JP4271299B2 - Reflow furnace - Google Patents

Reflow furnace Download PDF

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Publication number
JP4271299B2
JP4271299B2 JP18170999A JP18170999A JP4271299B2 JP 4271299 B2 JP4271299 B2 JP 4271299B2 JP 18170999 A JP18170999 A JP 18170999A JP 18170999 A JP18170999 A JP 18170999A JP 4271299 B2 JP4271299 B2 JP 4271299B2
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Japan
Prior art keywords
packing
outside
furnace
heat insulating
housing
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JP18170999A
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JP2001015905A (en
Inventor
洋幸 武田
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Koyo Thermo Systems Co Ltd
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Koyo Thermo Systems Co Ltd
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Description

【0001】
【発明の属する技術分野】
この発明は、ハウジングを上下に分割したリフロー炉に関する。
【0002】
【従来の技術】
例えば、プリント基板に各種デバイスを実装する際に、これらを接合する、一般にはんだリフロー工程と呼ばれるはんだ付け処理が、リフロー炉を用いて行われる。
上記リフロー炉では、炉内全体をはんだの溶着温度に均一に加熱保持するために、炉内に設けたヒータによって加熱された炉内空気を、同じく炉内に設けられたファンによって強制的に攪拌することが行われる。
当該リフロー炉は、メンテナンスの容易化を図るために、断熱性を有する下部ハウジングの上部に断熱性を有する上部ハウジングを分離可能に重ね合わせた構造が採用されており、各ハウジングの重ね合わせ部分は、炉内空気が外部に漏出しないようにシールされている。このシール手段として、発泡シリコン製パッキンが用いられ、このパッキンは上部ハウジングと下部ハウジングとの重ね合わせ面の間に挿入されている。
【0003】
【発明が解決しようとする課題】
しかしながら、従来のリフロー炉においては、パッキンを下部ハウジングと上部ハウジングとの重ね合わせ面の間に置いて、これを上下方向から押し付けて密閉しているので、パッキンの側面は前記重ね合わせ面のパッキンの厚さに相当する隙間を通って浸入する炉内空気と直接接触する。このため、はんだの溶融時に発生するフラックスヒュームガスが、炉内空気とともにパッキンに接触してこれを腐食させる。また、パッキンの温度は、炉内空気の接触と、ハウジングの重ね合わせ面からの伝熱とにより、耐熱温度以上の250〜260℃にも上昇する。上記の原因でパッキンが劣化して、上下重ね合わせ部のシールが損なわれると、ガスが外部に漏出する。この漏出防止のため、早い段階でパッキンを取り換えなければならない問題がある。
上記のような従来の問題点に鑑み、この発明は、パッキンの劣化の少ないハウジングを上下に分割したリフロー炉を提供することを目的とする。
【0004】
【課題を解決するための手段】
上記目的を達成するためのこの発明のリフロー炉は、断熱材を有する下部ハウジングの上部に断熱を有する上部ハウジングを分離可能に重ね合わせ、これらハウジングの重ね合わせ面から炉内空気が漏れるのをパッキンにより防止しているリフロー炉において、
前記下部ハウジングの前記重ね合わせ面の外側かつ前記断熱材より外側に形成された外方に延びる下鍔部と、前記上部ハウジングの前記重ね合わせ面の外側かつ前記断熱材より外側に形成された外方に延びる上鍔部とにより、前記断熱材の外側において炉体の外方に開口する環状保持部が構成され、前記上部ハウジングの重ね合わせ面と前記下部ハウジングの重ね合わせ面とが互いに密着させられると共に、前記パッキンは、その外側面全体を外方に露出させかつ前記断熱材との間に隙間をおいた状態で前記環状保持部内に挟持され、両ハウジング間が密閉されていることを特徴とするものである。
上記構成のリフロー炉によれば、重ね合わせ面どうしを密着させているとともに、この重ね合わせ面の外方にパッキンを設けているので、フラックス等から発生するガスを含む炉内空気が直接パッキンに接触するのを抑制できる。また、パッキンを各ハウジングの外側の上下鍔部で構成した環状保持部に、その外側面全体を外方に露出させかつ前記断熱材との間に隙間をおいた状態で挟んでいるので、パッキンに対するハウジングからの熱伝導が少なく、パッキンに加えられた熱を放散し易い。このため、パッキンの温度上昇が抑えられる。特に、パッキンがハウジングの側壁と直接接触しないので、側壁からの伝熱による昇温が防止される。
【0005】
上記リフロー炉は、上記各ハウジングの外側板が、複数の通風孔を有し、この外側板と断熱材との間に隙間を設けることが好ましい(請求項2)。
この場合は、ハウジングの断熱材と外側板との隙間に空気層を設けることができ、この隙間で加熱された空気を、外側板に設けた通風孔を通して、外気と置換させることができるので、パッキンの昇温をさらに抑えることができる。
【0007】
【発明の実施の形態】
以下この発明の実施の形態について、添付図面を参照しながら詳述する。図1はこの発明のリフロー炉の一つの実施の形態を示す断面図である。
この発明のリフロー炉は、上部ハウジング1と下部ハウジング2とに分割された炉体Rと、炉内空気を昇温させるための加熱ヒータ7と、炉内全体を均一に昇温させるために炉内空気を攪拌するファン4と、このファン4を回転させるモータ5と、炉内空気が炉体Rの外部に漏出するのを防止するパッキン3と、被加熱基板Aを搬送するチェーンコンベア6とで主要部が構成されている。
【0008】
上記炉体Rを構成する各ハウジング1,2は、金属板10,20間にグラスウール等の断熱材12,22を挟んだ断熱構造のものであり、上部ハウジング1は下部ハウジング2の上に分離可能に重ね合わせてある。上記上部ハウジング1と下部ハウジング2の、それぞれの重ね合わせ面1a、2aは、平滑面であり、互いに密着させて重ね合わせてある。
【0009】
上記上部ハウジング1と下部ハウジング2のそれぞれの側壁11,21の外側板13,23は、それぞれ断熱材12,22の側面との間で隙間を設けて配置されている。このため、側壁11、21は断熱材12,22に加えて、その外側に空気層Bが設けられた2重構造である。上記外側板13,23には、上記空気層Bを外気と置換させるための複数の通風孔13a,23aが設けられている。
上記上部ハウジング1と下部ハウジング2の上記重ね合わせ面1a、2aに近接した位置には、外方に延びる上鍔部1bと下鍔部2bが設けられ、先端部で上記外側板13,23に連結されている。
【0010】
上記上鍔部1bと下鍔部2bは、互いに近接した状態で炉体Rの重ね合わせ部の全体に亘って設けられており、両者で炉体の外方に開口する環状保持部が形成され、この環状保持部内にパッキン3を挟んで炉体Rを密封している。この上下鍔部1b、2bは、図の場合各ハウジング1,2の内面の金属板10,20に連続させて形成している。上記パッキン3は、発泡シリコンゴム製リングであり、上記ハウジング1,2の側壁11,21の下側面との間に隙間を置いて配置されている。
【0011】
上記上部ハウジング1の炉内上部には、ファン4が設けられ、その下方には加熱ヒータ7が設けられ、当該ファン4は上記上部ハウジング1の外部に固定されたモータ5に連結されている。上記加熱ヒータ7は通電によって炉内空気を加熱することができる。このため、上記加熱ヒータ7によって加熱された炉内空気を、上記ファン4によって循環させることにより、熱風循環経路aが形成される。したがって、被加熱基板Aは、上記加熱ヒータ7の下方を上記下部ハウジング2内部に設けられたチェーンコンベア6によって搬送される間、熱風によって加熱される。
【0012】
上記構成であれば、加熱ヒータ7で炉内空気を昇温させ、この炉内空気をファン4で攪拌して、熱風循環経路aに沿って炉内を循環させることができる。このとき、上部ハウジング1の重ね合わせ面1aと下部ハウジング2の重ね合わせ面2aとを密着させ、且つパッキン3を炉体Rの外側に設けているので、はんだの溶融時に発生するフラックスヒュームガスを含む炉内空気が直接パッキン3に接触するのを防止できる。このため、炉内空気によってパッキン3が昇温したり、前記ガスによってパッキン3が腐食したりするのを抑制できる。
また、パッキン3を、上下鍔部1b、2bを介して各ハウジング1,2に取り付けているので、パッキン3が各ハウジング1,2からの伝熱によって昇温するのが抑制される。 特にこの実施の形態においては、各側壁11,21とパッキン3との間に隙間を設けているので、各側壁11,21からの伝熱によってパッキン3が昇温するのが、より効果的に抑制される。また、各断熱材12,22と外側板13,23との間の空気層B内の空気を、外側板13,23に設けた通風孔13a,23aによって外気と置換させるので、パッキン3の昇温をさらに抑えることができる。したがって、鍔部1b、2bとパッキン3とによって、炉内を密閉状態に維持でき、かつパッキン3を劣化させることがない。
【0013】
【発明の効果】
以上のように、請求項1に係るリフロー炉によれば、はんだの溶融時に発生するフラックスヒュームガスを含む炉内空気がパッキンと接触するのを抑制でき、さらに、ハウジングからパッキンへの伝熱が抑制されるので、腐食や温度上昇によるパッキンの劣化が少ない。このため、パッキンの取り換え頻度が少なくメンテナンスが容易である。
【0014】
請求項2に係るリフロー炉によれば、パッキンの昇温をさらに抑制できるので、パッキンの劣化がさらに抑制される。
【0015】
請求項3に係るリフロー炉によれば、ハウジングからパッキンへの伝熱による、パッキンの温度上昇が抑制されるので、パッキンの劣化抑制にさらに効果がある。
【図面の簡単な説明】
【図1】この発明のリフロー炉の一つの実施の形態を示す断面図である。
【符号の説明】
1 上部ハウジング
11 側壁
12 断熱材
13 外側板
13a 通風孔
1a 重ね合わせ面
1b 鍔部
2 下部ハウジング
21 側壁
22 断熱材
2a 重ね合わせ面
2b 鍔部
23 外側板
23a 通風孔
3 パッキン
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a reflow furnace in which a housing is divided into upper and lower parts.
[0002]
[Prior art]
For example, when various devices are mounted on a printed circuit board, a soldering process generally called a solder reflow process is performed using a reflow furnace.
In the above reflow furnace, the furnace air heated by the heater provided in the furnace is forcibly agitated by a fan provided in the furnace in order to keep the entire furnace uniformly heated to the welding temperature of the solder. To be done.
In order to facilitate maintenance, the reflow furnace employs a structure in which a heat-insulating upper housing is detachably superposed on an upper part of a heat-insulating lower housing. The furnace air is sealed so as not to leak to the outside. As this sealing means, a foamed silicon packing is used, and this packing is inserted between the overlapping surfaces of the upper housing and the lower housing.
[0003]
[Problems to be solved by the invention]
However, in the conventional reflow furnace, the packing is placed between the overlapping surfaces of the lower housing and the upper housing and is pressed from above and below to be sealed, so the side surface of the packing is the packing of the overlapping surface. It is in direct contact with the furnace air entering through the gap corresponding to the thickness. For this reason, the flux fume gas generated when the solder melts contacts the packing together with the air in the furnace and corrodes it. Moreover, the temperature of packing rises to 250-260 degreeC more than heat-resistant temperature by the contact of the air in a furnace, and the heat transfer from the overlapping surface of a housing. If the packing deteriorates due to the above causes and the seal of the upper and lower overlapping parts is damaged, gas leaks to the outside. In order to prevent this leakage, there is a problem that the packing must be replaced at an early stage.
In view of the above-described conventional problems, an object of the present invention is to provide a reflow furnace in which a housing with little packing deterioration is divided into upper and lower parts.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, a reflow furnace according to the present invention is configured such that an upper housing having a heat insulating material is detachably overlapped on an upper portion of a lower housing having a heat insulating material, and air in the furnace leaks from the overlapping surfaces of these housings. In the reflow furnace that is prevented by packing,
An outwardly extending lower collar portion formed outside the overlapping surface of the lower housing and outside the heat insulating material, and an outside formed outside the overlapping surface of the upper housing and outside the heat insulating material. by an upper flange portion extending towards said annular holding portion which opens outwardly of the furnace body outside of the heat insulating material is constituted, it was superposed surface and adhered overlapping surfaces and each other of the lower housing of the upper housing together is, the packing is held between the annular holding portion in a state in which a gap between its outer surface a whole or one prior Symbol insulation material is exposed to the outside, that between the two housings is sealed It is characterized by.
According to the reflow furnace having the above configuration, the overlapping surfaces are brought into close contact with each other, and the packing is provided outside the overlapping surfaces, so that the furnace air containing the gas generated from the flux or the like is directly applied to the packing. The contact can be suppressed. Further, the annular holding portion configured packing in the upper and lower flange portion of the outside of each housing, the sandwich in a state where a gap between its outer surface a whole or One prior Symbol insulation material is exposed to the outside The heat conduction from the housing to the packing is small, and the heat applied to the packing is easily dissipated. For this reason, the temperature rise of packing is suppressed. In particular, since the packing does not directly contact the side wall of the housing, temperature rise due to heat transfer from the side wall is prevented.
[0005]
In the reflow furnace, it is preferable that the outer plate of each housing has a plurality of ventilation holes, and a gap is provided between the outer plate and the heat insulating material.
In this case, an air layer can be provided in the gap between the heat insulating material of the housing and the outer plate, and the air heated in this gap can be replaced with outside air through the ventilation holes provided in the outer plate. The temperature rise of the packing can be further suppressed.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an embodiment of a reflow furnace according to the present invention.
The reflow furnace of the present invention includes a furnace body R divided into an upper housing 1 and a lower housing 2, a heater 7 for raising the temperature of the furnace air, and a furnace for uniformly raising the temperature inside the furnace. A fan 4 that stirs the internal air, a motor 5 that rotates the fan 4, a packing 3 that prevents the air in the furnace from leaking outside the furnace body R, and a chain conveyor 6 that conveys the substrate A to be heated. The main part is composed of.
[0008]
The housings 1 and 2 constituting the furnace body R have a heat insulating structure in which heat insulating materials 12 and 22 such as glass wool are sandwiched between the metal plates 10 and 20, and the upper housing 1 is separated on the lower housing 2. Overlapping is possible. The overlapping surfaces 1a and 2a of the upper housing 1 and the lower housing 2 are smooth surfaces and are overlapped with each other.
[0009]
The outer plates 13 and 23 of the side walls 11 and 21 of the upper housing 1 and the lower housing 2 are disposed with a gap between the side surfaces of the heat insulating materials 12 and 22, respectively. For this reason, in addition to the heat insulating materials 12 and 22, the side walls 11 and 21 have a double structure in which an air layer B is provided outside thereof. The outer plates 13 and 23 are provided with a plurality of ventilation holes 13a and 23a for replacing the air layer B with outside air.
An upper flange portion 1b and a lower flange portion 2b extending outward are provided at positions close to the overlapping surfaces 1a and 2a of the upper housing 1 and the lower housing 2, and the outer plates 13 and 23 are provided at the distal end portions. It is connected.
[0010]
The upper flange portion 1b and the lower flange portion 2b are provided over the entire overlapping portion of the furnace body R in a state of being close to each other , and an annular holding portion that opens to the outside of the furnace body is formed by both. The furnace body R is sealed with the packing 3 sandwiched between the annular holding portions. The upper and lower flange portions 1b and 2b are formed continuously with the metal plates 10 and 20 on the inner surfaces of the housings 1 and 2 in the figure. The packing 3 is a foamed silicon rubber ring, and is disposed with a gap between the lower side surfaces of the side walls 11 and 21 of the housings 1 and 2.
[0011]
A fan 4 is provided in the upper part of the furnace of the upper housing 1, and a heater 7 is provided below the fan 4. The fan 4 is connected to a motor 5 fixed to the outside of the upper housing 1. The heater 7 can heat the furnace air by energization. For this reason, the hot air circulation path a is formed by circulating the furnace air heated by the heater 7 by the fan 4. Accordingly, the substrate A to be heated is heated by hot air while being conveyed by the chain conveyor 6 provided inside the lower housing 2 below the heater 7.
[0012]
If it is the said structure, the temperature in furnace can be heated up with the heater 7, this furnace air can be stirred with the fan 4, and the inside of a furnace can be circulated along the hot air circulation path | route a. At this time, since the overlapping surface 1a of the upper housing 1 and the overlapping surface 2a of the lower housing 2 are brought into close contact with each other and the packing 3 is provided outside the furnace body R, the flux fume gas generated when the solder is melted is removed. It is possible to prevent the in-furnace air contained from coming into direct contact with the packing 3. For this reason, it can suppress that the packing 3 heats up with furnace air, or the packing 3 corrodes with the said gas.
In addition, since the packing 3 is attached to the housings 1 and 2 via the upper and lower flange portions 1b and 2b, it is possible to prevent the packing 3 from being heated by heat transfer from the housings 1 and 2. Particularly in this embodiment, since a gap is provided between the side walls 11 and 21 and the packing 3, it is more effective that the temperature of the packing 3 is raised by heat transfer from the side walls 11 and 21. It is suppressed. In addition, the air in the air layer B between the heat insulating materials 12 and 22 and the outer plates 13 and 23 is replaced with the outside air by the ventilation holes 13a and 23a provided in the outer plates 13 and 23. The temperature can be further suppressed. Therefore, the inside of the furnace can be maintained in a sealed state by the flange portions 1b and 2b and the packing 3, and the packing 3 is not deteriorated.
[0013]
【The invention's effect】
As described above, according to the reflow furnace according to the first aspect, the furnace air containing the flux fume gas generated when the solder is melted can be prevented from coming into contact with the packing, and heat transfer from the housing to the packing can be prevented. Since it is suppressed, there is little deterioration of the packing due to corrosion or temperature rise. For this reason, the replacement frequency of the packing is small and maintenance is easy.
[0014]
According to the reflow furnace according to claim 2, since the temperature rise of the packing can be further suppressed, the deterioration of the packing is further suppressed.
[0015]
According to the reflow furnace according to the third aspect, since the temperature rise of the packing due to heat transfer from the housing to the packing is suppressed, it is further effective in suppressing the deterioration of the packing.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of a reflow furnace according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Upper housing 11 Side wall 12 Heat insulating material 13 Outer side plate 13a Ventilation hole 1a Overlapping surface 1b Gutter part 2 Lower housing 21 Side wall 22 Heat insulating material 2a Overlapping surface 2b Gutter part 23 Outer plate 23a Ventilation hole 3 Packing

Claims (2)

断熱材を有する下部ハウジングの上部に断熱を有する上部ハウジングを分離可能に重ね合わせ、これらハウジングの重ね合わせ面から炉内空気が漏れるのをパッキンにより防止しているリフロー炉において、
前記下部ハウジングの前記重ね合わせ面の外側かつ前記断熱材より外側に形成された外方に延びる下鍔部と、前記上部ハウジングの前記重ね合わせ面の外側かつ前記断熱材より外側に形成された外方に延びる上鍔部とにより、前記断熱材の外側において炉体の外方に開口する環状保持部が構成され、前記上部ハウジングの重ね合わせ面と前記下部ハウジングの重ね合わせ面とが互いに密着させられると共に、前記パッキンは、その外側面全体を外方に露出させかつ前記断熱材との間に隙間をおいた状態で前記環状保持部内に挟持され、両ハウジング間が密閉されていることを特徴とするリフロー炉。
In the reflow furnace in which the upper housing having the heat insulating material is detachably overlapped on the upper portion of the lower housing having the heat insulating material, and the air inside the furnace is prevented from leaking from the overlapping surface of these housings by packing,
An outwardly extending lower collar portion formed outside the overlapping surface of the lower housing and outside the heat insulating material, and an outside formed outside the overlapping surface of the upper housing and outside the heat insulating material. by an upper flange portion extending towards said annular holding portion which opens outwardly of the furnace body outside of the heat insulating material is constituted, it was superposed surface and adhered overlapping surfaces and each other of the lower housing of the upper housing together is, the packing is held between the annular holding portion in a state in which a gap between its outer surface a whole or one prior Symbol insulation material is exposed to the outside, that between the two housings is sealed Reflow furnace characterized by.
前記各ハウジングの外側板が、複数の通風孔を有し、この外側板と断熱材との間に隙間を設けた請求項1記載のリフロー炉。The reflow furnace according to claim 1, wherein the outer plate of each housing has a plurality of ventilation holes, and a gap is provided between the outer plate and the heat insulating material.
JP18170999A 1999-06-28 1999-06-28 Reflow furnace Expired - Lifetime JP4271299B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18170999A JP4271299B2 (en) 1999-06-28 1999-06-28 Reflow furnace

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18170999A JP4271299B2 (en) 1999-06-28 1999-06-28 Reflow furnace

Publications (2)

Publication Number Publication Date
JP2001015905A JP2001015905A (en) 2001-01-19
JP4271299B2 true JP4271299B2 (en) 2009-06-03

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JP3170508U (en) * 2011-05-19 2011-09-22 勝美 釣賀 Thermal insulator for reflow furnace
JP6547237B1 (en) 2019-02-26 2019-07-24 千住金属工業株式会社 Soldering apparatus and method for fixing packing to soldering apparatus
JP7028835B2 (en) * 2019-08-26 2022-03-02 株式会社タムラ製作所 Heating furnace and transfer heating equipment
CN116551101A (en) * 2022-01-27 2023-08-08 伊利诺斯工具制品有限公司 Sealing assembly and reflow oven with same

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US4747533A (en) * 1986-04-28 1988-05-31 International Business Machines Corporation Bonding method and apparatus
JPH06268B2 (en) * 1988-02-23 1994-01-05 エイティックテクトロン株式会社 Reflow soldering method and device
JPH0573496U (en) * 1992-03-05 1993-10-08 光洋リンドバーグ株式会社 Solder reflow equipment
JP3141306B2 (en) * 1992-08-31 2001-03-05 エイテックテクトロン株式会社 Automatic soldering equipment

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