WO2013029372A1 - Microruban - Google Patents

Microruban Download PDF

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Publication number
WO2013029372A1
WO2013029372A1 PCT/CN2012/073683 CN2012073683W WO2013029372A1 WO 2013029372 A1 WO2013029372 A1 WO 2013029372A1 CN 2012073683 W CN2012073683 W CN 2012073683W WO 2013029372 A1 WO2013029372 A1 WO 2013029372A1
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WO
WIPO (PCT)
Prior art keywords
substrate
microstrip line
metamaterial
line according
refractive index
Prior art date
Application number
PCT/CN2012/073683
Other languages
English (en)
Chinese (zh)
Inventor
刘若鹏
季春霖
岳玉涛
李星坤
周添
宿超
杨树坤
Original Assignee
深圳光启高等理工研究院
深圳光启创新技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201110254575.2A external-priority patent/CN102956942B/zh
Priority claimed from CN201110255253.XA external-priority patent/CN102956944B/zh
Priority claimed from CN201110254581.8A external-priority patent/CN102956943B/zh
Application filed by 深圳光启高等理工研究院, 深圳光启创新技术有限公司 filed Critical 深圳光启高等理工研究院
Publication of WO2013029372A1 publication Critical patent/WO2013029372A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines

Definitions

  • the present invention relates to the field of microstrip lines and, more particularly, to a microstrip line.
  • Microstrip Line is a hybrid microwave integrated circuit (Hybrid Microwave) Integrated Circuits, HMIC) and Monolithic Microwave Integrated Circuits (Monolithic Mictowave Integrated One of the most widely used planar transmission lines in Circuits, MMIC.
  • HMIC Hybrid Microwave
  • MMIC Monolithic Microwave Integrated Circuits
  • FIG. 1 from the structural point of view, the microstrip line is placed on the grounding plate 3 by a very thin metal strip 1 at a distance much smaller than the wavelength, and the metal strip 1 and the grounding plate 2 are separated by the dielectric substrate 3. open.
  • microstrip line is compact and lightweight, and can be used to make complex microwave circuits in a small volume by stereolithography, photolithography, etching, etc., and is easy to integrate with other microwave devices to realize microwave components and systems. Integration.
  • microstrip transmission lines can be used instead of waveguides to form microwave circuits and form various complex planar circuits on the same substrate, including Bridge circuit, matching load, attenuator antenna, etc.
  • the use of microstrip line transmission also has the disadvantages of large loss of microstrip line, crosstalk caused by easy leakage of electromagnetic energy, low Q value, difficulty in fine adjustment, and small power capacity.
  • the guided electromagnetic wave on the microstrip line continuously radiates energy along the axial direction of the microstrip line to generate leakage waves, wherein the electromagnetic wave leakage has two forms: surface wave form 5 and spatial wave form 4 ,as shown in picture 2.
  • the electromagnetic wave leakage has two forms: surface wave form 5 and spatial wave form 4 ,as shown in picture 2.
  • This leakage main mode leaks electromagnetic wave energy outward in the form of surface waves.
  • each higher order mode of the microstrip line is in the form of spatial wave. External leakage of electromagnetic wave energy.
  • a method for suppressing leakage of a microstrip main mode is mainly to apply a thin dielectric layer having a sufficiently large dielectric constant on the microstrip line; however, for the suppression of high order mode leakage of the microstrip line, there is no What is a simple and effective method. This is mainly due to the difference in the physical mechanism of the leakage of the main mode of the microstrip line and the leakage of the high-order mode. The spatial wave leakage of the higher-order mode of the microstrip line is hardly suppressed.
  • the object of the present invention is to overcome the defects of the spatial wave leakage of the high-order mode of the microstrip line in the prior art, and provide a microstrip line based on a metamaterial, which can effectively suppress the leakage of the space wave and solve the problem between the microstrip lines.
  • a technical solution adopted by the present invention is to provide a microstrip line including a metal strip, a dielectric substrate and a grounding plate, the microstrip line further comprising a metamaterial film, a metamaterial film and a metal strip It is located on one side of the dielectric substrate and is in close contact with the dielectric substrate, wherein the metamaterial film covers the metal strip, and the ground plate is located on the other side of the dielectric substrate.
  • the metamaterial film is formed by stacking a plurality of metamaterial sheets, and the plurality of metamaterial sheets have the same refractive index distribution.
  • Each of the metamaterial sheets is composed of a plurality of metamaterial units.
  • the metamaterial unit includes an artificial microstructure and a unit substrate to which the artificial microstructure is attached.
  • the artificial microstructure is a planar structure or a three-dimensional structure composed of at least one wire responsive to an electromagnetic field, and the wire is a copper wire or a silver wire.
  • the wire is attached to the unit substrate by etching, electroplating, drilling, photolithography, electron engraving or ion etching.
  • the artificial microstructure is any one of a snowflake-shaped or snowflake-shaped derivative.
  • the unit substrate is made of ceramic material, epoxy resin, polytetrafluoroethylene, FR-4 composite material or F4B composite material.
  • the refractive index distribution in each super-material layer is uniform, and the refractive index has a value ranging from 0 to 1.
  • the refractive index in each super-material layer is 0.7.
  • the dielectric substrate is formed by splicing a first substrate and a second substrate.
  • the first substrate and the second substrate have different refractive index distributions, and the second substrate is spliced on both sides of the first substrate.
  • the first substrate is formed by splicing a first substrate and a second substrate.
  • the first substrate and the second substrate have different refractive index distributions, and the second substrate is spliced on both sides of the first substrate.
  • the first substrate is formed by splicing a first substrate and a second substrate.
  • the refractive index of the first substrate is smaller than the refractive index of the second substrate.
  • the material of the first substrate is FR-4.
  • the second substrate is an alumina ceramic material.
  • the beneficial effects of the present invention are that the microstrip line based on the metamaterial can effectively suppress the leakage wave in the form of a space wave of the microstrip line and reduce the electromagnetic wave crosstalk of the adjacent microstrip line. .
  • FIG. 1 is a schematic structural view of a microstrip line in the prior art
  • FIG. 2 is a schematic view showing two types of leakage waves of a microstrip line in the prior art
  • FIG. 3 is a schematic structural view of a microstrip line according to a first embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a metamaterial film according to a first embodiment of the present invention.
  • Figure 5 is a schematic structural view of a metamaterial unit according to a first embodiment of the present invention.
  • FIG. 6 is a schematic structural view of a microstrip line according to a second embodiment of the present invention.
  • Figure 7 is a schematic structural view of a microstrip line according to a third embodiment of the present invention.
  • FIG. 8 is a schematic structural view of a microstrip line according to a fourth embodiment of the present invention.
  • FIG. 9 is a schematic structural view of a microstrip line according to a fifth embodiment of the present invention.
  • Figure 10 is a schematic view showing the structure of a microstrip line according to a sixth embodiment of the present invention.
  • the present invention is based on the structure diagram of a micro-belt line of a metamaterial.
  • the microstrip line includes a metal strip 10, a grounding plate 20, and a dielectric substrate 30, wherein the metal strip 10 and the grounding plate 20 are respectively located on the dielectric substrate 30.
  • the metal strip 10 is generally disposed on the dielectric substrate 30 by means of circuit printing.
  • a surface of the dielectric substrate on the same side of the metal strip 10 is coated with a layer of metamaterial 40, and The metamaterial film 40 completely covers the metal strip 10.
  • both the metal strip 10 and the grounding plate 20 are made of the same metal, and copper is generally used.
  • the super-material film 40 is used as the cover metal strip 10, thereby reducing electromagnetic wave crosstalk between adjacent microstrip lines.
  • the metamaterial film 40 is comprised of a plurality of metamaterial sheets 401, each of which is comprised of a plurality of metamaterial units 50 comprising an artificial microstructure 502 and a unit for attachment of the artificial microstructure 502 Substrate 501.
  • the plurality of metamaterial sheets 401 are a plurality of metamaterial sheets having the same refractive index distribution.
  • each metamaterial sheet 401 has a value of 0.7.
  • the topology, geometry, and unit cell 501 of the artificial microstructure 502 can be theoretically and practically demonstrated.
  • the distribution of the unit substrate 501 is made of a dielectric insulating material, which may be a ceramic material, a polymer material, a ferroelectric material, a ferrite material, a ferromagnetic material, etc., and the polymer material may be, for example, an epoxy resin or a poly Tetrafluoroethylene.
  • the artificial microstructure 502 is a metal wire which is attached to the unit substrate 501 in a certain geometric shape and is responsive to electromagnetic waves.
  • the metal wire may be a copper wire or a silver wire having a cylindrical or flat shape, and is generally made of copper because The copper wire is relatively cheap. Of course, the cross section of the metal wire can also be other shapes.
  • the metal wire is attached to the unit substrate 501 by etching, electroplating, drilling, photolithography, electron engraving or ion etching, and each of the super material sheets.
  • Layer 401 is comprised of a plurality of metamaterial units 50, each having an artificial microstructure 502, each of which reacts to electromagnetic waves passing therethrough, thereby affecting the transmission of electromagnetic waves therein, each
  • the size of the metamaterial unit 50 depends on the electromagnetic wave that needs to be responsive, typically one tenth of the wavelength of the electromagnetic wave that is required to respond, otherwise the arrangement of the metamaterial unit 50 containing the artificial microstructure 502 in space cannot be viewed in space. For continuous.
  • the equivalent dielectric constant and equivalent of each place on the metamaterial can be adjusted.
  • the magnetic permeability in turn changes the equivalent refractive index throughout the metamaterial.
  • the pattern of the artificial microstructure 502 used in this embodiment is a snowflake-shaped derivative pattern. As can be seen from FIG. 4 and FIG. 5, the size of the snowflake artificial microstructure 502 can be determined according to a specific application.
  • a microstrip line includes a metal strip 100, a dielectric substrate, and a ground plate 200.
  • the dielectric substrate is formed by splicing the first substrate 400 and the second substrate 300, and the first substrate 400 and the second substrate
  • the substrate 300 has different refractive index distributions, and the second substrate 300 is spliced on both sides of the first substrate 400.
  • the first substrate 400 is disposed directly under the metal strip 100, and the ground plate 200 is directly under the dielectric substrate.
  • the material of the first substrate 400 is FR-4.
  • the second substrate 300 is an alumina ceramic material.
  • the refractive index of the first substrate 400 is smaller than the refractive index of the second substrate 300.
  • the refractive range of the first substrate 400 is 2 to 10.
  • the second substrate 300 has a refractive range of 10 to 20.
  • the first substrate 400 has a refraction of 4.5.
  • the second substrate 300 has a refraction of 12.
  • a suspended microstrip line is different from Embodiment 2 in that the grounding plate 200 is suspended directly below the dielectric substrate and is not in close contact with the medium.
  • the substrate was the same as in the second embodiment.
  • FIG. 8 it is an inverted microstrip line, which is different from Embodiment 3 in that the metal strip 100 is located on the same side as the ground plane 200 and is in close contact with the dielectric substrate, and the others are the same as in Embodiment 3. .
  • FIG. 9 it is a coupled microstrip line, which is different from Embodiment 2 in that two identical metal strips 100 are disposed on one side of the dielectric substrate, and a grounding plate 200 is disposed on the other side.
  • the refractive index distribution of the dielectric substrate under each of the metal strips 100 is the same as that of the second embodiment.
  • the microstrip line includes a metal strip 610, a dielectric substrate, and a grounding plate 620.
  • the microstrip line further includes a metamaterial film 650.
  • the metamaterial film 650 and the metal strip 610 are located on one side of the dielectric substrate and are in close contact with the dielectric substrate. Among them, the metamaterial film 650 covers the metal strip 610.
  • the first substrate 640 and the second substrate 630 have different refractive index distributions, and the second substrate 630 is spliced on both sides of the first substrate 640, wherein the metal strip A first substrate 640 is disposed directly below the 610, and the ground plate 620 is located on the other side of the dielectric substrate.
  • the metamaterial film 650 is, for example, the metamaterial film 40 described in the first embodiment.
  • the dielectric substrate, metal strip 610, and ground plane are, for example, described in Examples 2-5.
  • the beneficial effects of the present invention are that the microstrip line based on the metamaterial can effectively suppress the leakage wave in the form of a space wave of the microstrip line and reduce the electromagnetic wave crosstalk of the adjacent microstrip line. .

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Abstract

La présente invention concerne le domaine des microrubans. Un microruban est décrit. Le microruban comprend un ruban métallique, un substrat diélectrique et une plaque de masse. Le microruban comprend également un film mince de métamatériau. Le film mince de métamatériau et le ruban métallique sont agencés sur un même côté du substrat diélectrique et sont tous les deux fixés au substrat diélectrique. Le film mince en métamatériau couvre le ruban métallique. La plaque de masse est agencée de l'autre côté du substrat diélectrique. Le microruban selon la présente invention permet d'empêcher efficacement une fuite d'onde d'espace, ce qui résout le problème d'intermodulation d'ondes électromagnétiques entre microrubans.
PCT/CN2012/073683 2011-08-31 2012-04-09 Microruban WO2013029372A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201110255253.X 2011-08-31
CN201110254575.2A CN102956942B (zh) 2011-08-31 2011-08-31 基于超材料的微带线
CN201110254581.8 2011-08-31
CN201110255253.XA CN102956944B (zh) 2011-08-31 2011-08-31 一种微带线
CN201110254581.8A CN102956943B (zh) 2011-08-31 2011-08-31 基于超材料的微带线
CN201110254575.2 2011-08-31

Publications (1)

Publication Number Publication Date
WO2013029372A1 true WO2013029372A1 (fr) 2013-03-07

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PCT/CN2012/073683 WO2013029372A1 (fr) 2011-08-31 2012-04-09 Microruban

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WO (1) WO2013029372A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682167A (en) * 1995-03-22 1997-10-28 The Charles Stark Draper Laboratory Mesa antenna
US20080266028A1 (en) * 2005-12-15 2008-10-30 Nxp B.V. Enhanced Substrate Using Metamaterials
CN101919109A (zh) * 2007-02-07 2010-12-15 台湾积体电路制造股份有限公司 使用超材料的传输线的设计方法
CN102160175A (zh) * 2008-08-22 2011-08-17 台湾积体电路制造股份有限公司 采用超材料的阻抗受控制的电性内连线

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682167A (en) * 1995-03-22 1997-10-28 The Charles Stark Draper Laboratory Mesa antenna
US20080266028A1 (en) * 2005-12-15 2008-10-30 Nxp B.V. Enhanced Substrate Using Metamaterials
CN101919109A (zh) * 2007-02-07 2010-12-15 台湾积体电路制造股份有限公司 使用超材料的传输线的设计方法
CN102160175A (zh) * 2008-08-22 2011-08-17 台湾积体电路制造股份有限公司 采用超材料的阻抗受控制的电性内连线

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHENG, C.Y ET AL.: "Tailoring Double-Negative Metamaterial Responses to Achieve Anomalous Propagation Effects Along Microstrip Transmission Lines", IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. 51, no. 12, December 2003 (2003-12-01), pages 2306 - 2308 *
HASHIMOTO, K. ET AL.: "Development of Low Characteristic Impedance Transmission Line for Power Supply", VLSI PACKAGING WORKSHOP OF JAPAN, 2008, vol. 71, December 2008 (2008-12-01) *

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