WO2012173519A1 - Thermoelectric module - Google Patents
Thermoelectric module Download PDFInfo
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- WO2012173519A1 WO2012173519A1 PCT/RU2012/000392 RU2012000392W WO2012173519A1 WO 2012173519 A1 WO2012173519 A1 WO 2012173519A1 RU 2012000392 W RU2012000392 W RU 2012000392W WO 2012173519 A1 WO2012173519 A1 WO 2012173519A1
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- thermoelectric module
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- substrate
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- semiconductor elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Definitions
- thermoelectric devices operating on the Peltier effect, and is intended for use in various cooling and heating systems: in air conditioners and refrigerators, thermostats, cooling devices of electronic components and units, as well as thermoelectric direct current generators.
- thermoelectric module which includes semiconductor elements with p- and p-type conductivities, interconnected by metal buses with high electrical conductivity in a single electric circuit and placed between substrates in such a way that all hot junctions are connected to one substrate, and all cold junctions - with the opposite (SU 1764094 A1, IPC H01L 35/02, 1992; RU 2179768 C2, IPC H01L 35/30, 2002).
- thermoelectric module With the passage of direct current through such an electric circuit, one substrate is cooled, and the opposite is heated. This property of the thermoelectric module is used to create various refrigeration devices that "pump" thermal energy from the working space into the external environment.
- thermoelectric module The disadvantage of this design of the thermoelectric module is its low efficiency, due to the relatively low thermal conductivity of ceramic substrates.
- thermoelectric module containing semiconductor elements with p- and p-type conductivities, interconnected by metal buses with high electrical conductivity in a single electrical circuit and placed between substrates in such a way that all hot junctions are connected to one substrate, and all cold junctions are with the opposite substrate, the substrates are made in the form of a metal base (RU 2075138 C1, IPC H01L 35/30, 1997).
- the disadvantage of this design, as well as the previous one, is that the distance between the hot and cold sides of the thermoelectric module is too small and due to the thermal effect that they exert on each other, it is not possible to obtain a large temperature difference.
- the technical result consists in increasing the efficiency of the thermoelectric module by creating a structure which allows to minimize or completely eliminate the thermal influence on the substrates to each other, resulting in a significant increase in temperature difference "between the substrates and, consequently, to an increase in the coefficient of performance.
- thermoelectric module which includes semiconductor elements with conductivities of p- and p-types, interconnected by metal buses with high electrical conductivity in a single electrical circuit and placed between the substrates in such a way that all hot junctions are connected to one substrate , and all cold junctions - with the opposite
- each of the semiconductor elements of p- and p-types of conductivities consists of two spaced parts interconnected by a metal wire ICOM with high electrical conductivity, wherein the length of each metal wire enables the separation of the substrates by a predetermined distance.
- FIG. 1 schematically shows the design of the thermoelectric module.
- thermoelectric module consists of semiconductor elements 1 and 2 with p- and p-type conductivities interconnected by metal buses 3 into a single electrical circuit and placed between substrates 4 and 5 in such a way that all hot junctions are connected to one substrate, and all cold spai - from the opposite.
- Each of the semiconductor elements 1 and 2 p- and p-types conductivity consists of two spaced parts interconnected by a metal conductor 6.
- Thermoelectric module operates as follows.
- thermoelectric module When passing direct current through an electric circuit consisting of semiconductor elements 1 and 2 of p- and p-types of conductivities, interconnected by metal buses 3 and placed between substrates 4 and 5 in such a way that all hot junctions are connected to one substrate, and all cold junctions - on the contrary, a temperature difference occurs between the sides of the module: one substrate is heated and the other is cooled. Moreover, due to the separation of the substrates over a considerable distance, their temperature influence on each other is minimally or completely eliminated. This provides a significant increase in the efficiency of the thermoelectric module.
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The thermoelectric module may be used in various cooling and heating systems: in air conditioning devices and refrigerators, temperature control elements, cooling units for nodes and blocks of electrical devices and in thermoelectric generators of direct current. The thermoelectric module comprises semiconductor elements (1) and (2) with p-type and n-type conduction, which are interconnected by metal strips (3) to form a single electric circuit and are located between substrates (4) and (5) in such a manner that all the hot junctions are connected to one substrate and all the cold junctions are connected to the opposite substrate. Each semiconductor element (1) and (2) consists of two separate sections connected by a metal conductor (6).
Description
ТЕРМОЭЛЕКТРИЧЕСКИЙ МОДУЛЬ Область техники THERMOELECTRIC MODULE
Техническое решение относится к термоэлектрическим приборам, работающим на эффекте Пельтье, и предназначено для использования в различных системах охлаждения и нагревания: в кондиционерах и холодильниках, термостатах, устройствах охлаждения узлов и блоков электронной аппаратуры, а так же термоэлектрических генераторах постоянного тока. The technical solution relates to thermoelectric devices operating on the Peltier effect, and is intended for use in various cooling and heating systems: in air conditioners and refrigerators, thermostats, cooling devices of electronic components and units, as well as thermoelectric direct current generators.
Уровень техники State of the art
Известен термоэлектрический модуль, включающий в себя полупроводниковые элементы с проводимостями р- и п- типов, соединенные между собой металлическими шинами с высокой электропроводностью в единую электрическую цепь и размещенные между подложками таким образом, что все горячие спаи соединены с одной подложкой, а все холодные спаи - с противоположной (SU 1764094 А1, МПК H01L 35/02, 1992; RU 2179768 С2, МПК H01L 35/30, 2002). A thermoelectric module is known, which includes semiconductor elements with p- and p-type conductivities, interconnected by metal buses with high electrical conductivity in a single electric circuit and placed between substrates in such a way that all hot junctions are connected to one substrate, and all cold junctions - with the opposite (SU 1764094 A1, IPC H01L 35/02, 1992; RU 2179768 C2, IPC H01L 35/30, 2002).
При прохождении постоянного тока по такой электрической цепи одна подложка охлаждается, а противоположная нагревается. Это свойство термоэлектрического модуля используется для создания различных холодильных устройств, «откачивающих» тепловую энергию из рабочего пространства во внешнюю среду. With the passage of direct current through such an electric circuit, one substrate is cooled, and the opposite is heated. This property of the thermoelectric module is used to create various refrigeration devices that "pump" thermal energy from the working space into the external environment.
Недостатком данной конструкции термоэлектрического модуля является низкая эффективность его работы, обусловленная сравнительно невысокой теплопроводностью керамических подложек. The disadvantage of this design of the thermoelectric module is its low efficiency, due to the relatively low thermal conductivity of ceramic substrates.
Наиболее близким к предлагаемому термоэлектрическому модулю является термоэлектрический модуль, содержащий полупроводниковые элементы с проводимостями р- и п- типов, соединенные между собой металлическими шинами с высокой электропроводностью в единую электрическую цепь и размещенные между подложками таким образом, что все горячие спаи соединены с одной подложкой, а все холодные спаи - с противоположной подложкой, подложки выполнены в виде металлического основания (RU 2075138 С1, МПК H01L 35/30, 1997).
Недостатком этой конструкции, как и предыдущей, является то, что расстояние между горячей и холодной сторонами термоэлектрического модуля слишком мало и из-за теплового влияния, которое они оказывают друг на друга, получить большой перепад температур не представляется возможным. Closest to the proposed thermoelectric module is a thermoelectric module containing semiconductor elements with p- and p-type conductivities, interconnected by metal buses with high electrical conductivity in a single electrical circuit and placed between substrates in such a way that all hot junctions are connected to one substrate, and all cold junctions are with the opposite substrate, the substrates are made in the form of a metal base (RU 2075138 C1, IPC H01L 35/30, 1997). The disadvantage of this design, as well as the previous one, is that the distance between the hot and cold sides of the thermoelectric module is too small and due to the thermal effect that they exert on each other, it is not possible to obtain a large temperature difference.
Сущность изобретения SUMMARY OF THE INVENTION
Технический результат заключается в повышении эффективности термоэлектрического модуля за счет создания конструкции, которая позволяет свести к минимуму или полностью исключить тепловое влияние подложек друг на друга, что приведет к значительному увеличению разности температур ' между подложками и, как следствие этого, к росту холодильного коэффициента. The technical result consists in increasing the efficiency of the thermoelectric module by creating a structure which allows to minimize or completely eliminate the thermal influence on the substrates to each other, resulting in a significant increase in temperature difference "between the substrates and, consequently, to an increase in the coefficient of performance.
Для достижения данного технического результата в термоэлектрическом модуле, включающем в себя полупроводниковые элементы с проводимостями р- и п -типов, соединенные между собой металлическими шинами с высокой электропроводностью в единую электрическую цепь и размещенные между подложками таким образом, что все горячие спаи соединены с одной подложкой, а все холодные спаи - с противоположной, каждый из полупроводниковых элементов р- и п- типов проводимостей состоит из двух разнесенных частей, соединенных между собой металлическим проводником с высокой электропроводностью, при этом длина каждого металлического проводника обеспечивает возможность разнесения подложек на заданное расстояние. To achieve this technical result in a thermoelectric module, which includes semiconductor elements with conductivities of p- and p-types, interconnected by metal buses with high electrical conductivity in a single electrical circuit and placed between the substrates in such a way that all hot junctions are connected to one substrate , and all cold junctions - with the opposite, each of the semiconductor elements of p- and p-types of conductivities consists of two spaced parts interconnected by a metal wire ICOM with high electrical conductivity, wherein the length of each metal wire enables the separation of the substrates by a predetermined distance.
Осуществление изобретения The implementation of the invention
На фиг.1 - схематично показана конструкция термоэлектрического модуля. Figure 1 - schematically shows the design of the thermoelectric module.
Термоэлектрический модуль состоит из полупроводниковых элементов 1 и 2 с проводимостями р- и п - типов, соединенных между собой металлическими шинами 3 в единую электрическую цепь и размещенных между подложками 4 и 5 таким образом, что все горячие спаи соединены с одной подложкой, а все холодные спаи - с противоположной. Каждый из полупроводниковых элементов 1 и 2 р- и п - типов
проводимостей состоит из двух разнесенных частей, соединенных между собой металлическим проводником 6. The thermoelectric module consists of semiconductor elements 1 and 2 with p- and p-type conductivities interconnected by metal buses 3 into a single electrical circuit and placed between substrates 4 and 5 in such a way that all hot junctions are connected to one substrate, and all cold spai - from the opposite. Each of the semiconductor elements 1 and 2 p- and p-types conductivity consists of two spaced parts interconnected by a metal conductor 6.
Термоэлектрический модуль работает следующим образом. Thermoelectric module operates as follows.
При прохождении постоянного тока по электрической цепи, состоящей из полупроводниковых элементов 1 и 2 р- и п- типов проводимостей, соединенных между собой металлическими шинами 3 и размещенных между подложками 4 и 5 таким образом, что все горячие спаи соединены с одной подложкой, а все холодные спаи - с противоположной, возникает разность температур между сторонами модуля: одна подложка нагревается, а другая охлаждается. При этом за счет разнесения подложек на значительное расстояние их температурное влияние друг на друга минимально или полностью исключается. Это обеспечивает значительное повышение эффективности работы термоэлектрического модуля.
When passing direct current through an electric circuit consisting of semiconductor elements 1 and 2 of p- and p-types of conductivities, interconnected by metal buses 3 and placed between substrates 4 and 5 in such a way that all hot junctions are connected to one substrate, and all cold junctions - on the contrary, a temperature difference occurs between the sides of the module: one substrate is heated and the other is cooled. Moreover, due to the separation of the substrates over a considerable distance, their temperature influence on each other is minimally or completely eliminated. This provides a significant increase in the efficiency of the thermoelectric module.
Claims
Формула изобретения Claim
Термоэлектрический модуль, включающий в себя полупроводниковые элементы с проводимостями р- и п- типов, соединенные между собой металлическими шинами с высокой электропроводностью в единую электрическую цепь и размещенные между подложками таким . образом, что все горячие спаи соединены с одной подложкой, а все холодные спаи - с противоположной, отличающийся тем, что каждый из полупроводниковых элементов р- и п- типов проводимостей состоит из двух разнесенных частей, соединенных между собой металлическим проводником с высокой электропроводностью, при этом длина каждого металлического проводника обеспечивает возможность разнесения подложек на заданное расстояние.
A thermoelectric module that includes semiconductor elements with p- and p-type conductivities, interconnected by metal buses with high electrical conductivity in a single electrical circuit and placed between the substrates. so that all hot junctions are connected to one substrate, and all cold junctions are connected to the opposite, characterized in that each of the semiconductor elements of p- and p-types of conductivity consists of two spaced parts interconnected by a metal conductor with high electrical conductivity, this length of each metal conductor provides the possibility of spacing the substrates at a given distance.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2011124092 | 2011-06-15 | ||
| RU2011124092 | 2011-06-15 |
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| Publication Number | Publication Date |
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| WO2012173519A1 true WO2012173519A1 (en) | 2012-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/RU2012/000392 WO2012173519A1 (en) | 2011-06-15 | 2012-05-17 | Thermoelectric module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3027157A1 (en) * | 2014-10-09 | 2016-04-15 | Andre Grangeon | THERMOELECTRIC MODULE OPERATING AT AMBIENT TEMPERATURES FOR ELECTRIC POWER PRODUCTION USEFUL IN DOMOTIC APPLICATIONS OR FOR THE AUTOMOBILE INDUSTRY |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2075138C1 (en) * | 1993-10-05 | 1997-03-10 | Товарищество с ограниченной ответственностью "НИВИНТЭ" | Thermoelectric unit and method for its manufacturing |
| US7299639B2 (en) * | 2004-06-22 | 2007-11-27 | Intel Corporation | Thermoelectric module |
| RU2364803C2 (en) * | 2007-09-18 | 2009-08-20 | Государственное образовательное учреждение высшего профессионального образования "Московский государственный институт электронной техники (технический университет) | Thermoelectric module |
| US20100031986A1 (en) * | 2008-01-29 | 2010-02-11 | Kyocera Corporation | Thermoelectric Module |
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2012
- 2012-05-17 WO PCT/RU2012/000392 patent/WO2012173519A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2075138C1 (en) * | 1993-10-05 | 1997-03-10 | Товарищество с ограниченной ответственностью "НИВИНТЭ" | Thermoelectric unit and method for its manufacturing |
| US7299639B2 (en) * | 2004-06-22 | 2007-11-27 | Intel Corporation | Thermoelectric module |
| RU2364803C2 (en) * | 2007-09-18 | 2009-08-20 | Государственное образовательное учреждение высшего профессионального образования "Московский государственный институт электронной техники (технический университет) | Thermoelectric module |
| US20100031986A1 (en) * | 2008-01-29 | 2010-02-11 | Kyocera Corporation | Thermoelectric Module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3027157A1 (en) * | 2014-10-09 | 2016-04-15 | Andre Grangeon | THERMOELECTRIC MODULE OPERATING AT AMBIENT TEMPERATURES FOR ELECTRIC POWER PRODUCTION USEFUL IN DOMOTIC APPLICATIONS OR FOR THE AUTOMOBILE INDUSTRY |
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