WO2013006442A3 - Procédé de manipulation d'une tranche - Google Patents

Procédé de manipulation d'une tranche Download PDF

Info

Publication number
WO2013006442A3
WO2013006442A3 PCT/US2012/044955 US2012044955W WO2013006442A3 WO 2013006442 A3 WO2013006442 A3 WO 2013006442A3 US 2012044955 W US2012044955 W US 2012044955W WO 2013006442 A3 WO2013006442 A3 WO 2013006442A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
handling
film
relates
dbg
Prior art date
Application number
PCT/US2012/044955
Other languages
English (en)
Other versions
WO2013006442A2 (fr
Inventor
Maria Parals SENDIN
Terry Sterrett
Albert P. Perez
Dave PEARD
Ciaran Mcardle
Original Assignee
Henkel Ag & Co. Kgaa
Henkel Ireland Limited
Henkel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co. Kgaa, Henkel Ireland Limited, Henkel Corporation filed Critical Henkel Ag & Co. Kgaa
Publication of WO2013006442A2 publication Critical patent/WO2013006442A2/fr
Publication of WO2013006442A3 publication Critical patent/WO2013006442A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un procédé de manipulation d'une tranche comprenant une pluralité de rainures sur sa surface. L'invention concerne en outre un assemblage, comprenant une tranche et un film polymère à mémoire de forme, et l'utilisation dudit film comme dispositif de fixation dans des procédés de découpage avant meulage (DBG).
PCT/US2012/044955 2011-07-01 2012-06-29 Procédé de manipulation d'une tranche WO2013006442A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161503796P 2011-07-01 2011-07-01
US61/503,796 2011-07-01

Publications (2)

Publication Number Publication Date
WO2013006442A2 WO2013006442A2 (fr) 2013-01-10
WO2013006442A3 true WO2013006442A3 (fr) 2013-05-10

Family

ID=47437640

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/044955 WO2013006442A2 (fr) 2011-07-01 2012-06-29 Procédé de manipulation d'une tranche

Country Status (2)

Country Link
TW (1) TW201312683A (fr)
WO (1) WO2013006442A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI540644B (zh) 2011-07-01 2016-07-01 漢高智慧財產控股公司 斥性材料於半導體總成中保護製造區域之用途
US9623813B2 (en) * 2013-11-14 2017-04-18 GM Global Technology Operations LLC Fit and finish methods
CN104891426B (zh) * 2015-04-07 2016-06-22 哈尔滨工业大学 一种具有选择性刺激回复功能微图案薄膜的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0316666A1 (fr) * 1987-11-13 1989-05-24 The Firestone Tire & Rubber Company Polymérisat réticulable par une amine ou élastomère (à base de polymère réticulé), utilisable à température basse ou ambiante dans la fabrication de chapes de pneus
US5211877A (en) * 1988-09-08 1993-05-18 Consortium Fur Elektrochemische Industrie Gmbh Liquid-crystalline polyorganosiloxanes containing (meth) acryloxy groups
US20040146715A1 (en) * 2001-07-17 2004-07-29 Guire Patrick E. Self assembling monolayer compositions
US20060046433A1 (en) * 2004-08-25 2006-03-02 Sterrett Terry L Thinning semiconductor wafers
US20060159867A1 (en) * 2005-01-19 2006-07-20 O'donnell Stephen D High-strength optical bonding method using optical silicone as a bonding medium and pressure sensitive adhesive as an intermediate layer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0316666A1 (fr) * 1987-11-13 1989-05-24 The Firestone Tire & Rubber Company Polymérisat réticulable par une amine ou élastomère (à base de polymère réticulé), utilisable à température basse ou ambiante dans la fabrication de chapes de pneus
US5211877A (en) * 1988-09-08 1993-05-18 Consortium Fur Elektrochemische Industrie Gmbh Liquid-crystalline polyorganosiloxanes containing (meth) acryloxy groups
US20040146715A1 (en) * 2001-07-17 2004-07-29 Guire Patrick E. Self assembling monolayer compositions
US20060046433A1 (en) * 2004-08-25 2006-03-02 Sterrett Terry L Thinning semiconductor wafers
US20060159867A1 (en) * 2005-01-19 2006-07-20 O'donnell Stephen D High-strength optical bonding method using optical silicone as a bonding medium and pressure sensitive adhesive as an intermediate layer

Also Published As

Publication number Publication date
TW201312683A (zh) 2013-03-16
WO2013006442A2 (fr) 2013-01-10

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