same configuration as the first spacer plate 200.
  • the second spacer plate 400 is divided into a plurality of spacers 20c by dicing.
  • the end surface 406a on the base side of the support 6a of the second spacer plate 400 is bonded to the second flange surface 22b on the lower side of the drawing of the second compound lens 20 constituting the second wafer lens 300 via an adhesive 81c. ing. That is, the base 400a of the second spacer plate 400 is directly bonded to the substrate 301 without using a resin.
  • the end surface 406b on the front end side of the second spacer plate 400 is bonded to the imaging element array 500 via an adhesive 81d.
  • the inner diameters of the front and back openings 6b are substantially the same.
  • the tip end position of the protrusion 92 is formed at the approximate center in the thickness direction.
  • the second spacer plate 400 and the spacer 20 c are members for adjusting the distance between the second wafer lens 300 and the image sensor array 500, and are between the second compound lens 20 and the image sensor 530 constituting the image pickup apparatus 700. It has a role to adjust the distance.
  • the thickness of the first spacer plate 200 is set to a value that appropriately maintains the distance between the lower lens portion 12 of the first wafer lens 100 and the upper lens portion 11 of the second wafer lens 300.
  • the thickness of the second spacer plate 400 is set to a value that appropriately maintains the distance between the lower lens portion 12 of the second wafer lens 300 and the image sensor 530 of the image sensor array 500.
  • the specific thickness of the first and second spacer plates 200 and 400 depends on the optical characteristics of the upper and lower lens portions 11 and 12, the performance of the image sensor 530, the functions and applications required for the imaging lens, and the like. However, generally 0.1 mm or more and 0.8 mm or less are preferable, and 0.2 mm or more and 0.6 mm or less are more preferable. When the thickness is 0.1 mm or more, handling is easy, stress relaxation is high, and failures such as peeling and cracking are unlikely to occur. Moreover, it is preferable that it is 0.8 mm or less because the transmittance is high.
  • Specific materials of the first and second spacer plates 200 and 400 are soft glass, resin, organic-inorganic hybrid material, and the like, and are not particularly limited. However, heat-resistant resin or heat-resistant organic-inorganic hybrid is used. Good material. As the organic / inorganic hybrid material, heat-resistant glass fiber reinforced resin, filler reinforced resin, organic-silica hybrid, and the like are preferable. In particular, an organic silica-hybrid is preferable. Among them, an epoxy resin-silica hybrid and an acrylic-silica hybrid are preferable because they have good adhesion to the upper and lower resin portions 102 and 103.
  • the openings 6b of the first and second spacer plates 200 and 400 are formed by, for example, etching or blasting.
  • etching or blasting For example, wet etching or the like is used as the etching method, and microblasting or the like is used as the blasting method.
  • the lens unit 800 and the imaging device 700 will be described with reference to FIG.
  • the imaging device 700 includes a lens unit 800 and an imaging element 530.
  • the lens unit 800 includes a first compound lens 10, a first spacer 10c, a second compound lens 20, and a second spacer 20c.
  • the first compound lens 10 includes the upper lens portion 11, the lower lens portion 12, and the flat plate portion 13 sandwiched therebetween.
  • the flat plate portion 13 is a portion obtained by cutting out the substrate 101. That is, the first compound lens 10 is a lens that is cut into individual pieces after forming a plurality of resin upper and lower lens portions 11 and 12 on the substrate 101 (the same applies to the second compound lens 20). .
  • the shapes of the upper and lower lens portions 11 and 12 may be the same or different.
  • the second compound lens 20 includes an upper lens unit 11, a lower lens unit 12, and a flat plate unit 13 sandwiched therebetween.
  • the first spacer 10 c is provided between the first compound lens 10 and the second compound lens 20.
  • the second spacer 20 c is provided between the second compound lens 20 and the image sensor 530.
  • the first and second spacers 10c and 20c have openings 6b corresponding to the upper and lower lens portions 11 and 12, respectively.
  • the entrance of the opening 6b is different between the end face 206a side on the root side and the end face 206b side on the tip side.
  • the inner diameter D1 of the entrance of the opening 6b facing the lower lens portion 12 of the first wafer lens 100 having a large outer dimension is an opening facing the upper lens portion 11 of the second wafer lens 300 having a smaller outer dimension. It is larger than the inner diameter D2 of the entrance of 6b.
  • a double-sided tapered surface TP that narrows toward the center in the thickness direction of the first and second spacers 10c and 20c is formed at the edge portion S of the opening 6b.
  • the tip position of the protrusion 91 is formed closer to the end surface 206b.
  • the tip position of the protrusion 92 is formed at the approximate center in the thickness direction.
  • the imaging device 700 has a rectangular outline when viewed from the optical axis OA direction. Note that the imaging device 700 is housed in, for example, a separately prepared holder and bonded to the imaging circuit board as an imaging lens.
  • FIGS. 23A to 23D An example of a method for manufacturing the first spacer plate 200 will be described with reference to FIGS. 23A to 23D.
  • the method for producing the second spacer plate 400 is the same as that for the first spacer plate 200.
  • masks MA1 and MA2 are formed on both surfaces of a spacer substrate SS which is a material of the first and second spacer plates 200 and 400.
  • circular holes OP1 and OP2 are formed at positions corresponding to the openings 6b of the first spacer plate 200.
  • the positions of the protrusions 91 on the tapered surfaces TP on both sides are adjusted by changing the diameters of the holes OP1 and OP2 and the etching and blasting time for each surface of the spacer substrate SS.
  • the diameter x1 of the hole OP1 of the mask MA1 formed on the base-side end surface 206a of the spacer substrate SS is larger than the diameter x2 of OP2 of the mask MA2 formed on the end-side end surface 206b.
  • a material that can withstand an etching solution and a blast projectile is used. Specifically, for example, a resist, a metal mask such as stainless steel, chromium, or the like is used.
  • the spacer substrate SS on which the masks MA1 and MA2 are formed is immersed in the etching solution ES.
  • the etching solution ES For example, hydrofluoric acid or ammonium fluoride is used as the etching solution.
  • the spacer substrate SS is gradually etched from the portions where the masks MA1 and MA2 are not formed, that is, the exposed portions of both end faces 206a and 206b, and finally, as shown in FIG. 23D.
  • openings 6b having different entrance inner diameters are formed on the end faces 206a and 206b.
  • a sheet-like or wafer-like first spacer plate 200 is attached to the other surface 101b of the substrate 101 of the first wafer lens 100.
  • the adhesive 81 a is applied to one side of the first spacer plate 200 or the first wafer lens 100.
  • the first spacer plate 200 or the first wafer lens 100 is aligned with respect to the substrate 101 and the lower resin portion 103, and the bonding surface of the first spacer plate 200, that is, the end surface 206 a on the root side is used as the other surface 101 b of the substrate 101.
  • the adhesive is cured by irradiating it with UV light.
  • the second spacer plate 400 is attached to the second wafer lens 300 using the adhesive 81c in the same process as the above process.
  • the second spacer plate 400 may be attached to the second wafer lens 300 after the first spacer plate 200 and the second wafer lens 300 are attached.
  • the first wafer lens 100 having the first spacer plate 200 attached thereto and the second wafer lens 300 having the second spacer plate 400 attached thereto are joined to produce the array unit 600. That is, the adhesive 81b is applied to the end face 206b of the first spacer plate 200 fixed to the first wafer lens 100 or the second wafer lens 300, and is bonded to the second wafer lens 300 or the first spacer plate 200. Irradiate with UV light. Accordingly, the second wafer lens 300 is fixed or bonded to the first wafer lens 100 via the first spacer plate 200. Next, the image sensor array 500 is attached to the second wafer lens 300 on the opposite side of the first wafer lens 100.
  • the adhesive 81d is applied to the end face of the second spacer plate 400 fixed to the second wafer lens 300, and is bonded to the image pickup device array 500 to irradiate UV light.
  • the imaging element array 500 is fixed or bonded to the second wafer lens 300 via the second spacer plate 400.
  • the laminated structure 1000 in which the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500 are laminated is completed.
  • the first and second wafer lenses 100, 300, etc. are cut, that is, diced, along the cut line DX shown in FIGS.
  • the first and second wafer lenses 100, 300, etc. are cut out into a quadrangular prism shape to form an imaging device 700 having a structure in which the first and second compound lenses 10, 20, etc. are stacked.
  • the laminated structure 1000 has been described as including the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, the second spacer plate 400, and the imaging element array 500.
  • the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 may be used.
  • the laminated structure 1000 is constituted by the array unit 600 in which the first wafer lens 100, the first spacer plate 200, the second wafer lens 300, and the second spacer plate 400 are laminated.
  • Such an array unit 600 can be separated into pieces by dicing and joined to an individual image pickup device 530 separately manufactured.
  • the imaging element array 500 is included in the stacked structure 1000, but the imaging element array 500 may be omitted and the array unit 600 may be configured.
  • the lens unit and the array unit of the eighth embodiment described above it is necessary to avoid interference with the lower lens portion 12 of the first wafer lens 100 (first compound lens 10 in the case of a lens unit) having a large outer dimension.
  • the size of the inner diameter D1 of the opening 6b is increased according to the contour and outer shape of the lower lens portion 12, and the first spacer plate 200 (first spacer 10c in the case of a lens unit) and the lower A sufficient gap (clearance) with the side lens portion 12 can be ensured.
  • the strength of the first spacer plate 200 that can be lowered to ensure the clearance can be improved while the first spacer plate 200 corresponds to the specifications of various lens outlines and external shapes.
  • the pair of tapers in which the opening 6b of the first spacer plate 200 narrows toward the center in the thickness direction.
  • the second wafer lens 300 having a small outer dimension (a second surface in the case of a lens unit) is obtained because the inner surface of the first spacer plate 200 has a different inner diameter between the end surface 206a and the end surface 206b.
  • the strength of the first spacer plate 200 can be increased by narrowing the size of the inner diameter D2 on the upper lens portion 11 side of the compound lens 20), that is, on the end face 206b side.
  • the spacer plate when the laminated structure 1000 is cut in order to obtain the imaging device 700, if the spacer plate has insufficient strength or the like, the spacer plate may be damaged or peeled off.
  • the strength can be increased by inserting the first spacer plate 200 with tapered surfaces TP on both sides having different inner diameters D1 and D2 of the opening 6b on the front and back sides.
  • the number of holes in the spacer plate is also increased, so that the strength of the first spacer plate 200 is improved, thereby enabling mass production of the lens unit 800.
  • the lens does not need to cut the upper and lower resin portions 102 and 103, which are resin portions, as compared with the whole dripping type lens unit.
  • the accuracy can be improved.
  • the outermost shape of the upper and lower lens portions 11 and 12 with respect to the third transfer surface 53 and the like for forming all the upper and lower lens portions 11 and 12 is accurately reflected between shots. Difficult to control.
  • the hole diameter of the spacer plate ensures the gap (clearance) between the lens part and the inside of the opening. If the inner diameter of the opening is widened, the strength of the spacer plate is reduced by that amount. There are concerns about strength such as the spacer plate being damaged in the step of laminating the spacer, the step of cutting the laminated structure, and the like.
  • the first spacer plate 200 with the tapered surfaces TP on both sides having different inner diameters D1 and D2 of the front and back openings 6b, the outermost diameter portions of the upper and lower lens portions 11 and 12, the first spacer plate 200, The thickness between the holes of the first spacer plate 200 can be increased while making relief so as not to interfere with each other. Thereby, the strength of the first spacer plate 200 can be improved.
  • the optical surfaces 11a, 12a, 21a, and 22a are formed by applying resin on the substrates 101 and 301, and the thickness of the substrate is equal to the thickness of the lens portion. Is not dependent. Therefore, there is an advantage that a large amount of lens parts (upper and lower lens parts 11 and 12) can be formed on the substrate 101. However, since it is necessary to separately apply a resin on the substrate, a convex portion (protrusion) made of resin always occurs on the substrate.
  • the first spacer plate 200 with the tapered surfaces TP on both sides having different inner diameters D1 and D2 of the opening 6b on the front and back sides is provided on the opening 6b to apply the resin on the substrate 101 and perform molding.
  • the lens portions (upper and lower lens portions 11 and 12) and the first spacer plate 200 can be arranged with high accuracy while suppressing the thickness of the entire lens unit 800.
  • the upper and lower lens portions 11 and 12 are connected with resin on the substrates 101 and 301, respectively. Is formed.
  • the upper and lower flange portions 15 and 16 made of resin are formed around the upper and lower lens portions 11 and 12 made of resin. That is, the first and second flange surfaces 11b, 12b, 21b, and 22b are formed on the upper and lower resin portions 102, 103, 302, and 303, respectively.
  • the base portion 200 a on the base side of the first spacer plate 200 is indirectly bonded to the substrate 101 via the adhesive 81 a and the upper flange portion 15.
  • the thickness in the cutting position of the upper side and lower side resin parts 102, 103, 302, and 303 shall be 0.01 mm or more and 0.3 mm or less, for example.
  • the inner diameter D1 of the entrance on the root end face 206a side of the entrance of the opening 6b is smaller than the inner diameter D2 of the entrance on the end face 206b side on the distal end side.
  • the tip end position of the projection 91 located on the innermost side of the opening 6b is formed closer to the end face 206a side on the root side than the center in the thickness direction of the first spacer plate 200.
  • the height h1 in the thickness direction from the end face 206a on the base side of the support 6a to the protrusion 91 is smaller than the height h2 in the thickness direction from the end face 206b on the tip side of the support 6a to the protrusion 91.
  • the tip position of the protrusion 91 may be formed on the end face 206b side of the tip side from the center in the thickness direction of the first spacer plate 200.
  • the inner diameters of the front and back openings 6b of the other second spacer plate 400 are approximately the same size, and the tip position of the protrusion 92 is formed at the approximate center in the thickness direction.
  • the manufacturing process of the first wafer lens 100 of this embodiment is the same as that described in the first embodiment (see FIGS. 9A to 9E or FIGS. 16A and 16B), the description thereof is omitted.
  • the upper and lower resin portions 102 and 103 of the first and second wafer lenses 100 of the present embodiment are formed by an entire dropping method.
  • the manufacturing process of the second wafer lens 300 is the same as the manufacturing process of the first wafer lens 100.
  • FIG. 25B an imaging device 700 including the lens unit 800 is obtained (in FIG. 25B, the illustration of the individual imaging elements 530 from which the imaging element array 500 is separated is omitted).
  • the inner diameter D1 of the entrance on the base end face 406a among the entrances of the opening 6b is equal to the entrance on the end face 406b side on the front end side. It is larger than the inner diameter D2.
  • the tip end position of the protrusion 92 located on the innermost side of the opening 6 b is formed on the end face 406 b side on the tip side from the center in the thickness direction of the second spacer plate 400.
  • the height h1 in the thickness direction from the base end surface 406a of the support 6a to the protrusion 92 is greater than the height h2 in the thickness direction from the end surface 206b of the support 6a to the protrusion 92.
  • the tip position of the protrusion 92 may be formed closer to the end surface 406a on the side of the root than the center in the thickness direction of the second spacer plate 400.
  • the inner diameters of the opening portions 6b on the front and back sides of the other first spacer plate 200 are substantially the same size, and the tip end position of the protrusion 91 is formed at the approximate center in the thickness direction.
  • the laminated structure 1000 is diced to obtain the imaging device 700 including the lens unit 800 shown in FIG. 26B (the imaging element 530 is not shown in FIG. 26B).
  • the lens unit and the array unit of the tenth embodiment by making the inner diameter D2 of the opening 6b of the end surface 406b on the distal end side where the lens portion is not formed smaller than the end surface 406a on the root side, the end surface on the root side
  • the strength of the second spacer plate 400 can be improved while avoiding hitting the lower lens portion 12 on the 406a side.
  • the opening 6b of the first spacer plate 200 has both side tapered surfaces TP including a pair of tapered surfaces narrowing toward the center in the thickness direction, and the edge portion of the first spacer 200 Are different between the end face 206a and the end face 206b. Further, between the end face 206a on the base side of the first spacer plate 200 and the other face 101b of the substrate 101, a joint portion CE1 formed of an adhesive 81a fills the gap GA and a part of both tapered surfaces TP. It is provided so that it may adhere to.
  • the joint CE2 formed of the adhesive 81a fills the gap GA between the end surface 206b far from the base of the first spacer plate 200 and the other surface 301a of the substrate 301, and a part of both side tapered surfaces TP. It is provided so that it may adhere to. That is, the protruding portion 85 is formed in both the joint portion CE1 on the end face 206a side and the joint portion CE2 on the end face 206a side.
  • the lens unit and the like according to this embodiment have been described above, but the lens unit and the like according to the present invention are not limited to the above.
  • the shapes and sizes of the first and second optical surfaces 11a and 12a and the like can be appropriately changed according to applications and functions.
  • the first and second wafer lenses 100 and 300 do not have to be disk-shaped and can have various contours such as an ellipse.
  • the dicing process can be simplified by forming the first and second wafer lenses 100 and 300 into a square plate shape from the beginning.
  • the number of the upper and lower lens portions 11 and 12 formed in the wafer lens 100 is not limited to nine in the drawing, and may be any plural number of two or more.
  • the arrangement of the upper and lower lens portions 11 and 12 is preferably on a lattice point for convenience of dicing.
  • the interval between the adjacent upper and lower lens portions 11 and 12 is not limited to the illustrated one, and can be set as appropriate in consideration of workability and the like.
  • a diaphragm, an IR cut filter, or the like may be provided on the substrates 101 and 301.
  • first or second spacer plate 200, 400 is different in the sizes of the inner diameters D1, D2 of the front and back openings 6b, but the other second or first spacer plate. 400 and 200 may have different inner diameters of the opening 6b on the front and back sides. The first and second spacer plates 200 and 400 may have different inner diameters D1 and D2 of the opening 6b on the front and back sides.
  • the shape of the entrance of the opening 6b is circular, but may be oval or rectangular.
  • the inner diameter of the opening 6b is defined by the length of the long side of the ellipse or rectangle.
  • two or more holes formed by the edge portions S of the first and second spacer plates 200 and 400 may be continuous.
  • the position of the protruding portion 91 is provided near the end surface 206a on the base side in the thickness direction of the first spacer plate 200 or the like, but may be provided at substantially the center.
  • the roughness of the both-side tapered surface TP and the one-side tapered surface PP is made rougher than the end surfaces of the first or second spacer plates 200 and 400, but it is not necessary to make it rough.
  • the roughness of the both-side tapered surface TP and the one-side tapered surface PP is made rougher than the end surfaces of the first or second spacer plates 200 and 400, but it is not necessary to make it rough.
  • the imaging device 700 is obtained by dicing the laminated structure 1000 mainly, but the laminated structure 1000 can be used as it is without being separated.
  • a plurality of images are captured using a solid-state imaging device such as a CCD (Charged Coupled Device) type image sensor or a CMOS (Complementary Metal Oxide Semiconductor) type image sensor and a plurality of imaging lenses arranged two-dimensionally.
  • An imaging device also referred to as a lens array type imaging device that reconstructs one image from a plurality of obtained images has been proposed (see Japanese Patent Application Laid-Open No. 2007-94103).
  • the laminated structure 1000 of the above embodiment can be used.
  • the laminated structure 1000 as a lens array type imaging device can create a high-definition image by reconstructing an image obtained by each imaging lens based on parallax of a plurality of imaging lenses. For this reason, each imaging lens is not required to have very high optical performance, and as a result, it is possible to achieve a reduction in size and thickness and obtain a high-definition image.

Abstract

L'invention a pour objectif de fournir une unité de lentille qui tout en garantissant de manière adéquate un écartement entre une partie lentille et un organe d'espacement, permet d'assurer la résistance de cet organe d'espacement. Des adhésifs (81a, 81b, 81c) sont collés sur une partie d'une face effilée des deux côtés (TP) d'une première et d'une seconde plaque d'espacement (200, 400) (premier et second organe d'espacement (10c, 20c)), augmentant ainsi la surface de contact de parties de liaison (CE1, CE2, CE3) formées par les adhésifs (81a, 81b, 81c). En outre, les faces planes de substrats (101, 301) (partie plaque plane (13)) et de la première plaque d'espacement (200) sont non seulement mises en adhésion entre elles, mais une adhésion dans une plage d'un certain angle et une liaison en trois dimensions sont également possibles. Par conséquent, il est possible d'augmenter considérablement la résistance d'adhérence entre la première plaque d'espacement (200) et le substrat (101), ou similaire.
PCT/JP2012/082976 2011-12-19 2012-12-19 Unité de lentille, et unité de réseau WO2013094658A1 (fr)

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JP2011277730 2011-12-19
JP2011-277729 2011-12-19
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JP2011-277730 2011-12-19
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Citations (2)

* Cited by examiner, † Cited by third party
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US20080136956A1 (en) * 2006-11-17 2008-06-12 Tessera North America Internal noise reducing structures in camera systems employing an optics stack and associated methods
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JP2011107588A (ja) * 2009-11-20 2011-06-02 Toppan Printing Co Ltd カメラモジュール及びその製造方法

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