KR102441834B1 - Camera packaging apparatus having function of heat spreading - Google Patents

Abstract

A camera packaging apparatus having a heat dissipation function according to an embodiment of the present invention includes: a camera module including an image sensor generating an image signal; A substrate unit through which light incident to the camera module is allowed to pass through, an opening in which a part of the camera module is disposed is formed, the image signal is transmitted, and is connected to the camera module by a flip-chip technique ; and a heat dissipation unit provided on a rear surface of the image sensor.

Description

Camera packaging device with heat dissipation function {CAMERA PACKAGING APPARATUS HAVING FUNCTION OF HEAT SPREADING}

The present invention relates to a camera packaging device having a heat dissipation function.

Recently, the demand for a small camera module is increasing. For example, in the case of a 5th generation mobile communication terminal, as the number of camera modules or the number of antennas increases, the space that can be occupied by one camera module is decreasing.

In the case of an image sensor, the number of terminals of the image sensor is increasing because high-resolution images such as 8K or 4K must be generated and transmitted.

As such, the reduction in the installation space of the camera module and the increase in the number of terminals may cause problems such as signal interference or noise increase.

Patent Publication 10-2009-0033611 (Published on: April 06, 2009)

An object of the present invention is to provide a camera packaging device having a small size and a heat dissipation function capable of operating for a long time.

The task of the present application is not limited to the task mentioned above, and another task that is not mentioned will be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, a camera module including an image sensor for generating an image signal; A substrate unit through which light incident to the camera module is allowed to pass through, an opening in which a part of the camera module is disposed is formed, the image signal is transmitted, and is connected to the camera module by a flip-chip technique ; There is provided a camera packaging device having a heat dissipation function including a heat dissipation unit provided on a rear surface of the image sensor.

The heat dissipating unit may include a thermal grease applied to a rear surface of the image sensor and a heat spreader in contact with the thermal grease.

The camera packaging apparatus having a heat dissipation function according to an aspect of the present invention may include a shield coating layer contacting the heat spreader under the heat spreader, and the shield coating layer may not be in contact with the substrate part.

The camera module includes one or more lenses, a lens support for supporting the one or more lenses, the image sensor for sensing light incident from the one or more lenses, and a glass filter disposed between the image sensor and the lens support. ), and the glass filter may be inserted into the opening.

The camera module includes one or more lenses, a lens support for supporting the one or more lenses, the image sensor for sensing light incident from the one or more lenses, and a glass filter disposed between the image sensor and the lens support. ), an infrared filtering film may be formed on one side of the lens side of the glass filter, and an antireflection film may be formed on one side of the glass filter on the image sensor side.

A passive element for transmitting the image signal may be mounted on the surface of the substrate.

An insulating resin part covering the passive element part may be formed under the substrate part.

The present invention can provide a camera packaging device having a small size and a heat dissipation function capable of operating for a long time by installing a glass filter in an opening of a substrate and including a heat dissipating unit.

The effect of the present application is not limited to the above-mentioned effects, and another effect not mentioned will be clearly understood by those skilled in the art from the following description.

1 shows a camera packaging apparatus having a heat dissipation function according to an embodiment of the present invention.
2 shows an example of a glass filter.
FIG. 3 is for explaining the opening of the substrate part of FIG. 1 .
4 shows the shape of the lens of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the accompanying drawings are only described in order to more easily disclose the contents of the present invention, and the scope of the present invention is not limited to the scope of the accompanying drawings. you will know

In addition, the terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that this does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

1 shows a camera packaging apparatus having a heat dissipation function according to an embodiment of the present invention. As shown in FIG. 1 , the camera packaging apparatus having a heat dissipation function according to an embodiment of the present invention includes a camera module 110 , a substrate unit 130 , and a heat dissipation unit 150 .

The camera module 110 includes an image sensor 113 that generates an image signal.

The camera module 110 includes one or more lenses 111 , a lens support 112 for supporting one or more lenses 111 , an image sensor 113 for sensing light incident from one or more lenses 111 , an image sensor ( It is disposed between the 113 and the lens support 112 and may include a glass filter 114 .

The lens support 112 may support one or more lenses 111 . Although not shown in FIG. 1 , the lens support 112 may include mechanical components or electrical/electronic circuits for performing zoom and focusing.

The image sensor 113 may sense light incident from one or more lenses 111 . That is, the image sensor 113 may convert externally incident light into an image signal in the form of an electrical signal. A micro lens may be formed in the image sensor 113 . The image sensor 113 may include a charge-coupled device (CCD) imaging device or a complementary metal-oxide semiconductor (CMOS) imaging device, but is not limited thereto.

The glass filter 114 may be disposed between the image sensor 113 and the lens support 112 . In this case, an infrared filtering film may be formed on one side of the glass filter 114 on the lens 111 side, and an anti-reflection film may be formed on one side of the glass filter 114 on the image sensor 113 side.

That is, as shown in FIG. 2 , the infrared filtering film and the anti-reflection film may face each other around the glass body of the glass filter 114 .

When the image sensor 113 operates, heat is generated. In the absence of an infrared filtering film, the image sensor 113 itself heats the image sensor 113 and heats the image sensor 113 with the heat of the image sensor 113 itself and the heat of the infrared rays. can make it unstable. The infrared filtering film may stabilize the operation of the image sensor 113 by blocking heat from sunlight.

In addition, when light passes through the glass body, if reflection occurs on one side of the image sensor 113 side of the glass body, the amount of light incident on the image sensor 113 decreases, so it may be difficult to obtain a clear image. The anti-reflection layer may prevent light from being reflected, thereby preventing a decrease in the amount of light incident on the image sensor 113 .

Although not shown in FIG. 2 , the glass filter 114 may include a blue color filter layer or a red color filter layer for color correction of an image.

The substrate 130 allows light incident to the camera module 110 to pass through, an opening in which a part of the camera module 110 is disposed, transmits an image signal, and flips with the camera module 110 . They are connected in a flip-chip technique.

Next, the substrate unit 130 will be described with reference to the drawings.

FIG. 3 is for explaining the opening of the substrate unit 130 of FIG. 1 , and some components of FIG. 1 are not shown for convenience of description.

1 and 3 , an opening through which light incident to the camera module 110 passes is formed in the substrate unit 130 . Such a substrate unit 130 performs image signal transmission. The substrate unit 130 may be a single substrate or may have a structure in which a plurality of substrates are stacked.

At this time, the glass filter 114 of the camera module 110 may be inserted into the opening of the substrate unit 130 .

As described above, an opening is formed in the substrate unit 130 , and the glass filter 114 of the camera module 110 is disposed in the opening, thereby reducing the thickness of the camera packaging device having a heat dissipation function.

On the other hand, the image sensor 113 and the substrate 130 are connected using a bump to connect the substrate 130 and the camera module 110 through the flip-chip technique, and the underfill resin or A space between the terminal of the image sensor 113 and the terminal of the substrate 130 may be sealed by anisotropic  conductive film (ACF).

In the case of applying the underfill resin, the space between the terminal of the image sensor 113 and the terminal of the substrate 130 may be filled with epoxy after flip-chip bonding is performed.

The ACF may include conductive particles inside the adhesive film. Conductive particles are coated with an Au/Ni layer that can conduct electricity on the surface of polymer particles.

In the case of using ACF, when the image sensor 113 is pressed to the adhesive film after attaching the adhesive film serving as a sealing to the substrate 130, the conductive particles in the adhesive film are broken by the bumps and The substrate unit 130 may be electrically connected.

Through such an underfill resin or ACF, the bump, the terminal of the image sensor 113, and the terminal of the board unit 130 may be protected from external environments (eg, dust, moisture, vibration, impact, etc.).

On the other hand, in the case of the camera packaging apparatus having a heat dissipation function according to an embodiment of the present invention, the heat dissipation unit 150 provided on the rear surface of the image sensor 113 is included. In the present invention, light is incident on the front side of the image sensor 113 , and the opposite side of the front side of the image sensor 113 may be the rear side of the image sensor 113 .

A surveillance camera must be able to output a stable image signal even if it is used continuously for a long time, such as for a black box of a car or for a CCTV to monitor a specific surveillance area.

A lot of heat is generated during the operation of the image sensor 113 , and when the image sensor 113 operates for a long time, stable operation of the image sensor 113 may not be achieved due to the heat.

In order to prevent this, in the present invention, since the heat dissipating unit 150 is provided on the rear surface of the image sensor 113 , heat according to the long-time operation of the image sensor 113 can be effectively dissipated to the outside.

Meanwhile, the heat dissipating unit 150 may include a thermal grease 151 applied to the rear surface of the image sensor 113 and a heat spreader 153 in contact with the thermal grease 151 . can

In the case of a camera packaging device that continuously operates for a long time, the heat spreader 153 may function as a heat sink in order to effectively dissipate heat because the image sensor 113 itself generates a lot of heat. The thermal grease 151 may be a medium connecting the heat spreader 153 and the image sensor 113 .

The heat spreader 153 may be made of a metallic material having good heat dissipation performance. The heat spreader 153 is electrically connected to the image sensor 113 and the substrate 130 by the metallic heat spreader 153 by being insulated from the image sensor 113 and the substrate 130 by the insulating resin unit 170 . possibility can be blocked. To this end, the insulating resin unit 170 may fill the space between the substrate unit 130 and the heat spreader 153 through a molding process.

The insulating resin unit 170 may protect the camera packaging device having a heat dissipation function according to an embodiment of the present invention from moisture, dust, or vibration.

Meanwhile, the camera packaging apparatus having a heat dissipation function according to an embodiment of the present invention may include a shield coating layer 190 in contact with the heat spreader 153 under the heat spreader 153 . In this case, the shield coating layer 190 may be made of a metal component and may not come into contact with the substrate unit 130 . To this end, between the shield coating layer 190 and the substrate unit 130 may be insulated by the above-described insulating resin unit 170 .

When the image sensor 113 continuously operates for a long time, such as a surveillance camera, it may be excessively affected by noise due to an ambient signal. To prevent this, the shield coating layer 190 may perform an EMI shield function to block electromagnetic waves.

Meanwhile, the passive element unit 210 for transmitting an image signal may be mounted on the surface of the substrate unit 130 . The passive element unit 210 may include passive elements (eg, at least one of a resistor, an inductor, and a capacitor) for impedance matching in the image signal transmission process.

The passive element unit 210 of the present invention can be implemented at a lower cost than an integrated passive device (IPD) in which a conductive pattern layer corresponding to a passive element is implemented because the passive elements are mounted on the surface of the substrate unit 130 .

In this case, the insulating resin part 170 covering the passive element part 210 may be formed under the substrate part 130 . As described above, the insulating resin unit 170 may cover the passive element unit 210 by filling the space between the substrate unit 130 and the heat spreader 153 through a molding process. Accordingly, the passive element unit 210 may be protected from an external environment (eg, vibration, moisture, dust, impact, etc.).

Meanwhile, the lens 111 of the present invention may have a rectangular shape corresponding to the shape of the image sensor 113 . As shown in FIG. 4 , the conventional lens has a circular shape. In the case of a circular lens, the diameter of the lens may be excessively large to cover the entire quadrangular image sensor 113 . Also, when the size of the lens is reduced, effective pixels in the periphery of the image sensor 113 may not be used.

In contrast, since the lens 111 of the present invention has a rectangular shape similar to that of the image sensor 113 , it is possible to cover all effective pixels of the image sensor 113 even if the size does not increase excessively.

As described above, the embodiments according to the present invention have been reviewed, and the fact that the present invention can be embodied in other specific forms without departing from the spirit or scope of the present invention in addition to the above-described embodiments is recognized by those with ordinary skill in the art. It is self-evident to Therefore, the above-described embodiments are to be regarded as illustrative rather than restrictive, and accordingly, the present invention is not limited to the above description, but may be modified within the scope of the appended claims and their equivalents.

camera module (110)
one or more lenses (111)
lens support (112)
image sensor(113)
Glass Filter(114)
Substrate 130
heat dissipation unit 150
Thermal Grease(151)
heat spreader (153)
Insulation resin part 170
Shield coating layer (190)
Passive element unit (210)

Claims (7)

a camera module including an image sensor that generates an image signal;
A substrate unit through which light incident to the camera module is allowed to pass through, an opening in which a part of the camera module is disposed is formed, the image signal is transmitted, and is connected to the camera module by a flip-chip technique ;
It includes a heat dissipation unit provided on the rear surface of the image sensor,
The heat dissipating unit includes a thermal grease applied to a rear surface of the image sensor and a heat spreader in contact with the thermal grease,
a width of the substrate portion and a width of the heat spreader are greater than a width of the image sensor;
The heat spreader is made of a metallic material, and the insulating resin part fills the space between the substrate part and the heat spreader so as to be insulated from the image sensor and the substrate part by the insulating resin part. Camera packaging device.
delete According to claim 1,
a shield coating layer in contact with the heat spreader under the heat spreader;
The camera packaging device having a heat dissipation function, characterized in that the shield coating layer does not contact the substrate part.
According to claim 1,
The camera module,
One or more lenses, a lens support for supporting the one or more lenses, the image sensor for sensing light incident from the one or more lenses, and a glass filter disposed between the image sensor and the lens support,
The camera packaging device having a heat dissipation function, characterized in that the glass filter is inserted into the opening.
According to claim 1,
The camera module,
One or more lenses, a lens support for supporting the one or more lenses, the image sensor for sensing light incident from the one or more lenses, and a glass filter disposed between the image sensor and the lens support,
An infrared filtering film is formed on one side of the lens side of the glass filter, and an anti-reflection film is formed on one side of the image sensor side of the glass filter.
According to claim 1,
A camera packaging device having a heat dissipation function, characterized in that a passive element for transmitting the image signal is mounted on the surface of the substrate.
7. The method of claim 6,
A camera packaging device having a heat dissipation function, wherein an insulating resin part covering the passive element part is formed under the substrate part.

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