WO2012165908A3 - 반도체 패키지용 인서트 - Google Patents

반도체 패키지용 인서트 Download PDF

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Publication number
WO2012165908A3
WO2012165908A3 PCT/KR2012/004357 KR2012004357W WO2012165908A3 WO 2012165908 A3 WO2012165908 A3 WO 2012165908A3 KR 2012004357 W KR2012004357 W KR 2012004357W WO 2012165908 A3 WO2012165908 A3 WO 2012165908A3
Authority
WO
WIPO (PCT)
Prior art keywords
package
insert
accommodation groove
semiconductor package
fixing body
Prior art date
Application number
PCT/KR2012/004357
Other languages
English (en)
French (fr)
Other versions
WO2012165908A2 (ko
Inventor
이재학
강경원
송재현
Original Assignee
주식회사 아이에스시
유니셉 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시, 유니셉 주식회사 filed Critical 주식회사 아이에스시
Publication of WO2012165908A2 publication Critical patent/WO2012165908A2/ko
Publication of WO2012165908A3 publication Critical patent/WO2012165908A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

본 발명은 반도체 패키지용 인서트에 대한 것으로서, 더욱 상세하게는 패키지 수납홈이 형성된 인서트 몸체; 상기 반도체 패키지가 상기 패키지 수납홈에 삽입되었을 때 패키지 수납홈을 폐쇄함으로서 상기 반도체 패키지가 상기 패키지 수납홈으로부터 이탈되는 것을 방지하는 패키지 고정체; 상기 패키지 고정체가 상기 패키지 수납홈을 폐쇄하는 방향으로 이동하도록 상기 패키지 고정체를 탄력지지하는 탄력지지부재; 상기 인서트 몸체 위에서 상기 인서트 몸체에 접근하거나 상기 인서트 몸체로부터 멀어지는 방향으로 이동가능한 오픈커버; 및 상기 패키지 고정체를, 상기 패키지 수납홈을 개방시키는 방향으로 이동가능하게 하는 개방부재;를 포함하되, 상기 패키지 고정체는 그 하면이 상기 반도체 패키지의 상면을 전체적으로 덮어 상기 반도체 패키지의 이탈을 방지하는 것을 특징으로 하는 반도체 패키지용 인서트를 포함하는 반도체 패키지용 인서트에 대한 것이다.
PCT/KR2012/004357 2011-06-01 2012-06-01 반도체 패키지용 인서트 WO2012165908A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110052997A KR101218348B1 (ko) 2011-06-01 2011-06-01 반도체 패키지용 인서트
KR10-2011-0052997 2011-06-01

Publications (2)

Publication Number Publication Date
WO2012165908A2 WO2012165908A2 (ko) 2012-12-06
WO2012165908A3 true WO2012165908A3 (ko) 2013-03-28

Family

ID=47260115

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004357 WO2012165908A2 (ko) 2011-06-01 2012-06-01 반도체 패키지용 인서트

Country Status (3)

Country Link
KR (1) KR101218348B1 (ko)
TW (1) TWI497653B (ko)
WO (1) WO2012165908A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101882706B1 (ko) * 2011-11-21 2018-07-30 삼성전자주식회사 반도체 패키지용 인서트 및 이를 포함하는 테스트 장치
KR101532391B1 (ko) * 2014-04-10 2015-06-30 주식회사 아이에스시 푸셔 장치
KR102036202B1 (ko) * 2018-10-26 2019-10-24 (주) 나노에이스 회동 레버를 이용한 반도체칩의 네 코너 고정식 지지체
KR102213075B1 (ko) * 2020-01-07 2021-02-08 (주)마이크로컨텍솔루션 반도체 칩 패키지 테스트 소켓
CN113178421B (zh) * 2021-04-08 2022-03-29 深圳市磐锋精密技术有限公司 一种手机集成电路的多芯片封装定位装置及其定位方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020190739A1 (en) * 1999-01-21 2002-12-19 Farnworth Warren M. CSP BGA test socket with insert and method
KR20080086702A (ko) * 2007-03-23 2008-09-26 세크론 주식회사 테스트 보조체
US7477063B1 (en) * 2007-08-17 2009-01-13 Powertech Technologies, Inc. Universal insert tool for fixing a BGA package under test
KR101032648B1 (ko) * 2011-02-10 2011-05-06 주식회사 아이에스시테크놀러지 테스트용 소켓

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
TW530159B (en) * 1999-07-16 2003-05-01 Advantest Corp Insert for electric devices testing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020190739A1 (en) * 1999-01-21 2002-12-19 Farnworth Warren M. CSP BGA test socket with insert and method
KR20080086702A (ko) * 2007-03-23 2008-09-26 세크론 주식회사 테스트 보조체
US7477063B1 (en) * 2007-08-17 2009-01-13 Powertech Technologies, Inc. Universal insert tool for fixing a BGA package under test
KR101032648B1 (ko) * 2011-02-10 2011-05-06 주식회사 아이에스시테크놀러지 테스트용 소켓

Also Published As

Publication number Publication date
KR20120134219A (ko) 2012-12-12
TWI497653B (zh) 2015-08-21
TW201308524A (zh) 2013-02-16
WO2012165908A2 (ko) 2012-12-06
KR101218348B1 (ko) 2013-01-03

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