WO2012122619A1 - Micro-dispositif de dégazeur à système microélectromécanique - Google Patents
Micro-dispositif de dégazeur à système microélectromécanique Download PDFInfo
- Publication number
- WO2012122619A1 WO2012122619A1 PCT/CA2011/000275 CA2011000275W WO2012122619A1 WO 2012122619 A1 WO2012122619 A1 WO 2012122619A1 CA 2011000275 W CA2011000275 W CA 2011000275W WO 2012122619 A1 WO2012122619 A1 WO 2012122619A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- getter
- mems
- microdevice
- thin
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- each supporting leg 107 has a slight tilt angle relative to the horizontal in order to connect the platform 101 to the substrate 105, recalling that both elements are spaced by the vertical gap g as previously shown in FIG. 5.
- the surface area required for a MEMS getter microdevice 100 can be determined according to the amount of gases that is expected to be released in the microcavity during the lifetime of the package.
- the surface area of a MEMS getter typically scales to less than 1 ⁇ 1 mm 2 .
- the corrugations 115 can be precisely registered with respect to the serpentine pattern of the resistor element 103, so that the spatial uniformity of the getter temperature is maximized during its activation.
- the corrugations 115 run parallel to the longest segments of the resistor element 103.
- the resistor element 103 has been sketched in solid thick line throughout its full length in FIG. 10. However, it must be recalled that the element 103 is located below the getter thin film 111 , so that most of its length would be hidden when viewing the microdevice 150 from the top.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
Abstract
L'invention porte sur un micro-dispositif de dégazeur à MEMS (système microélectromécanique) pour réguler la pression ambiante à l'intérieur des boîtiers hermétiques qui renferment différents types de dispositifs à MEMS, photoniques ou optoélectroniques. Le micro-dispositif de dégazeur tourne autour d'une plateforme suspendue à une certaine hauteur au-dessus d'un substrat, et qui est supportée par des pattes de support ayant une faible conductance thermique. Des couches sont déposées sur la plateforme, ces couches comprenant un élément de résistance à motifs appropriés, une couche de dissipation de la chaleur, et, finalement, un matériau de dégazeur en film mince. Lorsqu'un courant électrique circule à travers le matériau de dégazeur en film mince, l'élément de résistance chauffe jusqu'à ce ledit matériau atteigne sa température d'activation. Le matériau de dégazeur absorbe alors les espèces gazeuses qui pourraient être présentes dans le boîtier hermétique, telles que des espèces gazeuses gênant éventuellement le fonctionnement des dispositifs renfermés dans les boîtiers, tout en réduisant leur durée de vie. La faible conductance thermique entre la plateforme et le substrat aide à empêcher des détériorations causées aux dispositifs environnants lorsque le micro-dispositif de dégazeur à MEMS est chauffé à sa température d'activation, et réduit également la puissance électrique requise pour atteindre la température d'activation.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CA2011/000275 WO2012122619A1 (fr) | 2011-03-11 | 2011-03-11 | Micro-dispositif de dégazeur à système microélectromécanique |
CA2822484A CA2822484C (fr) | 2011-03-11 | 2011-03-11 | Micro-dispositif de degazeur a systeme microelectromecanique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CA2011/000275 WO2012122619A1 (fr) | 2011-03-11 | 2011-03-11 | Micro-dispositif de dégazeur à système microélectromécanique |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012122619A1 true WO2012122619A1 (fr) | 2012-09-20 |
Family
ID=46829972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CA2011/000275 WO2012122619A1 (fr) | 2011-03-11 | 2011-03-11 | Micro-dispositif de dégazeur à système microélectromécanique |
Country Status (2)
Country | Link |
---|---|
CA (1) | CA2822484C (fr) |
WO (1) | WO2012122619A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016225751A (ja) * | 2015-05-28 | 2016-12-28 | セイコーエプソン株式会社 | 電子デバイス、量子干渉装置、原子発振器、心磁計、発振器、電子機器、移動体および電子デバイスの製造方法 |
CN108367912A (zh) * | 2015-12-08 | 2018-08-03 | 罗伯特·博世有限公司 | 具有激光激活的吸气剂材料的传感器元件 |
US11181424B2 (en) | 2018-02-15 | 2021-11-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Process for manufacturing a microbolometer containing vanadium oxide-based sensitive material |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110078020B (zh) * | 2019-05-10 | 2022-02-08 | 江苏物联网研究发展中心 | 一种基于吸气剂热-电复合激活的真空烘烤工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7115436B2 (en) * | 2004-02-12 | 2006-10-03 | Robert Bosch Gmbh | Integrated getter area for wafer level encapsulated microelectromechanical systems |
US20080213539A1 (en) * | 2005-03-14 | 2008-09-04 | Commissariat A L'energie Atomique | Thin Film Getter Protection |
JP2011131207A (ja) * | 2009-11-17 | 2011-07-07 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | 2つの活性化温度を有するゲッタ及びこのゲッタを備える構造 |
EP2362230A1 (fr) * | 2010-02-18 | 2011-08-31 | Honeywell International Inc. | Paquet de capteurs MEMS |
US8040587B2 (en) * | 2006-05-17 | 2011-10-18 | Qualcomm Mems Technologies, Inc. | Desiccant in a MEMS device |
-
2011
- 2011-03-11 CA CA2822484A patent/CA2822484C/fr active Active
- 2011-03-11 WO PCT/CA2011/000275 patent/WO2012122619A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7115436B2 (en) * | 2004-02-12 | 2006-10-03 | Robert Bosch Gmbh | Integrated getter area for wafer level encapsulated microelectromechanical systems |
US20080213539A1 (en) * | 2005-03-14 | 2008-09-04 | Commissariat A L'energie Atomique | Thin Film Getter Protection |
US8040587B2 (en) * | 2006-05-17 | 2011-10-18 | Qualcomm Mems Technologies, Inc. | Desiccant in a MEMS device |
JP2011131207A (ja) * | 2009-11-17 | 2011-07-07 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | 2つの活性化温度を有するゲッタ及びこのゲッタを備える構造 |
EP2362230A1 (fr) * | 2010-02-18 | 2011-08-31 | Honeywell International Inc. | Paquet de capteurs MEMS |
Non-Patent Citations (1)
Title |
---|
KOVACS: "Micromachined Transducers Sourcebook", 1998, article KOVACS * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016225751A (ja) * | 2015-05-28 | 2016-12-28 | セイコーエプソン株式会社 | 電子デバイス、量子干渉装置、原子発振器、心磁計、発振器、電子機器、移動体および電子デバイスの製造方法 |
CN108367912A (zh) * | 2015-12-08 | 2018-08-03 | 罗伯特·博世有限公司 | 具有激光激活的吸气剂材料的传感器元件 |
US11181424B2 (en) | 2018-02-15 | 2021-11-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Process for manufacturing a microbolometer containing vanadium oxide-based sensitive material |
Also Published As
Publication number | Publication date |
---|---|
CA2822484A1 (fr) | 2012-09-20 |
CA2822484C (fr) | 2015-07-21 |
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