WO2013024948A1

WO2013024948A1 - Integrated humidity and temperature sensor module

Info

Publication number: WO2013024948A1
Application number: PCT/KR2012/001057
Authority: WO
Inventors: 박상익; 오제영; 김영민
Original assignee: 주식회사삼영에스앤씨
Priority date: 2011-08-17
Filing date: 2012-02-13
Publication date: 2013-02-21
Also published as: KR101307528B1; KR20130019515A

Abstract

The present invention relates to a sensor module capable of measuring humidity and temperature together, and more particularly, to an integrated humidity and temperature sensor module comprising: a humidity sensor; and a sensor signal processing unit which is provided with a temperature sensor and which takes, as an input, a signal from the humidity sensor and generates humidity data and temperature data by means of digital signal processing. The humidity sensor and the sensor signal processing unit are attached to a substrate and then interconnected through a mutual wire bonding technique, and an upper portion of the sensor signal processing unit is molded using a resin and then a case is attached thereto.

Description

Humidity and Temperature Integrated Sensor Module

The present invention relates to a sensor module capable of measuring humidity and temperature integrated, and more particularly, having a humidity sensor and a temperature sensor, but receiving a sensor signal of the humidity sensor and receiving humidity data by digital signal processing. The sensor signal processing unit is configured to generate temperature data. The humidity sensor and the sensor signal processing unit are attached to a substrate, and the wires are connected to each other by a wire bonding method. Humidity and temperature integrated sensor module of the attached configuration.

In general, there has been a demand for a combination of humidity and temperature measurements in industry and at home.

In particular, in order to create a more comfortable environment in the home to keep up with the well-being trend of the cultural property management system or the recent well-being trend, to preserve vegetables or grains more freshly, or to keep the indoor environment of the car fresh. The need to measure humidity and temperature in combination with systems is increasing day by day.

However, in the related art, measurement of temperature and humidity is separately performed, thereby causing measurement hassle, and additional equipment for processing sensor signals of temperature and humidity has been additionally needed.

The present invention was devised to solve the above-mentioned conventional problems, and integrated sensing of the humidity and temperature measured separately through a single sensor module, thereby increasing the convenience of measurement and to the equipment requiring temperature and humidity information There is a technical problem of the present invention to provide a configuration of an integrated sensor module of humidity and temperature that can be easily applied.

The humidity and temperature sensor of the present invention for achieving the technical problem as described above, the humidity sensor and the temperature sensor is provided with the sensor signal of the humidity sensor to receive humidity and temperature data by digital signal processing It consists of a sensor signal processing unit, but attaching the humidity sensor and the sensor signal processing unit to the substrate and wire them by mutual wire bonding method, and molded the upper part of the sensor signal processing unit with a resin and then attach the case It is done.

The effect of the humidity and temperature sensor of the present invention having the configuration as described above can sense the humidity and the temperature through a single sensor module, thereby eliminating the hassle of having to measure them separately.

In addition, it is a very advanced invention that has the advantage of increasing the efficiency and economic efficiency of the device can be easily applied to equipment that requires both the measurement of humidity and temperature.

1 is a block diagram of the humidity and temperature integrated sensor module of the present invention,

2 is a plan view of a substrate of the present invention humidity and temperature integrated sensor module;

3 is a plan view showing a state in which elements are mounted on a substrate of the humidity and temperature integrated sensor module of the present invention;

4 is a cross-sectional view showing a state in which a resin layer is formed in a state in which elements are mounted on a substrate of an integrated humidity and temperature sensor module according to the present invention;

5 and 6 are a plan view and a side view showing a case of the integrated humidity and temperature sensor module of the present invention.

Hereinafter, the configuration of the humidity and temperature integrated sensor module of the present invention with reference to the drawings in detail.

However, the disclosed drawings are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the invention is not limited to the drawings presented below, but may be embodied in other aspects.

In addition, unless there is another definition in terms used in the present specification, it has the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs, and the gist of the present invention in the following description and the accompanying drawings. Detailed descriptions of well-known functions and configurations that may be unnecessarily blurred are omitted.

1 is a block diagram of the humidity and temperature integrated sensor module of the present invention.

The humidity and temperature sensor module of the present invention (hereinafter, abbreviated as 'sensor module' for convenience) is designed to minimize the constraint of the internal space of the device in which the sensor module is to be used by miniaturizing the size of the module as a whole.

Referring to the drawings, such a sensor module of the present invention includes a sensor signal processing unit 20 and a humidity sensor 30 mounted on a substrate 10 to be described later.

The humidity sensor 30 is preferably a known capacitive humidity sensor, which generates a humidity sensor signal in accordance with the amount of water vapor contained in the air.

The sensor signal processing unit 20 receives humidity sensor signals measured by the humidity sensor 30 and performs signal processing according to logic of a control program stored in an interlocked memory device to generate information such as humidity data and temperature data. And, it is a unit for outputting the humidity data and the temperature data generated in the central control unit coupled to the rear end of the sensor module of the present invention.

More specifically, the sensor signal processing unit 20, the temperature sensor 40 for measuring the temperature in the air to generate a temperature sensor signal, the humidity sensor signal generated by the humidity sensor 30 and the temperature A digital signal converter 22 for receiving the temperature sensor signal generated by the sensor 40 and converting the received humidity sensor signal and the temperature sensor signal into a digital signal, respectively, and the digital signal converter 22. A digital signal processor 21 for receiving humidity sensor signals and temperature sensor signals converted into digital signals from the digital signal and performing signal processing by a signal processing program stored in the nonvolatile memory unit 24 to generate humidity data and temperature data; Receiving the humidity data and the temperature data generated by the digital signal processor 21 and outputting the humidity data and the temperature data to a central control unit coupled to the rear end of the sensor module of the present invention. It is configured to include an input-output interface section 25.

In addition, the temporary data generated while the digital signal processing unit 21 performs signal processing according to the humidity sensor signal and the temperature sensor signal are temporarily stored in the volatile memory unit 23.

The sensor signal processing unit 20 of the present invention made as described above is preferably made in the form of a read-out integrated circuit (ROIC).

The digital signal converter 22 is a known analog-to-digital converter (ADC).

The digital signal processing unit 21 uses a known core (Digital Signal Processing) core or element.

In addition, the nonvolatile memory 24 is a memory device such as a known ROM, and the volatile memory 23 is a memory device such as a known EEPROM or a flash memory.

In addition, the input / output interface unit 25 is a general communication device, and may be a RSC232C data communication device or a USB (Universal Serial Bus) communication device. In some cases, a known wireless communication device may be used. Can be used.

The input / output interface unit 25 outputs humidity data or temperature data to a central control unit for performing integrated control of the equipment in which the sensor module of the present invention is used, and the central control unit uses the received humidity data or temperature data. The control necessary for the equipment can be performed.

Next, the configuration of the substrate 10 on which the sensor signal processing unit 20 and the humidity sensor 30 configured as described above and the state mounted on the substrate 10 will be described.

Figure 2 is a plan view of the substrate 10 of the integrated humidity and temperature sensor module of the present invention, preferably, the substrate 10 is a substrate made of epoxy (Epoxy) resin.

Also, preferably, the line 11 is formed in a loop pattern as shown in consideration of forming the line 11 by electroplating.

In addition, in the process of dicing (cutting) the substrate 10 according to a standard, the line 11 may be patterned to prevent short circuits between pin pads.

3 is a plan view illustrating a state in which elements are mounted on a substrate of the integrated humidity and temperature sensor module, and FIG. 4 is a state in which a resin layer is formed in a state in which elements are mounted on a substrate of the integrated humidity and temperature sensor module. It is sectional drawing which shows.

As shown in FIG. 3, the humidity sensor 30 and the sensor signal processing unit 20 are electrically connected to the line 11 of the substrate 10, respectively, and the humidity sensor 30 and the sensor are electrically connected to each other. The signal processing unit 20 is connected to each other by a wire bonding method using the wire 12.

Subsequently, as shown in the cross-sectional view of FIG. 4 (cross section AA ′ of FIG. 3), the resin of the synthetic resin material is molded on top of the sensor signal processing unit 20 attached to the substrate 10. The protective film 50 of the resin layer is formed on the sensor signal processing unit 20.

At this time, the humidity sensor 30 should detect the amount of water vapor contained in the air, the position of the humidity sensor 30 should be in a position where the air flows smoothly, and further around the humidity sensor 30 It must satisfy the condition that air flow must be able to be constantly detected in the sensor detector.

Therefore, the sensor module of the present invention, in order to optimize the attachment position of the humidity sensor 30 and to achieve a smooth flow of air, a plurality of through-holes 61 between the humidity sensor 30 and the substrate 10 Attaching the plate-shaped spacer 60 is formed.

Since the spacer 60 separates the distance between the substrate 10 and the humidity sensor 30 by the thickness of the spacer 60, the air flows smoothly between the separation distances. It is possible to maximize the sensing capability of the same humidity sensor (30).

In addition, the sensor signal processing unit 20 also has a DSP element or a temperature sensor 40 of the digital signal processing unit 21 mounted thereon is easily affected by temperature, and the air flow of the sensor signal processing unit 20 is smooth. In order to improve the smooth signal processing capability of the DSP element and to allow the temperature sensor 40 to measure the temperature more accurately, the spacer member as described above is also provided between the sensor signal processing unit 20 and the substrate 10. It is preferable to attach 60.

Next, as described above, after the sensor signal processing unit 20 and the humidity sensor 30 are attached to the substrate 10 by wire bonding, the process of forming the protective film 50 by the resin layer is completed. In order to protect the sensor signal processing unit 20 and the humidity sensor 30 mounted on the substrate 10, a case 70 is provided on the upper portion thereof.

The plane and side surfaces of the case are as shown in FIGS. 5 and 6, respectively, and the case 70 has a window 71 and a hole 72 formed through the housing, and the window 71 is formed. Is formed for smooth air flow to the humidity sensor 30 attached to the substrate 10, and the hole 72 is smooth air to the temperature sensor 40 mounted on the sensor signal processing unit 20. It is formed for flow.

On the other hand, although not shown in the drawings, when attaching the case 70 to the substrate 10, a shielding member (not shown) for preventing the penetration of foreign matter between the case 70 and the substrate 10 A member made of PTFE (polytetrafluoroethylin) material can be used as the shielding member.

In the above description, the configuration of the integrated humidity and temperature sensor module of the present invention has been described in detail with reference to the accompanying drawings, but the present invention may be variously modified, changed, and replaced by those skilled in the art, and such modifications, changes, and substitutions may be made. It should be interpreted as falling within the protection scope of the invention.

Explanation of symbols on the main parts of the drawings

10; Board

11; track

12; wire

20; Sensor signal processing unit

21; Digital signal processor

22; Digital signal converter

23; Volatile Memory

24; Nonvolatile Memory

25; I / O interface unit

30; Humidity sensor

40; temperature Senser

50; Shield

60; Spacer

61; Through

70; case

71; window

72; hall

Claims

In the sensor module for sensing humidity and temperature,

A substrate 10 on which the line 11 is patterned;

A humidity sensor 30 connected on the line 11 of the substrate 10;

Is provided with a temperature sensor 40 is connected to the line 11 of the substrate 10 is connected to the humidity sensor 30 by wire bonding method, the humidity sensor signal generated by the humidity sensor 30 and the A sensor signal processing unit 20 which receives the temperature sensor signal generated by the temperature sensor 40 and performs signal processing to generate humidity data and temperature data;

A protective film 50 made of synthetic resin formed on the sensor signal processing unit 20;

A case 70 attached to the substrate 10 to protect the sensor signal processing unit 20 and the humidity sensor 30; Humidity and temperature integrated sensor module, characterized in that comprises a.
The method of claim 1,

In order to create a smooth air flow around the humidity sensor 30, the humidity and temperature, characterized in that for attaching the plate-shaped spacer 60 between the humidity sensor 30 and the substrate 10. Integrated sensor module.
The method of claim 2,

In order to create a smooth air flow around the sensor signal processing unit 20, the humidity and characterized in that for attaching the plate-shaped spacer 60 between the sensor signal processing unit 20 and the substrate 10 Temperature integrated sensor module.
The integrated humidity and temperature sensor module according to claim 1, wherein the case (70) is perforated with a window (71) for smooth air flow to the humidity sensor (30).
5. The integrated humidity and temperature sensor module according to claim 4, wherein the case (70) is perforated with holes (72) for smooth meat flow to the temperature sensor (40).
6. The integrated humidity and temperature sensor module according to claim 5, wherein a shielding member is attached between the case (70) and the substrate (10) to prevent foreign substances from penetrating.
The method of claim 1, wherein the sensor signal processing unit 20,

A digital signal for receiving the humidity sensor signal generated by the humidity sensor 30 and the temperature sensor signal generated by the temperature sensor 40 and converting the received humidity sensor signal and temperature sensor signal into digital signals, respectively. A conversion unit 22,

The humidity sensor signal and the temperature sensor signal received from the digital signal converter 22 are converted into digital signals to perform signal processing by a signal processing program stored in the nonvolatile memory unit 24 to generate humidity data and temperature data. A digital signal processor 21,

An input / output interface 25 for receiving the humidity data and the temperature data generated by the digital signal processor 21 and outputting the humidity data and the temperature data to a central control unit coupled to the rear end of the sensor module of the present invention;

Humidity and temperature integrated sensor module, characterized in that the digital signal processing unit 21 comprises a volatile memory unit 23 is stored in the temporary data generated while the signal processing according to the humidity sensor signal and the temperature sensor signal .