WO2013052721A1 - Encres métalliques de frittage sur substrats à bas point de fusion - Google Patents

Encres métalliques de frittage sur substrats à bas point de fusion Download PDF

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Publication number
WO2013052721A1
WO2013052721A1 PCT/US2012/058836 US2012058836W WO2013052721A1 WO 2013052721 A1 WO2013052721 A1 WO 2013052721A1 US 2012058836 W US2012058836 W US 2012058836W WO 2013052721 A1 WO2013052721 A1 WO 2013052721A1
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WO
WIPO (PCT)
Prior art keywords
paste
film
metallic ink
recited
ink
Prior art date
Application number
PCT/US2012/058836
Other languages
English (en)
Inventor
Richard Lee Fink
James P. Novak
Valerie Ginsberg
Original Assignee
Applied Nanotech Holdings, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Nanotech Holdings, Inc. filed Critical Applied Nanotech Holdings, Inc.
Priority to US14/348,846 priority Critical patent/US20140314966A1/en
Publication of WO2013052721A1 publication Critical patent/WO2013052721A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/003—Apparatus or processes specially adapted for manufacturing conductors or cables using irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Definitions

  • Photosintering can be used to create conductive films from metallic nanopariicles. Photosintering is a process whereb nanoparticles are exposed to a high-intensity light, the nanopartici.es absorb the light and convert, the energy to heat, and the particles begin, to melt, assuming a energy threshold, required to increase the temperature above their melting point is achieved.
  • Photosintering can be accomplished using broad band (such as produced, by a Xe-arc discharge lamp) or coherent light (such as produced by a laser) sources.
  • the photosintering process is extremely fast, usually occurring in sub-millisecond time scales.
  • the process of energy conversion can be considered rapid and violent with respect to the energy level of the nanoparticles. Determining the correct parameters to obtain a sintered, continuous, copper film, with photonic "flash lamp'' sintering, is very difficult due to the cracking and "blow off * of the ink or paste film prevalent with such a process.
  • PET polyethylene terephthalate
  • the ablation during photosintering is primarily caused by the rapid time scale of the conversion of light to heat.
  • Copper nanoparticles appear black in color when their size is less than 100 nm. This black color is due to a. broad, strong optical absorbance in the visible light region. When exposed to light, the nanoparticles absorb the light and convert the energy into heat in an effort to dissipate the energy.
  • the photosintering process involves exposing a surface to an intense light source. Copper has a high heat capacit and thermal conductivity, meaning it can both absorb a lot of energy in the form of heat and can also transfer thi heat away very quickly. This creates an interesting effect whereby it takes a significant input of energy to a copper nanoparticle ink.
  • a nanoparticle film will have three energy transitions.
  • the first transition is the threshold whereby the film, when exposed to light first has enough energy to absorb the light and heat up.
  • This first energy threshold is relatively low and will not cause any physical changes to the metallic film.
  • the second transition occurs when there is sufficient heat energy to melt the particles. In this case, there is a physical transformation of the particles from a solid, to a pseudo-solid, and then to a liquid.
  • the solid particle is the warm particle as a discrete particle.. This heat conversion ca occur very quickly, usually within a sub- microsecond time scale.
  • the pseudo-solid occurs when the surface of the particle Is melted due to the nanopariicles * high surface energy., but the core of the particle is still solid, in this state, particles are able to neck together and form conductive pathways as adjacent particles flow together on their surface without significant reorganization or movemen of the core.
  • the surface reorganization requires very little mass transfer and can occur very quickly, usually in a microsecond time scale.
  • the full liquid physical state occurs when the time scale of melting is sufficiently long to allow the heat propagation to reach the center core of the nanoparticle. in this case, surface tension of the metal dominates, and die masses of adjacent particles will flow together creating a very high density film with very low porosity.
  • the density of the film approaches the density of the bulk value of the parent metal. This usually occur in a time scale of approximately 0.1-10 milliseconds,
  • the density of bulk copper is 8.96 g/cnr ⁇
  • the third transition occurs when the energy level exceeds the melting of the nanopariicles into a liquid state. It the energy delivery is too last or too intense, the intraparticle mass transfer cannot keep up with the internal mechanisms to shed heat.
  • the primary mechanism to shed heat is the physical phase transition from solid to liquid. If the heat delivery is greater than the heat required for the phase transition, the nanopariicles will ablate from, the surface. For example, if the surface reorganization timescale is approximately 5 milliseconds and a pulse
  • Binder in the ink can increase the adhesion of the ink to the substrate but at the expense of film conductivity. Binder should be removed from the interface between the particles in the .film or they cannot connect to form conductive pathways. If not completely removed, the residue will reduce the overall density and conductivity of the film.
  • FIGS lA-1 E illustrate embodiments of the present invention.
  • Figure 2 shows a digital image of a Xenon Sinteron 2000 Photonic Curing System used for sintering/photosintering in embodiments of the present invention.
  • Figure 3A shows a digital image of a nano-eopper ink. applied with a "wire rod drawdown 5* technique on a PET substrate.
  • Figure 3B shows a digital, image of a flash lamp gap and voltage optimization process where some areas have tape applied and some do not. After exposure(s), the tapes were removed, and the films characterized.
  • Figure 3C shows a digital linage of a copper film adhesion checked with a routine "tape test”
  • Figure 3D shows a digital image of a tape pushed off of the copper film during a sintering process by sintering induced/generated vapors.
  • Figure 4 shows a digital image of a Kapton H substrate coated with copper ink, dried, "laminated,” then exposed to a flash lamp in three sections. The two overlapping areas received "double exposures,” resulting in a brighter copper film.
  • Figure 5A illustrates a roH-to-roll process in accordance with embodiments of the present invention.
  • Figure 5B illustrates a roH-to-roll process in. accordance with embodiments of the present inventio .
  • Figure 6A illustrates a double-sided tape holding a film.
  • Figure 6B illustrates a single-sided tape holding a film.
  • Figure 6C illustrates an adhesive, material securing a film.
  • Figure 7 illustrates weights/bars/magnets holding a film.
  • Figure- 8A illustrates a vacuum platen holding a film.
  • Figure SB illustrates a vacuum platen holding a film to a substrate with holes.
  • Figure 9 illustrates dried "fluid" materials serving as a film.
  • Embodiments described herein implement placement, of a cover film on top of a dried copper nanopartkle film.
  • the cover layer acts to provide a thermal transfer buffer to decrease heat loss to the outside environment, inhibit a residue from remaining inside the resulting film, and confine any inter-particle motion in the film to the X,Y plane inhibiting ablation in a Z direction.
  • the tape barrier produced an environment thai captures the vapor gases released during the flash lamp curing process, forming a "pocket,” or "vapor pillow,” over the cured film. This feature also reduced operator and environmental exposure risk to the vapors and "blown off particles.”
  • sintering parameters e.g., dried ink film thickness, distance between lamp and ink film, lamp voltage power, pulse width, etc
  • different tapes yielded noticeably different sintering results.
  • different tape thicknesses, levels of translueence or opacities, coalings, adhesives, etc. may be used as tools to optimize the sintering process (i.e., vary the characteristics of the sintering process and the resultant conductive film qualities). Consequently, this technique of tape lamination ma be used as a new tool for flash lamp sintering parameter optimizations.
  • a laminated cover on top of a dried ink can he used to alter the moisture content available to the surface of the metallic ink.
  • certain adhesive materials may be utilized, in the sintering process to provide chemical fimctionalizatio that modifies the oxidation or redaction of the metallic film.
  • the laminated cover tape can be used to alter the thermal transport characteristics of the sintering process.
  • the tape can be used to adjust how quickly the ink sinters by acting as a thermal insulator and/or heat spreader.
  • the tape can also be used to slow die cooling rate by acting as a heat blanket thereby inhibiting radiative beat loss into the local environment, in previous experiments, it was determined thai photosintering works well on a substrate possessing a low ihermal conductivity. This low thermal conductivity focuses the generated heat into the metal film and inhibits heat loss into the underlying substrate.
  • a substrate 101 e.g., a PET material
  • metallic ink or paste 102 e.g.. a nano-copper ink
  • tape lamination technique described herein utilized for producing a continuous and conductive copper film.
  • a metallic ink or paste 102 is applied to the substrate 101 , and dried, such as with application of heat.
  • a film 103 is laminated over the dried ink film.
  • the laminated film 103 may be a tape as described herein, or an other laminated film performing an equivalent function, including the alternatives described herein.
  • the metallic ink or paste film 102 is "flashed' ' with a high energy pulsed light 104 through the laminated film 103.
  • Such a pulsed light 104 may come from a flash lamp curing system, or any other system capable of sintering and/or photosintering the metallic ink or paste film 1.02.
  • Figure 1 D shows that the metallic ink or paste film 102 is sintered to produce a conductive film 106.
  • the exhaust vapor from the sintering process produces a "pocket” or "pillow” 105 between the laminated film 103 ami the sintered metallic ink or paste 106.
  • the laminated film 103 is removed leaving the cured metallic ink or paste film 106 attached to the substrate 101.
  • Figure 2 shows a digital image of a Xenon Sinteron 2000 Photonic Curing System, which may be utilized for s.ntering photosmiering processes described herein. Any other system capable of performing in an equivalent manner to sinter and/or photosinter metallic ink or pastes as described herein ma be utilized.
  • Figure 3A shows a digital image of a nano-eopper ink applied to a substrate using a "wire rod drawdown" technique onto a PET substrate.
  • Figure 3B show ' s a digital image of how flash lamp gap and voltage optimization and variation may be performed using embodiments of the present invention. The image shows some areas of the substrate with tape applied and some without. After one or more exposures, the tapes were removed, and the films were characterized. This is shown in Figure 3C, The copper film adhesion to the substrate was checked with a routine "tape test.” The sample was inspected with a microscope, and the thickness and sheet resistance measurements were taken. The "vapor atmosphere pillow/cushion" effect described above with respect to Figure I D is evident in the digital image shown in Figure 3D. Additionally, for the specimen in the sample with the label of "NO", where no tape was applied, it is apparent that the copper film "blew off the substrate.
  • a apton H substrate was coated with copper ink, dried, laminated with tape, then exposed in three sections. The two overlapping areas received double exposures, resulting in a brighter copper film.
  • metallic ink, or paste is applied to a substrate, and the ink layer may fee patterned according to a specified design.
  • a paste instead, of an ink may be used.
  • This ink layer may be thermally dried (e.g., in air), and covered with adhesive tape.
  • the sample is photosintered.
  • the tape serves to mechanically hold the film together such that the rapid evaporation of organic components does not ablate the film, from the substrate. Once the metallic layer is sintered the tape is removed.
  • metallic ink is applied to a substrate.
  • the ink layer may be patterned according to a specified design.
  • the ink layer may be thermally dried (e.g., in air).
  • the ink layer is covered with adhesive tape.
  • the sample is photosintered.
  • the tape serves to prevent air from reaching the surface, eliminating (or at least decreasing) oxidation of the metallic film during sintering. Once the metallic layer is sintered, the tape is removed.
  • metallic ink is applied to a substrate.
  • the ink layer may be patterned according to a. specified design.
  • the ink layer may fee thermally dried (e.g., in air).
  • the ink layer is covered with adhesive tape, i em odiments, the sample is photosmtered.
  • the rapid evaporation of organic components during the photosintering is captured by the tape layer that seals the edges outside the photosintering area.
  • the organic components decompose and maintain a reducing environment to prevent (or at least inhibit) the oxidation of the metallic layer.
  • the tape is removed.
  • metallic ink is applied, to a substrate.
  • the ink layer may be patterned according to a specified design.
  • the ink layer may be thermally dried (e.g., in air).
  • the ink layer is covered with an adhesive tape cover that, is essentially optically transparent.
  • the sample is photosintered.
  • the tape is thermally conductive. The tape serves to spread the heat across the metallic film increasing the uniformity of the film properties. Once the metallic layer is sintered, the tape is .removed,
  • metallic ink is applied to a substrate.
  • the ink layer may fee patterned according to a specified design.
  • the ink layer may fee thermally dried (e.g., in air).
  • the ink layer is covered with an adhesive tape.
  • These three layers are processed using a roll- to roll technique (e.g., at high speed).
  • the sample is photosintered.
  • the tape serves to mechanically hold the film together such that the rapid evaporation of organic components does not ablat the film from the substrate.
  • the metallic layer is sintered the tape is removed (e.g., using a peel-film separation technique).
  • the adhesive tape layer can be collected on a toll and re-used in a subsequent process.
  • the substrate ma be rolled from a plastic roll supply 501 in a feed direction and as driven by various drive rollers to pass underneath a metallic ink dispensing unit 502, which deposits a metallic ink or paste onto the plastic substrate.
  • a metallic ink dispensing unit 502 which deposits a metallic ink or paste onto the plastic substrate.
  • Another rolled .supply 503 contains the laminating tape, which is rolled onto or over the plastic substrate, which has had the metallic ink or paste applied thereon, and passed underneath a sintering and/or phoios.interi.ng unit 505, The tape is then removed and collected onto a roll 504, while the substrate with the siotered/photosintered conductive ink or paste thereon is collected in a final roll 506.
  • metallic ink is applied to a substrate.
  • the ink may he cured using photosmiering at a specific wavelength.
  • the ink layer may be thermally dried (e.g., in air).
  • the ink layer is covered with adhesive tape whereby the tape is colored to effectively filter out wanted or unwanted wavelengths of light
  • metallic ink is applied to a substrate,
  • the ink layer may be thermally dried, (e.g., in air).
  • the ink. layer is covered with adhesive tape that may be patterned according to a specified design.
  • These three layers are processed using a roll-to roll technique (e.g., at high speed).
  • the sample Is phoiosintered.
  • the design creates an effective mask of the light, and the resulting metallic film takes the pattern according to the design on the tape.
  • the non-sintered ink may be easily washed off the substrate leaving the sintered ink behind. This design may be re-used.
  • a process similar to what was described above with respect to Figure 5A. is performed with some variations.
  • the plastic substrate is provided from a supply roll 501 and fed underneath a metallic ink or paste depositing unit 502. Then a supply of tape which has a pattern according to a specified design as noted above is provided from, a suppl roll 5.10 to be positioned onto the plastic substrate with the conductive ink or paste to thereby be sintered/phoioslntered by the unit 505. The patterned tape or other type of laminating film is then collected on roll 51 L The plastic substrate will thereby have portions with, metallic ink or paste that has been sintered/photosmtered, and. portions that have not. A solvent wash 512 may be utilized to remove the ink or paste that was not sintered from the substrate leaving a patterned conductive trace on the plastic substrate which is collected on roll 513.
  • FIGs 6A-6C, 7, 8A-SB, and 9 different films may be attached to the substrate 601 , These films may be non-adhesive and sealed (e.g., tightly) to the substrate 601 containing the ink layer 602 (e.g., using adhesives, vacuum, magnetic field, or weights).
  • a substrate 601 possibly on another substrate or platen 604.
  • the metallic ink or paste 602 is applied or deposited to the substrate 601 , and a non- adhesive laminate Film 603 applied over this composite, and held down to the substrate 604 by a double-sided tape or adhesive 605.
  • Figure 6B shows a similar configuration with, the non-adhesive film 603 held down to the substrate 604 by a single-sided tape 606.
  • Figure 6C shows an adhesive material utilized to secure the non-adhesive laminate film 603 to the metallic ink or paste 602 and/or substrate 6 1 and/or substrate 604,
  • some other type of means is used to hold down the non-adhesive laminate film. 603, such as weights/bars/raagnets 701.
  • a vacuum platen 801 with a vacuum force applied thereto holds down the non-adhesive film 603, which may also hold down the substrate 601
  • Figure 8B shows a similar con figuration, but in.
  • the substrate with the metallic ink or paste 802 thereon is also perforated 805 with vias or holes in the substrate 800 for allowing the vacuum force to also hold down the non-adhesive film 803 over the metallic ink or paste 802, which is also patterned with the vias or holes.
  • the non-adhesive film or laminate material may comprise a thin silicone rubber material or sheet, which is optically transparent/translucent, including with or without minimal 1.JV inhibitors, and all the other characteristics described herein as alternatives for such a laminate film for use in embodiments of the present invention, in the foregoing embodiments, the metallic ink or paste is sintered pliotoshuered, and. it is possible m these embodiments that the released vapors are captured during the exposure process within a "pocket” or “pillow” produced between the slntered/photosmtered material and the silicone sheet.
  • Figure 9 illustrates embodiments where a liquid laminate material 9 1 is applied over the metallic ink or paste layer 602 and/or substrate 601 and/or substrate 604.
  • a liquid laminate 901 may be dried (e.g., thermally in air).
  • the dried laminate may be flexible and/or optically transparent or translucent, and with or without minimal ultraviolet inhibitors.
  • Such materials may comprise polymers such as polyurethane, PET, and FVC.
  • the metallic ink or paste is sintered/photosintered, and then the dried laminate 901 is removed (e.g., using a peel-film separation process).
  • Tape lamination o a dry copper ink film, .followed b an optimized flash Samp procedure, has produced conductive films.
  • An advantage of tape lamination over a tapeless process is that it essentially increases the curing parameter window, and reduces crack formation m the metallic film.
  • Tape lamination facilitates curing of a continuous copper film, on temperature sensitive substrates, such as PET, at power levels that would usually crack and/or blow off the copper film. This lamination process also improves adhesion and • uniformity of the cured film.
  • ink. -application techniques including ink jet, aerosol jet, air brash, flexography, among many others that may be used.
  • This lamination technique has been used with "blanket” films, as well as with trace features.
  • The. applied film tliickness can be varied, and multiple layers may be processed onto a substrate.
  • non-adhesive films which may be held in proximit with edge/discrete adliesives (see Figure C>), weights magnets (see Figure 7), vacuum (see Figure 8), and applied fluid films that are dried prior to curing (see figure 9), among others.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention porte sur une stratification de bande sur un film d'encre de cuivre sec, suivie par un processus par lampe à éclair, afin de produire des films conducteurs. La stratification de bande augmente la fenêtre de paramètres de durcissement et réduit la formation de fissure dans le film métallique. La stratification de bande facilite le durcissement d'un film de cuivre continu sur des substrats sensibles à la température, tels que du PET, à des niveaux de puissance qui normalement ferait exploser le film de cuivre par fissure. Ce procédé de stratification améliore également l'adhérence et l'uniformité du film durci.
PCT/US2012/058836 2011-10-05 2012-10-05 Encres métalliques de frittage sur substrats à bas point de fusion WO2013052721A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/348,846 US20140314966A1 (en) 2011-10-05 2012-10-05 Sintering Metallic Inks on Low Melting Point Substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161543557P 2011-10-05 2011-10-05
US61/543,557 2011-10-05

Publications (1)

Publication Number Publication Date
WO2013052721A1 true WO2013052721A1 (fr) 2013-04-11

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US (1) US20140314966A1 (fr)
TW (1) TW201331959A (fr)
WO (1) WO2013052721A1 (fr)

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CN108461631A (zh) * 2018-03-03 2018-08-28 昆山国显光电有限公司 柔性衬底、加工方法及装置

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US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US9598776B2 (en) 2012-07-09 2017-03-21 Pen Inc. Photosintering of micron-sized copper particles
US20150201504A1 (en) * 2014-01-15 2015-07-16 Applied Nanotech, Inc. Copper particle composition
JP6573903B2 (ja) 2014-03-25 2019-09-11 ストラタシス リミテッド 層交差パターンを製作する方法及びシステム
KR20170130515A (ko) * 2015-03-25 2017-11-28 스트라타시스 엘티디. 전도성 잉크의 인 시츄 소결을 위한 방법 및 시스템
WO2019079902A1 (fr) * 2017-10-27 2019-05-02 National Research Council Of Canada Substrats revêtus de nanotubes de nitrure de bore destinés au frittage de traces métalliques par une lumière pulsée intense
WO2019212481A1 (fr) * 2018-04-30 2019-11-07 Hewlett-Packard Development Company, L.P. Fabrication additive de métaux
EP3801462A4 (fr) 2018-05-24 2022-03-16 Celanese EVA Performance Polymers LLC Dispositif implantable pour la libération prolongée d'un composé médicamenteux macromoléculaire
CN111989068A (zh) 2018-05-24 2020-11-24 塞拉尼斯伊娃高性能聚合物公司 用于持续释放大分子药物化合物的可植入器件

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US20090269510A1 (en) * 2008-04-25 2009-10-29 Daniel Lieberman Printed electronics by metal plating through uv light

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JP2005038491A (ja) * 2003-07-18 2005-02-10 Idemitsu Technofine Co Ltd 情報記録媒体を製造する方法、及び情報記録媒体
US20100259589A1 (en) * 2009-04-14 2010-10-14 Jonathan Barry Inert uv inkjet printing

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US20080286488A1 (en) * 2007-05-18 2008-11-20 Nano-Proprietary, Inc. Metallic ink
US20090269510A1 (en) * 2008-04-25 2009-10-29 Daniel Lieberman Printed electronics by metal plating through uv light

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108461631A (zh) * 2018-03-03 2018-08-28 昆山国显光电有限公司 柔性衬底、加工方法及装置
CN108461631B (zh) * 2018-03-03 2021-12-14 昆山国显光电有限公司 柔性衬底、加工方法及装置

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US20140314966A1 (en) 2014-10-23

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