WO2012151789A1 - Method and apparatus for implanting laser-induced plasma into substrate - Google Patents

Method and apparatus for implanting laser-induced plasma into substrate Download PDF

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Publication number
WO2012151789A1
WO2012151789A1 PCT/CN2011/077731 CN2011077731W WO2012151789A1 WO 2012151789 A1 WO2012151789 A1 WO 2012151789A1 CN 2011077731 W CN2011077731 W CN 2011077731W WO 2012151789 A1 WO2012151789 A1 WO 2012151789A1
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workpiece
cavity
laser
plasma
sealed
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PCT/CN2011/077731
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French (fr)
Chinese (zh)
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任旭东
李应红
皇甫喁卓
汪诚
阮亮
何卫峰
周鑫
楚维
张永康
戴峰泽
张田
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江苏大学
中国人民解放军空军工程大学
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Publication of WO2012151789A1 publication Critical patent/WO2012151789A1/en

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/48Ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32321Discharge generated by other radiation
    • H01J37/32339Discharge generated by other radiation using electromagnetic radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412Plasma immersion ion implantation

Definitions

  • the invention relates to the technical field of ion implantation device and ion implantation material processing, and particularly relates to a method and a device for injecting metal ions into a surface layer of a substrate by separating high energy pulse laser induced plasma.
  • Injecting ions of other elements into the surface layer of the material can cause changes in the properties of the substrate. For example, injecting Mo and W ions into the steel can enhance the impact resistance characteristics; injecting N ions into the aluminum alloy can increase the hardness; injecting N into the titanium alloy, C ion can improve corrosion resistance and fatigue resistance; injecting Al ions into steel sections to improve heat resistance, abrasion resistance and corrosion resistance, this technology is applicable to semiconductors, metal materials, ceramic materials, polymer materials, optical materials, etc. Surface modification. It has been widely used in the industrial field. Various countries have produced various ion implanters, 20N ion implanters produced by American Ion Implant Science, and Tra 1090 ion implanters produced by Danish Physics.
  • Metal vapor vacuum arc (MEVVA) ion implantation is an advanced high-current, large-area line-of-sight processing technology.
  • This metal ion source ion implanter has reached a practical stage. At present, the largest metal ion source ion implanter ion beam is extracted. The diameter of the device has reached 500mm and the beam current is up to 10A, but the metal ion source ion implantation is still a line of sight process.
  • J., Department of Nuclear Engineering, University of Wisconsin, USA, 1987 R. Conrad proposed the "plasma source ion implantation" technology and obtained the US patent in 1988.
  • Commonly used plasma generating methods include a DC filament heating and discharging power source, a microwave excitation source, an electron cyclotron resonance excitation source, an RF excitation source, and a capacitive coupling excitation source, each having advantages and disadvantages.
  • the ion implantation process always has the problem of shallow injection layers.
  • the present invention uses a laser-induced plasma as an ion source to produce a high density plasma without contamination.
  • the method of ion implantation referred to in the present invention can overcome the above disadvantages by using laser induced plasma and radiant heating of the workpiece.
  • the ion source is clean, the reaction speed is fast, the depth of the injection layer is large, and the hardness is high.
  • the main process of the invention for ion implantation is that a high-energy short-pulse intense laser strikes a metal foil, and the metal foil absorbs high-energy short-pulse laser energy to instantaneously vaporize and ionize, and generates a high-temperature plasma, which is composed of metal ions, electrons, and uncharged atoms. Composition, plasma absorption followed by laser energy expansion and explosion. During the plasma explosion, the repulsive force between the electron and the negative potential workpiece causes the electron to move away from the workpiece, part of the electron is absorbed by the positive charge plate, and the other part is left in the next reaction process.
  • the phase suction between the positive-valence metal ions and the negative-potential workpiece causes the metal ions to move toward the workpiece, hitting the surface of the workpiece at a great speed, and completing the metal ion implantation.
  • the movement speed of metal ions is superimposed and synthesized in two parts. One is the shock wave formed by the plasma expansion and explosion, and the other is the attraction of the electric field. Heating can increase the depth of the ion strengthening layer, increase the hardness of the injection layer, and improve the quality and efficiency of ion implantation.
  • the apparatus of the present invention includes three systems: a plasma generation system, a vacuum reaction chamber system, and a workpiece system.
  • the plasma generation system includes a high power neodymium glass laser that excites a high energy short pulse laser, a 45° full mirror, a focusing lens, and a laser ablation material attached to the inner side of the upper glass plate.
  • the vacuum reaction chamber system comprises: a cylindrical sealed cavity formed of high pressure resistant glass, the upper glass cover is circular, the diameter of which is slightly larger than the diameter of the cavity, and the upper glass cover and the cavity are sealed and connected by a sealing ring, The glass cover can be opened and sealed to the cavity under working conditions.
  • the chamber is evacuated to a predetermined degree of vacuum via a bleed hole.
  • arc-shaped charge receiving plates are mounted on the inner wall of the cavity, which are located on two perpendicular diameters of the cavity, and the opposite two blocks are arranged one above the other, which is advantageous for the electrons and negative ions to be sufficiently absorbed.
  • the charge sensor is mounted on a charge receiving plate and a positive voltage source is coupled to the charge receiving plate for inputting and controlling the amount of positive charge on the positive charge receiving plate.
  • a sensor that monitors the pressure inside the chamber is located at the bottom of the chamber and is connected to an external pressure gauge. The connecting wires inside and outside the cavity pass through the same position of the cavity and are sealed. There are two elliptical cylindrical legs under the cavity.
  • the workpiece system includes: the workpiece is positioned and clamped on the inverted trapezoidal workbench, and the worktable is equipped with a liftable table support.
  • the length of the support is controlled to control the up and down rotation angle of the workbench to meet the requirements of the bevel processing.
  • the shape of the bracket is cylindrical, and the cavity is sealed with a large elastic sealing ring to ensure that the sealing ring is still in a sealed working state after the bracket is moved.
  • the radiant heater is located in a recessed portion below the workbench, the heater adopts a radiant heating method, the heating wire is a molybdenum wire, and the molybdenum wire is uniformly arranged in parallel in the same plane, and the cylindrical portion of the radiant heater and the lower end of the cavity are sealed by a sealing ring.
  • a temperature sensor for measuring the temperature of the workpiece is placed on the workpiece and connected to the temperature display meter outside the chamber to monitor the operating temperature of the workpiece.
  • a pulsed negative high voltage source is connected to the workpiece to apply a negative potential to the workpiece. All wires are sealed at the same location as the wires of the vacuum reaction chamber.
  • the computer controls the parameter setting of the laser, records the change in charge on the positive charge plate, and controls the lift of the table support.
  • the temperature of the workpiece is controlled by the temperature sensor at 600 ⁇ 800 °C; the positive power supply is turned on on the positive charge plate, the positive potential is 3 ⁇ 5kv, the pulse on the workpiece is connected to the negative high voltage source, and the negative potential is 40. ⁇ 60kv, pulse width 50 ⁇ 100 ⁇ s, pulse repetition frequency 50Hz;
  • the radiant heater is used to heat the workpiece, and the heating can increase the depth of the ion strengthening layer, increase the hardness of the injection layer, and improve the quality and efficiency of ion implantation;
  • the device uses a variety of sensors and computer systems to monitor the reaction process online in real time.
  • Figure 1 is a schematic illustration of the apparatus for laser induced plasma implantation into the surface of a workpiece.
  • the internal pressure reaches 10-2 ⁇ 10-1Pa; the radiant heater power supply is turned on to heat the workpiece, and the temperature of the workpiece is controlled by the temperature sensor (21) at 600 ⁇ 800 °C; the positive power supply is turned on on the positive charge plate.
  • the pulse on the workpiece is connected to the negative high voltage source (17), negative potential 60kv, pulse width 50 ⁇ s, pulse repetition frequency 50Hz; start high-power neodymium glass laser (1), set the laser energy 50J, pulse width 10ns, spot diameter 8mm and other parameters by computer (19), laser shock
  • the aluminum ions in the aluminum plasma move to the surface of the workpiece at a great speed under the double action of the shock wave and the electric field to achieve ion implantation.
  • the laser again impacts other parts of the aluminum foil to increase the aluminum ion.
  • the concentration was repeated 3 times. After 30 minutes of reaction, all power was turned off and the workpiece was removed.

Abstract

The present invention relates to the technical field of ion implantation apparatus and ion implantation material processing. A method and apparatus for implanting laser-induced plasma into a workpiece. A high-power short-pulse intense laser beam stimulated by a laser impacts a metal foil (13). The metal foil instantaneously vaporizes and ionizes by absorbing the energy of the high-power short-pulse laser beam, thereby generating a high-temperature plasma. The plasma is constituted by metal ions (11), electrons (12), and uncharged atoms. The plasma expands and explodes by absorbing subsequent laser energies. During the plasma explosion process, a repulsive force between the electrons (12) and a negative potential-connecting workpiece (6) makes the electrons (6) to move away from the workpiece (6). A positively charged plate neutralizes some of the electrons (12). An attractive force between metal cations (11) and the negative potential workpiece (6) makes the metal ions (11) to move towards the workpiece (6). By superimposition of the shock wave effect formed by the expansion and explosion of the plasma and the attraction effect of electric fields, the metal ions are blasted at a great speed onto a surface of the workpiece (6), thus completing the implantation of metal ions.

Description

一种激光诱导等离子体注入基材的方法及装置 Method and device for injecting laser induced plasma into substrate 技术领域Technical field
本发明涉及离子注入装置和离子注入材料加工技术领域,特指一种通过分离高能脉冲激光诱导的等离子体中的金属离子注入基材表层的方法和装置。 The invention relates to the technical field of ion implantation device and ion implantation material processing, and particularly relates to a method and a device for injecting metal ions into a surface layer of a substrate by separating high energy pulse laser induced plasma.
背景技术Background technique
在材料表层注入其他元素的离子,可以引起基材性能的变化,例如在钢中注入Mo、W离子可增强抗冲击特性;在铝合金中注入N离子可以提高硬度;在钛合金中注入N、C离子可以提高抗腐蚀、抗疲劳性能;在型钢中注入Al离子提高耐热性、抗磨损性和耐腐蚀性,这种技术适用于半导体、金属材料、陶瓷材料、高分子材料、光学材料等的表面改性。在工业领域已经得到广泛应用,各国生产出各种离子注入机,美国离子注入科学公司生产的20N型离子注入机,丹麦物理公司生产的丹物1090型离子注入机。金属蒸汽真空弧(MEVVA)离子注入是一种先进的强流、大面积视线加工处理技术,这种金属离子源离子注入机已达到实用化阶段,目前最大的金属离子源离子注入机离子束引出器直径已达500mm,束流达10A,但是该金属离子源离子注入毕竟还是一个视线过程。为了克服离子束注入机的视线过程,1987年美国威斯康星大学核工程系的J. R. Conrad提出了“等离子体源离子注入”技术,并于1988年获得美国专利。常用的等离子体产生方法有直流灯丝加热放电源、微波激发源、电子回旋共振激发源、射频激发源和电容耦合激发源,其各有优缺点。总的来说离子注入工艺方法始终存在着注入层浅的问题。本发明首次使用激光诱导的等离子体作为离子源,产生高密度等离子体且无污染。 Injecting ions of other elements into the surface layer of the material can cause changes in the properties of the substrate. For example, injecting Mo and W ions into the steel can enhance the impact resistance characteristics; injecting N ions into the aluminum alloy can increase the hardness; injecting N into the titanium alloy, C ion can improve corrosion resistance and fatigue resistance; injecting Al ions into steel sections to improve heat resistance, abrasion resistance and corrosion resistance, this technology is applicable to semiconductors, metal materials, ceramic materials, polymer materials, optical materials, etc. Surface modification. It has been widely used in the industrial field. Various countries have produced various ion implanters, 20N ion implanters produced by American Ion Implant Science, and Danke 1090 ion implanters produced by Danish Physics. Metal vapor vacuum arc (MEVVA) ion implantation is an advanced high-current, large-area line-of-sight processing technology. This metal ion source ion implanter has reached a practical stage. At present, the largest metal ion source ion implanter ion beam is extracted. The diameter of the device has reached 500mm and the beam current is up to 10A, but the metal ion source ion implantation is still a line of sight process. In order to overcome the line-of-sight process of the ion beam implanter, J., Department of Nuclear Engineering, University of Wisconsin, USA, 1987 R. Conrad proposed the "plasma source ion implantation" technology and obtained the US patent in 1988. Commonly used plasma generating methods include a DC filament heating and discharging power source, a microwave excitation source, an electron cyclotron resonance excitation source, an RF excitation source, and a capacitive coupling excitation source, each having advantages and disadvantages. In general, the ion implantation process always has the problem of shallow injection layers. For the first time, the present invention uses a laser-induced plasma as an ion source to produce a high density plasma without contamination.
技术问题technical problem
本发明所指离子注入的方法采用激光诱导等离子体和对工件辐射加热可以克服上述缺点,离子源清洁,反应速度快,注入层深度大、硬度高。 The method of ion implantation referred to in the present invention can overcome the above disadvantages by using laser induced plasma and radiant heating of the workpiece. The ion source is clean, the reaction speed is fast, the depth of the injection layer is large, and the hardness is high.
技术解决方案Technical solution
本发明实现离子注入的主要过程是高能短脉冲强激光冲击到金属箔上,金属箔吸收高能短脉冲激光能量瞬间气化、电离,产生高温等离子体,其由金属离子、电子和不带电的原子构成,等离子吸收后续激光能量膨胀爆炸,等离子体爆炸过程中,电子与负电位工件之间的相斥力使电子背离工件运动,一部分电子被正电荷板吸收,另一部分留到下一次反应过程中。正价金属离子与负电位工件之间的相吸力使金属离子朝着工件运动,以极大的速度打在工件表面,完成金属离子注入。金属离子的运动速度有两部分叠加合成,一是等离子体膨胀爆炸形成的冲击波作用,二是电场的吸引作用。加热可以增加离子强化层深度、提高注入层硬度和提高离子注入的质量和效率。The main process of the invention for ion implantation is that a high-energy short-pulse intense laser strikes a metal foil, and the metal foil absorbs high-energy short-pulse laser energy to instantaneously vaporize and ionize, and generates a high-temperature plasma, which is composed of metal ions, electrons, and uncharged atoms. Composition, plasma absorption followed by laser energy expansion and explosion. During the plasma explosion, the repulsive force between the electron and the negative potential workpiece causes the electron to move away from the workpiece, part of the electron is absorbed by the positive charge plate, and the other part is left in the next reaction process. The phase suction between the positive-valence metal ions and the negative-potential workpiece causes the metal ions to move toward the workpiece, hitting the surface of the workpiece at a great speed, and completing the metal ion implantation. The movement speed of metal ions is superimposed and synthesized in two parts. One is the shock wave formed by the plasma expansion and explosion, and the other is the attraction of the electric field. Heating can increase the depth of the ion strengthening layer, increase the hardness of the injection layer, and improve the quality and efficiency of ion implantation.
本发明的装置包括三个系统:等离子体发生系统、真空反应腔系统和工件系统。The apparatus of the present invention includes three systems: a plasma generation system, a vacuum reaction chamber system, and a workpiece system.
等离子体发生系统包括:激发高能短脉冲激光的大功率钕玻璃激光器,45°全反镜,聚焦透镜和贴于上玻璃板内侧的激光烧蚀材料。The plasma generation system includes a high power neodymium glass laser that excites a high energy short pulse laser, a 45° full mirror, a focusing lens, and a laser ablation material attached to the inner side of the upper glass plate.
真空反应腔系统包括:由耐高压玻璃构成的圆柱形密封腔体,上玻璃盖板为圆形,其直径稍大于腔体直径,上玻璃盖板与腔体之间通过密封圈密封连接,上玻璃盖板可以打开,工作情况下,其与腔体密封固定。腔体侧壁的一侧的上方位置有一个进气孔,相对的另一侧的下方位置有一个出气孔,进气孔用来打入工作气体,如氮离子注入时输入氮气源,抽气泵经由抽气孔把腔体内抽成预定真空度。腔体内壁上安装四块弧形电荷接收板,位于腔体两条垂直的直径上,且相对的两块上下错落布置,这样有利于电子和负离子充分被吸收。电荷传感器安装在电荷接收板上,正电压源连接在电荷接收板上,用来输入并控制正电荷接收板上的正电荷量。监测腔体内压的传感器位于腔体底部,与腔外压力计相连。所有腔内外的连接导线通过腔体的同一位置,且密封。腔体下方有两个椭圆柱形脚架。The vacuum reaction chamber system comprises: a cylindrical sealed cavity formed of high pressure resistant glass, the upper glass cover is circular, the diameter of which is slightly larger than the diameter of the cavity, and the upper glass cover and the cavity are sealed and connected by a sealing ring, The glass cover can be opened and sealed to the cavity under working conditions. There is an air inlet hole at a position above one side of the side wall of the cavity, and an air outlet hole at a lower position of the other side of the opposite side, the air inlet hole is used for driving a working gas, for example, a nitrogen source is input when nitrogen ion is injected, and the air pump is used. The chamber is evacuated to a predetermined degree of vacuum via a bleed hole. Four arc-shaped charge receiving plates are mounted on the inner wall of the cavity, which are located on two perpendicular diameters of the cavity, and the opposite two blocks are arranged one above the other, which is advantageous for the electrons and negative ions to be sufficiently absorbed. The charge sensor is mounted on a charge receiving plate and a positive voltage source is coupled to the charge receiving plate for inputting and controlling the amount of positive charge on the positive charge receiving plate. A sensor that monitors the pressure inside the chamber is located at the bottom of the chamber and is connected to an external pressure gauge. The connecting wires inside and outside the cavity pass through the same position of the cavity and are sealed. There are two elliptical cylindrical legs under the cavity.
工件系统包括:工件定位夹紧于倒梯形工作台,工作台下有可升降工作台支架,通过改变支架的长度来控制工作台上下旋转角度,以满足斜面加工的要求。支架形状为圆柱形,其与腔体通过弹性大密封圈密封,保证支架移动后,密封圈还处于密封工作状态。辐射加热器位于工作台下方的凹陷部分,加热器采用辐射式加热方式,加热丝为钼丝,钼丝同一平面内平行均匀布置,辐射加热器圆柱部分与腔体下端由密封圈密封。测量工件温度的温度传感器安置在工件上与腔外温度显示计相连,监测工件的工作温度。脉冲负高压源连接在工件上,给工件施加负电位。所有导线与真空反应腔的导线位于同一位置密封。计算机控制激光器的参数设置、记录正电荷板上电荷变化情况和控制工作台支架的升降。The workpiece system includes: the workpiece is positioned and clamped on the inverted trapezoidal workbench, and the worktable is equipped with a liftable table support. The length of the support is controlled to control the up and down rotation angle of the workbench to meet the requirements of the bevel processing. The shape of the bracket is cylindrical, and the cavity is sealed with a large elastic sealing ring to ensure that the sealing ring is still in a sealed working state after the bracket is moved. The radiant heater is located in a recessed portion below the workbench, the heater adopts a radiant heating method, the heating wire is a molybdenum wire, and the molybdenum wire is uniformly arranged in parallel in the same plane, and the cylindrical portion of the radiant heater and the lower end of the cavity are sealed by a sealing ring. A temperature sensor for measuring the temperature of the workpiece is placed on the workpiece and connected to the temperature display meter outside the chamber to monitor the operating temperature of the workpiece. A pulsed negative high voltage source is connected to the workpiece to apply a negative potential to the workpiece. All wires are sealed at the same location as the wires of the vacuum reaction chamber. The computer controls the parameter setting of the laser, records the change in charge on the positive charge plate, and controls the lift of the table support.
本发明方法具体步骤为:The specific steps of the method of the present invention are:
1. 用砂纸磨除工件表面的氧化层并抛光,然后使用乳化剂、无水乙醇除油清洗;1. Use a sandpaper to remove the oxide layer on the surface of the workpiece and polish it, then remove it with an emulsifier and absolute ethanol.
2. 上升工作台支架到一定高度,从腔体上方把预处理后的工件固定夹紧在工作台上,在工件表面贴上温度传感器、侧部连上脉冲负高压源接头,然后下降工作台到工作高度,调节辐射加热器的位置,再把加热器、工作台支架与耐高压真空腔之间的接触部分密封好;2. Raise the table support to a certain height, fix the pre-processed workpiece to the workbench from above the cavity, attach a temperature sensor to the surface of the workpiece, connect the pulsed negative high-voltage source connector to the side, and then lower the workbench to work. Height, adjust the position of the radiant heater, and then seal the contact part between the heater, the table bracket and the high pressure resistant vacuum chamber;
3. 在上玻璃板上贴上一层金属箔,然后把玻璃板盖在腔体上,金属箔向下,由密封板密封,再施力固定;3. Put a layer of metal foil on the upper glass plate, then cover the glass plate on the cavity, the metal foil is downward, sealed by the sealing plate, and then fixed by force;
4. 封紧进气孔,用真空泵从抽气孔抽腔内气体,观察压力表,使内压达到10-4~10-1Pa;4. Seal the air inlet hole, pump the gas from the air suction hole with a vacuum pump, observe the pressure gauge, and make the internal pressure reach 10-4~10-1Pa;
5. 接通辐射加热器电源对工件加热,由温度传感器控制工件温度在600~800℃;正电荷板上接通通正电源,正电位3~5kv,工件上接通脉冲负高压源,负电位40~60kv,脉冲宽度50~100μs,脉冲重复频率50Hz;5. Turn on the radiant heater power supply to heat the workpiece, the temperature of the workpiece is controlled by the temperature sensor at 600~800 °C; the positive power supply is turned on on the positive charge plate, the positive potential is 3~5kv, the pulse on the workpiece is connected to the negative high voltage source, and the negative potential is 40. ~60kv, pulse width 50~100μs, pulse repetition frequency 50Hz;
6. 打开激光器,由计算机设置激光的能量、脉冲宽度、光斑直径等参数,激光冲击金属箔3次,待反应完成后,关闭所有电源,取下工件。6. Turn on the laser, set the laser energy, pulse width, spot diameter and other parameters by the computer. The laser strikes the metal foil 3 times. After the reaction is completed, all the power supplies are turned off and the workpiece is removed.
有益效果Beneficial effect
本法明的有益效果为:The beneficial effects of this Act are:
1. 使用激光气化电离金属箔产生等离子体作为离子源,清洁高效,快速获得金属离子;1. Using a laser gasification ionized metal foil to generate plasma as an ion source, cleaning and efficient, and quickly obtaining metal ions;
2. 注入离子打到工件的速度快,速度由等离子体冲击波和电场作用叠加获得;2. The speed at which the implanted ions hit the workpiece is fast, and the velocity is obtained by superimposing the plasma shock wave and the electric field;
3. 用辐射加热器对工件辐射加热,加温可以增加离子强化层深度、提高注入层硬度和提高离子注入的质量和效率;3. The radiant heater is used to heat the workpiece, and the heating can increase the depth of the ion strengthening layer, increase the hardness of the injection layer, and improve the quality and efficiency of ion implantation;
4. 克服了传统离子注入直射性问题,同时可以进行金属离子和非金属离子的注入,非金属离子注入时,从进气孔输入反应气体;4. Overcoming the problem of traditional ion implantation directivity, and simultaneously injecting metal ions and non-metal ions, and inputting reaction gas from the air inlet when non-metal ions are injected;
5. 装置运用了多种传感器和计算机系统,可以实时在线监测反应过程。5. The device uses a variety of sensors and computer systems to monitor the reaction process online in real time.
附图说明DRAWINGS
图1本发明关于激光诱导等离子体注入工件表面的装置原理图。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of the apparatus for laser induced plasma implantation into the surface of a workpiece.
图中:1大功率激光器,2聚焦透镜,3全反镜,4进气孔,5电荷接收板,6工件,7工作台,8辐射加热器,9密封板,10可升降工作台支架,11金属离子,12电子,13金属箔,14耐高压玻璃板,15中性粒子,16密封板,17脉冲负高压源,18电荷传感器及正电压源,19计算机,20抽气孔,21工件温度传感器,22压力计,23压力传感器,24腔体。In the figure: 1 high power laser, 2 focusing lens, 3 full mirror, 4 air inlet, 5 charge receiving board, 6 workpiece, 7 working table, 8 radiant heater, 9 sealing plate, 10 lifting table bracket, 11 metal ion, 12 electrons, 13 metal foil, 14 high pressure resistant glass plate, 15 neutral particles, 16 sealing plate, 17 pulse negative high voltage source, 18 charge sensor and positive voltage source, 19 computers, 20 suction holes, 21 workpiece temperature Sensor, 22 pressure gauge, 23 pressure sensor, 24 cavity.
本发明的实施方式Embodiments of the invention
下面结合附图并使用实例详细说明本发明提出的方法和装置的细节及工作情况。The details and operation of the method and apparatus proposed by the present invention will be described in detail below with reference to the accompanying drawings.
工件材料00Cr12耐热钢,用砂纸磨除工件表面的氧化层并抛光,然后用无水乙醇除油清洗;上升工作台支架(10)到一定高度,从腔体上方把预处理后的工件(6)固定夹紧在工作台(7)上,在工件表面贴上温度传感器(21)、侧部连上脉冲负高压源(17)接头,然后下降工作台到工作高度,调节辐射加热器(8)的位置,再把加热器、工作台支架与耐高压真空腔之间的接触部分(9)密封好;在上玻璃板(14)上贴上一层金属箔(13),然后把玻璃板盖在腔体上,金属箔向下,由密封板(16)密封,再施力固定;封紧进气孔(4),用真空泵从抽气孔(20)抽腔内气体,观察压力表(22),使内压达到10-2~10-1Pa;接通辐射加热器电源对工件加热,由温度传感器(21)控制工件温度在600~800℃;正电荷板上接通通正电源(18),正电位3kv,工件上接通脉冲负高压源(17),负电位60kv,脉冲宽度50μs,脉冲重复频率50Hz;启动大功率钕玻璃激光器(1),由计算机(19)设置激光的能量50J、脉冲宽度10ns、光斑直径8mm等参数,激光冲击金属箔,铝等离子体中的铝离子在冲击波和电场的双重作用下,以极大的速度运动到工件表面,实现离子注入,待反应5分钟后,激光再次冲击铝箔上其他部分以增加铝离子浓度,重复3次,待反应30分钟后,关闭所有电源,取下工件。 Work material 00Cr12 heat-resistant steel, sanding off the oxide layer on the surface of the workpiece and polishing it, then degreasing with absolute ethanol; raising the table support (10) to a certain height, and taking the pre-processed workpiece from above the cavity ( 6) Fixedly clamped on the table (7), attach the temperature sensor (21) to the surface of the workpiece, connect the pulsed negative high voltage source (17) to the side, then lower the table to the working height and adjust the radiant heater ( 8), seal the contact part (9) between the heater, the table bracket and the high pressure vacuum chamber; attach a layer of metal foil (13) to the upper glass plate (14), and then put the glass The plate cover is on the cavity, the metal foil is downward, sealed by the sealing plate (16), and then fixed by force; the air inlet hole (4) is sealed, and the gas is evacuated from the air suction hole (20) by a vacuum pump, and the pressure gauge is observed. (22), the internal pressure reaches 10-2~10-1Pa; the radiant heater power supply is turned on to heat the workpiece, and the temperature of the workpiece is controlled by the temperature sensor (21) at 600~800 °C; the positive power supply is turned on on the positive charge plate. (18), positive potential 3kv, the pulse on the workpiece is connected to the negative high voltage source (17), negative potential 60kv, pulse width 50μs, pulse repetition frequency 50Hz; start high-power neodymium glass laser (1), set the laser energy 50J, pulse width 10ns, spot diameter 8mm and other parameters by computer (19), laser shock In the metal foil, the aluminum ions in the aluminum plasma move to the surface of the workpiece at a great speed under the double action of the shock wave and the electric field to achieve ion implantation. After 5 minutes of reaction, the laser again impacts other parts of the aluminum foil to increase the aluminum ion. The concentration was repeated 3 times. After 30 minutes of reaction, all power was turned off and the workpiece was removed.

Claims (7)

  1. 一种激光诱导等离子体注入基材的方法,其特征在于,激光烧蚀金属箔诱导的等离子体作为离子源,通过电场的分离,其中金属离子在等离子体爆炸产生的冲击波和电场力的加速作用下,以极大的速度注入到加热工况下的基材表层。 A method for laser-inducing plasma into a substrate, characterized in that a laser ablated metal foil-induced plasma is used as an ion source, and an electric field is separated, wherein a shock wave and an electric field force generated by a metal ion in a plasma explosion are accelerated. Next, it is injected into the surface layer of the substrate under heating conditions at a great speed.
  2. 根据权利要求1所示的一种激光诱导等离子体注入工件的方法,其特征在于,具体实施步骤为:A method of injecting a workpiece by laser induced plasma according to claim 1, wherein the specific implementation steps are:
    (1) 用砂纸磨除工件表面的氧化层并抛光,然后使用乳化剂、无水乙醇除油清洗;(1) Grinding off the oxide layer on the surface of the workpiece with sandpaper and polishing it, then removing it with an emulsifier and anhydrous ethanol;
    (2) 上升工作台支架,从腔体上方把预处理后的工件固定夹紧在工作台上,在工件表面贴上温度传感器、侧部连上脉冲负高压源接头,然后下降工作台到工作高度,调节辐射加热器的位置,再把加热器、工作台支架与耐高压真空腔之间的接触部分密封好;(2) Raise the table support, fix the pre-processed workpiece to the workbench from above the cavity, attach a temperature sensor to the surface of the workpiece, connect the pulsed negative high-voltage source connector to the side, and then lower the table to the working height and adjust The position of the radiant heater is sealed, and the contact portion between the heater, the table bracket and the high pressure resistant vacuum chamber is sealed;
    (3) 在上玻璃板上贴上一层金属箔,然后把玻璃板盖在腔体上,金属箔向下,由密封板密封,再施力固定;(3) Put a layer of metal foil on the upper glass plate, then cover the glass plate on the cavity, the metal foil is downward, sealed by the sealing plate, and then fixed by force;
    (4) 封紧进气孔,用真空泵从抽气孔抽腔内气体,观察压力表,使内压达到10-3~10-1Pa;(4) Sealing the air inlet hole, pumping the gas from the air suction hole with a vacuum pump, observing the pressure gauge to make the internal pressure reach 10-3~10-1Pa;
    (5) 接通辐射加热器电源对工件加热,由温度传感器控制工件温度在600~800℃;正电荷板上接通通正电源,正电位3~5kv,工件上接通脉冲负高压源,负电位40~60kv,脉冲宽度50~100μs,脉冲重复频率50Hz;(5) Turn on the radiant heater power supply to heat the workpiece, the temperature of the workpiece is controlled by the temperature sensor at 600~800 °C; the positive power supply is turned on on the positive charge plate, the positive potential is 3~5kv, the pulse on the workpiece is connected to the negative high voltage source, and the negative potential is 40. ~60kv, pulse width 50~100μs, pulse repetition frequency 50Hz;
    (6)打开激光器,由计算机设置激光的能量、脉冲宽度、光斑直径参数,激光冲击金属箔不同位置3次,待反应完成后,关闭所有电源,取下工件。(6) Turn on the laser, set the energy, pulse width and spot diameter parameters of the laser by the computer. The laser impacts the metal foil at different positions three times. After the reaction is completed, turn off all the power supplies and remove the workpiece.
  3. 实施权利要求2所述的一种激光诱导等离子体注入基材的方法的装置,其特征在于,由等离子体发生系统、真空反应腔系统、工件系统和计算机(19)组成;Apparatus for performing a method of laser-induced plasma injecting a substrate according to claim 2, comprising: a plasma generating system, a vacuum reaction chamber system, a workpiece system, and a computer (19);
    等离子体发生系统包括激发高能短脉冲激光的大功率钕玻璃激光器(1),45°全反镜(3),聚焦透镜(2),激光烧蚀材料(13);The plasma generating system comprises a high-power neodymium glass laser (1) for exciting high-energy short-pulse laser, a 45° full-mirror (3), a focusing lens (2), and a laser ablation material (13);
    真空反应腔系统包括:腔体(24)、进气孔(4)、抽气孔(20)、上玻璃板与腔体连接的密封板(16)、工作台支架、辐射加热器与腔体下端连接的密封板(9),电荷接收板(5)、电荷传感器及正电压源(18)、压力传感器(23)及压力计(22);所述腔体(24)为圆柱形密封腔体(24),上玻璃盖板为圆形,其直径大于腔体直径,所述上玻璃盖板与腔体之间通过密封圈密封连接;所述腔体(24)侧壁的一侧的上方位置有一个进气孔(4),相对称的另一侧的下方位置有一个抽气孔(20),抽气泵经由抽气孔(20)把腔体内抽成预定真空度;所述腔体(24)内壁上沿圆周均匀设置四块弧形电荷接收板(5),与腔体直径条垂直,相对的两块电荷接收板(5)上下错落布置;电荷传感器安装在电荷接收板上,正电压源连接在电荷接收板上,用来输入并控制正电荷接收板上的正电荷量;压力传感器(23) 位于腔体(24)底部,与腔外压力计相连,监测腔体(24)内压;腔体下方设有两个椭圆柱形脚架。The vacuum reaction chamber system comprises: a cavity (24), an air inlet hole (4), a suction hole (20), a sealing plate (16) connected to the upper glass plate and the cavity, a table support, a radiant heater and a lower end of the cavity a sealed sealing plate (9), a charge receiving plate (5), a charge sensor and a positive voltage source (18), a pressure sensor (23) and a pressure gauge (22); the cavity (24) is a cylindrical sealed cavity (24) The upper glass cover is circular, the diameter of which is larger than the diameter of the cavity, and the upper glass cover and the cavity are sealedly connected by a sealing ring; the side of the side wall of the cavity (24) is above The position has an air inlet hole (4), and a lower side of the opposite side has a suction hole (20), and the air suction pump draws the cavity into a predetermined vacuum through the air suction hole (20); the cavity (24) The inner wall is uniformly disposed with four arc-shaped charge receiving plates (5) along the circumference, perpendicular to the cavity diameter strips, and the opposite two charge receiving plates (5) are arranged up and down; the charge sensor is mounted on the charge receiving plate, and the positive voltage is The source is connected to the charge receiving plate for inputting and controlling the amount of positive charge on the positive charge receiving plate; the pressure sensor (23) Located at the bottom of the cavity (24), connected to the external pressure gauge, monitoring the internal pressure of the cavity (24); there are two elliptical cylindrical legs under the cavity.
  4. 根据权利要求3所述的一种激光诱导等离子体注入基材的装置,其特征在于,所述工件系统包括工作台(7)、辐射加热器(8)、工作台支架(10)、温度传感器(21)和脉冲负高压源(17);所述工件(6)定位夹紧于倒梯形工作台(7),所述工作台(7)下有升降工作台支架,通过改变支架的长度来控制工作台上下旋转角度满足斜面加工的要求;所述工作台支架(10)形状为圆柱形,与腔体通过弹性大密封圈密封;所述辐射加热器(8)位于工作台下方的凹陷部分,所述辐射加热器(8)圆柱部分与腔体下端由密封圈密封;所述温度传感器(21)安置在工件上与腔外温度显示计相连,监测工件的工作温度;所述脉冲负高压源(17)连接在工件上,给工件施加负电位。A device for injecting a plasma into a substrate according to claim 3, wherein the workpiece system comprises a table (7), a radiant heater (8), a table holder (10), and a temperature sensor. (21) and a pulsed negative high voltage source (17); the workpiece (6) is positioned and clamped to the inverted trapezoidal table (7), and the table (7) has a lifting table bracket underneath, by changing the length of the bracket The upper and lower rotation angles of the control table meet the requirements of the bevel processing; the table support (10) is cylindrical in shape, and is sealed with the cavity by a large elastic sealing ring; the radiant heater (8) is located in a recessed portion below the workbench The cylindrical portion of the radiant heater (8) and the lower end of the cavity are sealed by a sealing ring; the temperature sensor (21) is disposed on the workpiece and connected to the external temperature display meter to monitor the working temperature of the workpiece; The source (17) is connected to the workpiece to apply a negative potential to the workpiece.
  5. 根据权利要求3所述的一种激光诱导等离子体注入基材的装置,其特征在于,所述计算机(19)控制激光器的参数设置、记录正电荷板上电荷变化情况和控制工作台支架的升降。A device for injecting a plasma into a substrate according to claim 3, wherein said computer (19) controls parameter setting of the laser, records changes in charge on the positive charge plate, and controls lifting of the table support .
  6. 根据权利要求3所述的一种激光诱导等离子体注入基材的装置,其特征在于,所述真空腔为透明耐高压玻璃。A device for injecting a plasma into a substrate according to claim 3, wherein the vacuum chamber is a transparent high pressure glass.
  7. 根据权利要求3所述的一种激光诱导等离子体注入基材的装置,其特征在于,所述辐射加热器(8)用辐射式加热方式,加热丝为钼丝,钼丝同一平面内平行均匀布置。The apparatus for injecting a substrate by laser induced plasma according to claim 3, wherein the radiant heater (8) is heated by radiant heating, and the heating wire is molybdenum wire, and the molybdenum wire is parallel and uniform in the same plane. Arrangement.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114380517A (en) * 2021-12-09 2022-04-22 杭州航天电子技术有限公司 Device and method for sealing titanium alloy connector
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102513440B (en) * 2011-12-16 2013-10-23 江苏大学 Method and device for forming magnesium alloy formed parts with excellent high-temperature mechanical property
CN102978628A (en) * 2012-11-27 2013-03-20 中国人民解放军空军工程大学 Method for carrying out anatonosis by adopting laser plasma impact wave in chemical heat treatment process
CN104044017B (en) * 2014-06-06 2016-07-13 江苏大学 A kind of finishing method based on laser blast wave
CN105751251A (en) * 2014-12-16 2016-07-13 哈尔滨市三和佳美科技发展有限公司 Negative pressure high-temperature production cabin
CN104745999B (en) * 2015-03-02 2017-03-08 安徽工业大学 A kind of method and device of the endoporus hole wall impact spraying based on laser shock wave technology
CN104651569B (en) * 2015-03-02 2016-10-12 江西省科学院应用物理研究所 A kind of surface modifying method of cast iron
CN106856160B (en) * 2016-11-23 2018-06-26 大连民族大学 With the method for induced with laser excitation radio frequency plasma under hypobaric
CN107160040B (en) * 2017-07-10 2018-10-12 江苏大学 A kind of sheet laser back reflection synergy welding method of auxiliary electric field regulation and control back side energy field
CN108411274A (en) * 2018-04-27 2018-08-17 天津大学 The preparation method of the pulse laser Plasma inpouring of Mg/Zn graded alloy
CN110556280B (en) * 2018-06-01 2022-08-16 北京北方华创微电子装备有限公司 Plasma generating device and ion implantation apparatus
CN114457317A (en) * 2021-12-22 2022-05-10 北京机械工业自动化研究所有限公司 Preparation method of ion implantation nano-reinforcing layer
CN114324181B (en) * 2021-12-23 2024-02-27 重庆融海超声医学工程研究中心有限公司 Laser transduction device and control method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07252645A (en) * 1994-03-11 1995-10-03 Mitsubishi Electric Corp Thin film forming device
US6211080B1 (en) * 1996-10-30 2001-04-03 Matsushita Electric Industrial Co., Ltd. Repair of dielectric-coated electrode or circuit defects
CN1798617A (en) * 2003-06-05 2006-07-05 美国超能公司 Ion beam-assisted high-temperature superconductor (HTS) deposition for thick film tape
CN101717912A (en) * 2009-12-15 2010-06-02 江苏大学 Method for assisting ion in penetrating into metallic matrix by using laser shock wave

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2594853A1 (en) * 1986-02-25 1987-08-28 Commissariat Energie Atomique METHOD AND DEVICE FOR TREATING A THERMO-IONIC EFFECT MATERIAL IN ORDER TO MODIFY ITS PHYSICO-CHEMICAL PROPERTIES
KR100644929B1 (en) * 2004-03-04 2006-11-13 한국원자력연구소 Method for preparing the colored diamond by ion implantation and heat treatment
CN100523283C (en) * 2007-03-22 2009-08-05 华东师范大学 Combined ion implantation technology capable of raising crystallization quality of material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07252645A (en) * 1994-03-11 1995-10-03 Mitsubishi Electric Corp Thin film forming device
US6211080B1 (en) * 1996-10-30 2001-04-03 Matsushita Electric Industrial Co., Ltd. Repair of dielectric-coated electrode or circuit defects
CN1798617A (en) * 2003-06-05 2006-07-05 美国超能公司 Ion beam-assisted high-temperature superconductor (HTS) deposition for thick film tape
CN101717912A (en) * 2009-12-15 2010-06-02 江苏大学 Method for assisting ion in penetrating into metallic matrix by using laser shock wave

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
XUE, SIMIN: "An experimental investigation on the properties of laser-induced Al plasma under additional electric field", JOURNAL OF NORTHWEST NORMAL UNIVERSITY (NATURAL SCIENCE), vol. 42, no. 2, December 2006 (2006-12-01), pages 50 - 53 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114380517A (en) * 2021-12-09 2022-04-22 杭州航天电子技术有限公司 Device and method for sealing titanium alloy connector
CN114380517B (en) * 2021-12-09 2023-11-03 杭州航天电子技术有限公司 Device and method for sealing titanium alloy connector
CN114523116A (en) * 2022-01-24 2022-05-24 中国科学院福建物质结构研究所 Method and device for solving powder sticking problem of laser spheroidizing equipment

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