WO2012093867A2

WO2012093867A2 - Antenna and electronic device having same

Info

Publication number: WO2012093867A2
Application number: PCT/KR2012/000113
Authority: WO
Inventors: 류병훈; 성원모; 오상진; 박정미
Original assignee: 주식회사 이엠따블유
Priority date: 2011-01-05
Filing date: 2012-01-05
Publication date: 2012-07-12
Also published as: WO2012093867A3; KR101156486B1

Abstract

Disclosed are an antenna and an electronic device having same. The antenna according to an embodiment of the present invention comprises: an antenna carrier with at least one of each of first via holes and second via holes formed thereon; first radiators formed on each of the two sides of the antenna carrier and connecting electrically through the first via holes; and second radiators formed on each of the two sides of the antenna carriers and connecting electrically through the second via holes, wherein the first radiators and the second radiators are separated from each other. Thus, the present invention provides an antenna having a novel structure that maximizes the strengths of LDS processing method while resolving the problem of disconnection on the side surfaces of the antenna carrier, and is, at the same time, insensitive to the external factors.

Description

Antenna and electronic device including same

The present invention relates to an antenna and an electronic device including the same by applying an LDS processing method having an indirect feeding type structure through via hole processing to an antenna carrier so as to be insensitive to external factors affecting antenna performance.

Recently, with the development of information technology (IT) technology, electronic devices (for example, mobile phones, smartphones, etc.) that provide various services such as voice, video, wireless internet, and GPS services through wireless data communication have been developed. have.

The electronic device is essentially equipped with an antenna for transmitting and receiving wireless signals, which are classified into an external antenna and an internal antenna according to the mounting position in the electronic device.

Among them, an external antenna (for example, a rod antenna or a helical antenna) is formed by protruding from the electronic device, so that the risk of breakage is large and it is not used due to design vulnerability, but instead, it is mounted inside the electronic device. Built-in antennas are widely used.

In the case of the built-in antenna, an antenna carrier, which is a three-dimensional structure, is formed in order to realize desired radiation characteristics by spaced apart from the main board of the electronic device and the antenna radiator at a predetermined interval, and to reduce the SAR. I use it.

An antenna radiator for transmitting and receiving signals of a specific frequency band is formed on the surface of the antenna carrier to be electrically connected to the feeder and the ground of the main board.

As a method of forming an antenna radiator on the surface of the antenna carrier, a press method of manufacturing an antenna radiator and mechanically coupling it to a carrier separately from a method of directly plating the surface of the carrier (plating or printing plating by etching). This has been used mainly.

Recently, a laser direct structuring (LDS) processing method has been developed, which is formed by injection molding an antenna carrier using a material containing a heavy metal composite, and irradiating a laser to the surface of the carrier to form a radiator pattern. After exposing the metal seed, this part is plated and metallized. According to the LDS processing method, not only the antenna of various frequency bands can be manufactured by maximizing the volume of the radiator in a limited carrier space, but also the antenna manufacturing time and manufacturing process can be shortened and productivity can be improved. .

However, according to the LS processing method, after the upper and lower surfaces of the carrier are metallized, when the metallized upper and lower surfaces are electrically connected, the sides of the carrier are metallized to connect the upper and lower surfaces, and the side of the carrier is laser irradiated. It is not easy to select the angle, so there is a high possibility of disconnection, and there is a problem that even if metallization wears out, disconnection occurs.In addition, the laser irradiation angle or the number of LS machining is increased for the processing of the side of the carrier even in the machining procedure It can also lead to a rise in manufacturing costs.

On the other hand, when the performance of the antenna using the LPS processing method is sensitive to external factors (for example, when the electronic device is held by the hand or close to the head, the reception sensitivity decreases, etc.). In many cases, the benefits of the LDS processing method, which maximizes the volume, are not realized by reducing the advantages of the LDS antenna structure or switching the design direction to a general press type.

Therefore, while maximizing the advantages of the LDS processing method while solving the problem of disconnection of the side of the antenna carrier, there is an urgent need for the development of an antenna applying a new LDS processing method insensitive to external factors.

Embodiments of the present invention to provide an antenna to which the LDS processing method is insensitive to external factors affecting the antenna performance.

In addition, embodiments of the present invention to provide an antenna that solves the problem of disconnection of the side of the antenna carrier while maximizing the advantages of the LDS processing method.

Another technical problem according to embodiments of the present invention can be understood by the following description, which can be realized by the means and combinations thereof shown in the claims.

An antenna according to an exemplary embodiment of the present invention may include: an antenna carrier on which at least one first via hole and a second via hole are respectively formed, and firstly formed on both surfaces of the antenna carrier and electrically connected to each other through the first via hole. And a second radiator which is formed on both sides of the radiator and the antenna carrier, respectively, and is electrically connected through the second via hole, wherein the first radiator and the second radiator are spaced apart from each other.

Embodiments of the present invention provide the structure of the indirect feeding through the via hole to the antenna carrier, while maximizing the advantages of the LDS processing method while solving the problem of disconnection of the side of the antenna carrier and at the same time insensitive to external factors It is possible to provide an antenna.

1 is a perspective view showing the structure of a typical press type antenna.

2 is a view showing the bottom of a typical press type antenna.

FIG. 3 is a diagram illustrating the current distribution of the ground portion of the antenna illustrated in FIGS. 1 and 2 in the state where an external factor is applied.

4 is a plan view illustrating a structure of an antenna according to an exemplary embodiment of the present invention.

5 is a bottom view illustrating a structure of an antenna according to an exemplary embodiment of the present invention.

FIG. 6 is a sectional perspective view taken along line II ′ of FIG. 5;

7 and 8 illustrate only the first radiator and the second radiator separated from the antenna of the present invention.

9 is a diagram illustrating a current distribution of a ground part of an electronic device including an antenna of the present invention in a state where an external factor is applied.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, this is only an exemplary embodiment and the present invention is not limited thereto.

In describing the present invention, when it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of a user or an operator. Therefore, the definition should be made based on the contents throughout the specification.

In the following description, the terms connection or coupling similarly include not only directly connected to or coupled from one component to another, but also transmitted through other components.

Hereinafter, in order to easily understand the improved effect of the antenna according to an embodiment of the present invention, first, the antenna performance of a general press type and the antenna performance in a state in which free and external factors are applied The antenna structure and its performance according to the present invention will be described in detail. Here, the external factor refers to a state when the electronic device including the antenna is held by the hand (HAND) or when the electronic device including the antenna is near the head (HEAD). . In addition, the free state refers to a basic state in which external factors do not act on the antenna.

FIG. 1 is a perspective view illustrating a structure of a typical press type antenna, FIG. 2 is a view illustrating a bottom surface of a typical press type antenna, and FIG. 3 is a state in which external factors are applied to FIGS. 1 and 2. Figure is a diagram showing the current distribution in the ground portion of the antenna shown in.

A typical press type antenna 100 includes an antenna carrier 102 and a radiator 104, as shown in Figures 1 and 2. Here, the antenna 100 has a Planar Inverted-F Antenna (PIFA) structure in which the radiator 104 is configured in an inverted F-shape. In addition, the antenna carrier 102 is used to space desired intervals between the main board of the electronic device and the radiator of the antenna to implement desired radiation characteristics and to reduce the electromagnetic wave absorption rate.

In the antenna 100, the radiator 104 is manufactured separately from the antenna carrier 102 and mechanically coupled to the antenna carrier 102 by press working.

On the other hand, A portion (A) and B portion (B) of the radiator 104 is bent to the bottom of the antenna carrier 102 serves to mechanically couple the radiator 104 and the antenna carrier 102. In addition, the radiator 104 is electrically connected to a feeding part (not shown) of the main board through the portion A, and is connected to the ground portion of the main board through the portion B.

Hereinafter, referring to Table 1, the performance of the press type PIFA antenna 100 will be described. Here, Table 1 shows simulation results of the antenna performance shown in FIGS. 1 and 2.

Table 1

First, TRP (Total Radiated Power) refers to the total radiated power of the antenna, and TIS (Total Isotropic Sensitivity) refers to the total isotropic strength of the antenna, that is, the reception strength of the antenna. In addition, the free state indicates a basic state in which an external factor does not act on the antenna, and the external factor (HAND) indicates a state when the electronic device is held by hand.

Referring to Table 1, the average value (AVE) for each frequency in the DCS band shows that the TRP (21.86) in the external factor is reduced compared to the TRP (23.91) in the free state, and the TIS (-106) in the free state. It can be seen that the TIS (-103) in a state in which an external factor acts was reduced compared to Thus, it can be seen that the performance difference between the two states is 2.05 for TRP and 3.26 for TIS.

On the other hand, if the average value (AVE) between the free state and the external factor in the PCS band, the performance difference between the two states can be seen that the TRP by 3.28, TIS by 2.87.

Referring to FIG. 3, it can be seen that in an electronic device including a press type PIFA antenna 100, currents of the ground portion are unevenly distributed in the state where an external factor is applied.

Hereinafter, an antenna according to an embodiment of the present invention will be described in detail below in order to compare with a general press type PIFA antenna 100.

4 is a plan view showing the structure of an antenna according to an embodiment of the present invention, Figure 5 is a bottom view showing the structure of an antenna according to an embodiment of the present invention, Figure 6 is a cross-sectional view taken along line II 'of FIG. Perspective view.

4 and 5, an antenna 200 according to an embodiment of the present invention includes an antenna carrier 202, a first radiator 204, and a second radiator 206.

The antenna 200 is manufactured by Laser Direct Structuring (LDS), which implements a radiator through a plating process after processing the surface of the antenna carrier 202 using a laser. In this case, the LDS resin injection molding may be applied to the antenna carrier 202.

The antenna carrier 202 is formed with a plurality of via holes 208 penetrating the antenna carrier 202 so that a predetermined radiator can be connected.

The first and

second radiators

204, 206 of the antenna 200 are also formed on the top surface of the antenna carrier 202, as shown in FIG. 4, respectively, and as shown in FIG. 5, of the antenna carrier 202. It is also formed on the bottom surface. The first radiator 204 formed on the top and bottom surfaces of the antenna carrier 202 is electrically connected to some of the via holes 208, and is connected to the top and bottom surfaces of the antenna carrier 202. The formed second radiator 204 is electrically connected through further via holes 208. That is, the first radiators 204 and the second radiators 206 are connected through different via holes 208, respectively.

Referring to FIG. 5, the C portion C of the first radiator 204 formed on the bottom surface of the antenna carrier 202 is electrically connected to a feeding part (not shown) of the main board to receive power, and the second The D portion D of the radiator 206 is electrically connected to the ground portion of the main board. On the contrary, the C portion C of the first radiator 204 may be connected to the ground portion of the main board, and the D portion D of the second radiator 206 may be connected to the feed portion of the main board. On the other hand, in the antenna structure using two feeds, the C portion (C) of the first radiator 204 and the D portion (D) of the second radiator 206 are connected to the first feed portion and the second feed portion, respectively, Both may be connected to ground.

Here, the first radiator 204 formed on the lower surface of the antenna carrier 202 is electrically connected to the first radiator 204 and the via holes 208 formed on the upper surface. Referring to FIG. 6, the via hole 208 penetrating through the antenna carrier 208 is electrically plated during the LDS process to electrically connect the first radiator 204 formed on the upper and lower surfaces of the antenna carrier 208. .

On the other hand, the second radiator 206 formed on the lower surface of the antenna carrier 202 and the second radiator 206 formed on the upper surface of the via hole 208, like the first radiator 204 shown in FIG. Is electrically connected).

However, as shown in FIGS. 4 and 5, the first radiator 204 and the second radiator 206 are spaced apart by a predetermined distance from each of the upper and lower surfaces of the antenna carrier 202. In more detail, a plurality of second radiators 206 are formed on the upper surface of the antenna carrier 202 with respect to each of the via holes. The first radiator 204 is formed in a shape that surrounds the second radiator 206 spaced apart from the second radiator 206. That is, the first radiator 204 connected to the feeder part of the main board is electrically separated from the second radiator 206 connected to the ground part. Therefore, the antenna 200 has a structure in which the feed part and the ground part are not directly connected, but are indirectly connected through electrical coupling between the first radiator 204 and the second radiator 206.

The separation distance between the first radiator 204 and the second radiator 206 should be considered the area, length, etc. of the radiator, and may vary according to the intention of the antenna designer. However, the separation distance should be set to be equal to or less than a distance that can cause coupling by the electromagnetic field between the first radiator 204 and the second radiator 206.

As such, since a predetermined distance exists between the first radiator 204 and the second radiator 206, a coupling according to an electromagnetic field occurs between the two radiators, and the second radiator 206 is connected to the first radiator by the coupling. Power is indirectly received from the radiator 204.

On the other hand, referring to Figure 6, the via hole 208 is formed in a shape that widens in the opening direction of the lower surface of the antenna carrier 202. In this case, when the lower surface of the antenna carrier 202 is plated, the inside of the via hole 208 may be plated. In addition, the via hole 208 may be formed in a shape that widens in the opening direction of the upper surface of the antenna carrier 202. Of course, in this case, when plating the upper surface of the antenna carrier 202, it may be plated up to the inside of the via hole 208.

Conventionally, the radiator is formed on the upper and lower surfaces of the antenna carrier by LDS processing, and the sides of the antenna carrier are metallized to electrically connect the radiators formed on the upper and lower surfaces of the antenna carrier. As a result, a disconnection problem may occur in which the side surface of the antenna carrier is not properly plated, and thus the radiators formed on the top and bottom surfaces of the antenna carrier are not electrically connected. However, since the embodiment of the present invention connects the radiators formed on the upper and lower surfaces of the antenna carrier 202 through the via holes 208 formed through the antenna carrier 202, the radiator is limited to the antenna carrier space. It can solve the problem of disconnection on the side of the antenna carrier while still utilizing the advantages of the LDS processing method that maximizes the volume of the antenna.

7 and 8 are views illustrating the first radiator and the second radiator separated from the antenna of the present invention.

7 and 8, the first radiators 204 formed on the upper and lower surfaces of the antenna carrier are electrically connected to each other through via holes. Similarly, the second radiators 206 formed on the top and bottom surfaces of the antenna carrier are also electrically connected to each other via via holes. However, the first radiator 204 and the second radiator 206 are physically separated from each other.

Here, the C portion C of the first radiator 204 is connected to the power supply portion, and the D portion D of the second radiator 206 is connected to the ground portion. On the contrary, the C portion C of the first radiator 204 may be connected to the ground portion of the main board, and the D portion D of the second radiator 206 may be connected to the feed portion of the main board. Further, in the antenna structure using two feeds, the C portion C of the first radiator 204 and the D portion D of the second radiator 206 are connected to the first feed portion and the second feed portion, respectively. Both may be connected to ground.

As such, when the indirect feeding method is applied between the first radiator 204 and the second radiator 206 by using the via hole processing, the performance of the antenna of the present invention is improved and is insensitive to external factors. Will be described later.

Table 2 shows simulation results of the antenna performance of the present invention.

TABLE 2

Referring to Table 2, the average value (AVE) for each frequency in the DCS band shows that the TRP (23.68) of the external factor is reduced and the TIS (-106) of the free state compared to the TRP (24.19) of the free state. It can be seen that the TIS (-104) in the state where an external factor acted was reduced compared to). Also, it can be seen that the performance difference between the two states is 0.51 for TRP and 2.63 for TIS.

On the other hand, when the average value (AVE) between the free state and the external factor is applied in the PCS band, it can be seen that the performance difference between the two states differs by 3.14 for the TRP and 3.05 for the TIS.

The simulation results of the antenna of the present invention and the simulation results of the general PIFA antenna shown in Table 2 are as follows.

First, looking at the PIFA antenna, the difference between the free state and the external factor applied state in the DCS band is -2.05 and -3.26 for TRP and TIS, respectively.

On the other hand, in the antenna of the present invention, the difference between the free state and the external factor applied state in the DCS band is -0.51 and -2.63 for the TRP and TIS, respectively.

As described above, it can be seen that the antenna of the present invention has a smaller change in TRP and TIS between a free state and a state where external factors are applied as compared to a general PIFA antenna. That is, compared with the general PIFA antenna, it is less affected by external factors.

Comparing Fig. 3 and Fig. 9 showing the current distribution of the ground portion of the electronic device including the general PIFA antenna, it can be seen that the current distribution appears uniformly at the ground portion of the electronic device including the antenna of the present invention. That is, the embodiment of the present invention implements an antenna that is stronger in external factors than the general PIFA antenna.

Hereinafter, the performance of a general PIFA antenna and the antenna of the present invention will be described in detail.

Table 3 shows a comparison between the performance of a general PIFA antenna and the performance of the antenna of the present invention in a free state, and Table 4 shows a comparison of the performance of a general PIFA antenna and the performance of an antenna of the present invention in an external factor. Drawing.

TABLE 3

First, referring to Table 3, it can be seen that the TRP and TIS of the antenna of the present invention are generally improved compared to the TRP and TIS of the PIFA antenna in the free state. Accordingly, looking at the average value (AVE) of TRP and TIS in the DCS band, the antenna of the present invention is improved by 0.3 for TRP and 0.2 for TIS compared to PIFA antenna. Also, in the PCS band, the average value (AVE) of TRP and TIS is improved by 0.31 for TRP and 0.27 for TIS.

Table 4

On the other hand, referring to Table 4, it can be seen that the TRP and TIS of the antenna of the present invention as a whole improved compared to the TRP and TIS of the PIFA antenna even when the external factors are applied. Accordingly, when looking at the average value (AVE) of TRP and TIS in the DCS band, the antenna of the present invention is improved by 1.82 for TRP and 0.86 for TIS compared to the PIFA antenna. In addition, in the PCS band, the average value (AVE) of TRP and TIS is improved by 0.45 for TRP and 0.09 for TIS.

Thus, as a result of comparing the TRP and TIS value, the antenna of the present invention shows a higher performance than the conventional PIFA antenna in each of the free state or the external factor applied state.

In summary, the antenna according to the embodiment of the present invention electrically connects the first radiator and the second radiator formed on the upper and lower surfaces of the antenna carrier using via holes, respectively, and the first radiator and the second radiator. By applying an indirect feeding method through the electromagnetic field between the radiators, the performance is higher than that of the general PIFA antenna, and the performance change due to external factors is small.

Accordingly, an electronic device including an antenna according to an embodiment of the present invention has a higher antenna performance than an electronic device including a general PIFA antenna, and is free even when held by a hand or close to a head. The performance change is small compared to the state.

Although the present invention has been described in detail with reference to exemplary embodiments above, those skilled in the art to which the present invention pertains can make various modifications without departing from the scope of the present invention. Will understand. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.

Claims

An antenna carrier having at least one first via hole and a second via hole respectively formed;

First radiators formed on upper and lower surfaces of the antenna carrier and electrically connected to each other through the first via hole; And

Second radiators formed on upper and lower surfaces of the antenna carrier and electrically connected to each other through the second via hole;

Including;

And the first radiator and the second radiator are spaced apart from each other.
The antenna of claim 1, wherein the via hole is formed to have a shape widening in an opening direction of an upper surface or a lower surface of the antenna carrier.
The antenna according to claim 1, wherein the first radiator and the second radiator are formed in the antenna carrier by LDS processing.
An electronic device comprising the antenna according to any one of claims 1 to 3.