WO2013031276A1

WO2013031276A1 - Endoscope image capture unit

Info

Publication number: WO2013031276A1
Application number: PCT/JP2012/059099
Authority: WO
Inventors: 達也大丸
Original assignee: オリンパスメディカルシステムズ株式会社
Priority date: 2011-08-30
Filing date: 2012-04-03
Publication date: 2013-03-07

Abstract

An endoscope image capture unit (30) comprises: an anchoring frame (32) which is housed in a leading end part (6) of an insertion part (9) of an endoscope (2), and retains an objective optical assembly (31) in the front side thereof; an image capture unit (35) which is positioned in the rear end side of the anchoring frame (32) and further comprises a light receiving unit (36) wherein a subject image is formed by the objective optical assembly (31); and shutter parts (38) which are disposed between illumination parts (23) and the image capture unit (35), which are positioned in the leading end part (6), are disposed to be located upon tangent lines (A, B) which join end parts of the illumination parts (23) with corner parts of the light receiving part (36), and shutter stray light from the illumination parts (23) to the light receiving part (36). Flare and other light pollution from the illumination parts to a solid-state image capture element is reliably prevented, along with deterioration in ease of assembly and increasing size in the leading end part of the insertion part also being prevented.

Description

Endoscope imaging unit

The present invention relates to an endoscope imaging unit, and more particularly to an endoscope imaging unit that prevents flare and the like caused by illumination light entering a light receiving portion.

Endoscopes are widely used in the medical field and the industrial field. In a conventional endoscope, an image guide or the like is used, and what can observe the inside of a patient's body cavity, the inside of a jet engine, or the like at an eyepiece portion that a user looks into has been the mainstream.

On the other hand, in recent endoscopes, an imaging unit has been incorporated, and an electronic endoscope device has appeared that displays an object to be examined as an endoscopic image on a display device such as an external monitor. In such an electronic endoscope, a light guide bundle that transmits illumination light from a light source device is used as illumination means. An endoscope may use an LED light source as an illumination unit.

For example, Japanese Patent Application Laid-Open No. 2004-141335 discloses an endoscope in which stray light is prevented from being directly incident on a solid-state image sensor of an imaging unit due to light guide bundle breakage or the like. This conventional endoscope has a frame that covers the periphery of the incident surface of the solid-state image sensor on a support that is a light-shielding material, and stray light from the light guide bundle is directly incident on the solid-state image sensor of the image pickup unit. It is the composition which prevented.

However, in a conventional endoscope such as Japanese Patent Application Laid-Open No. 2004-141335, a frame that prevents stray light from the light guide bundle covers the periphery of the solid-state image sensor, and thus this frame is disposed. There is a problem that a space is required, and the distal end portion of the insertion portion in which the imaging unit is disposed increases in diameter. In other words, the endoscope of Patent Document 1 has a problem that the diameter of the distal end portion of the insertion portion is hindered.

In addition, if the stray light from the light guide bundle is shielded to the solid-state image sensor partly by the aluminum foil or adhesive layer in the tip part, light leakage may occur due to deterioration in assembly or assembly variation. There is a problem that there is.

Therefore, the present invention has been made in view of the above circumstances, and reliably prevents light damage such as flare to the solid-state image pickup device due to illumination light, and improves the ease of assembly and the small diameter of the distal end portion of the insertion portion. An object of the present invention is to provide an imaging unit for an endoscope that can be realized.

An endoscope imaging unit according to one aspect of the present invention is an endoscope imaging unit built in a distal end portion of an insertion portion of an endoscope, and includes a fixed frame that holds an objective optical system on the front side, An imaging unit provided on the rear side of the fixed frame and provided with a light receiving unit on which a subject image is formed by the objective optical system, and an illumination unit provided at the tip and the imaging unit A light shielding portion that is provided on a tangent line that connects an end portion in a cross section perpendicular to the longitudinal direction of the illumination portion and a corner portion of the light receiving portion, and shields stray light from the illumination portion to the light receiving portion. And.

Overall configuration diagram of an endoscope according to the first embodiment Sectional drawing which shows the structure of the front-end | tip part of an endoscope similarly FIG. 2 is a cross-sectional view taken along line III-III in FIG. Sectional view of the distal end portion of the endoscope of the modified example Sectional drawing which shows the structure of the front-end | tip part of the endoscope which concerns on 2nd Embodiment. Fig. 5 is a cross-sectional view taken along line VI-VI in Fig. 5. FIG. 5 is a cross-sectional view taken along line VII-VII in FIG. Sectional drawing which shows an example of a structure of the front-end | tip part of the endoscope which has built-in objects, such as a treatment tool channel concerning 3rd Embodiment. Sectional drawing which shows an example of a structure of the front-end | tip part of the endoscope of a 1st modification same as the above Sectional drawing which shows an example of a structure of the front-end | tip part of the endoscope of a 2nd modification same as the above Sectional drawing which shows an example of a structure of the front-end | tip part of the endoscope of a 3rd modification same as the above Sectional drawing which shows the structure of the front-end | tip part of the endoscope which concerns on a 1st reference example FIG. 12 is a cross-sectional view taken along line XIII-XIII in FIG. Sectional drawing which shows the structure of the front-end | tip part of the endoscope which concerns on a 2nd reference example. XV-XV cross-sectional view of FIG. Sectional drawing which shows the structure of the front-end | tip part of the endoscope which concerns on a 3rd reference example. Sectional drawing which shows the structure of the front-end | tip part of the endoscope in the position different from FIG. Sectional drawing which shows the structure of the front-end | tip part of the endoscope which concerns on a 4th reference example. Sectional drawing which shows the structure of the front-end | tip part of the endoscope which concerns on a 5th reference example.

Hereinafter, the endoscope apparatus according to the present invention will be described. In the following description, the drawings based on each embodiment are schematic, and the relationship between the thickness and width of each part, the thickness ratio of each part, and the like are different from the actual ones. It should be noted that the drawings may include portions having different dimensional relationships and ratios between the drawings.

Note that the endoscope in the following description of the configuration will be described by taking a so-called flexible endoscope having an insertion portion flexible for insertion into the digestive organs of the upper or lower part of the living body, but is not limited thereto. In addition, the technique can be applied to a so-called rigid endoscope having a hard insertion portion used for surgery.

(First embodiment)
First, a first embodiment of the present invention will be described with reference to the drawings. 1 to 4 relate to a first embodiment of the present invention, FIG. 1 is an overall configuration diagram of an endoscope, FIG. 2 is a sectional view showing a configuration of a distal end portion of the endoscope, and FIG. FIG. 4 is a cross-sectional view of the distal end portion of the endoscope of a modification.

As shown in FIG. 1, the electronic endoscope system 1 of the present embodiment mainly includes an endoscope 2, a light source device 3, a video processor 4, and a monitor 5.

The endoscope 2 includes a long and narrow insertion portion 9, an operation portion 10, and a universal cable 17 that is an electric cable. The insertion portion 9 of the endoscope 2 includes a distal end portion 6, a bending portion 7, and a flexible tube portion 8 in order from the distal end.

The operation unit 10 is disposed in the operation unit main body 11 and a bend preventing unit provided between the operation unit main body 11 and one end of the flexible tube 8 of the insertion unit 9, and is disposed in the insertion unit 9. And a treatment instrument channel insertion portion 18 that is an opening of a treatment instrument channel through which various treatment instruments are inserted.

The operation section main body 11 is provided with a bending operation knob 14 for bending the bending section 7 of the insertion section 9, and is provided with switches for various endoscope functions. In the bending operation knob 14, a UD bending operation knob 12 for bending the bending portion 7 in the vertical direction and an RL bending operation knob 13 for bending the bending portion 7 in the left-right direction are superimposed. It is arranged.

The universal cable 19 extended from the operation unit 10 has an endoscope connector 19a that is detachable from the light source device 3 at the extended end. The endoscope 2 according to the present embodiment is provided with a light guide bundle 23 (see FIGS. 2 and 3) that is an illumination unit as an illumination unit disposed in the universal cable 19, the operation unit 10, and the insertion unit 9. The illumination light is transmitted from the light source device 3 to the tip portion 6. Further, the endoscope connector 19a is provided with a coiled coil cable 20 extending, and an electric connector detachably attached to the video processor 4 is provided at an extended end of the coil cable 20.

The video processor 4 is electrically connected to a monitor 5 that displays an endoscopic image, and is an image pickup signal that is photoelectrically converted by an endoscope image pickup unit 30 that is an image pickup unit as an image pickup unit described later of the endoscope 2. Is output to the monitor 5 as an image signal. Although not shown, the electronic endoscope system 1 is provided with an air / water supply function for ejecting air and water from the distal end portion 6 of the insertion portion 9 of the endoscope 2 in the light source device 3.

Next, the internal configuration of the distal end portion 6 of the insertion portion 9 of the endoscope 2 will be described below based on FIG. 2 and FIG.

As shown in FIGS. 2 and 3, the distal end portion 6 of the insertion portion 9 of the endoscope 2 has a distal end rigid portion 21 that is a frame portion made of metal or hard resin, and the outer shape is mainly formed. ing.

The distal rigid portion 21 is an illumination window that irradiates the subject with illumination light transmitted from the light source device 3 on the distal flat surface portion, and here, two illumination lenses 22 are provided. That is, the illumination light is emitted from the light source in the light source device 3, transmitted to the endoscope 2 by the light guide bundle 23, and irradiated on the subject via the illumination lens 22. The light guide bundle 23 is inserted and disposed in the distal end rigid portion 21, is formed in a substantially crescent-shaped cross section so that the distal end faces the illumination lens 22, and is fixed in the distal end rigid portion 21.

In addition, the distal end rigid portion 21 incorporates an endoscope imaging unit (hereinafter simply referred to as an imaging unit) 30 according to the present embodiment.

The imaging unit 30 includes an objective lens group 31 that is an objective optical system, a substantially tubular lens frame 32 that is a fixed frame that holds the objective lens group 31, and a cover glass 33 that is held behind the lens frame 32. And a solid-state imaging device 35 of imaging means (imaging unit) fixed to the cover glass 33 with an optical adhesive, and an imaging substrate 37 electrically connected to the solid-state imaging device 35. It is configured.

The objective lens group 31 includes a state-of-the-art first objective lens 31a that is an observation window, and a second objective lens 31b that is held in the middle of the lens frame 32 behind the objective lens 31a. Has been. The lens frame 32 is fixed so that the tip flat surface of the tip hard portion 21 and the surface of the first objective lens 31a are arranged in the same plane.

The imaging unit 30 is configured so that imaging light (subject image) of the optical axis O that enters the objective lens group 31 is imaged by the light receiving unit 36 of the solid-state imaging device 35. This solid-state image sensor 35 photoelectrically converts photographic light and outputs imaging data of the subject to the imaging substrate 37. The imaging board 37 appropriately processes the imaging data and outputs it to an electrically connected communication cable (not shown). This communication cable is inserted and arranged in the endoscope 2 and is electrically connected to the video processor 4 as an external device via an electrical connector provided on the coil cable 20 extending from the endoscope connector 19a. .

By the way, in the imaging unit 30 of the present embodiment, the two collar portions 38 serving as a light shielding unit at the rear part of both end portions of the lens frame 32 are more than the light receiving surface of the light receiving unit 36 of the solid-state imaging device 35. It is arranged to extend rearward by a predetermined distance L (see FIG. 2). In other words, each of the two brim portions 38 is wrapped on the opposite side surface of the solid-state imaging element 35, that is, the surface position of the light receiving portion 36 (the position of the light receiving surface) is disposed to face the projected region. A predetermined distance L extends from 36 to the rear.

The two flanges 38 have a flat plate shape, and an adhesive 39 is filled and fixed in a gap between the cover glass 33 and the flat surface facing the side surface of the solid-state imaging device 35. The adhesive 39 is black and non-light transmissive. In addition, the two flange portions 38 are such that the outer surface of the tip portion 6 faces the light guide bundle 23, and here, at least the side portion of the light receiving portion 36 of the solid-state image sensor 35 exceeds the upper and lower ends. A predetermined height H is set.

In the imaging unit 30 configured as described above, the upper ends of the two flange portions 38 are located above the upper end of the light guide bundle 23 with respect to the upper end corner of the light receiving unit 36 of the solid-state imaging device 35, and the solid-state imaging is performed. The lower ends of the two flange portions 38 are positioned below the lower end of the light guide bundle 23 relative to the lower end corners of the light receiving portion 36 of the element 35.

In other words, the imaging unit 30 has two tangents A and B connecting the upper and lower ends in the cross section of the two light guide bundles 23 and the upper and lower corners of the light receiving unit 36 of the solid-state imaging device 35 far from the upper and lower ends. The predetermined height H of the two collar portions 38 is set so that the two collar portions 38 pass at least in positions. In addition to this, in the imaging unit 30, the light receiving unit 36 of the solid-state imaging device 35 is behind the surface (light receiving surface) of the light receiving unit 36 of the solid-state imaging device 35 by a predetermined distance L as described above for the two flanges 38. Therefore, the light receiving part 36 is disposed at a position where the light receiving part 36 is shielded by the two flange parts 38, and stray light from the two light guide bundles 23 is prevented from entering. It becomes the composition. Further, as described above, since the adhesive 39 is black and non-light-transmitting, the adhesive 39 enters from the rear end side of the flange portion 38 and is reflected on the rear surface of the cover glass 33 or is formed inside the cover glass 33. The stray light F (see FIG. 2) that enters and diffuses and eventually enters the surface of the light receiving unit 36 can be blocked by the adhesive 39. Even if it is assumed that the stray light F can pass through the layer of the adhesive 39, it is light that has passed through the adhesive 39 and is reflected on the rear surface of the cover glass 33. When the light enters the light receiving unit 36, the light becomes extremely weak, and the influence of flare and the like on the light receiving unit 36 can be suppressed as much as possible.

From the above description, the image pickup unit 30 of the present embodiment can reliably prevent light damage such as flare to the solid-state image sensor due to illumination light. Furthermore, since the imaging unit 30 does not surround the solid-state imaging device 35 with the collar part 38 but the collar part 38 is disposed only between the light receiving part 36 and the light guide bundle 23, the distal end rigid part 21. It is possible to reduce the diameter of the tip portion 6 without requiring a useless space inside. Since the imaging unit 30 is configured to shield the light receiving unit 36 of the solid-state imaging device 35 from the two light guide bundles 23 with the two flanges 38 formed integrally with the lens frame 32, the imaging unit 30 is partially made of aluminum foil. Compared to the configuration in which the light is blocked by the adhesive layer or the adhesive layer, the light can be reliably shielded from light without causing deterioration in assembling property or light leakage from the light guide bundle 23 due to assembly variation.

The light guide bundle 23 is not limited to a substantially crescent-shaped cross section, and may have a circular cross section, for example, as shown in FIG.

Specifically, in the imaging unit 30, the upper ends of the two flange portions 38 are positioned above the upper end of the light guide bundle 23 with respect to the upper end corner of the light receiving unit 36 of the solid-state imaging device 35, and the solid-state imaging device 35. The lower ends of the two flange portions 38 are positioned below the lower end of the light guide bundle 23 relative to the lower end corners of the light receiving portion 36.

That is, as described above, the imaging unit 30 includes the upper and lower ends of the two light guide bundles 23 in which the predetermined height H of the two flange portions 38 has a circular cross section, and the solid-state imaging device farther from the upper and lower ends. The two collars 38 are set so as to pass through the tangent lines A and B connecting the upper and lower corners of the 35 light-receiving parts 36, and the two collars 38 are connected to the light-receiving part 36 of the solid-state imaging device 35. What is necessary is just to arrange | position so that only the predetermined distance L may extend back from the surface. Thereby, the imaging unit 30 arranges the two collar portions 38 at positions where the stray light from the light guide bundle 23 is shielded, thereby preventing the stray light from the two light guide bundles 23 from increasing in size. Is prevented from entering the light receiving unit 36.

(Second Embodiment)
Next, a second embodiment will be described based on FIGS. This embodiment is a modification of the first embodiment, and the same members are denoted by the same reference numerals and detailed description thereof is omitted. 5 to 7 relate to a second embodiment of the present invention, FIG. 5 is a cross-sectional view showing the configuration of the distal end portion of the endoscope, FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. FIG. 7 is a sectional view taken along line VII-VII in FIG. 5.

As shown in FIGS. 5 and 6, the imaging unit 30 of the present embodiment includes a prism 41 that changes the direction by reflecting photographing light having an optical axis O, and the photographing light reflected by the prism 41 is downward. It is configured to enter the light receiving portion 36 of the solid-state imaging device 35 disposed on the side. In addition, the prism 41 has a configuration in which the protective glass 42 is attached to the reflective surface 41a and the reflective surface 41a is protected.

Here, the lens frame 32 of the image pickup unit 30 is located on the lower side so that the two flange portions 43 serving as light shielding means (light shielding portions) wrap around the surface of the light receiving portion 36 of the solid-state imaging device 35 at the rear portions of both side end portions. A predetermined height H is set so as to extend. These two flanges 43 have a flat plate shape as in the first embodiment. Here, the adhesive 39 is filled and fixed in a gap between the side surfaces of the prism 41 and the protective glass 42. Yes. Here, the two flange portions 38 are also opposed to the light guide bundle 23 whose outer surface of the tip portion 6 has a substantially crescent-shaped cross section.

The two flange portions 43 of the present embodiment are extended to the rear side with a predetermined distance d so as to wrap around the reflecting surface 41a of the prism 41 facing each other. Further, the imaging unit 30 here has two upper and lower ends of the two light guide bundles 23 and two tangents C connecting the left and right corners of the light receiving unit 36 of the solid-state imaging device 35 close to the upper and lower ends. A predetermined height H of the two flanges 43 is set so as to pass through the flanges 43.

From the above, the imaging unit 30 has the effects described in the first embodiment, and even when the photographing light having the optical axis O is reflected by the prism 41, the solid-state imaging disposed on the lower side. The light receiving portion 36 of the element 35 is arranged at a position where the stray light from the two light guide bundles 23 is shielded by the two flange portions 43, so that the tip portion 6 is not enlarged and the two light guide bundles 23 are not enlarged. The stray light is prevented from entering the light receiving unit 36.

(Third embodiment)
Next, a third embodiment will be described with reference to FIGS. This embodiment is a modification of the first embodiment, and the same members are denoted by the same reference numerals and detailed description thereof is omitted. 8 to 11 relate to a third embodiment of the present invention, FIG. 8 is a cross-sectional view showing an example of the configuration of the distal end portion of an endoscope having a built-in object such as a treatment instrument channel, and FIG. FIG. 10 is a sectional view showing an example of the configuration of the distal end portion of the endoscope according to the second modified example, and FIG. 11 is a sectional view showing an example of the configuration of the distal end portion of the endoscope according to the second modified example. It is sectional drawing which shows an example of a structure of the front-end | tip part of the endoscope of an example.

As shown in FIG. 8, in the endoscope 2 of the present embodiment, for example, a treatment instrument channel 51 is inserted and disposed at the distal end portion 6, and the light shielding means is integrally formed with the lens frame 32 of the imaging unit 30. The collar portion 45 which is a (light-shielding portion) is formed in a U-shaped cross section so that stray light from the light guide bundle 23 having a substantially crescent-shaped cross section is shielded.

More specifically, the heel portion 45 continuously covers one side portion of the solid-state imaging device 35 facing the treatment instrument channel 51 in the space of the distal end rigid portion 21 of the distal end portion 6 and the upper and lower ends of the solid-state imaging device 35. It has a U-shaped cross section. The flange portion 45 is set so that a tangent line D connecting the end portions of the two light guide bundles 23 and the corner portion of the light receiving portion 36 of the solid-state imaging device 35 passes.

Even with the configuration as described above, the imaging unit 30 has the effects described in the first embodiment, and a built-in object such as the treatment instrument channel 51 is inserted and disposed in the space of the distal end rigid portion 21. However, the light receiving portion 36 of the solid-state imaging device 35 disposed on the lower side is disposed at a position where the stray light from the two light guide bundles 23 is shielded by the flange portion 45 having a U-shaped cross section. It is possible to prevent the stray light from these two light guide bundles 23 from entering without increasing the size of 6.

(First modification)
As shown in FIG. 9, the lens unit 32 is integrated with the lens frame 32 so that a tangent line D connecting the ends of the two light guide bundles 23 and the corners of the light receiving unit 36 of the solid-state image sensor 35 passes. Two plate-shaped flange portions 46 which are light shielding means (light shielding portions) to be formed may be formed.

(Second modification)
Further, when the two light guide bundles 23 have a circular cross section, as shown in FIG. 10, two flange portions 47 that are light shielding means (light shielding portions) integrally formed on the lens frame 32 of the imaging unit 30 are provided. A notch 47a is formed so as to have an L-shaped cross section, and a space for accommodating the treatment instrument channel 51, which is a built-in object, is secured by using the notch 47a to enlarge the distal end portion 6. It is good also as a structure.

Note that, in the internal space of the distal end rigid portion 21, two end portions of the flange portion 47 in which the notch portion 47 a is formed, and two corner portions of the light receiving portion 36 of the solid-state imaging device 35 adjacent to these two end portions. If the two light guide bundles 23 are not arranged in the region α surrounded by the two tangents D connecting the two diagonally, stray light from the two light guide bundles 23 can be prevented from entering. .

(Third Modification)
Further, when the two light guide bundles 23 have a circular cross section, as shown in FIG. 11, according to the directivity of the stray light of the light guide bundle 23, the ends of the light guide bundles 23 and the solid-state image sensor Depending on the position through which the tangent line E that connects the corners of the 35 light receiving portions 36 passes, a plurality of plate-like flange portions 46, here two, may be formed integrally with the lens frame 32 of the imaging unit 30.

(Reference example)
Hereinafter, reference examples will be described based on FIGS.

12 and 13 relate to the first reference example, FIG. 12 is a cross-sectional view showing the configuration of the distal end portion of the endoscope, FIG. 13 is a cross-sectional view taken along the line XIII-XIII of FIG. 12, and FIGS. 15 relates to the second reference example, FIG. 14 is a sectional view showing the configuration of the distal end portion of the endoscope, FIG. 15 is a sectional view taken along the line XV-XV in FIG. 14, and FIGS. 16 and 17 are the third reference example. 16 is a sectional view showing the configuration of the distal end portion of the endoscope, FIG. 17 is a sectional view showing the configuration of the distal end portion of the endoscope at a position different from FIG. 16, and FIG. 18 is a fourth reference example. FIG. 19 is a cross-sectional view showing the configuration of the distal end portion of the endoscope according to the fifth reference example.

(First reference example)
As shown in FIG. 12 and FIG. 13, the endoscope 2 of the present reference example has a distal end rigid portion 21 of the distal end portion 6 formed of a non-conductive hard resin and is continuously provided behind the distal end rigid portion 21. A resin pipe 24 such as rubber, and a metal pipe 25 disposed on the inner surface of the resin pipe 24 are provided.

Further, the hard end portion 21 here includes two projecting portions 34 extending vertically. These protrusions 34 are vertically extended so as to be close to the metal pipe 25 in a non-contact manner, and a separation distance g from the metal pipe 25 is set to about 0.2 mm, for example.

In the endoscope 1 of the present modification configured as described above, static electricity from the distal end hard portion 21 is discharged to the metal pipe 25 via the two protrusions 34. The applied electric charge is configured to safely flow to the GND of the video processor 4 from the bent pipe of the metal pipe 25 or the bending portion 7 through the shield of the flexible tube portion 8. Thereby, the endoscope 1 can be configured such that static electricity is difficult to discharge toward the electrical configuration in the distal end portion 6, in this example, the solid-state imaging device 35.

(Second reference example)
As shown in FIG. 14, the endoscope 2 of the present reference example covers the periphery of the imaging substrate 37 on which the solid-state imaging device 35 and the electronic components are mounted up to the distal end portion of the imaging cable 63 that extends to the imaging unit 30. Two first and second

adhesive layers

61 and 62 are provided.

As the first adhesive layer 61 on the inner side, an adhesive that becomes hard when solidified with high vapor permeability is used, and a second adhesive layer 62 that covers the periphery of the first adhesive layer 61 is used. Uses an adhesive that is softer than the first adhesive layer 61 when vapor permeability is low and solidifies. Further, the lens frame 32 of the fixed frame that fixes and holds the solid-state imaging device 35 through the cover glass 33 here is formed of a resin member such as PEEK, or a sintered member such as ceramic.

As described above, the imaging unit 30 has the vapor intrusion around the imaging substrate 37 on which the solid-state imaging device 35 and the electronic components are mounted by the two first and second

adhesive layers

61 and 62 having different vapor permeability. Is reduced.

As shown in FIG. 15, the imaging cable 63 is provided with double

integrated shields

65 and 66 on the inner side of the outer skin 64, so that electromagnetic waves radiated from the internal signal plug can be prevented, and EMC resistance is improved. Can be improved. Further, the double

integrated shields

65 and 66 are fixed with the outer peripheral portion of the tip entangled with a soft conducting wire 65a.

(Third reference example)
As shown in FIGS. 16 and 17, the endoscope 2 of the present reference example is provided with a tubular reinforcing frame 67a formed of nickel or the like on the rear outer peripheral portion of the distal end rigid portion 21 of the imaging unit 30, and this reinforcing frame 67a. The first insulating tube 67 is configured to cover the periphery of the. Further, the rear end of the first insulating tube 67 is covered by about 1 mm so as to overlap with the outer end of the second insulating tube 68 that covers the outer peripheral portion of the distal end of the imaging cable 63. That is, the imaging unit 30 of the endoscope 2 of the present reference example has an insulating heat shrinkable tube that is divided into two in the longitudinal direction of the insertion portion 9.

The first insulating tube 67 on the distal end side is thinner than the second insulating tube 68 and has a lower glass transition point than the second insulating tube 68 on the proximal end side. As a result, the thermal load on the solid-state image sensor 35 during assembly can be reduced, and a more stable insulating tube can be used in a portion where stress is easily applied on the proximal end side of the imaging unit 30. Is possible.

The imaging unit 30 is provided with an electronic component 37a mounted on the imaging substrate 37 and a high thermal conductivity member 70 made of, for example, graphite sheet, which is installed on the general shield 65 of the imaging cable 63. The high thermal conductivity member 70 is provided so that the tip portion is in surface contact with the electronic component 37 a and the base end portion is in surface contact with the general shield 65, and heat generated in the electronic component 37 a is inserted into the endoscope insertion portion via the general shield 65. Heat can be dissipated by guiding it to the base end side. Therefore, it is possible to obtain the imaging unit 30 having excellent electrical characteristics.

(Fourth reference example)
As shown in FIG. 18, in the endoscope 2 of the present reference example, the distal end rigid portion 21 of the imaging unit 30 is formed of a hard resin, and the tubular insulating tube 71 fitted to the midway outer peripheral portion of the distal end rigid portion 21. Are disposed so as to wrap around the solid-state imaging device 35 and the imaging substrate 37. The insulating tube 71 is formed of a polyimide tube or the like, which is a material having a glass transition point higher than the reprocessing temperature such as autoclave sterilization.

With such a configuration, the endoscope 1 has an insulating structure between the distal end side and the proximal end side by the resinous distal rigid portion 21 and the insulating tube 71 in which the solid-state imaging device 35 and the imaging substrate 37 are held at the distal end portion 6. Therefore, it is possible to provide the imaging unit 30 that is small and more excellent in insulation.

(Fifth reference example)
As shown in FIG. 19, the endoscope 2 of the present reference example covers the solid-state imaging device 35 and the imaging substrate 37 of the imaging unit 30 with a first adhesive layer 72, and surrounds the first adhesive layer 72. Insulating tube 73 is provided. The insulating tube 73 is disposed inside the reinforcing frame 67a, and the second adhesive layer 74 is solidified around it. Even with such rigidity, the solid-state imaging device 35 and the imaging substrate 37 can be insulated from each other at the distal end portion 6.

The invention described in the above embodiment is not limited to the embodiment and modifications, and various modifications can be made without departing from the scope of the invention in the implementation stage. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the described requirements can be deleted if the stated problem can be solved and the stated effect can be obtained. Such a configuration can be extracted as an invention.

This application is filed on the basis of the priority claim of Japanese Patent Application No. 2011-187838 filed in Japan on August 30, 2011, and the above content includes the present specification, claims, and It is cited in the drawing.

Claims

An endoscope imaging unit built in a distal end portion of an insertion portion of an endoscope,
A fixed frame for holding the objective optical system on the front side;
An imaging unit provided on a rear side of the fixed frame and provided with a light receiving unit on which a subject image is formed by the objective optical system;
Provided between the illumination unit disposed at the tip and the imaging unit, and located on a tangent line connecting the end of the cross section perpendicular to the longitudinal direction of the illumination unit and the corner of the light receiving unit A light-shielding unit that shields stray light from the illumination unit to the light-receiving unit;
An imaging unit for an endoscope, comprising:
The said light-shielding part is integrally formed so that it may extend in the back of the said fixed frame, and it has extended back only predetermined distance rather than the light-receiving surface of the said light-receiving part. Endoscope imaging unit.
A prism that refracts and reflects imaging light from the objective optical system is joined to the solid-state imaging device,
The light shielding portion is integrally formed with the fixed frame, extends rearward from the reflecting surface of the prism, and extends downward by a predetermined distance from the light receiving surface of the light receiving portion. The endoscope imaging unit according to claim 1.
An endoscope imaging unit built in a distal end portion of an insertion portion of an endoscope,
A fixed frame for holding the objective optical system on the front side;
An imaging means provided on the rear side of the fixed frame and provided with a light receiving unit on which a subject image is formed by the objective optical system;
Provided between the illuminating means disposed at the tip and the imaging means so as to be located on a tangent line connecting the end of the section perpendicular to the longitudinal direction of the illuminating means and the corner of the light receiving part. A light shielding means for shielding stray light of the illumination means to the light receiving unit,
An imaging unit for an endoscope, comprising: