WO2012166856A3 - Substrate cleaning method and substrate cleaning device - Google Patents

Substrate cleaning method and substrate cleaning device Download PDF

Info

Publication number
WO2012166856A3
WO2012166856A3 PCT/US2012/040106 US2012040106W WO2012166856A3 WO 2012166856 A3 WO2012166856 A3 WO 2012166856A3 US 2012040106 W US2012040106 W US 2012040106W WO 2012166856 A3 WO2012166856 A3 WO 2012166856A3
Authority
WO
WIPO (PCT)
Prior art keywords
cleaning
substrate
face
cleaning plate
liquid
Prior art date
Application number
PCT/US2012/040106
Other languages
French (fr)
Other versions
WO2012166856A2 (en
Inventor
Kazuta Saito
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Priority to KR1020137034830A priority Critical patent/KR20140033174A/en
Publication of WO2012166856A2 publication Critical patent/WO2012166856A2/en
Publication of WO2012166856A3 publication Critical patent/WO2012166856A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A substrate cleaning device (10) is provided with a substrate support portion (16) for supporting a substrate (12) in a downward-facing orientation; a cleaning plate (24) that has a cleaning liquid support face (22), where the cleaning plate (24) is positioned in an upward-facing orientation at an operating position able to face the liquid support face (22) of a first face (12a) of the substrate (12) that is supported by the substrate support portion (16) across a gap G that has a specific dimension; a cleaning liquid supply portion (26) for supplying a cleaning liquid to a central region (22a) of the liquid support face (22) of the cleaning plate (24); and a cleaning plate drive portion (28) for rotating the cleaning plate (24) around a cleaning plate axis (24a) that is substantially perpendicular to the liquid support face (22). The substrate cleaning device (10) cleans the first face (12a) by causing the cleaning liquid that flows along the liquid support face (22) of the cleaning plate (24), which is rotated around the cleaning plate axis (24a), to contact the first face (12a) of the substrate (12).
PCT/US2012/040106 2011-06-02 2012-05-31 Substrate cleaning method and substrate cleaning device WO2012166856A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020137034830A KR20140033174A (en) 2011-06-02 2012-05-31 Substrate cleaning method and substrate cleaning device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-124375 2011-06-02
JP2011124375A JP2012253185A (en) 2011-06-02 2011-06-02 Substrate cleaning method and substrate cleaning apparatus

Publications (2)

Publication Number Publication Date
WO2012166856A2 WO2012166856A2 (en) 2012-12-06
WO2012166856A3 true WO2012166856A3 (en) 2013-02-28

Family

ID=47260302

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/040106 WO2012166856A2 (en) 2011-06-02 2012-05-31 Substrate cleaning method and substrate cleaning device

Country Status (4)

Country Link
JP (1) JP2012253185A (en)
KR (1) KR20140033174A (en)
TW (1) TW201303985A (en)
WO (1) WO2012166856A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101506895B1 (en) * 2014-03-26 2015-03-30 (주)포시스 Plastic Organic Light Emitting Diode Panel Washing the cleaning system and its cleaning method
CN115254752A (en) * 2022-08-10 2022-11-01 常州星宇车灯股份有限公司 Stain cleaning system of vehicle-mounted camera and using method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321004A (en) * 1996-05-28 1997-12-12 Sony Corp Wafer cleaning method and wafer cleaning device
US20020134403A1 (en) * 2001-03-12 2002-09-26 Selwyn Gary S. Combined plasma/liquid cleaning of substrates
US20020166569A1 (en) * 2001-05-10 2002-11-14 Speedfam-Ipec Corporation Method and apparatus for semiconductor wafer cleaning
US20040007559A1 (en) * 1999-05-19 2004-01-15 Akihisa Hongo Wafer cleaning apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321004A (en) * 1996-05-28 1997-12-12 Sony Corp Wafer cleaning method and wafer cleaning device
US20040007559A1 (en) * 1999-05-19 2004-01-15 Akihisa Hongo Wafer cleaning apparatus
US20020134403A1 (en) * 2001-03-12 2002-09-26 Selwyn Gary S. Combined plasma/liquid cleaning of substrates
US20020166569A1 (en) * 2001-05-10 2002-11-14 Speedfam-Ipec Corporation Method and apparatus for semiconductor wafer cleaning

Also Published As

Publication number Publication date
WO2012166856A2 (en) 2012-12-06
KR20140033174A (en) 2014-03-17
TW201303985A (en) 2013-01-16
JP2012253185A (en) 2012-12-20

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