WO2013018524A1

WO2013018524A1 - Photosensitive resin composition, material for forming relief pattern, photosensitive film, polyimide film, cured relief pattern and method for producing same, and semiconductor device

Info

Publication number: WO2013018524A1
Application number: PCT/JP2012/067852
Authority: WO
Inventors: 和田　健二; 恭平荒山; 雨宮　拓馬
Original assignee: 富士フイルム株式会社
Priority date: 2011-07-29
Filing date: 2012-07-12
Publication date: 2013-02-07
Also published as: CN103718109A; JP2013050696A; JP5887172B2; CN103718109B; KR101780663B1; KR20140047105A

Abstract

Provided are: a photosensitive resin composition which has lithographic performance including excellent resolution and excellent sensitivity and enables the formation of a cured relief pattern that has low stress and therefore can prevent the warpage of a wafer in so-called low-temperature curing; a material for forming a relief pattern, a photosensitive film, a polyimide film, a cured relief pattern and a method for producing the cured relief pattern, each of which utilizes the photosensitive resin composition; and a semiconductor device involving the cured relief pattern. A photosensitive resin composition comprising (a) a resin having a repeating unit represented by general formula (1) and (b) a compound capable of generating an acid upon the irradiation with an active ray or a radioactive ray. In general formula (1), R¹'s independently represent a tetravalent organic group, wherein the multiple R¹'s may be the same as or different from each other; R²'s independently represent a bivalent organic group, wherein the multiple R²'s may be the same as or different from each other, and wherein at least one of the multiple R²'s is a bivalent organic group having an alicyclic group; and R³'s independently represent a hydrogen atom or an organic group, wherein at least one of multiple -CO₂R³ groups is a group capable of being decomposed by the action of an acid to produce an alkali-soluble group.

Description

Photosensitive resin composition, relief pattern forming material, photosensitive film, polyimide film, cured relief pattern, manufacturing method thereof, and semiconductor device

The present invention uses a positive type high heat resistant photosensitive resin composition used as a surface protective film for semiconductor devices, an interlayer insulating film, an interlayer insulating film for display devices, and the positive type high heat resistant photosensitive resin composition. The present invention relates to a method for producing a cured relief pattern having heat resistance and a semiconductor device containing the relief pattern.

A negative polyimide resin having excellent heat resistance, electrical characteristics, mechanical characteristics, and the like is used for a surface protective film and an interlayer insulating film of a semiconductor device. This negative polyimide resin is generally provided in the form of a photosensitive polyimide precursor composition, and is applied on a semiconductor device by coating, patterning with actinic rays, organic solvent development, thermal imidization treatment at high temperature, and the like. A surface protective film, an interlayer insulating film, and the like can be easily formed, and the process can be greatly shortened as compared with a conventional non-photosensitive polyimide precursor composition.
However, the photosensitive negative polyimide precursor composition needs to use a large amount of an organic solvent such as N-methyl-2-pyrrolidone as a developing solution in the development process. Measures to remove organic solvents have been demanded. In response, recently, various heat-resistant photosensitive resin materials that can be developed with an alkaline aqueous solution have been proposed in the same manner as photoresists.

Among them, a composition in which an alkaline aqueous solution-soluble polyamic acid (polyimide precursor) or hydroxypolyamide (polybenzoxazole) precursor is mixed with a photoactive component such as a photosensitive diazoquinone compound is used as a positive photosensitive resin composition. The method has attracted attention in recent years.
The development mechanism of this positive photosensitive resin is that the photosensitive diazoquinone compound in the unexposed area is insoluble in the alkaline aqueous solution, but when exposed, the photosensitive diazoquinone compound undergoes a chemical change to become an indenecarboxylic acid compound. It makes use of being soluble in an alkaline aqueous solution. By utilizing the difference in the dissolution rate with respect to the developer between the exposed portion and the unexposed portion, it is possible to form a relief pattern only in the unexposed portion (for example, see Patent Document 1).
On the other hand, as a technology that separates the photosensitive and insoluble areas of the unexposed area, the semiconductor photoresist field generates a catalytic amount of acid during exposure, and the subsequent heating process generates alkali-insoluble groups during exposure. Many chemically amplified photosensitive compositions that convert to an alkali-soluble group by a chemical reaction using an acid as a catalyst have been applied. Also in this technical field, a chemically amplified photosensitive composition is disclosed (for example, see Patent Document 2). In particular, from the viewpoint of high resolution, high sensitivity, etc., a chemically amplified photosensitive resin composition containing a polyimide precursor protected with a specific acid-decomposable protecting group has been disclosed (for example, patents). References 3 and 4).
On the other hand, with the development of semiconductor technology in recent years, there is a demand for forming a finer pattern and lowering the hardening temperature (curing temperature) after pattern formation.
However, it is known that when the cure temperature is lowered, imide cyclization hardly proceeds. It has already been reported that this problem can be improved by adding, for example, a sulfonic acid or a sulfonic acid ester compound (Patent Document 5). However, it has been found that the strength and chemical resistance of the obtained film may be insufficient or the fine image forming ability may be impaired.
In addition, with the recent increase in diameter and lamination of silicon wafers, the problem of warpage of silicon wafers formed with a polyimide film (hereinafter also simply referred to as “wafer warpage”) has become apparent. This is thought to be due to the residual stress generated from the difference in thermal expansion coefficient between the polyimide and silicon wafer. Therefore, a low thermal expansion and low stress (low stress) polyimide is strongly demanded compared to conventional polyimide ( For example, refer nonpatent literature 1). Low thermal expansion can be achieved by making the polyimide main chain a straight and rigid structure (see Non-Patent Document 2), but in such a structure, the precursor has low i-line permeability, solvent solubility, and alkali solubility. There is a problem that sufficient lithography performance cannot be imparted. For example, Patent Document 6 is a positive photosensitive composition containing a compound that generates an acid upon irradiation and a PBO precursor, and the residual stress of the polybenzoxazole film formed by the PBO precursor is 25 MPa or less. Although a positive photosensitive composition containing a certain PBO precursor is disclosed, there are various problems in lithography performance such as sensitivity and profile.

Japanese Unexamined Patent Publication No. 56-27140 Japanese Laid-Open Patent Publication No. 2002-526793 Japanese Unexamined Patent Publication No. 2009-244479 Japanese Unexamined Patent Publication No. 2009-192760 Japanese Laid-Open Patent Publication No. 2006-010881 Japanese Laid-Open Patent Publication No. 2001-214055

The present invention has lithography performance with excellent resolution and sensitivity, and cures at a low temperature of 300 ° C. or lower (preferably 250 ° C. or lower), that is, curing at a low temperature to prevent wafer warpage due to low stress. A photosensitive resin composition capable of forming a relief pattern, a relief pattern forming material, a photosensitive film, a polyimide film, a cured relief pattern, a production method thereof, and the cured relief pattern using the photosensitive resin composition An object is to provide a semiconductor device.

The present invention has the following configuration, which solves the above-described problems of the present invention.
[1]
(A) A photosensitive resin composition comprising a resin having a repeating unit represented by the following general formula (1), and (b) a compound that generates an acid upon irradiation with actinic rays or radiation.

In the general formula (1),
R ¹ represents a tetravalent organic group. Several R < ¹ > may mutually be same or different.
R ² represents a divalent organic group. A plurality of R ² may being the same or different.
However, at least one of the plurality of R ² is a divalent organic group having an alicyclic group.
R ³ each independently represents a hydrogen atom or an organic group.
However, at least one of the plurality of —CO ₂ R ³ is a group that decomposes by the action of an acid to generate an alkali-soluble group.
[2]
Resin in which the resin (a) having a repeating unit represented by the general formula (1) has a repeating unit represented by the following general formula (2) and a repeating unit represented by the following general formula (3) The photosensitive resin composition according to [1].

In the general formula (2),
R ¹ 'has the same meaning as ^{R 1} in the general formula (1).
R ³ 'has the same meaning as ^{R 3} in Formula (1).
However, at least one of the plurality of —CO ₂ R ³ ′ is a group that decomposes by the action of an acid to generate an alkali-soluble group.
R ⁴ is a divalent organic group having an alicyclic group.
In the general formula (3),
R ¹ "has the same meaning as ^{R 1} in the general formula (1).
R ³ "has the same meaning as ^{R 3} in Formula (1).
However, at least one of the plurality of —CO ₂ R ³ ″ is a group that decomposes by the action of an acid to generate an alkali-soluble group.
R ⁵ is a divalent organic group different from R ⁴ .
[3]
The photosensitive resin composition according to [2], wherein R ⁵ in the general formula (3) is a divalent group having an aromatic group.
[4]
The photosensitive resin composition according to [3], wherein R ⁵ in the general formula (3) is a divalent group represented by any of the following formulas.

In the above formula, at least one hydrogen atom of each aromatic ring is independently selected from the group consisting of fluorine atom, chlorine atom, bromine atom, methyl group, methoxy group, cyano group, phenyl group and trifluoromethyl group. It may be substituted by a species atom or group.
[5]
The thermal decomposition temperature of —CO ₂ R ³ in the general formula (1), —CO ₂ R ³ ′ in the general formula (2) or —CO ₂ R ³ ″ in the general formula (3) is 100 to 220 ° C. The photosensitive resin composition according to any one of [1] to [4].
[6]
_-CO 2 ^{R 3} in the general formula (1), decomposing the alkali-soluble by an acid action of the _-CO 2 ^{R 3} "in _-CO 2 ^{R 3} 'or the general formula (3) in the general formula (2) The photosensitive resin according to any one of [1] to [5], wherein the group that generates a group is an ester group in which a hydrogen atom of a carboxyl group is substituted with a group represented by the following general formula (III): Composition.

In the above general formula,
Ra represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group.
Rb represents a single bond or a divalent linking group.
Q represents an alkyl group, an alicyclic group which may contain a hetero atom, or an aromatic ring group which may contain a hetero atom.
At least two of Ra, Rb and Q may be bonded to each other to form a ring.
[7]
The photosensitive resin composition according to [6], wherein Ra in the general formula (III) is a group represented by the following general formula (IV) or (V).

In the above general formula,
Rc, Rd, Re, Rf and Rg each independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group or a halogen atom. Rc and Rd may be bonded to each other to form a ring, or at least two of Re, Rf and Rg may be bonded to each other to form a ring.
[8]
In the general formula (IV), at least one of Rc and Rd is a cycloalkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group, or a halogen atom. 7]. The photosensitive resin composition as described in 7].
[9]
The photosensitive resin composition according to [8], wherein at least one of Rc and Rd in the general formula (IV) is an aryl group.
[10]
The photosensitive resin composition according to [6], wherein at least one of Ra, Rb and Q in the general formula (III) is an electron-withdrawing group or a group having an electron-withdrawing group.
[11]
The photosensitive resin composition according to [1], wherein R ¹ in the general formula (1) is a tetravalent linking group having a monocyclic or condensed polycyclic aliphatic group or aromatic group.
[12]
Wherein R ² is in the general formula (1), a divalent group, the divalent group containing a divalent group or a silicon atom having an aromatic group having an alicyclic group, [1] or [11] The photosensitive resin composition as described in 2.

[13]
The photosensitive resin composition according to any one of [1] to [12], wherein the resin (a) has a mass average molecular weight of 200,000 or less.
[14]
(C) The photosensitive resin composition according to any one of [1] to [13], further containing a basic compound.
[15]
The photosensitive resin composition according to any one of [1] to [14], wherein the compound (b) is an oxime compound.
[16]
(F) The photosensitive resin composition according to any one of [1] to [15], further comprising an adhesion promoter.
[17]
The photosensitive resin composition according to any one of [1] to [16], which is for positive development.
[18]
[1] A pattern forming material which is the photosensitive resin composition according to any one of [16]. [19]
[1] A photosensitive film formed of the photosensitive resin composition according to any one of [16]. [20]
[1] A polyimide film obtained by heat-treating the photosensitive resin composition according to any one of [16].
[21]
(A) forming a photosensitive film according to [19] on a substrate;
(A) a step of exposing the photosensitive film with actinic rays or radiation;
(C) A process for developing the photosensitive film so as to remove the exposed portion with an aqueous alkaline developer, and (d) a method for producing a cured relief pattern comprising a step of heat-treating the obtained relief pattern.
[22]
A cured relief pattern obtained by the production method according to [21].
[23]
[22] A semiconductor device comprising the cured relief pattern according to [22].
[24]
Resin which has a repeating unit represented by following General formula (1).

In the general formula (1),
R ¹ represents a tetravalent organic group. Several R < ¹ > may mutually be same or different.
R ² represents a divalent organic group. A plurality of R ² may being the same or different.
However, at least one of the plurality of R ² is a divalent organic group having an alicyclic group.
R ³ each independently represents a hydrogen atom or an organic group.
However, at least one of the plurality of —CO ₂ R ³ is a group that decomposes by the action of an acid to generate an alkali-soluble group.

The photosensitive resin composition of the present invention has lithography performance with excellent resolution and sensitivity, and can form a cured relief pattern that prevents wafer warpage due to low stress in so-called low-temperature curing.
According to the present invention, a relief pattern forming material having lithography performance with excellent resolution and sensitivity, excellent low stress characteristics in so-called low temperature cure, and capable of forming a cured relief pattern that prevents wafer warpage, A photosensitive film, a polyimide film, a cured relief pattern, a manufacturing method thereof, and a semiconductor device including the cured relief pattern can be provided.

In the description of the group (atomic group) in this specification, the notation which does not describe substitution and non-substitution includes the thing which has a substituent with the thing which does not have a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In the present specification, “active light” or “radiation” means, for example, the emission line spectrum of a mercury lamp, far ultraviolet rays represented by excimer laser, extreme ultraviolet rays (EUV light), X-rays, electron beams (EB), etc. To do. In the present invention, light means actinic rays or radiation.
In addition, “exposure” in the present specification is not limited to exposure to far ultraviolet rays, extreme ultraviolet rays, X-rays, EUV light and the like represented by mercury lamps and excimer lasers, but also electron beams, ion beams, etc., unless otherwise specified. The exposure with the particle beam is also included in the exposure.

The photosensitive resin composition of the present invention contains (a) a resin having a repeating unit represented by the following general formula (1), and (b) a compound that generates an acid upon irradiation with actinic rays or radiation.

The photosensitive resin composition of the present invention containing the resin (a) having a repeating unit represented by the general formula (1) has lithography performance with excellent resolution and sensitivity. In so-called low temperature curing, The reason why it is possible to form a cured relief pattern that prevents wafer warpage due to low stress is not clear, but is estimated as follows.
The repeating unit represented by the general formula (1) can form a linear and rigid polyimide by thermosetting, and at least one of a plurality of R ² present in the resin (a) is a fat. Linearity and rigidity can be improved by using a divalent organic group having a cyclic group. Thereby, it is presumed that the thermal expansibility can be particularly lowered, low stress can be achieved, and wafer warpage can be prevented.
Further, since at least one of R ² present in the resin (a) is a divalent organic group having an alicyclic group, the light transmission property such as i-line at the time of exposure is not impaired and the resolution is improved. It is estimated that the lithography performance with excellent sensitivity is achieved.

(A) Resin having a repeating unit of the general formula (1) The resin (a) having a repeating unit represented by the general formula (1) is a resin whose solubility in an alkaline developer is increased by the action of an acid. The resin having the repeating unit of the general formula (1) is preferably insoluble or hardly soluble in an alkali developer.

The repeating unit represented by the general formula (1) includes a compound having four carboxyl groups with R ¹ as a nucleus, a carboxylic acid anhydride thereof, or a hydrogen atom in at least one of the four carboxyl groups. It is composed of an acid component derived from a compound substituted with a group capable of leaving by the action of an acid and a diamine component derived from a compound having two amino groups with R ² as a nucleus. In other words, an acid component which is a partial structure containing two carbonyl groups sandwiched between two carbonyl groups in the general formula (1), and —NH—R ² —NH— in the general formula (1) It is comprised from the diamine component which is the partial structure represented by these.
The tetravalent organic group R ¹ preferably has 4 to 30 carbon atoms, and more preferably a tetravalent linking group having a monocyclic or condensed polycyclic aliphatic group or aromatic group. . A plurality of R ¹ present in the resin (a) may be the same or different.
Examples of the monocyclic aromatic group in the tetravalent organic group R ¹ include a benzene ring group and a pyridine ring group.
Examples of the condensed polycyclic aromatic group in the tetravalent organic group R ¹ include a naphthalene ring group and a perylene ring group.
Examples of the monocyclic aliphatic group in the tetravalent organic group R ¹ include a cyclobutane ring group, a cyclopentane ring group, and a cyclohexane ring group.
Examples of the condensed polycyclic aliphatic group in the tetravalent organic group R ¹ include a bicyclo [2.2.1] heptane ring group, a bicyclo [2.2.2] octane ring group, and a bicyclo [2.2. 2] Oct-7-ene ring group and the like.
As the tetravalent linking group having a monocyclic or condensed polycyclic aliphatic group or aromatic group for the tetravalent organic group R ¹ , the above-mentioned monocyclic or condensed polycyclic aliphatic group or The aromatic group itself may be used, but a plurality of monocyclic or condensed polycyclic aliphatic groups or aromatic groups are linked via a single bond or a divalent linking group, and 4 as R ¹ A valent linking group may be formed.
The divalent linking group is preferably an alkylene group (an alkylene group having 1 to 6 carbon atoms, such as a methylene group, an ethylene group, or a propylene group), an oxygen atom, a sulfur atom, a divalent sulfone group, or an ester bond. , Ketone group, amide group and the like.

Specific examples of the acid component having a group derived from at least four carboxyl groups with R ¹ as a nucleus include pyromellitic acid anhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic acid anhydride, 2, 3,3 ′, 4′-biphenyltetracarboxylic anhydride, 2,2 ′, 3,3′-biphenyltetracarboxylic anhydride, 3,3 ′, 4,4′-benzophenonetetracarboxylic anhydride, 2 , 2 ′, 3,3′-benzophenonetetracarboxylic anhydride, 4,4′-
(Hexafluoroisopropylidene) diphthalic anhydride, 1,2,5,6-naphthalenetetracarboxylic anhydride, 2,3,6,7-naphthalenetetracarboxylic anhydride, 2,3,5,6- Pyridinetetracarboxylic anhydride, 3,4,9,10-perylenetetracarboxylic anhydride, (trifluoromethyl) pyromellitic anhydride, di (trifluoromethyl) pyromellitic anhydride, di (heptafluoropropyl) ) Pyromellitic anhydride, pentafluoroethylpyromellitic anhydride, bis [3,5-di (trifluoromethyl) phenoxy] pyromellitic anhydride, 3,3 ′, 4,4′-tetracarboxydiphenyl ether Anhydride, 2,3 ′, 3,4′-tetracarboxydiphenyl ether dianhydride, 3,3 ′, 4,4′-tetracarboxydiphe Lumethane dianhydride, 3,3 ′, 4,4′-tetracarboxydiphenylsulfone dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (3 4-Dicarboxyphenyl) hexafluoropropane dianhydride, 5,5′-bis (trifluoromethyl) -3,3 ′, 4,4′-tetracarboxybiphenyl dianhydride, 2,2 ′, 5,5 '-Tetrakis (trifluoromethyl) -3,3', 4,4'-tetracarboxybiphenyl dianhydride, 5,5'-bis (trifluoromethyl) -3,3 ', 4,4'-tetracarboxy Diphenyl ether dianhydride, 5,5′-bis (trifluoromethyl) -3,3 ′, 4,4′-tetracarboxybenzophenone dianhydride, bis [(trifluoromethyl) dicarboxyphenoxy] benzene Anhydrous, bis (dicarboxyphenoxy) bis (trifluoromethyl) benzene dianhydride, bis (dicarboxyphenoxy) tetrakis (trifluoromethyl) benzene dianhydride, 2,2-bis [4- (3,4- Dicarboxyphenoxy) phenyl] propane dianhydride, 2,2-bis (4- (3,4-dicarboxyphenoxy) phenyl) hexafluoropropane dianhydride, 5,5 ′-[p-phenylenebis (oxycarbonyl) )] Components derived from aromatic tetracarboxylic anhydrides such as diphthalic anhydride,
Cyclobutanetetracarboxylic acid anhydride, cyclopentanetetracarboxylic acid anhydride, cyclohexanetetracarboxylic acid anhydride, 1,2,4,5-cyclohexanetetracarboxylic acid, bicyclo [2.2.1] heptane-2,3, 5,6-tetracarboxylic acid, bicyclo [2.2.2] octane-2,3,5,6-tetracarboxylic acid, or bicyclo [2.2.2] oct-7-ene-2,3,5 , 6-tetracarboxylic acid, bicyclo [2.2.2] octane-2,3,5,6-tetracarboxylic dianhydride, (1S, 2S, 4R, 5R) -cyclohexanetetracarboxylic dianhydride, Examples thereof include components derived from aliphatic tetracarboxylic anhydrides such as (1R, 2S, 4S, 5R) -cyclohexanetetracarboxylic dianhydride.

Preferably, a component derived from pyromellitic acid anhydride, a component derived from 3,3 ′, 4,4′-biphenyltetracarboxylic acid anhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic acid anhydride A component derived from 2,2 ′, 3,3′-biphenyltetracarboxylic anhydride, a component derived from 3,3 ′, 4,4′-benzophenonetetracarboxylic anhydride, 4,4 Component derived from '-(hexafluoroisopropylidene) diphthalic anhydride, component derived from 3,3', 4,4'-tetracarboxydiphenyl ether dianhydride, 1,2,5,6-naphthalenetetracarboxylic A component derived from an acid anhydride, a component derived from 5,5 ′-[p-phenylenebis (oxycarbonyl)] diphthalic anhydride, a component derived from cyclobutanetetracarboxylic anhydride, Component derived from tantetracarboxylic anhydride, component derived from bicyclo [2.2.2] octane-2,3,5,6-tetracarboxylic dianhydride, (1S, 2S, 4R, 5R)- A component derived from cyclohexanetetracarboxylic dianhydride, a component derived from (1R, 2S, 4S, 5R) -cyclohexanetetracarboxylic dianhydride,
More preferably, a component derived from pyromellitic anhydride, a component derived from 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride, 4,4 ′-(hexafluoroisopropylidene) diphthalic anhydride A component derived from cyclobutanetetracarboxylic anhydride, a component derived from 3,3 ′, 4,4′-tetracarboxydiphenyl ether dianhydride, a component derived from cyclopentanetetracarboxylic anhydride, 5 , 5 ′-[p-phenylenebis (oxycarbonyl)] diphthalic anhydride component, (1S, 2S, 4R, 5R) -cyclohexanetetracarboxylic dianhydride component, (1R, 2S, It is a component derived from 4S, 5R) -cyclohexanetetracarboxylic dianhydride. By using these, good solvent solubility, alkali dissolution rate, transparency, and stress characteristics can be realized.
The content of the acid component derived from the compound having four carboxyl groups with R ¹ as a nucleus in the resin (a) is 20 to 70 mol% with respect to all repeating units constituting the resin (a). It is preferably 30 to 60% by mole.

Examples of the divalent organic group R ² include a divalent group having an alicyclic group, a divalent group having an aromatic group, and a divalent group containing a silicon atom. A plurality of R ² present in the resin (a) may be the same or different.
Hereinafter, when R ² is a divalent group having an alicyclic group, the diamine component having R ² as a nucleus is sometimes referred to as an alicyclic diamine component, and when R ² is a divalent group having an aromatic group. the diamine component of R ² to the core of, sometimes called the aromatic diamine component, the diamine component of the R ² at the core when the divalent group R ² contains a silicon atom, that silicon diamine There is also.

At least one of R ^{2 in} the diamine component present in the resin (a) is a divalent group having an alicyclic group. When the resin (a) contains a diamine component having an alicyclic group, good solvent solubility, alkali dissolution rate, transparency, and sensitivity can be realized.
The alicyclic group that R ² may have is preferably a divalent alicyclic group having 3 to 20 carbon atoms, such as a monocyclic cycloalkylene group such as a cyclopentylene group or a cyclohexylene group, or bicyclo [2.2. 1] Polycyclic cycloalkylene groups such as a heptylene group, norbornylene group, tetracyclodecanylene group, tetracyclododecanylene group, adamantylene group, and the like can be given.
The divalent group having an alicyclic group for R ² may be the alicyclic group itself, but a plurality of alicyclic groups are preferably an alkylene group (an alkylene group having 1 to 6 carbon atoms, for example, Methylene group, ethylene group, propylene group, etc.) may be linked to form a divalent group having an alicyclic group as R ² , and the amino group and alicyclic group in the diamine component are alkylene groups. You may connect with.
The alicyclic group and alkylene group that can form a divalent group having an alicyclic group may have a substituent, and an alkyl group (preferably an alkyl group having 1 to 4 carbon atoms) as such a substituent. ), Halogen atoms and the like.
Particularly preferred diamine components having an alicyclic structure having R ² as a nucleus include a 5-amino-1,3,3-trimethylcyclohexanemethylamine component, a cis-1,4-cyclohexanediamine component, and trans-1,4- Cyclohexanediamine component, 1,4-cyclohexanediamine component (cis, trans mixture), 4,4′-methylenebis (cyclohexylamine) component and its 3,3′-dimethyl-substituted product, bis (aminomethyl) bicyclo [2.2 .1] heptane component, 1,3-diaminoadamantane component, 3,3′-diamino-1,1′-biadamantyl component, 4,4′-hexafluoroisopropylidenebis (cyclohexylamine) component, Of which 3,3′-diamino-1,1′-biadamantyl component, trans-1,4-cyclo From the viewpoint of hexane diamine component to lower the stress.
The content of the alicyclic diamine component having two amino groups with R ² as a nucleus in the resin (a) is 20 to 70 mol% with respect to all repeating units constituting the resin (a). Preferably, it is 30 to 60 mol%.

The aromatic group in the divalent group having an aromatic group for R ² is preferably an aromatic group having 5 to 16 carbon atoms, and examples thereof include a phenylene group and a naphthylene group. Further, the aromatic group may contain a hetero atom such as a nitrogen atom or an oxygen atom, and examples thereof include a divalent benzoxazole group.
The divalent group having an aromatic group for R ² may be the aromatic group itself, but a plurality of aromatic groups are linked via a single bond or a divalent linking group, and R ² The divalent group which has an aromatic group as may be formed, and the amino group in the diamine component and the aromatic group may be linked via a divalent linking group.
The divalent linking group is preferably an alkylene group (an alkylene group having 1 to 6 carbon atoms, such as a methylene group, an ethylene group, or a propylene group), an oxygen atom, a sulfur atom, a divalent sulfone group, or an ester bond. , Ketone group, amide group and the like.
The aromatic group and alkylene group that can form a divalent group having an aromatic group may have a substituent, and as such a substituent, an alkyl group (preferably an alkyl group having 1 to 4 carbon atoms) may be used. ), An alkoxy group such as a halogen atom and a methoxy group, and an aryl group such as a cyano group and a phenyl group.
Specific examples of the aromatic diamine component having R ² as a core include, for example, an m-phenylenediamine component, a p-phenylenediamine component, a 2,4-tolylenediamine component, a 3,3′-diaminodiphenyl ether component, 3, 4'-diaminodiphenyl ether component, 4,4'-diaminodiphenyl ether component, 3,3'-diaminodiphenyl sulfone component, 4,4'-diaminodiphenyl sulfone component, 3,4'-diaminodiphenyl sulfone component, 3,3 ' -Diaminodiphenylmethane component, 4,4'-diaminodiphenylmethane component, 3,4'-diaminodiphenylmethane component, 4,4'-diaminodiphenyl sulfide component, 3,3'-diaminodiphenyl ketone component, 4,4'-diaminodiphenyl Ketone component, 3,4'-diaminodiphenyl ketone component, 2 2′-bis (4-aminophenyl) propane component, 2,2′-bis (4-aminophenyl) hexafluoropropane component, 1,3-bis (3-aminophenoxy) benzene component, 1,3-bis ( 4-aminophenoxy) benzene component, 1,4-bis (4-aminophenoxy) benzene component, 4-methyl-2,4-bis (4-aminophenyl) -1-pentene component, 4-methyl-2,4 -Bis (4-aminophenyl) -2-pentene component, 1,4-bis (α, α-dimethyl-4-aminobenzyl) benzene component, imino-di-p-phenylenediamine component, 1,5-diaminonaphthalene Component, 2,6-diaminonaphthalene component, 4-methyl-2,4-bis (4-aminophenyl) pentane component, 5 (or 6) -amino-1- (4-aminophenyl) 1,3,3-trimethylindane component, bis (p-aminophenyl) phosphine oxide component, 4,4′-diaminoazobenzene component, 4,4′-diaminodiphenylurea component, 4,4′-bis (4- Aminophenoxy) biphenyl component, 2,2-bis [4- (4-aminophenoxy) phenyl] propane component, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane component, 2,2- Bis [4- (3-aminophenoxy) phenyl] benzophenone component, 4,4′-bis (4-aminophenoxy) diphenylsulfone component, 4,4′-bis [4- (α, α-dimethyl-4-amino) Benzyl) phenoxy] benzophenone component, 4,4′-bis [4- (α, α-dimethyl-4-aminobenzyl) phenoxy] diphenylsulfo Component, 4,4′-diaminobiphenyl component, 4,4′-diaminobenzophenone component, phenylindanediamine component, 3,3′-dimethoxy-4,4′-diaminobiphenyl component, 3,3′-dimethyl-4, 4'-diaminobiphenyl component, 2,2'-dimethyl 4,4'-diaminobiphenyl component, 2,2'-bis (trifluoromethyl) benzidine component, o-toluidine sulfone component, 2,2-bis (4- Aminophenoxyphenyl) propane component, bis (4-aminophenoxyphenyl) sulfone component, bis (4-aminophenoxyphenyl) sulfide component, 1,4- (4-aminophenoxyphenyl) benzene component, 1,3- (4- Aminophenoxyphenyl) benzene component, 9,9-bis (4-aminophenyl) fluorene component, 4,4′- -(3-aminophenoxy) diphenylsulfone component, 4,4'-diaminobenzanilide component, 4-aminophenyl-4'-aminophenylbenzoate component, bis (4-aminophenyl) terephthalate component, 2- (4-amino Phenyl) benzoxazol-5-ylamine, 4,4 ″ -diamino-p-terphenyl component, etc., and hydrogen atoms of aromatic nuclei of these aromatic diamines are chlorine, fluorine, bromine, methyl, methoxy And a structure substituted with at least one group or atom selected from the group consisting of a group, a cyano group and a phenyl group.
Particularly preferred aromatic diamine components include p-phenylenediamine component, 4,4′-diaminodiphenyl ether component, 3,3′-diaminodiphenylsulfone component, 4,4′-diaminodiphenylsulfone component, and 2,2′-bis. (4-aminophenyl) hexafluoropropane component, 1,4-bis (4-aminophenoxy) benzene component, imino-di-p-phenylenediamine component, 4,4'-diaminobiphenyl component, 4,4'-diamino Benzophenone component, 3,3′-dimethoxy-4,4′-diaminobiphenyl component, 3,3′-dimethyl-4,4′-diaminobiphenyl component, 2,2′-dimethyl 4,4′-diaminobiphenyl component, 2,2′-bis (trifluoromethyl) benzidine component, o-toluidine sulfone component, 2,2-bis (4-amino Nophenoxyphenyl) propane component, 9,9-bis (4-aminophenyl) fluorene component, 4,4′-di- (3-aminophenoxy) diphenylsulfone component, 4,4′-diaminobenzanilide component, 4- Aminophenyl-4′-aminophenylbenzoate component, bis (4-aminophenyl) terephthalate, 2- (4-aminophenyl) benzoxazol-5-ylamine component, 4,4 ″ -diamino-p-terphenyl component A film having good toughness and low stress can be obtained.
The diamine component may be substituted with a hydroxyl group. Examples of such bisaminophenol components include 3,3′-dihydroxybenzidine component, 3,3′-diamino-4,4′-dihydroxybiphenyl component, and 4,4′-diamino-3,3′-dihydroxy. Biphenyl component, 3,3′-diamino-4,4′-dihydroxydiphenylsulfone component, 4,4′-diamino-3,3′-dihydroxydiphenylsulfone component, bis- (3-amino-4-hydroxyphenyl) methane Component, 2,2-bis- (3-amino-4-hydroxyphenyl) propane component, 2,2-bis- (3-amino-4-hydroxyphenyl) hexafluoropropane component, 2,2-bis- (4 -Amino-3-hydroxyphenyl) hexafluoropropane component, bis- (4-amino-3-hydroxyphenyl) methane component, 2 2-bis- (4-amino-3-hydroxyphenyl) propane component, 4,4′-diamino-3,3′-dihydroxybenzophenone component, 3,3′-diamino-4,4′-dihydroxybenzophenone component, 4 , 4'-diamino-3,3'-dihydroxydiphenyl ether component, 3,3'-diamino-4,4'-dihydroxydiphenyl ether component, 1,4-diamino-2,5-dihydroxybenzene component, 1,3-diamino -2,4-dihydroxybenzene component, 1,3-diamino-4,6-dihydroxybenzene component and the like. These bisaminophenol components may be used alone or in combination.

Among these bisaminophenol structures, a particularly preferred embodiment is that R ² in the general formula (1) is a divalent group having an aromatic group selected from the following.

In the above formula, X ₁ represents —O—, —S—, —C (CF ₃ ) ₂ —, —CH ₂ —, —SO ₂ —, —NHCO—. * Represents a bonding position with —NH— or —OH bonded to R ² in the general formula (1). In the above structure, —NH— and —OH bonded to R ² are bonded to each other in the ortho position (adjacent position).
The content of the aromatic diamine component having two amino groups with R ² as a nucleus in the resin (a) is 5 to 40 mol% with respect to all repeating units constituting the resin (a). Preferably, it is 10 to 30 mol%.

Further, the R ² in order to enhance the adhesion to the substrate can be a silicon diamine component as the diamine component to the nucleus. Examples include bis (4-aminophenyl) dimethylsilane component, bis (4-aminophenyl) tetramethylsiloxane component, bis (4-aminophenyl) tetramethyldisiloxane component, bis (γ-aminopropyl) tetramethyl. Examples thereof include a disiloxane component, a 1,4-bis (γ-aminopropyldimethylsilyl) benzene component, a bis (4-aminobutyl) tetramethyldisiloxane component, and a bis (γ-aminopropyl) tetraphenyldisiloxane component.
The following structure can also be mentioned as a silicon diamine component.

In the above formula, R ₅ and R ₆ represent a divalent organic group, and R ₇ and R ₈ represent a monovalent organic group. A plurality of R ₇ may be the same as or different from each other. The plurality of R ₈ may be the same as or different from each other.
Examples of the divalent organic group represented by R ₅ and R ₆ include a linear or branched alkylene group having 1 to 20 carbon atoms which may have a substituent, a phenylene group having 6 to 20 carbon atoms, carbon This represents a divalent alicyclic group of 3 to 20 or a group constituted by combining these.
The monovalent organic group represented by R ₇ and R ₈ represents a linear or branched alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms which may have a substituent. .
More specifically, the following can be mentioned.

The content of the silicon diamine component having at least two amino groups with R ² as a nucleus in the resin (a) is 5 to 40 mol% with respect to all repeating units constituting the resin (a). Preferably, it is 10 to 30 mol%.

When the resin (a) having the repeating unit represented by the general formula (1) is thermoset to be polyimide, the viewpoint of improving linearity and rigidity and achieving low stress to prevent wafer warpage, From the viewpoint of enhancing the adhesiveness with the substrate, the viewpoint of enhancing the alkali solubility after exposure, and the like, it has a repeating unit represented by the following general formula (2) and a repeating unit represented by the following general formula (3). A resin is preferred.

In the general formula (2),
R ¹ 'has the same meaning as ^{R 1} in the general formula (1).
R ³ 'has the same meaning as ^{R 3} in Formula (1).
However, at least one of the plurality of —CO ₂ R ′ ³ is a group that decomposes by the action of an acid to generate an alkali-soluble group.
R ⁴ is a divalent organic group having an alicyclic group.
In the general formula (3),
R ¹ "has the same meaning as ^{R 1} in the general formula (1).
R ³ "has the same meaning as ^{R 3} in Formula (1).
However, at least one of the plurality of —CO ₂ R ³ ″ is a group that decomposes by the action of an acid to generate an alkali-soluble group.
R ⁵ is a divalent organic group different from R ⁴ .

Specific examples and preferred examples of the divalent organic group having an alicyclic group for R ⁴ include those similar to the specific examples and preferred examples of the divalent group having an alicyclic group for R ² .
Examples of the divalent organic group R ⁵ different from R ⁴ include the divalent group having an aromatic group and the divalent group containing a silicon atom described above for R ² .
R ⁵ in the general formula (3) is a fragrance from the viewpoint of improving linearity and rigidity, achieving low stress and preventing wafer warpage, and improving heat resistance when cured to polyimide. A divalent group having an aromatic group is preferred, and specific examples and preferred examples of the divalent group having an aromatic group for R ⁵ include a divalent group having an aromatic group for R ² . Specific examples and preferred examples are the same. A divalent group represented by any of the following formulas is more preferable.

In the above formula, at least one hydrogen atom of each aromatic ring is independently selected from the group consisting of a fluorine atom, a chlorine atom, a bromine atom, a methyl group, a methoxy group, a cyano group, a phenyl group, and a trifluoromethyl group. It may be substituted by a species atom or group.

Examples of the organic group for R ³ , R ³ ′ or R ³ ″ preferably have 1 to 20 carbon atoms. Specifically, a group that decomposes by the action of an acid to generate an alkali-soluble group, an alkyl group, A cycloalkyl group, an aryl group, an aralkyl group, an alkenyl group, an alkynyl group, an alkoxy group, a silicon atom-containing group, —CORc (Rc is an alkyl group, an aryl group, a cycloalkyl group), —SO ₂ Rd (Rd is an alkyl group, Aryl group, cycloalkyl group, o-quinonediazide group), or a combination thereof.

The alkyl group represented by R ³ , R ³ ′ or R ³ ″ may have a substituent, and is preferably a linear or branched alkyl group having 1 to 20 carbon atoms in the alkyl chain. It may have an oxygen atom, a sulfur atom, or a nitrogen atom, specifically, methyl group, ethyl group, n-propyl group, n-butyl group, n-pentyl group, n-hexyl group, n-octyl group And straight chain alkyl groups such as n-dodecyl group, n-tetradecyl group and n-octadecyl group, and branched alkyl groups such as isopropyl group, isobutyl group, t-butyl group, neopentyl group and 2-ethylhexyl group. Examples of the substituent include a cyano group, a halogen atom, a hydroxyl group, an alkoxy group, a carboxyl group, and an alkoxycarbonyl group.

The cycloalkyl group represented by R ³ , R ³ ′ or R ³ ″ may have a substituent, preferably a cycloalkyl group having 3 to 20 carbon atoms, which may be polycyclic, Specific examples include a cyclopropyl group, a cyclopentyl group, a cyclohexyl group, a norbornyl group, an adamantyl group, and the like.

The aryl group represented by R ³ , R ³ ′ or R ³ ″ may have a substituent, preferably an aryl group having 6 to 14 carbon atoms, such as a phenyl group, a naphthyl group, And anthryl group.

The aralkyl group represented by R ³ , R ³ ′ or R ³ ″ may have a substituent, preferably an aralkyl group having 7 to 20 carbon atoms, such as a benzyl group, a phenethyl group, A naphthylmethyl group and a naphthylethyl group are mentioned.

The alkoxy group represented by R ³ , R ³ ′ or R ³ ″ may have a substituent, preferably an alkoxy group having 1 to 20 carbon atoms, such as a methoxy group, an ethoxy group, Examples include propoxy group, n-butoxy group, pentyloxy group, hexyloxy group, heptyloxy group and the like.

The silicon atom-containing group represented by R ³ , R ³ ′ or R ³ ″ is not particularly limited as long as silicon is contained, but a silyloxy group (trimethylsilyloxy, triethylsilyloxy, t-butyldimethylsilyloxy) is preferable.

The alkenyl group represented by R ³ , R ³ ′ or R ³ ″ is a group having a double bond at an arbitrary position of the alkyl group, cycloalkyl group, aryl group, aralkyl group, alkoxy group or silicon atom-containing group. The number of carbon atoms is preferably 1 to 12, more preferably 1 to 6. For example, a vinyl group and an allyl group are preferable.

The alkynyl group represented by R ³ , R ³ ′ or R ³ ″ has a triple bond at any position of the above alkyl group, cycloalkyl group, aryl group, aralkyl group, alkoxy group and silicon atom-containing group. Preferred are those having 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, such as ethynyl group and propargyl group.

In the present invention, at least one of the plurality of —CO ₂ R ³ present in the resin (a) is a group that decomposes by the action of an acid to generate an alkali-soluble group. Formula (2) _-CO 2 ^{R 3} in 'is the same for _-CO 2 ^{R 3} "in formula (3).
The group that decomposes by the action of an acid to generate an alkali-soluble group is a group that decomposes by the action of an acid to generate an alkali-soluble group such as a hydroxyl group or a carboxyl group on the resin side (hereinafter also referred to as an acid-decomposable group). Say. In the present invention, the acid-decomposable group is preferably a group that decomposes by the action of an acid and generates a carboxyl group as an alkali-soluble group on the resin side.
A preferred group as the acid-decomposable group is a group obtained by substituting the hydrogen atom of these alkali-soluble groups with a group capable of leaving with an acid.
Examples of the group capable of leaving with an acid include —C (R ₃₆ ) (R ₃₇ ) (R ₃₈ ), —C (R ₃₆ ) (R ₃₇ ) (OR ₃₉ ), —C (R ₀₁ ) (R ₀₂ ). ) (OR ₃₉ ) and the like. In the formula, R ₃₆ to R ₃₉ each independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group. R ₃₆ and R ₃₇ may be bonded to each other to form a ring.

R ₀₁ and R ₀₂ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group.

The acid-decomposable group is preferably a tertiary alkyl ester group, an acetal ester group, a cumyl ester group, an enol ester group or the like. A tertiary alkyl ester group and an acetal ester group are more preferable, and a photosensitive film having high sensitivity and high resolution can be obtained by using them.

The tertiary alkyl ester group as the acid-decomposable group is preferably an ester group in which the hydrogen atom of the carboxyl group is substituted with a group represented by the following general formula (AI).

In the general formula (AI),
T represents a single bond or a —Rt—COO— group. Rt represents an alkylene group or a cycloalkylene group.
Rx ₁ to Rx ₃ each independently represents an alkyl group (straight or branched) or a cycloalkyl group (monocyclic or polycyclic).
Two of Rx ₁ to Rx ₃ may combine to form a cycloalkyl group (monocyclic or polycyclic).

Rt is preferably an alkylene group having 1 to 5 carbon atoms, more preferably a —CH ₂ — group, — (CH ₂ ) ₂ — group, or — (CH ₂ ) ₃ — group.
The alkyl group of Rx ₁ to Rx ₃ is preferably an alkyl group having 1 to 4 carbon atoms such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, or a t-butyl group.

Examples of the cycloalkyl group represented by Rx ₁ to Rx ₃ include monocyclic cycloalkyl groups such as cyclopentyl group and cyclohexyl group, polycyclic cycloalkyl groups such as norbornyl group, tetracyclodecanyl group, tetracyclododecanyl group, and adamantyl group. Groups are preferred.
Examples of the cycloalkyl group formed by combining two of Rx ₁ to Rx ₃ include a monocyclic cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group, an adamantyl group A polycyclic cycloalkyl group such as a group is preferred. A monocyclic cycloalkyl group having 5 or 6 carbon atoms is particularly preferable.
An embodiment in which Rx ₁ is a methyl group or an ethyl group, and Rx ₂ and Rx ₃ are bonded to form the above-described cycloalkyl group is preferable.

Each of the above groups may have a substituent. Examples of the substituent include an alkyl group (1 to 4 carbon atoms), a halogen atom, a hydroxyl group, an alkoxy group (1 to 4 carbon atoms), a carboxyl group, Examples thereof include alkoxycarbonyl groups (having 2 to 6 carbon atoms), and those having 8 or less carbon atoms are preferred.

Specific examples of the group represented by the general formula (AI) constituting the tertiary alkyl ester group as the acid-decomposable group are shown below, but the present invention is not limited thereto.

In specific examples, Rxa and Rxb each represents an alkyl group having 1 to 4 carbon atoms. Z represents the substituent which each said group may have, and when there exist multiple, each is independent. p represents 0 or a positive integer.

The tertiary alkyl ester group as the acid-decomposable group includes a group represented by the following general formula (I) and a group represented by the following general formula (II) as the group represented by the general formula (AI). A tertiary alkyl ester group having at least one of the above is more preferable.

In formulas (I) and (II),
R ₂ , R ₄ , R ₅ and R ₆ each independently represents an alkyl group or a cycloalkyl group.
R represents an atomic group necessary for forming an alicyclic structure together with a carbon atom.

The alkyl group in R ₂ may be linear or branched, and may have a substituent.
The cycloalkyl group in R ₂ may be monocyclic or polycyclic and may have a substituent.
R ₂ is preferably an alkyl group, more preferably 1 to 10 carbon atoms, still more preferably 1 to 5 carbon atoms, and examples thereof include a methyl group and an ethyl group.

R represents an atomic group necessary for forming an alicyclic structure together with a carbon atom. The alicyclic structure formed by R is preferably a monocyclic alicyclic structure, and the carbon number thereof is preferably 3 to 7, more preferably 5 or 6.

The alkyl group in R ₄ , R ₅ , and R ₆ may be linear or branched and may have a substituent. As the alkyl group, those having 1 to 4 carbon atoms such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group and t-butyl group are preferable.

The cycloalkyl group in R ₄ , R ₅ and R ₆ may be monocyclic or polycyclic and may have a substituent. The cycloalkyl group is preferably a monocyclic cycloalkyl group such as a cyclopentyl group or a cyclohexyl group, or a polycyclic cycloalkyl group such as a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group or an adamantyl group.

Examples of the group represented by the general formula (I) include groups represented by the following general formulas (Ia) and (Ib).

In the formula, R ₂ has the same meaning as R ₂ in formula (I).

The group represented by the general formula (II) is preferably a group represented by the following general formula (II-a).

In the formula (II-a),
R ₄ and R ₅ have the same meaning as in general formula (II).

Specifically, the acetal ester group as the acid-decomposable group is preferably an ester group in which a hydrogen atom of a carboxyl group is substituted with a group represented by the following general formula (III).

Ra represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group.
Rb represents a single bond or a divalent linking group.
Q represents an alkyl group, an alicyclic group which may contain a hetero atom, or an aromatic ring group which may contain a hetero atom.
At least two of Ra, Rb and Q may be bonded to each other to form a ring. This ring is preferably a 5-membered ring or a 6-membered ring.

Examples of the alkyl group, cycloalkyl group, aryl group or aralkyl group as Ra include the same groups as those described above for the alkyl group, cycloalkyl group, aryl group and aralkyl group for R ³ in formula (1).
Ra is particularly preferably a hydrogen atom, a methyl group, a phenyl group or a benzyl group, and a photosensitive film having good sensitivity can be obtained.
Ra is a group represented by the following general formula (IV) or (V) from the standpoint of preventing degradation of the acetal ester group as an acid-decomposable group during storage due to steric hindrance and preventing a decrease in patternability. Is also preferable.

In the above general formula, Rc, Rd, Re, Rf and Rg are each independently an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkoxycarbonyl group, an aryloxycarbonyl group, cyano. Represents a group or a halogen atom, and Rc and Rd may be bonded to each other to form a ring, or at least two of Re, Rf and Rg may be bonded to each other to form a ring.
When Ra is a group represented by the general formula (IV) or (V), the progress of the imidization reaction during storage can be suppressed in the resin having the repeating unit represented by the general formula (1), and the patterning property Can be prevented.
The alkyl group, cycloalkyl group, aryl group, aralkyl group or alkoxy group as Rc, Rd, Re, Rf, Rg is an alkyl group, cycloalkyl group, aryl group, aralkyl group for R ³ in the general formula (1), The thing similar to what was mentioned above as an alkoxy group is mentioned.
The aryloxy group as Rc, Rd, Re, Rf, Rg is preferably an aryloxy group having 6 to 10 carbon atoms, and specific examples include phenoxy, toluyloxy, 1-naphthoxy and the like.
The alkoxycarbonyl group as Rc, Rd, Re, Rf, Rg is preferably an alkoxycarbonyl group having 1 to 10 carbon atoms, specifically, methoxycarbonyl, ethoxycarbonyl, linear or branched propoxycarbonyl, cyclopentyloxycarbonyl, Examples include cyclohexyloxycarbonyl.
Examples of the aryloxy moiety of the aryloxycarbonyl group as Rc, Rd, Re, Rf, and Rg include the same aryloxy groups as those described above.

From the viewpoint of preventing degradation of the acetal ester group as an acid-decomposable group during storage and preventing a decrease in patternability, at least one of Rc and Rd in the general formula (IV) is a cycloalkyl group, an aryl group, or an aralkyl. It is preferably a group, an alkoxy group, an aryloxy group, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group, or a halogen atom, and more preferably at least one is an aryl group.

The divalent linking group as Rb is, for example, an alkylene group (preferably an alkylene group having 1 to 8 carbon atoms, such as a methylene group, an ethylene group, a propylene group, a butylene group, a hexylene group or an octylene group), a cycloalkylene group. (Preferably a cycloalkylene group having 3 to 15 carbon atoms, such as a cyclopentylene group or a cyclohexylene group), —S—, —O—, —CO—, —CS—, —SO ₂ —, —N (R ₀ )-, or a combination of two or more thereof, and those having a total carbon number of 20 or less are preferred. Here, R ₀ is a hydrogen atom or an alkyl group (eg, an alkyl group having 1 to 8 carbon atoms, specifically, a methyl group, an ethyl group, a propyl group, an n-butyl group, a sec-butyl group, Hexyl group and octyl group).
Rb is preferably a single bond, an alkylene group, or a divalent linking group comprising a combination of an alkylene group and at least one of —O—, —CO—, —CS— and —N (R ₀ ) —. , An alkylene group, or a divalent linking group composed of a combination of an alkylene group and —O— is more preferable. Here, R ₀ has the same meaning as R ₀ described above.

The alkyl group as Q is the same as the alkyl group as Ra described above, for example.

Examples of the alicyclic group and aromatic ring group as Q include the cycloalkyl group and aryl group as Ra described above. The number of carbon atoms is preferably 3-18. In the present invention, a group in which a plurality of aromatic rings are connected via a single bond (for example, a biphenyl group or a terphenyl group) is also included in the aromatic group as Q.
Examples of the alicyclic group containing a hetero atom and the aromatic ring group containing a hetero atom include, for example, thiirane, cyclothiolane, thiophene, furan, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, thiazole. And pyrrolidone.
The alicyclic group and aromatic ring group as Q may have a substituent, and examples thereof include an alkyl group, a cycloalkyl group, a cyano group, a halogen atom, a hydroxyl group, an alkoxy group, a carboxyl group, and an alkoxycarbonyl group. It is done.

(—Rb-Q) is particularly preferably a methyl group, an aryloxyethyl group, a cyclohexylethyl group, or an arylethyl group, which improves solubility and thermal stability.

In the case where at least two of Ra, Rb and Q are bonded to each other to form a ring, for example, any of Rb and Q and Ra are bonded to form a propylene group or a butylene group and contain an oxygen atom The case where a 5-membered ring or a 6-membered ring is formed is mentioned.

When the total carbon number of Ra, Rb and Q is expressed as N _C , when N _C is large, the alkali dissolution rate change of the resin (a) before and after the removal of the group represented by the general formula (III) is eliminated Increases, the dissolution contrast becomes harder, and the resolution is improved. The range of N _C is preferably 2 to 20, and 2 to 15 is particularly preferable. When N _C is 20 or less, the glass transition temperature of the polymer compound is suppressed from being lowered, and further, the generation of defects in which a desorbed substance from the acid-decomposable group adheres to the pattern is suppressed.

At least one of Ra, Rb and Q is preferably an electron-withdrawing group or a group having an electron-withdrawing group. Thereby, in resin (a) which has a repeating unit represented by the said General formula (1), decomposition | disassembly of the acid-decomposable group during preservation | save can be suppressed and the fall of patterning property can be prevented.
Examples of the electron withdrawing group include an alkoxy group, aryl group, alkenyl group, alkynyl group, halogen atom, acyl group, arylcarbonyl group, alkoxycarbonyl group, aryloxycarbonyl group, aryloxy group, nitrile group (cyano group). ), An alkylsulfonyl group, an arylsulfonyl group, a nitro group, and the like, and an alkoxy group, an aryl group, and an acyl group are preferable.

Specific examples of the group represented by the general formula (III) constituting the acetal ester group as the acid-decomposable group are shown below, but are not limited thereto.

The thermal decomposition temperature of —CO ₂ R ³ in the general formula (1), —CO ₂ R ³ ′ in the general formula (2) or —CO ₂ R ³ ″ in the general formula (3) is 100 to 220 ° C. Preferably, it is 120 to 210 ° C., more preferably 140 to 200 ° C. The thermal decomposition temperature can be determined, for example, by differential thermobalance analysis.
When the thermal decomposition temperature is too low, the storage stability of the photosensitive resin composition of the present invention may be lowered. If the thermal decomposition temperature is too high, the stress increases and the wafer warpage may increase. In addition, decomposition products remain in the film, which may cause outgassing and decrease in reliability.
By setting the thermal decomposition temperature to 100 to 220 ° C., the stress of the cured relief pattern according to the present invention is further reduced, and the wafer warpage is further reduced. The reason why the stress is further lowered is not clear, but by setting the thermal decomposition temperature to 100 to 220 ° C., —CO ₂ R ³ in the repeating unit represented by the general formula (1) is converted to —CO ₂ during low temperature curing. It is presumed that the in-plane orientation of the polyimide film is enhanced and the stress is reduced by ring closure of the imide after ₂ H.

Specifically, as the structure of R ³ , R ³ ′ or R ³ ″ capable of achieving the thermal decomposition temperature as described above,
A structure in which at least one of Rx ₁ to Rx _{3 in} the general formula (A1) is a group represented by the following general formula (VI);
Examples include a structure in which Ra in the general formula (III) is a group represented by the general formula (IV) or the following general formula (VII).

In the general formula (VI),
R ₇ to R ₈ each independently represents a hydrogen atom, an alkyl group (straight or branched) or a cycloalkyl group (monocyclic or polycyclic), and at least one of R ₇ to R ₈ is a hydrogen atom. .

In the general formula (VII),
Rh represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group or a halogen atom.
Specific examples and preferred examples of the alkyl group and cycloalkyl group for R ₇ to R ₈ include the same as the specific examples and preferred examples described above for the alkyl group and cycloalkyl group for Rx ₁ to Rx _3. .
The alkyl group, cycloalkyl group, aryl group, aralkyl group or alkoxy group as Rh is the same as that described above as the alkyl group, cycloalkyl group, aryl group, aralkyl group or alkoxy group for R ³ in the general formula (1). Can be mentioned.
The aryloxy group as Rh is preferably an aryloxy group having 6 to 10 carbon atoms, and specific examples include phenoxy, toluyloxy, 1-naphthoxy and the like.
The alkoxycarbonyl group as Rh is preferably an alkoxycarbonyl group having 1 to 10 carbon atoms, and specific examples include methoxycarbonyl, ethoxycarbonyl, linear or branched propoxycarbonyl, cyclopentyloxycarbonyl, cyclohexyloxycarbonyl and the like.
Examples of the aryloxy moiety of the aryloxycarbonyl group as Rh include the same aryloxy groups as those described above.

In the present invention, a hydrogen atom and an organic group can be mixed in R ³ . It is preferably 100 mol% to 20 mol%, more preferably 100 mol% to 40 mol%, respectively, based on the total R ³ in the resin (a). By adjusting the amount of the hydrogen atom and organic group of R ^3, the dissolution rate with respect to the aqueous alkali solution is changed, and by this adjustment, a photosensitive resin composition having an appropriate dissolution rate can be obtained.
Of all —CO ₂ R ^{3 in} the resin (a), the proportion of the group that decomposes by the action of an acid to generate an alkali-soluble group, the so-called protection rate, is preferably 40 to 100%, and preferably 45 to 100 % Is more preferable.
Moreover, in this invention, terminal blocker can be made to react with the terminal of the polymer which has as a main component the structural unit represented by General formula (1). As the terminal capping agent, monoamine, acid anhydride, monocarboxylic acid, monoacid chloride compound, monoactive ester compound and the like can be used. By making terminal blocker react, it is preferable at the point which can control the repeating number of a structural unit, ie, molecular weight, in a preferable range. Furthermore, acid deactivation due to neutralization of the terminal amine and the generated acid can be suppressed by the terminal blocking agent. In addition, by reacting a terminal blocking agent at the terminal, various organic groups such as a crosslinking reactive group having a carbon-carbon unsaturated bond can be introduced as a terminal group.

Monoamines used for end-capping agents are 5-amino-8-hydroxyquinoline, 4-amino-8-hydroxyquinoline, 1-hydroxy-8-aminonaphthalene, 1-hydroxy-7-aminonaphthalene, 1-hydroxy- 6-aminonaphthalene, 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 1-hydroxy-3-aminonaphthalene, 1-hydroxy-2-aminonaphthalene, 1-amino-7-hydroxynaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 2-hydroxy-4-aminonaphthalene, 2-hydroxy-3-aminonaphthalene, 1-amino-2 -Hydroxynaphthalene, 1-carboxy-8-amino Naphthalene, 1-carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 1-carboxy-4-aminonaphthalene, 1-carboxy-3-aminonaphthalene, 1-carboxy -2-aminonaphthalene, 1-amino-7-carboxynaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminonaphthalene, 2-carboxy-5-aminonaphthalene, 2-carboxy-4-aminonaphthalene 2-carboxy-3-aminonaphthalene, 1-amino-2-carboxynaphthalene, 2-aminonicotinic acid, 4-aminonicotinic acid, 5-aminonicotinic acid, 6-aminonicotinic acid, 4-aminosalicylic acid, 5- Aminosalicylic acid, 6-aminosalicylic acid, 3- Mino-O-toluic acid, amelide, 2-aminobenzoic acid, 3-aminobenzoic acid, 4-aminobenzoic acid, 2-aminobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 4-aminobenzenesulfonic acid, 3-aminobenzoic acid Amino-4,6-dihydroxypyrimidine, 2-aminophenol, 3-aminophenol, 4-aminophenol, 5-amino-8-mercaptoquinoline, 4-amino-8-mercaptoquinoline, 1-mercapto-8-aminonaphthalene 1-mercapto-7-aminonaphthalene, 1-mercapto-6-aminonaphthalene, 1-mercapto-5-aminonaphthalene, 1-mercapto-4-aminonaphthalene, 1-mercapto-3-aminonaphthalene, 1-mercapto- 2-aminonaphthalene, 1-amino-7-mercaptonaphtha Len, 2-mercapto-7-aminonaphthalene, 2-mercapto-6-aminonaphthalene, 2-mercapto-5-aminonaphthalene, 2-mercapto-4-aminonaphthalene, 2-mercapto-3-aminonaphthalene, 1-amino -2-Mercaptonaphthalene, 3-amino-4,6-dimercaptopyrimidine, 2-aminothiophenol, 3-aminothiophenol, 4-aminothiophenol, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline 2,4-diethynylaniline, 2,5-diethynylaniline, 2,6-diethynylaniline, 3,4-diethynylaniline, 3,5-diethynylaniline, 1-ethynyl-2-aminonaphthalene, 1-ethynyl-3-aminonaphthalene, 1-ethynyl-4-aminonaphthalene 1-ethynyl-5-aminonaphthalene, 1-ethynyl-6-aminonaphthalene, 1-ethynyl-7-aminonaphthalene, 1-ethynyl-8-aminonaphthalene, 2-ethynyl-1-aminonaphthalene, 2-ethynyl- 3-aminonaphthalene, 2-ethynyl-4-aminonaphthalene, 2-ethynyl-5-aminonaphthalene, 2-ethynyl-6-aminonaphthalene, 2-ethynyl-7-aminonaphthalene, 2-ethynyl-8-aminonaphthalene, 3,5-diethynyl-1-aminonaphthalene, 3,5-diethynyl-2-aminonaphthalene, 3,6-diethynyl-1-aminonaphthalene, 3,6-diethynyl-2-aminonaphthalene, 3,7-diethynyl- 1-aminonaphthalene, 3,7-diethynyl-2-aminonaphthalene, 4,8-diethy -1-aminonaphthalene, 4,8-diethynyl-2-amino-naphthalene, and the like, but is not limited thereto.

Of these, 5-amino-8-hydroxyquinoline, 1-hydroxy-7-aminonaphthalene, 1-hydroxy-6-aminonaphthalene, 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 2 -Hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 1-carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5 Aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminonaphthalene, 2-carboxy-5-aminonaphthalene, 2-aminobenzoic acid, 3-aminobenzoic acid, 4-aminobenzoic acid, 4- Amino salicylic acid, 5-amino salicylic acid, 6-amino salicy Acid, 2-aminobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 4-aminobenzenesulfonic acid, 3-amino-4,6-dihydroxypyrimidine, 2-aminophenol, 3-aminophenol, 4-aminophenol, 2 -Aminothiophenol, 3-aminothiophenol, 4-aminothiophenol, 3-ethynylaniline, 4-ethynylaniline, 3,4-diethynylaniline, 3,5-diethynylaniline and the like are preferable.

Acid anhydrides, monocarboxylic acids, monoacid chloride compounds and active ester compounds used as end-capping agents are phthalic anhydride, maleic anhydride, nadic anhydride, cyclohexanedicarboxylic anhydride, 3-hydroxyphthalic anhydride Acid anhydrides such as 2-carboxyphenol, 3-carboxyphenol, 4-carboxyphenol, 2-carboxythiophenol, 3-carboxythiophenol, 4-carboxythiophenol, 1-hydroxy-8-carboxynaphthalene, 1- Hydroxy-7-carboxynaphthalene, 1-hydroxy-6-carboxynaphthalene, 1-hydroxy-5-carboxynaphthalene, 1-hydroxy-4-carboxynaphthalene, 1-hydroxy-3-carboxynaphthalene, 1-hydroxy-2-carbo Sinaphthalene, 1-mercapto-8-carboxynaphthalene, 1-mercapto-7-carboxynaphthalene, 1-mercapto-6-carboxynaphthalene, 1-mercapto-5-carboxynaphthalene, 1-mercapto-4-carboxynaphthalene, 1- Mercapto-3-carboxynaphthalene, 1-mercapto-2-carboxynaphthalene, 2-carboxybenzenesulfonic acid, 3-carboxybenzenesulfonic acid, 4-carboxybenzenesulfonic acid, 2-ethynylbenzoic acid, 3-ethynylbenzoic acid, 4 -Ethynylbenzoic acid, 2,4-diethynylbenzoic acid, 2,5-diethynylbenzoic acid, 2,6-diethynylbenzoic acid, 3,4-diethynylbenzoic acid, 3,5-diethynylbenzoic acid, 2-ethynyl-1 -Naphthoic acid, 3-ethynyl-1- Futheic acid, 4-ethynyl-1-naphthoic acid, 5-ethynyl-1-naphthoic acid, 6-ethynyl-1-naphthoic acid, 7-ethynyl-1-naphthoic acid, 8-ethynyl-1-naphthoic acid, 2- Ethynyl-2-naphthoic acid, 3-ethynyl-2-naphthoic acid, 4-ethynyl-2-naphthoic acid, 5-ethynyl-2-naphthoic acid, 6-ethynyl-2-naphthoic acid, 7-ethynyl-2-naphthoic acid Acids, monocarboxylic acids such as 8-ethynyl-2-naphthoic acid, and monoacid chloride compounds in which these carboxyl groups are acid chloride, and terephthalic acid, phthalic acid, maleic acid, cyclohexanedicarboxylic acid, 3-hydroxyphthalic acid, 5-norbornene-2,3-dicarboxylic acid, 1,2-dicarboxynaphthalene, 1,3-dicarboxynaphthalene, 1,4-dicarbo Xinaphthalene, 1,5-dicarboxynaphthalene, 1,6-dicarboxynaphthalene, 1,7-dicarboxynaphthalene, 1,8-dicarboxynaphthalene, 2,3-dicarboxynaphthalene, 2,6-dicarboxynaphthalene , Monoacid chloride compounds in which only the monocarboxylic group of dicarboxylic acids such as 2,7-dicarboxynaphthalene is acid chloride, monoacid chloride compounds and N-hydroxybenzotriazole or N-hydroxy-5-norbornene-2,3- Examples include active ester compounds obtained by reaction with dicarboximide.

Among these, phthalic anhydride, maleic anhydride, nadic anhydride, cyclohexanedicarboxylic anhydride, acid anhydrides such as 3-hydroxyphthalic anhydride, 3-carboxyphenol, 4-carboxyphenol, 3-carboxythiophenol 4-carboxythiophenol, 1-hydroxy-7-carboxynaphthalene, 1-hydroxy-6-carboxynaphthalene, 1-hydroxy-5-carboxynaphthalene, 1-mercapto-7-carboxynaphthalene, 1-mercapto-6-carboxy Naphthalene, 1-mercapto-5-carboxynaphthalene, 3-carboxybenzenesulfonic acid, 4-carboxybenzenesulfonic acid, 3-ethynylbenzoic acid, 4-ethynylbenzoic acid, 3,4-diethynylbenzoic acid, 3,5-diethynyl Benzo Monocarboxylic acids such as these, and monoacid chloride compounds in which these carboxyl groups are acid chloride, terephthalic acid, phthalic acid, maleic acid, cyclohexanedicarboxylic acid, 1,5-dicarboxynaphthalene, 1,6-dicarboxynaphthalene, Monoacid chloride compounds in which only monocarboxylic groups of dicarboxylic acids such as 1,7-dicarboxynaphthalene and 2,6-dicarboxynaphthalene are acid chlorided, monoacid chloride compounds and N-hydroxybenzotriazole and N-hydroxy-5 -Active ester compounds obtained by reaction with norbornene-2,3-dicarboximide are preferred.

The introduction ratio of the monoamine used for the terminal blocking agent is preferably in the range of 0.1 to 60 mol%, particularly preferably 5 to 50 mol%, based on the total amine component. The introduction ratio of the compound selected from the acid anhydride, monocarboxylic acid, monoacid chloride compound and monoactive ester compound used as the end-capping agent is in the range of 0.1 to 100 mol% with respect to the diamine component. The amount is particularly preferably 5 to 90 mol%. A plurality of different terminal groups may be introduced by reacting a plurality of terminal blocking agents.

The end-capping agent introduced into the polymer can be easily detected by the following method. For example, a polymer having an end-capping agent introduced therein is dissolved in an acidic solution and decomposed into an amine component and an acid anhydride component that are constituent units of the polymer. The end-capping agent can be easily detected by gas chromatography (GC) or NMR measurement. In addition, it can also be easily detected by directly measuring the polymer component into which the end capping agent has been introduced by pyrolysis gas chromatography (PGC), infrared spectrum and ¹³ CNMR spectrum.

The resin (a) used in the photosensitive resin composition of the present invention preferably has a structural unit represented by the general formula (1) as a main component. The main component as used herein means that 70 mol% or more of the structural unit represented by the general formula (1) is contained. More preferably, it is 80 mol% or more, and most preferably 90 mol% or more.
The resin used in the present invention is a copolymer of the structural unit represented by the general formula (1) and other structural units, or contains the structural unit represented by the general formula (1). It may be a mixture of a plurality of resins.
Furthermore, a resin containing the structural unit represented by the general formula (1) and a resin not containing the structural unit represented by the general formula (1) (for example, in the general formula (1), R ² is an aromatic ring only. A resin). In this case, the resin containing the structural unit represented by the general formula (1) is preferably contained in an amount of 50% by mass or more, and more preferably 75% by mass or more.
The type and amount of structural units used for copolymerization or mixing are preferably selected within a range that does not impair the heat resistance of the polymer obtained by the final heat treatment.

The resin (a) containing the repeating unit represented by the general formula (1) preferably has a mass average molecular weight of 200,000 or less from the viewpoint of alkali dissolution rate, film physical properties, etc. 200,000 is more preferable, 2,000 to 100,000 is more preferable, and 3,000 to 100,000 is particularly preferable. By adjusting to this molecular weight range, it is possible to obtain a photosensitive film having low stress, excellent mechanical properties, and excellent resolution with few development defects. In the present invention, the molecular weight can be measured by a gel permeation chromatography method and determined using a standard polystyrene calibration curve.
The dispersity (molecular weight distribution) is preferably 1.0 to 4.0, and more preferably 1.0 to 3.5.

As the method for producing the resin (a) in the present invention, any conventionally known method may be used (see, for example, the latest polyimide: basics and applications (edited by Japan Polyimide Research Group)).
For example, in the case of polyamic acid or polyamic acid ester, a method of reacting tetracarboxylic dianhydride and diamine compound at low temperature, a diester is obtained by tetracarboxylic dianhydride and alcohol, and then in the presence of an amine and a condensing agent. A method of reacting, obtaining a diester by tetracarboxylic dianhydride and an alcohol, then converting the remaining dicarboxylic acid to acid chloride and reacting with an amine, imidating a part of the side chain carboxyl group by heat treatment, There is a method of alkyl esterification using an esterification reagent or the like.
In particular, polyamic acid is obtained by reacting a diamine compound and tetracarboxylic dianhydride in an organic solvent at −20 to 50 ° C. for several minutes to several days, and then reacting with basic halides or under acidic conditions. A method for obtaining a polyamic acid ester of the general formula (1) by reaction with vinyl ethers or by reaction with dimethylformamide with a dialkyl acetal (Synthesis Method 1), and Makromol. Chem. , 194, 511 to 521 (1993), a method of synthesizing a dicarboxylic acid having an acid-decomposable group and then polycondensing with a diamine (Synthesis Method 2) is cost, operational simplicity, and performance reproduction. From the viewpoint of sex.
(Synthesis method 1)

(Synthesis method 2)

In the above scheme, R ¹ , R ² and R ³ have the same meaning as in general formula (1).
Examples of organic solvents that can be used in the synthesis reaction of the polyamic acid include amides such as N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidinone, and 1,3-dimethyl-2-imidazolidinone. Solvents, aromatic solvents such as benzene, anisole, diphenyl ether, nitrobenzene, benzonitrile, pyridine, halogen solvents such as chloroform, dichloromethane, 1,2-dichloroethane, 1,1,2,2-tetrachloroethane, Examples thereof include ether solvents such as tetrahydrofuran, dioxane and diglyme. Of these, amide solvents are preferred, and high molecular weight polyamic acid can be obtained.

The boiling point of the organic solvent used for the polymerization reaction is preferably 50 ° C. or higher, more preferably 100 ° C. or higher, and particularly preferably 150 ° C. or higher.
The concentration of the solute in the reaction solution is preferably 1 to 50% by mass, more preferably 5 to 30% by mass, and particularly preferably 10 to 20% by mass.

The polyamic acid ester obtained as described above is formed on a substrate such as a semiconductor substrate together with the component (b), and a relief pattern can be formed by a subsequent lithography process. By heat treatment of this pattern, polyamic acid ester or polyamic acid is dehydrated and closed, and a cured polyimide film is obtained.

In the present invention, the polyamic acid ester having the structural unit represented by the general formula (1) has a film formed from the precursor having an i-line transmittance of 1% or more per film thickness of 20 μm, and 5% or more. It is preferably 10% or more, more preferably 10 to 80%. When this value is less than 1%, it is difficult to obtain a photosensitive resin composition capable of forming a pattern with high resolution and good shape. The transmittance of i-line (light having a wavelength of 365 nm) can be measured with a spectrophotometer (for example, Hitachi U3410 type, manufactured by Hitachi, Ltd.).

Further, the residual stress of the cured polyimide film formed by imide ring closure from the polyamic acid ester having the structural unit represented by the general formula (1) is preferably 25 MPa or less, more preferably 20 MPa or less. preferable.
Here, when it exceeds 25 MPa, there is a drawback that the warpage amount of the silicon wafer and the residual strain inside the silicon chip increase. The residual stress of the polyimide film can be measured at a normal temperature (25 ° C.) with a thin film stress measuring device (for example, FLX-2320 manufactured by Tencor).

The polyamic acid ester having the structural unit represented by the above general formula (1) that satisfies these characteristics can suppress the aromatic ring π conjugation length by selecting an appropriate monomer, and has a rigid and straight main chain. It will have a structure that can be formed.
In the present invention, the resin (a) may be used alone or in combination. Further, a resin other than the resin (a) may be used in combination.

(B) Compound that generates acid upon irradiation with actinic ray or radiation The composition of the present invention is a compound that generates acid upon irradiation with actinic ray or radiation (also referred to as “photoacid generator” or “(b) component”). Containing. These may be used in combination of two or more. Moreover, a sensitizer etc. can also be used together for sensitivity adjustment.

(B1) Photoacid generator The photoacid generator is used as a photoinitiator for photocationic polymerization, a photoinitiator for radical photopolymerization, a photodecolorant for dyes, a photochromic agent, or a microresist. Known compounds that generate an acid upon irradiation with active light or radiation and mixtures thereof can be appropriately selected and used.

Examples include diazonium salts, phosphonium salts, sulfonium salts, iodonium salts, imide sulfonates, oxime sulfonates, diazodisulfones, disulfones, and o-nitrobenzyl sulfonates.

Further, a group that generates an acid upon irradiation with actinic rays or radiation, or a compound in which a compound is introduced into the main chain or side chain of the polymer, such as US Pat. No. 3,849,137, German Patent No. 3914407, JP 63-26653, JP 55-164824, JP 62-69263, JP 63-146038, JP 63-163452, JP 62-153853, JP The compounds described in 63-146029 and the like can be used.

Further, compounds capable of generating an acid by light described in US Pat. No. 3,779,778, European Patent 126,712 and the like can also be used.

Among the compounds that generate an acid upon irradiation with actinic rays or radiation, compounds represented by the following general formulas (ZI), (ZII), and (ZIII) can be exemplified.

In the general formula (ZI),
R ₂₀₁ , R ₂₀₂ and R ₂₀₃ each independently represents an organic group.
In the general formulas (ZII) and (ZIII),
R ₂₀₄ to R ₂₀₇ each independently represents an aryl group, an alkyl group, or a cycloalkyl group.
X ⁻ represents a non-nucleophilic anion, preferably sulfonate anion, carboxylate anion, bis (alkylsulfonyl) amide anion, tris (alkylsulfonyl) methide anion, BF ₄ ⁻ , PF ₆ ⁻ , SbF ₆ ^— An organic anion having a carbon atom is preferable.

Preferred organic anions include organic anions represented by the following general formula.

In the above general formula,
Rc ₁ represents an organic group.
Examples of the organic group in Rc ₁ include those having 1 to 30 carbon atoms, and preferably an alkyl group, a cycloalkyl group, an aryl group, or a plurality of these which may be substituted is a single bond, —O—, — And groups linked by a linking group such as CO ₂ —, —S—, —SO ₃ —, —SO ₂ N (Rd ₁ ) —.
Rd ₁ represents a hydrogen atom or an alkyl group.
Rc ₃ , Rc ₄ and Rc ₅ each independently represents an organic group.
Examples of the organic group for Rc ₃ , Rc ₄ and Rc ₅ include the same organic groups as those for Rc ₁ , preferably a perfluoroalkyl group having 1 to 4 carbon atoms.
Rc ₃ and Rc ₄ may be bonded to form a ring.
Examples of the group formed by combining Rc ₃ and Rc ₄ include an alkylene group, a cycloalkylene group, and an arylene group. A perfluoroalkylene group having 2 to 4 carbon atoms is preferred.
The organic group of Rc ₁ and Rc ₃ to Rc ₅ is preferably an alkyl group substituted at the 1-position with a fluorine atom or a fluoroalkyl group, or a phenyl group substituted with a fluorine atom or a fluoroalkyl group. By having a fluorine atom or a fluoroalkyl group, the acidity of the acid generated by light irradiation is increased and the sensitivity is improved. Further, Rc ₃ and Rc ₄ are combined to form a ring, so that the acidity of the acid generated by light irradiation is increased, and the sensitivity is improved, which is preferable.

In general formula (ZI),
The organic group as R ₂₀₁ , R ₂₀₂ and R ₂₀₃ generally has 1 to 30 carbon atoms, preferably 1 to 20 carbon atoms. _Examples of the organic group for R ₂₀₁ to R ₂₀₃ include an aryl group, an alkyl group, and a cycloalkyl group.
Two of R ₂₀₁ to R ₂₀₃ may be bonded to form a ring structure, and the ring may contain an oxygen atom, a sulfur atom, an ester bond, an amide bond, or a carbonyl group. Examples of the group formed by combining two of R ₂₀₁ to R ₂₀₃ include an alkylene group (eg, butylene group, pentylene group).
In the general formulas (ZII) and (ZIII), the aryl group of R ₂₀₄ to R ₂₀₇ is preferably a phenyl group or a naphthyl group, and more preferably a phenyl group. The aryl group of R ₂₀₄ to R ₂₀₇ may be an aryl group having a heterocyclic structure having an oxygen atom, a nitrogen atom, a sulfur atom, or the like. Examples of the skeleton of the aryl group having a heterocyclic structure include pyrrole, furan, thiophene, indole, benzofuran, benzothiophene, and the like.
The alkyl group and cycloalkyl group in R ₂₀₄ to R ₂₀₇ are preferably a linear or branched alkyl group having 1 to 10 carbon atoms (for example, methyl group, ethyl group, propyl group, butyl group, pentyl group), carbon Examples thereof include cycloalkyl groups having a number of 3 to 10 (cyclopentyl group, cyclohexyl group, norbornyl group).
The aryl group, alkyl group, and cycloalkyl group of R ₂₀₄ to R ₂₀₇ may have a substituent. Examples of the substituent that the aryl group, alkyl group, and cycloalkyl group represented by R ₂₀₄ to R ₂₀₇ may have include an alkyl group (eg, having 1 to 15 carbon atoms) and a cycloalkyl group (eg, having 3 to 15 carbon atoms). ), Aryl groups (for example, having 6 to 15 carbon atoms), alkoxy groups (for example, having 1 to 15 carbon atoms), halogen atoms, hydroxyl groups, phenylthio groups, and the like.

<Triarylsulfonium salt>
Triarylsulfonium salts are particularly preferable in terms of thermal stability and sensitivity, and it is preferable to use a sensitizer in combination.
Two or more kinds of such compounds can be used in combination as required.

In the triarylsulfonium salt, it is preferable that at least one aryl group has an electron withdrawing group as a substituent, and the total Hammett value of the substituents bonded to the aryl skeleton is preferably larger than 0.18. .

Here, the electron withdrawing group means a substituent having a Hammett value (Hammet substituent constant σ) larger than 0. In the present invention, from the viewpoint of increasing sensitivity, the sum of Hammett values of substituents bonded to the aryl skeleton in the specific photoacid generator is preferably 0.18 or more, more preferably greater than 0.46. Preferably, it is more preferably larger than 0.60.
The Hammett value represents the degree of electron withdrawing property of a cation having a triarylsulfonium salt structure, and there is no particular upper limit from the viewpoint of increasing sensitivity, but from the viewpoint of reactivity and stability. Is preferably more than 0.46 and less than 4.0, more preferably more than 0.50 and less than 3.5, and particularly preferably more than 0.60 and less than 3.0.

The Hammett value in the present invention uses the numerical values described in Naoki Inamoto, Chemistry Seminar 10 Hammett's Law-Structure and Reactivity (published by Maruzen Co., Ltd. in 1983).
Examples of the electron withdrawing group introduced into the aryl skeleton include a trifluoromethyl group, a halogen atom, an ester group, a sulfoxide group, a cyano group, an amide group, a carboxyl group, and a carbonyl group. The Hammett values of these substituents are shown below. A trifluoromethyl group (—CF ₃ , m: 0.43, p: 0.54), a halogen atom [for example, —F (m: 0.34, p: 0.06), —Cl (m: 0. 37, p: 0.23), -Br (m: 0.39, p: 0.23), -I (m: 0.35, p: 0.18)], an ester group (for example, -COCH ₃ , O: 0.37, p: 0.45), sulfoxide group (for example, —SOCH ₃ , m: 0.52, p: 0.45), cyano group (—CN, m: 0.56, p: 0.66), an amide group (for example, —NHCOCH ₃ , m: 0.21, p: 0.00), a carboxy group (—COOH, m: 0.37, p: 0.45), a carbonyl group (— CHO, m: 0.36, p: (043)) and the like. The parenthesis represents the introduction position of the substituent in the aryl skeleton and the Hammett value, and (m: 0.50) is the Hammett value of 0.50 when the substituent is introduced at the meta position. Indicates that there is.

Among these substituents, nonionic substituents such as a halogen atom and a halogenated alkyl group are preferable from the viewpoint of hydrophobicity. Among them, —Cl is preferable from the viewpoint of reactivity, and imparts hydrophobicity. From the viewpoint, —F, —CF ₃ , —Cl, and —Br are preferable.

These substituents may be introduced into any one of the three aryl skeletons of the triarylsulfonium salt structure, or may be introduced into two or more aryl skeletons. Moreover, the substituent introduced into each of the three aryl skeletons may be one or plural. In the present invention, the sum of Hammett values of substituents introduced into these aryl skeletons is preferably more than 0.18, more preferably more than 0.46. The number of substituents to be introduced is arbitrary. For example, only one substituent having a particularly large Hammett value (for example, a Hammett value exceeding 0.46 alone) may be introduced into one position of an aryl skeleton having a triarylsulfonium salt structure. Moreover, for example, a plurality of substituents introduced and the sum of the Hammett values exceeding 0.46 may be introduced.

As described above, since the Hammett value of the substituent varies depending on the position where it is introduced, the sum of Hammett values in the specific photoacid generator according to the present invention is determined by the type of substituent, the position of introduction, and the number of introductions. become.
The Hammett's rule is usually expressed in the m-position and p-position, but in the present invention, the substituent effect at the o-position is calculated as the same value as the p-position as an index of electron withdrawing property. Preferred substitution positions are preferably m-position and p-position, and most preferably p-position from the viewpoint of synthesis.
Preferred in the present invention is a sulfonium salt that is tri- or more substituted with a halogen atom, and most preferred is a sulfonium salt that is tri-substituted with a chloro group, specifically, each of the three aryl skeletons. And preferably have a triarylsulfonium salt structure in which —Cl is introduced, and more preferably —Cl is substituted at the p-position.

Examples of the sulfonate anion possessed by the triarylsulfonium salt contained in the composition of the present invention include an aryl sulfonate anion, an alkane sulfonate anion, and the like, which are substituted with a fluorine atom or an organic group having a fluorine atom. An anion is preferred.

Examples of the compound having a triarylsulfonium salt structure are J.P. Am. Chem. Soc. 112 (16), 1990; 6004-6015, J.A. Org. Chem. 1988; It can be easily synthesized by the methods described in 5571-5573, WO02 / 081439A1 pamphlet, or European Patent (EP) No. 1113005.

Specific examples are given below, but are not limited thereto.

Further, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium trifluoroacetate, 4-methoxyphenyldiphenylsulfonium trifluoromethanesulfonate, 4-methoxyphenyldiphenylsulfonium trifluoroacetate, 4-phenylthiophenyldiphenylsulfonium trifluoromethanesulfonate or 4-phenylthiophenyl diphenylsulfonium trifluoroacetate and the like.

Examples of the diaryliodonium salts include diphenyliodonium trifluoroacetate, diphenyliodonium trifluoromethanesulfonate, 4-methoxyphenylphenyliodonium trifluoromethanesulfonate, 4-methoxyphenylphenyliodonium trifluoroacetate, phenyl, 4- (2′-hydroxy- 1'-tetradecaoxy) phenyliodonium trifluoromethanesulfonate, 4- (2'-hydroxy-1'-tetradecoxy) phenyliodonium hexafluoroantimonate, phenyl, 4- (2'-hydroxy-1'-tetra Decaoxy) phenyliodonium-p-toluenesulfonate, etc .; diazomethane derivatives such as bis (cyclohexylsulfonyl) diazomethane, bis (t-butyl) Sulfonyl) diazomethane, bis (p- toluenesulfonyl) diazomethane;
Examples of imide sulfonate derivatives include trifluoromethylsulfonyloxybicyclo [2.2.1] hept-5-enedicarboximide, succinimide trifluoromethyl sulfonate, phthalimide p-toluene sulfonate, phthalimide trifluoromethyl sulfonate, and N-hydroxynaphthalimide methane. Examples thereof include sulfonate, N-hydroxy-5-norbornene-2,3-dicarboximidopropane sulfonate, and the like.

Among compounds that generate an acid upon irradiation with actinic rays or radiation, oxime compounds, more preferably oxime sulfonate compounds, are the most preferable examples from the viewpoint of sensitivity, resolution, dielectric constant, dimensional stability, and the like. Can be mentioned.

Preferred examples of the oxime sulfonate compound, that is, the compound having an oxime sulfonate residue include compounds containing an oxime sulfonate residue represented by the formula (b1).

(In formula (b1), R ⁵ represents an alkyl group or an aryl group.)
Any group may be substituted, and the alkyl group in R ⁵ may be linear, branched or cyclic. Acceptable substituents are described below.
The alkyl group for R ⁵ is preferably a linear or branched alkyl group having 1 to 10 carbon atoms. The alkyl group represented by R ⁵ is an aryl group having 6 to 11 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a cycloalkyl group (7,7-dimethyl-2-oxonorbornyl group or the like). It may be substituted with a cyclic group, preferably a bicycloalkyl group or the like.
The aryl group for R ⁵ is preferably an aryl group having 6 to 11 carbon atoms, more preferably a phenyl group or a naphthyl group. The aryl group for R ⁵ may be substituted with a lower alkyl group, an alkoxy group or a halogen atom.

The compound containing the oxime sulfonate residue represented by the formula (b1) is an oxime sulfonate compound represented by the formula (OS-3), the formula (OS-4) or the formula (OS-5). Is particularly preferred.

(In the formulas (OS-3) to (OS-5), R ¹ represents an alkyl group, an aryl group or a heteroaryl group, and each R ² independently represents a hydrogen atom, an alkyl group, an aryl group or a halogen atom. R ⁶ represents each independently a halogen atom, an alkyl group, an alkyloxy group, a sulfonic acid group, an aminosulfonyl group or an alkoxysulfonyl group, X represents O or S, n represents 1 or 2, m Represents an integer of 0 to 6.)

In the above formulas (OS-3) to (OS-5), the alkyl group, aryl group or heteroaryl group in R ¹ may have a substituent.
In the formulas (OS-3) to (OS-5), the alkyl group for R ¹ is preferably an alkyl group having 1 to 30 carbon atoms which may have a substituent.
Examples of the substituent that the alkyl group in R ¹ may have include a halogen atom, an alkyloxy group, an aryloxy group, an alkylthio group, an arylthio group, an alkyloxycarbonyl group, an aryloxycarbonyl group, and an aminocarbonyl group. .

Examples of the alkyl group in R ¹ include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, s-butyl group, t-butyl group, n-pentyl group, n-hexyl group, n -Octyl group, n-decyl group, n-dodecyl group, trifluoromethyl group, perfluoropropyl group, perfluorohexyl group, benzyl group.

In the formulas (OS-3) to (OS-5), the aryl group for R ¹ is preferably an aryl group having 6 to 30 carbon atoms which may have a substituent.
Examples of the substituent that the aryl group in R ¹ may have include a halogen atom, an alkyl group, an alkyloxy group, an aryloxy group, an alkylthio group, an arylthio group, an alkyloxycarbonyl group, an aryloxycarbonyl group, and an aminocarbonyl group. , Sulfonic acid group, aminosulfonyl group, alkoxysulfonyl group.

Examples of the aryl group in R ¹ include a phenyl group, a p-methylphenyl group, a p-chlorophenyl group, a pentachlorophenyl group, a pentafluorophenyl group, an o-methoxyphenyl group, and a p-phenoxyphenyl group.

In the formulas (OS-3) to (OS-5), the heteroaryl group for R ¹ is preferably a heteroaryl group having 4 to 30 carbon atoms which may have a substituent.
Examples of the substituent that the heteroaryl group in R ¹ may have include a halogen atom, an alkyl group, an alkyloxy group, an aryloxy group, an alkylthio group, an arylthio group, an alkyloxycarbonyl group, an aryloxycarbonyl group, and an aminocarbonyl. Group, sulfonic acid group, aminosulfonyl group and alkoxysulfonyl group.

In the above formulas (OS-3) to (OS-5), at least one of the heteroaryl groups in R ¹ may be a heteroaromatic ring. For example, a heteroaromatic ring and a benzene ring are condensed. May be.
The heteroaryl group for R ¹ is selected from the group consisting of optionally substituted thiophene ring, pyrrole ring, thiazole ring, imidazole ring, furan ring, benzothiophene ring, benzothiazole ring and benzimidazole ring. And a group in which one hydrogen atom is removed from the ring.

In the formulas (OS-3) to (OS-5), R ² is preferably a hydrogen atom, an alkyl group or an aryl group, and more preferably a hydrogen atom or an alkyl group.
In the formulas (OS-3) to (OS-5), it is preferred that one or two of R ² present in the compound is an alkyl group, an aryl group or a halogen atom, and one is an alkyl group. More preferably an aryl group or a halogen atom, and particularly preferably one is an alkyl group and the rest is a hydrogen atom.
In the formulas (OS-3) to (OS-5), the alkyl group or aryl group in R ² may have a substituent. Examples of the substituent that the alkyl group or aryl group in R ² may have include the same groups as the substituent that the alkyl group or aryl group in R ¹ may have.

The alkyl group for R ² is preferably an alkyl group having 1 to 12 carbon atoms which may have a substituent, and is an alkyl group having 1 to 6 carbon atoms which may have a substituent. It is more preferable.
Examples of the alkyl group for R ² include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, n-hexyl group, allyl group, and chloromethyl group. , A bromomethyl group, a methoxymethyl group, and a benzyl group are preferable, and a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group, an s-butyl group, and an n-hexyl group are preferable. A methyl group, an ethyl group, an n-propyl group, an n-butyl group, and an n-hexyl group are more preferable, and a methyl group is preferable.

The aryl group for R ² is preferably an aryl group having 6 to 30 carbon atoms which may have a substituent.
Specifically, the aryl group in R ² is preferably a phenyl group, a p-methylphenyl group, an o-chlorophenyl group, a p-chlorophenyl group, an o-methoxyphenyl group, or a p-phenoxyphenyl group.
Examples of the halogen atom for R ² include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
Among these, a chlorine atom and a bromine atom are preferable.

In the formulas (OS-3) to (OS-5), X represents O or S, and is preferably O.
In formulas (OS-3) to (OS-5), the ring containing X as a ring member is a 5-membered ring or a 6-membered ring.
In the formulas (OS-3) to (OS-5), n represents 1 or 2, and when X is O, n is preferably 1, and when X is S, n is 2 is preferable.

In the formulas (OS-3) to (OS-5), the alkyl group and alkyloxy group in R ⁶ may have a substituent.
In the formulas (OS-3) to (OS-5), the alkyl group for R ⁶ is preferably an alkyl group having 1 to 30 carbon atoms which may have a substituent.
Examples of the substituent that the alkyl group in R ⁶ may have include a halogen atom, an alkyloxy group, an aryloxy group, an alkylthio group, an arylthio group, an alkyloxycarbonyl group, an aryloxycarbonyl group, and an aminocarbonyl group. .

Examples of the alkyl group for R ⁶ include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, s-butyl group, t-butyl group, n-pentyl group, n-hexyl group, n -Octyl, n-decyl, n-dodecyl, trifluoromethyl, perfluoropropyl, perfluorohexyl and benzyl are preferred.

In the above formulas (OS-3) to (OS-5), the alkyloxy group for R ⁶ is preferably an alkyloxy group having 1 to 30 carbon atoms which may have a substituent.
Examples of the substituent that the alkyloxy group in R ⁶ may have include a halogen atom, an alkyloxy group, an aryloxy group, an alkylthio group, an arylthio group, an alkyloxycarbonyl group, an aryloxycarbonyl group, and an aminocarbonyl group. It is done.

As the alkyloxy group in R ⁶ , a methyloxy group, an ethyloxy group, a butyloxy group, a hexyloxy group, a phenoxyethyloxy group, a trichloromethyloxy group, or an ethoxyethyloxy group is preferable.
In the above formulas (OS-3) to (OS-5), examples of the aminosulfonyl group for R ⁶ include a methylaminosulfonyl group, a dimethylaminosulfonyl group, a phenylaminosulfonyl group, a methylphenylaminosulfonyl group, and an aminosulfonyl group. It is done.
In the formulas (OS-3) to (OS-5), examples of the alkoxysulfonyl group for R ⁶ include a methoxysulfonyl group, an ethoxysulfonyl group, a propyloxysulfonyl group, and a butyloxysulfonyl group.

In the formulas (OS-3) to (OS-5), m represents an integer of 0 to 6, preferably an integer of 0 to 2, more preferably 0 or 1, and 0. It is particularly preferred.

The compound containing an oxime sulfonate residue represented by the formula (b1) is particularly preferably an oxime sulfonate compound represented by any one of the following formulas (OS-6) to (OS-11). .

(In the formulas (OS-6) to (OS-11), R ¹ represents an alkyl group, an aryl group, or a heteroaryl group, R ⁷ represents a hydrogen atom or a bromine atom, R ⁸ represents a hydrogen atom, Represents an alkyl group of 1 to 8, a halogen atom, a chloromethyl group, a bromomethyl group, a bromoethyl group, a methoxymethyl group, a phenyl group or a chlorophenyl group; R ⁹ represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group; ¹⁰ represents a hydrogen atom or a methyl group.)

R ¹ in the formulas (OS-6) to (OS-11) has the same meaning as R ¹ in the formulas (OS-3) to (OS-5), and preferred embodiments thereof are also the same.
R ⁷ in formula (OS-6) represents a hydrogen atom or a bromine atom, and is preferably a hydrogen atom.
R ⁸ in the formulas (OS-6) to (OS-11) is a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, a halogen atom, a chloromethyl group, a bromomethyl group, a bromoethyl group, a methoxymethyl group, a phenyl group or a chlorophenyl Represents an alkyl group having 1 to 8 carbon atoms, a halogen atom or a phenyl group, more preferably an alkyl group having 1 to 8 carbon atoms, and an alkyl group having 1 to 6 carbon atoms. Is more preferable, and a methyl group is particularly preferable. R ⁹ in formula (OS-8) and formula (OS-9) represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group, and is preferably a hydrogen atom.
R ¹⁰ in the formulas (OS-8) to (OS-11) represents a hydrogen atom or a methyl group, and is preferably a hydrogen atom.
In the oxime sulfonate compound, the oxime steric structure (E, Z) may be either one or a mixture.

Specific examples of the oxime sulfonate compounds represented by the above formulas (OS-3) to (OS-5) include the following exemplified compounds, but the present invention is not limited thereto.

The compound containing an oxime sulfonate residue represented by the formula (b1) is also preferably a compound represented by the formula (OS-1).

In the general formula (OS-1), R ¹ represents a hydrogen atom, an alkyl group, an alkenyl group, an alkoxy group, an alkoxycarbonyl group, an acyl group, a carbamoyl group, a sulfamoyl group, a sulfo group, a cyano group, an aryl group, or a heteroaryl. Represents a group. R ² represents an alkyl group or an aryl group.

X is -O -, - S -, - NH -, - NR 5 -, - CH 2 -, - CR 6 H- or ^-CR 6 ^{R 7} - ^represents, ^R 5 ~ R ⁷ is an alkyl group or an aryl group Represents.
R ²¹ to R ²⁴ are each independently a hydrogen atom, halogen atom, alkyl group, alkenyl group, alkoxy group, amino group, alkoxycarbonyl group, alkylcarbonyl group, arylcarbonyl group, amide group, sulfo group, cyano group or Represents an aryl group. Two of R ²¹ to R ²⁴ may be bonded to each other to form a ring.
As R ²¹ to R ²⁴ , a hydrogen atom, a halogen atom and an alkyl group are preferable, and an embodiment in which at least two of R ²¹ to R ²⁴ are bonded to each other to form an aryl group is also preferable. Among these, an embodiment in which R ²¹ to R ²⁴ are all hydrogen atoms is preferable from the viewpoint of sensitivity.
Any of the aforementioned functional groups may further have a substituent.

The compound represented by the formula (OS-1) is more preferably a compound represented by the following formula (OS-2).

In the formula (OS-2), R ¹ , R ² and R ²¹ to R ²⁴ have the same meanings as in the formula (OS-1), and preferred examples thereof are also the same.
Among these, an embodiment in which R ¹ in the formula (OS-1) and the formula (OS-2) is a cyano group or an aryl group is more preferable, represented by the formula (OS-2), in which R ¹ is a cyano group, phenyl The embodiment which is a group or a naphthyl group is most preferred.

In the oxime sulfonate compound, the steric structure (E, Z, etc.) of the oxime or benzothiazole ring may be either one or a mixture.

Specific examples (exemplary compounds b-1 to b-34) of the compound represented by the formula (OS-1) that can be suitably used in the present invention are shown below, but the present invention is not limited thereto. Me represents a methyl group, Et represents an ethyl group, Bn represents a benzyl group, and Ph represents a phenyl group.

Among the above compounds, b-9, b-16, b-31, and b-33 are preferable from the viewpoint of achieving both sensitivity and stability.

The above compound containing an oxime sulfonate residue represented by the formula (b1) may be an oxime sulfonate compound represented by the following formula (b2).

(In the formula (b2), R ⁵ represents an alkyl group or an aryl group, X represents an alkyl group, an alkoxy group, or a halogen atom, m represents an integer of 0 to 3, and m is 2 or 3. In some cases, multiple Xs may be the same or different.)

The alkyl group as X is preferably a linear or branched alkyl group having 1 to 4 carbon atoms.
The alkoxy group as X is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms.
The halogen atom as X is preferably a chlorine atom or a fluorine atom.
m is preferably 0 or 1.
In the formula (b2), m is 1, X is a methyl group, the substitution position of X is the ortho position, R ⁵ is a linear alkyl group having 1 to 10 carbon atoms, 7,7-dimethyl- A compound that is a 2-oxonorbornylmethyl group or a p-toluyl group is particularly preferred.

The compound containing an oxime sulfonate residue represented by the formula (b1) may be an oxime sulfonate compound represented by the formula (b3).

(In the formula (b3), ^{R 5} has the same meaning as ^{R 5} in the formula (b1), X 'is a halogen atom, a hydroxyl group, an alkyl group having 1 to 4 carbon atoms, alkoxy group having 1 to 4 carbon atoms, cyano Represents a group or a nitro group, and L represents an integer of 0 to 5.)

R ⁵ in the formula (b3) is methyl, ethyl, n-propyl, n-butyl, n-octyl, trifluoromethyl, pentafluoroethyl, perfluoro-n-propyl, perfluoro A fluoro-n-butyl group, p-tolyl group, 4-chlorophenyl group or pentafluorophenyl group is preferred, and an n-octyl group is particularly preferred.
X ′ is preferably an alkoxy group having 1 to 5 carbon atoms, and more preferably a methoxy group.
L is preferably from 0 to 2, particularly preferably from 0 to 1.

Specific examples of the compound represented by the formula (b3) include α- (methylsulfonyloxyimino) benzyl cyanide, α- (ethylsulfonyloxyimino) benzyl cyanide, α- (n-propylsulfonyloxyimino) benzyl. Cyanide, α- (n-butylsulfonyloxyimino) benzyl cyanide, α- (4-toluenesulfonyloxyimino) benzyl cyanide, α-[(methylsulfonyloxyimino) -4-methoxyphenyl] acetonitrile, α- [(Ethylsulfonyloxyimino) -4-methoxyphenyl] acetonitrile, α-[(n-propylsulfonyloxyimino) -4-methoxyphenyl] acetonitrile, α-[(n-butylsulfonyloxyimino) -4-methoxyphenyl ] Acetonitrile, α-[(4-True Can be exemplified sulfonyl) -4-methoxyphenyl] acetonitrile.

Specific examples of preferable oxime sulfonate compounds include the following compounds (i) to (viii), and the like can be used singly or in combination of two or more. Compounds (i) to (viii) can be obtained as commercial products. It can also be used in combination with other types of (C) radiation-sensitive acid generators.

In the photosensitive resin composition of the present invention, the content of the photoacid generator is preferably 1 to 30% by mass, more preferably 3 to 20% by mass based on the total solid content of the photosensitive resin composition.

The acid generator can be used alone or in combination of two or more. When two or more types are used in combination, it is preferable to combine two types of compounds that generate two types of organic acids that differ in the total number of atoms excluding hydrogen atoms by two or more. *

(B2) Sensitizer A sensitizer may be added to the composition of the present invention in order to absorb actinic rays or radiation and promote the decomposition of the sulfonium salt. The sensitizer absorbs actinic rays or radiation and enters an electronically excited state. The sensitizer in an electronically excited state comes into contact with sulfonium, and effects such as electron transfer, energy transfer, and heat generation occur. As a result, the polymerization initiator undergoes a chemical change and decomposes to generate radicals, acids or bases.
Examples of preferred sensitizers include compounds belonging to the following compounds and having an absorption wavelength in the 350 nm to 450 nm region.
Polynuclear aromatics (eg, pyrene, perylene, triphenylene, anthracene), xanthenes (eg, fluorescein, eosin, erythrosine, rhodamine B, rose bengal), cyanines (eg, thiacarbocyanine, oxacarbocyanine), merocyanine (Eg, merocyanine, carbomerocyanine), thiazines (eg, thionine, methylene blue, toluidine blue), acridines (eg, acridine orange, chloroflavin, acriflavine), anthraquinones (eg, anthraquinone), squalium (eg, , Squalium), coumarins (eg, 7-diethylamino-4-methylcoumarin).

More preferred examples of the sensitizer include compounds represented by the following formulas (IX) to (XIV).

In formula (IX), A ¹ represents a sulfur atom or NR ⁵⁰ , R ⁵⁰ represents an alkyl group or an aryl group, and L ² forms a basic nucleus of the dye together with adjacent A ¹ and an adjacent carbon atom. R ⁵¹ and R ⁵² each independently represent a hydrogen atom or a monovalent nonmetallic atomic group, and R ⁵¹ and R ⁵² may be bonded to each other to form an acidic nucleus of the dye. Good. W represents an oxygen atom or a sulfur atom.

In the formula (X), Ar ¹ and Ar ² each independently represent an aryl group and are linked via a bond with —L ³ —. Here, L ³ represents —O— or —S—. W is synonymous with that shown in Formula (IX).

In the formula (XI), A ₂ represents a sulfur atom or NR ⁵⁹ , L ⁴ represents a nonmetallic atomic group that forms a basic nucleus of the dye in combination with adjacent A ₂ and a carbon atom, R ⁵³ , R ⁵⁴ , R ⁵⁵ , R ⁵⁶ , R ⁵⁷ and R ⁵⁸ each independently represent a monovalent nonmetallic atomic group, and R ⁵⁹ represents an alkyl group or an aryl group.

In formula (XII), A ³ and A ⁴ each independently represent —S—, —NR ⁶² — or —NR ⁶³ —, and R ⁶² and R ⁶³ each independently represent a substituted or unsubstituted alkyl group, substituted or Represents an unsubstituted aryl group, and L ⁵ and L ⁶ each independently represent a nonmetallic atomic group that forms a basic nucleus of a dye in cooperation with adjacent A ³ , A ^4, and adjacent carbon atoms, and R ⁶⁰ , R ⁶¹ each independently represents a hydrogen atom or a monovalent nonmetallic atomic group, or may be bonded to each other to form an aliphatic or aromatic ring.

In formula (XIII), R ⁶⁶ represents an aromatic ring or a hetero ring which may have a substituent, and A ⁵ represents an oxygen atom, a sulfur atom or ═NR ⁶⁷ . R ⁶⁴ , R ⁶⁵ and R ⁶⁷ each independently represent a hydrogen atom or a monovalent non-metallic atomic group, R ⁶⁷ and R ⁶⁴ , and R ⁶⁵ and R ⁶⁷ each represent an aliphatic or aromatic ring. Can be combined to form.

In formula (XIV), R ₆₈ and R ₆₉ each independently represent a hydrogen atom or a monovalent nonmetallic atomic group. R ₇₀ and R ₇₁ each independently represent a monovalent nonmetallic atomic group, and n represents an integer of 0 to 4. When n is 2 or more, R ₇₀ and R ₇₁ can be bonded to each other to form an aliphatic or aromatic ring.

As the sensitizer, an anthracene derivative is particularly preferable.

Specific preferred examples of the compounds represented by the formulas (IX) to (XIV) include (C-1) to (C-26) shown below, but are not limited thereto.

The sensitizer as described above may be a commercially available one or may be synthesized by a known synthesis method.

In the photosensitive resin composition of the present invention, the content of the sensitizer is preferably 1 to 30% by mass, more preferably 3 to 20% by mass based on the total solid content of the photosensitive resin composition.

(C) Basic compound The composition according to the present invention preferably contains a basic compound in order to reduce a change in performance over time from exposure to heating.
Preferred examples of the basic compound include compounds having a structure represented by the following formulas (A) to (E).

In general formulas (A) and (E),
R ²⁰⁰ , R ²⁰¹ and R ²⁰² may be the same or different and are a hydrogen atom, an alkyl group (preferably having a carbon number of 1 to 20), a cycloalkyl group (preferably having a carbon number of 3 to 20) or an aryl group (having a carbon number). 6-20), wherein R ²⁰¹ and R ²⁰² may combine with each other to form a ring.

R ²⁰³ , R ²⁰⁴ , R ²⁰⁵ and R ²⁰⁶ may be the same or different and each represents an alkyl group having 1 to 20 carbon atoms.
Regarding the alkyl group, the alkyl group having a substituent is preferably an aminoalkyl group having 1 to 20 carbon atoms, a hydroxyalkyl group having 1 to 20 carbon atoms, or a cyanoalkyl group having 1 to 20 carbon atoms.
The alkyl groups in the general formulas (A) and (E) are more preferably unsubstituted.

Preferred compounds include guanidine, aminopyrrolidine, pyrazole, pyrazoline, piperazine, aminomorpholine, aminoalkylmorpholine, piperidine and the like, and more preferred compounds include imidazole structure, diazabicyclo structure, onium hydroxide structure, onium carboxylate Examples thereof include a compound having a structure, a trialkylamine structure, an aniline structure or a pyridine structure, an alkylamine derivative having a hydroxyl group and / or an ether bond, and an aniline derivative having a hydroxyl group and / or an ether bond.

Examples of the compound having an imidazole structure include imidazole, 2,4,5-triphenylimidazole, benzimidazole, 2-phenylbenzimidazole and the like. Examples of the compound having a diazabicyclo structure include 1,4-diazabicyclo [2,2,2] octane, 1,5-diazabicyclo [4,3,0] non-5-ene, and 1,8-diazabicyclo [5,4,0. ] Undecar 7-ene and the like. Examples of the compound having an onium hydroxide structure include tetrabutylammonium hydroxide, triarylsulfonium hydroxide, phenacylsulfonium hydroxide, sulfonium hydroxide having a 2-oxoalkyl group, specifically, triphenylsulfonium hydroxide, tris ( t-butylphenyl) sulfonium hydroxide, bis (t-butylphenyl) iodonium hydroxide, phenacylthiophenium hydroxide, 2-oxopropylthiophenium hydroxide, and the like. The compound having an onium carboxylate structure is a compound having an onium hydroxide structure in which the anion moiety is converted to a carboxylate, and examples thereof include acetate, adamantane-1-carboxylate, and perfluoroalkylcarboxylate. Examples of the compound having a trialkylamine structure include tri (n-butyl) amine and tri (n-octyl) amine. Examples of aniline compounds include 2,6-diisopropylaniline, N, N-dimethylaniline, N, N-dibutylaniline, N, N-dihexylaniline and the like. Examples of the alkylamine derivative having a hydroxyl group and / or an ether bond include ethanolamine, diethanolamine, triethanolamine, N-phenyldiethanolamine, and tris (methoxyethoxyethyl) amine. Examples of aniline derivatives having a hydroxyl group and / or an ether bond include N, N-bis (hydroxyethyl) aniline.

Preferred examples of the basic compound further include an amine compound having a phenoxy group, an ammonium salt compound having a phenoxy group, an amine compound having a sulfonic acid ester group, and an ammonium salt compound having a sulfonic acid ester group.

As the amine compound, a primary, secondary or tertiary amine compound can be used, and an amine compound in which at least one alkyl group is bonded to a nitrogen atom is preferable. The amine compound is more preferably a tertiary amine compound. As long as at least one alkyl group (preferably having 1 to 20 carbon atoms) is bonded to a nitrogen atom, the amine compound has an cycloalkyl group (preferably having 3 to 20 carbon atoms) or an aryl group (preferably having 3 to 20 carbon atoms). Preferably 6 to 12 carbon atoms may be bonded to the nitrogen atom. The amine compound preferably has an oxygen atom in the alkyl chain and an oxyalkylene group is formed. The number of oxyalkylene groups is one or more in the molecule, preferably 3 to 9, and more preferably 4 to 6. Among the oxyalkylene groups, an oxyethylene group (—CH ₂ CH ₂ O—) or an oxypropylene group (—CH (CH ₃ ) CH ₂ O— or —CH ₂ CH ₂ CH ₂ O—) is preferable, and more preferably oxy Ethylene group.

As the ammonium salt compound, a primary, secondary, tertiary, or quaternary ammonium salt compound can be used, and an ammonium salt compound in which at least one alkyl group is bonded to a nitrogen atom is preferable. In addition to the alkyl group, the ammonium salt compound may be a cycloalkyl group (preferably having 3 to 20 carbon atoms) or an aryl group, provided that at least one alkyl group (preferably having 1 to 20 carbon atoms) is bonded to the nitrogen atom. (Preferably having 6 to 12 carbon atoms) may be bonded to a nitrogen atom. The ammonium salt compound preferably has an oxygen atom in the alkyl chain and an oxyalkylene group is formed. The number of oxyalkylene groups is one or more in the molecule, preferably 3 to 9, and more preferably 4 to 6. Among the oxyalkylene groups, an oxyethylene group (—CH ₂ CH ₂ O—) or an oxypropylene group (—CH (CH ₃ ) CH ₂ O— or —CH ₂ CH ₂ CH ₂ O—) is preferable, and more preferably oxy Ethylene group.

Examples of the anion of the ammonium salt compound include halogen atoms, sulfonates, borates, and phosphates. Among them, halogen atoms and sulfonates are preferable. The halogen atom is particularly preferably chloride, bromide or iodide, and the sulfonate is particularly preferably an organic sulfonate having 1 to 20 carbon atoms. Examples of the organic sulfonate include alkyl sulfonates having 1 to 20 carbon atoms and aryl sulfonates. The alkyl group of the alkyl sulfonate may have a substituent, and examples of the substituent include fluorine, chlorine, bromine, alkoxy groups, acyl groups, and aryl groups. Specific examples of the alkyl sulfonate include methane sulfonate, ethane sulfonate, butane sulfonate, hexane sulfonate, octane sulfonate, benzyl sulfonate, trifluoromethane sulfonate, pentafluoroethane sulfonate, and nonafluorobutane sulfonate. Examples of the aryl group of the aryl sulfonate include a benzene ring, a naphthalene ring and an anthracene ring. The benzene ring, naphthalene ring and anthracene ring may have a substituent, and the substituent is preferably a linear or branched alkyl group having 1 to 6 carbon atoms or a cycloalkyl group having 3 to 6 carbon atoms. Specific examples of the linear or branched alkyl group and cycloalkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, i-butyl, t-butyl, n-hexyl, cyclohexyl and the like. Examples of the other substituent include an alkoxy group having 1 to 6 carbon atoms, a halogen atom, cyano, nitro, an acyl group, and an acyloxy group.

An amine compound having a phenoxy group and an ammonium salt compound having a phenoxy group are those having a phenoxy group at the terminal opposite to the nitrogen atom of the alkyl group of the amine compound or ammonium salt compound. The phenoxy group may have a substituent. Examples of the substituent of the phenoxy group include an alkyl group, an alkoxy group, a halogen atom, a cyano group, a nitro group, a carboxyl group, a carboxylic acid ester group, a sulfonic acid ester group, an aryl group, an aralkyl group, an acyloxy group, and an aryloxy group. Etc. The substitution position of the substituent may be any of the 2-6 positions. The number of substituents may be any in the range of 1 to 5.

It is preferable to have at least one oxyalkylene group between the phenoxy group and the nitrogen atom. The number of oxyalkylene groups is one or more in the molecule, preferably 3 to 9, and more preferably 4 to 6. Among the oxyalkylene groups, an oxyethylene group (—CH ₂ CH ₂ O—) or an oxypropylene group (—CH (CH ₃ ) CH ₂ O— or —CH ₂ CH ₂ CH ₂ O—) is preferable, and more preferably oxy Ethylene group.

In the amine compound having a sulfonic acid ester group and the ammonium salt compound having a sulfonic acid ester group, the sulfonic acid ester group may be any of alkyl sulfonic acid ester, cycloalkyl group sulfonic acid ester, and aryl sulfonic acid ester. In the case of an alkyl sulfonate ester, the alkyl group has 1 to 20 carbon atoms, in the case of a cycloalkyl sulfonate ester, the cycloalkyl group has 3 to 20 carbon atoms, and in the case of an aryl sulfonate ester, the aryl group has 6 carbon atoms. ~ 12 are preferred. Alkyl sulfonic acid ester, cycloalkyl sulfonic acid ester, and aryl sulfonic acid ester may have a substituent. Examples of the substituent include a halogen atom, a cyano group, a nitro group, a carboxyl group, a carboxylic acid ester group, and a sulfonic acid. An ester group is preferred.

It is preferable to have at least one oxyalkylene group between the sulfonate group and the nitrogen atom. The number of oxyalkylene groups is one or more in the molecule, preferably 3 to 9, and more preferably 4 to 6. Among the oxyalkylene groups, an oxyethylene group (—CH ₂ CH ₂ O—) or an oxypropylene group (—CH (CH ₃ ) CH ₂ O— or —CH ₂ CH ₂ CH ₂ O—) is preferable, and more preferably oxy Ethylene group.
The following compounds are also preferable as the basic compound.

These basic compounds may be used individually by 1 type, and may be used in combination of 2 or more types.
The composition according to the present invention may or may not contain a basic compound. However, when it is contained, the content of the basic compound is usually 0.001 to on the basis of the total solid content of the composition. It is 10% by mass, preferably 0.01-5% by mass.

The use ratio of the acid generator and the basic compound is preferably acid generator / basic compound (molar ratio) = 2.5 to 300. That is, the molar ratio is preferably 2.5 or more from the viewpoints of sensitivity and resolution, and is preferably 300 or less from the viewpoint of suppressing the reduction in resolution due to the thickening of the relief pattern over time until post-exposure heat treatment. The acid generator / basic compound (molar ratio) is more preferably from 5.0 to 200, still more preferably from 7.0 to 150.

(D) Thermal acid generator The present invention may contain a thermal acid generator. The thermal acid generator is a compound that generates an acid by heat, and is usually a compound having a thermal decomposition point in the range of 130 ° C. to 250 ° C., preferably 150 ° C. to 220 ° C., for example, sulfonic acid, It is a compound that generates a low nucleophilic acid such as carboxylic acid or disulfonylimide.
As the generated acid, sulfonic acid, alkyl substituted with an electron withdrawing group or arylcarboxylic acid having a strong pKa of 2 or less, disulfonylimide substituted with an electron withdrawing group, and the like are preferable. Examples of the electron withdrawing group include a halogen atom such as an F atom, a haloalkyl group such as a trifluoromethyl group, a nitro group, and a cyano group.
The thermal acid generator is required not to be decomposed during storage time or in a pre-baking process after applying the composition, but to be quickly decomposed in a heat-curing process after patterning. Therefore, the thermal decomposition point is preferably 100 ° C to 300 ° C. More preferably, it is 120 ° C to 250 ° C, and further preferably 150 ° C to 200 ° C.
As the thermal acid generator, a photoacid generator that generates an acid by the above-described exposure can be applied. Examples thereof include onium salts such as sulfonium salts and iodonium salts, N-hydroxyimide sulfonate compounds, oxime sulfonates, o-nitrobenzyl sulfonates and the like.

Preferred examples of the sulfonium salt include compounds represented by the following general formulas (TA-1) to (TA-3).

In general formula (TA-1),
R _T1 to R _T5 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxy group or a halogen atom.
R _T6 and R _T7 each independently represent a hydrogen atom, an alkyl group or a cycloalkyl group.
R _T8 and R _T9 each independently represents an alkyl group, a cycloalkyl group, an allyl group or a vinyl group.
Any two or more of R _T1 to R _T5 , R _T6 and R _T7, and R _T8 and R _T9 may be bonded to each other to form a ring structure, and this ring structure includes an oxygen atom, a sulfur atom, a ketone A bond, an ester bond, or an amide bond may be included.
_Examples of the group formed by combining any two or more of R _T1 to R _T5 , R _T6 and R _T7, and R _T8 and R _T9 include a butylene group and a pentylene group.
X ⁻ represents a non-nucleophilic anion, and has a strong pKa of 2 or less as described above, a sulfonic acid or an alkyl or aryl carboxylic acid substituted with an electron withdrawing group, or a disulfonylimide substituted with an electron withdrawing group. Etc. are preferable. Examples of the electron withdrawing group include a halogen atom such as an F atom, a haloalkyl group such as a trifluoromethyl group, a nitro group, and a cyano group.

In general formula (TA-2),
R _T10 and R _T11 each independently represent an alkyl group, a cycloalkyl group, an allyl group, or a vinyl group.
R _T10 and R _T11 may be bonded to each other to form a ring structure, and this ring structure may contain an oxygen atom, a sulfur atom, a ketone bond, an ester bond, or an amide bond.
_{Examples of} the group formed by combining R _T10 and R _T11 include a butylene group and a pentylene group.
R _T12 to R _T16 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkoxy group, a thioalkoxy group, or a hydroxyl group, and two or more of them are bonded to each other to form a naphthalene ring, an anthracene ring, etc. A polycyclic aromatic ring may be formed.
X ⁻ represents a non-nucleophilic anion.

In general formula (TA-3),
R _T17 represents an alkyl group (straight chain or branched) or a cycloalkyl group, preferably a straight chain and branched alkyl group having 1 to 20 carbon atoms, more preferably 1 to 12 carbon atoms (for example, a methyl group, Ethyl group, linear or branched propyl group, linear or branched butyl group, linear or branched pentyl group). Examples of the cycloalkyl group include not only a monocyclic cyclic alkyl group such as a cyclopentyl group and a cyclohexyl group, but also a cyclic alkyl group having a bridging site such as a norbornyl group, a tricyclodecanyl group, and an adamantyl group. it can.
R _T18 and R _T19 each independently represent a hydrogen atom, an alkyl group or a cycloalkyl group.
R _T20 and R _T21 each independently represents an alkyl group, a cycloalkyl group, an allyl group or a vinyl group.
R _T18 and R _T19 and R _T20 and R _T21 may be bonded to each other to form a ring structure, and this ring structure may contain an oxygen atom, a sulfur atom, a ketone bond, an ester bond, or an amide bond. Good. _{Examples of} the group formed by combining R _T18 and R _T19 and R _T20 and R _T21 include a butylene group and a pentylene group.
X ⁻ represents a non-nucleophilic anion.

The alkyl group as R _T1 to R _T17 may be linear or branched. For example, a linear or branched alkyl group having 1 to 20 carbon atoms, preferably 1 to 12 carbon atoms (for example, Methyl group, ethyl group, linear or branched propyl group, linear or branched butyl group, linear or branched pentyl group).
The cycloalkyl group as R _T1 to R _T17 is _{meant to} include a monocyclic alkyl group as well as a polycyclic and cyclic alkyl group having a bridging site, and the cycloalkyl group as R _T12 to R _T16 is preferably Is a cycloalkyl group having 3 to 8 carbon atoms (eg, cyclopentyl group, cyclohexyl group).
The cycloalkyl group as R _T17 has a cycloalkyl group having 3 to 8 carbon atoms (eg, cyclopentyl group, cyclohexyl group) and a cyclic group having a bridging site such as a norbornyl group, a tricyclodecanyl group, or an adamantyl group. Also preferred are alkyl groups.

The alkoxy group as R _T1 to R _{T5 and} R _T12 to R _T16 may be linear, branched or cyclic, for example, an alkoxy group having 1 to 10 carbon atoms, preferably 1 to 1 carbon atoms. 5 linear and branched alkoxy groups (for example, methoxy group, ethoxy group, linear or branched propoxy group, linear or branched butoxy group, linear or branched pentoxy group), cyclic alkoxy groups having 3 to 8 carbon atoms (for example, , Cyclopentyloxy group, cyclohexyloxy group).
The thioalkoxy group as R _T12 to R _T16 may be linear, branched or cyclic, for example, a thioalkoxy group having 1 to 10 carbon atoms, preferably a linear or branched group having 1 to 5 carbon atoms. A thioalkoxy group (for example, a thiomethoxy group, a thioethoxy group, a linear or branched thiopropoxy group, a linear or branched thiobutoxy group, a linear or branched thiopentoxy group), a cyclic thioalkoxy group having 3 to 8 carbon atoms (for example, thiocyclopentyl) Oxy group, thiocyclohexyloxy group).

The non-nucleophilic anion as X ⁻ is preferably an organic anion, and particularly preferably an organic anion represented by the following general formula.

In the above general formula,
Rc ₁ represents an organic group.
Examples of the organic group for Rc ₁ include those having 1 to 30 carbon atoms, and preferably an alkyl group, a cycloalkyl group, an aryl group, or a plurality of these optionally having a substituent is a single bond, —O. _{-, - CO 2 -, -} S -, - SO 3 -, - SO 2 N (Rd 1) - can be exemplified linked group a linking group such as.
Rd ₁ represents a hydrogen atom or an alkyl group.
Rc ₂ represents 1-position an alkyl group substituted with a fluorine atom or a fluoroalkyl group.
Rc ₃ and Rc ₄ each independently represents an alkyl group substituted at the 1-position with a fluorine atom or a fluoroalkyl group. Preferably, it is a perfluoroalkyl group having 1 to 4 carbon atoms.
Rc ₃ and Rc ₄ may be bonded to each other to form a ring.
Examples of the group formed by combining Rc ₃ and Rc ₄ include an alkylene group, a cycloalkylene group, and an arylene group. A perfluoroalkylene group having 2 to 4 carbon atoms is preferred.

Preferred examples of the iodonium salt include compounds represented by the following general formula (TA-4).

In formula (TA-4), R ₄₁ and R ₄₂ each have a hydrogen atom, an optionally substituted alkyl group, an optionally substituted cycloalkyl group, or a substituent. An alkoxy group which may have a substituent, an alkoxycarbonyl group which may have a substituent, an acyl group which may have a substituent, an acyloxy group which may have a substituent, a nitro group, a halogen atom, a hydroxyl group Represents a carboxyl group.
a represents 1 to 5, and b represents 1 to 5.
However, at least one of R ₄₁ and R ₄₂ has an alkyl group having 5 or more carbon atoms, which may have a substituent, a cycloalkyl group which may have a substituent, or a substituent. An alkoxy group which may have a substituent, an alkoxycarbonyl group which may have a substituent, an acyl group which may have a substituent, and an acyloxy group which may have a substituent.
X represents R—SO ₃ , and R represents an aliphatic hydrocarbon group which may have a substituent and an aromatic hydrocarbon group which may have a substituent.

As the alkyl group for R ₄₁ and R ₄₂ , an optionally substituted methyl group, ethyl group, propyl group, n-butyl group, isobutyl group, sec-butyl group, t-butyl group, pentyl group, Examples thereof include those having 1 to 25 carbon atoms such as hexyl group, heptyl group, octyl group, t-amyl group, decanyl group, dodecanyl group and hexadecanyl group. The cycloalkyl group has 3 to 25 carbon atoms which may have a substituent, such as cyclopropyl group, cyclopentyl group, cyclohexyl group, cyclooctyl group, cyclododecanyl group, cyclohexadecanyl group and the like. Things. The alkoxy group may have a substituent such as methoxy group, ethoxy group, propoxy group, isopropoxy group, n-butoxy group, isobutoxy group, sec-butoxy group or t-butoxy group, pentyloxy group, t Examples thereof include those having 1 to 25 carbon atoms such as -amyloxy group, n-hexyloxy group, n-octyloxy group, n-dodecanoxy group and the like.

As the alkoxycarbonyl group, a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, an n-butoxycarbonyl group, an isobutoxycarbonyl group, a sec-butoxycarbonyl group or t which may have a substituent. Those having 2 to 25 carbon atoms such as -butoxycarbonyl group, pentyloxycarbonyl group, t-amyloxycarbonyl group, n-hexyloxycarbonyl group, n-octyloxycarbonyl group, n-dodecanoxycarbonyl group, etc. Can be mentioned. The acyl group may have a substituent and has 1 carbon atom such as formyl group, acetyl group, butyryl group, valeryl group, hexanoyl group, octanoyl group, t-butylcarbonyl group, t-amylcarbonyl group and the like. Up to 25 can be mentioned. As the acyloxy group, an acetoxy group, propionyloxy group, butyryloxy group, t-butyryloxy group, t-amylyloxy group, n-hexanecarbonyloxy group, n-octanecarbonyloxy group, which may have a substituent, Examples thereof include those having 2 to 25 carbon atoms such as n-dodecane carbonyloxy group, n-hexadecane carbonyloxy group, and the like. As the halogen atom, there can be mentioned a fluorine atom, a chlorine atom, a bromine atom or an iodine atom.

As a substituent for these groups, an alkoxy group having 1 to 4 carbon atoms, a halogen atom (a fluorine atom, a chlorine atom, a bromine atom, an iodine atom), an acyl group, an acyloxy group, a cyano group, a hydroxyl group, a carboxy group, An alkoxycarbonyl group, a nitro group, etc. can be mentioned. As described above, at least one of R ₁ and R ₂ has 5 or more carbon atoms and may have a substituent, a cycloalkyl group that may have a substituent, An alkoxy group which may have a substituent, an alkoxycarbonyl group which may have a substituent, an acyl group which may have a substituent, an acyloxy group which may have a substituent . Examples of the substituent having 5 or more carbon atoms include those having 5 to 25 carbon atoms in the above specific examples.

Among these, as R ₄₁ and R ₄₂ , which may have a substituent, examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a t-butyl group, and n-pentyl. Group, t-amyl group, n-hexyl group, n-octyl group and decanyl group are preferable, and the cycloalkyl group is preferably a cyclohexyl group, cyclooctyl group or cyclododecanyl group which may have a substituent. As the alkoxy group, which may have a substituent, a methoxy group, an ethoxy group, an isopropoxy group, an n-butoxy group, a sec-butoxy group, a t-butoxy group, a pentyloxy group, a t-amyloxy group, n -Hexyloxy group, n-octyloxy group and n-dodecanoxy group are preferable, and the alkoxycarbonyl group may be a methoxy group which may have a substituent. Carbonyl group, ethoxycarbonyl group, isopropoxycarbonyl group, n-butoxycarbonyl group, sec-butoxycarbonyl group, t-butoxycarbonyl group, pentyloxycarbonyl group, t-amyloxycarbonyl group, n-hexyloxycarbonyl group, n -Octyloxycarbonyl group and n-dodecanoxycarbonyl group are preferred, and the acyl group may have a substituent, formyl group, acetyl group, butyryl group, valeryl group, hexanoyl group, octanoyl group, t-butyl A carbonyl group and a t-amylcarbonyl group are preferable, and the acyloxy group may have an acetoxy group, a propionyloxy group, a butyryloxy group, a t-butyryloxy group, a t-amylyloxy group, and an n-hexanecarbonyl group, which may have a substituent. Roxy group, n-octa N-carbonyloxy group is preferred.

The alkyl group having 5 or more carbon atoms and optionally having a substituent is preferably an n-pentyl group, a t-amyl group, an n-hexyl group, an n-octyl group or a decanyl group. The cycloalkyl group having 5 or more carbon atoms and optionally having a substituent is preferably a cyclohexyl group, a cyclooctyl group or a cyclododecanyl group. The alkoxy group having 5 or more carbon atoms and optionally having a substituent is preferably a pentyloxy group, a t-amyloxy group, a hexyloxy group, an n-octyloxy group, or a dodecanoxy group. Examples of the alkoxycarbonyl group having 5 or more carbon atoms which may have a substituent include a pentyloxycarbonyl group, a t-amyloxycarbonyl group, a hexyloxycarbonyl group, an n-octyloxycarbonyl group, and dodecaneoxycarbonyl. Groups are preferred. The acyl group having 5 or more carbon atoms and optionally having a substituent is preferably a valeryl group, a hexanoyl group, an octanoyl group or a t-amylcarbonyl group. As the acyloxy group having 5 or more carbon atoms, which may have a substituent, a t-amylyloxy group, an n-hexanecarbonyloxy group, and an n-octanecarbonyloxy group are preferable. Substituents for these groups include methoxy group, ethoxy group, t-butoxy group, chlorine atom, bromine atom, cyano group, hydroxyl group, methoxycarbonyl group, ethoxycarbonyl group, t-butoxycarbonyl group, t-amyloxycarbonyl group Groups are preferred.

The iodonium compound represented by formula (TA-4) used in the present invention uses sulfonic acid having a specific structure as described above as its counter anion, X ⁻ . Examples of the aliphatic hydrocarbon group which may have an R substituent in the counter anion include a linear or branched alkyl group having 1 to 20 carbon atoms, or a cyclic alkyl group. Moreover, R can mention the aromatic group which may have a substituent. Examples of the alkyl group for R include a methyl group, an ethyl group, a propyl group, an n-butyl group, an n-pentyl group, an n-hexyl group, an n-octyl group, and 2-ethylhexyl, which may have a substituent. And those having 1 to 20 carbon atoms such as a group, a decyl group and a dodecyl group. Examples of the cyclic alkyl group include an optionally substituted cyclopentyl group, cyclohexyl group, cyclooctyl group, cyclododecyl group, adamantyl group, norbornyl group, camphor group, tricyclodecanyl group, menthyl group and the like. Can do. Examples of the aromatic group include a phenyl group and a naphthyl group, which may have a substituent.

Among the above, as the alkyl group which may have a substituent of R, a methyl group, a trifluoromethyl group, an ethyl group, a pentafluoroethyl group, a 2,2,2-trifluoroethyl group, n- Propyl group, n-butyl group, nonafluorobutyl group, n-pentyl group, n-hexyl group, n-octyl group, heptadecafluorooctyl group, 2-ethylhexyl group, decyl group, dodecyl group, cyclic alkyl group A cyclopentyl group, a cyclohexyl group, and a camphor group can be mentioned. As the aromatic group, a phenyl group, a naphthyl group, a pentafluorophenyl group, a p-toluyl group, a p-fluorophenyl group, a p-chlorophenyl group, a p-hydroxyphenyl group, p-, which may have a substituent. Examples thereof include a methoxyphenyl group, dodecylphenyl group, mesityl group, triisopropylphenyl group, 4-hydroxy-1-naphthyl group, and 6-hydroxy-2-naphthyl group.

Among the above substituents, more preferred specific examples of R ₄₁ and R ₄₂ are methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, t-butyl group, n-pentyl group, t- Amyl group, n-hexyl group, n-octyl group, cyclohexyl group, methoxy group, ethoxy group, isopropoxy group, n-butoxy group, t-butoxy group, pentyloxy group, t-amyloxy group, hexyloxy group, n -Octyloxy group, methoxycarbonyl group, ethoxycarbonyl group, n-butoxycarbonyl group, t-butoxycarbonyl group, t-amyloxycarbonyl group, hexyloxycarbonyl group, n-octyloxycarbonyl group, formyl group, acetyl group, Butyryl group, hexanoyl group, octanoyl group, t-butylcarbonyl group, t-amylca Bonyl group, acetoxy group, propionyloxy group, butyryloxy group, t-butyryloxy group, t-amylyloxy group, n-hexanecarbonyloxy group, n-octanecarbonyloxy group, hydroxyl group, chlorine atom, bromine atom, nitro group is there. Specific examples of more preferable groups having 5 or more carbon atoms include n-pentyl group, t-amyl group, n-hexyl group, n-octyl group, decanyl group, cyclohexyl group, pentyloxy group, t-amyloxy group, Hexyloxy group, n-octyloxy group, dodecaneoxy group, pentyloxycarbonyl group, t-amyloxycarbonyl group, hexyloxycarbonyl group, n-octyloxycarbonyl group, dodecanoxyoxycarbonyl group, valeryl group, hexanoyl group, octanoyl group A t-amylcarbonyl group, a t-amylyloxy group, an n-hexanecarbonyloxy group, and an n-octenecarbonyloxy group.

Specific examples of the more preferable sulfonic acid substituent R include methyl group, trifluoromethyl group, ethyl group, pentafluoroethyl group, 2,2,2-trifluoroethyl group, n-butyl group, nonafluorobutyl group, n-hexyl group, n-octyl group, heptadecafluorooctyl group, 2-ethylhexyl group, camphor group, phenyl group, naphthyl group, pentafluorophenyl group, p-toluyl group, p-fluorophenyl group, p-chlorophenyl group P-methoxyphenyl group, dodecylphenyl group, mesityl group, triisopropylphenyl group, 4-hydroxy-1-naphthyl group, 6-hydroxy-2-naphthyl group.

The total number of carbon atoms of the acid generated is preferably 1-30. More preferably, the number is 1 to 28, and still more preferably 1 to 25. If the total number of carbon atoms is less than 1, troubles such as poor resolution due to volatilization may occur, and if it exceeds 30, the development residue may be generated.
Specific examples of the compound represented by formula (TA-4) are shown below, but are not limited thereto. These compounds are used alone or in combination of two or more.

Examples of the imide sulfonate compound preferable as the thermal acid generator include compounds of the following general formula.

In the formula, C ₁ (carbon atom) and C ₂ (carbon atom) are bonded by a single bond or a double bond, and R ₅₁ or R ₅₂ may be the same or different, and the following (1) to (4) Represents one of the following:
(1) each independently a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, and (2) a monocyclic or polycyclic ring that may contain one or more heteroatoms together with C ₁ and C ₂ .
(3) Represents a residue containing (4) N-sulfonyloxyimide that forms a condensed aromatic ring containing C ₁ and C ₂ .
R ₅₃ represents an alkyl group, a halogenated alkyl group, a cyclic alkyl group, an alkenyl group, an aryl group which may have a substituent, an aralkyl group which may have a substituent, or a camphor group.

In the general formula (TA-5), when R ₅₁ and R ₅₂ correspond to the case of (1), the alkyl group includes a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, Examples thereof include an alkyl group having 1 to 4 carbon atoms such as a tert-butyl group. Examples of the cycloalkyl group include those having 3 to 8 carbon atoms such as cyclopropyl group, cyclopentyl group, cyclohexyl group, cyclooctyl group and the like. Examples of the aryl group include those having 6 to 14 carbon atoms such as phenyl group, tolyl group, xylyl group, mesityl group, and naphthyl group. When R ₅₁ and R ₅₂ correspond to the case (2), for example, the following partial structure can be given.

When R ₅₁ and R ₅₂ correspond to the case of (3), for example, the following partial structure can be given.

When R ₅₁ and R ₅₂ correspond to the case of (4), so-called at least two N-sulfonyloxyimide residues are a single bond at the R ₅₁ and R ₅₂ portions having the partial structures of (1) to (3) above. Or the thing couple | bonded with the following bivalent organic groups can be mention | raise | lifted. However, the following linking groups are used alone or in combination of two or more.
[Divalent organic _{group]: -O -, - S -,} - SO -, - SO 2 -, - NH -, - CO -, - CO 2 -, - NHSO 2 -, - NHCO -, - NHCO 2 -,

(R ₅₅ and R ₅₆ each represents a hydrogen atom or a methyl group. M represents an integer of 1 to 4.)

_Examples of the alkyl group for R ₅₃ include linear or branched alkyl groups having 1 to 20 carbon atoms. Preferred is a linear or branched alkyl group having 1 to 16 carbon atoms, and more preferred is one having 1 to 12 carbon atoms. In the case of an alkyl group having 21 or more carbon atoms, sensitivity and resolving power decrease, which is not preferable. Examples of the halogenated alkyl group include those in which one or two or more hydrogen atoms of the alkyl group are halogenated. Examples of the halogen atom to be substituted include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Preferred are a fluorine atom, a chlorine atom and a bromine atom, and particularly preferred is a fluorine atom. However, the halogen atom to be substituted may be plural types per molecule. Examples of the cyclic alkyl group include cycloalkyl groups having 3 to 12 carbon atoms such as cyclopropyl group, cyclopentyl group, cyclohexyl group, and cyclooctyl group, and polycyclic substituents such as norbornyl group, adamantyl group, and tricyclodecanyl group. I can give you. Examples of the alkenyl group include linear or branched alkenyl groups having 2 to 20 carbon atoms. A straight-chain or branched alkenyl group having 2 to 16 carbon atoms is preferable, and one having 2 to 12 carbon atoms is more preferable. In the case of an alkenyl group having 21 or more carbon atoms, sensitivity and resolving power decrease, which is not preferable.

_Examples of the aryl group of R ₅₃ include a phenyl group and a naphthyl group, and examples of the aralkyl group include a benzyl group. Examples of the substituent of the aryl group and the aralkyl group include a lower alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, and a tert-butyl group, a cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, a phenyl group, a toluyl group, Aryl groups such as xylyl and mesityl groups, methoxy groups, ethoxy groups, propoxy groups, isopropoxy groups, sec-butoxy groups, tert-butoxy groups and other lower alkoxy groups, vinyl groups, allyl groups, propenyl groups, butenyl groups, etc. And an acyl group such as alkenyl group, formyl group and acetyl group, and halogen atoms such as hydroxy group, carboxy group, cyano group, nitro group, fluorine atom, chlorine atom, bromine atom and iodine atom. Preferably, a lower alkyl group such as a methyl group, ethyl group, propyl group, isopropyl group, tert-butyl group, cyclohexyl group, phenyl group, toluyl group, methoxy group, ethoxy group, propoxy group, isopropoxy group, sec-butoxy Group, lower alkoxy group such as tert-butoxy group, halogen atom such as cyano group, nitro group, fluorine atom, chlorine atom, bromine atom and iodine atom. Two or more kinds of substituents on the aryl group and the aralkyl group may be used.
Specific examples of these compounds are shown below, but are not limited thereto.

Preferred oxime sulfonate compounds as thermal acid generators include compounds of the following general formula.

In the above general formula (TA-6), R ₆₁ and R ₆₂ are an alkyl group, alkenyl group, alkynyl group, cycloalkyl group, cycloalkenyl group, substituted group which may have a substituent having 1 to 16 carbon atoms. An aryl group, a heteroaryl group or a cyano group which may have a group. R ₆₁ and R ₆₂ are an alkylene chain, alkenylene chain, alkynylline chain, which may have a substituent having 2 to 8 carbon atoms, or phenylene, freelen, thienylene, which may have a substituent, It may be bonded to R ₆₁ or R _{62 of the} compound represented by another general formula (TA-6) through a linking chain containing —O—, —S—, —N—, and —CO—. . That is, the compound represented by the general formula (TA-6) includes those having two or three oxime sulfonate structures via a linking chain.
R ₆₃ represents an alkyl group, a cycloalkyl group, or an aryl group which may have a substituent, which may have a substituent having 1 to 16 carbon atoms.

Examples of the alkyl group having 1 to 16 carbon atoms in R ₆₁ to R ₆₃ include a methyl group, an ethyl group, a propyl group, an i-propyl group, a butyl group, an i-butyl group, a t-butyl group, a t-amyl group, alkyl groups such as n-hexyl group, n-octyl group, i-octyl group, n-decyl group, undecyl group, dodecyl group, hexadecyl group, trifluoromethyl group, perfluoropropyl group, perfluorobutyl group, perfluoro-t- Examples thereof include a butyl group, a perfluorooctyl group, a perfluoroundecyl group, and a 1,1-bistrifluoromethylethyl group.

Examples of the alkenyl group for R ₆₁ and R ₆₂ include allyl group, methallyl group, vinyl group, methylallyl group, 1-butenyl group, 3-butenyl group, 2-butenyl group, 1,3-pentadienyl group, 5-hexenyl group, Examples include 2-oxo-3-pentenyl group, decapentaenyl group, 7-octenyl group and the like.

Examples of the alkynyl group in R ₆₁ and R ₆₂ include ethynyl group, propargyl group, 2-butynyl group, 4-hexynyl group, 2-octynyl group, phenylethynyl group, cyclohexylethynyl group and the like.

_Examples of the cycloalkyl group in R ₆₁ to R ₆₃ include those having 3 to 8 carbon atoms, such as a cyclopropyl group, a cyclopentyl group, and a cyclohexyl group, which may have a substituent.

Examples of the cycloalkenyl group for R ₆₁ and R ₆₂ include a cyclobutenyl group, a cyclohexenyl group, a cyclopentadienyl group, a bicyclo [4.2.4] dodeca-3,7-dien-5-yl group, and the like.

_Examples of the aryl group in R ₆₁ to R ₆₃ include those having 6 to 14 carbon atoms, such as phenyl group, tolyl group, methoxyphenyl group, and naphthyl group, which may have a substituent.

The above substituents include alkyl groups, cycloalkyl groups, alkoxy groups, halogen atoms (fluorine atoms, chlorine atoms, iodine atoms), cyano groups, hydroxy groups, carboxy groups, nitro groups, aryloxy groups, alkylthio groups, aralkyls. And groups represented by the following general formula (1A).
Here, the alkyl group and the cycloalkyl group have the same meanings as described above. Examples of the alkoxy group include those having 1 to 4 carbon atoms such as methoxy group, ethoxy group, hydroxyethoxy group, propoxy group, n-butoxy group, isobutoxy group, sec-butoxy group and t-butoxy group. Examples of the aralkyl group include a benzyl group, a naphthylmethyl group, a furyl group, and a thienyl group.

In the above _{formula, R 61} and _{R 62} have the same meanings as _{R 61} and _{R 62} in formula (TA-6).

Specific examples of the compound represented by the general formula (TA-6) are shown below, but the present invention is not limited thereto.

Preferred examples of the oxime sulfonate-based acid generator as the thermal acid generator include compounds having at least one group represented by the following general formula (TA-7).

(In formula (TA-7), R ^70a and R ^70b each independently represents an organic group.)
The organic group of R ^70a and R ^{70b is} a group containing a carbon atom, and an atom other than a carbon atom (for example, a hydrogen atom, an oxygen atom, a nitrogen atom, a sulfur atom, a halogen atom (a fluorine atom, a chlorine atom, etc.)) You may have.
As the organic group for R ^70a , a linear, branched, or cyclic alkyl group or aryl group is preferable. These alkyl groups and aryl groups may have a substituent. The substituent is not particularly limited, and examples thereof include a fluorine atom and a linear, branched or cyclic alkyl group having 1 to 6 carbon atoms. Here, “having a substituent” means that part or all of the hydrogen atoms of the alkyl group or aryl group are substituted with a substituent.
The alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms, still more preferably 1 to 8 carbon atoms, particularly preferably 1 to 6 carbon atoms, and most preferably 1 to 4 carbon atoms. As the alkyl group, a partially or completely halogenated alkyl group (hereinafter sometimes referred to as a halogenated alkyl group) is particularly preferable. The partially halogenated alkyl group means an alkyl group in which a part of hydrogen atoms is substituted with a halogen atom, and the fully halogenated alkyl group means that all of the hydrogen atoms are halogen atoms. Means an alkyl group substituted with Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and a fluorine atom is particularly preferable. That is, the halogenated alkyl group is preferably a fluorinated alkyl group.
The aryl group preferably has 4 to 20 carbon atoms, more preferably 4 to 10 carbon atoms, and most preferably 6 to 10 carbon atoms. As the aryl group, a partially or completely halogenated aryl group is particularly preferable. The partially halogenated aryl group means an aryl group in which a part of hydrogen atoms is substituted with a halogen atom, and the fully halogenated aryl group means that all of the hydrogen atoms are halogen atoms. Means an aryl group substituted with.
R ^70a is particularly preferably an alkyl group having 1 to 4 carbon atoms having no substituent or a fluorinated alkyl group having 1 to 4 carbon atoms.

As the organic group for R ^70b , a linear, branched, or cyclic alkyl group, aryl group, or cyano group is preferable. As the alkyl group and aryl group for R ^70b, the same alkyl groups and aryl groups as those described above for R ^70a can be used.
R ^70b is particularly preferably a cyano group, an alkyl group having 1 to 8 carbon atoms having no substituent, or a fluorinated alkyl group having 1 to 8 carbon atoms.

As the oxime sulfonate-based acid generator, a compound represented by the following general formula (TA-7a) or (TA-7b) is preferably used because of its high acid generation efficiency against electron beam irradiation.

[In the formula (TA-7a), m ′ is 0 or 1; X is 1 or 2; R ₇₁ is a phenyl group, a heteroaryl group, or an alkyl group having 1 to 12 carbon atoms, or When m ′ is 0, an alkoxycarbonyl group having 2 to 6 carbon atoms, a phenoxycarbonyl group, CN (cyano group); R ₇₂ is synonymous with R ₇₁ ; R ₇₃ ′ is 1 to 1 carbon atoms when X is 1; An alkyl group having 18 carbon atoms, an alkylene group having 2 to 12 carbon atoms when X is 2, a phenylene group; R ₇₄ and R ₇₅ are independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 6 carbon atoms; A is —S— , -O-, -N (R ₇₆ )-. _R76 represents an alkyl group, an aryl group or an aralkyl group. ]

[In the formula (TA-7b), R ₇₁ ′ is an alkylene group having 2 to 12 carbon atoms; R ₇₂ , R ₇₄ , R ₇₅ and A are as defined above; R ₇₃ is an alkyl group having 1 to 18 carbon atoms. . ]

As the above compound, the following thiolene-containing oxime sulfonate is particularly preferable.

Preferred examples of the general formula of nitrobenzyl sulfonate include compounds represented by the general formula (TA-9).

(Z in this formula is alkyl group, aryl group, alkylaryl group, halogen-substituted alkyl group, halogen-substituted aryl group, halogen-substituted alkylaryl group, nitro-substituted aryl group, nitro-substituted An alkylaryl group, an aryl group having a nitro substituent and a halogen substituent, an alkylaryl group having a nitro substituent and a halogen substituent, and the formula C ₆ H ₄ SO ₃ CHR′C ₆ H _4-m Q _m (NO ) is selected from groups having _2, R represents a hydrogen atom or a methyl group, R 'are selected from hydrogen atoms and methyl groups, and nitro substituted aryl groups, each Q is a hydrocarbon group, hydrocarbonoxy carboxymethyl Independently selected from the group, NO ₂ , halogen atoms and organosilicon groups, the value of m being 0, 1 or 2, where Q is not an acidic group)
Specific examples of the compound represented by the general formula (TA-9) include the following compounds.

Also sulfonic acid esters can be used.
For example, a sulfonic acid ester represented by the following general formula (TA-1) can be given.
R′—SO ₂ —O—R ″ (TA-1)
In the above formula, R ′ and R ″ are each independently a linear or branched alkyl group having 1 to 10 carbon atoms which may have a substituent or an optionally substituted carbon group having 6 carbon atoms. Represents an aryl group of ˜20, and examples of the substituent include a hydroxyl group, a halogen atom, a cyano group, a vinyl group, an acetylene group, and a linear or cyclic alkyl group having 1 to 10 carbon atoms.
Preferable specific examples of the sulfonic acid ester include the following.

As the sulfonic acid ester, a compound represented by the following general formula (TA-2) is more preferable from the viewpoint of heat resistance.
The molecular weight of the sulfonate ester is generally 230 to 1000, preferably 230 to 800.

A represents an h-valent linking group.
R ₀ represents an alkyl group, an aryl group, an aralkyl group, or a cyclic alkyl group.
R ₀ ′ represents a hydrogen atom, an alkyl group, or an aralkyl group.
h represents an integer of 2 to 8.

The h-valent linking group as A includes, for example, an alkylene group (eg, methylene, ethylene, propylene, etc.), a cycloalkylene group (eg, cyclohexylene, cyclopentylene, etc.), an arylene group (1,2-phenylene, 1,3). -Phenylene, 1,4-phenylene, naphthylene, etc.), an ether group, a carbonyl group, an ester group, an amide group, and a group obtained by removing h-2 arbitrary hydrogen atoms from a divalent group combining these groups. Can be mentioned.
The carbon number of the h-valent linking group as A is generally 1 to 15, preferably 1 to 10, and more preferably 1 to 6.

The alkyl group for R ₀ and R ₀ ′ is generally an alkyl group having 1 to 20 carbon atoms, preferably an alkyl group having 1 to 15 carbon atoms, more preferably an alkyl group having 1 to 8 carbon atoms. is there. Specific examples include methyl, ethyl, propyl, butyl, hexyl, octyl and the like.
The aralkyl group for R ₀ and R ₀ ′ is generally an aralkyl group having 7 to 25 carbon atoms, preferably an aralkyl group having 7 to 20 carbon atoms, more preferably an aralkyl group having 7 to 15 carbon atoms. is there. Specific examples include benzyl, toluylmethyl, mesitylmethyl, phenethyl and the like.
The cyclic alkyl group for R ₀ is generally a cyclic alkyl group having 3 to 20 carbon atoms, preferably a cyclic alkyl group having 4 to 20 carbon atoms, more preferably a cyclic alkyl group having 5 to 15 carbon atoms. is there. Specific examples include cyclopentyl, cyclohexyl, norbornyl, camphor group and the like.

The linking group as A may further have a substituent. The substituent is an alkyl group (an alkyl group having 1 to 10 carbon atoms, specifically, methyl, ethyl, propyl, butyl, hexyl). Octyl, etc.), aralkyl groups (aralkyl groups having 7 to 15 carbon atoms, specifically benzyl, toluylmethyl, mesitylmethyl, phenethyl, etc.), aryl groups (aryl groups having 6 to 10 carbon atoms, specifically Are phenyl, toluyl, xylyl, mesityl, naphthyl, etc.), an alkoxy group (the alkoxy group may be linear, branched or cyclic, and has 1 to 10 carbon atoms, specifically, Methoxy, ethoxy, linear or branched propoxy, linear or branched butoxy, linear or branched pentoxy, cyclopentyloxy, cyclohexyloxy, etc.) A reeloxy group (an aryloxy group having 6 to 10 carbon atoms, specifically phenoxy, toluyloxy, 1-naphthoxy, etc.), an alkylthio group (which may be linear, branched or cyclic, the number of carbon atoms 1 to 10 alkylthio groups, specifically methylthio, ethylthio, linear or branched propylthio, cyclopentylthio, cyclohexylthio), arylthio groups (arylthio groups having 6 to 10 carbon atoms, specifically phenylthio , Toluylthio, 1-naphthylthio, etc.), acyloxy groups (acyloxy groups having 2 to 10 carbon atoms, specifically acetoxy, propanoyloxy, benzoyloxy, etc.), alkoxycarbonyl groups (alkoxycarbonyl having 1 to 10 carbon atoms) Groups such as methoxycarbonyl, ethoxycarbonyl, Or branched propoxycarbonyl, cyclopentyloxycarbonyl, cyclohexyloxycarbonyl, etc.), can be exemplified.

In the general formula (2), R ₀ is preferably an alkyl group or an aryl group. R ₀ ′ is preferably a hydrogen atom and an alkyl group having 1 to 6 carbon atoms, more preferably a hydrogen atom, a methyl group or an ethyl group, and most preferably a hydrogen atom.

Examples of the sulfonic acid ester of the present invention include the following specific compounds, but are not limited thereto.

As the sulfonic acid ester of the present invention, a commercially available one may be used, or one synthesized by a known method may be used. The sulfonic acid ester of the present invention can be synthesized, for example, by reacting sulfonyl chloride or sulfonic acid anhydride with a corresponding polyhydric alcohol under basic conditions.

In the photosensitive resin composition of the present invention, the content of the thermal acid generator is preferably 1 to 20% by mass, more preferably 3 to 10% by mass based on the total solid content of the photosensitive resin composition.

(E) Compound containing at least one of alkoxymethyl group and acyloxymethyl group The composition of the present invention may contain a compound containing at least one of alkoxymethyl group and acyloxymethyl group. Even in the low-temperature curing process, it is possible to prevent melting and thermal shrinkage of the pattern during curing.

As the compound containing at least one of an alkoxymethyl group and an acyloxymethyl group in the present invention, a compound in which an alkoxymethyl group or an acyloxymethyl group is substituted directly on an aromatic group or a nitrogen atom of the following urea structure on a triazine Can be cited as a representative structure.
The alkoxymethyl group or acyloxymethyl group of the compound preferably has 2 to 5 carbon atoms, preferably 2 or 3 carbon atoms, and particularly preferably 2 carbon atoms.
The total number of alkoxymethyl groups and acyloxymethyl groups possessed by the compound is preferably 1 to 10, more preferably 2 to 8, and particularly preferably 3 to 6.
The molecular weight of the compound is preferably 1500 or less, and preferably 180 to 1200.

R ₁₀₀ represents an alkyl group or an acyl group.
R ₁₀₁ and R ₁₀₂ independently represent a monovalent organic group, and may be bonded to each other to form a ring.

Examples of the compound in which an alkoxymethyl group or an acyloxymethyl group is directly substituted with an aromatic group include compounds having the following general formula.

In the formula, X represents a single bond or a divalent organic group, each R ₁₀₄ independently represents an alkyl group or an acyl group, and R ₁₀₃ represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, Or a group that decomposes by the action of an acid to generate an alkali-soluble group (for example, a group that is eliminated by the action of an acid, a group represented by —C (R ⁴ ) ₂ COOR ⁵ (R ⁴ is a hydrogen atom or a carbon number) Represents an alkyl group of 1 to 4, and R ⁵ represents a group capable of leaving by the action of an acid))).
R ₁₀₅ each independently represents an alkyl group or an alkenyl group, a, b and c are each independently 1 to 3, d is 0 to 4, and e is independently 0 to 3.
The group capable of decomposing by the action of an acid to generate an alkali-soluble group, the group leaving by the action of an acid, and the group represented by —C (R ⁴ ) ₂ COOR ⁵ are the same as those in the general formula (1). is there.

Specific examples of the compound having an alkoxymethyl group include the following structures. Examples of the compound having an acyloxymethyl group include compounds in which the alkoxymethyl group of the following compound is changed to an acyloxymethyl group. Examples of the compound having an alkoxymethyl group or acyloxymethyl in the molecule include, but are not limited to, the following compounds.

As the compound containing at least one of an alkoxymethyl group and an acyloxymethyl group, a commercially available product or a compound synthesized by a known method may be used.
From the viewpoint of heat resistance, a compound in which an alkoxymethyl group or an acyloxymethyl group is directly substituted on an aromatic ring or a triazine ring is preferable.
The addition amount of these compounds is preferably 1 to 20 parts by mass, and more preferably 3 to 15 parts by mass with respect to 100 parts by mass of the total amount of the resin of the present invention.

(E ′) Compound containing methacryloyl group or acryloyl group The composition of the present invention may contain a compound containing methacryloyl group or acryloyl group.
The compound containing a methacryloyl group or an acryloyl group is a compound selected from the group consisting of acrylic acid esters and methacrylic acid esters. Since these compounds are insoluble in an alkaline developer, they have a function of suppressing the alkali solubility of the composition, and are useful for good image formation in order to suppress film loss in unexposed areas. In addition, although the specific reaction mechanism is not grasped, the molecular weight of components constituting the composition partially increases due to the reaction of the acrylic group or methacrylic group with the compound in the composition at the stage of the cure reaction. The film properties are improved. Therefore, it is preferable to use a compound having two or more acryloyl groups and methacryloyl groups in one molecule, more preferably four or more functional groups, because this compound can exhibit a function as a crosslinking compound.
Further, it is more preferable that the skeleton containing an acrylolyl group or a methacryloyl group is a ring structure such as an aromatic ring or an alicyclic ring, particularly a substance containing an alicyclic structure, because of the exposure light transmittance and the rigidity of the cured film.
Furthermore, if the length (n) of the ethylene oxide (EO) chain and propylene oxide (PO) chain in the skeleton is long, the rigidity of the film is lost, so that n = 1 to 5 is preferable.

Preferable specific examples include NK-10 series made by Shin-Nakamura Chemical Co., Ltd., monofunctional AMP-10G, AMP-20GY, AM30G, AM90G, AM230G, ACB-3, A-BH, A-IB, A-SA, A -OC-18E, 720A, S-1800A, ISA, AM-130G, LA, M-20G, M-90G, M230G, PHE-1G, SA, CB-1, CB-3, CB-23, TOPOLENE-M , S-1800M, IB, OC-18E, S, bifunctional A-200, A-400, A-600, A-1000, ABE-300, A-BPE-4, A-BPE-10, A- BPE-20, A-BPE-30, A-BPP-3, A-DOD, A-DCP, A-IBD-2E, A-NPG, 701A, A-B1206PE, A-HD-N A-NOD-N, APG-100, APG-200, APG-400, APG-700, 1G, 2G, 3G, 4G, 9G, 14G, 23G, BG, BD, HD-N, NOD, IND, BPE -100, BPE-200, BPE-300, BPE-500, BPE-900, BPE-1300N, NPG, DCP, 1206PE, 701, 3PG, 9PG, trifunctional A-9300, AT-30E, A-TMPT- 3EO, A-TMPT-9EO, A-TMPT-3PO, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, TMPT, TMPT-9EO, 4 or more functional ATM-35E, ATM- Examples thereof include 4E, AD-TMP, AD-TMP-L, ATM-4P, A-TMMT, and A-DPH.
Particularly preferred examples include the following polyfunctional monomers.

The addition amount of the compound containing a methacryloyl group or an acryloyl group in the molecule of the present invention is 0.5 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the resin having a repeating unit represented by the general formula (1). Is preferred. More preferably, they are 1 mass part or more and 20 mass parts or less, Most preferably, they are 2 mass parts or more and 15 mass parts or less. By making the addition amount 0.5 parts by mass or more, the effect of the present invention can be further obtained, and by suppressing the addition amount appropriately, it is possible to prevent a decrease in heat resistance of the cured film.

(F) Adhesion promoter In the positive photosensitive resin composition in the present invention, an adhesion promoter such as an organosilicon compound, a silane coupling agent, and a leveling agent for imparting adhesion may be added as necessary. Examples of these are, for example, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, vinyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, p-styryl. Trimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, ureapropyltriethoxysilane, tris ( Acetylacetonate) aluminum, acetylacetate aluminum diisopropylate and the like. When an adhesion promoter is used, it is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the resin of the present invention.

(G) Solvent The solvent is not particularly limited as long as it can dissolve the composition of the present invention. However, in order to prevent the solvent from evaporating more than necessary at the time of coating and precipitating the solid content of the composition at the time of coating, Solvents with the above boiling points are preferred. For example, alkylene glycol monoalkyl ether carboxylate, alkylene glycol monoalkyl ether, alkyl lactate ester, alkyl alkoxypropionate, cyclic lactone (preferably having 4 to 10 carbon atoms), monoketone compound (preferably carbon And organic solvents such as alkylene carbonate, alkyl alkoxyacetate, alkyl pyruvate, and amide solvents.

Examples of the alkylene glycol monoalkyl ether carboxylate include propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, propylene glycol monomethyl ether propionate, propylene glycol monoethyl Preferred examples include ether propionate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate.
Preferred examples of the alkylene glycol monoalkyl ether include propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, ethylene glycol monomethyl ether, and ethylene glycol monoethyl ether.

Preferred examples of the alkyl lactate include methyl lactate, ethyl lactate, propyl lactate and butyl lactate.
Preferred examples of the alkyl alkoxypropionate include ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, methyl 3-ethoxypropionate, and ethyl 3-methoxypropionate.

Examples of the cyclic lactone include β-propiolactone, β-butyrolactone, γ-butyrolactone, α-methyl-γ-butyrolactone, β-methyl-γ-butyrolactone, γ-valerolactone, γ-caprolactone, and γ-octano. Preferred are iclactone and α-hydroxy-γ-butyrolactone.

Examples of the monoketone compound which may contain a ring include 2-butanone, 3-methylbutanone, pinacolone, 2-pentanone, 3-pentanone, 3-methyl-2-pentanone, 4-methyl-2-pentanone, 2 -Methyl-3-pentanone, 4,4-dimethyl-2-pentanone, 2,4-dimethyl-3-pentanone, 2,2,4,4-tetramethyl-3-pentanone, 2-hexanone, 3-hexanone, 5-methyl-3-hexanone, 2-heptanone, 3-heptanone, 4-heptanone, 2-methyl-3-heptanone, 5-methyl-3-heptanone, 2,6-dimethyl-4-heptanone, 2-octanone, 3-octanone, 2-nonanone, 3-nonanone, 5-nonanone, 2-decanone, 3-decanone, 4-decanone, 5-hexen-2-one 3-penten-2-one, cyclopentanone, 2-methylcyclopentanone, 3-methylcyclopentanone, 2,2-dimethylcyclopentanone, 2,4,4-trimethylcyclopentanone, cyclohexanone, 3- Methylcyclohexanone, 4-methylcyclohexanone, 4-ethylcyclohexanone, 2,2-dimethylcyclohexanone, 2,6-dimethylcyclohexanone, 2,2,6-trimethylcyclohexanone, cycloheptanone, 2-methylcycloheptanone, 3-methyl Preferred is cycloheptanone.

Preferred examples of the alkylene carbonate include propylene carbonate, vinylene carbonate, ethylene carbonate, and butylene carbonate.
Examples of alkyl alkoxyacetates include 2-methoxyethyl acetate, 2-ethoxyethyl acetate, 2- (2-ethoxyethoxy) ethyl acetate, 3-methoxy-3-methylbutyl acetate, and 1-methoxy-acetate. 2-propyl is preferred.
Preferred examples of the alkyl pyruvate include methyl pyruvate, ethyl pyruvate, and propyl pyruvate.
Preferred examples of the amide solvent include N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidinone, and 1,3-dimethyl-2-imidazolidinone.
In addition, dimethyl sulfoxide and sulfolane are preferable.
Among the above, N-methylpyrrolidone (NMP), γ-butyrolactone (GBL), N, N-dimethylacetamide (DMAc), 1,3-dimethyl-2-imidazolidinone (DMI) are more preferable solvents. , N, N-dimethylformamide (DMF), cyclopentanone, cyclohexanone, cycloheptanone and the like. More preferred are γ-butyrolactone, N-methylpyrrolidone, cyclopentanone, and cyclohexanone.
These solvents may be used alone or in combination of two or more.
The total solid concentration in the photosensitive resin composition of the present invention is generally 10 to 40% by mass, more preferably 10 to 30% by mass, and still more preferably 15 to 30% by mass.

[Relief pattern manufacturing method]
As a method for producing a relief pattern using the photosensitive resin composition of the present invention, (a) the photosensitive resin composition of the present invention is coated on an appropriate substrate to form a photosensitive film, and (b) The coated substrate is baked (pre-baked), (c) exposed with actinic light or radiation, (d) developed with an aqueous developer, and (e) cured to form a cured relief pattern. be able to. In the exposed part of the coated photosensitive film, —CO ₂ R ³ in the general formula (1) is decomposed by the action of an acid to generate an alkali-soluble group, which is developed so as to be removed with an aqueous alkaline developer. Thus, a positive cured relief pattern can be obtained.

The coated and exposed substrate can be baked at a high temperature (post-exposure baking) prior to development. Further, the developed substrate may be rinsed before curing.

As described above, the photosensitive resin composition of the present invention is applied on a semiconductor element so that the thickness after heat curing becomes a predetermined thickness (for example, 0.1 to 30 μm), prebaked, exposed, developed, and heat cured. Thus, a semiconductor device can be manufactured.

Hereinafter, a method for manufacturing a relief pattern will be described in more detail.
The photosensitive resin composition of the present invention is coated on a suitable substrate. The substrate is for example a semiconductor material such as a silicon wafer or a ceramic substrate, glass, metal or plastic. Coating methods include, but are not limited to, spray coating, spin coating, offset printing, roller coating, screen printing, extrusion coating, meniscus coating, curtain coating, and dip coating.

The coating film is baked at a temperature of about 70 to 150 ° C. for several minutes to half an hour in order to evaporate the residual solvent. Subsequently, the resulting film is exposed to actinic rays or radiation through a mask. As the actinic ray or radiation, X-ray, electron beam, ultraviolet ray, visible ray or the like can be used. The most preferred radiation is one having a wavelength of 365 nm (i-line) or 436 nm (g-line).

Following exposure to actinic light or radiation, the exposed substrate is preferably heated at a temperature of about 70-150 ° C. Usually, it is heated at a predetermined temperature for several tens of seconds to several minutes. This method is referred to as post-exposure baking.
By this post-exposure baking, a polyamic acid is produced from the polyamic acid ester in the general formula (1) as shown in the following scheme.

Next, the coating film can be developed with an aqueous developer to obtain a relief pattern. Examples of the aqueous developer include inorganic alkali (eg, potassium hydroxide, sodium hydroxide, aqueous ammonia), primary amine (eg, ethylamine, n-propylamine), secondary amine (eg, diethylamine, di-n-propyl). Amines), tertiary amines (eg, triethylamine), alcohol amines (eg, triethanolamine), quaternary ammonium salts (eg, tetramethylammonium hydroxide, tetraethylammonium hydroxide), and alkaline solutions such as mixtures thereof Is mentioned. The most preferred developer is one containing tetramethylammonium hydroxide. Furthermore, an appropriate amount of a surfactant may be added to the developer. Development can be carried out by dipping, spraying, paddling, or other similar development methods.

In some cases, the relief pattern may be rinsed using deionized water. Next, in order to obtain a final pattern film having high heat resistance, polyimide is produced from the polyamic acid ester by heat-curing the relief pattern as shown in the following scheme. For curing, baking at a glass transition temperature _Tg or higher of the polymer is preferable in order to obtain a polyimide having high heat resistance. The heat curing temperature is preferably about 200 to 400 ° C, particularly preferably 250 to 400 ° C.

Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited thereto.

[GPC measurement conditions]
GPC measurement in the following is performed by directly connecting three HPC-8220GPC (manufactured by Tosoh), guard column: TSKguardcolumn SuperAW-H, column: TSKgel SuperAWM-H, column temperature of 50 ° C., and sample concentration of 0.5 mass%. Inject 20 μl of -2-pyrrolidone solution, and flow N-methyl-2-pyrrolidone solution (containing LiBr (10 mM) and H ₃ PO ₄ (10 mM)) as an elution solvent at a flow rate of 0.35 ml / min. This was done by detecting the sample peak with a detector. Mw and Mn were calculated using a calibration curve prepared using standard polystyrene.

<Example of resin synthesis>
[Synthesis of P-1]
Synthesis of polyamic acid In a 5000 mL flask equipped with a thermometer, a stirrer and a nitrogen introduction tube, 123.42 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed, and NMP (N-methyl-2- After dissolving in 2399.4 g of pyrrolidone), 300.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and then allowed to cool to room temperature (25 ° C.). Next, 30.27 g of phthalic anhydride was added and stirred at room temperature for 10 hours to obtain a colorless and transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 1.68 × 10 ⁴ , Mn = 0.62 × 10 ⁴ , and Mw / Mn = 2.71.

Synthesis of polyamic acid ester 132.01 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer and a nitrogen introduction tube, and 111.0 g of NMP was added and cooled, and 12.56 g of chloromethyl methyl ether at 0 ° C. or lower. Subsequently, 16.12 g of N, N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1175 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 24.6 g of the desired product (resin P-1) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.00 × 10 ⁴ and Mw / Mn = 1.91. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-2]
A polyamic acid was synthesized in the same manner as P-1. 132.01 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 111.0 g of NMP was added and cooled. 8.06 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1175 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 19.3 g of the desired product (resin P-2) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 1.88 × 10 ⁴ and Mw / Mn = 1.68. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 72%.

[Synthesis of P-3]
A polyamic acid was synthesized in the same manner as P-1. 142.26 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 70.37 g of NMP was added and cooled, and 15.91 g of chloromethyl ethyl ether at 0 ° C. or lower, followed by N, 17.39 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1267 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 23.6 g of the desired product (resin P-3) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.09 × 10 ⁴ and Mw / Mn = 1.73. The solid was dissolved in deuterated DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 96%.

[Synthesis of P-7]
A polyamic acid was synthesized in the same manner as P-1. 132.01 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 111.0 g of NMP was added and cooled. 16.12 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1175 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 24.8 g of the desired product (resin P-7) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.36 × 10 ⁴ and Mw / Mn = 1.72. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-8]
A polyamic acid was synthesized in the same manner as P-1. 132.01 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 111.0 g of NMP was added and cooled. At 0 ° C. or lower, 9.27 g of chloromethylcyclohexyl ether was added, followed by N, 8.06 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1175 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 20.2 g of the desired product (resin P-8) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.13 × 10 ⁴ and Mw / Mn = 1.59. The solid was dissolved in heavy DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 64%.

[Synthesis of P-11]
A polyamic acid was synthesized in the same manner as P-1. 106.30 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 52.59 g of NMP was added and cooled, and 20.96 g of 2- (chloromethoxy) ethyltrimethylsilane at 0 ° C or lower Subsequently, 13.00 g of N, N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 947 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 13.5 g of the desired product (resin P-11) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 1.58 × 10 ⁴ and Mw / Mn = 1.55. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 73%.

[Synthesis of P-16]
48.11 g of paraaldehyde, 140.0 g of cyclohexaneethanol, and 1.27 g of 10-camphorsulfonic acid were added to 150 g of hexane, and the mixture was refluxed for 5 hours using a Dean-Stark apparatus. The solution was washed twice with a saturated sodium hydrogen carbonate solution and twice with water, and the organic layer was dried over sodium sulfate and concentrated under reduced pressure to obtain 157 g of a transparent solution. 34.3 g of acetyl chloride was added to this and reacted at 50 ° C. for 5 hours, and then concentrated under reduced pressure to obtain 178 g of a transparent liquid. ¹ H-NMR spectrum was measured after dissolving in deuterated chloroform, and it was found that the content of cyclohexylethyl 1-chloroethyl ether was 31% by mass.
Polyamic acid was synthesized in the same manner as P-1, and 105.61 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 52.23 g of NMP was added and cooled to 0 ° C. or lower. Was added 76.75 g of the above 31% by weight solution followed by 26.87 g of N, N-diisopropylethylamine. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 940 g of acetonitrile, and the precipitated solid was collected by filtration and dried to obtain 16.5 g of the desired product (resin P-16) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.29 × 10 ⁴ and Mw / Mn = 1.75. The solid was dissolved in heavy DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 69%.

[Synthesis of P-19]
A polyamic acid was synthesized in the same manner as P-1, and 106.30 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 52.59 g of NMP was added, (2-phenoxyethyl). ) 20.64 g of vinyl ether and 0.97 g of 10-camphorsulfonic acid were sequentially added. After reacting at 25 ° C. for 5 hours, the reaction solution was added to 947 g of acetonitrile, and the precipitated solid was collected by filtration and dried to obtain 18.9 g of the desired product (resin P-19) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.50 × 10 ⁴ and Mw / Mn = 1.71. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-22]
Polyamic acid was synthesized in the same manner as P-1, and 105.59 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 52.23 g of NMP was added, and (1- (4 -Tert-octyl-phenoxy) -2-vinyloxy-ethane (34.43 g) and 10-camphorsulfonic acid (0.96 g) were sequentially added, and the mixture was reacted at 25 ° C. for 5 hours. The product was collected by filtration and dried to obtain 22.1 g of the desired product (resin P-22) as a white solid, and the obtained resin was analyzed by GPC, whereby Mw = 2.84 × 10 ⁴ and Mw / Mn = 1. It was 71. the solid was dissolved in deuterated DMSO to measure ^{1 H-NMR} spectrum, 1 was calculated protective index from the peak integration ratio of carboxylic acid esters and carboxylic acid It was 0%.

[Synthesis of P-26]
24.93 g of ethylene glycol monovinyl ether and 35.42 g of cyclohexyl isocyanate were added to 150 ml of dehydrated ethyl acetate and stirred at 70 ° C. for 6 hours. Concentrated under reduced pressure and cooled to precipitate crystals. The crystals were filtered and rinsed with cold hexane to obtain 37.8 g of vinyl ether having the following structure as white needle crystals.

Polyamic acid was synthesized in the same manner as P-1, and 79.19 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 39.18 g of NMP was added, and 19.92 g of the vinyl ether was added. 0.72 g of 10-camphorsulfonic acid was sequentially added. After reacting at 25 ° C. for 5 hours, the reaction solution was added to 705 g of acetonitrile, and the precipitated solid was collected by filtration and dried to obtain 15.1 g of the desired product (resin P-26) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.62 × 10 ⁴ and Mw / Mn = 1.76. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-27]
Ethylene glycol monovinyl ether 29.00 g and phenyl isocyanate 39.20 g were added to dehydrated ethyl acetate 150 ml and stirred at 70 ° C. for 6 hours. Concentration under reduced pressure (100 ° C., 0.1 kPa) gave 60.2 g of an oily vinyl ether having the following structure.

Polyamic acid was synthesized in the same manner as P-1, and 79.19 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, 39.18 g of NMP was added, and 19.36 g of the vinyl ether was added. 0.72 g of 10-camphorsulfonic acid was added sequentially. After reacting at 25 ° C. for 5 hours, the reaction solution was added to 705 g of acetonitrile, and the precipitated solid was collected by filtration and dried to obtain 17.6 g of the desired product (resin P-26) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.89 × 10 ⁴ and Mw / Mn = 1.95. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-29]
In a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube, 100 g of phenylacetaldehyde dimethyl acetal and 54.3 g of acetyl chloride were added, reacted at 50 ° C. for 5 hours, concentrated under reduced pressure, and transparent with the following structure A liquid was obtained.

Polyamic acid was synthesized in the same manner as P-1, and 132.8 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 65.68 g of NMP was added and cooled to 0 ° C. or lower. 25.58 g of the above solution was added followed by 23.25 g of N, N-diisopropylethylamine. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1182 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 29.19 g of the desired product (resin P-29) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.49 × 10 ⁴ and Mw / Mn = 1.65. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 97%.

[Synthesis of P-31]
In a 2000 mL flask equipped with a thermometer, stirrer, and nitrogen inlet tube, add 58.2 g of 1-ethylcyclopentanol and 250 ml of dry THF, and add 184 ml of n-butyllithium (2,6M hexane) dropwise at -5 ° C or lower. The mixture was stirred at -2 ° C for 2 hours. To this was added 50.0 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride, and the mixture was stirred at room temperature for 1 hour, 200 ml of NMP was added, and the mixture was further stirred at room temperature for 3 hours and then at 50 ° C. for 1 hour. Stir. The mixture was allowed to cool, neutralized with dilute hydrochloric acid, and extracted with 600 ml of ethyl acetate. The organic layer was washed twice with saturated brine and twice with water, and the organic layer was dried over sodium sulfate and concentrated under reduced pressure. As a result, 32.3 g of a dicarboxylic acid having the following structure was obtained.

16.00 g of this dicarboxylic acid was added to a 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 58.28 g of NMP was added and cooled. Diphenyl (2,3-dihydro-2-thioxo-3 -Benzoxazolyl) phosphonate (DBOP) 27.61 g, N, N-diisopropylethylamine 11.63 g, and trans-1,4-cyclohexanediamine 3.43 g were sequentially added. After stirring at 0 ° C. or lower for 1 hour, the mixture was stirred overnight at room temperature. The reaction solution was added to 700 ml of methanol, and the precipitated solid was collected by filtration and further reslurried with 1000 ml of acetonitrile. The solid was dissolved in 100 ml of NMP, 0.89 g of phthalic anhydride was added, and the mixture was stirred at 50 ° C. for 1 hour. The reaction solution was added to 800 ml of methanol / 200 ml of water and dried to obtain 15.6 g of the desired product (resin P-31) as a white solid. When the obtained resin was analyzed by GPC, Mw = 0.90 × 10 ⁴ and Mw / Mn = 2.03. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-33]
In a 2000 mL flask equipped with a thermometer, stirrer and nitrogen inlet tube, 94.4 g of 2-ethyl-2-adamantanol and 250 ml of dry THF were added. The solution was added dropwise and stirred at 5 ° C. for 1 hour. To this, 70.0 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride and 280 g of NMP were added and stirred at room temperature for 2 hours and then at 40 ° C. for 1 hour. The mixture was allowed to cool, neutralized with 600 ml of 1M hydrochloric acid, extracted with 1000 ml of ethyl acetate, and the organic layer was washed successively with saturated brine twice and water twice. 500 ml of 1M NaOH was added, and the aqueous layer was extracted and washed with 300 ml of ethyl acetate. The aqueous layer was neutralized with 500 ml of 1M-hydrochloric acid and extracted with 500 ml of ethyl acetate, and the organic layer was washed successively with saturated brine twice and with water twice. The extract was dried over sodium sulfate and concentrated under reduced pressure to obtain 76.4 g of a dicarboxylic acid having the following structure.

15.00 g of this dicarboxylic acid was added to a 100 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 52.69 g of NMP was added and cooled, and diphenyl (2,3-dihydro-2-thioxo-3 was cooled below 0 ° C. -Benzoxazolyl) phosphonate (DBOP) 20.66 g, N, N-diisopropylethylamine 8.70 g, and trans-1,4-cyclohexanediamine 2.56 g were sequentially added. The mixture was stirred at 0 ° C. or lower for 1 hour and then stirred at room temperature for 4 hours. Subsequently, 0.67 g of phthalic anhydride was added and stirred at room temperature for 1 hour. The reaction solution was added to 1200 ml of methanol, and the precipitated solid was collected by filtration and reslurried with 1000 ml of methanol. The solid was dried to obtain 14.7 g of the desired product (resin P-33) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 0.82 × 10 ⁴ and Mw / Mn = 1.64. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-34]
The polyamic acid was synthesized in the same manner as P-1, and 142.3 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 70.38 g of NMP was added, and bromo at 0 ° C. or lower. 31.32 g of tert-butyl acetate and 16.60 g of N, N-diisopropylethylamine were added. After reacting at room temperature for 7 hours, the reaction solution was added to 1267 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 34.07 g of the desired product (resin P-34) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.38 × 10 ⁴ and Mw / Mn = 2.68. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-36]
In a 1000 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 25 g of bromoacetyl bromide and 475 g of dehydrated NMP were added, and 50 g of DBU was added while cooling. The mixture was cooled and 110.47 g of 1-ethylcyclopentanol was added at 10 ° C. or lower, and then reacted at room temperature for 4 hours. Add 600 ml of water, extract twice with 500 ml of ethyl acetate, wash the organic layer with saturated sodium bicarbonate solution twice and with water twice, dry the organic layer with magnesium sulfate and concentrate under reduced pressure. A brown oil having the following structure was obtained.

A polyamic acid was synthesized in the same manner as P-1, and 142.3 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 70.38 g of NMP was added. 37.76 g of halide and 16.60 g of N, N-diisopropylethylamine were added. After reacting at room temperature for 7 hours, the reaction solution was added to 1267 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 36.97 g of the desired product (resin P-36) as a brown solid. When the obtained resin was analyzed by GPC, Mw = 3.64 × 10 ⁴ and Mw / Mn = 2.51. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-39]
In a 2000 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube, 111.9 g of bromoacetyl bromide and 360 g of dehydrated NMP were added, and 50.7 g of DBU was added while cooling. At 10 ° C. or less, 40.0 g of 2-ethyl-2-adamantanol was added, and then reacted at room temperature for 4 hours. Add 600 ml of water, extract twice with 500 ml of ethyl acetate, wash the organic layer with saturated sodium bicarbonate solution twice and water twice, dry the organic layer with magnesium sulfate and concentrate under reduced pressure. As a result, a brown oil having the following structure was obtained.

Polyamic acid was synthesized in the same manner as P-1, and 133.10 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, 65.87 g of NMP was added, and the above was performed at 0 ° C. or lower. 36.46 g of halide and 15.65 g of N, N-diisopropylethylamine were added. After reacting at room temperature for 8 hours, the reaction solution was added to 1186 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 41.21 g of the desired product (resin P-39) as a brown solid. When the obtained resin was analyzed by GPC, it was Mw = 3.97 × 10 ⁴ and Mw / Mn = 2.59. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-41]
Synthesis of polyamic acid In a 5000 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 64,04 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed, and NMP (N-methyl-2- After dissolving in 2427.2 g of pyrrolidone), 275.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic acid anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. Subsequently, 89.29 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) was added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 27.69 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 1.88 × 10 ⁴ , Mn = 0.74 × 10 ⁴ , and Mw / Mn = 2.55.

Synthesis of polyamic acid ester 132.20 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 65.47 g of NMP was added and cooled, and 11.39 g of chloromethyl methyl ether at 0 ° C. or lower. Subsequently, 14.62 g of N, N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1178 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 25.9 g of the desired product (resin P-41) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.45 × 10 ⁴ and Mw / Mn = 1.68. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-42]
A polyamic acid was synthesized in the same manner as P-41. 132.20 g of this polyamic acid solution is added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 65.47 g of NMP is added and cooled, and below 3.degree. 6.09 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1178 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 18.8 g of the desired product (resin P-42) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.20 × 10 ⁴ and Mw / Mn = 1.58. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, and it was 52%.

[Synthesis of P-45]
A polyamic acid was synthesized in the same manner as P-41. 136.30 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 67.49 g of NMP was added and cooled. 14.39 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1215 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 32.1 g of the desired product (resin P-45) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.83 × 10 ⁴ and Mw / Mn = 1.76. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.

[Synthesis of P-47]
A polyamic acid was synthesized in the same manner as P-41. Add 146.80 g of this polyamic acid solution to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, add 72.69 g of NMP, cool it, and cool it to 0 ° C. or less, 22.28 g of chloromethylcyclohexyl ether, followed by N, 19.37 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1308 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 31.8 g of the desired product (resin P-47) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.50 × 10 ⁴ and Mw / Mn = 1.85. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-49]
A polyamic acid was synthesized in the same manner as P-41. 157.30 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 77.88 g of NMP was added and cooled. 8.30 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1402 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 26.19 g of the desired product (resin P-49) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.22 × 10 ⁴ and Mw / Mn = 1.94. The solid was dissolved in heavy DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 63%.

[Synthesis of P-50]
A polyamic acid was synthesized in the same manner as P-41. 132.20 g of this polyamic acid solution was added to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 65.47 g of NMP was added and cooled, and below 22.degree. 14.62 g of N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1178 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 26.1 g of the desired product (resin P-50) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.59 × 10 ⁴ and Mw / Mn = 1.83. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-52]
A polyamic acid was synthesized in the same manner as P-41. Add 117.51 g of this polyamic acid solution to a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, add 58.19 g of NMP, cool it, and cool it to 0 ° C. or less, 15.66 g of 2-methoxyethoxymethyl chloride, and then 13.00 g of N, N-diisopropylethylamine was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1047 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 20.5 g of the desired product (resin P-52) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 3.02 × 10 ⁴ and Mw / Mn = 1.59. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-55]
106.55 g of 2-chloroethyl vinyl ether was added to 385.86 g of a 28% sodium methoxide methanol solution and refluxed for 12 hours. 200 ml of hexane was added, and the solution was washed three times with saturated saline and then twice with water. The organic layer was dried over sodium sulfate and concentrated under reduced pressure to give (2-methoxyethyl) vinyl ether as a colorless transparent oil. Got.
Polyamic acid was synthesized in the same manner as P-41, and 88.13 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen inlet tube, 74.20 g of NMP was added, and 9.63 g of the vinyl ether was added. 0.73 g of 10-camphorsulfonic acid was sequentially added. After reacting at 25 ° C. for 5 hours, the reaction solution was added to 786 g of acetonitrile, and the precipitated solid was collected by filtration and dried to obtain 12.6 g of the desired product (resin P-55) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.96 × 10 ⁴ and Mw / Mn = 1.82. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.
[Synthesis of P-74]
In a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 5.61 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and trans-1,4-cyclohexane 4.27 g of diamine (manufactured by Iwatani Gas Co., Ltd.) was added and dissolved in 132.24 g of N-methyl-2-pyrrolidone, and then 6.40 g of pyromellitic anhydride and (1R, 2S, 7.06 g of 4S, 5R) -cyclohexanetetracarboxylic dianhydride (manufactured by Iwatani Gas Co., Ltd., PMDA-HS) was added. After reacting at 4 ° C. for 1 hour and then at 25 ° C. for 24 hours, 1.77 g of phthalic anhydride was added and stirred at room temperature for 2 hours. 77.79 g of NMP was added to this polyamic acid solution, and 20.469 g of (2-methoxyethyl) vinyl ether and 1.55 g of 10-camphorsulfonic acid were sequentially added. After reacting at 25 ° C. for 5 hours, the reaction solution was added to 1400 g of acetonitrile, and the precipitated solid was collected by filtration and dried to obtain 31.6 g of the desired product (resin P-74) as a white solid. When the obtained resin was analyzed by GPC, Mw = 3.26 × 10 ⁴ and Mw / Mn = 1.90. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-93]
Into a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 6.85 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed and dissolved in 182.71 g of N-methyl-2-pyrrolidone. After that, 13.45 g of (1R, 2S, 4S, 5R) -cyclohexanetetracarboxylic dianhydride (manufactured by Iwatani Gas Co., Ltd., PMDA-HS) was added at room temperature. The reaction was carried out at room temperature for 1 hour and then at 60 ° C. for 4 hours. When the obtained solution was analyzed by GPC, it was Mw = 5.53 × 10 ⁴ , Mn = 2.71 × 10 ⁴ , and Mw / Mn = 2.04. To this solution was added 0.89 g of phthalic anhydride, and the mixture was stirred at room temperature for 2 hours and then cooled. At 0 ° C. or lower, 15.22 g of chloromethyl methyl ether was added, followed by 19.54 g of N, N-diisopropylethylamine. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1218 g of methanol, and the precipitated solid was collected by filtration and dried to obtain 26.1 g of the desired product (resin P-93) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 6.26 × 10 ⁴ and Mw / Mn = 2.11. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of R3]
Synthesis of polyamic acid (polyimide precursor) 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) in a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube. 49 g was added and dissolved in 108.75 g of N-methyl-2-pyrrolidone, and then (1R, 2S, 4S, 5R) -cyclohexanetetracarboxylic dianhydride (Iwatani Gas Co., Ltd. PMDA-HS) 10.70 g was added. After reacting at 4 ° C. for 1 hour and then at 25 ° C. for 12 hours, 1.62 g of phthalic anhydride was added and stirred at room temperature for 2 hours. To this polyamic acid solution, 109 g of NMP was added and cooled, and 10.10 g of chloromethyl methyl ether was added at 0 ° C. or lower, followed by 12.97 g of N, N-diisopropylethylamine. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1500 ml of methanol, and the precipitated solid was collected by filtration and dried to obtain 22.3 g of the desired product (resin R3) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 1.93 × 10 ⁴ and Mw / Mn = 1.82. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-110]
In a 100 mL flask equipped with a thermometer, a stirrer and a calcium chloride tube, 48.0 g of 1,1,2-trimethoxyethane, 29.8 g of acetyl chloride and 10 mg of zinc chloride were added and reacted at room temperature for 8 hours. 76.3 g of the compound represented by b5-1) was obtained as a transparent liquid.

Polyamic acid was synthesized in the same manner as P-41, and 125.8 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 62.3 g of NMP was added and cooled to 0 ° C. or lower. Then, 17.71 g of N, N-diisopropylethylamine was added, followed by 27.69 g of the transparent liquid for the compound represented by the structure (b5-1). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1.2 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 22.71 g of the desired product (resin P-110) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.52 × 10 ⁴ and Mw / Mn = 1.91. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.
As a result of differential thermal balance analysis of the resin P-110, the endothermic peak top temperature was 206 ° C., and the weight loss rate was 34%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 206 ° C.

[Synthesis of P-111]
In a 500 mL flask equipped with a thermometer, stirrer, Dean Stark, and reflux tube, 1,0.02 g of 1,1,2-trimethoxyethane, 190.0 g of 2-methoxyethanol, 1.74 g of 10-camphorsulfonic acid, 200 mL of hexane And refluxed for 48 hours. The reaction solution was cooled to 0 ° C., 3.79 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes, and then extracted with ethyl acetate and saturated aqueous sodium hydrogen carbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and concentrated under reduced pressure to obtain 97.2 g of a transparent liquid.
After adding 97.2 g of the above solution, 43.0 g of acetyl chloride, and 10 mg of zinc chloride in a 300 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, the mixture was reacted at room temperature for 8 hours, and then concentrated under reduced pressure. 93.8 g of a compound represented by the structure (b5-2) was obtained as a transparent liquid.

Polyamic acid was synthesized in the same manner as P-41, and 125.8 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 62.3 g of NMP was added and cooled to 0 ° C. or lower. 16.60 g of N, N-diisopropylethylamine was added, followed by 33.07 g of the transparent liquid for the compound represented by the structure (b5-2). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1.5 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 23.86 g of the desired product (resin P-111) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.62 × 10 ⁴ and Mw / Mn = 1.62. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.
As a result of differential thermal balance analysis of the resin P-111, the endothermic peak top temperature was 210 ° C., and the weight reduction rate was 42%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 210 ° C.

[Synthesis of P-112]
In a 1 L flask equipped with a thermometer, stirrer, Dean Stark and reflux tube, 150.0 g of 1,1,2-trimethoxyethane, 379.5 g of 2-phenoxyethanol, 4.35 g of 10-camphorsulfonic acid, and 200 mL of hexane The mixture was refluxed for 48 hours. The reaction solution was cooled to 0 ° C., 9.47 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes, and then extracted with ethyl acetate and saturated aqueous sodium hydrogen carbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and then concentrated under reduced pressure to obtain 532.4 g of a transparent liquid.
In a 1 L flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 532.4 g of the above solution, 117.6 g of acetyl chloride and 10 mg of zinc chloride were added and reacted at room temperature for 4 hours, and then concentrated under reduced pressure. 518.2 g of a compound represented by the structure (b5-3) was obtained as a transparent liquid.

A polyamic acid was synthesized in the same manner as P-41, and 260.4 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 129.2 g of NMP was added and cooled to 0 ° C. or lower. N, N-diisopropylethylamine (36.55 g) was added, followed by 216.87 g of the transparent liquid for the compound represented by the structure (b5-3). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 68.68 g of the desired product (resin P-112) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.56 × 10 ⁴ and Mw / Mn = 1.85. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 97%.
As a result of differential thermal balance analysis of the resin P-112, the endothermic peak top temperature was 211 ° C., and the weight loss rate was 51%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 211 ° C.

[Synthesis of P-113]
In a 500 mL flask equipped with a thermometer, stirrer, Dean Stark, and reflux tube, add 50.0 g of 1,1,2-trimethoxyethane, 91.7 g of cyclohexanol, 1.45 g of 10-camphorsulfonic acid, and 200 mL of hexane. And refluxed for 48 hours. The reaction solution was cooled to 0 ° C., 3.16 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes, and then extracted with ethyl acetate and saturated aqueous sodium hydrogen carbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and then concentrated under reduced pressure to obtain 84.4 g of a transparent liquid.
In a 200 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 84.4 g of the above solution, 31.0 g of acetyl chloride and 10 mg of zinc chloride were added and reacted at room temperature for 4 hours, and then concentrated under reduced pressure. 91.2 g of a compound represented by the structure (b5-4) was obtained as a transparent liquid.

Polyamic acid was synthesized in the same manner as P-41, and 125.8 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 62.3 g of NMP was added and cooled to 0 ° C. or lower. N, N-diisopropylethylamine (16.60 g) was added, followed by 43.66 g of the clear liquid for the compound represented by the structure (b5-4). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1.5 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 26.40 g of the desired product (resin P-113) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.52 × 10 ⁴ and Mw / Mn = 1.64. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, and it was 88%.
When differential thermal balance analysis of the resin P-113 was performed, the endothermic peak top temperature was 177 ° C., and the weight loss rate was 46%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 177 ° C.

[Synthesis of P-114]
In a 500 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 50.0 g of isobutyraldehyde, 50.0 g of magnesium sulfate, 200 mL of methanol, and 1.61 g of 10-camphorsulfonic acid were added and reacted at 50 ° C. for 8 hours. . The reaction solution was cooled to 0 ° C., 3.51 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes. Magnesium sulfate was filtered, and the filtrate was extracted with hexane and saturated aqueous sodium bicarbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and concentrated under normal pressure to obtain 58.3 g of a transparent liquid.
In a 500 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 58.3 g of the above solution, 42.0 g of acetyl chloride, and 10 mg of zinc chloride were added and reacted at 50 ° C. for 24 hours, and represented by the following structure (b5-5) 81.0 g of the resulting compound was obtained as a clear liquid.

Polyamic acid was synthesized in the same manner as P-41, and 125.8 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 62.3 g of NMP was added and cooled to 0 ° C. or lower. Then, 22.14 g of N, N-diisopropylethylamine was added, followed by 33.16 g of the transparent liquid for the compound represented by the structure (b5-5). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1.5 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 20.12 g of the desired product (resin P-114) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.28 × 10 ⁴ and Mw / Mn = 1.74. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, and found to be 91%.
As a result of differential thermal balance analysis of the resin P-114, the endothermic peak top temperature was 163 ° C., and the weight reduction rate was 32%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 163 ° C.

[Synthesis of P-115]
In a 500 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 50.0 g of isobutyraldehyde, 77.8 g of magnesium sulfate, 158.3 g of 2-methoxyethanol, and 1.61 g of 10-camphorsulfonic acid were added, and at 50 ° C. The reaction was carried out for 10 hours. The reaction solution was cooled to 0 ° C., 3.51 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes. Magnesium sulfate was filtered, and the filtrate was extracted with ethyl acetate and saturated aqueous sodium hydrogen carbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and then concentrated under reduced pressure to obtain 105.9 g of a transparent liquid.
10500 g of the above solution and 48.3 g of acetyl chloride were added to a 500 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, reacted at room temperature for 4 hours, and then concentrated under reduced pressure, and the following structure (b5 111.1 g of the compound represented by −6) was obtained as a transparent liquid.

Polyamic acid was synthesized in the same manner as P-41, and 125.8 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 62.3 g of NMP was added and cooled to 0 ° C. or lower. Then, 22.14 g of N, N-diisopropylethylamine was added, followed by 35.80 g of the transparent liquid for the compound represented by the structure (b5-6). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1.5 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 19.76 g of the desired product (resin P-115) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.64 × 10 ⁴ and Mw / Mn = 1.62. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.
As a result of differential thermal balance analysis of the resin P-115, the endothermic peak top temperature was 164 ° C., and the weight loss rate was 42%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 164 ° C.

[Synthesis of P-118]
In a 1 L flask equipped with a thermometer, a stirrer and a calcium chloride tube, 120.0 g of 2-phenylpropionaldehyde, 120.0 g of magnesium sulfate, 600 mL of methanol, and 2.08 g of 10-camphorsulfonic acid were added, and the mixture was stirred at 50 ° C. for 11 hours. Reacted. The reaction solution was cooled to 0 ° C., 4.53 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes. Magnesium sulfate was filtered, and the filtrate was extracted with ethyl acetate and saturated aqueous sodium hydrogen carbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and then concentrated under reduced pressure to obtain 144.2 g of a transparent liquid.
After adding 144.2 g of the above solution and 84.2 g of acetyl chloride to a 1 L flask equipped with a thermometer, a stirrer, and a calcium chloride tube, the mixture was reacted at room temperature for 2 hours, then concentrated under reduced pressure, and the following structure (b5- 132.2 g of the compound represented by 9) was obtained as a transparent liquid.

A polyamic acid was synthesized in the same manner as P-41, and 250.0 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 124.0 g of NMP was added and cooled to 0 ° C. or lower. Then, 28.51 g of N, N-diisopropylethylamine was added, followed by 40.82 g of the transparent liquid for the compound represented by the structure (b5-9). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 2.7 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 66.54 g of the desired product (resin P-118) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.43 × 10 ⁴ and Mw / Mn = 2.13. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.
As a result of differential thermal balance analysis of the resin P-118, the endothermic peak top temperature was 165 ° C., and the weight loss rate was 44%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 165 ° C.

[Synthesis of P-120]
In a 300 mL flask equipped with a thermometer, stirrer, and calcium chloride tube, 59.8 g of 2-phenylpropionaldehyde, 50.0 g of magnesium sulfate, 101.8 g of 2-methoxyethanol, and 1.04 g of 10-camphorsulfonic acid were added, The reaction was carried out at 50 ° C. for 12 hours. The reaction solution was cooled to 0 ° C., 2.26 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes. Magnesium sulfate was filtered, and the filtrate was extracted with ethyl acetate and saturated aqueous sodium hydrogen carbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and concentrated under reduced pressure to obtain 91.6 g of a transparent liquid.
In a 300 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 91.6 g of the above solution and 42.0 g of acetyl chloride were added and reacted at room temperature for 2 hours, then concentrated under reduced pressure, and the following (b5-10) ) Was obtained as a transparent liquid.

Polyamic acid was synthesized in the same manner as P-41, and 125.0 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 62.0 g of NMP was added and cooled to 0 ° C. or lower. 16.45 g of N, N-diisopropylethylamine was added, followed by 68.97 g of the clear liquid for the compound represented by the structure (b5-10). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1.5 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 29.96 g of the desired product (resin P-120) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.44 × 10 ⁴ and Mw / Mn = 1.67. The solid was dissolved in deuterated DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 96%.
As a result of differential thermal balance analysis of the resin P-120, the endothermic peak top temperature was 162 ° C., and the weight loss rate was 50%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 162 ° C. Furthermore, an endothermic peak that was considered to be an imide ring closure at 198 ° C. was also observed.

[Synthesis of P-122]
In a 500 mL flask equipped with a thermometer, stirrer, and calcium chloride tube, 120.0 g of 2-phenylpropionaldehyde, 100.0 g of magnesium sulfate, 204.9 g of 2-propoxyethanol, and 2.08 g of 10-camphorsulfonic acid were added. The reaction was carried out at 50 ° C. for 12 hours. The reaction solution was cooled to 0 ° C., 4.53 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes. Magnesium sulfate was filtered, and the filtrate was extracted with ethyl acetate and saturated aqueous sodium hydrogen carbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and then concentrated under reduced pressure to obtain a transparent liquid.
In a 1 L flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 84.2 g of the above solution was added and reacted at room temperature for 2 hours. The mixture was then concentrated under reduced pressure, and the following structure (b5-11) As a transparent liquid, 211.7 g of a compound represented by the formula:

A polyamic acid was synthesized in the same manner as P-41, and 260.4 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 129.2 g of NMP was added and cooled to 0 ° C. or lower. N, N-diisopropylethylamine (36.55 g) was added, and then 173.21 g of the transparent liquid for the compound represented by the structure (b5-11) was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 64.02 g of the desired product (resin P-122) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.71 × 10 ⁴ and Mw / Mn = 1.82. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.
As a result of differential thermal balance analysis of the resin P-122, the endothermic peak top temperature was 163 ° C., and the weight reduction rate was 54%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 163 ° C. Furthermore, an endothermic peak that was considered to be imide ring closure at 206 ° C. was also observed.

[Synthesis of P-127]
In a 500 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 39.2 g of pivalaldehyde, 40.0 g of magnesium sulfate, 50 mL of methanol, 200 mL of hexane, and 1.06 g of 10-camphorsulfonic acid were added. Reacted for hours. The reaction solution was cooled to 0 ° C., 2.30 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes. Magnesium sulfate was filtered, and the filtrate was extracted with hexane and saturated aqueous sodium bicarbonate. The obtained organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and then concentrated under normal pressure to obtain 82.1 g of a transparent liquid.
In a 200 mL flask equipped with a thermometer, a stirrer, and a calcium chloride tube, 76.6 g of the above solution, 17.0 g of acetyl chloride and 10 mg of zinc chloride were added and reacted at 50 ° C. for 12 hours, and represented by the following structure (b5-14) 112.0 g of the resulting compound was obtained as a clear liquid.

Polyamic acid was synthesized in the same manner as P-41, and 125.8 g of this polyamic acid solution was added to a 300 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 62.3 g of NMP was added and cooled to 0 ° C. or lower. Then, 17.71 g of N, N-diisopropylethylamine was added, followed by 51.47 g of the transparent liquid for the compound represented by the structure (b5-14). After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 1.5 L of methanol, and the precipitated solid was collected by filtration and dried to obtain 15.27 g of the desired product (resin P-127) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.57 × 10 ⁴ and Mw / Mn = 1.57. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.
When differential thermal balance analysis of the resin P-127 was performed, the endothermic peak top temperature was 230 ° C., and the weight reduction rate was 37%. This weight reduction rate corresponds to the weight of R ^{3 in} the repeating unit represented by the general formula (1), and it can be seen that the thermal decomposition temperature of R ³ is 230 ° C.

[Synthesis of P-130]
Synthesis of polyamic acid 20.96 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed in a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and NMP (N-methyl-2- After dissolving in 628.8 g of pyrrolidone), 90.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. Subsequently, 27.27 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and 154.6 g of NMP were added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 3.63 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 2.44 × 10 ⁴ , Mn = 0.95 × 10 ⁴ , and Mw / Mn = 2.58.

Synthesis of polyamic acid ester 246.71 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, 122.87 g of NMP was added and cooled, and N, N-diisopropylethylamine 27 was added at 0 ° C. or lower. .96 g followed by 40.04 g of the liquid from (b5-9) synthesized on P-118. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 2.6 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 62.92 g of the desired product (resin P-130) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 3.33 × 10 ⁴ and Mw / Mn = 2.02. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.

[Synthesis of P-131]
Polyamic acid was synthesized in the same manner as P-130, and 246.71 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 122.87 g of NMP was added and cooled to 0 ° C. or lower. Was added 27.96 g of N, N-diisopropylethylamine, followed by 112.94 g of the liquid (b5-11) synthesized on P-122. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.1 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 70.16 g of the desired product (resin P-131) as a white solid. When the obtained resin was analyzed by GPC, Mw = 3.85 × 10 ⁴ and Mw / Mn = 1.90. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.

[Synthesis of P-132]
Synthesis of polyamic acid 20.96 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed in a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and NMP (N-methyl-2- After dissolving in 628.8 g of pyrrolidone), 90.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. Next, 25.98 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and 147.2 g of NMP were added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 1.81 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 3.04 * 10 < ⁴ >, Mn = 1.19 * 10 < ⁴ >, Mw / Mn = 2.55.

Synthesis of polyamic acid ester 243.92 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, NMP 121.72 g was added and cooled, and N, N-diisopropylethylamine 27 .41 g was added, followed by 39.25 g of the liquid from (b5-9) synthesized on P-118. After reacting at 0 ° C. or less for 4 hours, the reaction solution was added to 2.6 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 61.84 g of the desired product (resin P-132) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 4.12 × 10 ⁴ and Mw / Mn = 2.35. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-133]
Polyamic acid was synthesized in the same manner as P-132, and 243.92 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 121.72 g of NMP was added and cooled to 0 ° C. or lower. Then, 27.41 g of N, N-diisopropylethylamine was added, followed by 110.72 g of the liquid (b5-11) synthesized in P-122. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 71.19 g of the desired product (resin P-133) as a white solid. When the obtained resin was analyzed by GPC, Mw = 4.79 × 10 ⁴ and Mw / Mn = 1.98. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.

[Synthesis of P-134]
Synthesis of polyamic acid 10.48 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.), 2,2′-dimethyl-4,4 in a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube After putting 14.61 g of '-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and dissolving in 397.2 g of NMP (N-methyl-2-pyrrolidone), 3,3', 4,4'-biphenyltetracarboxylic 45.00 g of acid anhydride (Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 6 hours and allowed to cool to room temperature. 4.53 g of phthalic anhydride was added and stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 2.10 × 10 ⁴ , Mn = 0.76 × 10 ⁴ , and Mw / Mn = 2.77.

In a 1 L flask equipped with a thermometer, stirrer, and calcium chloride tube, 240.0 g of 2-phenylpropionaldehyde, 240.0 g of magnesium sulfate, 558.9 g of 2-propoxyethanol, p-toluenesulfonic acid monohydrate 17. 01g was added and it was made to react at room temperature for 12 hours. The reaction solution was cooled to 0 ° C., 45.25 g of triethylamine was added, and the mixture was stirred at 0 ° C. for 30 minutes. 500 mL of ethyl acetate was added, and 1 L of distilled water was added to completely dissolve magnesium sulfate. After liquid separation, the organic layer was washed with distilled water and saturated brine, dried over sodium sulfate, and concentrated under reduced pressure to obtain 657.8 g of a transparent liquid.
In a 1 L flask equipped with a thermometer, a stirrer and a calcium chloride tube, 652.8 g of the above liquid and 168.5 g of acetyl chloride were added and reacted at room temperature for 4 hours, and then concentrated under reduced pressure, (b5-11) 716.6 g of a clear liquid was obtained.

Synthesis of polyamic acid ester 251.63 g of a polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, 124.6 g of NMP was added and cooled, and N, N-diisopropylethylamine 28. 78 g was added, followed by 111.05 g of the liquid (b5-11) above. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.1 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 73.69 g of the desired product (resin P-134) as a white solid. When the obtained resin was analyzed by GPC, Mw = 3.21 × 10 ⁴ and Mw / Mn = 1.86. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.

[Synthesis of P-135]
Synthesis of polyamic acid 10.48 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.), 2,2′-dimethyl-4,4 in a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube 13.64 g of '-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) was added and dissolved in 391.7 g of NMP (N-methyl-2-pyrrolidone), and then 3,3', 4,4'-biphenyltetracarboxylic 45.00 g of acid anhydride (Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 6 hours and allowed to cool to room temperature. 1.81 g of phthalic anhydride was added and stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 3.46 × 10 ⁴ , Mn = 1.25 × 10 ⁴ , and Mw / Mn = 2.76.

Synthesis of polyamic acid ester 251.85 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and N5.412 g of NMP was added and cooled. .54 g, followed by 110.43 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.1 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 74.57 g of the desired product (resin P-135) as a white solid. When the obtained resin was analyzed by GPC, Mw = 5.49 × 10 ⁴ and Mw / Mn = 2.02. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.

[Synthesis of P-136]
Synthesis of polyamic acid 10.48 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.), 2,2′-dimethyl-4,4 in a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube 13.31 g of '-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) was added and dissolved in 389.8 g of NMP (N-methyl-2-pyrrolidone), and then 3,3', 4,4'-biphenyltetracarboxylic 45.00 g of acid anhydride (Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 6 hours and allowed to cool to room temperature. 0.91 g of phthalic anhydride was added and stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 5.71 × 10 ⁴ , Mn = 2.07 × 10 ⁴ , and Mw / Mn = 2.76.

Synthesis of polyamic acid ester 255.29 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 127.4 g of NMP was added and cooled. .84 g, followed by 111.57 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.1 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 78.88 g of the desired product (resin P-136) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 8.58 × 10 ⁴ and Mw / Mn = 2.09. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-138]
Synthesis of polyamic acid 6.99 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed in a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and NMP (N-methyl-2- After dissolving in 294.6 g of pyrrolidone), 45.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. Next, 20.78 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and 117.8 g of NMP were added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 3.63 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 1.82 × 10 ⁴ , Mn = 0.71 × 10 ⁴ , and Mw / Mn = 2.55.

Synthesis of polyamic acid ester 260.66 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer and a nitrogen introducing tube, 129.4 g of NMP was added and cooled, and N, N-diisopropylethylamine 28 .51 g followed by 110.22 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.2 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 72.98 g of the desired product (resin P-138) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.76 × 10 ⁴ and Mw / Mn = 1.79. The solid was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 99%.

[Synthesis of P-139]
Synthesis of polyamic acid In a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, 8.73 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed, and NMP (N-methyl-2- After dissolving in 304.5 g of pyrrolidone), 45.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. Next, 17.53 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and 99.4 g of NMP were added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 3.63 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, Mw = 1.68 × 10 ⁴ , Mn = 0.65 × 10 ⁴ , and Mw / Mn = 2.58.

Synthesis of polyamic acid ester 255.32 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, and 126.7 g of NMP was added and cooled. .51 g followed by 110.22 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.2 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 71.56 g of a white solid target product (Resin P-139). When the obtained resin was analyzed by GPC, Mw = 2.67 × 10 ⁴ and Mw / Mn = 1.78. The solid was dissolved in heavy DMSO, ¹ H-NMR spectrum was measured, and the protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, and it was 98%.

[Synthesis of P-141]
Synthesis of polyamic acid 13.04 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed in a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and NMP (N-methyl-2- After dissolving in 345.9 g of pyrrolidone), 48.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. Next, 11.78 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and 66.7 g of NMP were added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 3.87 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 1.54 × 10 ⁴ , Mn = 0.53 × 10 ⁴ , and Mw / Mn = 2.89.

Synthesis of polyamic acid ester 254.85 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, 126.4 g of NMP was added and cooled, and N, N-diisopropylethylamine 29 was added at 0 ° C. or lower. .69 g followed by 114.82 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.2 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 73.07 g of the desired product (resin P-141) as a white solid. When the obtained resin was analyzed by GPC, Mw = 2.52 × 10 ⁴ and Mw / Mn = 1.76. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-142]
Synthesis of polyamic acid 15.21 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed in a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and NMP (N-methyl-2- After dissolving in 363.9 g of pyrrolidone), 49.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic acid anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. Next, 8.49 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and 48.1 g of NMP were added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 3.95 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 1.56 × 10 ⁴ , Mn = 0.52 × 10 ⁴ , and Mw / Mn = 2.99.

Synthesis of polyamic acid ester 249.29 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, NMP 123.6 g was added and cooled, and N, N-diisopropylethylamine 29 .69 g followed by 114.82 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.2 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 73.21 g of the desired product (resin P-142) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.65 × 10 ⁴ and Mw / Mn = 1.78. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-143]
Synthesis of polyamic acid In a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 17.47 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed, and NMP (N-methyl-2- After dissolving in 382.3 g of pyrrolidone), 50.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic acid anhydride (manufactured by Mitsubishi Chemical Corporation) was added. The mixture was stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. Subsequently, 2,5′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) (5.05 g) and NMP (28.6 g) were added, and the mixture was stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 4.03 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, Mw = 1.54 × 10 ⁴ , Mn = 0.41 × 10 ⁴ , and Mw / Mn = 3.73.

Synthesis of polyamic acid ester 243.73 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introducing tube, 120.9 g of NMP was added and cooled, and N, N-diisopropylethylamine 29 was added at 0 ° C. or lower. .69 g followed by 114.57 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.2 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 72.50 g of the desired product (resin P-143) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.68 × 10 ⁴ and Mw / Mn = 1.80. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-144]
Synthesis of polyamic acid 10.48 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) was placed in a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and NMP (N-methyl-2- Pyrrolidone) was dissolved in 314.4 g. The mixture was heated to 70 ° C., 15.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (Mitsubishi Chemical Corporation) was added, and the mixture was stirred at 70 ° C. for 15 minutes. Further, 15.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride was added and stirred at 70 ° C. for 15 minutes. Further, 15.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride was added, stirred at 60 ° C. for 4 hours, and allowed to cool to room temperature. Next, 14.29 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and 81.0 g of NMP were added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 3.63 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 1.50 × 10 ⁴ , Mn = 0.60 × 10 ⁴ , and Mw / Mn = 2.50.

Synthesis of polyamic acid ester 249.999 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 124.0 g of NMP was added and cooled, and N, N-diisopropylethylamine 28 .51 g followed by 107.22 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.1 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 72.20 g of the desired product (resin P-144) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 2.39 × 10 ⁴ and Mw / Mn = 1.76. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-145]
Synthesis of polyamic acid 45.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (manufactured by Mitsubishi Chemical Corporation), NMP (in a 500 mL flask equipped with a thermometer, a stirrer and a nitrogen introduction tube) N-methyl-2-pyrrolidone) 234.4 g was added and heated to 70 ° C. with stirring. A solution prepared by dissolving 10.48 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) in 80 g of NMP was added dropwise to the flask over 30 minutes, then stirred at 60 ° C. for 4 hours and allowed to cool to room temperature. . Next, 14.29 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) and 81.0 g of NMP were added and stirred at 60 ° C. for 2 hours. The mixture was allowed to cool to room temperature, 3.63 g of phthalic anhydride was added, and the mixture was stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 1.21 × 10 ⁴ , Mn = 0.47 × 10 ⁴ , and Mw / Mn = 2.58.

Synthesis of polyamic acid ester 249.999 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 124.0 g of NMP was added and cooled, and N, N-diisopropylethylamine 28 .51 g followed by 107.22 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.1 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 67.95 g of the desired product (resin P-145) as a white solid. When the obtained resin was analyzed by GPC, it was Mw = 1.94 × 10 ⁴ and Mw / Mn = 1.69. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

[Synthesis of P-146]
Synthesis of polyamic acid In a 500 mL flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, 35.00 g of 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (manufactured by Mitsubishi Chemical Corporation), NMP ( N-methyl-2-pyrrolidone) (265.3 g) was added and heated to 70 ° C. with stirring. 10.48 g of trans-1,4-cyclohexanediamine (manufactured by Iwatani Gas Co., Ltd.) and 14.29 g of 2,2′-dimethyl-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Co., Ltd.) were dissolved in 130 g of NMP. The solution was added dropwise to the flask over 30 minutes, stirred at 60 ° C. for 6 hours, and allowed to cool to room temperature. Subsequently, 3.63 g of phthalic anhydride was added and stirred at room temperature for 10 hours to obtain a slightly brown transparent polyamic acid solution. When the obtained solution was analyzed by GPC, it was Mw = 2.26 × 10 ⁴ , Mn = 0.85 × 10 ⁴ , and Mw / Mn = 2.65.

Synthesis of polyamic acid ester 249.999 g of this polyamic acid solution was added to a 1 L flask equipped with a thermometer, a stirrer, and a nitrogen introduction tube, and 124.0 g of NMP was added and cooled, and N, N-diisopropylethylamine 28 .51 g followed by 107.22 g of the liquid (b5-11) synthesized on P-134 was added. After reacting at 0 ° C. or lower for 4 hours, the reaction solution was added to 3.1 L of isopropanol, and the precipitated solid was collected by filtration and dried to obtain 72.30 g of the desired product (resin P-146) as a white solid. When the obtained resin was analyzed by GPC, Mw = 3.75 × 10 ⁴ and Mw / Mn = 1.93. The solid was dissolved in heavy DMSO, and the ¹ H-NMR spectrum was measured. The protection ratio was calculated from the peak integral ratio of the carboxylic acid ester to the carboxylic acid, which was 100%.

Other resins were synthesized in the same manner. A monomer structure derived from the tetravalent organic group R ¹ peripheral structure of these synthesized resins, a diamine monomer around the divalent organic group R ² , a monomer forming the R ¹ peripheral structure, and a diamine monomer around the R ² Charge molar ratio, groups that decompose by the action of an acid on R ³ to generate alkali-soluble groups (in the case of combined use, the respective molar ratios), protection rate of carboxyl groups by the groups, end-capping agent, synthesis method, mass The average molecular weight and dispersity (Mw / Mn) were as shown in Tables 1 to 4 below.

The abbreviations in the table are shown below.

[Preparation of photosensitive resin composition]
The components shown in the table below are dissolved in the solvent shown in the table, the total solid content concentration is 25% by mass, and the mixture is filtered through a cassette filter made of polytetrafluoroethylene having a pore size of 0.1 μm to prepare a photosensitive resin composition. did. In the table, the solid content of each component is expressed as mass%.

<Stability over time of photosensitive resin composition>
After aging the photosensitive resin composition of Example 110 at room temperature for 4 weeks, the solution of the composition was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the imidation ratio was calculated from the peak integral value of amide NH. As a result, it was 32% imidized. After aging the photosensitive resin composition of Example 122 for 4 weeks at room temperature, the solution of the composition was dissolved in deuterated DMSO, ¹ H-NMR spectrum was measured, and the imidation ratio was calculated from the peak integral value of amide NH. As a result, the imidation ratio was less than 1%.
When the photosensitive resin composition of Example 114 was aged for 4 weeks at room temperature, a decrease in viscosity was observed. Further, when the acid value of the photosensitive resin composition was measured, a decrease in the acid value was also observed, and the decomposition of the acid-decomposable group including the structure represented by (a5-5) of the resin P-114 partially progressed. Was. When the photosensitive resin composition of Example 122 was aged at room temperature for 4 weeks, no decrease in viscosity or acid value was observed.

(Image performance evaluation)
The prepared photosensitive resin composition was spin-coated on a 4 inch silicon wafer and pre-dried at 120 ° C. for 3 minutes on a hot plate to obtain a film having a thickness of 5.0 μm. Next, pattern exposure was performed using an i-line stepper exposure apparatus FPA-3000i5 + (manufactured by Canon, Inc.) using a 1-30 μm via hole repeating pattern mask. Subsequently, it was heated at 120 ° C. for 3 minutes, subjected to paddle development with a 2.38 mass% TMAH aqueous solution, and rinsed with pure water. Thereafter, heating was performed on a hot plate at 100 ° C. for 2 minutes.

<Resolution>
The obtained pattern film was observed with a length measuring SEM (Hitachi Ltd. S-8840), and the resolved via hole had a minimum dimension of less than 3 μm A, 3 μm to 5 μm B, 5 μm to 10 μm C 10 μm or more was designated as D.

<Sensitivity>
The obtained pattern film was observed with a length measurement SEM (Hitachi, Ltd. S-8840), and the exposure amount obtained by resolving the via hole having the smallest dimension was defined as sensitivity. A less than 250 mJ / cm ² was A, 250 mJ / cm ² or more. 500 mJ / cm ² less than the B, 500mJ / cm ² or more 750 mJ / cm ² less than the C, and 750 mJ / cm ² or more was D.

(Membrane property evaluation)
The prepared photosensitive resin composition was spin-coated on a 4 inch silicon wafer and pre-dried at 120 ° C. for 3 minutes on a hot plate to obtain a film having a thickness of 5.0 μm. Subsequently, the polyimide film was obtained by heat curing at 250 ° C. for 60 minutes under nitrogen.
<Stress>
The cured film was measured for stress at 25 ° C. with a thin film stress measuring device (FLX-2320, manufactured by Tencor). A smaller stress value means a smaller amount of wafer warpage.
In the following table, the numerical value in parentheses when using a solvent together represents a mass ratio.

Abbreviations in the table are shown below.
[Acid generator]

[Sensitizer]

[Thermal acid generator]

[Basic compounds]
DIA: 2,6-diisopropylaniline PEA: N-phenyldiethanolamine DBU: 1,8-diazabicyclo [5.4.0] undec-7-ene EOA: amine having the following structure

[Surfactant]
F176: Megafuck F176 (manufactured by Dainippon Ink & Chemicals, Inc.)
F475: Megafuck F-475 (Dainippon Ink Chemical Co., Ltd.)
PF6320: (made by OMNOVA, fluorine type)
BYK307: (Bic Chemie)

[Adhesion promoter]
GPTMS: 3-glycidyloxypropyltrimethoxysilane MAPTMS: 3-methacryloxypropyltrimethoxysilane TESPEC: triethoxysilylpropyl ethyl carbamate [solvent]
GBL: γ-butyrolactone NMP: N-methylpyrrolidone CX: cyclohexanone CP: cycloheptanone DMI: 1,3-dimethyl-2-imidazolidinone [polymerizable compound]
DPHA: Dipentaerythritol hexaacrylate

As is apparent from the results shown in Tables 5 to 8, Comparative Example 1 having an acid-decomposable group as R ³ in the general formula (1) but not having an alicyclic group as R ² has a solubility in an alkali developer. It can be seen that sufficient results cannot be obtained with respect to image performance such as resolution and sensitivity. It can also be seen that the wafer is warped due to the large stress.
Comparative Example 2 having an alicyclic group as R ² but not having an acid-decomposable group as R ³ does not reveal even a latent image, and gives satisfactory results for image performance such as resolution and sensitivity. I can't understand. It can also be seen that the wafer is warped due to the large stress.
In Comparative Example 3 having an acid-decomposable group as R ³ in the general formula (1) but not having an alicyclic group as R ² , the image performance such as resolution and sensitivity is relatively good, but the stress is large. It can be seen that wafer warpage can occur.
On the other hand, Examples 1 to 146 using the resin (a) satisfying the requirement of the general formula (1) are excellent in image performance such as resolution and sensitivity, have small stress, and can suppress the occurrence of wafer warpage. .

According to the present invention, it can be suitably used as a surface protective film for semiconductor devices, an interlayer insulating film, an interlayer insulating film for display devices, has lithography performance with excellent resolution and sensitivity, and has low stress in low-temperature curing. Provided are a relief pattern forming material, a photosensitive film, a polyimide film, a cured relief pattern, a manufacturing method thereof, and a semiconductor device including the cured relief pattern, which have excellent characteristics and can form a cured relief pattern that prevents warpage of the wafer. can do.

Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on a Japanese patent application filed on July 29, 2011 (Japanese Patent Application No. 2011-167622) and a Japanese patent application filed on March 23, 2012 (Japanese Patent Application No. 2012-068197). Incorporated herein by reference.

Claims

(A) A photosensitive resin composition comprising a resin having a repeating unit represented by the following general formula (1), and (b) a compound that generates an acid upon irradiation with actinic rays or radiation.

In the general formula (1),
R 1 represents a tetravalent organic group. Several R < 1 > may mutually be same or different.
R 2 represents a divalent organic group. A plurality of R 2 may being the same or different.
However, at least one of the plurality of R 2 is a divalent organic group having an alicyclic group.
R 3 each independently represents a hydrogen atom or an organic group.
However, at least one of the plurality of —CO 2 R 3 is a group that decomposes by the action of an acid to generate an alkali-soluble group.
Resin in which the resin (a) having a repeating unit represented by the general formula (1) has a repeating unit represented by the following general formula (2) and a repeating unit represented by the following general formula (3) The photosensitive resin composition according to claim 1, wherein

In the general formula (2),
R 1 'has the same meaning as R 1 in the general formula (1).
R 3 'has the same meaning as R 3 in Formula (1).
However, at least one of the plurality of —CO 2 R 3 ′ is a group that decomposes by the action of an acid to generate an alkali-soluble group.
R 4 is a divalent organic group having an alicyclic group.
In the general formula (3),
R 1 "has the same meaning as R 1 in the general formula (1).
R 3 "has the same meaning as R 3 in Formula (1).
However, at least one of the plurality of —CO 2 R 3 ″ is a group that decomposes by the action of an acid to generate an alkali-soluble group.
R 5 is a divalent organic group different from R 4 .
Wherein R 5 in the general formula (3) is a divalent group having an aromatic group, the photosensitive resin composition of claim 2.
Formula R 5 in (3) is a divalent group represented by any one of the following formulas, the photosensitive resin composition of claim 3.

In the above formula, at least one hydrogen atom of each aromatic ring is independently selected from the group consisting of fluorine atom, chlorine atom, bromine atom, methyl group, methoxy group, cyano group, phenyl group and trifluoromethyl group. It may be substituted by a species atom or group.
The thermal decomposition temperature of —CO 2 R 3 in the general formula (1), —CO 2 R 3 ′ in the general formula (2) or —CO 2 R 3 ″ in the general formula (3) is 100 to 220 ° C. The photosensitive resin composition according to any one of claims 1 to 4.
-CO 2 R 3 in the general formula (1), decomposing the alkali-soluble by an acid action of the -CO 2 R 3 "in -CO 2 R 3 'or the general formula (3) in the general formula (2) 6. The photosensitive resin composition according to claim 1, wherein the group that generates a group is an ester group in which a hydrogen atom of a carboxyl group is substituted with a group represented by the following general formula (III): .

In the above general formula,
Ra represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group.
Rb represents a single bond or a divalent linking group.
Q represents an alkyl group, an alicyclic group which may contain a hetero atom, or an aromatic ring group which may contain a hetero atom.
At least two of Ra, Rb and Q may be bonded to each other to form a ring.
The photosensitive resin composition according to claim 6, wherein Ra in the general formula (III) is a group represented by the following general formula (IV) or (V).

In the above general formula,
Rc, Rd, Re, Rf and Rg each independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group or a halogen atom. Rc and Rd may be bonded to each other to form a ring, or at least two of Re, Rf and Rg may be bonded to each other to form a ring.
At least one of Rc and Rd in the general formula (IV) is a cycloalkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkoxycarbonyl group, an aryloxycarbonyl group, a cyano group, or a halogen atom. Item 8. The photosensitive resin composition according to Item 7.
The photosensitive resin composition according to claim 8, wherein at least one of Rc and Rd in the general formula (IV) is an aryl group.
The photosensitive resin composition according to claim 6, wherein at least one of Ra, Rb and Q in the general formula (III) is an electron-withdrawing group or a group having an electron-withdrawing group.
The photosensitive resin composition according to claim 1, wherein R 1 in the general formula (1) is a tetravalent linking group having a monocyclic or condensed polycyclic aliphatic group or aromatic group.
The R 2 in the general formula (1) is a divalent group having an alicyclic group, a divalent group having an aromatic group, or a divalent group containing a silicon atom. Photosensitive resin composition.
The photosensitive resin composition according to any one of claims 1 to 12, wherein the resin (a) has a mass average molecular weight of 200,000 or less.
The photosensitive resin composition according to any one of claims 1 to 13, further comprising (c) a basic compound.
The photosensitive resin composition according to any one of claims 1 to 14, wherein the compound (b) is an oxime compound.
The photosensitive resin composition according to any one of claims 1 to 15, further comprising (f) an adhesion promoter.
The photosensitive resin composition according to any one of claims 1 to 16, which is for positive development.
A pattern forming material, which is the photosensitive resin composition according to any one of claims 1 to 16.
A photosensitive film formed from the photosensitive resin composition according to any one of claims 1 to 16.
A polyimide film obtained by heat-treating the photosensitive resin composition according to any one of claims 1 to 16.
(A) forming the photosensitive film according to claim 19 on a substrate;
(A) a step of exposing the photosensitive film with actinic rays or radiation;
(C) A process for developing the photosensitive film so as to remove the exposed portion with an aqueous alkaline developer, and (d) a method for producing a cured relief pattern comprising a step of heat-treating the obtained relief pattern.
A cured relief pattern obtained by the production method according to claim 21.
A semiconductor device comprising the cured relief pattern according to claim 22.
Resin which has a repeating unit represented by following General formula (1).

In the general formula (1),
R 1 represents a tetravalent organic group. Several R < 1 > may mutually be same or different.
R 2 represents a divalent organic group. A plurality of R 2 may being the same or different.
However, at least one of the plurality of R 2 is a divalent organic group having an alicyclic group.
R 3 each independently represents a hydrogen atom or an organic group.
However, at least one of the plurality of —CO 2 R 3 is a group that decomposes by the action of an acid to generate an alkali-soluble group.