WO2013092127A3 - Schaltungsträger mit einem leitpfad und einer elektrischen schirmung und verfahren zu dessen herstellung - Google Patents

Schaltungsträger mit einem leitpfad und einer elektrischen schirmung und verfahren zu dessen herstellung Download PDF

Info

Publication number
WO2013092127A3
WO2013092127A3 PCT/EP2012/073692 EP2012073692W WO2013092127A3 WO 2013092127 A3 WO2013092127 A3 WO 2013092127A3 EP 2012073692 W EP2012073692 W EP 2012073692W WO 2013092127 A3 WO2013092127 A3 WO 2013092127A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
conducting path
electric shield
producing
shield
Prior art date
Application number
PCT/EP2012/073692
Other languages
English (en)
French (fr)
Other versions
WO2013092127A2 (de
Inventor
Florian Poprawa
Markus Schieber
Christina Schindler
Jörg ZAPF
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to US14/367,894 priority Critical patent/US9999120B2/en
Publication of WO2013092127A2 publication Critical patent/WO2013092127A2/de
Publication of WO2013092127A3 publication Critical patent/WO2013092127A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Die Erfindung betrifft einen Schaltungsträger (11) mit einer Digitalschaltung, die mindestens zwei Bauelemente (12, 14) enthält, die elektrisch miteinander verbunden (19, 21, 20) sind. Zusätzlich ist eine elektrische Schirmung (24) vorgesehen. Erfindungsgemäß ist vorgesehen, dass die elektrische Schirmung (24) sowie ein Leitpfad (21) zur elektrischen Verbindung der Bauelemente (12, 14) durch einen einzigen Schichtverbund (18) realisiert sind. Insbesondere sind die elektrische Schirmung (24) und der Leitpfad (21) durch dieselbe elektrisch leitfähige Lage ausgebildet, wobei eine Freistellung (25) für eine komplette elektrische Isolation des Leitpfades (21) gegenüber der Schirmung (24) sorgt. Gegenstand der Erfindung ist außerdem ein Verfahren zur Herstellung eines solchen Schaltungsträgers.
PCT/EP2012/073692 2011-12-21 2012-11-27 Schaltungsträger mit einem leitpfad und einer elektrischen schirmung und verfahren zu dessen herstellung WO2013092127A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/367,894 US9999120B2 (en) 2011-12-21 2012-11-27 Circuit carrier having a conducting path and an electric shield

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011089415A DE102011089415A1 (de) 2011-12-21 2011-12-21 Schaltungsträger mit einem Leitpfad und einer elektrischen Schirmung und Verfahren zu dessen Herstellung
DE102011089415.2 2011-12-21

Publications (2)

Publication Number Publication Date
WO2013092127A2 WO2013092127A2 (de) 2013-06-27
WO2013092127A3 true WO2013092127A3 (de) 2013-09-26

Family

ID=47458867

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/073692 WO2013092127A2 (de) 2011-12-21 2012-11-27 Schaltungsträger mit einem leitpfad und einer elektrischen schirmung und verfahren zu dessen herstellung

Country Status (3)

Country Link
US (1) US9999120B2 (de)
DE (1) DE102011089415A1 (de)
WO (1) WO2013092127A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106257652B (zh) * 2015-06-16 2020-03-27 台达电子企业管理（上海）有限公司 封装模块及封装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6285559B1 (en) * 1998-05-26 2001-09-04 Nec Corporation Multichip module
US20070057366A1 (en) * 2005-09-14 2007-03-15 Masashi Katsumata Semiconductor IC-embedded module
WO2010106599A1 (ja) * 2009-03-19 2010-09-23 パナソニック株式会社 回路モジュール及び電子機器
WO2011125354A1 (ja) * 2010-04-06 2011-10-13 日本電気株式会社 機能素子内蔵基板
US20110266041A1 (en) * 2002-01-31 2011-11-03 Tuominen Risto Method for embedding a component in a base

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4678699A (en) * 1982-10-25 1987-07-07 Allied Corporation Stampable polymeric composite containing an EMI/RFI shielding layer
DE9214898U1 (de) * 1991-11-07 1992-12-17 Siemens Ag, 8000 Muenchen, De
DE29505327U1 (de) * 1995-03-29 1995-08-03 Siemens Ag Abschirmung für Logik- und Hochfrequenzschaltkreise
DE10125746C1 (de) * 2001-05-21 2003-02-06 Siemens Ag Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung
DE102006061248B3 (de) 2006-12-22 2008-05-08 Siemens Ag Leiterplatte mit einem Hochfrequenzbauelement
DE102007028799A1 (de) * 2007-06-19 2008-12-24 Technische Universität Ilmenau Impedanzkontrolliertes koplanares Wellenleitersystem zur dreidimensionalen Verteilung von Signalen hoher Bandbreite
US8822844B1 (en) * 2010-09-27 2014-09-02 Rockwell Collins, Inc. Shielding and potting for electrical circuits

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6285559B1 (en) * 1998-05-26 2001-09-04 Nec Corporation Multichip module
US20110266041A1 (en) * 2002-01-31 2011-11-03 Tuominen Risto Method for embedding a component in a base
US20070057366A1 (en) * 2005-09-14 2007-03-15 Masashi Katsumata Semiconductor IC-embedded module
WO2010106599A1 (ja) * 2009-03-19 2010-09-23 パナソニック株式会社 回路モジュール及び電子機器
EP2410561A1 (de) * 2009-03-19 2012-01-25 Panasonic Corporation Schaltungsmodul und elektronische anordnung
WO2011125354A1 (ja) * 2010-04-06 2011-10-13 日本電気株式会社 機能素子内蔵基板

Also Published As

Publication number Publication date
DE102011089415A1 (de) 2013-06-27
WO2013092127A2 (de) 2013-06-27
US9999120B2 (en) 2018-06-12
US20150016073A1 (en) 2015-01-15

Similar Documents

Publication Publication Date Title
WO2011137756A3 (zh) 复合材料以及电子设备
EP2545562A4 (de) Isolierung mit mischoxidpartikeln und kabel damit
WO2015050589A3 (en) Photonic sintering of polymer thick film copper conductor compositions
WO2011056668A3 (en) Selective die electrical insulation additive process
WO2013085839A3 (en) Semiconductor modules and methods of forming the same
WO2013126308A8 (en) High current, low equivalent series resistance printed circuit board coil for power transfer application
EA201270276A1 (ru) Панель, снабженная электрически проводящими структурами
MY163248A (en) Insulated wire having a layer containing bubbles, electrical equipment, and method of producing insulated wire having a layer containing bubbles
ITMI20130965A1 (it) Procedimento per la fabbricazione di un elemento componente con un contatto elettrico passante
WO2012175207A3 (de) Elektronische baugruppe und verfahren zu deren herstellung
IN2014CN03328A (de)
WO2013011127A3 (de) Thermoelektrisches modul, verfahren zur herstellung eines thermoelektrischen moduls und verwendung eines metallischen glases oder eines gesinterten werkstoffes
WO2013039972A3 (en) Composite conductor insulation
WO2011107075A3 (de) Verfahren zum herstellen einer elektrischen schnittstelle und schnittstelle
WO2012091487A3 (ko) 전극 및 이를 포함하는 전자소자
WO2012120032A3 (de) Baugruppe mit einem träger, einem smd-bauteil und einem stanzgitterteil
MY153256A (en) Passive electrical devices and methods of fabricating passive electrical devices
WO2013167643A3 (de) Verfahren zum elektrischen kontaktieren eines elektronischen bauelements als stapel und elektronisches bauelement mit einer kontaktierungsstruktur
WO2014016093A3 (de) Verstellantrieb
WO2012085367A3 (fr) Circuit electronique comportant des connexions electriques resistantes a un environnement severe
WO2011151098A3 (de) Bauelement mit einer durchkontaktierung und verfahren zu dessen herstellung
WO2013050328A3 (en) Crimped terminal
WO2011112409A3 (en) Wiring substrate with customization layers
WO2012158845A3 (en) Method of fabricating high-density hermetic electrical feedthroughs using insulated wire bundles
WO2009043670A3 (de) Elektronische schaltung aus teilschaltungen und verfahren zu deren herstellung

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12808274

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 14367894

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 12808274

Country of ref document: EP

Kind code of ref document: A2