WO2012092028A1 - Appareil, système et procédé de micro-usinage haute résolution de films fins pour la projection de motifs de lumière - Google Patents

Appareil, système et procédé de micro-usinage haute résolution de films fins pour la projection de motifs de lumière Download PDF

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Publication number
WO2012092028A1
WO2012092028A1 PCT/US2011/066207 US2011066207W WO2012092028A1 WO 2012092028 A1 WO2012092028 A1 WO 2012092028A1 US 2011066207 W US2011066207 W US 2011066207W WO 2012092028 A1 WO2012092028 A1 WO 2012092028A1
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Prior art keywords
coating
light
stack
color
substrate
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PCT/US2011/066207
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English (en)
Inventor
Richard W. Hutton
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Hutton Richard W
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Publication of WO2012092028A1 publication Critical patent/WO2012092028A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings

Definitions

  • This disclosure relates generally to light pattern projection equipment. More specifically, this disclosure relates to an apparatus, system, and method for high- resolution micro-machining of thin films for light pattern projection .
  • Light pattern or "image” projection is a widely-used way of expressing a mood or expression for a particular event or scene in architectural and live performance lighting situations, such as theatrical productions, videos, films, display lighting, and general illumination.
  • images are created using slide-type devices that are placed in the projection gate of a lighting projector.
  • Each slide is typically called a stencil or "gobo".
  • Gobos may be as simple as hand-cut or stamped images on stainless steel, brass, or thin aluminum. These types of materials work well with low- level light sources and low-resolution projections and lenses.
  • This disclosure provides an apparatus, system, and method for high-resolution micro-machining of thin films for light pattern projection.
  • an apparatus in a first embodiment, includes a substantially transparent substrate and a coating on one side of the substrate.
  • the coating includes a stack of alternating layers of high refractive index and low refractive index materials.
  • the coating has (i) a first area having a first thickness and configured to allow passage of light of a first specified color and (ii) a second area having a second thickness and configured to allow passage of light of a second specified color different than the first specified color.
  • a method for use with a gobo blank.
  • the gobo blank includes a substantially transparent substrate having on one side a coating with a stack of alternating layers of high refractive index and low refractive index materials.
  • the coating is substantially reflective to visible light.
  • the method includes removing a first portion of the coating to a first depth in a first area of the coating, where a remaining portion of the coating in the first area passes light of a first specified color.
  • the method also includes removing a second portion of the coating to a second depth in a second area of the coating, where a remaining portion of the coating in the second area passes light of a second specified color different than the first specified color.
  • a system in a third embodiment, includes a light source, a positioning system, and a controller.
  • the positioning system is configured to position a beam from the light source and/or a gobo blank.
  • the gobo blank includes a substantially transparent substrate having on one side a coating with a stack of alternating layers of high refractive index and low refractive index materials.
  • the coating is substantially reflective to visible light.
  • the controller is configured to control the positioning system and/or the light source in order to remove a first portion of the coating to a first depth in a first area of the coating such that a remaining portion of the coating in the first area passes light of a first specified color.
  • the controller is also configured to control the positioning system and/or the light source in order to remove a second portion of the coating to a second depth in a second area of the coating such that a remaining portion of the coating in the second area passes light of a second specified color different than the first specified color.
  • an apparatus in a fourth embodiment, includes a substantially transparent substrate and a coating on one side of the substrate.
  • the coating includes a stack of alternating layers of high refractive index and low refractive index materials.
  • the coating is substantially reflective to visible light.
  • the coating has a thickness enabling passage of light of any visible color through the coating based on controlled depth removal of at least one portion of the coating.
  • FIGURES 1 through 3 illustrate example gobo blanks with a coating stack in accordance with this disclosure
  • FIGURES 4 through 6 illustrate example processed gobos that transmit different single colors of light in accordance with this disclosure
  • FIGURES 7 and 8 illustrate example processed gobos that transmit more complex images in accordance with this disclosure.
  • FIGURES 9 through 11 illustrate example systems for processing gobo blanks in accordance with this disclosure.
  • FIGURES 1 through 11 discussed below, and the various embodiments used to describe the principles of the present invention in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the invention. Those skilled in the art will understand that the principles of the invention may be implemented in any type of suitably arranged device or system.
  • this disclosure describes a monolithic thin film-coated substrate for use as a gobo blank, a method for producing high-resolution gobos, and a processing system for manufacturing high-resolution gobos. Details of these different aspects are provided below.
  • a coating stack design for gobo blanks is provided that may be used in the systems and methods described below.
  • a gobo blank includes a substantially transparent substrate coated on one side with alternating layers of high refractive index and low refractive index materials. This creates a dichroic stack that is very highly reflective to the visible portion of the light spectrum (about 400nm to about 700nm) . Substrates such as this may be used to fabricate a monolithic full-color high-resolution gobo. These substrates may also be used for making black and white gobos.
  • FIGURES 1 through 3 illustrate example gobo blanks with a coating stack in accordance with this disclosure.
  • FIGURE 1 illustrates a first example gobo blank with a coating stack.
  • the gobo blank here represents a monolithic thin film- coated substrate (MTFCS) 10.
  • MTFCS 10 can be patterned to create a black and white or color image by controlling the depth removal of a thin film stack 13, which is formed by alternating layers of high and low refractive index materials.
  • the MTFCS 10 includes a transparent substrate 12.
  • the substrate 12 is generally transparent to light in a wavelength range of interest, such as from about 400nm to about 700nm.
  • the substrate 12 can be formed from any suitable material (s), such as a material having a low coefficient of thermal expansion like B0R0FL0AT 33 available from SCHOTT GLASS of Elmsford, NY or other similar material.
  • suitable material such as a material having a low coefficient of thermal expansion like B0R0FL0AT 33 available from SCHOTT GLASS of Elmsford, NY or other similar material.
  • Other transparent rigid or flexible material (s) may be used depending on the application, such as for low heat applications like LED projectors or other applications.
  • the stack 13 generally includes alternating layers having higher and lower refractive indices.
  • the alternating layers in the stack 13 may or may not have different thicknesses.
  • the alternating layers in the stack 13 could include different transparent oxides.
  • the layers of the stack 13 form a reflective mirror, such as one that is at least about 95% reflective to light having wavelengths from about 400 nanometers to about 700 nanometers.
  • Each layer in the stack 13 can include any suitable material (s) and can be formed in any suitable manner.
  • the stack 13 could be formed separately and then bonded or otherwise attached to the substrate 12, or the stack 13 could be formed on the substrate 12.
  • the reflective layer 14 is reflective in a wavelength range of interest, such as at least about 90% reflective to light having wavelengths from about 400 nanometers to about 700 nanometers.
  • the reflective layer 14 operates to further block light that may pass through the stack 13.
  • the reflective layer 14 can include any suitable material (s) and can be formed in any suitable manner.
  • the reflective layer 14 could be formed separately and then bonded or otherwise attached to the stack 13, or the reflective layer 14 could be formed on the stack 13.
  • a dark mirror 15 is formed or otherwise placed on the reflective layer 14.
  • the dark mirror 15 has a low reflectivity to light in a wavelength range of interest, such as less than about 3% from about 350 nanometers to about 700 nanometers.
  • the dark mirror 15 provides a back reflection suppressor to projection optics of a lighting projector.
  • the dark mirror 15 can include any suitable material (s) and can be formed in any suitable manner.
  • the dark mirror 15 could be formed separately and then bonded or otherwise attached to the reflective layer 14, or the dark mirror 15 could be formed on the reflective layer 14.
  • a Multi-Layer Anti-Reflective (MLAR) coating 16 is formed or otherwise placed on the side of the substrate 12 opposite the stack 13.
  • the MLAR coating 16 is highly transmissive to certain light entering the MTFCS 10 (from below in this example) , such as at least about 95% transmissive for light from about 350 nanometers to about 700 nanometers.
  • the MLAR coating 16 therefore operates to reduce light loss at an air-glass interface and allows higher transmission of light through the MTFCS 10.
  • the MLAR coating 16 is also transmissive to a controlled laser beam used to remove portions of the dark mirror 15, the reflective layer 14, and the stack 13 as explained in more detail below.
  • the MLAR coating 16 can include any suitable material (s) and can be formed in any suitable manner.
  • the MLAR coating 16 could be formed separately and then bonded or otherwise attached to the substrate 12, or the MLAR coating 16 could be formed on the substrate 12.
  • FIGURE 2 illustrates a second example gobo blank with a coating stack.
  • an MTFCS 20 includes a transparent substrate 12 having a stack 13 on one side and an MLAR coating 16 on another side. Over the stack 13 in this example is a matte finish black aluminum layer 17. No reflective layer 14 or dark mirror 15 is shown in FIGURE 2. Note, however, that in other embodiments, the matte finish black aluminum layer 17 may be used along with either or both of the reflective layer 14 and the dark mirror 15.
  • FIGURE 3 illustrates a third example gobo blank with a coating stack.
  • an MTFCS 30 includes a transparent substrate 12 having a stack 13 on one side. However, no MLAR coating 16 is provided on the opposing side of the substrate 12, and no additional layers 15-17 are provided over the stack 13.
  • FIGURES 1 through 3 illustrate examples of gobo blanks with a coating stack 13
  • each stack 13 could include any number of alternating layers.
  • an embodiment of an MTFCS could include any combination of features from FIGURES 1 through 3.
  • a processing technique uses micro- machining to selectively remove material from a thin film stack 13 on a monolithic substrate 12 to desired depth (s) in desired pattern (s) .
  • This allows for the creation of black and white or color images on gobo blanks.
  • the selective removal may be accomplished in any suitable manner, such as by using the laser systems described below.
  • a processing technique for processing an MTFCS to create a gobo is referred to as a "micro-machining process," although this does not imply that features of a certain size (such as micrometer- sized features) must be created.
  • FIGURES 4 through 6 illustrate example processed gobos that transmit different single colors of light in accordance with this disclosure. Note that while these figures are described with respect to gobo blanks similar in structure to the MTFCS 10 of FIGURE 1, the same or similar techniques could be used with gobo blanks similar in structure to the MTFCS 20 or MTFCS 30 of FIGURE 2 or 3 or other suitable MTFCS.
  • a controlled and focused laser beam 11 (such as a UV beam having a wavelength of about 355 nanometers and pulse widths in the nanosecond range or shorter) is used to etch at least partially through the stack 13.
  • the laser beam 11 can be used to "cold” ablate through the dark mirror 15, the reflective layer 14, and some or all of the stack 13 in a controlled depth removal.
  • UV irradiation and pulse widths below the microsecond range, "cold" material ablation with its subsequent conversion into plasma can occur at temperatures below the usual vaporization levels of the materials in the layers 13-15. In this way, it is possible to maintain laser spot size without significant or any thermal melt-back in the material not removed.
  • the laser beam 11 is used to remove all of the layers 13-15 down to the substrate 12 in a specified area 41 of an MTFCS 40. Substantially all visible light is transmitted through that area 41, while other (non- etched) areas of the MTFCS 40 reflect substantially all visible light. This allows the MTFCS 40 to pass white light through the area 41 and block light in other areas.
  • the laser beam 11 is used to remove all of the layers 14-15 and part of the top layer in the stack 13 in a specified area 51 of an MTFCS 50. Visible light at the blue end of the spectrum can be transmitted through the area 51, while other (non-etched) areas of the MTFCS 50 reflect substantially all visible light. This allows the MTFCS 50 to pass bluish light through the area 51 and block light in other areas .
  • the laser beam 11 is used to remove all of the layers 14-15 and most layers in the stack 13 in a specified area 61 of an MTFCS 60. Visible light at the red end of the spectrum can be transmitted through the area 61, while other (non-etched) areas of the gobo 60 reflect substantially all visible light. This allows the MTFCS 60 to pass redish light through the area 61 and block light in other areas .
  • FIGURES 4 through 6 illustrate examples of processed gobos 40-60 that transmit different colors of light
  • the stack 13 could include any number of alternating layers.
  • other colors can be obtained by etching the stack 13 to different depths.
  • more complex images can also be produced using the processing technique described above.
  • digital data of a desired image can be entered into computer software and processed through software.
  • the software can determine color values for each pixel or area of the desired image.
  • components such as those described below with respect to FIGURES 9 through 11
  • color values for pixels can be created with no screen angles.
  • color values for pixels and a screen angle for each color can be created.
  • laser energy can be applied to a substrate 12 in order to remove all layers of the stack 13 in desired areas to create a clear passage for light. These areas represent white portions of an image, and other areas where the stack 13 remains represent black portions of the image.
  • To produce a color image different portions of the stack 13 are removed to different depths in order to create different colors. By removing atomic layers of the stack 13 using precise control of the laser pulses and energy, a desired wavelength of transmitted light through the stack 13 can be obtained to create a specific color in a projected image .
  • the stack 13 can be thick enough to block most or all visible light, much like a cold mirror or broadband mirror. As the stack 13 is micro-machined down in thickness, it begins transmitting visible light at the blue end of the visible light spectrum. The thinner the stack 13 gets, the more the transmitted visible light shifts up towards the red end of the spectrum. In other words, the stack 13 can originally have a thickness that allows, after controlled depth removal of at least one portion of the stack 13, passage of light of any visible color through the stack 13. An example of this is shown in FIGURE 7.
  • FIGURE 7 illustrates an example processed gobo 70 that transmits an image in accordance with this disclosure.
  • the gobo 70 has four areas 71-74. When light 25 passes through the gobo 70, these areas 71-74 transmit red, green, yellow, and blue light, respectively, as shown in view 75. In this way, a multi-colored gobo may be produced having the stack 13 removed to specified depths in selected areas to produce the desired colors. While FIGURE 7 illustrates a very simplified example, a highly-complex full-color photographic image can be generated using this technique.
  • the laser beam 11 is used to remove all of the layers 14-15 and different amounts of the stack 13 in different areas 81 and 83 of a gobo 80.
  • the gobo 80 creates a complex color representing a combination of colors formed in the different areas 81 and 83 of the gobo 80.
  • the areas 81 and 83 can represent "sub- pixels" of a single pixel, where the sub-pixels use two or more discrete colors (such as blue in area 81 and red in area 83) to make a complex color (such as magenta) .
  • Other complex colors may be produced using other combinations of sub-pixel colors. Note that as described above, a complex color can also be created using combinations of adjacent pixels.
  • Other (non- etched) areas of the gobo 80 can reflect substantially all visible light.
  • one or more clear (white) pixels or sub-pixels may be placed in a gobo, such as in a specified pattern.
  • the clear pixels or sub-pixels pass a desired amount of white light to mix with the colored light of the intended area, thereby producing a desired saturation.
  • the stack 13 may leak some small percentage of visible light that could be a problem for contrast, as well as being a visual distraction. Applying the reflective layer 14 or other coating over the stack 13 may help block such unwanted light.
  • the dark mirror 15 can be used for contrast enhancement on a projection lens side of the gobo. When a gobo is placed in a projector, the reflective mirror side faces a light source, and the dark mirror side faces the projection lens. Light that is reflected from the glass surface of the projection lens back onto the gobo can produce a halo or ghost image if reflected from the gobo back through the projection lens. The dark mirror 15 operates to absorb light reflected back onto the gobo from the projection lens, reducing the halo and increasing the contrast.
  • pixel means an image element that typically has a dimension small enough not to be individually resolved by a viewer when the gobo's image is projected at its expected magnification. In other embodiments, however, for graphic effect or other reasons, a pixel may deliberately be sized to be visible to a viewer under such conditions.
  • sub-pixel means one of a plurality of image elements that make up a pixel. In some embodiments, a pixel may be an undivided image element. In other embodiments, a pixel may be divided into sub-pixels. A sub-pixel may be 1/2, 1/3, 1/4, or other portion of the size of a pixel. Typically, individual sub-pixels forming a pixel will have two or more different visual effects (color, transmittance, etc.) selected to produce a desired combined visual effect from the pixel.
  • a gobo can also be fabricated to provide gray scale control within an image.
  • three types of gray scale control may be used. The first is gray scale resulting from a mix of C.M.Y.K. color pixels or sub-pixels.
  • the second type is a mix of clear and opaque pixels or sub- pixels that produce a perceived intensity of light through a coated substrate.
  • the third type controls an amount of reflective material, such as aluminum, as it is deposited on the substrate in a vacuum coating process.
  • All three types of gray scale may be produced using the methods and systems described in this disclosure.
  • a laser' s short pulse duration and output power control within each pulse train may be used to remove precise and calculated amounts of colored, opaque, or reflective material in a gobo blank without disturbing underlying material. This can be done in order to create a controlled passage of projected light through each pixel, sub-pixel, or region of an image. In turn, this will create the effect of gray scale or intensity control within the projected image.
  • a gobo can further be fabricated having a single color dichroic material bonded or otherwise attached to a transparent substrate 12.
  • a short-pulsed laser can be used to selectively change the hue of each pixel by controlled removal of specific amounts of the single color dichroic material without disturbing underlying layers of the material. This provides for multiple hues of the same color.
  • each substrate can be micro-machined to produce a desired color and saturation for one aspect of an image. Once the substrates are micro- machined, the substrates can be aligned on top of one another and secured to each other via glue or other means of securing. The result is a full-color image suitable for projection from a lighting instrument.
  • each substrate has different color filters on opposite sides of the substrate.
  • the color substrates can be bonded to another substrate having a Black ( W K") layer.
  • One of the color substrates may have a Cyan (“C") layer on one side and a Yellow (“Y”) layer on the other side.
  • Another of the color substrates may have a Magenta (“M”) layer on one side and a Green (“G”) or other color layer on the other side.
  • Each substrate is micro-machined on each side to show the color and saturation for each aspect of the desired image.
  • the substrates are aligned on top of one another and then secured in place via glue or other means of securing. The result is a full-color image suitable for projection from a lighting instrument .
  • multiple substrates may be used having four coatings.
  • the four coatings may be C.M.Y.K., R.G.B., or Red/Green/Blue/Yellow ("R.G.B.Y").
  • R.G.B.Y Red/Green/Blue/Yellow
  • the combinations of colors described here are provided merely as examples, and any desired combination ( s ) of color coatings may be used.
  • Various micro-machining systems include a laser, such as a fast pulsed or ultra-fast pulsed ultraviolet laser system with a characteristic wavelength of about 355 nanometers and pulse durations in the nano-, pico- and femto-second regimes.
  • a laser beam may be optically coupled to a precision X-Y galvanometer system (or other means of beam steering) and/or an X-Y-Z table or gantry system to position a substrate under the marking area.
  • a positioning system, a camera imaging system, and a spectral monitoring system in conjunction with at least one computer and software system (or other controller) can be used for controlling and monitoring all parameters of the process, from pinhole inspection prior to an image being generated through inspection after the micro- machining process is complete.
  • the image (s) and substrate shape (s) to be manufactured can be entered into the controller in digital or other suitable format.
  • the controller can control each aspect of a micro-machining system to carry out desired functions, such as initial inspection for pinholes, positioning the substrate under a laser beam, laser micro-machining, substrate cutting, and final inspection.
  • a laser system may also be used for cutting a desired final shape of the gobo out of the substrate after an image is micro-machined, inspected, and centered though a vision system.
  • the same UV laser can be used to cut the final shape of the gobo out of the substrate.
  • a CO2 laser, a diamond scribe, or other device can be used for the cutting process. All cutting functions can be interfaced with an appropriate positioning system, spectral and imaging vision system, and controller controls. If a CO2 laser is used for cutting, the system can be designed so that both the CO2 laser beam and the UV laser beam are focused in the same Z plane and can be co-parallel, overlaid or separate with respect to each other.
  • Certain embodiments of the systems in this disclosure are capable of accepting large substrates, such as a 30" coated glass disc or square, on a machining or positioning table.
  • These systems may be designed to check the substrate for pinholes (via a vision system and a light source placed on the underside of the substrate) in the area where each image is to be processed.
  • the controller decides whether the viewed area is acceptable and, if so, initiates micro- machining of the desired image (s) .
  • developing images can be checked spectrally and visually, as well as upon completion.
  • these systems can utilize a vision system to center the image (s) for cutting of a desired shape out of the substrate using the UV laser, CO2 laser, or other device. This process can be repeated over the entire substrate for each gobo.
  • Laser cut glass may be five times stronger than glass cut using diamond scribe and break techniques.
  • the controller may instruct an imaging system to acquire an image of a completed gobo.
  • the system may compare the acquired image to an original digital data file for X-Y marking parameters and color comparison.
  • the controller can pass or fail the micro- machined image based on the analysis. If the image fails, the controller may perform a sequence of actions to repair the defective image. If the image is non-repairable or has previous reported pinhole defects, the controller may instruct the system to bypass that area and use the next section of a substrate.
  • the controller can use data from the original data file compared to the acquired image verification file to determine the precise center of the image for substrate cutting. That information is relayed to the positioning system to move the disc under the laser beam, diamond scribe, or other component and proceed with the cut-out of the gobo . This can help to ensure that images are substantially or exactly centered in all manufactured gobos .
  • FIGURES 9 through 11 illustrate example systems for processing gobo blanks in accordance with this disclosure.
  • a system 200 includes a fast pulsed or ultra-fast pulsed ultraviolet laser 100.
  • an AVIA or TALASKER UV laser from COHERENT LASERS of Santa Clara, CA is used because of its minimal thermal interaction with material and to obtain a minimal spot size of approximately 4 ⁇ diameter resulting in maximum resolutions of about 6,000 dpi.
  • the system 200 can control the overall stack thickness in a given area and control the transmitted wavelengths of light through that specific area.
  • the depth removal is controlled by feedback from a spectral measuring device 220, such as the MODEL 600 spectrophotometer from TRICOR SYSTEMS of Elgin, IL or the 20/20 FPD microspectrophotometer from CRAIC TECHNOLOGIES of San Dimas, CA (or other spectral and hyperspectral measuring devices) .
  • a spectral measuring device 220 such as the MODEL 600 spectrophotometer from TRICOR SYSTEMS of Elgin, IL or the 20/20 FPD microspectrophotometer from CRAIC TECHNOLOGIES of San Dimas, CA (or other spectral and hyperspectral measuring devices) .
  • the micro-machining system 200 is shown with a fixed beam configuration.
  • a laser beam 11 is set at a fixed focus location, and an MTFCS 10 is moved via an X-Y-Z stage 235 to a sequence of desired positions under the laser beam 11.
  • a controller 210 including a general host computer with digital software serves for interfacing with the UV laser 100 for pulse and power control, with the stage 235, with a beam profile monitoring camera 225, and with the spectral monitoring device 220.
  • the controller 210 includes any hardware, software, firmware, or combination thereof for controlling the operation of at least part of the system 200.
  • the controller 210 includes at least one processing unit, such as a microprocessor, microcontroller, digital signal processor, field programmable gate array, or application-specific integrated circuit.
  • the controller 210 also includes at least one memory storing instructions and data used, generated, or collected by the controller 210 in operating the system 200.
  • a visible output light table 230 is secured to the X-Y-Z positioning stage 235 so that visible light is directed upwards towards the spectral monitoring device 220.
  • a UV turning mirror 222 (such as one that is at least about 98% reflective at about 355 nanometers and at least about 95% transmissive to visible light from about 400 to about 700 nanometers) is positioned at a 45° angle.
  • An incoming laser beam 102 is therefore directed down through a focusing lens 224 and to the MTFCS 10.
  • a small percentage of UV light 103 that transmits through the turning mirror 222 enters into the camera 225 to monitor the laser beam profile and energy at the controller 210.
  • a pulse is emitted out of the laser 100 in a very small diameter beam 101.
  • the beam passes through beam shaping and expanding optics 223 and is transformed, such as into a beam 102 with a 15mm diameter top hat beam profile.
  • a top hat beam profile produces an even energy distribution across the entire width of the laser beam.
  • Untreated beam profiles typically have a Gaussian distribution, with more energy in the center of the beam.
  • the laser beam 102 is then reflected off the turning mirror 222, sent through the focusing lens 224, and focused down such as to 4 microns.
  • the MTFCS 10 is placed on top of the visible light table 230 with the coated side up.
  • the MTFCS 10 can be a precut small single piece or a large substrate on which multiple images may be micro-machined.
  • a laser pulse When a laser pulse is released, it imparts an extremely high concentration of UV photons in a defined spot, breaking the chemical bonds and releasing the material from its neighboring bond structures in the MTFCS 10.
  • the pulses from the laser 100 are extremely short in duration, allowing "cold" ablation to occur .
  • the spectral monitoring device 220 takes a sample of the transmitted light 221 passing though the MTFCS 10 and compares the color data to an original color data file.
  • the controller 210 determines if the color of the transmitted light 221 matches that of the original data file and instructs the process to continue with a prescribed number of pulses to release if the sampled data does not match.
  • the X-Y-Z stage 235 is instructed to move to its next position. This process is repeated in rapid succession until an entire image is completed.
  • the controller 210 may command the positioning stage 235 to step in one or multiple axes to each position, and the sequence described above could be performed a row at a time.
  • the same fixed beam-type setup could be accomplished with all or some of the fixed beam apparatus mounted to an X-Y-Z gantry- type configuration so that the MTFCS 10 is positioned on the light table 230 in a fixed position and the fixed beam system is translated above the MTFCS 10 to each micro-machining location .
  • FIGURE 10 illustrates another micro-machining system
  • the system 300 uses a set of precision X-Y galvanometers 341-342 in a scan head 340 configuration to direct a laser beam 11 across the MTFCS 10 in a controlled movement.
  • Other means of beam steering could also be used, such as high-speed solid-state laser beam scanners like the KTN SCANNER from NTT ADVANCED TECHNOLOGY of Shinjuku, Tokyo, Japan.
  • a controller 210 (such as a general host computer with digital software) serves for interfacing with the laser 100 for pulse and power control, the X-Y scan head 340, a motor-driven precision X-Y-Z positioning stage 235, a beam profile monitoring camera 225, and a spectral monitoring device 220.
  • a visible output light table 230 is secured to the X-Y-Z positioning stage 235 so that visible light 221 is directed upwards towards the spectral monitoring device 220.
  • a UV turning mirror 326 (such as one that is at least about 98% transmissive to light at about 355 nanometers and at least about 95% reflective to visible light from about 400 to about 700 nanometers) is positioned at a 45° angle.
  • an incoming laser beam 101 is first shaped and expanded using beam shaping and expanding optics 323. It is then passed through the mirror 326 to the scan head 340 and then to the X- axis mirror 341. The laser beam reflects off the X-axis mirror 341 to the Y-axis mirror 342.
  • the movement-controlled laser beam 102 is then directed through a scan lens 343 (such as a Telecentric F-theta scan lens) and is focused towards the MTFCS 10.
  • a scan lens 343 such as a Telecentric F-theta scan lens
  • a small percentage 103 of UV light from the beam 102 that reflects off the turning mirror 326 enters into the camera 225 to monitor the laser beam profile and energy at the controller 210.
  • a pulse is emitted out of the laser 100 in a very small diameter beam 101.
  • the laser beam 101 passes through the optics 323 and is transformed, such as into a beam with a 15mm diameter top hat beam profile. It then passes through the mirror 326, scan head 340, and scan lens 343 and is focused, such as down to 4 microns.
  • the MTFCS 10 is placed on top of the visible light table 230 with the coated side up.
  • the MTFCS 10 can be a precut small single piece or a large substrate on which multiple images may be micro-machined.
  • a laser pulse When a laser pulse is released, it imparts an extremely high concentration of UV photons in a spot, breaking the chemical bonds and releasing the material from its neighboring bond structures.
  • the pulses from the UV laser 100 are extremely short in width and duration allowing "cold" ablation to occur.
  • the controller 210 determines if the color of the transmitted light 221 matches that of the original data file and instructs the process to continue with a prescribed number of pulses to release if the sampled data does not match. When a match is signaled, the X-Y-Z stage 235 is instructed to move to its next position. This process is repeated in rapid succession until the all images are completed.
  • the controller 210 could command the positioning stage 235 to move in one or multiple axes to each position, and the sequence could be programmed for any size substrate.
  • the same scan head-type setup could be accomplished with all or some of the scan head apparatus mounted to an X-Y-Z gantry-type configuration so that the MTFCS 10 is positioned on the light table 230 in a fixed position and the scan head system is translated above the substrate to each micro-machining location .
  • FIGURE 11 illustrates yet another micro-machining system 400.
  • the system 400 may incorporate either the micro- machining system 200 or the micro-machining system 300 (or any other suitable micro-machining system) .
  • the system 400 here is constructed on a vibration isolation table 410 to help reduce or cancel any vibrations that could cause inaccurate machining. Such vibrations might arise from outside disturbances such as passing vehicles or other machinery.
  • the system 400 is enclosed in a class 1 laser enclosure with a climate- and dust-controlled environment to eliminate impurities in the process.
  • the X-Y-Z stage 235 is a high-precision positioning table with feedback and tooling capable of positioning an MTFCS 10.
  • the MTFCS 10 may be a small single substrate, multiple pieces, or a large disc or plate substrate to be micro-machined under the work area with great accuracy and repeatability.
  • the Z-axis is used to accurately adjust the MTFCS 10 precisely at the focus of the laser beam 11.
  • the controller 210 in conjunction with the X-Y- Z stage 235 can also position a large substrate under the flat work area so that a large image can be micro-machined in sections over the entire substrate to create one continuous image .
  • An imaging camera 440 and appropriate lens are used to monitor several additional aspects of the process.
  • the MTFCS 10 can be scanned under the camera 440 and checked for pinholes in its coating using contrast detection techniques. Any defective area may be tagged in the system so that the defective area is not used.
  • the completed images can be positioned under the camera 440 to view the finished gobo and to compare the gobo with a data file from the original artwork. Through edge detection or other techniques, each gobo can be checked prior to it leaving the process for quality control purposes.
  • the camera 440 (or other suitable measurement device) can provide feedback to the motion controller of the X-Y-Z positions.
  • the MTFCS 10 is positioned for cutting the outside shape of each gobo.
  • the substrate is cut by the UV laser using appropriate control settings, such as those described by COHERENT LASERS in an article entitled “Micromachining of Glass Using a Fiber-Based, High Average Power Picosecond Laser” (which is hereby incorporated by reference) .
  • a CO2 or other laser 420 is mounted in the system 400 with appropriate optics 430 so that the focal points of two laser beams 11 and 21 are in the same Z-plane with respect to each other and the positioning table.
  • the two laser beams 11 and 21 (such as UV and C0 2 ) could be spaced a known distance from each other with the vision camera 440 also in a known position.
  • the X-Y-Z stage 235 could position the MTFCS 10 for each function of the process. Once the MTFCS 10 is positioned, the laser 420 is energized to cut the desired shape out of the substrate. When the substrate is completely cut, it can slide down a chute into a package or a holding frame in order to be secured.
  • a diamond scribe (not shown in FIGURE 11) is mounted in the system 400 in the same Z-plane with respect to the positioning table.
  • the diamond scribe could be spaced a known distance from each other with the vision camera 440 also in a known position.
  • the X-Y-Z stage 235 could position the MTFCS 10 for each function of the process. Once the MTFCS 10 is positioned, the diamond scribe is commanded to cut the desired shape out of the substrate. When the substrate is completely cut, it can slide down the chute into a package or the holding frame to be secured .
  • FIGURES 9 through 11 illustrate examples of systems for processing gobo blanks
  • various changes may be made to FIGURES 9 through 11.
  • Example applications include wafer patterning of color filters for camera sensors, manufacturing photographs on glass for scientific/medical/entertainment applications, and creating custom linear and circular bandpass and notch filters for scientific and medical test instruments used in all areas of life (such as solar, security, and anti- counterfeit applications).
  • These systems could also be integrated into robotic or on-line production environments for high volume, hands-free manufacturing.
  • various components in these figures could be replaced by other components that perform the same or similar function(s).
  • various functions described above are implemented or supported by a computer program that is formed from computer readable program code and that is embodied in a computer readable medium.
  • computer readable program code includes any type of computer code, including source code, object code, and executable code.
  • computer readable medium includes any type of medium capable of being accessed by a computer, such as read only memory (ROM) , random access memory (RAM) , a hard disk drive, a compact disc (CD) , a digital video disc (DVD) , or any other type of memory.
  • Couple and its derivatives refer to any direct or indirect communication between two or more elements, whether or not those elements are in physical contact with one another.
  • the term “or” is inclusive, meaning and/or.
  • controller means any device, system, or part thereof that controls at least one operation.
  • a controller may be implemented in hardware, firmware, software, or some combination of at least two of the same.
  • the functionality associated with any particular controller may be centralized or distributed, whether locally or remotely.

Abstract

L'invention concerne un système comprenant une source de lumière (100), un système de positionnement (235) et une unité de commande (210). Le système de positionnement est conçu pour positionner un faisceau (11) provenant de la source de lumière et/ou un flan de décalque (10, 20, 30). Le flan de décalque comprend un substrat essentiellement transparent (12) comportant sur un côté un revêtement avec une pile (13) de couches alternantes faites de matériaux ayant un indice de réfraction élevé et un indice de réfraction faible. Le revêtement est essentiellement réfléchissant pour la lumière visible. L'unité de commande est conçue pour commander le système de positionnement et/ou la source de lumière afin d'éliminer une première partie du revêtement à une première profondeur dans une première zone du revêtement, et afin d'éliminer une seconde partie du revêtement à une seconde profondeur dans une seconde zone du revêtement.
PCT/US2011/066207 2010-12-30 2011-12-20 Appareil, système et procédé de micro-usinage haute résolution de films fins pour la projection de motifs de lumière WO2012092028A1 (fr)

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US61/460,353 2010-12-30

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Publication number Priority date Publication date Assignee Title
IT201800006602A1 (it) * 2018-06-22 2019-12-22 Sistema di proiezione di immagini comprendente una sorgente luminosa a LED e un gobo in vetro con superfice nano o micro strutturata
CN110612001A (zh) * 2018-06-14 2019-12-24 因特瓦克公司 多色介电涂层及uv喷墨打印
EP3588187A1 (fr) 2018-06-22 2020-01-01 Sunland Optics Srl Système de projection d'image
IT201900009681A1 (it) 2019-06-20 2020-12-20 Tlpicoglass Srl Sistema di proiezione di immagini

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US5959768A (en) * 1993-11-05 1999-09-28 Vari-Lite, Inc. Light pattern generator formed on a transparent substrate
US20040166362A1 (en) * 2003-02-20 2004-08-26 Makoto Utsumi Color conversion filter substrate, color conversion type multicolor organic EL display having the color conversion filter substrate, and methods of manufacturing these
US20050153219A1 (en) * 2004-01-12 2005-07-14 Ocean Optics, Inc. Patterned coated dichroic filter
US20090104413A1 (en) * 2007-10-18 2009-04-23 Samsung Corning Precision Glass Co., Ltd. Filter For Display Device And Method For Fabricating The Same

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Publication number Priority date Publication date Assignee Title
US5959768A (en) * 1993-11-05 1999-09-28 Vari-Lite, Inc. Light pattern generator formed on a transparent substrate
US20040166362A1 (en) * 2003-02-20 2004-08-26 Makoto Utsumi Color conversion filter substrate, color conversion type multicolor organic EL display having the color conversion filter substrate, and methods of manufacturing these
US20050153219A1 (en) * 2004-01-12 2005-07-14 Ocean Optics, Inc. Patterned coated dichroic filter
US20090104413A1 (en) * 2007-10-18 2009-04-23 Samsung Corning Precision Glass Co., Ltd. Filter For Display Device And Method For Fabricating The Same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110612001A (zh) * 2018-06-14 2019-12-24 因特瓦克公司 多色介电涂层及uv喷墨打印
CN110612001B (zh) * 2018-06-14 2023-06-30 因特瓦克公司 多色介电涂层及uv喷墨打印
IT201800006602A1 (it) * 2018-06-22 2019-12-22 Sistema di proiezione di immagini comprendente una sorgente luminosa a LED e un gobo in vetro con superfice nano o micro strutturata
EP3588187A1 (fr) 2018-06-22 2020-01-01 Sunland Optics Srl Système de projection d'image
IT201900009681A1 (it) 2019-06-20 2020-12-20 Tlpicoglass Srl Sistema di proiezione di immagini

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