WO2012146037A1 - 一种超材料介质基板及其加工方法 - Google Patents

一种超材料介质基板及其加工方法 Download PDF

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Publication number
WO2012146037A1
WO2012146037A1 PCT/CN2011/084497 CN2011084497W WO2012146037A1 WO 2012146037 A1 WO2012146037 A1 WO 2012146037A1 CN 2011084497 W CN2011084497 W CN 2011084497W WO 2012146037 A1 WO2012146037 A1 WO 2012146037A1
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Prior art keywords
dielectric substrate
metamaterial
metamaterial dielectric
mold
processing
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PCT/CN2011/084497
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English (en)
French (fr)
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WO2012146037A9 (zh
Inventor
刘若鹏
胡侃
赵治亚
缪锡根
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深圳光启高等理工研究院
深圳光启创新技术有限公司
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Priority to EP20110864444 priority Critical patent/EP2712027A4/en
Priority to US14/114,283 priority patent/US20140057072A1/en
Publication of WO2012146037A1 publication Critical patent/WO2012146037A1/zh
Publication of WO2012146037A9 publication Critical patent/WO2012146037A9/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/02—Refracting or diffracting devices, e.g. lens, prism
    • H01Q15/10—Refracting or diffracting devices, e.g. lens, prism comprising three-dimensional array of impedance discontinuities, e.g. holes in conductive surfaces or conductive discs forming artificial dielectric
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/002—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials
    • G02B1/005—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials made of photonic crystals or photonic band gap materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture

Definitions

  • the present invention relates to the field of metamaterials, and in particular to a process for processing a metamaterial dielectric substrate. ⁇ Background technique ⁇
  • Metamaterials are artificial composite structures or composite materials that have extraordinary physical properties not found in natural materials. Through the orderly design of the structure on the key physical scale of the material, it is possible to break through the limitations of certain apparent natural laws, thereby obtaining the ordinary super-material function beyond the natural world.
  • the metamaterial is formed by stacking or arraying a multi-layered metamaterial functional board composed of a dielectric substrate and a plurality of artificial microstructures disposed on the dielectric substrate, and the metamaterial can provide materials of various common materials with and without characteristic.
  • a single artificial microstructure is typically less than 1/10 wavelengths in size and has an electrical or magnetic response to an applied electric or magnetic field, thereby exhibiting an equivalent dielectric constant or equivalent permeability, or wave impedance.
  • the equivalent dielectric constant and equivalent permeability (or wave impedance) of an artificial microstructure are determined by the element geometry parameters and can be artificially designed and controlled.
  • artificial microstructures can have artificially designed electromagnetic parameters, resulting in many novel phenomena.
  • the role of the dielectric substrate in the existing metamaterial function board is to adapt the mechanical properties to the needs of the application environment to fix the artificial microstructure array, and ceramics, polymer materials, polytetrafluoroethylene, ferroelectric materials, ferrite can be selected on the material selection. Materials, ferromagnetic materials, etc., the processing technology varies according to the material selected. Because the dielectric constant and magnetic permeability are a fixed value for a uniform material, the basic function of the dielectric substrate in the metamaterial is limited to the fixed artificial microstructure array, the external electric field or The magnetic field does not produce a characteristic electrical or magnetic response, i.e., it does not have an electromagnetic modulation function with respect to the electromagnetic waves incident on the metamaterial.
  • the technical problem to be solved by the present invention is to provide a metamaterial dielectric substrate and a processing method thereof, which enable a dielectric substrate of a metamaterial to generate an electrical response or a magnetic response to an external electric field or a magnetic field, thereby realizing
  • the various electromagnetic modulation functions of the substrate enable the functional application of the metamaterial to make the functional design of the metamaterial more flexible.
  • the duty ratio is a volume ratio of air voids per unit volume of the dielectric substrate
  • the mold is used to form the dielectric substrate, and a convex array is arranged in the mold to form the air gap, and the convex array is arranged by a plurality of protrusions, and is controlled
  • the protrusion volume makes the air gap in the unit volume of the dielectric substrate satisfy the duty ratio; c uniformly filling the metamaterial dielectric substrate material into the mold in a liquid state, a solid powder or a liquid-solid mixture;
  • the air gap in the unit volume of the dielectric substrate can be made to satisfy the duty ratio by changing the degree of density of the protrusions.
  • the air gap in the unit volume of the dielectric substrate can be made to satisfy the duty ratio by changing the size of the plurality of protrusions.
  • the convex array is a needle array
  • the protrusion is a needle.
  • the material of the metamaterial dielectric substrate is uniformly filled into the mold in a liquid state by a high-temperature melting method, and in the step c, the super-solution in the mold is performed by a cooling method.
  • the material substrate material is integrally formed.
  • the liquid material of the metamaterial dielectric substrate is a mixture of a molten polytetrafluoroethylene resin or a molten epoxy resin prepolymer and a curing agent thereof.
  • the material of the metamaterial dielectric substrate is uniformly filled into the mold as a solid powder
  • the metamaterial medium in the mold is processed by a high temperature sintering method.
  • the substrate material is integrally formed.
  • the solid powder is a mixture of a ceramic powder and a binder.
  • the material of the metamaterial dielectric substrate is uniformly filled into the mold with a liquid-solid mixture, and in the C step, the metamaterial medium in the mold is cooled by a method.
  • the substrate material is integrally molded and cured.
  • the liquid-solid mixture is a mixture of molten plastic and ceramic powder.
  • the present invention also provides a metamaterial dielectric substrate, wherein the metamaterial substrate is provided with a hole array, and the hole array is formed by a plurality of hole-shaped void arrays.
  • the plurality of pore-shaped voids are unevenly distributed with unevenness.
  • the plurality of pore-shaped voids have a non-uniform distribution of unequal volume sizes. In a specific embodiment, the plurality of pore-shaped voids have a pinhole shape.
  • the metamaterial dielectric substrate of the present invention By applying the metamaterial dielectric substrate of the present invention and the processing method thereof, the arrangement law of the needle objects in the needle array can be preset in the processing, so that the formed metamaterial dielectric substrate has a pinhole array arranged in a regular pattern. Therefore, the metamaterial dielectric substrate can realize certain modulation functions of electromagnetic waves, such as diverging, converging or deflecting electromagnetic waves, thereby providing a more flexible design approach for functional applications of metamaterials.
  • Figure 1 Schematic diagram of the structure of the metamaterial dielectric substrate of the first embodiment.
  • FIG. 2 is a schematic cross-sectional view showing a metamaterial dielectric substrate of Embodiment 2.
  • FIG. 3 is a schematic cross-sectional view of a metamaterial dielectric substrate of Embodiment 3.
  • the metamaterial dielectric substrate 1 is in the shape of a circular plate.
  • the metamaterial dielectric substrate 1 is provided with a pinhole array, and the pinhole array is composed of a plurality of pinholes.
  • 2 is arranged, for convenience of representation, a pinhole array is indicated by black dots in the figure, and a substrate of the metamaterial dielectric substrate 1 is indicated by a blank area.
  • each pinhole 2 is designed to have a non-uniform distribution of equal size and unequal spacing, and the pinhole array as a whole has a loose intermediate region from the peripheral region. Dense distribution law, pinhole 2 The arrangement density gradually increases from the periphery to the middle.
  • the dielectric constant of the metamaterial dielectric substrate is changed by providing an air gap in a partial region of the polytetrafluoroethylene resin dielectric substrate. Since the dielectric constant of the air is approximately equal to 1, a certain portion of the metamaterial dielectric substrate is changed.
  • the volume ratio (ie, duty ratio) of the air voids per unit volume is changed, the dielectric constant in the local region of the metamaterial dielectric substrate can be changed.
  • the dielectric constant of the metamaterial dielectric substrate can be realized as a whole by making the duty ratio on the metamaterial dielectric substrate small in the middle region and narrowing from the middle to the periphery. Large distribution of small surrounding areas.
  • the embodiment is embodied by the following method. First, an injection mold is set according to the shape and size of the metamaterial dielectric substrate, and the injection mold is used for injection molding a circular plate shaped dielectric substrate. Then, a needle array is arranged in the injection mold, the needle array is used to form an air gap during the injection molding, and the needle array is formed by a plurality of needles, and the needles are designed to have the same size and the same pitch.
  • the non-uniform distribution, the needle array as a whole is densely distributed by the loose intermediate region of the peripheral region, and the arrangement density of the needles is gradually increased from the periphery to the middle, so as to control the needles in the needle array.
  • the distribution density can easily make the duty ratio of the metamaterial dielectric substrate to be a small distribution in the middle region and a small distribution from the middle to the periphery.
  • the polytetrafluoroethylene resin is melted at a high temperature, and the molten polytetrafluoroethylene resin is uniformly injected into the injection mold.
  • the polytetrafluoroethylene resin of the injection mold is cooled to solidify the polytetrafluoroethylene resin, and the metamaterial dielectric substrate is obtained after demolding.
  • the present invention is directed to providing as many control means as possible to flexibly control the duty cycle on the dielectric substrate to be regularly distributed, thereby controlling the super The distribution law of the dielectric constant on the material substrate.
  • the distribution law of the dielectric constant of the metamaterial dielectric substrate in the present embodiment is small in the middle and small and gradually changes from small to large, which is merely a specific law exemplified for convenience of explanation, and the gist of the present invention is
  • the processing method of the metamaterial dielectric substrate realizes arbitrary design of the dielectric constant distribution law of the metamaterial dielectric substrate, and the beneficial effect thereof is also the flexibility and convenience of the design.
  • due to the integrated molding of injection molds it is highly efficient and suitable for mass production.
  • the metamaterial dielectric substrate 1 is in the shape of a circular plate.
  • the metamaterial substrate 1 is provided with a pinhole array, and the pinhole array is formed by a plurality of pinholes. 2 is arranged, since the pinhole 2 is small, for convenience of expression, the pinhole 2 is indicated by solid lines in FIG. 2, and the number of solid lines is only a schematic description, and the number of pinholes 2 in specific implementation is as the case may be.
  • Arbitrarily set, the blank area in the figure indicates the substrate of the metamaterial dielectric substrate 1.
  • each pinhole 2 is designed to be equal in size and unequal in height, and the height of the pinhole 2 in the pinhole array is gradually increased from the periphery of the metamaterial substrate to the middle. Big.
  • the small peripheral region of the intermediate region is large and gradually changes from small to large
  • the ceramic substrate is used as the material of the dielectric substrate, and the material is used in the metamaterial.
  • the method of providing an air gap in a partial region of the dielectric substrate changes the dielectric constant in a local region of the metamaterial dielectric substrate.
  • the ceramic substrate Since the dielectric constant of air is approximately equal to 1, the ceramic substrate generally has a high dielectric constant, so when changing When the volume ratio (ie, duty ratio) of the air void per unit volume in a partial region of the metamaterial dielectric substrate can change the dielectric constant in a local region of the metamaterial dielectric substrate in a large range, the local region of the metamaterial dielectric substrate is partially The larger the duty cycle, the smaller the dielectric constant will be. Conversely, the smaller the duty cycle, the larger the dielectric constant will be. Therefore, in this embodiment, the dielectric constant of the metamaterial dielectric substrate can be realized as a whole by making the duty ratio on the metamaterial dielectric substrate small in the middle region and narrowing from the middle to the periphery. The small surrounding area of the area is large and gradually distributed from small to large.
  • a molding die is set according to the shape and size of the metamaterial dielectric substrate, and the molding die is used for molding a circular plate-shaped dielectric substrate, and then a needle array is arranged in the molding die, and the needle array is used to form an air gap, and the needle shape
  • the array is formed by arranging a plurality of needles. Since the volume of each needle can be arbitrarily set, by controlling the height of the needle in the needle array, the distribution in the middle region is high and the peripheral region is gradually lowered from the middle to the periphery. The rule can easily make the duty ratio of the metamaterial dielectric substrate to be a small distribution in the middle region and a small distribution from the middle to the periphery.
  • the ceramic powder is sintered at a high temperature of 800 ° C or higher, and the super-material dielectric substrate is obtained after demolding.
  • the present invention is directed to providing as many control means as possible to flexibly control the duty cycle on the dielectric substrate to be regularly distributed, thereby controlling the distribution of dielectric constants on the metamaterial dielectric substrate.
  • the distribution law of the dielectric constant of the metamaterial dielectric substrate in the present embodiment is small in the middle and small and gradually changes from small to large, which is merely a specific law exemplified for convenience of explanation, and the gist of the present invention is
  • the processing method of the metamaterial dielectric substrate realizes arbitrary design of the dielectric constant distribution law of the metamaterial dielectric substrate, and the beneficial effect thereof is also the flexibility and convenience of the design.
  • due to the integrated molding of injection molds it is highly efficient and suitable for mass production.
  • the metamaterial dielectric substrate 1 is in the shape of a circular plate.
  • the metamaterial dielectric substrate 1 is provided with a pinhole array, and the pinhole array is composed of a plurality of pinholes. 2 is arranged, since the pinhole 2 is small, for convenience of expression, the pinhole 2 is indicated by solid lines in FIG. 2, and the number of solid lines is only a schematic description, and the number of pinholes 2 in specific implementation is as the case may be.
  • Arbitrarily set, the blank area in the figure indicates the substrate of the metamaterial dielectric substrate 1.
  • each pinhole 2 is designed to be equal in size and unequal in height, and the height of the pinhole 2 in the pinhole array is gradually lowered from the periphery of the metamaterial substrate to the middle.
  • the processing method of this embodiment is as follows:
  • the dielectric constant of the metamaterial dielectric substrate In order to make the dielectric constant of the metamaterial dielectric substrate as a whole, the small peripheral region of the intermediate region is large and the distribution law gradually changes from small to large.
  • the composite material of plastic and ceramic is used as the material of the dielectric substrate.
  • the method of setting an air gap in a partial region of the metamaterial dielectric substrate changes the dielectric constant in a local region of the metamaterial dielectric substrate, since the dielectric constant of the air is approximately equal to 1, when the air volume per unit volume of the metamaterial dielectric substrate is changed When the volume ratio (ie, duty ratio) of the voids is changed, the dielectric constant in the local region of the metamaterial dielectric substrate can be changed.
  • the dielectric constant of the metamaterial dielectric substrate can be realized as a whole by making the duty ratio on the metamaterial dielectric substrate have a small peripheral region in the middle region and gradually increasing from the middle to the periphery.
  • the distribution pattern of the large surrounding area of the area is small and gradually changes from large to small.
  • the embodiment is embodied by the following method.
  • a molding die is set according to the shape and size of the metamaterial dielectric substrate, and the molding die is used for molding a circular plate shaped dielectric substrate.
  • a needle array is arranged in the molding die, the needle array is used to form an air gap, and the needle array is arranged by a plurality of needles. Since the volume of each needle can be arbitrarily set, by controlling the needle array The height of the needle is high in the middle region, and the low peripheral region is gradually lowered from the middle to the periphery. The duty ratio of the metamaterial dielectric substrate can be easily made small in the middle region and the peripheral region is gradually enlarged from the middle to the periphery. The law of distribution.
  • the plastic is melted at a high temperature, and then the ceramic powder is added to the molten plastic, uniformly mixed, and the liquid-solid mixture of the molten plastic and the ceramic powder is uniformly filled into the molding die; d. cooling at a low temperature, The liquid-solid mixture of the molten plastic and the ceramic powder is integrally molded and solidified in a mold, and the super-material dielectric substrate is obtained after demolding.
  • the present invention is directed to providing as many control means as possible to flexibly control the duty cycle on the dielectric substrate to be regularly distributed, thereby controlling the distribution of dielectric constants on the metamaterial dielectric substrate.
  • the dielectric constant of the metamaterial dielectric substrate in the embodiment is large and small in the middle and small.
  • the gradual change distribution law is only a specific law exemplified for convenience of explanation.
  • the gist of the present invention is to realize the dielectric constant distribution law of the metamaterial dielectric substrate by the above-described processing method of the metamaterial dielectric substrate.
  • the arbitrarily designed design also has the flexibility and convenience of its design. At the same time, due to the integrated molding of injection molds, it is highly efficient and suitable for mass production.
  • the material of the substrate of the metamaterial dielectric substrate may be arbitrarily selected according to the overall size of the dielectric constant, and the specific molding process is also different according to the selected material.
  • the present invention has been described by way of example only, and various modifications of the invention may be made without departing from the spirit and scope of the invention.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Waveguide Aerials (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

本发明提供了一种超材料介质基板的加工方法及由该方法制得的超材料介质基板，通过应用本发明的超材料介质基板及其加工方法，可以在加工时预先设定针形阵列中针形物的排列规律，使成型后的超材料介质基板具有呈一定规律分布的针孔形阵列，从而使超材料介质基板能实现对电磁波的某些调制功能，如使电磁波发散、汇聚或偏折等，从而为超材料的功能应用提供更为灵活的设计途径。

Description

一种超材料介质基板及其加工方法
【技术领域】
本发明涉及超材料领域， 具体地涉及超材料介质基板的加工工艺。 【背景技术】
超材料，是指一些具有天然材料所不具备的超常物理性质的人工复合结 构或复合材料。通过在材料的关键物理尺度上的结构有序设计， 可突破某些 表观自然规律的限制， 从而获得超出自然界固有的普通的超常材料功能。超 材料由多层超材料功能板层叠或阵列而成，超材料功能板由介质基板和设置 在介质基板上的多个人造微结构组成，超材料可以提供各种普通材料具有和 不具有的材料特性。 单个人造微结构大小一般小于 1/10个波长， 其对外加 电场或磁场具有电响应或磁响应，从而具有表现出等效介电常数或等效磁导 率， 或者波阻抗。 人造微结构的等效介电常数和等效磁导率（或波阻抗） 由 单元几何尺寸参数决定， 可人为设计和控制。 并且， 人造微结构可以具有人 为设计的电磁参数， 从而产生许多新奇的现象。
现有超材料功能板中介质基板的作用是在机械性能上适应应用环境的 需要以固定人造微结构阵列， 在选材上可选用陶瓷、 高分子材料、 聚四氟乙 烯、铁电材料、铁氧材料、铁磁材料等等， 其加工工艺根据选材而各有不同。 因为对于均一材质而言， 其介电常数和磁导率为一固定值， 所以超材料中的 介质基板不管采用哪种材料或工艺， 其基本功能局限于固定人造微结构阵 列， 对外加电场或磁场不会产生特有的电响应或磁响应， 即相对于入射超材 料的电磁波而言， 其不具有电磁调制功能。
【发明内容】
本发明所要解决的技术问题是提供一种超材料介质基板及其加工方法， 使超材料的介质基板能对外加电场或磁场产生电响应或磁响应从而实现介 质基板的各种电磁调制功能， 进而拓展超材料的功能应用， 使超材料的功能 设计更为灵活多变。
本发明实现发明目的首先提供一种超材料介质基板的加工方法，包括以 下步骤：
a.根据超材料预定的性质确定超材料介质基板的材料以及超材料介质 基板上预定区域内的介电常数，并根据超材料介质基板预定区域内的介电常 数计算得到该预定区域内的占空比，所述占空比为介质基板单位体积内空气 空隙所占的体积比；
b.设置一模具， 所述模具用以成型所述介质基板， 在模具内布置一凸起 阵列， 用以成型所述空气空隙， 所述凸起阵列由多个凸起物排列而成， 控制 所述凸起物体积使所述介质基板单位体积内的空气间隙满足所述占空比； c将超材料介质基板材料以液态、固态粉末或液固混合物均匀地填充到 所述模具中；
d.对填充到所述模具中的超材料介质基板材料进行一体化成型，脱模后 得到超材料介质基板。
具体实施时，可以通过改变所述凸起物的疏密程度使所述介质基板单位 体积内的空气间隙满足所述占空比。
具体实施时，可以通过改变多个凸起物的大小使所述介质基板单位体积 内的空气间隙满足所述占空比。
作为具体实施方式， 所述凸起阵列为针形阵列， 所述凸起物为针形物。 作为具体实施方式， 所述 b步骤中， 采用高温熔融的方法将超材料介质 基板的材料以液态均匀地填充到所述模具中， 所述 c步骤中， 通过冷却方法 对所述模具中的超材料介质基板材料进行一体化成型。
作为具体实施方式，所述超材料介质基板的液态材料为熔融的聚四氟乙 烯树脂或熔融的环氧树脂预聚物与其固化剂的混合物。
作为具体实施方式， 所述 b步骤中， 将超材料介质基板的材料以固态粉 末均匀地填充到所述模具中， 所述 c步骤中， 通过高温烧结的方法对所述模 具中的超材料介质基板材料进行一体化成型。
作为具体实施方式， 所述固态粉末为陶瓷粉末与粘结剂的混合物。 作为具体实施方式， 所述 b步骤中， 将超材料介质基板的材料以液固混 合物均匀地填充到所述模具中， 所述 C步骤中， 通过冷却的方法对所述模具 中的超材料介质基板材料进行一体化成型， 固化。
作为具体实施方式， 所述液固混合物为熔融塑料与陶瓷粉末的混合物。 本发明还提供一种超材料介质基板， 所述超材料基板中设置有孔形阵 列， 所述孔形阵列由多个孔状空隙阵列而成。
作为具体实施方式， 所述多个孔状空隙呈疏密不等的非均匀分布。
作为具体实施方式， 所述多个孔状空隙呈体积大小不等的非均匀分布。 作为具体实施方式， 所述多个孔状空隙为针孔形。
通过应用本发明的超材料介质基板及其加工方法，可以在加工时预先设 定针形阵列中针形物的排列规律，使成型后的超材料介质基板具有呈一定规 律分布的针孔形阵列，从而使超材料介质基板能实现对电磁波的某些调制功 能， 如使电磁波发散、 汇聚或偏折等， 从而为超材料的功能应用提供更为灵 活的设计途径。
【附图说明】
图 1， 实施例 1的超材料介质基板的结构示意图。
图 2， 实施例 2的超材料介质基板的剖面示意图。
图 3， 实施例 3的超材料介质基板的剖面示意图。
【具体实施方式】
下面结合附图和实施例对本发明进行详细说明。
实施例 1
附图 1示出了本实施例超材料介质基板的结构示意图，该超材料介质基 板 1为圆板形， 超材料介质基板 1中设置有针孔形阵列， 针孔形阵列由多个 针孔 2排列而成， 为便于表示， 图中以黑点表示针孔形阵列， 以空白区域表 示超材料介质基板 1的基材。为方便计算和形成具有预定占空比的超材料介 质基板， 将各个针孔 2的设计为形状大小相等、 间距不相等的非均匀分布， 针孔形阵列在整体上呈由周边区域疏松中间区域密集的分布规律， 针孔 2 的排列密度从周边到中间由小逐渐增大。
本实施例的加工方法如下：
a.为使超材料介质基板的介电常数在整体上呈中间区域小周边区域大 且由小到大逐渐变化的分布规律，本实施例以聚四氟乙烯树脂作为超材料介 质基板的材料，通过在聚四氟乙烯树脂介质基板的局部区域内设置空气间隙 的方法改变超材料介质基板局部区域内的介电常数，由于空气的介电常数约 等于 1， 所以当改变超材料介质基板某局部区域单位体积内空气空隙所占的 体积比 （即占空比） 时， 可以改变超材料介质基板局部区域内的介电常数， 超材料介质基板局部区域内占空比越大， 其介电常数将越小， 反之， 占空比 越小， 其介电常数将越大。 所以， 本实施例通过使超材料介质基板上的占空 比呈中间区域大周边区域小且由中间向周边逐渐变小的分布规律，可以实现 超材料介质基板的介电常数在整体上呈中间区域小周边区域大的分布规律。
b.为便于在超材料介质基板上按规律形成空气空隙，本实施例采用以下 方法具体实施， 首先根据超材料介质基板的形状大小设置注塑模具， 该注塑 模具用以注塑成型圆板形介质基板， 然后在注塑模具内布置针形阵列， 针形 阵列用以在注塑成型时形成空气空隙， 针形阵列由多个针状物排列而成， 各 个针状物设计为形状大小相等、 间距不相等的非均匀分布， 针形阵列在整体 上呈由周边区域疏松中间区域密集的分布规律，针状物的排列密度从周边到 中间由小逐渐增大，这样通过控制针形阵列中针状物的分布密度可以很容易 地使超材料介质基板的占空比呈中间区域大周边区域小且由中间向周边逐 渐变小的分布规律。
c将聚四氟乙烯树脂在高温下熔融，并将熔融后的聚四氟乙烯树脂均匀 地注入到注塑模具内。
d.最后， 对注塑模具的聚四氟乙烯树脂进行冷却， 使聚四氟乙烯树脂固 化成型， 脱模后得到超材料介质基板。
应当理解， 本实施例中为形成具有一定体积和一定分布规律的空气空 隙， 可以采用各种不同的凸起阵列而不仅仅限于针形阵列， 凸起阵列中的凸 起物可以进行任意设计而不仅仅限于针形物，本发明的要旨在于提供尽可能 多的控制手段来灵活控制介质基板上的占空比呈一定规律分布，进而控制超 材料介质基板上介电常数的分布规律。
应当理解，本实施例中超材料介质基板介电常数呈中间小周边大且由小 到大逐渐变化的分布规律仅仅是为了便于说明而例举的一种特定规律，本发 明的要旨正是通过上述超材料介质基板的加工方法来实现对超材料介质基 板的介电常数分布规律的任意设计，其有益效果也在于其设计的灵活性和方 便性。 同时， 由于采用注塑模具一体化成型， 其效率高， 适合于大规模生产。 实施例 2
附图 2示出了本实施例超材料介质基板的剖面示意图，该超材料介质基 板 1为圆板形， 超材料介质基板 1中设置有针孔形阵列， 针孔形阵列由多个 针孔 2排列而成， 由于针孔 2很小， 为便于表达， 附图 2中用实线条表示针 孔 2， 实线条的个数只是示意性说明， 具体实施时的针孔 2的数量根据具体 情况而任意设置， 图中的空白区域表示超材料介质基板 1的基材。为方便计 算和形成具有预定占空比的超材料介质基板， 各个针孔 2 的设计为大小相 等、高度不相等， 针孔形阵列中针孔 2的高度从超材料介质基板周边到中间 逐渐增大。
本实施例的加工方法如下：
a.为使超材料介质基板的介电常数在整体上呈中间区域小周边区域大 且由小到大逐渐变化的分布规律， 本实施例以陶瓷基材作为介质基板的材 料，通过在超材料介质基板的局部区域内设置空气间隙的方法改变超材料介 质基板局部区域内的介电常数， 由于空气的介电常数约等于 1， 陶瓷基材则 一般具有较高的介电常数，所以当改变超材料介质基板某局部区域单位体积 内空气空隙所占的体积比（即占空比） 时， 可以较大范围地改变超材料介质 基板局部区域内的介电常数， 超材料介质基板局部区域内占空比越大， 其介 电常数将越小， 反之， 占空比越小， 其介电常数将越大。 所以， 本实施例通 过使超材料介质基板上的占空比呈中间区域大周边区域小且由中间向周边 逐渐变小的分布规律，可以实现超材料介质基板的介电常数在整体上呈中间 区域小周边区域大且由小到大逐渐变化的分布规律。
b.为便于在超材料介质基板上按规律形成空气空隙，本实施例采用以下 方法具体实施， 首先根据超材料介质基板的形状大小设置成型模具， 该成型 模具用以成型圆板形介质基板， 然后在成型模具内布置针形阵列， 针形阵列 用以形成空气空隙， 针形阵列由多个针状物排列而成， 由于各个针状物的体 积可以任意设置，所以通过控制针形阵列中针状物的高度呈中间区域高周边 区域低且由中间向周边逐渐降低的分布规律可以很容易地使超材料介质基 板的占空比呈中间区域大周边区域小且由中间向周边逐渐变小的分布规律。
C .将陶瓷粉末和粘结剂均匀地填充到成型模具中；
d.在 800摄氏度以上的高温下对陶瓷粉末进行高温烧结，脱模后得到超 材料介质基板。
应当理解， 本实施例中为形成具有一定体积和一定分布规律的空气空 隙， 可以采用各种不同的凸起阵列而不仅仅限于针状物阵列， 凸起阵列中的 凸起物可以进行任意设计而不仅仅限于针形物，本发明的要旨在于提供尽可 能多的控制手段来灵活控制介质基板上的占空比呈一定规律分布，进而控制 超材料介质基板上介电常数的分布规律。
应当理解，本实施例中超材料介质基板介电常数呈中间小周边大且由小 到大逐渐变化的分布规律仅仅是为了便于说明而例举的一种特定规律，本发 明的要旨正是通过上述超材料介质基板的加工方法来实现对超材料介质基 板的介电常数分布规律的任意设计，其有益效果也在于其设计的灵活性和方 便性。 同时， 由于采用注塑模具一体化成型， 其效率高， 适合于大规模生产。 实施例 3
附图 3示出了本实施例超材料介质基板的剖面示意图，该超材料介质基 板 1为圆板形， 超材料介质基板 1中设置有针孔形阵列， 针孔形阵列由多个 针孔 2排列而成， 由于针孔 2很小， 为便于表达， 附图 2中用实线条表示针 孔 2， 实线条的个数只是示意性说明， 具体实施时的针孔 2的数量根据具体 情况而任意设置， 图中的空白区域表示超材料介质基板 1的基材。为方便计 算和形成具有预定占空比的超材料介质基板， 各个针孔 2 的设计为大小相 等、高度不相等， 针孔形阵列中针孔 2的高度从超材料介质基板周边到中间 逐渐降低。 本实施例的加工方法如下：
a.为使超材料介质基板的介电常数在整体上呈中间区域小周边区域大 且由小到大逐渐变化的分布规律，本实施例以塑料和陶瓷的复合材料作为介 质基板的材料，通过在超材料介质基板的局部区域内设置空气间隙的方法改 变超材料介质基板局部区域内的介电常数， 由于空气的介电常数约等于 1， 当改变超材料介质基板某局部区域单位体积内空气空隙所占的体积比（即占 空比） 时， 可以改变超材料介质基板局部区域内的介电常数， 超材料介质基 板局部区域内占空比越大， 其介电常数将越小， 反之， 占空比越小， 其介电 常数将越大。所以， 本实施例通过使超材料介质基板上的占空比呈中间区域 小周边区域大且由中间向周边逐渐增大的分布规律，可以实现超材料介质基 板的介电常数在整体上呈中间区域大周边区域小且由大到小逐渐变化的分 布规律。
b.为便于在超材料介质基板上按规律形成空气空隙，本实施例采用以下 方法具体实施， 首先根据超材料介质基板的形状大小设置成型模具， 该成型 模具用以成型圆板形介质基板， 然后在成型模具内布置针形阵列， 针形阵列 用以形成空气空隙， 针形阵列由多个针状物排列而成， 由于各个针状物的体 积可以任意设置，所以通过控制针形阵列中针状物的高度呈中间区域低周边 区域高且由中间向周边逐渐降低的分布规律可以很容易地使超材料介质基 板的占空比呈中间区域小周边区域大且由中间向周边逐渐增大的分布规律。
c .首先将塑料在高温下熔融， 然后将陶瓷粉末添加到熔融的塑料中， 混 合均匀， 再将熔融塑料与陶瓷粉末的液固混合物均匀地填充到成型模具中； d.在低温下冷却，使熔融塑料与陶瓷粉末的液固混合物在模具内一体化 成型和固化， 脱模后得到超材料介质基板。
应当理解， 本实施例中为形成具有一定体积和一定分布规律的空气空 隙， 可以采用各种不同的凸起阵列而不仅仅限于针状物阵列， 凸起阵列中的 凸起物可以进行任意设计而不仅仅限于针形物，本发明的要旨在于提供尽可 能多的控制手段来灵活控制介质基板上的占空比呈一定规律分布，进而控制 超材料介质基板上介电常数的分布规律。
应当理解，本实施例中超材料介质基板介电常数呈中间小周边大且由小 到大逐渐变化的分布规律仅仅是为了便于说明而例举的一种特定规律，本发 明的要旨正是通过上述超材料介质基板的加工方法来实现对超材料介质基 板的介电常数分布规律的任意设计，其有益效果也在于其设计的灵活性和方 便性。 同时， 由于采用注塑模具一体化成型， 其效率高， 适合于大规模生产。
应当理解， 超材料介质基板的基材具体选用哪种材料， 可以根据介电常 数的整体大小而任意选择， 根据选择的材料不同， 其具体成型的工艺方法也 不尽相同， 本发明中的上述实施例仅作了示范性描述， 本领域技术人员在阅 读本专利申请后可以在不脱离本发明的精神和范围的情况下对本发明进行 各种修改。

Claims

权 利 要 求 书
1、 一种超材料介质基板的加工方法， 包括以下步骤：
a.根据超材料预定的性质确定超材料介质基板的材料以及超材料介质 基板上预定区域内的介电常数，并根据超材料介质基板预定区域内的介电常 数计算得到该预定区域内的占空比，所述占空比为介质基板单位体积内空气 空隙所占的体积比；
b.设置一模具， 所述模具用以成型所述介质基板， 在模具内布置一凸起 阵列， 用以成型所述空气空隙， 所述凸起阵列由多个凸起物排列而成， 控制 所述凸起物体积使所述介质基板单位体积内的空气间隙满足所述占空比； c将超材料介质基板材料以液态、固态粉末或液固混合物均匀地填充到 所述模具中；
d.对填充到所述模具中的超材料介质基板材料进行一体化成型，脱模后 得到超材料介质基板。
2、 根据权利要求 1所述的一种超材料介质基板的加工方法， 其特征在 于：通过改变所述凸起物的疏密程度使所述介质基板单位体积内的空气间隙 满足所述占空比。
3、 根据权利要求 1所述的一种超材料介质基板的加工方法， 其特征在 于：通过改变多个凸起物的大小使所述介质基板单位体积内的空气间隙满足 所述占空比。
4、 根据权利要求 1所述的一种超材料介质基板的加工方法， 其特征在 于： 所述凸起阵列为针形阵列， 所述凸起物为针形物。
5、 根据权利要求 1所述的一种超材料介质基板的加工方法， 其特征在 于： 所述 b步骤中， 采用高温熔融的方法将超材料介质基板的材料以液态均 匀地填充到所述模具中， 所述 c步骤中， 通过冷却方法对所述模具中的超材 料介质基板材料进行一体化成型。
6、 根据权利要求 5所述的一种超材料介质基板的加工方法， 其特征在 于：所述超材料介质基板的液态材料为熔融的聚四氟乙烯树脂或熔融的环氧 树脂预聚物与其固化剂的混合物。
7、 根据权利要求 1所述的一种超材料介质基板的加工方法， 其特征在 于： 所述 b步骤中， 将超材料介质基板的材料以固态粉末均匀地填充到所述 模具中， 所述 c步骤中， 通过高温烧结的方法对所述模具中的超材料介质基 板材料进行一体化成型。
8、 根据权利要求 7所述的一种超材料介质基板的加工方法， 其特征在 于： 所述固态粉末为陶瓷粉末与粘结剂的混合物。
9、 根据权利要求 1所述的一种超材料介质基板的加工方法， 其特征在 于： 所述 b步骤中， 将超材料介质基板的材料以液固混合物均匀地填充到所 述模具中， 所述 c步骤中， 通过冷却的方法对所述模具中的超材料介质基板 材料进行一体化成型， 固化。
10、根据权利要求 9所述的一种超材料介质基板的加工方法， 其特征在 于： 所述液固混合物为熔融塑料与陶瓷粉末的混合物。
11、 一种超材料介质基板， 由权利要求 1-10任一项所述的超材料介质 基板的加工方法制得， 其特征在于： 所述超材料基板中设置有孔形阵列， 所 述孔形阵列由多个孔状空隙阵列而成。
12、 根据权利要求 11所述的超材料介质基板， 其特征在于： 所述多个 孔状空隙呈疏密不等的非均匀分布。
13、 根据权利要求 11所述的超材料介质基板， 其特征在于： 所述多个 孔状空隙呈体积大小不等的非均匀分布。
14、 根据权利要求 11所述的超材料介质基板， 其特征在于： 所述多个 孔状空隙为针孔形。
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PCT/CN2011/084497 2011-04-28 2011-12-23 一种超材料介质基板及其加工方法 WO2012146037A1 (zh)

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CN102480012B (zh) 2013-02-13
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