WO2013020773A2 - Ensemble éclairage à del et lampe de rattrapage à del le comportant - Google Patents

Ensemble éclairage à del et lampe de rattrapage à del le comportant Download PDF

Info

Publication number
WO2013020773A2
WO2013020773A2 PCT/EP2012/063723 EP2012063723W WO2013020773A2 WO 2013020773 A2 WO2013020773 A2 WO 2013020773A2 EP 2012063723 W EP2012063723 W EP 2012063723W WO 2013020773 A2 WO2013020773 A2 WO 2013020773A2
Authority
WO
WIPO (PCT)
Prior art keywords
lighting assembly
led lighting
led
thermal conduction
heat sink
Prior art date
Application number
PCT/EP2012/063723
Other languages
English (en)
Other versions
WO2013020773A3 (fr
Inventor
Ruiri FENG
Jin Hu
Tingbiao LAN
Changyu TAN
Original Assignee
Osram Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Ag filed Critical Osram Ag
Publication of WO2013020773A2 publication Critical patent/WO2013020773A2/fr
Publication of WO2013020773A3 publication Critical patent/WO2013020773A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings

Definitions

  • the present invention relates to an LED lighting assembly.
  • the present invention further relates to an LED retrofit lamp having the LED lighting assembly.
  • LED illumination has irreplaceable advantages, such as energy saving, low power consumption, and electrical-to-optical conversion efficiency near to 100%. It can save more than 80% energy compared with the traditional light source with the same illuminating efficiency and has a longer service life.
  • the LED is more and more used as a light source such as a lot of LED retrofit lamps in the market.
  • the LED luminous efficiency will be decreased with the service duration, i.e. usage times, and a too high junction temperature will accelerate attenuation of the LED luminous efficiency and decrease the efficiency of the LED chip.
  • the input power of a single LED chip turns to be higher and higher, and then it becomes more and more important to prevent a too high working temperature of the LED. If the chip heat cannot be dissipated effectively, the subsequent thermal effect will become more and more prominent, which increases the junction temperature of the chip and further decreases the light efficiency. The increased temperature also will lead to a great deviation of the CCT.
  • an electric insulation thermal conduction plate made from a thermal interface material is arranged between a printed circuit board and a heat sink for the sake of safety, but it cannot provide a good thermal dissipation performance due to limita- tion of the properties of the thermal interface material itself, and further it leads to a poor light output performance and a big CCT deviation.
  • an electric insulation thermal conduction plate made from a thermal silicone grease or thermal interface material may be used in the LED retrofit lamp driven by an insulation driver.
  • the thermal silicone grease though having a very good thermal conductivity, cannot assure a sufficient creepage distance between the driver and the printed circuit board, and therefore can only be used in the LED retrofit lamp of the type of insulation driver.
  • the cost of the insulation driver is too high.
  • the light output cannot be increased by boosting the current, because boosted current necessarily will lead to increased to- tal power. Therefore, it is urgent to provide an LED lighting assembly having a very good thermal dissipation performance and driven by the non- insulation driver and an LED retrofit lamp having the LED lighting assembly of the above type.
  • one object of the present invention lies in providing an LED lighting assembly that has a good light output performance and a small CCT deviation with a low cost as well.
  • the other object of the present invention lies in pro- viding an LED retrofit lamp having the LED lighting assembly of the above type .
  • the first object of the present invention is accomplished via an LED lighting assembly through the following solution, i.e. the LED lighting assembly has a printed circuit board with an LED chip, a heat sink thermally connected with the printed circuit board at one side and forming a cavity at the other side for at least accommodating a non- insulation LED driver, wherein a thermal conduction insulating layer which is arranged between the heat sink and the printed circuit board consists of a first part and a second part, and wherein the first part is configured to provide a creepage distance, both the first part and the second part thermally contact the heat sink and the printed circuit board, and the second part has a thermal conductivity higher than that of the first part.
  • the creepage phenomenon that may take place between the printed circuit board and the non- insulation LED driver is effectively prevented by the creepage distance provided by the first part, in order to prevent human getting a electric shock.
  • the material generally used to fabri- cate the first part providing the creepage distance has a poor thermal conductive performance
  • the second part that can well transfer heat is provided, and the heat from the LED chip is transferred to the heat sink mainly through the second part.
  • the first part is configured by an electric insulation thermal conduction plate made from a thermal interface material .
  • Such electric insulation thermal conduction plate made from the thermal interface ma- terial can provide the creepage distance between the printed circuit board and the non- insulation LED driver.
  • the second part is configured by a thermal silicone grease with a good thermal conductive performance.
  • the second part also may be other thermal gels having a good thermal dissipation performance .
  • the electric insulation thermal conduction plate is provided with a hole into which a thermal silicone grease is coated. And further preferably, the hole is provided in a center of the electric insulation thermal conduction plate. In a practical situation that the assembling is completed, the hole provided in the center of the electric insulation thermal conduction plate may be aligned with the LED chip arranged on the printed circuit board so as to restrictedly transfer heat from the LED chip to the heat sink to further reduce a junction temperature of the LED chip and improve the light output performance of the LED chip.
  • both sides of the electric insulation thermal conduction plate are sticky on both sides, thus one side of the electric insulation thermal conduction plate can be simply adhered onto a corresponding position of the heat sink, and meanwhile, the printed circuit board also can be adhered onto another side of the electric insulation thermal conduction plate, so that other additional fastening part is not needed .
  • the LED lighting assembly further comprises a first holder configured to fix the printed circuit board on the electric insulation thermal conduction plate.
  • a first holder configured to fix the printed circuit board on the electric insulation thermal conduction plate.
  • the LED lighting assembly further comprises a second holder that uses one side to fix the electric insulation thermal conduction plate fixed with the printed circuit board in the accommodating groove.
  • the electric insulation thermal conduction plate has been attached onto the heat sink with the double-faced adhesive, the electric insulation thermal conduction plate is further assured not to move with respect to the heat sink by means of the second holder.
  • the LED lighting assembly further has an LED lens that may be fixed on the other side of the second holder, thus the second holder also may be used as a lens holder.
  • a sealing member is arranged between the LED lens and the heat sink in order to prevent the external pollutants such as water or dust from entering the inside of the LED lighting assembly.
  • the sealing member in the solution of the present invention is configured as an 0- shape sealing ring.
  • the other object of the present invention is accomplished via an LED retrofit lamp that has a lamp holder and the LED lighting assembly of the above type, wherein the lamp holder is fixed on the heat sink of the LED lighting assembly and configured to connect the LED lighting assembly to a power supply.
  • the LED retrofit lamp which is driven by a non- insulation LED driver has a low cost but a perfect thermal dissipation performance, and further has a very good light output performance and a relative small CCT deviation.
  • Fig. 1 is an exploded perspective view of an LED retrofit lamp according to the present invention
  • Fig. 2 is a schematic diagram of an electric insulation thermal conduction plate of an LED lighting assembly according to the present invention
  • Fig. 3 is a top view of a heat sink of the LED lighting as- sembly according to the present invention.
  • Fig. 4 is a top view of the heat sink assembled with a thermal conduction insulating layer
  • Fig. 5 is a sectional view of the LED retrofit lamp according to the present invention. Detailed Description of the Embodiments
  • Fig. 1 is an exploded perspective view of an LED retrofit lamp according to the present invention. It can be seen from the figure that the LED retrofit lamp has a lamp holder 14 and an LED lighting assembly. In an assembled state, the lamp holder 14 is fixed on the LED lighting assembly (see Fig. 5) .
  • the LED lighting assembly has a heat sink 3 thermally connected with a printed circuit board 2 at one side and forming a cavity 5 at the other side for at least accommodating a non- insulation LED driver 4.
  • the LED lighting assembly further has a printed circuit board 2 with an LED chip 1, a thermal conduction insulating layer which is arranged between the heat sink 3 and the printed circuit board 2 consists of a first part configured by an electric insulation thermal con- duction plate 6 and a second part configured by a thermal silicone grease 7.
  • the configuration of the electric insulation thermal conduction plate 6 will be described in detail in Fig. 2.
  • An accommodating groove 10 having a profile consistent with that of the electric insulation thermal conduction plate 6 is provided in one side of the heat sink 3.
  • the electric insulation thermal conduction plate 6 is accommo- dated in the accommodating groove 10 so as to guarantee a precise arrangement of the electric insulation thermal conduction plate 6 in the heat sink 3.
  • the LED lighting assembly further comprises a first holder 9 configured to fix the printed circuit board 2 on the electric insulation thermal conduction plate 6. Meanwhile, the LED lighting assembly further comprises a second holder 11 that uses one side to fix the electric insulation thermal conduction plate 6 fixed with the printed circuit board 2 in the accommodating groove 10. In the present embodiment, the electric insulation thermal conduction plate 6 is fixed in the accommodating groove 10 with two fastening bolts 15. At the same time, the LED lighting assembly further comprises an LED lens 12 that is fixed on the other side of the second holder 11. In addition, a sealing member 13 is arranged be- tween the LED lens 12 and the heat sink 3. The sealing member 13 in the present embodiment is configured as an 0- shape sealing ring.
  • Fig. 2 is a schematic diagram of the electric insulation thermal conduction plate of the LED lighting assembly accord- ing to the present invention.
  • the electric insulation thermal conduction plate 6 which is made from a thermal interface material can provide a sufficient creepage distance between the non- insulation LED driver 4 and the printed circuit board 2.
  • a hole 8 is provided in a center of the electric insulation thermal conduction plate 6.
  • the hole 8 is coated with the thermal silicone grease 7.
  • the LED chip 1 arranged on the printed circuit board 2 can be aligned precisely with a region of the hole 8 so as to well transfer heat from the LED chip 1 to the heat sink 3 via the thermal silicone grease 7, and further to reduce a junction temperature of the LED chip 1.
  • Fig. 3 is a top view of the heat sink of the LED lighting assembly according to the present invention. It can be seen from the figure that the heat sink 3 has at one side the accommodating groove 10 for accommodating the electric insulation thermal conduction plate 6. In the assembled state, the electric insulation thermal conduction plate 6 is placed in the accommodating groove 10 with a matched shape.
  • Fig. 4 is a top view of the heat sink assembled with a thermal conduction insulating layer. It can be seen from the figure that the electric insulation thermal conduction plate 6 has been placed in the accommodating groove 10 with a matched shape, and the hole 8 in the center of the electric insulation thermal conduction plate 6 has been coated with the thermal silicone grease 7, so that both the thermal silicone grease 7 and the electric insulation thermal conduction plate 6 can contact the printed circuit board 2 and the heat sink 3.
  • Fig. 5 is a sectional view of the LED retrofit lamp according to the present invention.
  • the elec- trie insulation thermal conduction plate 6 made from the thermal interface material is firstly placed in the accommodating groove 10 of the heat sink 3, and the thermal silicone grease 7 is coated in the hole 8 in the center of the elec- trie insulation thermal conduction plate 6; subsequently, the printed circuit board 2 is fixed on the electric insulation thermal conduction plate 6 by means of the first holder 9, and the electric insulation thermal conduction plate 6 fixed with the printed circuit board 2 is fixed on the heat sink 3 by means of the second holder 11; thereafter, the LED lens 12 is arranged on the second holder 11, and the sealing member 13 configured as an 0- shape sealing ring is arrange between the LED lens 12 and the heat sink 3; and finally, a lamp holder 14 and the non- insulation LED driver 4 are mounted on the heat sink 3 to form the LED retrofit lamp.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

La présente invention concerne un ensemble d'éclairage à DEL comportant une carte de circuits imprimés (2) dotée d'une puce DEL (1), un dissipateur thermique (3) thermiquement connecté à la carte de circuits imprimés (2) sur un côté et formant une cavité (5) sur l'autre côté pour accueillir au moins un pilote DEL non isolant (4), une couche d'isolation de conduction thermique qui est disposée entre le dissipateur thermique (3) et la carte de circuits imprimés (2) comprenant une première partie et une seconde partie, et la première partie étant conçue pour former une distance de glissement, la première partie et la seconde partie étant toutes les deux en contact thermique avec le dissipateur thermique (3) et avec la carte de circuits imprimés (2), et la seconde partie possédant une conductivité thermique supérieure à celle de la première partie. En outre, la présente invention concerne une lampe de rattrapage à DEL comportant l'ensemble éclairage à DEL du type susmentionné.
PCT/EP2012/063723 2011-08-09 2012-07-12 Ensemble éclairage à del et lampe de rattrapage à del le comportant WO2013020773A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110227751.3 2011-08-09
CN201110227751.3A CN102927456B (zh) 2011-08-09 2011-08-09 Led发光组件和具有该led发光组件的led改型灯

Publications (2)

Publication Number Publication Date
WO2013020773A2 true WO2013020773A2 (fr) 2013-02-14
WO2013020773A3 WO2013020773A3 (fr) 2013-05-30

Family

ID=46582672

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/063723 WO2013020773A2 (fr) 2011-08-09 2012-07-12 Ensemble éclairage à del et lampe de rattrapage à del le comportant

Country Status (2)

Country Link
CN (1) CN102927456B (fr)
WO (1) WO2013020773A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014202360A1 (fr) * 2013-06-17 2014-12-24 Osram Gmbh Dissipateur thermique pour un dispositif d'éclairage et dispositif d'éclairage
GB2525508A (en) * 2014-04-25 2015-10-28 Gooee Ltd Improved LED lamps and luminaires
WO2017102100A1 (fr) * 2015-12-15 2017-06-22 Te Connectivity Nederland B.V. Douille de del destinée à recevoir une del cob et base pour ladite douille de del
US10520182B2 (en) 2016-12-27 2019-12-31 Consumer Lighting (U.S.), Llc Lamp and lighting fixture comprising the lamp

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110566830A (zh) * 2019-10-14 2019-12-13 江苏优为视界科技有限公司 一种满足安全爬电间距的灯具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6787999B2 (en) * 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
CA2464153A1 (fr) * 2003-04-14 2004-10-14 Integral Technologies, Inc. Circuits d'eclairage a cout reduit fabriques au moyen de materiaux resineux charges de poudre conductrice
CN2849439Y (zh) * 2004-12-31 2006-12-20 彭洲龙 大功率发光二极管照明灯
US7874699B2 (en) * 2007-07-05 2011-01-25 Aeon Lighting Technology Inc. Heat dissipating device for LED light-emitting module
TW200934362A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipaters having heat sinks and structure thereof
CN201448798U (zh) * 2009-04-24 2010-05-05 东莞市星火机电设备工程有限公司 Led灯散热装置
CN101936460A (zh) * 2009-06-29 2011-01-05 富准精密工业(深圳)有限公司 发光二极管灯具
CN201377709Y (zh) * 2009-07-23 2010-01-06 深圳市长方照明工业有限公司 一种led灯泡
CN101706090A (zh) * 2009-09-08 2010-05-12 熊为君 一种应用于大功率led的导热基板结构及制作方法
TWM402992U (en) * 2009-09-24 2011-05-01 Molex Inc Light module
CN201547729U (zh) * 2009-11-24 2010-08-11 东莞市友美电源设备有限公司 Led球泡灯的散热结构
CN102109104B (zh) * 2009-12-30 2012-11-21 广州南科集成电子有限公司 一种大功率led灯泡

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014202360A1 (fr) * 2013-06-17 2014-12-24 Osram Gmbh Dissipateur thermique pour un dispositif d'éclairage et dispositif d'éclairage
GB2525508A (en) * 2014-04-25 2015-10-28 Gooee Ltd Improved LED lamps and luminaires
WO2015162600A1 (fr) * 2014-04-25 2015-10-29 Gooee Limited Lampes et luminaires à led améliorés
GB2525508B (en) * 2014-04-25 2016-10-19 Gooee Ltd Improved LED lamps and luminaires
AU2015249406B2 (en) * 2014-04-25 2017-09-07 Gooee Limited Improved led lamps and luminaires
US9777915B2 (en) 2014-04-25 2017-10-03 Gooee Limited LED lamps and luminaires
US9989239B2 (en) 2014-04-25 2018-06-05 Gooee Limited LED lamps and luminaires
US10174930B2 (en) 2014-04-25 2019-01-08 Gooee Limited LED lamps and luminaires
WO2017102100A1 (fr) * 2015-12-15 2017-06-22 Te Connectivity Nederland B.V. Douille de del destinée à recevoir une del cob et base pour ladite douille de del
US10429048B2 (en) 2015-12-15 2019-10-01 Te Connectivity Nederland Bv LED socket for receiving a CoB-LED and base for such LED socket
US10520182B2 (en) 2016-12-27 2019-12-31 Consumer Lighting (U.S.), Llc Lamp and lighting fixture comprising the lamp

Also Published As

Publication number Publication date
CN102927456A (zh) 2013-02-13
CN102927456B (zh) 2016-08-03
WO2013020773A3 (fr) 2013-05-30

Similar Documents

Publication Publication Date Title
JP3146696U (ja) Ｌｅｄライト
JP5101578B2 (ja) 発光ダイオード照明装置
US8342716B2 (en) LED heat sink module, LED module for LED heat sink module
RU2418345C1 (ru) Светодиодная лампа
WO2008138177A1 (fr) Système d'éclairage del avec effet de radiation à haute efficacité
WO2013020773A2 (fr) Ensemble éclairage à del et lampe de rattrapage à del le comportant
CN102518971A (zh) 一种紫外线发光二极管光源
CN201954316U (zh) 一种led灯具
CN202501224U (zh) 一种紫外线发光二极管光源
CN202032396U (zh) Led道路照明灯具模组
CN201935013U (zh) 一种led灯泡
CN202769331U (zh) 半导体制冷散热的led灯
CN202056580U (zh) Led泛光照明灯具模组
KR20110023186A (ko) 방열기능을 갖는 엘이디 조명기구
KR20110092907A (ko) 압력 체결 식 엘이디 조명장치
CN213361953U (zh) 一种led物联网球泡灯
CN201589145U (zh) Led路灯头
CN201273470Y (zh) 照明灯
WO2013016953A1 (fr) Ampoule pour lampe à diode électroluminescente à montage en surface
CN201513761U (zh) 一种散热性能优良的节能型led日光灯
CN201935014U (zh) 一种led发光柱
CN202024127U (zh) 一种led模组
CN203349011U (zh) 一种led灯杯
CN202452451U (zh) 大功率led聚光灯的散热结构
CN202708654U (zh) 一种led-par灯具

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12740326

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 12740326

Country of ref document: EP

Kind code of ref document: A2