WO2012165839A3 - 미세섬모의 인터락킹을 이용한 가역적 전기커넥터, 이를 이용한 다기능 센서 및 그 제작방법 - Google Patents

미세섬모의 인터락킹을 이용한 가역적 전기커넥터, 이를 이용한 다기능 센서 및 그 제작방법 Download PDF

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Publication number
WO2012165839A3
WO2012165839A3 PCT/KR2012/004228 KR2012004228W WO2012165839A3 WO 2012165839 A3 WO2012165839 A3 WO 2012165839A3 KR 2012004228 W KR2012004228 W KR 2012004228W WO 2012165839 A3 WO2012165839 A3 WO 2012165839A3
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WO
WIPO (PCT)
Prior art keywords
electrical connector
fine
cilium
same
multi functional
Prior art date
Application number
PCT/KR2012/004228
Other languages
English (en)
French (fr)
Other versions
WO2012165839A2 (ko
WO2012165839A9 (ko
Inventor
서갑양
방창현
김태일
강대식
김상문
Original Assignee
서울대학교산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울대학교산학협력단 filed Critical 서울대학교산학협력단
Publication of WO2012165839A2 publication Critical patent/WO2012165839A2/ko
Publication of WO2012165839A3 publication Critical patent/WO2012165839A3/ko
Publication of WO2012165839A9 publication Critical patent/WO2012165839A9/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

나노스케일의 구조물을 통해 전극을 연결하여 저항의 발생을 최소화시킴으로써 전기 효율을 극대화시킨 가역적 전기커넥터와, 이러한 전기커넥터 구조를 통해 작은 압력과 힘에도 미세하게 반응하며 작은 변화에도 크게 반응하는 민감도를 제공하는 다기능 센서가 개시된다. 이를 위하여 제 1 기판 상에 형성된 제 1 미세섬모를 가지는 제 1 연결부재, 및 상기 제 1 미세섬모에 접촉하여 접착력을 나타내도록 제 2 기판 상에 형성된 제 2 미세섬모를 가지는 제 2 연결부재를 포함하며, 상기 제 1 미세섬모 및 제 2 미세섬모의 표면에 금속 박막이 형성된 것을 특징으로 하는 미세섬모의 인터락킹을 이용한 가역적 전기커넥터를 제공한다. 이에 따르면, 본 발명의 가역적 전기커넥터는 전기적 연결을 하는데 있어 유연성을 가지고, 종전의 전기커넥터에 비해 낮은 전기 저항을 갖는다. 또한, 본 발명의 다기능 센서는 작은 압력과 힘도 계측할 수 있으며, 측정할 수 있는 압력과 힘의 범위에서 작은 변화에도 크게 반응하는 민감도를 갖는다.
PCT/KR2012/004228 2011-05-27 2012-05-29 미세섬모의 인터락킹을 이용한 가역적 전기커넥터, 이를 이용한 다기능 센서 및 그 제작방법 WO2012165839A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110050382A KR101200798B1 (ko) 2011-05-27 2011-05-27 미세섬모의 인터락킹을 이용한 가역적 전기커넥터, 이를 이용한 다기능 센서 및 그 제작방법
KR10-2011-0050382 2011-05-27

Publications (3)

Publication Number Publication Date
WO2012165839A2 WO2012165839A2 (ko) 2012-12-06
WO2012165839A3 true WO2012165839A3 (ko) 2013-03-28
WO2012165839A9 WO2012165839A9 (ko) 2013-05-16

Family

ID=47260062

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004228 WO2012165839A2 (ko) 2011-05-27 2012-05-29 미세섬모의 인터락킹을 이용한 가역적 전기커넥터, 이를 이용한 다기능 센서 및 그 제작방법

Country Status (2)

Country Link
KR (1) KR101200798B1 (ko)
WO (1) WO2012165839A2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101540177B1 (ko) * 2014-03-26 2015-07-28 삼성전기주식회사 압력센서 및 그 제조방법
US9869171B2 (en) 2014-07-25 2018-01-16 Halliburton Energy Services, Inc. Nanofiber strain gauge sensors in downhole tools
KR101665191B1 (ko) 2014-10-15 2016-10-14 한국표준과학연구원 생체모방 다중감각 피부센서
KR102097449B1 (ko) * 2017-07-17 2020-04-06 성균관대학교산학협력단 복수의 층간 인터락킹 구조를 포함하는 건식 접착 시스템
CN109990929A (zh) * 2019-03-21 2019-07-09 中国科学技术大学 高分子聚合物基电阻型力学传感器及制备方法
CN114354172B (zh) * 2022-01-10 2024-04-16 浙江吉利控股集团有限公司 油气分离器的故障检测方法、装置及计算机可读存储介质
CN114812875B (zh) * 2022-03-29 2023-05-30 中国科学院空天信息创新研究院 一种分层式大长径比磁性纤毛传感器、制备方法及其应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040030653A (ko) * 2001-06-06 2004-04-09 인피네온 테크놀로지스 아게 전자 칩 및 전자 칩 장치
JP2007062372A (ja) * 2005-08-29 2007-03-15 Seoul National Univ Industry Foundation 高縦横比のナノ構造物の形成方法及び微細パターンの形成方法
KR20080003997A (ko) * 2006-07-04 2008-01-09 삼성에스디아이 주식회사 탄소나노튜브를 이용한 반도체 소자의 층간 배선 및 그제조 방법
KR20080008892A (ko) * 2006-07-21 2008-01-24 주식회사 하이닉스반도체 반도체 소자의 콘택 패턴 형성 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040030653A (ko) * 2001-06-06 2004-04-09 인피네온 테크놀로지스 아게 전자 칩 및 전자 칩 장치
JP2007062372A (ja) * 2005-08-29 2007-03-15 Seoul National Univ Industry Foundation 高縦横比のナノ構造物の形成方法及び微細パターンの形成方法
KR20080003997A (ko) * 2006-07-04 2008-01-09 삼성에스디아이 주식회사 탄소나노튜브를 이용한 반도체 소자의 층간 배선 및 그제조 방법
KR20080008892A (ko) * 2006-07-21 2008-01-24 주식회사 하이닉스반도체 반도체 소자의 콘택 패턴 형성 방법

Also Published As

Publication number Publication date
WO2012165839A2 (ko) 2012-12-06
WO2012165839A9 (ko) 2013-05-16
KR101200798B1 (ko) 2012-11-13

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