WO2012157823A1 - Insulation body for reflow device - Google Patents
Insulation body for reflow device Download PDFInfo
- Publication number
- WO2012157823A1 WO2012157823A1 PCT/KR2011/008238 KR2011008238W WO2012157823A1 WO 2012157823 A1 WO2012157823 A1 WO 2012157823A1 KR 2011008238 W KR2011008238 W KR 2011008238W WO 2012157823 A1 WO2012157823 A1 WO 2012157823A1
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- WO
- WIPO (PCT)
- Prior art keywords
- reflow device
- outer shell
- reflow
- insulating material
- air
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Definitions
- the present invention relates to a heat insulator for a reflow apparatus, and more particularly, to an insulator for blocking heat entry and exit, and to a reflow apparatus for soldering a component by mounting a component on an outer surface and a substrate surrounding the insulator. It relates to a heat insulating body for a reflow device, characterized in that it comprises a detachable means provided on the outside of the outer shell to be detachable.
- the reflow apparatus is a device in which a creamy solder is printed on a portion to be joined in a manufacturing process of a printed circuit board and melted to solder.
- a hot heating furnace having a soldering temperature set.
- solder and electronic components are mounted on the printed circuit wiring board and passed through the heating furnace, the solder melts to transfer the electronic components to the printed circuit wiring board. Will be connected.
- the internal temperature of the furnace for soldering is about 200 ° C., which consumes a lot of power and time. Therefore, maintaining the temperature properly is a very critical task for cost savings and time savings.
- a heat insulating material made of synthetic resin is used or aluminum is deposited on the outside of the heat insulating material made of synthetic resin.
- the heat insulating material as described above is composed of only a synthetic resin material, there is a problem that the heat and heat dissipation effect is not sufficiently exhibited, it is not easy to use.
- the present invention is to solve the above problems
- Desorption means provided in; characterized in that comprises a.
- the outer shell is characterized in that it further comprises; a thermal insulation member for increasing the thermal insulation effect.
- the apparatus may further include a ventilation control unit configured to be openable and closed to reversibly block the inflow and outflow of air from the reflow apparatus.
- a ventilation control unit configured to be openable and closed to reversibly block the inflow and outflow of air from the reflow apparatus.
- the outer shell is made of a glass fiber material, but the upper end of the outer shell contains a silicon mixture composed of silica (silica) and octamethylcyclotetrasiloxane (octamethylcyclotetrasiloxane), the thickness of the outer shell is characterized in that 10 to 30 mm It is done.
- the outer shell is wrapped around the insulating material can block the air flow of the insulating material can increase the warming effect and heat dissipation effect
- Figure 1a is a perspective view showing an embodiment of the present invention from above.
- Figure 1b is a perspective view showing one embodiment of the present invention from the bottom.
- FIG. 2 is a front view of a reflow apparatus to which an embodiment of the present invention is applied.
- Figure 3 is a front view of a reflow apparatus to which another embodiment of the present invention is applied.
- Figure 4 is a front view of a reflow apparatus to which another embodiment of the present invention is applied.
- the present invention is largely configured as shown in Figures 1 to 3, including a heat insulating material 100, the outer shell 200, the removable means 300.
- the heat insulating material 100 is demonstrated.
- the heat insulator is heated inside the furnace in the process of maintaining the temperature and heating the temperature of the furnace to about 200 ° C. in order to mount and solder the electronic component on the upper part of the printed circuit board during the manufacturing process of the PCB. It serves to block heat entry and exit.
- the heat insulating material may be a heat insulating material according to the glass wool manufacturing method for compression molding by adding a binder to the short fiber of the glass fiber.
- the binder is easily decomposed by the temperature and the shape may be disturbed, it is more preferable to use a heat insulating material according to a glass fiber manufacturing method for weaving long fibers in the glass fiber without using a binder.
- the heat insulating material according to the glass fiber manufacturing method has no advantage of dense, scattering, etc. of the fiber itself, excellent heat insulation and thermal insulation, there is less concern about environmental pollution by dust and the like.
- the envelope 200 surrounds the heat insulating material 100. That is, the envelope 200 may be made in various shapes to easily put the heat insulating material 100 therein, such as a bag or a paper bag shape, and put the heat insulating material 100 in the outer shell 200, fasteners, magnets It can be manufactured by sewing with Velcro tape, double-sided tape, snap, hook, knot or special sewing thread.
- the outer shell 200 serves to prevent the phenomenon that the thermal insulation material 100 is scattered while deteriorating for a long time, and to improve the thermal insulation and thermal insulation effect. When the insulation 100 is used alone, the internal flow of the reflow apparatus is lost by about 50% due to the distribution of air, but the heat loss rate is reduced to less than about 5% by wrapping the insulation 100 with the shell 200. do.
- the outer shell 200 is preferably made of glass fiber.
- the outer shell 200 is made of glass fiber because the heat resistance temperature of the glass fiber reaches about 800 ° C. and the thermal conductivity is 1 or less, thereby effectively circulating air. Because it blocks.
- the top of the shell 200 is preferably prepared by further containing a silicon mixture.
- the silicon mixture is composed of silica and octamethylcyclotetrasiloxane, and the content of the silica and octamethylcyclotetrasiloxane is greater than the total weight of the top of the shell 200.
- Particularly preferred is about 10 to 20 Wt% for the silica, about 0.1 to 1 Wt% for the octamethylcyclotetrasiloxane. This is because when the silicone mixture is contained in the ratio, heat can be more effectively prevented from being conducted or transmitted through the upper end of the shell 200, which is the opposite side of the contact surface of the reflow apparatus.
- the thickness of the shell 200 is preferably manufactured to about 10 to 30 mm. This is because the most effective thermal insulation and insulation effect is exhibited at the thickness.
- the outer shell 200 may be configured to further include a thermal insulation member 210 to increase the thermal insulation effect.
- the insulating member 210 may be implemented by forming a pocket 220 in the outer shell 200 and mounting it therein, according to the temperature profile of the component to be soldered by the introduction of the insulating member 210. By appropriately selecting and using the thickness and type of the thermal insulation member 210, it will be possible to give an optimal thermal insulation and heat insulation effect to the outer shell (200).
- the insulating member 210 may utilize a variety of materials having a heating function, such as a film heater that can be used as a power source function by heat source accumulation, and if the thermal insulation temperature is to be further increased, the insulating member 210 may be further used. Can be.
- the outer shell 200 may further include a connection member 230 for connecting the insulators for the reflow apparatus.
- the connection member 230 may use a variety of materials, such as fasteners, magnets, Velcro tape, double-sided tape, snaps, hooks, knots, etc., the interval between the insulation body for the reflow device by the introduction of the connection member 230 It is effective to eliminate the heat, and more effectively prevent the heat discharge from the furnace.
- the detaching means 300 is provided on the outer shell 200 so that the heat insulating material 100 can be easily detached to the reflow device that is soldered by mounting a component on a substrate.
- the detachable means 300 may utilize a variety of detachable means commonly used, such as fasteners, magnets, Velcro tape, double-sided tape, snaps, hooks, knots.
- the present invention may further include an air inlet 400, an air outlet 500, and a ventilation control unit 600 as shown in FIG. 4.
- the air inlet 400 is formed through the insulator for the reflow device to introduce external air into the reflow device.
- the air outlet 500 is formed through the insulating body for the reflow device in order to outflow the internal air from the reflow device. That is, when the air inlet 400 and the air outlet 500 rapidly cool the heating furnace of the reflow apparatus, the movement of the air so that the low temperature outside air is rapidly introduced and the high temperature internal air is quickly flowed out. It is a passage.
- the ventilation control unit 600 is configured to open and close to reversibly block external air inflow or internal air outflow from the reflow apparatus.
- the ventilation control unit 600 is open when the air inlet is desired through the air inlet unit 400 or the air outlet unit 500 in the insulator for the reflow device of the present invention, when the air inlet is to be blocked It is characterized in that the reversible opening and closing means to be closed.
- the most preferable form is a zipper, the portion corresponding to the air inlet 400 or the air outlet 500 in the insulator for the reflow device is combined to be removable, but fasteners, magnets, Velcro tape, double-sided tape Various means of inspection may be utilized, such as snaps, hooks, and knots.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Thermal Insulation (AREA)
- Furnace Details (AREA)
Abstract
The present invention relates to an insulating body for a reflow device, and more specifically, to an insulating body for a reflow device comprising: an insulating material for blocking the entrance/exit of heat; an outer skin enshrouding the insulation material; and an attachment/detachment means provided on the outer skin to enable attachment/detachment of the insulating material on the reflow device for implementing on a substrate and brazing a component. The insulating body has superior insulating, adiabatic, anti-shatter, and shape maintenance effects compared to a conventional insulating material.
Description
본 발명은 리플로우 장치용 보온체에 관한 것으로써, 좀 더 상세하게는 열출입을 차단시키기 위한 단열재와 상기 단열재를 감싸고 있는 외피와 기판에 부품을 실장하여 납 땜 공정하는 리플로우 장치에 상기 단열재가 탈착 가능하도록 상기 외피의 외부에 구비된 탈착수단을 포함하여 구성되는 것을 특징으로 하는 리플로우 장치용 보온체에 관한 것이다. The present invention relates to a heat insulator for a reflow apparatus, and more particularly, to an insulator for blocking heat entry and exit, and to a reflow apparatus for soldering a component by mounting a component on an outer surface and a substrate surrounding the insulator. It relates to a heat insulating body for a reflow device, characterized in that it comprises a detachable means provided on the outside of the outer shell to be detachable.
리플로우 장치란 인쇄회로 배선기판의 제조공정에서 접합하려고 하는 부분에 크림 상의 땜납을 인쇄하고 땜납을 용융처리하여 접합시키는 장치이다. 리플로우 장치 내에는 납땜 온도가 설정된 뜨거운 가열로가 있는데, 인쇄회로 배선기판 상부에 땜납과 전자부품을 실장하고 상기 가열로를 통과시키면 상기 땜납이 녹으면서 상기 전자부품을 상기 인쇄회로 배선기판에 전기적으로 접속시키게 된다.The reflow apparatus is a device in which a creamy solder is printed on a portion to be joined in a manufacturing process of a printed circuit board and melted to solder. In the reflow apparatus, there is a hot heating furnace having a soldering temperature set. When solder and electronic components are mounted on the printed circuit wiring board and passed through the heating furnace, the solder melts to transfer the electronic components to the printed circuit wiring board. Will be connected.
납땜을 위한 가열로 내부온도는 약 200℃로, 상기 온도로 가열시키기 위해서는 많은 전력과 시간이 소비된다. 따라서, 상기 온도를 적절히 유지시키는 것은 비용절감과 시간절약을 위해 매우 긴요한 작업이다.The internal temperature of the furnace for soldering is about 200 ° C., which consumes a lot of power and time. Therefore, maintaining the temperature properly is a very critical task for cost savings and time savings.
종래에는 가열로를 상기 온도로 가열하고 유지시키기 위한 방법으로, 합성수지 재질의 단열재를 사용하거나, 합성수지 재질의 단열재 외부에 알루미늄을 증착하여 사용하였다. 그러나, 상기와 같은 단열재는 합성수지 재질만으로 구성되어 있어 보온 및 방열 효과를 충분히 발휘하지 못하고, 사용이 용이하지 않다는 문제점이 있었다. Conventionally, as a method for heating and maintaining a heating furnace at the above temperature, a heat insulating material made of synthetic resin is used or aluminum is deposited on the outside of the heat insulating material made of synthetic resin. However, the heat insulating material as described above is composed of only a synthetic resin material, there is a problem that the heat and heat dissipation effect is not sufficiently exhibited, it is not easy to use.
본 발명은 상기한 문제점을 해결하기 위한 것으로,The present invention is to solve the above problems,
첫째, 단열재의 공기 유동을 차단하여 단열효과를 증대시키고,First, increase the insulation effect by blocking the air flow of the insulation,
둘째, 별도의 열원없이 단열재만을 이용해 전기료 절감 효과를 발생시키며,Secondly, it generates electricity cost reduction effect using only insulation material without a separate heat source,
셋째, 단열재의 비산 현상을 방지하여 그 형태를 장기간 유지시키고,Third, to prevent the scattering of the insulating material to maintain its shape for a long time,
넷쩨, 리플로우 장치의 배선 접속을 해제시키지 않고 별도의 공구 없이 장착 가능하도록 하여 시공의 편의성을 제공하며,Provides convenience of installation by enabling installation without separate tools without disconnecting wiring connections of nets and reflow devices.
다섯째, 냉각시스템과 협력하여 화로 내 온도를 급강하시킬 수 있도록 하고, Fifth, in cooperation with the cooling system to lower the temperature in the furnace,
마지막으로, 별도로 보온부재 또는 단열재를 추가할 수 있도록 하여, 단열효과를 유동적으로 증대시킬 수 있도록 하고자 한다. Finally, to be able to add a thermal insulation member or a heat insulating material separately, to be able to increase the heat insulation effect fluidly.
상기한 과제를 달성하기 위하여 본 발명은, 열출입을 차단시키기 위한 단열재;와 상기 단열재를 감싸고 있는 외피;와 기판에 부품을 실장하여 납 땜 공정하는 리플로우 장치에 상기 단열재가 탈착 가능하도록 상기 외피에 구비된 탈착수단;을 포함하여 구성되는 것을 특징으로 한다. In order to achieve the above object, the present invention, the heat insulating material for blocking heat entry and exit; and the outer shell surrounding the heat insulating material; and the outer shell so that the heat insulating material is detachable to the reflow apparatus for soldering process by mounting the component on the substrate Desorption means provided in; characterized in that comprises a.
또한, 상기 외피에는 단열 효과를 증가시키기 위한 보온부재;를 더 포함하여 구성되는 것을 특징으로 한다.In addition, the outer shell is characterized in that it further comprises; a thermal insulation member for increasing the thermal insulation effect.
또한, 외부공기를 리플로우 장치에 유입시키기 위하여 상기 리플로우 장치용 보온체를 관통하여 형성된 공기유입부 및; 내부공기를 리플로우 장치로부터 유출시키기 위하여 상기 리플로우 장치용 보온체를 관통하여 형성된 공기유출부;를 더 포함하여 구성되는 것을 특징으로 한다.In addition, the air inlet formed to penetrate the insulator for the reflow device to introduce external air into the reflow device; And an air outlet formed through the insulator for the reflow device to allow the internal air to flow out of the reflow device.
또한, 상기 리플로우 장치로부터 공기의 출입을 가역적으로 차단하기 위하여 개폐가능하도록 형성된 통풍 조절부;를 더 포함하여 구성되는 것을 특징으로 한다.The apparatus may further include a ventilation control unit configured to be openable and closed to reversibly block the inflow and outflow of air from the reflow apparatus.
한편, 상기 외피는 유리섬유 소재로 구성되되 상기 외피의 상단은 실리카(silica) 및 옥타메틸시클로테트라실옥세인(octamethylcyclotetrasiloxane)으로 구성된 실리콘 혼합물을 함유하고, 상기 외피의 두께는 10 내지 30 mm인 것을 특징으로 한다.On the other hand, the outer shell is made of a glass fiber material, but the upper end of the outer shell contains a silicon mixture composed of silica (silica) and octamethylcyclotetrasiloxane (octamethylcyclotetrasiloxane), the thickness of the outer shell is characterized in that 10 to 30 mm It is done.
본 발명에 의하면, According to the invention,
첫째, 상기 단열재를 외피가 감싸고 있어 단열재의 공기 유동을 차단할 수 있으므로 보온 효과 및 방열 효과를 증대시킬 수 있고,First, the outer shell is wrapped around the insulating material can block the air flow of the insulating material can increase the warming effect and heat dissipation effect,
둘째, 별도의 열원없이 단열재만을 이용해 전기료 절감 효과를 발생시키며,Secondly, it generates electricity cost reduction effect using only insulation material without a separate heat source,
셋째, 상기 단열재의 외피에 의해 단열재의 비산 현상을 방지하여 그 형태를 장기간 유지시키고, 가열로의 형상에 따라 적용이 용이하며, 반복적인 탈부착이 가능하고, Third, by preventing the scattering phenomenon of the insulation by the outer shell of the insulation to maintain its shape for a long time, easy to apply according to the shape of the heating furnace, it is possible to repeatedly detachable,
넷째, 리플로의 장치의 배선 접속을 해제시킬 필요가 없어 별도의 공구 없이 장칙이 가능하며,Fourth, it is not necessary to disconnect the wiring of the reflow device, so it is possible to have a long time without any tools.
다섯째, 냉각시스템과 협력하여 화로 내 온도를 급강하시킬 수 있으며,Fifth, in cooperation with the cooling system can lower the temperature in the furnace,
여섯째, 외피 내에 별도의 보온부재를 추가하거나 단열재를 추가하여 단열효과를 유동적으로 증가시킬 수 있다.Sixth, it is possible to fluidly increase the heat insulation effect by adding a separate heat insulating member or heat insulating material in the outer shell.
도1a는 본 발명의 일실시예를 상측에서 보여주는 사시도.Figure 1a is a perspective view showing an embodiment of the present invention from above.
도1b는 본 발명의 일실시예를 하측에서 보여주는 사시도.Figure 1b is a perspective view showing one embodiment of the present invention from the bottom.
도2는 본 발명의 일실시예가 적용된 리플로우 장치의 정면도.2 is a front view of a reflow apparatus to which an embodiment of the present invention is applied.
도3은 본 발명의 다른 일실시예가 적용된 리플로우 장치의 정면도.Figure 3 is a front view of a reflow apparatus to which another embodiment of the present invention is applied.
도4는 본 발명의 또 다른 일실시예가 적용된 리플로우 장치의 정면도.Figure 4 is a front view of a reflow apparatus to which another embodiment of the present invention is applied.
이하에서는 첨부된 도면을 참조로 하여, 본 발명의 일 실시 예에 따른 리플로우 장치용 보온체를 상세히 설명한다. 우선, 도면들 중, 동일한 구성요소 또는 부품들은 가능한 한 동일한 참조부호로 나타내고 있음에 유의하여야 한다. Hereinafter, with reference to the accompanying drawings, a thermostat for a reflow apparatus according to an embodiment of the present invention will be described in detail. First, in the drawings, the same components or parts are to be noted that as indicated by the same reference numerals as possible.
본 발명은 도1 내지 도3에 도시된 바와 같이 크게, 단열재(100), 외피(200), 탈착수단(300)을 포함하여 구성된다. The present invention is largely configured as shown in Figures 1 to 3, including a heat insulating material 100, the outer shell 200, the removable means 300.
우선, 단열재(100)에 대하여 설명한다. 상기 단열재는 리플로우 장치 내에서 인쇄회로 배선기판 제조공정 중 인쇄회로 배선기판 상부에 전자부품을 실장하고 납땜하기 위하여 가열로의 온도를 약 200℃로 가열하고 상기 온도를 유지시키는 과정에서 가열로 내부와 외부의 열출입을 차단시키는 역할을 한다. 일반적으로 상기 단열재는 유리섬유 중 단섬유에 바인더를 첨가하여 압축 성형하는 글라스 울 제조법에 의한 단열재를 사용할 수 있다. 그러나, 상기 바인더는 온도에 의해 분해되기 쉽고 형상이 흐트러질 염려가 있으므로, 유리섬유 중 장섬유를 바인더 사용없이 직조하는 유리섬유 제조법에 의한 단열재를 사용하는 것이 더 바람직하다. 상기 유리섬유 제조법에 의한 단열재는 섬유 자체의 밀집, 비산 등이 없고, 단열성과 보온성이 뛰어나며, 분진 등에 의한 환경 오염의 염려도 적다는 장점이 있다.First, the heat insulating material 100 is demonstrated. The heat insulator is heated inside the furnace in the process of maintaining the temperature and heating the temperature of the furnace to about 200 ° C. in order to mount and solder the electronic component on the upper part of the printed circuit board during the manufacturing process of the PCB. It serves to block heat entry and exit. In general, the heat insulating material may be a heat insulating material according to the glass wool manufacturing method for compression molding by adding a binder to the short fiber of the glass fiber. However, since the binder is easily decomposed by the temperature and the shape may be disturbed, it is more preferable to use a heat insulating material according to a glass fiber manufacturing method for weaving long fibers in the glass fiber without using a binder. The heat insulating material according to the glass fiber manufacturing method has no advantage of dense, scattering, etc. of the fiber itself, excellent heat insulation and thermal insulation, there is less concern about environmental pollution by dust and the like.
다음으로, 외피(200)에 대해 설명한다. 상기 외피(200)는 상기 단열재(100)를 감싸고 있다. 즉, 상기 외피(200)는 주머니 또는 종이 봉투 형상 등 그 내부에 상기 단열재(100)를 넣기 쉽도록 다양한 형상으로 만들 수 있으며, 상기 외피(200) 내에 상기 단열재(100)를 넣고, 패스너, 자석, 밸크로 테이프, 양면 테이프, 스냅, 후크, 매듭 또는 특수 봉제실 등으로 봉합하여 제조할 수 있다. 상기 외피(200)는 상기 단열재(100)가 장기간 열화되면서 비산되는 현상을 방지하고, 보온 및 단열 효과를 향상시키는 작용을 한다. 상기 단열재(100)를 단독으로 사용하는 경우 공기의 유통으로 리플로우 장치 내부 열이 약 50% 정도 손실되지만, 상기 단열재(100)를 상기 외피(200)로 감싸면 열 손실률은 약 5% 미만으로 감소된다.Next, the outer shell 200 will be described. The envelope 200 surrounds the heat insulating material 100. That is, the envelope 200 may be made in various shapes to easily put the heat insulating material 100 therein, such as a bag or a paper bag shape, and put the heat insulating material 100 in the outer shell 200, fasteners, magnets It can be manufactured by sewing with Velcro tape, double-sided tape, snap, hook, knot or special sewing thread. The outer shell 200 serves to prevent the phenomenon that the thermal insulation material 100 is scattered while deteriorating for a long time, and to improve the thermal insulation and thermal insulation effect. When the insulation 100 is used alone, the internal flow of the reflow apparatus is lost by about 50% due to the distribution of air, but the heat loss rate is reduced to less than about 5% by wrapping the insulation 100 with the shell 200. do.
상기 외피(200)는 유리섬유로 제조되는 것이 바람직한데, 상기 외피(200)를 유리섬유로 제조하는 이유는 유리섬유의 내열온도가 약 800℃에 달하고, 열전도율이 1 이하이므로 공기의 유통을 효과적으로 차단하기 때문이다. The outer shell 200 is preferably made of glass fiber. The outer shell 200 is made of glass fiber because the heat resistance temperature of the glass fiber reaches about 800 ° C. and the thermal conductivity is 1 or less, thereby effectively circulating air. Because it blocks.
한편, 상기 외피(200)의 상단은 실리콘 혼합물을 더 함유하여 제조되는 것이 바람직하다. 상기 실리콘 혼합물은 실리카(silica)와 옥타메틸시클로테트라실옥세인(octamethylcyclotetrasiloxane)으로 구성되며, 상기 실리카(silica)와 옥타메틸시클로테트라실옥세인(octamethylcyclotetrasiloxane)의 함량은 상기 외피(200) 상단의 총 무게 대비 상기 실리카(silica)의 경우 약 10 내지 20 Wt%, 상기 옥타메틸시클로테트라실옥세인(octamethylcyclotetrasiloxane)의 경우 약 0.1 내지 1 Wt%로 구성되는 것이 특히 바람직하다. 이는 상기 실리콘 혼합물을 상기 비율만큼 함유시키는 경우, 리플로우 장치의 접촉면의 반대면인 상기 외피(200)의 상단을 통해 열이 전도되거나 투과되는 것을 더욱 효과적으로 방지할 수 있기 때문이다. On the other hand, the top of the shell 200 is preferably prepared by further containing a silicon mixture. The silicon mixture is composed of silica and octamethylcyclotetrasiloxane, and the content of the silica and octamethylcyclotetrasiloxane is greater than the total weight of the top of the shell 200. Particularly preferred is about 10 to 20 Wt% for the silica, about 0.1 to 1 Wt% for the octamethylcyclotetrasiloxane. This is because when the silicone mixture is contained in the ratio, heat can be more effectively prevented from being conducted or transmitted through the upper end of the shell 200, which is the opposite side of the contact surface of the reflow apparatus.
또한, 상기 외피(200)의 두께는 약 10 내지 30 mm로 제조하는 것이 바람직하다. 이는 상기 두께에서 가장 효과적인 보온 및 단열 효과가 발휘되기 때문이다.In addition, the thickness of the shell 200 is preferably manufactured to about 10 to 30 mm. This is because the most effective thermal insulation and insulation effect is exhibited at the thickness.
또한, 상기 외피(200)에는 단열 효과를 증가시키기 위한 보온부재(210)가 더 포함되어 구성될 수 있다. 상기 보온부재(210)는 상기 외피(200)에 포켓(220)을 형성하고 그 내부에 장착하는 방식으로 실시될 수 있는데, 상기 보온부재(210)의 도입으로 납땜하고자 하는 부품의 온도프로필에 따라 적절히 상기 보온부재(210)의 두께 및 종류를 선택하여 사용함으로써, 상기 외피(200)에 최적의 보온 및 단열 효과를 부여할 수 있을 것이다. 상기 보온부재(210)는 열원 축적에 의해 전원 기능으로 사용할 수 있는 필름 히터 등 가온 기능을 가지는 다양한 소재를 활용할 수 있고, 보온 온도를 더 높이고자 하는 경우 상기 보온부재(210)를 더 추가하여 사용할 수 있다.In addition, the outer shell 200 may be configured to further include a thermal insulation member 210 to increase the thermal insulation effect. The insulating member 210 may be implemented by forming a pocket 220 in the outer shell 200 and mounting it therein, according to the temperature profile of the component to be soldered by the introduction of the insulating member 210. By appropriately selecting and using the thickness and type of the thermal insulation member 210, it will be possible to give an optimal thermal insulation and heat insulation effect to the outer shell (200). The insulating member 210 may utilize a variety of materials having a heating function, such as a film heater that can be used as a power source function by heat source accumulation, and if the thermal insulation temperature is to be further increased, the insulating member 210 may be further used. Can be.
그리고, 상기 외피(200)에는 리플로우 장치용 보온체 상호간을 연결시키기 위한 접속부재(230)가 더 포함되어 구성될 수 있다. 상기 접속부재(230)는 패스너, 자석, 밸크로 테이프, 양면 테이프, 스냅, 후크, 매듭 등 다양한 소재를 사용할 수 있으며, 상기 접속부재(230)의 도입으로 상기 리플로우 장치용 보온체 상호간의 간격을 없애고, 가열로로부터의 열 방출을 더욱더 효과적으로 방지할 수 있는 효과가 있다. In addition, the outer shell 200 may further include a connection member 230 for connecting the insulators for the reflow apparatus. The connection member 230 may use a variety of materials, such as fasteners, magnets, Velcro tape, double-sided tape, snaps, hooks, knots, etc., the interval between the insulation body for the reflow device by the introduction of the connection member 230 It is effective to eliminate the heat, and more effectively prevent the heat discharge from the furnace.
한편, 상기 탈착수단(300)은 기판에 부품을 실장하여 납 땜 공정하는 리플로우 장치에 상기 단열재(100)가 용이하게 탈착 가능하도록 상기 외피(200)에 구비된다. 상기 탈착수단(300)은 패스너, 자석, 밸크로 테이프, 양면 테이프, 스냅, 후크, 매듭 등 일반적으로 사용되는 다양한 탈착수단을 활용할 수 있을 것이다. On the other hand, the detaching means 300 is provided on the outer shell 200 so that the heat insulating material 100 can be easily detached to the reflow device that is soldered by mounting a component on a substrate. The detachable means 300 may utilize a variety of detachable means commonly used, such as fasteners, magnets, Velcro tape, double-sided tape, snaps, hooks, knots.
한편, 본 발명은 도4에 도시된 바와 같이, 공기유입부(400), 공기유출부(500) 및 통풍 조절부(600)를 더 포함하여 구성될 수 있다. Meanwhile, the present invention may further include an air inlet 400, an air outlet 500, and a ventilation control unit 600 as shown in FIG. 4.
상기 공기유입부(400)는 외부공기를 리플로우 장치에 유입시키기 위하여 상기 리플로우 장치용 보온체를 관통하여 형성된다. 또한 상기 공기유출부(500)는 내부공기를 리플로우 장치로부터 유출시키기 위하여 상기 리플로우 장치용 보온체를 관통하여 형성된다. 즉, 상기 공기유입부(400) 및 공기유출부(500)는 리플로우 장치의 가열로를 급격히 냉각시킬 때, 저온의 외부공기가 신속히 유입되고 고온의 내부공기가 신속히 유출될 수 있도록 공기의 이동통로가 된다. The air inlet 400 is formed through the insulator for the reflow device to introduce external air into the reflow device. In addition, the air outlet 500 is formed through the insulating body for the reflow device in order to outflow the internal air from the reflow device. That is, when the air inlet 400 and the air outlet 500 rapidly cool the heating furnace of the reflow apparatus, the movement of the air so that the low temperature outside air is rapidly introduced and the high temperature internal air is quickly flowed out. It is a passage.
또한, 통풍 조절부(600)는 리플로우 장치로부터 외부공기 유입 또는 내부공기 유출을 가역적으로 차단하기 위하여 개폐가능하도록 형성된 구성이다. 상기 통풍 조절부(600)는 본 발명인 리플로우 장치용 보온체에서 공기유입부(400) 또는 공기유출부(500)를 통하여 공기의 출입을 원하는 경우에는 개방되고, 공기의 출입을 차단하고자 하는 경우에는 폐쇄될 수 있도록 가역적인 개폐 수단인 것을 특징으로 한다. 가장 바람직한 형태로는 지퍼로 리플로우 장치용 보온체에서 공기유입부(400) 또는 공기유출부(500)에 부합하는 부분이 분리 가능하도록 결합된 형상이지만, 패스너, 자석, 밸크로 테이프, 양면 테이프, 스냅, 후크, 매듭 등 다양한 탈찰수단이 활용될 수도 있을 것이다.In addition, the ventilation control unit 600 is configured to open and close to reversibly block external air inflow or internal air outflow from the reflow apparatus. The ventilation control unit 600 is open when the air inlet is desired through the air inlet unit 400 or the air outlet unit 500 in the insulator for the reflow device of the present invention, when the air inlet is to be blocked It is characterized in that the reversible opening and closing means to be closed. The most preferable form is a zipper, the portion corresponding to the air inlet 400 or the air outlet 500 in the insulator for the reflow device is combined to be removable, but fasteners, magnets, Velcro tape, double-sided tape Various means of inspection may be utilized, such as snaps, hooks, and knots.
이상에서는 도면과 명세서에서 최적 실시 예들이 개시되었다. 여기서 특정한 용어들이 사용되었으나, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미 한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로 본 기술분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시 예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.In the foregoing description, optimal embodiments have been disclosed in the drawings and the specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.
Claims (5)
- 열출입을 차단시키기 위한 단열재;와 Insulation material to block heat entry; And상기 단열재를 감싸고 있는 외피;와 Outer shell surrounding the insulation; and기판에 부품을 실장하여 납 땜 공정하는 리플로우 장치에 상기 단열재가 탈착 가능하도록 상기 외피에 구비된 탈착수단;을 포함하여 구성되는 것을 특징으로 하는 리플로우 장치용 보온체.And a desorption means provided in the outer shell so that the heat insulating material is detachable to the reflow device that is soldered by mounting a component on a substrate.
- 청구항 제1항에 있어서,The method of claim 1,상기 외피에는 단열 효과를 증가시키기 위한 보온부재;를 더 포함하여 구성되는 것을 특징으로 하는 리플로우 장치용 보온체.The outer shell is a thermal insulation member for increasing the thermal insulation effect; the thermal insulation for a reflow device, characterized in that it further comprises.
- 청구항 제2항에 있어서,The method according to claim 2,외부공기를 리플로우 장치에 유입시키기 위하여 상기 리플로우 장치용 보온체를 관통하여 형성된 공기유입부 및; An air inlet formed through the insulator for the reflow device to introduce external air into the reflow device;내부공기를 리플로우 장치로부터 유출시키기 위하여 상기 리플로우 장치용 보온체를 관통하여 형성된 공기유출부;를 더 포함하여 구성되는 것을 특징으로 하는 리플로우 장치용 보온체.And an air outlet formed through the insulator for reflow device to allow the internal air to flow out of the reflow device.
- 청구항 제3항에 있어서, The method of claim 3, wherein상기 리플로우 장치로부터 공기의 출입을 가역적으로 차단하기 위하여 개폐가능하도록 형성된 통풍 조절부;를 더 포함하여 구성되는 것을 특징으로 하는 리플로우 장치용 보온체.And a ventilation controller configured to be openable and closed to reversibly block air from the reflow apparatus.
- 청구항 제1항에 있어서,The method of claim 1,상기 외피는 유리섬유 소재로 구성되되 상기 외피의 상단은 실리카(silica) 및 옥타메틸시클로테트라실옥세인(octamethylcyclotetrasiloxane)으로 구성된 실리콘 혼합물을 함유하고, 상기 외피의 두께는 10 내지 30 mm인 것을 특징으로 하는 리플로우 장치용 보온체.The outer shell is composed of a glass fiber material, the upper end of the outer shell contains a silicone mixture composed of silica (silica) and octamethylcyclotetraoxane (octamethylcyclotetrasiloxane), the thickness of the outer shell is characterized in that 10 to 30 mm Thermostat for reflow device.
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PCT/KR2011/008238 WO2012157823A1 (en) | 2011-05-19 | 2011-11-01 | Insulation body for reflow device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3170508U (en) |
KR (1) | KR101116187B1 (en) |
CN (1) | CN102892541A (en) |
WO (1) | WO2012157823A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010011352A (en) * | 1999-07-27 | 2001-02-15 | 윤종용 | Soldering apparatus for screen printer |
JP2002016353A (en) * | 2000-06-28 | 2002-01-18 | Canon Inc | Reflow soldering method and mounting board |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2754517A1 (en) * | 1977-12-07 | 1979-06-13 | Wacker Chemie Gmbh | PROCESS FOR IMPROVING THERMAL PROTECTION OBJECTS |
JP2000165031A (en) * | 1998-11-26 | 2000-06-16 | Koyo Thermo System Kk | Reflow furnace |
JP4271299B2 (en) * | 1999-06-28 | 2009-06-03 | 光洋サーモシステム株式会社 | Reflow furnace |
US7402778B2 (en) * | 2005-04-29 | 2008-07-22 | Asm Assembly Automation Ltd. | Oven for controlled heating of compounds at varying temperatures |
JP5264079B2 (en) * | 2007-01-12 | 2013-08-14 | 有限会社ヨコタテクニカ | Heating device |
JP2010155269A (en) * | 2008-12-27 | 2010-07-15 | Senju Metal Ind Co Ltd | Solder bath and method of heating solder contained in the solder bath |
-
2011
- 2011-05-19 JP JP2011003193U patent/JP3170508U/en not_active Expired - Fee Related
- 2011-10-31 KR KR1020110111993A patent/KR101116187B1/en active IP Right Grant
- 2011-11-01 CN CN2011800045134A patent/CN102892541A/en active Pending
- 2011-11-01 WO PCT/KR2011/008238 patent/WO2012157823A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010011352A (en) * | 1999-07-27 | 2001-02-15 | 윤종용 | Soldering apparatus for screen printer |
JP2002016353A (en) * | 2000-06-28 | 2002-01-18 | Canon Inc | Reflow soldering method and mounting board |
Also Published As
Publication number | Publication date |
---|---|
JP3170508U (en) | 2011-09-22 |
CN102892541A (en) | 2013-01-23 |
KR101116187B1 (en) | 2012-03-06 |
KR20110126091A (en) | 2011-11-22 |
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