WO2012169754A3 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

Info

Publication number
WO2012169754A3
WO2012169754A3 PCT/KR2012/004397 KR2012004397W WO2012169754A3 WO 2012169754 A3 WO2012169754 A3 WO 2012169754A3 KR 2012004397 W KR2012004397 W KR 2012004397W WO 2012169754 A3 WO2012169754 A3 WO 2012169754A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate treating
treating apparatus
chamber
substrate
holder
Prior art date
Application number
PCT/KR2012/004397
Other languages
English (en)
French (fr)
Other versions
WO2012169754A2 (ko
Inventor
강호영
조병호
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110056269A external-priority patent/KR101306767B1/ko
Priority claimed from KR1020110059803A external-priority patent/KR101297666B1/ko
Priority claimed from KR1020110059804A external-priority patent/KR101297670B1/ko
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Publication of WO2012169754A2 publication Critical patent/WO2012169754A2/ko
Publication of WO2012169754A3 publication Critical patent/WO2012169754A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

기판 처리 장치가 개시된다. 본 발명에 따른 기판 처리 장치는 홀더는 챔버에 배치되어 남아있고, 기판만이 챔버에 로딩되고 챔버로부터 언로딩된다. 따라서, 홀더를 재가열하기 위한 에너지 및 시간이 상대적으로 적게 소요되므로, 기판 처리 공정의 생산성이 향상되는 효과가 있다.
PCT/KR2012/004397 2011-06-10 2012-06-04 기판 처리 장치 WO2012169754A2 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020110056269A KR101306767B1 (ko) 2011-06-10 2011-06-10 기판 처리 장치
KR10-2011-0056269 2011-06-10
KR10-2011-0059804 2011-06-20
KR10-2011-0059803 2011-06-20
KR1020110059803A KR101297666B1 (ko) 2011-06-20 2011-06-20 기판 처리 장치
KR1020110059804A KR101297670B1 (ko) 2011-06-20 2011-06-20 기판 처리 장치

Publications (2)

Publication Number Publication Date
WO2012169754A2 WO2012169754A2 (ko) 2012-12-13
WO2012169754A3 true WO2012169754A3 (ko) 2013-04-04

Family

ID=47296570

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004397 WO2012169754A2 (ko) 2011-06-10 2012-06-04 기판 처리 장치

Country Status (2)

Country Link
TW (1) TW201308511A (ko)
WO (1) WO2012169754A2 (ko)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06349775A (ja) * 1993-06-10 1994-12-22 Tokyo Electron Ltd 処理装置
KR20080082270A (ko) * 2007-03-08 2008-09-11 (주)소슬 승강 장치, 이를 포함하는 기판 처리 장치 및 이를이용하여 기판을 처리하는 방법
KR20090030231A (ko) * 2007-09-19 2009-03-24 도쿄엘렉트론가부시키가이샤 상압 건조 장치 및 기판 처리 장치 및 기판 처리 방법
KR20100008722A (ko) * 2008-07-16 2010-01-26 주식회사 테라세미콘 배치식 열처리 장치
KR20100026274A (ko) * 2008-08-29 2010-03-10 주식회사 테라세미콘 보트
KR20100106042A (ko) * 2009-03-23 2010-10-01 주식회사 테라세미콘 인라인 열처리 장치
KR20110006091A (ko) * 2009-07-13 2011-01-20 주식회사 아이피에스 기판처리 장치 및 방법과, 이를 포함한 인라인 처리 시스템 및 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06349775A (ja) * 1993-06-10 1994-12-22 Tokyo Electron Ltd 処理装置
KR20080082270A (ko) * 2007-03-08 2008-09-11 (주)소슬 승강 장치, 이를 포함하는 기판 처리 장치 및 이를이용하여 기판을 처리하는 방법
KR20090030231A (ko) * 2007-09-19 2009-03-24 도쿄엘렉트론가부시키가이샤 상압 건조 장치 및 기판 처리 장치 및 기판 처리 방법
KR20100008722A (ko) * 2008-07-16 2010-01-26 주식회사 테라세미콘 배치식 열처리 장치
KR20100026274A (ko) * 2008-08-29 2010-03-10 주식회사 테라세미콘 보트
KR20100106042A (ko) * 2009-03-23 2010-10-01 주식회사 테라세미콘 인라인 열처리 장치
KR20110006091A (ko) * 2009-07-13 2011-01-20 주식회사 아이피에스 기판처리 장치 및 방법과, 이를 포함한 인라인 처리 시스템 및 방법

Also Published As

Publication number Publication date
WO2012169754A2 (ko) 2012-12-13
TW201308511A (zh) 2013-02-16

Similar Documents

Publication Publication Date Title
WO2012009371A3 (en) Compartmentalized chamber
EP2794815A4 (en) LUMINESCENT MATERIALS, ARTICLES INCORPORATING LUMINESCENT MATERIALS AND METHODS FOR REALIZING AUTHENTICATION OF ARTICLES
EP3101157A4 (en) Treatment solution for chromium-free tension coating, method for forming chromium-free tension coating, and grain oriented electrical steel sheet with chromium-free tension coating
MY163030A (en) Methods and systems for coating granular substrates
WO2012020234A3 (en) Integration of an energy storage device with a separate thermal process
EP2707541A4 (en) METHOD OF TREATING CELLULOSE AND PROCESSED CELLULOSE ACCORDING TO THE METHOD
ZA201206448B (en) Pallets the handling of goods,processes for manufacturing pallets and methods of using pallets in the handling of goods
EP2812298A4 (en) IMPROVED PROCESS FOR PRODUCING 2,3,3,3-TETRAFLUOROPROPENE
PL2993248T3 (pl) Płaski wyrób stalowy z powłoką al, sposób jego wytwarzania, oraz sposób wytwarzania elementu konstrukcyjnego kształtowanego na gorąco
WO2016100557A3 (en) Plasma treatment with non-polymerizing compounds that leads to reduced biomolecule adhesion to thermoplastic articles
EP3006578A4 (en) Steel sheet for steel belt and process for manufacturing same, and steel belt
RS61888B1 (sr) Proces za tretman ćelijskih zidova kvasca sa β-1,3-glukanazom koja proizvodi laminaripentaozu
EP3399063A4 (en) INSERT HARDENED STEEL, CARBONIZED COMPONENT AND METHOD FOR PRODUCING THE STEEL USED HARDENED
WO2013067531A3 (en) Methods of using microrna 195 in providing neuroprotection
ZA201305234B (en) Process for the treatment and the winemaking of grapes
MX2016017124A (es) Proceso para la preparacion de acidos 3-hidroxipicolinicos.
PL2804703T3 (pl) Proces i sposób uzdatniania materiałów, materiały otrzymane w ten sposób i zastosowanie tych materiałów
WO2011136604A3 (ko) 기판 처리 장치
PT3007816T (pt) Processo de polimerização com formação reduzida de depósitos no espaço de reação
WO2012087919A3 (en) Methods and apparatus for gas delivery into plasma processing chambers
WO2015151070A3 (fr) Procede de fonctionnalisation de surface
EP2683533A4 (en) Wood coloring with fungi and the treating process
WO2013113037A8 (en) Improved 1, 1-disubstituted ethylene process
WO2012169754A3 (ko) 기판 처리 장치
EP2864257A4 (en) PROCESS FOR TREATING PURIFICATION SLUDGE, PRODUCT SO OBTAINED AND USE THEREOF

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12797530

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12797530

Country of ref document: EP

Kind code of ref document: A2