WO2012086959A3 - Photo-curable resin composition for printing process - Google Patents
Photo-curable resin composition for printing process Download PDFInfo
- Publication number
- WO2012086959A3 WO2012086959A3 PCT/KR2011/009635 KR2011009635W WO2012086959A3 WO 2012086959 A3 WO2012086959 A3 WO 2012086959A3 KR 2011009635 W KR2011009635 W KR 2011009635W WO 2012086959 A3 WO2012086959 A3 WO 2012086959A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photo
- resin composition
- curable resin
- printing process
- high temperature
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Mathematical Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Abstract
The present invention relates to a photo-curable resin composition for a printing process and more specifically to a photo-curable resin composition comprising a polysilazane compound. The composition according to the invention comprises the polysilazane compound, thereby ensuring an excellent adhesive force to a substrate, heat resistance, durability (against high temperature, high pressure, and high humidity) and lower layer protection property while maintaining high permeability even after high temperature treatment. Therefore, the photo-curable resin composition can be useful in the formation of a fine pattern and a protective layer.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0130666 | 2010-12-20 | ||
KR20100130666 | 2010-12-20 | ||
KR10-2011-0131502 | 2011-12-09 | ||
KR1020110131502A KR101917156B1 (en) | 2010-12-20 | 2011-12-09 | Photocurable resin composition for printing process |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012086959A2 WO2012086959A2 (en) | 2012-06-28 |
WO2012086959A3 true WO2012086959A3 (en) | 2012-10-18 |
Family
ID=46314582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/009635 WO2012086959A2 (en) | 2010-12-20 | 2011-12-14 | Photo-curable resin composition for printing process |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2012086959A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110023841B (en) * | 2016-11-25 | 2023-05-30 | 默克专利有限公司 | Lithographic composition, method of forming resist pattern, and method of manufacturing semiconductor device |
CN110092873A (en) * | 2019-05-16 | 2019-08-06 | 广东工业大学 | A kind of photosensitive resin ceramics and its Stereo Lithography preparation method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005092099A (en) * | 2003-09-19 | 2005-04-07 | Fuji Photo Film Co Ltd | Curable resin composition and optical article, and image display device using the same |
KR20070089721A (en) * | 2004-12-29 | 2007-08-31 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Single- and multi-photon polymerizable pre-ceramic polymeric compositions |
KR20080034983A (en) * | 2005-09-09 | 2008-04-22 | 도오꾜오까고오교 가부시끼가이샤 | Film forming composition for nanoimprinting and method for pattern formation |
KR20100063664A (en) * | 2008-12-03 | 2010-06-11 | 후지필름 가부시키가이샤 | Curable composition for photoimprint, and method for producing cured product using the same |
-
2011
- 2011-12-14 WO PCT/KR2011/009635 patent/WO2012086959A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005092099A (en) * | 2003-09-19 | 2005-04-07 | Fuji Photo Film Co Ltd | Curable resin composition and optical article, and image display device using the same |
KR20070089721A (en) * | 2004-12-29 | 2007-08-31 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Single- and multi-photon polymerizable pre-ceramic polymeric compositions |
KR20080034983A (en) * | 2005-09-09 | 2008-04-22 | 도오꾜오까고오교 가부시끼가이샤 | Film forming composition for nanoimprinting and method for pattern formation |
KR20100063664A (en) * | 2008-12-03 | 2010-06-11 | 후지필름 가부시키가이샤 | Curable composition for photoimprint, and method for producing cured product using the same |
Also Published As
Publication number | Publication date |
---|---|
WO2012086959A2 (en) | 2012-06-28 |
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