WO2013085097A1 - Composé à base de phosphore ayant une nouvelle structure, son procédé de préparation et composition de résine thermoplastique retardatrice de flamme le contenant - Google Patents
Composé à base de phosphore ayant une nouvelle structure, son procédé de préparation et composition de résine thermoplastique retardatrice de flamme le contenant Download PDFInfo
- Publication number
- WO2013085097A1 WO2013085097A1 PCT/KR2011/010325 KR2011010325W WO2013085097A1 WO 2013085097 A1 WO2013085097 A1 WO 2013085097A1 KR 2011010325 W KR2011010325 W KR 2011010325W WO 2013085097 A1 WO2013085097 A1 WO 2013085097A1
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- WO
- WIPO (PCT)
- Prior art keywords
- phosphorus
- resin
- flame retardant
- thermoplastic resin
- compound
- Prior art date
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- 229910052698 phosphorus Inorganic materials 0.000 title claims abstract description 56
- 239000011574 phosphorus Substances 0.000 title claims abstract description 56
- 239000003063 flame retardant Substances 0.000 title claims abstract description 33
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 32
- 150000001875 compounds Chemical class 0.000 title claims abstract description 30
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 239000011342 resin composition Substances 0.000 title claims abstract description 22
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title abstract 2
- -1 phosphorus compound Chemical class 0.000 claims description 52
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 22
- 229920006026 co-polymeric resin Polymers 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 229920005990 polystyrene resin Polymers 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 238000002411 thermogravimetry Methods 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 229920005668 polycarbonate resin Polymers 0.000 claims description 4
- 239000004431 polycarbonate resin Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- YAAQEISEHDUIFO-UHFFFAOYSA-N C=CC#N.OC(=O)C=CC=CC1=CC=CC=C1 Chemical compound C=CC#N.OC(=O)C=CC=CC1=CC=CC=C1 YAAQEISEHDUIFO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920002877 acrylic styrene acrylonitrile Polymers 0.000 claims description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 3
- 229920001893 acrylonitrile styrene Polymers 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical compound C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 claims description 3
- 239000000975 dye Substances 0.000 claims description 3
- CTYOELISUWITTG-UHFFFAOYSA-N ethyl prop-2-enoate;prop-2-enenitrile;styrene Chemical compound C=CC#N.CCOC(=O)C=C.C=CC1=CC=CC=C1 CTYOELISUWITTG-UHFFFAOYSA-N 0.000 claims description 3
- 239000012760 heat stabilizer Substances 0.000 claims description 3
- 239000004611 light stabiliser Substances 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
- 229920013716 polyethylene resin Polymers 0.000 claims description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims 1
- 230000007062 hydrolysis Effects 0.000 abstract description 13
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 13
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- 239000000047 product Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 239000011968 lewis acid catalyst Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Chemical class 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- OWICEWMBIBPFAH-UHFFFAOYSA-N (3-diphenoxyphosphoryloxyphenyl) diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1)(=O)OC1=CC=CC=C1 OWICEWMBIBPFAH-UHFFFAOYSA-N 0.000 description 2
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- GLUYADGKGBGXRV-UHFFFAOYSA-N chloro dihydrogen phosphate Chemical compound OP(O)(=O)OCl GLUYADGKGBGXRV-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910001510 metal chloride Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- HPYNZHMRTTWQTB-UHFFFAOYSA-N dimethylpyridine Natural products CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/06—Phosphorus compounds without P—C bonds
- C07F9/08—Esters of oxyacids of phosphorus
- C07F9/09—Esters of phosphoric acids
- C07F9/12—Esters of phosphoric acids with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/06—Phosphorus compounds without P—C bonds
- C07F9/08—Esters of oxyacids of phosphorus
- C07F9/141—Esters of phosphorous acids
- C07F9/145—Esters of phosphorous acids with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/06—Organic materials
- C09K21/12—Organic materials containing phosphorus
Definitions
- the present invention relates to a phosphorus compound having a novel structure, a method for preparing the same, and a flame retardant thermoplastic resin composition comprising the same. More specifically, the present invention includes a phenyl group in which a tertiary butyl group is substituted at an ortho position, and a biphenol linker, which has excellent hydrolysis resistance and heat resistance at high temperature. It relates to a compound, a method for preparing the same, and a flame retardant thermoplastic resin composition comprising the same.
- Phosphoric acid esters are most commonly used as such phosphorus-based flame retardants, and examples thereof include bisphenol-A bis (diphenylphosphate) (BDP), resorcinol bis (diphenylphosphate) (RDP), and resorcinol bis (di-2, 6-dimethylphenyl phosphate) (PX-200) and the like.
- BDP bisphenol-A bis
- RDP resorcinol bis
- PX-200 resorcinol bis
- Such phosphate esters are applied to thermoplastic resins such as styrene resins and polycarbonate resins to impart flame retardancy to these resins.
- the present inventors include a phenyl group in which a tertiary butyl group is substituted at an ortho position, and a biphenol linker.
- a method for preparing the same, and a flame retardant thermoplastic resin composition comprising the same.
- Another object of the present invention is to provide a phosphorus compound having excellent hydrolysis resistance and heat resistance at a high temperature and a method for producing the same.
- Still another object of the present invention is to provide a thermoplastic resin composition excellent in flame retardancy, hydrolysis resistance at high temperature, and heat resistance.
- Phosphorus-based compound according to the present invention is represented by the following formula (1).
- R is hydrogen or an alkyl group of C 1 -C 4 .
- the acid value change before and after stirring is more than 0 mg KOH / g 0.9 mg KOH / g
- the acid value change before and after standing is 0 mg KOH / g or more and 0.8 mg KOH / g or less.
- the weight loss at 350 ° C. of the phosphorus compound measured by thermogravimetric analysis is 0% or more and 15% or less.
- the method for preparing a phosphorus compound represented by Chemical Formula 1 according to the present invention includes reacting a phosphorus oxychloride, a compound represented by Chemical Formula 2 below, and a biphenol.
- R is hydrogen or an alkyl group of C 1 -C 4 .
- the method for producing a phosphorus compound is phosphorus oxychloride ⁇ and the compound represented by the formula (2); And reacting the biphenol with the product resulting from the reaction.
- the reaction molar ratio of the phosphorus oxychloride to the compound represented by Formula 2 is 1: 2, and the reaction molar ratio of the phosphorus oxychloride to the biphenol is 2: 1.
- the flame retardant thermoplastic resin composition according to the present invention comprises the phosphorus-based compound.
- the flame retardant thermoplastic resin composition 100 parts by weight of a thermoplastic resin; And 0.1 parts by weight or more and 50 parts by weight or less of the phosphorus compound.
- the thermoplastic resin is a polystyrene resin, acrylonitrile-butadiene-styrene copolymer resin, high strength polystyrene resin, acrylonitrile-styrene-acrylate copolymer resin, acrylonitrile-styrene copolymer Resin, methyl methacrylate-butadiene-styrene copolymer resin, acrylonitrile-ethyl acrylate-styrene copolymer resin, polycarbonate resin, polyphenylene ether resin, polyphenylene sulfide resin, polyethylene resin, polypropylene resin , At least one selected from the group consisting of polyethylene terephthalate resin, polybutylene terephthalate resin, poly (meth) acrylic resin and polyamide resin.
- the flame retardant thermoplastic resin composition is a flame retardant, flame retardant aid, lubricant, plasticizer, heat stabilizer, anti-drip agent, antioxidant, compatibilizer, light stabilizer, pigment, dye and inorganic fillers other than the phosphorus compound Further comprises at least one additive selected from the group consisting of.
- the phosphorus compound according to the present invention has a new structure and is excellent in hydrolysis resistance and heat resistance at high temperature.
- the thermoplastic resin composition according to the present invention is excellent in flame retardancy, hydrolysis resistance at high temperature, and heat resistance.
- 1 is a 1 H-NMR spectrum of a phosphorus compound according to an embodiment.
- Phosphorus-based compound according to the present invention is represented by the following formula (1).
- R is hydrogen or an alkyl group of C 1 -C 4 .
- the phosphorus compound according to the present invention includes a phenyl group and a biphenol linker in which a tertiary butyl group is substituted at an ortho position, thereby replacing the tertiary butyl group at another position.
- Oligomeric aromatic phosphate esters containing phenyl groups Oligomeric aromatic phosphate esters containing a phenyl group substituted with a methyl group, ethyl group, propyl group or normal butyl group other than the tertiary butyl group;
- the hydrolysis resistance and heat resistance at a high temperature are excellent as compared to the oligomeric aromatic phosphate ester containing hydroquinone, resorcinol or bisphenol-A, which is not a biphenol as a linker.
- R is hydrogen or an alkyl group of C 1 -C 4 , preferably hydrogen, methyl group, ethyl group, and more preferably hydrogen.
- the acid value change before and after stirring is more than 0 mg KOH / g 0.9 mg KOH / g Or less, preferably 0 mg KOH / g or more and 0.5 mg KOH / g or less, more preferably 0 mg KOH / g or more and 0.2 mg KOH / g or less, most preferably 0 mg KOH / g or more and 0.1 mg KOH / g or less.
- the acid value change before and after standing is more than 0 mg KOH / g 0.8 mg KOH / g Or less, preferably 0 mg KOH / g or more and 0.4 mg KOH / g or less, more preferably 0 mg KOH / g or more and 0.1 mg KOH / g or less, most preferably 0.00 mg KOH / g.
- the acid value is obtained by dissolving a proper amount of sample in 50 ml of ethanol, adding a small amount of BTB solution, titrating with 0.1N NaOH solution, and measuring the consumption of NaOH solution using the following formula.
- the loss weight at 200 ° C. of the phosphorus compound measured by thermogravimetric analysis is 0% or more and 0.3% or less, preferably 0% or more and 0.2% or less, more preferably 0% or more and 0.1% Below, most preferably, it is 0%.
- the loss weight at 250 ° C. of the phosphorus compound measured by thermogravimetric analysis is 0% or more and 0.6% or less, preferably 0% or more and 0.3% or less, more preferably 0% or more and 0.1% Below, most preferably, it is 0%.
- the loss weight at 300 ° C. of the phosphorus compound measured by thermogravimetric analysis is 0% or more and 4% or less, preferably 0% or more and 1% or less, more preferably 0% or more and 0.1% Below, most preferably, it is 0%.
- the loss weight at 350 ° C. of the phosphorus compound measured by thermogravimetric analysis is 0% or more and 15% or less, preferably 0% or more and 5% or less, more preferably 0% or more and 1% Most preferably, they are 0% or more and 0.1% or less. For example, 0.1%.
- the method for preparing a phosphorus compound represented by Chemical Formula 1 according to the present invention includes reacting a phosphorus oxychloride, a compound represented by Chemical Formula 2 below, and a biphenol.
- R is hydrogen or an alkyl group of C 1 -C 4 .
- the method for producing a phosphorus compound is phosphorus oxychloride ⁇ and the compound represented by the formula (2); And reacting the biphenol with the product resulting from the reaction.
- biphenol di-2-tertarybutylphenyl phosphate
- di-2-tertarybutylphenyl phosphate may be prepared by reacting biphenol with the di-2-tertbutylbutylphenyl chloro phosphate.
- the solvent that can be used in the process for producing the phosphorus compound is an aprotic organic solvent having a boiling point of 110 ° C. or more and 200 ° C. or less, preferably a toluene, xylene, chlorobenzene or dichlorobenzene as an aromatic compound, more preferably. Toluene, xylene, chlorobenzene.
- a solvent having a boiling point lower than 110 ° C. is used, the reaction may proceed very slowly.
- a solvent having a boiling point higher than 200 ° C. it may be difficult to completely dry after the reaction and the color of the product may be changed.
- the solvents may be used alone or in combination of two or more thereof.
- the catalyst which can be used for the step of reacting the phosphorus oxychloride and the compound represented by the formula (2), the reaction of the biphenol to the product resulting from the reaction, or both thereof is a Lewis acid catalyst or a base catalyst.
- metal chlorides or metal oxides may be used.
- metal chlorides such as magnesium chloride, aluminum chloride, and calcium chloride may be used, but are not limited thereto.
- the Lewis acid catalyst may be used in an amount of 0.1 mol% or more and 10 mol% or less, preferably 0.5 mol% or more and 5 mol% or less, more preferably 1 mol% or more and 2 mol% or less, based on the total number of moles of the reactants. When the Lewis acid catalyst is used within the above range, the reaction rate may be excellent and the catalyst removal after the reaction may also be advantageous.
- An organic amine compound may be used as the base catalyst, preferably an aromatic amine such as pyridine or lutidine and a trivalent amine of trialkylamines, and the like, and most preferably pyridine or triethylamine may be used.
- the base catalyst may be used in an amount of 1 equivalent or more and 3 equivalents or less, preferably 1.1 equivalents or more and 2 equivalents or less, more preferably 1.2 equivalents or more and 1.5 equivalents or less, based on the amount of chlorine elements in the raw materials used. When the base catalyst is used within the above range, the completeness of the reaction can be increased, and by-products can be minimized.
- the reaction temperature of the phosphorus oxychloride and the compound represented by the formula (2), the reaction temperature of the product and the biphenol resulting from the reaction or all of them are 80 °C to 170 °C, preferably 100 It is more than 160 degreeC, More preferably, it is 120 degreeC or more and 140 degrees C or less.
- the reaction molar ratio of the phosphorus oxychloride to the compound represented by Formula 2 is 1: 2, and the reaction molar ratio of the phosphorus oxychloride to the biphenol is 2: 1.
- the reactants are used within the above range, the completeness of the reaction can be increased, and by-products can be minimized.
- the flame-retardant thermoplastic resin composition according to the present invention comprises the phosphorus-based compound, and since the phosphorus-based compound is excellent in hydrolysis resistance and heat resistance at high temperature, even if a resin processed mainly at high temperature is used as the thermoplastic resin, When the thermoplastic resin composition is included, problems such as gas generation, decomposition, or appearance deterioration due to the phosphorus-based compound may be prevented.
- the phosphorus compound can be preferably applied to a thermoplastic resin containing oxygen.
- the flame retardant thermoplastic resin composition 100 parts by weight of a thermoplastic resin; And 0.1 parts by weight or more and 50 parts by weight or less, preferably 1 parts by weight or more and 30 parts by weight or less, more preferably 5 parts by weight or less and 15 parts by weight or less.
- the thermoplastic resin is a polystyrene resin, acrylonitrile-butadiene-styrene copolymer resin, high strength polystyrene resin, acrylonitrile-styrene-acrylate copolymer resin, acrylonitrile-styrene copolymer Resin, methyl methacrylate-butadiene-styrene copolymer resin, acrylonitrile-ethyl acrylate-styrene copolymer resin, polycarbonate resin, polyphenylene ether resin, polyphenylene sulfide resin, polyethylene resin, polypropylene resin , At least one selected from the group consisting of polyethylene terephthalate resin, polybutylene terephthalate resin, poly (meth) acrylic resin and polyamide resin.
- the flame retardant thermoplastic resin composition is a flame retardant, flame retardant aid, lubricant, plasticizer, heat stabilizer, anti-drip agent, antioxidant, compatibilizer, light stabilizer, pigment, dye and inorganic fillers other than the phosphorus compound
- the additive may be included in an amount of 0 to 30 parts by weight, preferably 0 to 15 parts by weight with respect to 100 parts by weight of the thermoplastic resin.
- Examples of flame retardants, flame retardant aids and anti-dripping agents other than the phosphorus-based compounds include halogen-containing organic compounds, cyanurate compounds, metal salts, fluorinated polyolefin resins, and the like, which are generally commercially available.
- Metal salts that can be used as the flame retardant aids include conventionally known sulfonic acid metal salts and sulfone sulfonic acid metal salts.
- Fluorinated polyolefin resins usable as anti-dropping agents include polytetrafluoroethylene and polyvinylidene fluoride as conventionally available resins.
- Tetrafluoroethylene / vinylidene fluoride copolymer Tetrafluoroethylene / vinylidene fluoride copolymer, tetrafluoroethylene / hexafluoropropylene copolymer, ethylene / tetrafluoroethylene copolymer and the like.
- the inorganic fillers include glass fibers, talc, ceramics or sulfates.
- the flame retardant thermoplastic resin composition may be prepared in the form of pellets or chips by mixing components and additives, followed by melt extrusion in an extruder.
- the plastic molded article may be manufactured using an extrusion, injection, or casting molding method.
- the thermoplastic resin composition according to the present invention is excellent in heat resistance and hydrolysis resistance as well as flame retardancy, it can be preferably applied to various products.
- the thermoplastic resin composition may include a housing of an electric / electronic product such as a TV, an audio, a mobile phone, a digital camera, a navigation machine, a washing machine, a computer, a monitor, an MP3, a video player, a CD player, a washing machine, and the like; Or in a housing of an office automation device such as a copy machine, a facsimile machine, a printer, or the like.
- BDP bisphenol-A bis (diphenylphosphate)
- PX-200 resorcinol bis (di-2,6-dimethylphenylphosphate)
- Acid value (mg KOH / g) ((0.1N-NaOH solution consumption ml) * (0.1N-NaOH solution Factor) * 5.61) / sample amount (g)
- the phosphorus-based compound according to the embodiment is excellent in hydrolysis resistance and heat resistance at a high temperature compared to the phosphorus-based compound according to Comparative Examples 1-2.
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Abstract
La présente invention concerne : un composé à base de phosphore, qui comprend un groupe butyle tertiaire ayant un groupe phényle substitué en position ortho et un liant biphénol, et a une excellente résistance à l'hydrolyse et une excellente résistance à la chaleur à une température élevée ; un procédé de préparation de ce composé ; et une composition de résine thermoplastique retardatrice de flamme le contenant.
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KR1020110129445A KR101465476B1 (ko) | 2011-12-06 | 2011-12-06 | 새로운 구조를 갖는 인계 화합물, 이의 제조방법, 및 이를 포함하는 난연성 열가소성 수지 조성물 |
KR10-2011-0129445 | 2011-12-06 |
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WO2013085097A1 true WO2013085097A1 (fr) | 2013-06-13 |
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PCT/KR2011/010325 WO2013085097A1 (fr) | 2011-12-06 | 2011-12-29 | Composé à base de phosphore ayant une nouvelle structure, son procédé de préparation et composition de résine thermoplastique retardatrice de flamme le contenant |
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WO2021177488A1 (fr) * | 2020-03-05 | 2021-09-10 | 주식회사 삼양사 | Composition de résine de poly téréphtalate de butylène possédant une excellente ininflammabilité et une excellente résistance à l'hydrolyse et article moulé produit à partir de ladite composition |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420327A (en) * | 1992-09-14 | 1995-05-30 | Akzo Nobel N.V. | Process for forming hydrocarbyl bisphosphate compound |
EP0509506B1 (fr) * | 1991-04-16 | 1997-06-25 | Daihachi Chemical Industry Co., Ltd. | Poudres cristallines de diphosphates aromatiques, leur préparation et utilisation |
EP0822197B1 (fr) * | 1996-07-30 | 2003-04-02 | Daihachi Chemical Industry Co., Ltd. | Procédé de préparation de biphosphates aromatiques |
WO2005012417A1 (fr) * | 2003-08-04 | 2005-02-10 | Cheil Industries Inc. | Composition de resine thermoplastique ignifuge |
WO2005017030A1 (fr) * | 2003-08-14 | 2005-02-24 | Cheil Industries Inc. | Composition de resine styrenique ignifuge renforcee par du caoutchouc |
Family Cites Families (2)
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JPH1036645A (ja) * | 1996-07-22 | 1998-02-10 | Polyplastics Co | ポリブチレンテレフタレート樹脂組成物 |
US6906123B2 (en) * | 1998-09-02 | 2005-06-14 | Cheil Industries Inc. | Flameproof styrene-containing graft resin compositions having a particular nitrile content distribution |
-
2011
- 2011-12-06 KR KR1020110129445A patent/KR101465476B1/ko active IP Right Grant
- 2011-12-29 WO PCT/KR2011/010325 patent/WO2013085097A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0509506B1 (fr) * | 1991-04-16 | 1997-06-25 | Daihachi Chemical Industry Co., Ltd. | Poudres cristallines de diphosphates aromatiques, leur préparation et utilisation |
US5420327A (en) * | 1992-09-14 | 1995-05-30 | Akzo Nobel N.V. | Process for forming hydrocarbyl bisphosphate compound |
EP0822197B1 (fr) * | 1996-07-30 | 2003-04-02 | Daihachi Chemical Industry Co., Ltd. | Procédé de préparation de biphosphates aromatiques |
WO2005012417A1 (fr) * | 2003-08-04 | 2005-02-10 | Cheil Industries Inc. | Composition de resine thermoplastique ignifuge |
WO2005017030A1 (fr) * | 2003-08-14 | 2005-02-24 | Cheil Industries Inc. | Composition de resine styrenique ignifuge renforcee par du caoutchouc |
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KR20130063107A (ko) | 2013-06-14 |
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