WO2013038304A1 - Revêtement réflecteur destiné à un support de dispositif électroluminescent - Google Patents

Revêtement réflecteur destiné à un support de dispositif électroluminescent Download PDF

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Publication number
WO2013038304A1
WO2013038304A1 PCT/IB2012/054598 IB2012054598W WO2013038304A1 WO 2013038304 A1 WO2013038304 A1 WO 2013038304A1 IB 2012054598 W IB2012054598 W IB 2012054598W WO 2013038304 A1 WO2013038304 A1 WO 2013038304A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
mount
emitting device
lens
disposed
Prior art date
Application number
PCT/IB2012/054598
Other languages
English (en)
Inventor
Frederic Stephane Diana
Brendan Jude Moran
Jeffrey Dellert Kmetec
Stefan Eberle
Mira Misra
Kuochou Tai
Werner Karl Goetz
Mikhail FOUKSMAN
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Publication of WO2013038304A1 publication Critical patent/WO2013038304A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

Un procédé selon des modes de réalisation de la présente invention inclut une étape consistant à disposer, sur un support secondaire (14), une pluralité de dispositifs électroluminescents (15). Chaque dispositif électroluminescent inclut une diode électroluminescente (10) qui est disposée sur un support primaire (12). Un matériau réfléchissant (18) est disposé sur une surface (16) du support secondaire entre les dispositifs électroluminescents. Après le dépôt de la pluralité de dispositifs électroluminescents sur le support secondaire, une lentille (26) est disposée au-dessus d'au moins un des dispositifs électroluminescents (15).
PCT/IB2012/054598 2011-09-14 2012-09-06 Revêtement réflecteur destiné à un support de dispositif électroluminescent WO2013038304A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161534450P 2011-09-14 2011-09-14
US61/534,450 2011-09-14

Publications (1)

Publication Number Publication Date
WO2013038304A1 true WO2013038304A1 (fr) 2013-03-21

Family

ID=47080752

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2012/054598 WO2013038304A1 (fr) 2011-09-14 2012-09-06 Revêtement réflecteur destiné à un support de dispositif électroluminescent

Country Status (2)

Country Link
TW (1) TW201323766A (fr)
WO (1) WO2013038304A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014072871A1 (fr) * 2012-11-07 2014-05-15 Koninklijke Philips N.V. Dispositif électroluminescent comprenant un filtre et une couche de protection
JP2015220392A (ja) * 2014-05-20 2015-12-07 日亜化学工業株式会社 発光装置の製造方法
JP2016518033A (ja) * 2013-05-15 2016-06-20 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 光学エレメントとリフレクタを用いた発光デバイス
JP2016174148A (ja) * 2015-03-16 2016-09-29 日東電工株式会社 光反射層付光半導体素子、および、光反射層および蛍光体層付光半導体素子の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10245946C1 (de) * 2002-09-30 2003-10-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Lichtquellenmoduls
US20060163601A1 (en) * 2003-02-28 2006-07-27 Volker Harle Lighting module and method the production thereof
US20060232969A1 (en) * 2002-09-30 2006-10-19 Georg Bogner Illumination device for backlighting an image reproduction device
US20070189007A1 (en) * 2004-03-26 2007-08-16 Keiji Nishimoto Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
EP2160082A1 (fr) * 2007-05-18 2010-03-03 Denki Kagaku Kogyo Kabushiki Kaisha Carte de circuit imprimé à base métallique
US20100315818A1 (en) * 2009-10-07 2010-12-16 Alexander Shaikevitch Reflective surface sub-assembly for a light-emitting device
EP2312659A2 (fr) * 2009-10-15 2011-04-20 LG Innotek Co., Ltd. Appareil électroluminescent

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10245946C1 (de) * 2002-09-30 2003-10-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Lichtquellenmoduls
US20060232969A1 (en) * 2002-09-30 2006-10-19 Georg Bogner Illumination device for backlighting an image reproduction device
US20060163601A1 (en) * 2003-02-28 2006-07-27 Volker Harle Lighting module and method the production thereof
US20070189007A1 (en) * 2004-03-26 2007-08-16 Keiji Nishimoto Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
EP2160082A1 (fr) * 2007-05-18 2010-03-03 Denki Kagaku Kogyo Kabushiki Kaisha Carte de circuit imprimé à base métallique
US20100315818A1 (en) * 2009-10-07 2010-12-16 Alexander Shaikevitch Reflective surface sub-assembly for a light-emitting device
EP2312659A2 (fr) * 2009-10-15 2011-04-20 LG Innotek Co., Ltd. Appareil électroluminescent

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014072871A1 (fr) * 2012-11-07 2014-05-15 Koninklijke Philips N.V. Dispositif électroluminescent comprenant un filtre et une couche de protection
JP2015535144A (ja) * 2012-11-07 2015-12-07 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． フィルタ及び保護層を含む発光デバイス
US9543478B2 (en) 2012-11-07 2017-01-10 Koninklijke Philips N.V. Light emitting device including a filter and a protective layer
US9935244B2 (en) 2012-11-07 2018-04-03 Koninklijke Philips N.V. Light emitting device including a filter and a protective layer
JP2016518033A (ja) * 2013-05-15 2016-06-20 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 光学エレメントとリフレクタを用いた発光デバイス
JP2015220392A (ja) * 2014-05-20 2015-12-07 日亜化学工業株式会社 発光装置の製造方法
JP2016174148A (ja) * 2015-03-16 2016-09-29 日東電工株式会社 光反射層付光半導体素子、および、光反射層および蛍光体層付光半導体素子の製造方法

Also Published As

Publication number Publication date
TW201323766A (zh) 2013-06-16

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