WO2012093867A2 - Antenne et dispositif électronique comprenant celle-ci - Google Patents

Antenne et dispositif électronique comprenant celle-ci Download PDF

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Publication number
WO2012093867A2
WO2012093867A2 PCT/KR2012/000113 KR2012000113W WO2012093867A2 WO 2012093867 A2 WO2012093867 A2 WO 2012093867A2 KR 2012000113 W KR2012000113 W KR 2012000113W WO 2012093867 A2 WO2012093867 A2 WO 2012093867A2
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WO
WIPO (PCT)
Prior art keywords
antenna
radiator
carrier
present
electronic device
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Application number
PCT/KR2012/000113
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English (en)
Korean (ko)
Other versions
WO2012093867A3 (fr
Inventor
류병훈
성원모
오상진
박정미
Original Assignee
주식회사 이엠따블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이엠따블유 filed Critical 주식회사 이엠따블유
Publication of WO2012093867A2 publication Critical patent/WO2012093867A2/fr
Publication of WO2012093867A3 publication Critical patent/WO2012093867A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00—Processes for producing special ornamental bodies
    • B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
    • B44C5/0407—Ornamental plaques, e.g. decorative panels, decorative veneers containing glass elements
    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element

Definitions

  • the present invention relates to an antenna and an electronic device including the same by applying an LDS processing method having an indirect feeding type structure through via hole processing to an antenna carrier so as to be insensitive to external factors affecting antenna performance.
  • IT information technology
  • the electronic device is essentially equipped with an antenna for transmitting and receiving wireless signals, which are classified into an external antenna and an internal antenna according to the mounting position in the electronic device.
  • an external antenna for example, a rod antenna or a helical antenna
  • a rod antenna or a helical antenna is formed by protruding from the electronic device, so that the risk of breakage is large and it is not used due to design vulnerability, but instead, it is mounted inside the electronic device.
  • Built-in antennas are widely used.
  • an antenna carrier which is a three-dimensional structure, is formed in order to realize desired radiation characteristics by spaced apart from the main board of the electronic device and the antenna radiator at a predetermined interval, and to reduce the SAR. I use it.
  • An antenna radiator for transmitting and receiving signals of a specific frequency band is formed on the surface of the antenna carrier to be electrically connected to the feeder and the ground of the main board.
  • LDS laser direct structuring
  • the LS processing method after the upper and lower surfaces of the carrier are metallized, when the metallized upper and lower surfaces are electrically connected, the sides of the carrier are metallized to connect the upper and lower surfaces, and the side of the carrier is laser irradiated. It is not easy to select the angle, so there is a high possibility of disconnection, and there is a problem that even if metallization wears out, disconnection occurs.In addition, the laser irradiation angle or the number of LS machining is increased for the processing of the side of the carrier even in the machining procedure It can also lead to a rise in manufacturing costs.
  • the performance of the antenna using the LPS processing method is sensitive to external factors (for example, when the electronic device is held by the hand or close to the head, the reception sensitivity decreases, etc.).
  • the benefits of the LDS processing method which maximizes the volume, are not realized by reducing the advantages of the LDS antenna structure or switching the design direction to a general press type.
  • Embodiments of the present invention to provide an antenna to which the LDS processing method is insensitive to external factors affecting the antenna performance.
  • embodiments of the present invention to provide an antenna that solves the problem of disconnection of the side of the antenna carrier while maximizing the advantages of the LDS processing method.
  • An antenna according to an exemplary embodiment of the present invention may include: an antenna carrier on which at least one first via hole and a second via hole are respectively formed, and firstly formed on both surfaces of the antenna carrier and electrically connected to each other through the first via hole. And a second radiator which is formed on both sides of the radiator and the antenna carrier, respectively, and is electrically connected through the second via hole, wherein the first radiator and the second radiator are spaced apart from each other.
  • Embodiments of the present invention provide the structure of the indirect feeding through the via hole to the antenna carrier, while maximizing the advantages of the LDS processing method while solving the problem of disconnection of the side of the antenna carrier and at the same time insensitive to external factors It is possible to provide an antenna.
  • FIG. 1 is a perspective view showing the structure of a typical press type antenna.
  • FIG. 2 is a view showing the bottom of a typical press type antenna.
  • FIG. 3 is a diagram illustrating the current distribution of the ground portion of the antenna illustrated in FIGS. 1 and 2 in the state where an external factor is applied.
  • FIG. 4 is a plan view illustrating a structure of an antenna according to an exemplary embodiment of the present invention.
  • FIG. 5 is a bottom view illustrating a structure of an antenna according to an exemplary embodiment of the present invention.
  • FIG. 6 is a sectional perspective view taken along line II ′ of FIG. 5;
  • FIG. 9 is a diagram illustrating a current distribution of a ground part of an electronic device including an antenna of the present invention in a state where an external factor is applied.
  • connection or coupling similarly include not only directly connected to or coupled from one component to another, but also transmitted through other components.
  • the antenna performance of a general press type and the antenna performance in a state in which free and external factors are applied The antenna structure and its performance according to the present invention will be described in detail.
  • the external factor refers to a state when the electronic device including the antenna is held by the hand (HAND) or when the electronic device including the antenna is near the head (HEAD).
  • the free state refers to a basic state in which external factors do not act on the antenna.
  • FIG. 1 is a perspective view illustrating a structure of a typical press type antenna
  • FIG. 2 is a view illustrating a bottom surface of a typical press type antenna
  • FIG. 3 is a state in which external factors are applied to FIGS. 1 and 2.
  • Figure is a diagram showing the current distribution in the ground portion of the antenna shown in.
  • a typical press type antenna 100 includes an antenna carrier 102 and a radiator 104, as shown in Figures 1 and 2.
  • the antenna 100 has a Planar Inverted-F Antenna (PIFA) structure in which the radiator 104 is configured in an inverted F-shape.
  • PIFA Planar Inverted-F Antenna
  • the antenna carrier 102 is used to space desired intervals between the main board of the electronic device and the radiator of the antenna to implement desired radiation characteristics and to reduce the electromagnetic wave absorption rate.
  • the radiator 104 is manufactured separately from the antenna carrier 102 and mechanically coupled to the antenna carrier 102 by press working.
  • a portion (A) and B portion (B) of the radiator 104 is bent to the bottom of the antenna carrier 102 serves to mechanically couple the radiator 104 and the antenna carrier 102.
  • the radiator 104 is electrically connected to a feeding part (not shown) of the main board through the portion A, and is connected to the ground portion of the main board through the portion B.
  • Table 1 shows simulation results of the antenna performance shown in FIGS. 1 and 2.
  • TRP Total Radiated Power
  • TIS Total Isotropic Sensitivity
  • HAND external factor
  • the average value (AVE) for each frequency in the DCS band shows that the TRP (21.86) in the external factor is reduced compared to the TRP (23.91) in the free state, and the TIS (-106) in the free state. It can be seen that the TIS (-103) in a state in which an external factor acts was reduced compared to Thus, it can be seen that the performance difference between the two states is 2.05 for TRP and 3.26 for TIS.
  • FIG. 4 is a plan view showing the structure of an antenna according to an embodiment of the present invention
  • Figure 5 is a bottom view showing the structure of an antenna according to an embodiment of the present invention
  • Figure 6 is a cross-sectional view taken along line II 'of FIG. Perspective view.
  • an antenna 200 includes an antenna carrier 202, a first radiator 204, and a second radiator 206.
  • the antenna 200 is manufactured by Laser Direct Structuring (LDS), which implements a radiator through a plating process after processing the surface of the antenna carrier 202 using a laser.
  • LDS resin injection molding may be applied to the antenna carrier 202.
  • the antenna carrier 202 is formed with a plurality of via holes 208 penetrating the antenna carrier 202 so that a predetermined radiator can be connected.
  • the first and second radiators 204, 206 of the antenna 200 are also formed on the top surface of the antenna carrier 202, as shown in FIG. 4, respectively, and as shown in FIG. 5, of the antenna carrier 202. It is also formed on the bottom surface.
  • the first radiator 204 formed on the top and bottom surfaces of the antenna carrier 202 is electrically connected to some of the via holes 208, and is connected to the top and bottom surfaces of the antenna carrier 202.
  • the formed second radiator 204 is electrically connected through further via holes 208. That is, the first radiators 204 and the second radiators 206 are connected through different via holes 208, respectively.
  • the C portion C of the first radiator 204 formed on the bottom surface of the antenna carrier 202 is electrically connected to a feeding part (not shown) of the main board to receive power
  • the second The D portion D of the radiator 206 is electrically connected to the ground portion of the main board.
  • the C portion C of the first radiator 204 may be connected to the ground portion of the main board
  • the D portion D of the second radiator 206 may be connected to the feed portion of the main board.
  • the C portion (C) of the first radiator 204 and the D portion (D) of the second radiator 206 are connected to the first feed portion and the second feed portion, respectively, Both may be connected to ground.
  • the first radiator 204 formed on the lower surface of the antenna carrier 202 is electrically connected to the first radiator 204 and the via holes 208 formed on the upper surface.
  • the via hole 208 penetrating through the antenna carrier 208 is electrically plated during the LDS process to electrically connect the first radiator 204 formed on the upper and lower surfaces of the antenna carrier 208. .
  • the first radiator 204 and the second radiator 206 are spaced apart by a predetermined distance from each of the upper and lower surfaces of the antenna carrier 202.
  • a plurality of second radiators 206 are formed on the upper surface of the antenna carrier 202 with respect to each of the via holes.
  • the first radiator 204 is formed in a shape that surrounds the second radiator 206 spaced apart from the second radiator 206. That is, the first radiator 204 connected to the feeder part of the main board is electrically separated from the second radiator 206 connected to the ground part. Therefore, the antenna 200 has a structure in which the feed part and the ground part are not directly connected, but are indirectly connected through electrical coupling between the first radiator 204 and the second radiator 206.
  • the separation distance between the first radiator 204 and the second radiator 206 should be considered the area, length, etc. of the radiator, and may vary according to the intention of the antenna designer. However, the separation distance should be set to be equal to or less than a distance that can cause coupling by the electromagnetic field between the first radiator 204 and the second radiator 206.
  • the via hole 208 is formed in a shape that widens in the opening direction of the lower surface of the antenna carrier 202.
  • the inside of the via hole 208 may be plated.
  • the via hole 208 may be formed in a shape that widens in the opening direction of the upper surface of the antenna carrier 202.
  • it may be plated up to the inside of the via hole 208.
  • the radiator is formed on the upper and lower surfaces of the antenna carrier by LDS processing, and the sides of the antenna carrier are metallized to electrically connect the radiators formed on the upper and lower surfaces of the antenna carrier.
  • a disconnection problem may occur in which the side surface of the antenna carrier is not properly plated, and thus the radiators formed on the top and bottom surfaces of the antenna carrier are not electrically connected.
  • the embodiment of the present invention connects the radiators formed on the upper and lower surfaces of the antenna carrier 202 through the via holes 208 formed through the antenna carrier 202, the radiator is limited to the antenna carrier space. It can solve the problem of disconnection on the side of the antenna carrier while still utilizing the advantages of the LDS processing method that maximizes the volume of the antenna.
  • FIG 7 and 8 are views illustrating the first radiator and the second radiator separated from the antenna of the present invention.
  • the first radiators 204 formed on the upper and lower surfaces of the antenna carrier are electrically connected to each other through via holes.
  • the second radiators 206 formed on the top and bottom surfaces of the antenna carrier are also electrically connected to each other via via holes.
  • the first radiator 204 and the second radiator 206 are physically separated from each other.
  • the C portion C of the first radiator 204 is connected to the power supply portion, and the D portion D of the second radiator 206 is connected to the ground portion.
  • the C portion C of the first radiator 204 may be connected to the ground portion of the main board, and the D portion D of the second radiator 206 may be connected to the feed portion of the main board.
  • the C portion C of the first radiator 204 and the D portion D of the second radiator 206 are connected to the first feed portion and the second feed portion, respectively. Both may be connected to ground.
  • the performance of the antenna of the present invention is improved and is insensitive to external factors. Will be described later.
  • Table 2 shows simulation results of the antenna performance of the present invention.
  • TRP Total Radiated Power
  • TIS Total Isotropic Sensitivity
  • HAND external factor
  • the average value (AVE) for each frequency in the DCS band shows that the TRP (23.68) of the external factor is reduced and the TIS (-106) of the free state compared to the TRP (24.19) of the free state. It can be seen that the TIS (-104) in the state where an external factor acted was reduced compared to). Also, it can be seen that the performance difference between the two states is 0.51 for TRP and 2.63 for TIS.
  • the difference between the free state and the external factor applied state in the DCS band is -2.05 and -3.26 for TRP and TIS, respectively.
  • the difference between the free state and the external factor applied state in the DCS band is -0.51 and -2.63 for the TRP and TIS, respectively.
  • the antenna of the present invention has a smaller change in TRP and TIS between a free state and a state where external factors are applied as compared to a general PIFA antenna. That is, compared with the general PIFA antenna, it is less affected by external factors.
  • FIG. 9 is a diagram illustrating a current distribution of a ground part of an electronic device including an antenna of the present invention in a state where an external factor is applied.
  • Table 3 shows a comparison between the performance of a general PIFA antenna and the performance of the antenna of the present invention in a free state
  • Table 4 shows a comparison of the performance of a general PIFA antenna and the performance of an antenna of the present invention in an external factor. Drawing.
  • the TRP and TIS of the antenna of the present invention are generally improved compared to the TRP and TIS of the PIFA antenna in the free state. Accordingly, looking at the average value (AVE) of TRP and TIS in the DCS band, the antenna of the present invention is improved by 0.3 for TRP and 0.2 for TIS compared to PIFA antenna. Also, in the PCS band, the average value (AVE) of TRP and TIS is improved by 0.31 for TRP and 0.27 for TIS.
  • the TRP and TIS of the antenna of the present invention as a whole improved compared to the TRP and TIS of the PIFA antenna even when the external factors are applied. Accordingly, when looking at the average value (AVE) of TRP and TIS in the DCS band, the antenna of the present invention is improved by 1.82 for TRP and 0.86 for TIS compared to the PIFA antenna. In addition, in the PCS band, the average value (AVE) of TRP and TIS is improved by 0.45 for TRP and 0.09 for TIS.
  • the antenna of the present invention shows a higher performance than the conventional PIFA antenna in each of the free state or the external factor applied state.
  • the antenna according to the embodiment of the present invention electrically connects the first radiator and the second radiator formed on the upper and lower surfaces of the antenna carrier using via holes, respectively, and the first radiator and the second radiator.
  • an electronic device including an antenna according to an embodiment of the present invention has a higher antenna performance than an electronic device including a general PIFA antenna, and is free even when held by a hand or close to a head.
  • the performance change is small compared to the state.

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  • Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne une antenne et un dispositif électronique comprenant celle-ci., Selon un mode de réalisation de l'invention, l'antenne comprend: un support d'antenne présentant au moins un premier trou d'une série de trous d'interconnexion et un second trou d'une série de trous d'interconnexion; une première série d'éléments rayonnants formés sur chacun des deux côtés du support d'antenne et se raccordant électriquement à travers la première série de trous d'interconnexion; et une seconde série d'éléments rayonnants formés sur chacun des deux côtés du support d'antenne et se raccordant électriquement à travers la seconde série de trous d'interconnexion, la première série d'éléments rayonnants et la seconde série d'éléments rayonnants étant séparés l'une de l'autre. On obtient ainsi une antenne de structure novatrice qui optimise la puissance de traitement des LDS, résout en même temps le problème de déconnexion sur les surfaces latérales du support d'antenne tout en étant insensible aux facteurs externes.
PCT/KR2012/000113 2011-01-05 2012-01-05 Antenne et dispositif électronique comprenant celle-ci WO2012093867A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110000793A KR101156486B1 (ko) 2011-01-05 2011-01-05 안테나 및 이를 포함하는 전자 장치
KR10-2011-0000793 2011-01-05

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WO2012093867A2 true WO2012093867A2 (fr) 2012-07-12
WO2012093867A3 WO2012093867A3 (fr) 2012-11-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021126823A1 (fr) * 2019-12-19 2021-06-24 Avx Antenna, Inc. D/B/A Ethertronics, Inc. Ensemble antenne à structure directe par laser (lds)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160100593A (ko) 2015-02-16 2016-08-24 주식회사 에이티앤씨 메탈 프레임을 이용한 전자계 장치
KR20160100594A (ko) 2015-02-16 2016-08-24 주식회사 에이티앤씨 메탈 프레임을 이용한 전자계 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080054964A (ko) * 2006-12-14 2008-06-19 스카이크로스 인코포레이티드 내장형 안테나 모듈 및 이의 제조방법
KR20090001767U (ko) * 2007-08-21 2009-02-25 (주)에이스안테나 일체형 이동통신 내장형 안테나
KR20090124042A (ko) * 2008-05-29 2009-12-03 주식회사 케이티테크 복층의 연결 구조를 가진 패턴 안테나 및 이를 이용한이동통신단말기
KR20100097318A (ko) * 2009-02-26 2010-09-03 주식회사 모비텍 다중배열 패턴 안테나

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080054964A (ko) * 2006-12-14 2008-06-19 스카이크로스 인코포레이티드 내장형 안테나 모듈 및 이의 제조방법
KR20090001767U (ko) * 2007-08-21 2009-02-25 (주)에이스안테나 일체형 이동통신 내장형 안테나
KR20090124042A (ko) * 2008-05-29 2009-12-03 주식회사 케이티테크 복층의 연결 구조를 가진 패턴 안테나 및 이를 이용한이동통신단말기
KR20100097318A (ko) * 2009-02-26 2010-09-03 주식회사 모비텍 다중배열 패턴 안테나

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021126823A1 (fr) * 2019-12-19 2021-06-24 Avx Antenna, Inc. D/B/A Ethertronics, Inc. Ensemble antenne à structure directe par laser (lds)

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WO2012093867A3 (fr) 2012-11-29
KR101156486B1 (ko) 2012-06-18

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