WO2013028616A3 - Flip-chip bonded imager die - Google Patents

Flip-chip bonded imager die Download PDF

Info

Publication number
WO2013028616A3
WO2013028616A3 PCT/US2012/051573 US2012051573W WO2013028616A3 WO 2013028616 A3 WO2013028616 A3 WO 2013028616A3 US 2012051573 W US2012051573 W US 2012051573W WO 2013028616 A3 WO2013028616 A3 WO 2013028616A3
Authority
WO
WIPO (PCT)
Prior art keywords
flip
imager die
chip bonded
circuit board
optical layer
Prior art date
Application number
PCT/US2012/051573
Other languages
French (fr)
Other versions
WO2013028616A2 (en
Inventor
Timothy Patrick PATTERSON
Tim Moran
Craig Forrest
Original Assignee
Imi Usa, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imi Usa, Inc. filed Critical Imi Usa, Inc.
Priority to KR1020147007313A priority Critical patent/KR20140083993A/en
Priority to EP12768926.3A priority patent/EP2745324A2/en
Priority to JP2014526271A priority patent/JP2014527722A/en
Publication of WO2013028616A2 publication Critical patent/WO2013028616A2/en
Publication of WO2013028616A3 publication Critical patent/WO2013028616A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An image sensor includes an imager die, a circuit board, and an optical layer. The circuit board is flip-chip bonded to the imager die. The optical layer is adhered to the circuit board and includes a first portion configured to refract light differently than a second portion. Both the first portion and the second portion are integrally formed with the optical layer.
PCT/US2012/051573 2011-08-19 2012-08-20 Flip-chip bonded imager die WO2013028616A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020147007313A KR20140083993A (en) 2011-08-19 2012-08-20 Flip-chip bonded imager die
EP12768926.3A EP2745324A2 (en) 2011-08-19 2012-08-20 Flip-chip bonded imager die
JP2014526271A JP2014527722A (en) 2011-08-19 2012-08-20 Flip chip mounted imaging chip

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161525372P 2011-08-19 2011-08-19
US61/525,372 2011-08-19

Publications (2)

Publication Number Publication Date
WO2013028616A2 WO2013028616A2 (en) 2013-02-28
WO2013028616A3 true WO2013028616A3 (en) 2013-06-27

Family

ID=46970385

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/051573 WO2013028616A2 (en) 2011-08-19 2012-08-20 Flip-chip bonded imager die

Country Status (4)

Country Link
EP (1) EP2745324A2 (en)
JP (1) JP2014527722A (en)
KR (1) KR20140083993A (en)
WO (1) WO2013028616A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10108073B2 (en) 2017-03-10 2018-10-23 Google Llc Heat transfer from image sensor
KR102441834B1 (en) * 2020-05-08 2022-09-08 (주)에이피텍 Camera packaging apparatus having function of heat spreading

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396116B1 (en) * 2000-02-25 2002-05-28 Agilent Technologies, Inc. Integrated circuit packaging for optical sensor devices
US20020105002A1 (en) * 2001-01-10 2002-08-08 Canon Kabushiki Kaisha Electronic part and its manufacturing method
EP1494277A2 (en) * 2003-07-03 2005-01-05 Matsushita Electric Industrial Co., Ltd. Module with a built-in semiconductor and method for producing the same
US20050253211A1 (en) * 2004-05-14 2005-11-17 Matsushita Electric Industrial Co., Ltd. Optical device and method for fabricating the same
US20080246133A1 (en) * 2007-04-05 2008-10-09 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabricating the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647630A (en) * 1987-06-30 1989-01-11 Sony Corp Bonding structure of semiconductor device
JPH09312295A (en) * 1996-03-21 1997-12-02 Matsushita Electric Ind Co Ltd Bump forming body and forming method of bump
JP3859403B2 (en) * 1999-09-22 2006-12-20 株式会社東芝 Semiconductor device and manufacturing method thereof
JP4483016B2 (en) * 2000-04-19 2010-06-16 ソニー株式会社 Solid-state imaging device and manufacturing method thereof
JP2002223378A (en) * 2000-11-14 2002-08-09 Toshiba Corp Image pickup unit, its producing method and electric apparatus
JP2004173028A (en) * 2002-11-21 2004-06-17 Olympus Corp Solid-state image pickup device
JP2005039227A (en) * 2003-07-03 2005-02-10 Matsushita Electric Ind Co Ltd Module with built-in semiconductor, and its manufacturing method
JP2006013791A (en) * 2004-06-24 2006-01-12 Citizen Miyota Co Ltd Solid-state imaging device
JP4802491B2 (en) * 2004-12-17 2011-10-26 大日本印刷株式会社 Sensor module and camera module using the same
JP3821831B2 (en) * 2005-06-10 2006-09-13 三菱電機株式会社 Imaging device
JP2007012995A (en) * 2005-07-01 2007-01-18 Toshiba Corp Microminiature camera module and method of manufacturing same
JP2009188720A (en) * 2008-02-06 2009-08-20 Panasonic Corp Solid-state imaging device and method of manufacturing the same
JP5596293B2 (en) * 2009-03-03 2014-09-24 オリンパス株式会社 Imaging unit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396116B1 (en) * 2000-02-25 2002-05-28 Agilent Technologies, Inc. Integrated circuit packaging for optical sensor devices
US20020105002A1 (en) * 2001-01-10 2002-08-08 Canon Kabushiki Kaisha Electronic part and its manufacturing method
EP1494277A2 (en) * 2003-07-03 2005-01-05 Matsushita Electric Industrial Co., Ltd. Module with a built-in semiconductor and method for producing the same
US20050253211A1 (en) * 2004-05-14 2005-11-17 Matsushita Electric Industrial Co., Ltd. Optical device and method for fabricating the same
US20080246133A1 (en) * 2007-04-05 2008-10-09 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabricating the same

Also Published As

Publication number Publication date
WO2013028616A2 (en) 2013-02-28
EP2745324A2 (en) 2014-06-25
JP2014527722A (en) 2014-10-16
KR20140083993A (en) 2014-07-04

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