WO2013016779A1 - Procédés, systèmes et compositions de polissage - Google Patents

Procédés, systèmes et compositions de polissage Download PDF

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Publication number
WO2013016779A1
WO2013016779A1 PCT/AU2012/000930 AU2012000930W WO2013016779A1 WO 2013016779 A1 WO2013016779 A1 WO 2013016779A1 AU 2012000930 W AU2012000930 W AU 2012000930W WO 2013016779 A1 WO2013016779 A1 WO 2013016779A1
Authority
WO
WIPO (PCT)
Prior art keywords
shear
thickening fluid
fluid
article
viscosity
Prior art date
Application number
PCT/AU2012/000930
Other languages
English (en)
Inventor
Li CHANG
Klaus Friedrich
Lin Ye
Original Assignee
The University Of Sydney
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AU2011903111A external-priority patent/AU2011903111A0/en
Application filed by The University Of Sydney filed Critical The University Of Sydney
Publication of WO2013016779A1 publication Critical patent/WO2013016779A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Definitions

  • the present invention relates generally to methods, systems and compositions for polishing, and more specifically to such polishing methods, systems and compositions based on the phase transition of shear thickening fluids.
  • the process includes one or more polishing steps in which a polishing pad of a suitable material is applied against the surface to be treated, with a combination of relative motion and pressure (see Figure 1 ).
  • a mechanical polishing formulation usually in slurry form, is typically interspersed between the polishing pad and the surface to be treated.
  • pressure is applied in conjunction with a polishing motion, the polishing formulation carried in the slurry can cut, grind, and/or polish the surface to the desired topography or degree of smoothness.
  • known processes of this type suffer from several disadvantages.
  • this polishing process cannot usually be used to simultaneously polish a number of surfaces of an article, where those surfaces have different heights and/or orientations, or where the surfaces are curved in complex ways.
  • the prior art systems and processes cannot typically be used to polish the interior surfaces of hollow components, particularly where more complex internal shapes or curvatures are involved.
  • a trained technician, a highly customized machine and/or an elaborate setup procedure is typically required for each type or shape of component, which adds considerably to the capital and/or labour cost.
  • Another problem relates to wear of the polishing pads, which typically require regular inspection and replacement, resulting in additional downtime and maintenance costs.
  • CMP chemical-mechanical planarization
  • This process uses an abrasive and corrosive chemical in conjunction with a polishing pad.
  • the pad and wafer are pressed together by a dynamic polishing head which is rotated with a different axis of rotation compared to the wafer.
  • This removes material and tends to even out any irregular surface topography, making the wafer substantially flat or planar.
  • the process of material removal is not simply that of abrasive scraping. Rather, the chemicals in the slurry also react with and/or weaken the material to be removed. The abrasive accelerates this weakening process and the polishing pad simultaneously helps to wipe the reacted materials from the polished surface.
  • Vapour polishing is another method of polishing used to reduce surface roughness or improve clarity. Typically, in this process, a component is exposed to a chemical vapour causing the surface to flow, thereby improving the surface finish. This method of polishing is frequently used to return transparent materials to an optical quality finish after machining, and the process can also work well in relation to the internal features of components.
  • Fluid jet polishing is yet another method of contouring and polishing a surface, by aiming a jet of slurry at a component and eroding the surface to create the desired shape.
  • this process suffers several disadvantages, such as the overall complexity and the need for a motion system, which is usually computer controlled, to direct the fluid nozzle and optimize the dwell time of the tool pattern on the surface of the component to be polished, in order to achieve the desired final surface topography.
  • the invention provides a method for polishing an article, said method including the steps of bringing the article into contact with an abrasive shear-thickening fluid, and causing sufficient relative movement of said article with respect to said abrasive shear-thickening fluid to simultaneously shear- thicken said fluid and polish said article.
  • the shear-thickening fluid is relatively viscous or thick during said relative movement but relatively fluid at other times.
  • the shear-thickened fluid is in a substantially solid state.
  • the fluid preferably has a viscosity of greater than 50, 100, 250, 500, 1000 or 10,000 Pa.s respectively.
  • the shear-thickening fluid is caused to become sufficiently solid during the relative movement to provide a substantially solid or sufficiently firm support for the abrasive particles suspended therein to abrade or wear the surface of the article with which the shear-thickened fluid is in contact.
  • the relative movement is specifically adapted to apply a high level of shear to the shear- thickening fluid.
  • This relative movement can include rotational, translational, orbital, reciprocating or randomised motion, or any suitable combination of these or other forms of relative movement.
  • the critical shear rate being the sheer rate at which shear thickening substantially begins, can vary across a wide range, depending upon the specific composition of the fluid, the relative proportion of suspended solids, temperature and other process variables.
  • the shear-thickening fluid is selected, designed or formulated to exhibit a critical shear rate of between 2 and around 200 s-1 , and more preferably in some embodiments between 5 and around 50 S-1. [0011] It will be appreciated that to polish a lowermost surface of the article, the lowermost surface will need to be in contact with the fluid.
  • the article may be at least partially immersed into the shear-thickening fluid to a sufficient depth to cover the surfaces requiring polishing.
  • the article comprises surfaces at different heights or orientations, and/or curved surfaces.
  • the shear-thickening fluid comprises a suspension of polymeric particles in a fluid, such as ethylene glycol.
  • a fluid such as ethylene glycol
  • the polymeric particles comprise a solid volume fraction of between 20% and around 80% and more preferably between 30% and around 70% of the ethylene glycol.
  • the shear thickening fluid preferably includes at least 50% by volume of particulates in suspension. It should be appreciated, however, that the optimal proportion will depend upon a number of process variables including the specific composition of the liquid and solid components, the shape a d material composition of the component to be polished, the desired surface finish, the required rate of polishing, and the like.
  • the shear-thickening fluid comprises a base fluid having a sufficient concentration of particles suspended therein such that the resulting composition acts as a shear-thickening fluid, and wherein the suspended particles are themselves abrasive particles, for example, silica or SiC particles suspended in ethylene glycol.
  • the suspended particles are themselves abrasive particles, for example, silica or SiC particles suspended in ethylene glycol.
  • micro-sized or nano-sized abrasive particles in relatively high concentrations in the base fluid can cause the suspension to act as a shear-thickening fluid and also synergistically provide the desired abrasive effect.
  • the particles suspended in the base fluid confer, at least to some extent, both shear-thickening and abrasive properties.
  • the shear-thickening characteristics and the abrasive characteristics the fluid may be conferred by different constituent components are fluid.
  • the volume content of the abrasive suspended in the base fluid is greater than 50 % (v/v). In some embodiments, preferably, the volume content of the abrasive suspended in the base fluid is, respectively, less than or equal to around 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, or 90% (v/v).
  • the particles of the abrasive are predominantly nano-sized, i.e. between 1 and around 100 nm.
  • the particle size is respectively greater than 1 , 10, 20, 30, 40, 50, 60, 70, 80 and 90, and less than 100 nm.
  • the particles of the abrasive are predominantly micro-sized, i.e. between 0.1 and around 2000 micron, for example in respective embodiments less than 1 , 25, 50, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1500 or 2000 micron.
  • the abrasive is a mixture of nano-sized and micro-sized abrasive particles.
  • the abrasive particle is SiC.
  • those skilled in the art will appreciate that other materials and material combinations will be suitable for use in the present invention.
  • the size, shape, and/or volume content of the abrasive particles suspended in the base fluid is chosen such that the viscosity transition at the critical shear rate involves at least a fourfold increase in viscosity.
  • the viscosity transition involves an increase of between 6 and around 12 times the viscosity at low shear rate.
  • the increase in viscosity is at least one order of magnitude. In other preferred embodiments, the viscosity increase is greater than two, three, four and five orders of magnitude respectively.
  • use of relatively large abrasive particles suspended in the fluid means that the particles do not 'pack' particularly well in the fluid, and the viscosity transition at the critical shear rate is relatively low.
  • use of micro-sized, and preferably nano-sized particles provides significantly improved particle packing and particle distribution in the fluid suspension, and gives a relatively sharp viscosity transition at the critical shear rate, meaning a sudden and substantial or "quantum" viscosity increase of at least several multiples and up to several orders of magnitude, relative to the initial viscosity at zero or relatively low shear rates.
  • micro-sized or nano-sized particles are preferred since they provide a relatively sharp viscosity transition at the critical shear rate, and by selection of suitable materials, are also capable of abrasion of the article being polished.
  • the micro-sized or nano-sized abrasive particles are surface treated to control or minimise agglomeration of the abrasive particles. It has been surprisingly found that use of micro-sized or nano-sized particles enhances shear-thickening behaviour while synergistically interacting with one another and with the base fluid to provide an effective polishing medium.
  • micro-sized or nano-sized abrasive particles are particularly useful for fine polishing of articles of high value, such as jewellery, or for polishing complex shapes ranging from intricate mechanical components to artificial teeth.
  • a controller is preferably employed to detect the resistance to relative movement of the article with respect to the shear-thickening fluid.
  • the controller is preferably further adapted to slow down, speed up or otherwise modify the relative movement in order to optimally control the viscosity of the shear-thickening fluid.
  • the controller is adapted to maintain a substantially constant viscosity during relative movement.
  • the controller may be adapted to control the relative movement such that the viscosity is changed over time according to a predetermined viscosity vs time profile.
  • the controller may be adapted to control the relative movement such that the viscosity is initially relatively low, to effect a relatively mild degree of polishing in a first phase, and then the viscosity is changed over time such that the final degree of polish is relatively coarse or 'severe', or vice versa.
  • the controller includes a sensor adapted to generate a control signal indicative of the surface finish or typography of the article or component being polished, and a feedback loop whereby the controller, in response to that control signal and/or other control inputs, is adapted to progressively regulate the relative motion, the fluid viscosity or other system parameters until a desired or. predetermined surface finish or surface topography has been obtained.
  • the invention provides a composition for polishing an article, said composition comprising an abrasive shear-thickening fluid exhibiting a relatively sharp viscosity transition at a critical shear rate.
  • the invention provides a method for controlling a degree of polish of an article in contact with an abrasive shear-thickening fluid, said method comprising the step of controlling the speed of relative movement of said article with respect to said shear-thickening fluid thereby to control the viscosity of said shear-thickening fluid and hence the degree of polish.
  • the present invention provides a system for polishing an article, said system comprising:
  • a controller for controlling the speed of relative movement of said article with respect to said shear-thickening fluid
  • Prior art polishing methods typically require a plurality of polishing steps to achieve a desired degree of polish, with the number of polishing steps increasing significantly in. order to achieve or approach a mirror finish. For example, 2, 4 or 6 polishing steps requiring different sized abrasive particles is common in the industry.
  • the present invention substantially ameliorates this requirement, since the degree of abrasion is dependent upon the speed of relative movement of the article to be polished and the shear-thickening fluid, and/or the viscosity of the shear-thickening fluid. It will be appreciated that one influences the other, i.e. the greater the relative speed of movement the greater the viscosity. Therefore, the present invention provides a significant advance over prior art methods, since only a single shear- thickening fluid/abrasive particle composition may be required to polish an article to a coarse polish, a mirror finish, or any desired finish in between.
  • a dilatant material is synonymous with a shear- thickening material.
  • a dilatant is a material in which viscosity increases with the rate of shear, and is an example of a non-Newtonian fluid. At low shear, the material is a fluid and the dilatant flows easily, whereas at high shear the material substantially thickens or solidifies.
  • Nano-sized particles are generally considered as particles having a particle diameter less than about 100 nanometers (nm), and micro-sized particles are generally considered as particles having a particle diameter between about 0.1 and 1000 microns.
  • Figure 1 is a schematic of a typical prior art polishing machine
  • Figure 2a is a schematic of a plate-on-plate rheometer
  • Figure 2b is a graph showing typical shear thickening behaviour of a shear- thickening fluid under steady shear conditions
  • Figure 3a is a schematic drawing of one embodiment of the polishing technique of the present invention.
  • Figure 3b shows a diagrammatic representation of the polishing mechanism adapted to implement the technique represented in figure 3a;
  • Figure 4 depicts micrographs showing the effects of abrasive particle size on (a) the removal rate, and (b) the surface roughness of the finishing surfaces of a steel disk;
  • Figures 5a and 5b show a comparison of the surface profiles of a steel disk respectively before and after the polishing process.
  • Figure 1 shows a schematic of a typical prior art polishing machine.
  • the specimen to be polished is pressed on the polishing pad, and during the polishing process the lowest part of the specimen is polished by the polishing slurry which contains hard abrasive particles.
  • the polishing pad undergoes wear during the polishing process, and has to be replaced after a certain period of time.
  • the removal rate of the material and the roughness of the finished surface can be controlled by the properties of the abrasive particles, such size and hardness.
  • the present invention by contrast, utilises a shear-thickening fluid (STF) which comprises abrasive particles.
  • STF shear-thickening fluid
  • An STF possesses high frequency and strain- rate dependent characteristics, as expressed by a recoverable phase transition between liquid and solid or semi-solid.
  • Figure 2b shows the typical shear thickening behaviour of an STF tested with a plate-on-plate rheometer of the type shown in figure 2a.
  • the STF can transition from a liquid state to a thickened or substantially solid state when the shear rate reaches a critical value. Due to the dilatancy effect, the STF also results in a considerable normal force on the plates which confine its expansion.
  • FIG 3a shows a schematic drawing of the novel polishing technique of the present invention.
  • the STF remains in its liquid state and the specimen can be fully immersed therein.
  • Abrasive particles are added to the STF in order to act as the abrasive medium.
  • the rotational speed of the specimen reaches the critical value, the surrounding STF substantially solidifies, which firmly holds the abrasive particles in place. Meanwhile, a normal force is also generated due to the shear-thickening behaviour of the STF (see Figure 2b).
  • the abrasive particles can polish all the surfaces of the specimen in contact with the STF simultaneously, including surfaces A and B disposed at different heights (see Figure 3a), which cannot be simultaneously polished by using the prior art polishing technique shown in Figure 1.
  • polishing tests were conducted with the experimental setup shown in Figure 3a.
  • the materials include:
  • shear thickening fluid Ethylene Glycol based STF filled with 60 wt% polymeric particles (BASF AG, Ludwigshafen, Germany);
  • abrasive particles SiC with the sizes of 45, 250, 500, 1000 prn;
  • the present invention allows an article to be polished without the need for a polishing pad.
  • the technique enables polishing of complex structures which have curved surfaces or surfaces at different heights or orientations, such that these surfaces are polished evenly and simultaneously.
  • the technique potentially enables even the inner surfaces of an article to be polished, and potentially simultaneously with the exterior surfaces.
  • the process can substantially increase production rates by reducing the number of process steps, while reducing process downtime and maintenance costs, by avoiding the need for polishing pads to be periodically inspected and replaced.
  • the invention also potentially reduces the extent of operator training required.
  • the present invention means that a single shear-thickening slurry can be used to effect different polishing finishes by controlling certain process parameters. This contrasts with the prior art processes, wherein different slurries need to be prepared with different sizes /or types of abrasive particles. Further advantages of the invention, at least in some preferred embodiments, are that no expensive and complicated computer system is required to control the polishing of multi-faceted articles. In these and other respects, the invention represents a practical and commercially significant improvement over the prior art.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne un procédé de polissage d'un article comprenant les étapes qui consistent à mettre l'article en contact avec un fluide rhéoépaississant abrasif et à provoquer un mouvement relatif suffisant dudit article par rapport audit fluide rhéoépaississant abrasif pour effectuer simultanément un rhéoépaississement dudit fluide et un polissage dudit article.
PCT/AU2012/000930 2011-08-03 2012-08-03 Procédés, systèmes et compositions de polissage WO2013016779A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AU2011903111A AU2011903111A0 (en) 2011-08-03 Methods, systems and compositions for polishing
AU2011903111 2011-08-03

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WO2013016779A1 true WO2013016779A1 (fr) 2013-02-07

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104400648A (zh) * 2014-10-20 2015-03-11 华南理工大学 一种复杂曲面抛光速度自适应控制方法
US20160016292A1 (en) * 2013-03-12 2016-01-21 Kyushu University, National University Corporation Polishing pad and polishing method
CN108500741A (zh) * 2018-04-13 2018-09-07 浙江工业大学 一种定点释放化学作用的力流变抛光方法
CN109852254A (zh) * 2019-01-28 2019-06-07 湖南科技大学 用于可潮解晶体超精密加工的无水基剪切增稠-化学协同抛光液
CN110465862A (zh) * 2019-08-25 2019-11-19 山东理工大学 一种自动化复杂曲面力控高剪低压磨削装置及其加工方法
CN111702560A (zh) * 2020-06-03 2020-09-25 大连理工大学 一种适用于剪切增稠抛光的抛光头及抛光方法
CN112658812A (zh) * 2020-12-18 2021-04-16 中国人民解放军国防科技大学 一种ccos剪切增稠抛光方法
US11027397B2 (en) 2016-12-23 2021-06-08 Saint-Gobain Abrasives, Inc. Coated abrasives having a performance enhancing composition
CN113103070A (zh) * 2021-03-05 2021-07-13 华南理工大学 一种剪切增稠磨料流复合磨削加工微槽的方法
CN114378718A (zh) * 2022-01-27 2022-04-22 大连理工大学 一种非牛顿流体分散装置及方法
CN114473719A (zh) * 2022-02-21 2022-05-13 南京理工大学 一种基于局域剪切增稠的微结构抛光方法
CN114473720A (zh) * 2022-01-27 2022-05-13 大连理工大学 一种透镜阵列光学元件抛光方法及装置
CN114800057A (zh) * 2022-05-11 2022-07-29 浙江工业大学 一种基于非牛顿流体液膜剪切机理的抛光装置
WO2024037289A1 (fr) * 2022-08-19 2024-02-22 中山莱圃新材料有限公司 Fluide d'épaississement par cisaillement à concentration ultra-élevée, son procédé de préparation et son utilisation

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EP1930938A1 (fr) * 2005-09-09 2008-06-11 Asahi Glass Company, Limited Agent de polissage, procédé de polissage de surface à polir, et procédé de fabrication de dispositif à circuit intégré semi-conducteur

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Publication number Priority date Publication date Assignee Title
US5536437A (en) * 1992-08-19 1996-07-16 Colgate-Palmolive Co. Hard surface cleaning composition formed from a structured silicate
JPH1015789A (ja) * 1996-06-28 1998-01-20 Tokyo Seimitsu Co Ltd 半導体ウェーハの研磨方法及び装置
RU2146993C1 (ru) * 1999-02-23 2000-03-27 Ульяновский государственный технический университет Способ абразивной обработки
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EP1930938A1 (fr) * 2005-09-09 2008-06-11 Asahi Glass Company, Limited Agent de polissage, procédé de polissage de surface à polir, et procédé de fabrication de dispositif à circuit intégré semi-conducteur

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160016292A1 (en) * 2013-03-12 2016-01-21 Kyushu University, National University Corporation Polishing pad and polishing method
EP2974829A4 (fr) * 2013-03-12 2017-01-18 Kyushu University, National University Corporation Tampon de polissage et procédé de polissage
US9956669B2 (en) * 2013-03-12 2018-05-01 Kyushu University, National University Corporation Polishing pad and polishing method
CN104400648A (zh) * 2014-10-20 2015-03-11 华南理工大学 一种复杂曲面抛光速度自适应控制方法
US11027397B2 (en) 2016-12-23 2021-06-08 Saint-Gobain Abrasives, Inc. Coated abrasives having a performance enhancing composition
CN108500741A (zh) * 2018-04-13 2018-09-07 浙江工业大学 一种定点释放化学作用的力流变抛光方法
CN109852254A (zh) * 2019-01-28 2019-06-07 湖南科技大学 用于可潮解晶体超精密加工的无水基剪切增稠-化学协同抛光液
CN110465862B (zh) * 2019-08-25 2021-05-04 山东理工大学 一种自动化复杂曲面力控高剪低压磨削装置及其加工方法
CN110465862A (zh) * 2019-08-25 2019-11-19 山东理工大学 一种自动化复杂曲面力控高剪低压磨削装置及其加工方法
CN111702560B (zh) * 2020-06-03 2021-07-02 大连理工大学 一种适用于剪切增稠抛光的抛光头及抛光方法
CN111702560A (zh) * 2020-06-03 2020-09-25 大连理工大学 一种适用于剪切增稠抛光的抛光头及抛光方法
CN112658812B (zh) * 2020-12-18 2023-01-10 中国人民解放军国防科技大学 一种ccos剪切增稠抛光方法
CN112658812A (zh) * 2020-12-18 2021-04-16 中国人民解放军国防科技大学 一种ccos剪切增稠抛光方法
CN113103070A (zh) * 2021-03-05 2021-07-13 华南理工大学 一种剪切增稠磨料流复合磨削加工微槽的方法
CN114378718A (zh) * 2022-01-27 2022-04-22 大连理工大学 一种非牛顿流体分散装置及方法
CN114473720A (zh) * 2022-01-27 2022-05-13 大连理工大学 一种透镜阵列光学元件抛光方法及装置
CN114378718B (zh) * 2022-01-27 2022-11-11 大连理工大学 一种非牛顿流体分散装置及方法
CN114473720B (zh) * 2022-01-27 2023-10-27 大连理工大学 一种透镜阵列光学元件抛光方法及装置
CN114473719A (zh) * 2022-02-21 2022-05-13 南京理工大学 一种基于局域剪切增稠的微结构抛光方法
CN114800057A (zh) * 2022-05-11 2022-07-29 浙江工业大学 一种基于非牛顿流体液膜剪切机理的抛光装置
WO2024037289A1 (fr) * 2022-08-19 2024-02-22 中山莱圃新材料有限公司 Fluide d'épaississement par cisaillement à concentration ultra-élevée, son procédé de préparation et son utilisation

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