WO2012149740A1 - Carte de circuit imprimé et module d'alimentation - Google Patents

Carte de circuit imprimé et module d'alimentation Download PDF

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Publication number
WO2012149740A1
WO2012149740A1 PCT/CN2011/079621 CN2011079621W WO2012149740A1 WO 2012149740 A1 WO2012149740 A1 WO 2012149740A1 CN 2011079621 W CN2011079621 W CN 2011079621W WO 2012149740 A1 WO2012149740 A1 WO 2012149740A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic core
planar
windings
planar conductive
conductive
Prior art date
Application number
PCT/CN2011/079621
Other languages
English (en)
Chinese (zh)
Inventor
侯召政
毛恒春
傅电波
黄良荣
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2011/079621 priority Critical patent/WO2012149740A1/fr
Priority to CN201180002311.6A priority patent/CN102369790B/zh
Publication of WO2012149740A1 publication Critical patent/WO2012149740A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes

Definitions

  • Embodiments of the present invention relate to electronic technologies, and in particular, to a printed circuit board and a power module. Background technique
  • a switching converter is generally referred to as a power module.
  • a primary winding and a secondary winding of a transformer may be composed of a plurality of planar conductive layers in a Printed Circuit Board (PCB).
  • PCB Printed Circuit Board
  • the PCB in the existing power module switching converter is mainly composed of a planar conductive layer.
  • the skin effect of the planar conductive winding in the planar conductive layer of the PCB is more obvious, that is, The current in the planar conductive layer of the PCB at the high switching frequency tends to the surface of the conductor, the penetration depth of the current in the planar conductive layer becomes smaller, and the conductor cross-sectional area of the actual conduction current in the same planar conductive layer is relatively reduced, This results in a high impedance of the switching converter at high switching frequencies, which does not meet the high power density requirements of the power module. Summary of the invention
  • the printed circuit board and the power module provided by the embodiment of the invention can realize the high power density of the power module, and at the same time, the AC impedance of the power module can be reduced, thereby meeting the use requirement.
  • An aspect of the invention provides a printed circuit board including an insulating layer, a first planar conductive layer above the insulating layer, and a second planar conductive layer under the insulating layer; the insulating layer, the first A magnetic core slot penetrating through the magnetic core is disposed in each of the planar conductive layer and the second planar conductive layer, and further includes:
  • One side of the at least one set of vertical conductive windings is located at a position of the non-magnetic core groove in the insulating layer or the first planar conductive layer in a direction perpendicular to the insulating layer, the at least one set of vertical conductive The other side of the winding is located at a location of the non-magnetic core slot in the insulating layer or the second planar conductive layer.
  • Another aspect of the present invention provides a power module comprising a magnetic core and a printed circuit board according to any of the present invention, the magnetic core penetrating through a core slot of the printed circuit board.
  • the printed circuit board and the power module of the embodiment of the present invention can effectively increase the conduction cross-sectional area of the conductive layer in the PCB by providing a vertical conductive winding at the non-magnetic core slot position of the PCB, and at the same time enable
  • the power module with the PCB has a reduced AC impedance at a high switching frequency, which in turn can effectively reduce the skin effect of a high power density power module, and better meets the use requirements.
  • FIG. 1A is a schematic structural diagram of a PCB according to an embodiment of the present invention.
  • Figure 1B is a partial enlarged view of Figure 1A;
  • Figure 1 C and Figure 1 D are cross-sectional views taken along line A-A of Figure 1B;
  • FIGS. 3A to 3E are schematic diagrams showing parallel connection of a set of vertical conductive windings and a set of planar conductive windings according to another embodiment of the present invention. ;
  • 4A to 4H are schematic diagrams showing parallel connection of a set of vertical conductive windings and a plurality of sets of planar conductive windings according to another embodiment of the present invention
  • 5A to 5E are schematic diagrams showing a series of vertical conductive windings and a plurality of sets of planar conductive windings according to another embodiment of the present invention
  • 6A-6E are schematic diagrams showing electrical connection between a set of vertical conductive windings, a set of planar conductive windings, and a set of sidewall conductive windings according to another embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a power module according to another embodiment of the present invention. detailed description
  • Embodiments of the present invention provide a printed circuit board, which may include: an insulating layer, a first planar conductive layer above the insulating layer and a second planar conductive layer under the insulating layer; the insulating layer, the first planar conductive a magnetic core-through core slot is disposed in each of the layer and the second planar conductive layer, wherein the printed circuit board further comprises at least one set of vertical conductive windings for cooperating with the magnetic core mounted in the magnetic core slot for electromagnetic conversion In a direction perpendicular to the insulating layer, one side of the at least one set of vertical conductive windings is located at a position of the non-magnetic core groove in the insulating layer or the first planar conductive layer, and the other side of the at least one set of vertical conductive windings is located at the insulation The location of the non-magnetic core slot in the layer or second planar conductive layer.
  • a non-magnetic core groove is disposed on the insulating layer at a position, and a vertical conductive winding is disposed on a surface of the inner wall portion or the inner wall of the cavity. Further, the cavity is filled with an insulating material to insulate the vertical conductive windings in the opposite inner walls from each other. It should be noted that the cavity in this embodiment can be It is a groove or a rectangular through hole.
  • a cavity is formed on the insulating layer by milling, and a vertical conductive winding is formed on the inner wall of the cavity, so that the vertical conductive winding is attached to the surface of the inner wall portion or the entire inner wall of the cavity, and at the same time
  • One side of the vertical conductive winding is disposed in the first planar conductive layer above the insulating layer; further, the other side of the vertical conductive winding may also be disposed in the second planar conductive layer below the insulating layer.
  • the portion of the vertical conductive winding is disposed on the inner wall of the cavity (for example, 85% of a vertical conductive winding is disposed on the inner wall of the cavity, and the remaining 15% extends to, for example, the first planar conductive layer). / other position such as the second planar conductive layer).
  • the vertical conductive windings referred to in this embodiment may include multiple parallel and vertical guide wires arranged in parallel, and one side and the other side of the vertical conductive windings may be understood as the upper surface of the vertical conductive windings in a direction perpendicular to the insulating layer. And the lower surface.
  • the printed circuit board may include a plurality of planar conductive layers, and an insulating layer may be disposed between any adjacent planar conductive layers. At this time, one side of at least one set of vertical conductive windings may be disposed at any In the cavity of the insulating layer, one side of at least one set of vertical conductive windings may be disposed in any planar conductive layer above the insulating layer.
  • one side of the vertical conductive winding may be embedded in the third insulating layer in the vertical direction of the printed circuit board (ie, perpendicular to the direction of the insulating layer).
  • the vertical conductive winding is disposed through the first insulating layer and the second insulating layer such that the other side thereof is located on the first planar conductive layer.
  • the planar conductive layer of the printed circuit board is provided with an insulating partition so that the conductive lines of the planar conductive layer are rotated around the insulation to form a planar conductive winding.
  • one side of the vertical conductive winding may be provided with a partition in which the insulation is embedded, or a partition through which the insulation is placed.
  • the first planar conductive layer includes at least one set of first planar conductive windings
  • the second planar conductive layer includes at least one set of second planar conductive windings
  • the at least one set of vertical conductive windings and the At least one set of first planar conductive windings is conductive
  • the at least one set of vertical conductive windings is in communication with the at least one set of second planar conductive windings.
  • the starting end of the vertical conductive winding or the starting end of one of the segments is electrically conductive with the first plane
  • the starting end of the winding is electrically connected in the via of the printed circuit board to be turned on, and the terminating end of the vertical conductive winding or the terminating end of one of the segments is electrically connected to the terminating end of the first planar conducting winding, etc., so that the vertical guide
  • the electric winding and the first planar conductive winding form a structure of a hybrid structure, thereby forming a three-dimensional conductive winding that cooperates with the magnetic core in the magnetic core slot for electromagnetic conversion.
  • At least one set of sidewall conductive windings may be disposed on the wall of the core slot for electromagnetic conversion in cooperation with a magnetic core mounted in the core slot.
  • at least one set of side wall conductive windings is provided on the surface of the groove wall portion of the core groove or the entire surface of the groove wall.
  • the sidewall conductive windings may be independent conductive windings, that is, the sidewall conductive windings and any planar conductive windings (including the first planar conductive winding, the second planar conductive winding), and the vertical conductive windings are not Turn on.
  • At least one set of sidewall conductive windings and at least one set of vertical conductive windings, at least one set of first planar conductive windings, and at least one set of second planar conductive windings Passing to form one or more sets of three-dimensional conductive windings that cooperate with the magnetic core in the core slot for electromagnetic conversion.
  • the PCB in the above embodiment can effectively increase the conduction cross-sectional area of the conductive layer in the PCB by setting a vertical conductive winding at the non-magnetic core slot position of the PCB, and at the same time enable the power module having the PCB to be at a high switching frequency.
  • the AC impedance is reduced, which can effectively reduce the skin effect of the power module with high power density, and better meet the needs of use.
  • FIG. 1A is a schematic structural view of a PCB according to an embodiment of the present invention.
  • FIG. 1B is a partially enlarged schematic view of FIG. 1A
  • FIG. 1C is a cross-sectional view taken along line AA of FIG.
  • the PCB of this embodiment may include: an insulating layer 100, a first planar conductive layer 107 above the insulating layer 100, and a second planar conductive layer 108 under the insulating layer 100 (as shown in FIG.
  • the insulating layer 100, the first planar conductive layer 107 and the second planar conductive layer 108 are each provided with a core-through magnetic core slot 101
  • the PCB further includes at least one set of vertical conductive windings 104, For electromagnetic conversion in cooperation with a magnetic core mounted in the core slot 101; in a direction perpendicular to the insulating layer (as shown in the thickness direction in FIG. 7), at least one side of the vertical conductive winding 104 is located / embedded in The location of the non-magnetic core slots in the insulating layer 100, the other side of the at least one set of vertical conductive windings 104 is located in the first planar conductive layer 107, as shown in Figure 1C.
  • At least one set of vertical conductive windings 104 shown in Fig. 1D - both sides and the other side are located at the locations of the non-magnetic core slots of the insulating layer 100.
  • one or more of the vertical conductive windings are spirally wound in the direction of the cavity provided in the insulating layer to form a spiral vertical conductive winding, as shown in Fig. 1A.
  • a cavity (not shown) is disposed in the insulating layer 100, and the position of the cavity in the insulating layer is different from the position of the core groove in the insulating layer.
  • the cavity in the embodiment of the present invention may be a groove or a rectangular through hole.
  • the cavity may be formed by slotting so that a vertical conductive winding 104 is plated on the entire surface of the inner wall portion or the inner wall of the cavity.
  • the vertical conductive winding 104 can be a metallized winding.
  • the conductive end of the metallized winding can pass through the via 103 and the first planar conductive layer 107 or the second planar conductive layer 108.
  • the conductive ends of the corresponding conductive windings are electrically connected.
  • the cavity is filled with an insulating material 105 to insulate the vertical conductive windings 104 in the opposing inner walls from each other.
  • the insulating material 105 may be filled in the grooves to insulate the vertical conductive windings 104 attached to the opposing groove walls from each other.
  • the insulating material 105 preferably used in this embodiment is a resin for insulating the vertical conductive windings on the walls of the grooves facing the grooves.
  • the shape of the above cavity is not limited, and it can be set according to actual needs.
  • each of the planar conductive layers includes at least one set of planar conductive windings
  • the planar conductive windings may include N (N is a natural number, N is greater than or equal to 2) a helical coil
  • the first planar conductive layer 107 includes at least one set of first planar conductive windings
  • second planar conductive layer 108 includes at least one set of second planar conductive windings.
  • At least one set of vertical conductive windings 104 is electrically coupled to at least one set of first planar conductive windings, or at least one set of vertical conductive windings 104 is electrically coupled to at least one set of second planar conductive windings.
  • the starting end of the vertical conductive winding 104 or the starting end of the segment and the first plane The conductive windings are connected in series or in parallel, and the terminating end of the vertical conductive winding 104 or the terminating end of one of the segments is connected in series or in parallel with the first planar conducting winding to form a three-dimensional conductive winding.
  • the vertical conductive windings 104 and the first planar conductive windings may be connected in parallel or in series in the vias 103 of the first planar conductive layer 107.
  • the vertical conductive winding 104 is non-conducting with any planar conductive winding (including the first planar conductive winding and the second planar conductive winding), that is, the vertical conductive winding 104 can form a separate conductive winding. Electromagnetic conversion is performed in cooperation with a magnetic core installed in a core slot of the PCB.
  • At least one set of sidewall conductive windings 110 may be disposed on the wall of the core slot 101 of the PCB for mounting in the core slot 101.
  • the magnetic core cooperates to perform electromagnetic conversion.
  • the core slot 101 of the PCB is a through hole for penetrating the core included in the power module.
  • At least one set of sidewall conductive windings 110 may be formed by electroplating on the surface of the wall portion of the core slot or the entire surface of the slot wall by electroplating.
  • the sidewall conductive winding 110 can be used as a separate conductive winding for electromagnetic conversion with a magnetic core mounted in the core slot, that is, the sidewall conductive winding 110 and the vertical conductive winding 104, the first planar conductive winding, The two planar conductive windings are not turned on.
  • the sidewall conductive windings 1 10 are electrically connected to any one or more of the vertical conductive windings 104, the first planar conductive windings, and the second planar conductive windings.
  • the PCB in the above embodiment is provided with a vertical conductive winding at a non-magnetic core slot position of the PCB, and further a sidewall conductive winding is disposed on the inner wall of the core groove of the PCB, thereby effectively increasing the conduction cross-sectional area of the conductive layer in the PCB, and simultaneously
  • the power module with the PCB can reduce the AC impedance at a high switching frequency, thereby effectively reducing the skin effect of the power module with high power density, and better meeting the use requirements.
  • FIGS. 2A to FIG. 2C are schematic diagrams showing the structure of a PCB according to another embodiment of the present invention.
  • the PCB may include four planar conductive layers such as a first planar conductive layer 201 and a second plane.
  • the conductive layer 202, the third planar conductive layer 203 and the fourth planar conductive layer 204 are provided with an insulating layer between any adjacent planar conductive layers, such as a first insulating layer 211, a second insulating layer 212 and a third insulating layer. Layer 213.
  • FIG. 1 the PCB may include four planar conductive layers such as a first planar conductive layer 201 and a second plane.
  • the conductive layer 202, the third planar conductive layer 203 and the fourth planar conductive layer 204 are provided with an insulating layer between any adjacent planar conductive layers, such as a first insulating layer 211, a second insulating layer 212 and a third insulating layer.
  • one side of at least one set of vertical conductive windings 205 is located/embedded in a non-magnetic core slot position of the third insulating layer 213 in a direction perpendicular to the printed circuit board, and the at least one set of vertical conductive The other side of the winding 205 is located/embedded in the first insulating layer 211.
  • one side of at least one set of vertical conductive windings 205 is located at a non-magnetic core slot position of the first insulating layer 21 1 , and the other side of the at least one set of vertical conductive windings 205 may be electrically conductive in a third plane.
  • Layer 203 is located at a non-magnetic core slot position of the first insulating layer 21 1 , and the other side of the at least one set of vertical conductive windings 205 may be electrically conductive in a third plane.
  • At least one set of vertical conductive windings 205 extends through the non-magnetic core slot locations of the first insulating layer 211, the second insulating layer 212, and the third insulating layer 213, and the at least one set of vertical conductive windings 205
  • One side may be located on the fourth planar conductive layer 204, and the other side thereof may be located on the first planar conductive layer 201.
  • the surface or all surfaces of the groove wall portion of the core groove of the PCB shown in FIG. 2A to FIG. 2C may also be provided with sidewall conductive windings for cooperating with the magnetic core installed in the core groove. Transform.
  • the sidewall conductive winding can be used as a separate three-dimensional conductive winding or can be electrically connected to the vertical conductive winding to form one or more sets of three-dimensional conductive windings.
  • the PCB in the above embodiment can provide a vertical conductive winding at a non-magnetic core slot position of the PCB, and a sidewall conductive winding is disposed on the inner wall of the core slot of the PCB, thereby effectively increasing the conduction cross-sectional area of the conductive layer in the PCB, and simultaneously
  • the power module with the PCB can reduce the AC impedance at a high switching frequency, thereby effectively reducing the skin effect of the power module with high power density, and better meeting the use requirements.
  • FIGS. 4A to 4H are provided according to another embodiment of the present invention.
  • FIG. 5A to FIG. 5E are schematic diagrams showing a series connection of a set of vertical conductive windings and a plurality of sets of planar conductive windings according to another embodiment of the present invention
  • FIG. 6A to FIG. 6E is a set of vertical conductive windings according to another embodiment of the present invention. Schematic diagram of the electrical connection between a set of planar conductive windings and a set of sidewall conductive windings.
  • the planar conductive winding in this embodiment may be a first planar conductive winding of the first planar conductive layer or a second planar conductive winding of the second planar conductive layer, which is not limited in this embodiment.
  • 3A through 6E are only schematic representations of the electrical connection between the vertical conductive windings, the planar conductive windings and/or the sidewall conductive windings.
  • the start end of the planar conductive winding of the PCB may be electrically connected to the start end of the vertical conductive winding (or the start end of one of the segments);
  • the terminating end (or the terminating end of one of the segments) may be electrically connected to the terminating end of the vertical conductive winding (or the terminating end of one of the segments).
  • the electrical connections mentioned in the embodiments of the present invention are conductive.
  • a set of planar conductive windings 301 can be combined with a set of vertical conductive windings.
  • the start end of the planar conductive winding 301 (or the start end of one of the segments) is electrically connected to the start end of the vertical conductive winding (or the start end of one of the segments), and the terminating end of the planar conductive winding 301 ( Or the terminating end of one of the segments is electrically connected to the terminating end of the vertical conductive winding (or the terminating end of one of the segments) to form a three-dimensional conductive winding that cooperates with the magnetic core mounted in the core slot of the PCB for electromagnetic conversion.
  • a plurality of sets of planar conductive windings 301 are connected in parallel with a set of vertical conductive windings 302 to form a three-dimensional conductive winding that cooperates with a magnetic core mounted in a core slot of the PCB for electromagnetic conversion. It can be understood that the at least one set of vertical conductive windings 302 and the at least one set of planar conductive windings 301 can also be connected in parallel by other means, which is not limited in this embodiment.
  • a plurality of sets of planar conductive windings 301 are connected in series with a set of vertical conductive windings 302 to form a three-dimensional conductive winding that cooperates with a magnetic core mounted in a core slot of the PCB for electromagnetic conversion. It can be understood that the at least one set of vertical conductive windings 302 and the at least one set of planar conductive windings 301 can also be connected in series by other means, which is not limited in this embodiment.
  • the start end of the planar conductive winding 301 of the PCB (or the start end of one of the segments), the start end of the vertical conductive winding 302 (or the start end of one of the segments), and the sidewall conductive winding 303
  • the start end (or the start end of one of the segments) is turned on, and the end of each conductive winding
  • the terminal end (or the terminating end of one of the segments) is turned on to form a three-dimensional conductive winding that cooperates with the magnetic core mounted in the core slot of the PCB for electromagnetic conversion.
  • connection manner of at least one set of vertical conductive windings 302, at least one set of planar conductive windings 301 and at least one set of sidewall conductive windings 303 can also be electrically connected by other means, and embodiments of the present invention do not limit each conductive The way the windings are combined.
  • the PCB is difficult to reduce the AC impedance by increasing the area of the planar conductive layer. Therefore, in the insulating layer of the PCB, an electromagnetic transformation is performed in cooperation with the magnetic core in the PCB core slot.
  • Vertical conductive windings to fully expand the space for conducting windings in the PCB, which can relatively reduce the number of conductive windings disposed on the conductive layer of the PCB, thereby increasing the conduction cross-sectional area of the PCB and reducing the tendency of the PCB at high switching frequencies.
  • the effect of the skin effect; in turn, the AC impedance of the conductive windings on the PCB can be effectively reduced.
  • connection methods based on vertical conductive windings, planar conductive windings and/or sidewall conductive windings can meet the flexible needs of various deployment scenarios, and at the same time effectively increase the conduction cross-sectional area of the conductive layer in the PCB, enabling
  • the power module of the PCB has a reduced AC impedance at a high switching frequency, thereby effectively reducing the skin effect of the power module of high power density, and better satisfying the use requirements.
  • a power supply module comprising a magnetic core and the printed circuit board of any of the above embodiments, the magnetic core being inserted through a core slot of the printed circuit board.
  • FIG. 7 is a schematic structural diagram of a power module according to another embodiment of the present invention.
  • the power module provided by the embodiment of the present invention may include: Four PCBs 400, two pairs of magnetic cores 402, a semiconductor conversion unit 401, and the like.
  • the semiconductor conversion unit in this embodiment may include a plurality of semiconductor components electrically connected through a PCB, and the semiconductor conversion unit 401 cooperates with a plurality of conductive windings including a magnetic core 402, a vertical conductive winding 404, and a sidewall conductive winding 405. Electromagnetic transformation.
  • the semiconductor conversion unit 401 in this embodiment can be directly soldered to any of the PCBs 400 (which are actually soldered to the PCB on the upper surface of the power module).
  • the planar direction of the PCB refers to the extending direction of the planar conductive layer/insulating layer
  • the thickness direction of the PCB refers to the direction in which the planar conductive laminated layers are pressed.
  • the planar conductive windings of each PCB, the vertical conductive windings 404, and the sidewall conductive windings 405 together form an electrically conductive winding that cooperates with the magnetic core 402 to achieve electromagnetic conversion.
  • a magnetic core slot 403 for mounting the magnetic core 402 can be opened in the plurality of PCBs 400, and the two pairs of magnetic cores 402 can respectively penetrate through the magnetic core slot 403.
  • each of the PCBs 400 is provided with a vertical conductive winding 404, and a sidewall conductive winding 405 is attached to the inner wall of each of the core slots.
  • the PCB in the power module is difficult to reduce the on-resistance by increasing the area of the planar conductive layer. Therefore, the electromagnetic non-magnetic core slot position of the PCB is arranged to cooperate with the magnetic core to realize electromagnetic transformation.
  • Vertical conductive windings to expand the installation space of the conductive windings on the PCB, thereby increasing the conduction cross-sectional area of the conductive windings of the PCB, and at the same time reducing the AC impedance of the power module having the PCB at a high switching frequency, and thus Effectively reduce the skin effect of high power density power modules, and better meet the needs of use.
  • the power module in the above embodiment is further provided with a sidewall conductive winding on the inner wall of the core slot for fully utilizing the side of the PCB to expand the space for the conductive winding.
  • an embodiment of the present invention further provides a method of fabricating a vertical conductive winding in a PCB, including:
  • the inner wall of the cavity is plated to form a vertical conductive winding.
  • the insulating material may be filled in the cavity to insulate the vertical conductive windings in the opposing inner walls from each other according to actual needs.
  • the above preparation method may further include: milling a slot on the printed circuit board where the core slot of the sidewall conductive winding is required to form a slot to be plated; and plating the sidewall of the slot Forming a sidewall conductive winding; the sidewall conductive winding is configured to cooperate with a magnetic core mounted in the core slot for electromagnetic conversion.
  • the disclosed systems, devices, and methods may be implemented in other ways.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not executed.
  • the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be electrical, mechanical or otherwise.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple physical units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solution of the embodiment.

Abstract

Des modes de réalisation de l'invention concernent une carte de circuit imprimé et un module d'alimentation. Ladite carte de circuit imprimé comprend une couche isolante, une première couche conductrice planaire située au-dessus de la couche isolante, et une seconde couche conductrice planaire située au-dessous de la couche isolante. Ladite couche isolante, la première couche conductrice planaire et la seconde couche conductrice planaire sont chacune pourvues d'une rainure centrale magnétique dotée d'un noyau magnétique pénétrant. La carte de circuit magnétique comprend en outre : au moins un groupe d'enroulement conducteur vertical, destiné à coopérer avec le noyau magnétique monté dans la rainure centrale magnétique en vue d'exécuter une conversion électromagnétique. Dans la direction perpendiculaire à la couche isolante, un côté dudit groupe d'enroulement conducteur vertical est situé sur une position sur la couche isolante ou la première couche conductrice planaire à l'exception de la rainure centrale magnétique, et l'autre côté dudit groupe d'enroulement conducteur vertical est situé sur une position sur la couche isolante ou la seconde couche conductrice planaire à l'exception de la rainure centrale magnétique. La carte de circuit imprimé peut déployer la zone de coupe de l'enroulement conducteur, et réduire l'impédance à courant alternatif du module d'alimentation.
PCT/CN2011/079621 2011-09-14 2011-09-14 Carte de circuit imprimé et module d'alimentation WO2012149740A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2011/079621 WO2012149740A1 (fr) 2011-09-14 2011-09-14 Carte de circuit imprimé et module d'alimentation
CN201180002311.6A CN102369790B (zh) 2011-09-14 2011-09-14 印刷电路板和电源模块

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