WO2012123054A1 - Drucksensor - Google Patents
Drucksensor Download PDFInfo
- Publication number
- WO2012123054A1 WO2012123054A1 PCT/EP2012/000525 EP2012000525W WO2012123054A1 WO 2012123054 A1 WO2012123054 A1 WO 2012123054A1 EP 2012000525 W EP2012000525 W EP 2012000525W WO 2012123054 A1 WO2012123054 A1 WO 2012123054A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pressure sensor
- membrane
- electronic component
- organic substance
- sensor according
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0654—Protection against aggressive medium in general against moisture or humidity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Definitions
- the present invention relates to a pressure sensor comprising at least one variable in shape and / or size membrane and an electronic component, wherein at least one component of the electronic component is connected to the membrane such that upon application of an electrical voltage to the electronic component and change the shape and / or size of the membrane a change in a measurable in the component
- the present invention relates to a motor vehicle having the pressure sensor according to the invention.
- particulate filters which are used for the filtration of exhaust particles in motor vehicles, it is necessary to continuously the loading state of the particulate filter body with the
- Particle filter is determined. The higher the pressure gradient, the higher the
- a signal can be generated, which contains information about a necessary treatment or replacement of the particulate filter.
- a pressure sensor to be used for this purpose comprises a so-called sensor chip with a membrane that changes in shape and / or size when there are pressure changes, and an electronic component, of which at least one component is connected to the membrane in such a way that upon installation an electrical voltage on the electronic component and change in the shape and / or size of the membrane, a change in a physical quantity measurable in the component is detectable.
- the electronic component is connected by means of so-called bonding wires to the electronic periphery.
- the membrane is often located in or at an opening of a two volume separating partition.
- the pressure sensor can be designed such that it has at least on the side of the membrane on which the bonding wires are arranged, a gel layer which protects the membrane surface or the electronic component arranged there against deposits of exhaust particles or liquid or frozen Condensate and / or acid contained in the exhaust gas condensate is used.
- the pressure sensor must in addition to the above stresses caused by frozen condensate or exhaust particles and acid also mechanical stress, in particular in the form of vibrations, and thermal stress with
- the gel layer used to protect the chip therefore has a layer thickness of 1 mm to 3 mm. Nevertheless, it has been shown in continuous load tests as well as in practice that under certain circumstances, the life of the sensor may not be sufficient, which is due in particular to the problem of mechanical stress due to the freezing condensate, which may possibly cause obstruction or blocking of a pressure access.
- the object is achieved by the pressure sensor according to claim 1.
- a motor vehicle according to claim 10 which comprises the pressure sensor according to the invention.
- a pressure sensor which comprises at least one variable in shape and / or size membrane and an electronic component, wherein at least one component of the electronic component is connected to the membrane such that upon application of an electrical voltage on electronic component and change in the shape and / or size of the membrane, a change in a physical quantity measurable in the component is detectable, and at least one side of the membrane is coated with a non-crosslinked organic substance.
- a pressure sensor which has a so-called sensor chip with an integrated membrane.
- the non-crosslinked organic substance coating is preferably on the side of the membrane
- the pressure sensor forms a so-called sensor chip, in which the membrane is integrated, wherein the membrane is essentially configured by a two-dimensional surface area.
- the pressure sensor according to the invention may be or be a differential pressure sensor
- a differential pressure sensor measures the difference between two absolute pressures simultaneously applied to both sides of the sensor diaphragm.
- the relative pressure sensor differs from the differential pressure sensor in that atmospheric pressure is applied as reference on one side of the sensor diaphragm.
- the pressure sensor may also be an absolute pressure sensor.
- the absolute pressure sensor uses vacuum as the reference pressure.
- the pressure sensor according to the invention as a differential pressure sensor or as a relative or absolute pressure sensor, it preferably comprises two chambers, which are separated by a partition, in or on which the membrane is arranged.
- the chambers may be substantially closed cavities in a housing, in which also the membrane and the electronic component are arranged.
- the non-crosslinked organic substance used according to the invention is preferably a fat, wherein the term fat is also to be understood as meaning an oil, preferably with a bodying agent.
- the thus provided pressure sensor is relatively easy to manufacture and is characterized by a robust construction, through the structural design, the risk of deposition and freezing of condensate in the vicinity of the membrane or the piezoelectric element is reduced or prevented.
- the electronic component is a piezoresistive element, or that the electronic component is a capacitor.
- a piezoresistive pressure sensor is provided.
- Such a piezoresistive pressure sensor is predominantly made of silicon, wherein electrical resistances are applied to the membrane.
- the electrical resistances are preferably diffused in and their respective electrical resistance is deformation-dependent.
- the individual resistors can be connected together to form a resistance bridge.
- the change in the resistances is measured via the transverse bridge voltage, which is a measure of the deformation of the membrane and thus of the pressure difference between both sides of the sensor membrane.
- Pressure sensor chip is predominantly made of silicon. In his membrane is a
- Electrode of a capacitor diffused or applied as a conductive thin film.
- the second electrode of the capacitor is a stationary electrode and is opposite, on a non-movable part of the pressure sensor or the membrane. There is a vacuum between the membrane and the non-moving electrode.
- Pressurization deforms the membrane and thus changes the distance between the two opposing capacitor electrodes.
- the result is a capacitance change of the capacitor.
- the capacity is evaluated electronically and is a measure of the pressure applied to the membrane from the outside.
- the membrane has a gel layer.
- This gel layer may optionally cover the entire membrane, at least on one side thereof.
- the gel used may be an organic, crosslinked gel or a fluorine-based synthetic gel.
- the gel layer thickness is 1 mm to 3 mm, but also thicker or thinner layers should not be excluded from the subject of the invention.
- the layer of the non-crosslinked organic substance is arranged on the gel layer. That is, a gel layer is disposed on the membrane and the non-crosslinked organic substance is also coated on the gel layer as a layer. Alternatively, it is also possible that the substance is arranged directly on the membrane or the electronic component. The advantage of the arrangement of the substance layer on the gel layer is in addition to the protection of the membrane also a protection of the gel layer.
- the gel layer is arranged only on one side of the membrane and the layer of non-crosslinked organic substance is disposed on the side of the membrane opposite the gel layer.
- Embodiment thus one side of the membrane is protected by the gel layer and the other side protected by the substance layer.
- the substance layer is to be arranged in particular on the side on which the larger, chemical, mechanical or thermal loads are to be expected.
- gel layers are arranged on both sides of the membrane and layers of the non-crosslinked organic substance are arranged on the gel layers.
- the membrane or the electronic component is protected from both sides by a respective gel layer and a substance layer.
- the chamber is spatial except for one
- the non-crosslinked organic substance thus replaces the gas in the chamber as a carrier medium of the pressure signal.
- the pressure of the exhaust gas acts on the substance, which transfers the compressive stress accordingly to the membrane.
- the membrane is attached with its edges on or in the opening.
- this substance layer has a thickness of approximately 1 mm to 5 mm.
- a layer thickness of 2.5 mm to 3.5 mm, in particular 3 mm, may be provided.
- the pressure sensor may be configured such that at least the chamber in which the layer of the non-crosslinked organic substance is disposed has a
- Gas line opening which has a diameter of 1, 5 mm to 8 mm.
- the preferred size of the diameter of the gas line opening is between 2.5 mm - 6 mm.
- gas line opening diameters of 5 mm have proved favorable.
- the advantage of this embodiment is, in particular, that exhaust gas condensate can flow off unhindered from such dimensioned gas line openings, so that
- non-crosslinked organic substance has at least proportionally a silicone oil fat.
- the non-crosslinked organic substance consists entirely of the silicone oil fat.
- the substance may be at least partially prepared from a perfluoropolyether oil fat or completely formed by this grease.
- said silicone oil grease or perfluoropolyether oil grease comprises a bodying agent, that is, a viscosifying agent, such as PTFE (polytetrafluoroethylene) having particle sizes in the preferably single-digit micron range.
- a viscosifying agent such as PTFE (polytetrafluoroethylene) having particle sizes in the preferably single-digit micron range.
- the viscosity of the non-crosslinked organic substance is preferably between 150 mm 2 s -1 at 313 K and 40 mm 2 s -1 at 373 K.
- the above fats are non-flammable and relatively insensitive to high exhaust gas temperatures.
- the invention furthermore relates to a motor vehicle which has the pressure sensor according to the invention, with which the load state of the particle filter of the motor vehicle can be reliably determined in the aforementioned manner.
- FIG. 1 shows a pressure sensor according to the invention with a coating of the non-crosslinked organic substance
- Figure 2 shows a pressure sensor according to the invention with gel layer and non-crosslinked organic substance
- Figure 3 shows a pressure sensor according to the invention with gel layer and non-crosslinked organic substance having only one chamber
- FIG. 4 shows a pressure sensor according to the invention with gel layer and non-crosslinked organic substance
- Figure 5 shows a pressure sensor according to the invention only with coating of the non-crosslinked organic substance
- FIG. 6 shows a pressure sensor according to the invention with a vacuum chamber.
- FIGS. 1 and 2 show that the pressure sensor comprises a housing 10 in which a partition wall 20 is arranged, which encloses the housing 10 into a first chamber 11 and a second chamber 12, wherein the second chamber 12 defines the volume adjacent to the partition 20.
- Pressure sensors can have the function of a differential pressure sensor.
- the connected to the first chamber 11 and second chamber 12 gas line openings 22 are connected to the exhaust pipe respectively before and behind the particulate filter, so that the gas pressure 60, which is illustrated in the accompanying figures with the arrow acts in the chambers 11 and 12 respectively ,
- FIG. 3 shows an embodiment of the pressure sensor according to the invention, which likewise has the function of a differential pressure sensor.
- Pressure sensor has only one chamber 11, which is limited by the partition wall 20.
- the Gas effetsöffnuhg 22 is connected to the first chamber 11 with the exhaust line upstream of the particulate filter.
- the gas line opening 22 on the opposite side of the first chamber 11 is preferably connected to the exhaust line downstream of the particulate filter.
- All three embodiments of the pressure sensor have in common that, depending on the difference between the gas pressures 60 on the two sides of the partition 20, so in Figures 1 and 2 in the first chamber 11 and the second chamber 12 and in Figure 3 of the first Chamber 11 acting gas pressure with respect to the ambient pressure, a relatively thin-walled membrane 31 deformed, which is arranged on or in an opening 21 of the partition wall 20.
- the membrane 31 is thus part of a so-called pressure sensor chip 32, which also includes the electronic component 30.
- non-crosslinked organic substance 40 is preferably a fat.
- this substance 40 is disposed on both sides of the membrane 31.
- the partition wall 20 serves not only to subdivide the housing 10 into the chambers 11 and 12, but also to the line or as a carrier of bonding wires or electrical lines 24, which are connected to the electronic component 30 for the purpose of measuring the respective physical size.
- Component 30 the substance layer 40 also fulfills the function of protecting these electrical leads 24.
- Substance layer 40 kept away from the electronic component 30. Due to the relatively low strength of the non-crosslinked organic substance 40, the gas pressure 60 on the
- the substance layer 40 may also be combined with a gel layer 50, as shown in FIG.
- This gel layer 50 is preferably arranged on the side of the membrane 31, on which the bonding wires or the electrical leads 24 are arranged.
- a layer of the non-crosslinked organic substance 40 is provided on the gel layer.
- a substance layer 40 On the side facing away from the electrical lines 24 of the membrane 31 may also be provided a substance layer 40, as shown in Figure 2.
- the invention is not limited to certain layer thicknesses of the non-crosslinked organic substance 40, but it can also - as shown in Figure 3 - be provided that the respective chamber in which the substance 40 is arranged completely through the substance 40 and filled by the gel 50.
- a nozzle adjoining the dividing wall 20 and forming a gas line opening 22 may at least partially be filled with the non-crosslinked organic substance 40, as also shown in FIG.
- This embodiment of the filling with the non-crosslinked organic substance 40 causes no condensate to accumulate in a chamber or in a gas line opening, so that after a corresponding drop in temperature no frozen condensate can affect the electronic component 30 in its function.
- FIGS. 4 and 5 show a pressure sensor designed as a relative pressure sensor according to the invention. One is connected to the first chamber 1 1
- Gas line opening preferably connected to the exhaust pipe upstream of the particulate filter, so that the gas pressure 60, which prevails in the exhaust pipe, via the gas line opening 22 also acts in the first chamber 11.
- the second chamber 12 is connected via an opening 22 with the environment. As a result, the pressure prevailing in the second chamber is the
- FIGS. 4 and 5 differ in that, in the pressure sensor according to the invention in FIG. 4, a gel layer 50 is still present between the membrane 31 and the layer of the non-crosslinked organic substance 40, as well as the layers of gel 50 and non-crosslinked organic substance 40 by
- FIG. 6 shows an absolute pressure sensor according to the invention.
- This pressure sensor has only one chamber, namely the first chamber 11, in which variable pressure conditions can prevail.
- the pressure in the first chamber 1 1 is transferred to the membrane 31 via the layer of the non-crosslinked organic substance 40 and the gel layer 50.
- To support the membrane 31 rests on a glass base 80, which in turn on a support plate 70th supported.
- the shape of the diaphragm 31 also changes in this embodiment of the pressure sensor according to the invention, so that the resistance of a piezoresistive element arranged on the diaphragm 31 is changed or the capacitance of a capacitor arranged on the diaphragm 31 is changed ,
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011013912.5 | 2011-03-15 | ||
DE102011013912A DE102011013912A1 (de) | 2011-03-15 | 2011-03-15 | Drucksensor |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012123054A1 true WO2012123054A1 (de) | 2012-09-20 |
Family
ID=45688405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2012/000525 WO2012123054A1 (de) | 2011-03-15 | 2012-02-06 | Drucksensor |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102011013912A1 (en22) |
WO (1) | WO2012123054A1 (en22) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2555829A (en) * | 2016-11-11 | 2018-05-16 | Sensata Technologies Inc | Encapsulations for MEMS sense elements and wire bonds |
CN113091986A (zh) * | 2017-04-20 | 2021-07-09 | 霍尼韦尔国际公司 | 压力传感器组件 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3211394B1 (en) | 2016-02-29 | 2021-03-31 | Melexis Technologies NV | Semiconductor pressure sensor for harsh media application |
US10481024B2 (en) | 2017-04-20 | 2019-11-19 | Honeywell International Inc. | Pressure sensor assembly including a cured elastomeric force transmitting member |
RU206162U1 (ru) * | 2021-03-30 | 2021-08-26 | Акционерное общество "Промышленная группа "Метран" (АО "ПГ "Метран") | Датчик давления с компенсацией изменения объема жидкости при её кристаллизации |
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US5686162A (en) * | 1994-09-26 | 1997-11-11 | Motorola, Inc. | Protecting electronic components in acidic and basic environments |
EP1091201A2 (en) * | 1999-10-04 | 2001-04-11 | Shin-Etsu Chemical Co., Ltd. | Pressure sensor unit |
DE10223357A1 (de) | 2002-05-25 | 2003-12-04 | Bosch Gmbh Robert | Vorrichtung zur Druckmessung |
DE102008012895A1 (de) * | 2008-03-06 | 2009-09-10 | Robert Bosch Gmbh | Korrosionsschutzgel und Korrosionsschutzbeschichtung für elektronische und/oder mikromechanische Bauteile |
US20100077862A1 (en) * | 2008-09-30 | 2010-04-01 | Hubert Benzel | Workpiece Composite and Use of the Workpiece Composite |
Family Cites Families (6)
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JP2819783B2 (ja) * | 1990-06-08 | 1998-11-05 | 株式会社デンソー | 半導体圧力センサ |
FR2764113B1 (fr) * | 1997-05-28 | 2000-08-04 | Motorola Semiconducteurs | Dispositif capteur et son procede de fabrication |
JP2004198147A (ja) * | 2002-12-16 | 2004-07-15 | Toyoda Mach Works Ltd | 圧力センサ |
DE102004033475A1 (de) * | 2004-02-09 | 2005-08-25 | Robert Bosch Gmbh | Korrosionsschutz für Drucksensoren |
JP2006177859A (ja) * | 2004-12-24 | 2006-07-06 | Denso Corp | 圧力センサ |
DE102007042976B4 (de) * | 2007-09-10 | 2012-12-13 | Continental Automotive Gmbh | Drucksensor und Verfahren zu dessen Herstellung |
-
2011
- 2011-03-15 DE DE102011013912A patent/DE102011013912A1/de not_active Withdrawn
-
2012
- 2012-02-06 WO PCT/EP2012/000525 patent/WO2012123054A1/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5686162A (en) * | 1994-09-26 | 1997-11-11 | Motorola, Inc. | Protecting electronic components in acidic and basic environments |
EP1091201A2 (en) * | 1999-10-04 | 2001-04-11 | Shin-Etsu Chemical Co., Ltd. | Pressure sensor unit |
DE10223357A1 (de) | 2002-05-25 | 2003-12-04 | Bosch Gmbh Robert | Vorrichtung zur Druckmessung |
DE102008012895A1 (de) * | 2008-03-06 | 2009-09-10 | Robert Bosch Gmbh | Korrosionsschutzgel und Korrosionsschutzbeschichtung für elektronische und/oder mikromechanische Bauteile |
US20100077862A1 (en) * | 2008-09-30 | 2010-04-01 | Hubert Benzel | Workpiece Composite and Use of the Workpiece Composite |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2555829B (en) * | 2016-11-11 | 2019-11-20 | Sensata Technologies Inc | Encapsulations for MEMS sense elements and wire bonds |
US20180134545A1 (en) * | 2016-11-11 | 2018-05-17 | Sensata Technologies, Inc. | Encapsulations for mems sense elements and wire bonds |
DE102017126640A1 (de) | 2016-11-11 | 2018-05-17 | Sensata Technologies, Inc. | Kapselung für sensorische mirkoelektromechanische Systemelemente und Drahtbonds |
JP2018075710A (ja) * | 2016-11-11 | 2018-05-17 | センサータ テクノロジーズ インコーポレーテッド | Mems検知素子およびワイヤーボンドの封止部 |
KR20180053264A (ko) * | 2016-11-11 | 2018-05-21 | 센사타 테크놀로지스, 인크 | Mems 감지 요소 및 와이어 접합부를 위한 인캡슐레이션 |
CN108072483A (zh) * | 2016-11-11 | 2018-05-25 | 森萨塔科技公司 | Mems感测元件和导线接合部的密封 |
GB2555829A (en) * | 2016-11-11 | 2018-05-16 | Sensata Technologies Inc | Encapsulations for MEMS sense elements and wire bonds |
US10519031B2 (en) | 2016-11-11 | 2019-12-31 | Sensata Technologies, Inc. | Encapsulations for mems sense elements and wire bonds |
CN108072483B (zh) * | 2016-11-11 | 2021-11-09 | 森萨塔科技公司 | Mems感测元件和导线接合部的密封 |
JP7120752B2 (ja) | 2016-11-11 | 2022-08-17 | センサータ テクノロジーズ インコーポレーテッド | Mems検知素子およびワイヤーボンドの封止部 |
KR102484047B1 (ko) * | 2016-11-11 | 2023-01-02 | 센사타 테크놀로지스, 인크 | Mems 감지 요소 및 와이어 접합부를 위한 인캡슐레이션 |
CN113091986A (zh) * | 2017-04-20 | 2021-07-09 | 霍尼韦尔国际公司 | 压力传感器组件 |
CN113091986B (zh) * | 2017-04-20 | 2022-11-08 | 霍尼韦尔国际公司 | 压力传感器组件 |
Also Published As
Publication number | Publication date |
---|---|
DE102011013912A1 (de) | 2012-09-20 |
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