WO2012173519A1 - Module thermoélectrique - Google Patents

Module thermoélectrique Download PDF

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Publication number
WO2012173519A1
WO2012173519A1 PCT/RU2012/000392 RU2012000392W WO2012173519A1 WO 2012173519 A1 WO2012173519 A1 WO 2012173519A1 RU 2012000392 W RU2012000392 W RU 2012000392W WO 2012173519 A1 WO2012173519 A1 WO 2012173519A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermoelectric module
substrates
substrate
interconnected
semiconductor elements
Prior art date
Application number
PCT/RU2012/000392
Other languages
English (en)
Russian (ru)
Inventor
Валерий Васильевич ШУЛЯТЕВ
Original Assignee
Shulyatev Valerij Vasilevich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shulyatev Valerij Vasilevich filed Critical Shulyatev Valerij Vasilevich
Publication of WO2012173519A1 publication Critical patent/WO2012173519A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Definitions

  • thermoelectric devices operating on the Peltier effect, and is intended for use in various cooling and heating systems: in air conditioners and refrigerators, thermostats, cooling devices of electronic components and units, as well as thermoelectric direct current generators.
  • thermoelectric module which includes semiconductor elements with p- and p-type conductivities, interconnected by metal buses with high electrical conductivity in a single electric circuit and placed between substrates in such a way that all hot junctions are connected to one substrate, and all cold junctions - with the opposite (SU 1764094 A1, IPC H01L 35/02, 1992; RU 2179768 C2, IPC H01L 35/30, 2002).
  • thermoelectric module With the passage of direct current through such an electric circuit, one substrate is cooled, and the opposite is heated. This property of the thermoelectric module is used to create various refrigeration devices that "pump" thermal energy from the working space into the external environment.
  • thermoelectric module The disadvantage of this design of the thermoelectric module is its low efficiency, due to the relatively low thermal conductivity of ceramic substrates.
  • thermoelectric module containing semiconductor elements with p- and p-type conductivities, interconnected by metal buses with high electrical conductivity in a single electrical circuit and placed between substrates in such a way that all hot junctions are connected to one substrate, and all cold junctions are with the opposite substrate, the substrates are made in the form of a metal base (RU 2075138 C1, IPC H01L 35/30, 1997).
  • the disadvantage of this design, as well as the previous one, is that the distance between the hot and cold sides of the thermoelectric module is too small and due to the thermal effect that they exert on each other, it is not possible to obtain a large temperature difference.
  • the technical result consists in increasing the efficiency of the thermoelectric module by creating a structure which allows to minimize or completely eliminate the thermal influence on the substrates to each other, resulting in a significant increase in temperature difference "between the substrates and, consequently, to an increase in the coefficient of performance.
  • thermoelectric module which includes semiconductor elements with conductivities of p- and p-types, interconnected by metal buses with high electrical conductivity in a single electrical circuit and placed between the substrates in such a way that all hot junctions are connected to one substrate , and all cold junctions - with the opposite
  • each of the semiconductor elements of p- and p-types of conductivities consists of two spaced parts interconnected by a metal wire ICOM with high electrical conductivity, wherein the length of each metal wire enables the separation of the substrates by a predetermined distance.
  • FIG. 1 schematically shows the design of the thermoelectric module.
  • thermoelectric module consists of semiconductor elements 1 and 2 with p- and p-type conductivities interconnected by metal buses 3 into a single electrical circuit and placed between substrates 4 and 5 in such a way that all hot junctions are connected to one substrate, and all cold spai - from the opposite.
  • Each of the semiconductor elements 1 and 2 p- and p-types conductivity consists of two spaced parts interconnected by a metal conductor 6.
  • Thermoelectric module operates as follows.
  • thermoelectric module When passing direct current through an electric circuit consisting of semiconductor elements 1 and 2 of p- and p-types of conductivities, interconnected by metal buses 3 and placed between substrates 4 and 5 in such a way that all hot junctions are connected to one substrate, and all cold junctions - on the contrary, a temperature difference occurs between the sides of the module: one substrate is heated and the other is cooled. Moreover, due to the separation of the substrates over a considerable distance, their temperature influence on each other is minimally or completely eliminated. This provides a significant increase in the efficiency of the thermoelectric module.

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Le module thermoélectrique peut être utilisé dans différents systèmes de refroidissement et de chauffage tels que des climatiseurs et des réfrigérateurs, des thermostats, des dispositifs de refroidissement d'unités et de blocs de matériel électronique ainsi que dans des générateurs thermoélectriques de courant continu. Le module thermoélectrique comprend des éléments semi-conducteurs (1) et (2) avec des conductivités de types p- et n-, regroupés au moyen de bus métalliques (3) en un circuit électrique uni et disposés entre les substrats (4) et (5) de manière à ce que toutes les soudures à chaud soient reliées à un substrat et toutes les soudures à froids soient reliées à un autre substrat. Chacun des éléments semi-conducteurs (1) et (2) est constitué de deux parties distantes reliées entre elles par un fil métallique (6).
PCT/RU2012/000392 2011-06-15 2012-05-17 Module thermoélectrique WO2012173519A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU2011124092 2011-06-15
RU2011124092 2011-06-15

Publications (1)

Publication Number Publication Date
WO2012173519A1 true WO2012173519A1 (fr) 2012-12-20

Family

ID=47357318

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU2012/000392 WO2012173519A1 (fr) 2011-06-15 2012-05-17 Module thermoélectrique

Country Status (1)

Country Link
WO (1) WO2012173519A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3027157A1 (fr) * 2014-10-09 2016-04-15 Andre Grangeon Module thermoelectrique fonctionnant a des temperatures ambiantes pour une production d'energie electrique utilisable dans des applications de domotique ou pour l'industrie automobile

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2075138C1 (ru) * 1993-10-05 1997-03-10 Товарищество с ограниченной ответственностью "НИВИНТЭ" Термоэлектрический модуль и способ его изготовления
US7299639B2 (en) * 2004-06-22 2007-11-27 Intel Corporation Thermoelectric module
RU2364803C2 (ru) * 2007-09-18 2009-08-20 Государственное образовательное учреждение высшего профессионального образования "Московский государственный институт электронной техники (технический университет) Термоэлектрический модуль
US20100031986A1 (en) * 2008-01-29 2010-02-11 Kyocera Corporation Thermoelectric Module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2075138C1 (ru) * 1993-10-05 1997-03-10 Товарищество с ограниченной ответственностью "НИВИНТЭ" Термоэлектрический модуль и способ его изготовления
US7299639B2 (en) * 2004-06-22 2007-11-27 Intel Corporation Thermoelectric module
RU2364803C2 (ru) * 2007-09-18 2009-08-20 Государственное образовательное учреждение высшего профессионального образования "Московский государственный институт электронной техники (технический университет) Термоэлектрический модуль
US20100031986A1 (en) * 2008-01-29 2010-02-11 Kyocera Corporation Thermoelectric Module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3027157A1 (fr) * 2014-10-09 2016-04-15 Andre Grangeon Module thermoelectrique fonctionnant a des temperatures ambiantes pour une production d'energie electrique utilisable dans des applications de domotique ou pour l'industrie automobile

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