WO2009115643A3 - Novel materials and methods - Google Patents

Novel materials and methods Download PDF

Info

Publication number
WO2009115643A3
WO2009115643A3 PCT/FI2009/050207 FI2009050207W WO2009115643A3 WO 2009115643 A3 WO2009115643 A3 WO 2009115643A3 FI 2009050207 W FI2009050207 W FI 2009050207W WO 2009115643 A3 WO2009115643 A3 WO 2009115643A3
Authority
WO
WIPO (PCT)
Prior art keywords
nanoparticles
substrate
methods
layer
order
Prior art date
Application number
PCT/FI2009/050207
Other languages
French (fr)
Other versions
WO2009115643A2 (en
Inventor
Jun Shan
Petri Pulkkinen
Juha Merta
Ari KÄNSÄKOSKI
Heikki Tenhu
Original Assignee
Oy Keskuslaboratorio - Centrallaboratorium Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oy Keskuslaboratorio - Centrallaboratorium Ab filed Critical Oy Keskuslaboratorio - Centrallaboratorium Ab
Publication of WO2009115643A2 publication Critical patent/WO2009115643A2/en
Publication of WO2009115643A3 publication Critical patent/WO2009115643A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)

Abstract

The invention relates to nanoparticles having a metallic core and a protective wrapping attached to the core, said protective wrapping being derived from aliphatic amines. Using said nanoparticles conductive layers or patterns can be produced on the surface of a substrate by providing onto the substrate a layer of the nanoparticles and by subjecting the layer of nanoparticles to heat and pressure in order to remove protective wrappings of the nanoparticles and to fuse the cores of the nanoparticles in order to form a conductive pattern. The nanoparticles posses advantageous properties with respect to processability and usability.
PCT/FI2009/050207 2008-03-18 2009-03-18 Novel materials and methods WO2009115643A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20085229A FI20085229L (en) 2008-03-18 2008-03-18 New materials and procedures
FI20085229 2008-03-18

Publications (2)

Publication Number Publication Date
WO2009115643A2 WO2009115643A2 (en) 2009-09-24
WO2009115643A3 true WO2009115643A3 (en) 2009-11-26

Family

ID=39269524

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2009/050207 WO2009115643A2 (en) 2008-03-18 2009-03-18 Novel materials and methods

Country Status (2)

Country Link
FI (1) FI20085229L (en)
WO (1) WO2009115643A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2687365B1 (en) 2007-12-27 2019-02-20 Lockheed Martin Corporation Method for fabricating refractory metal carbides
WO2009111488A2 (en) 2008-03-04 2009-09-11 Lockheed Martin Corporation Tin nanoparticles and methodology for making same
US8900704B1 (en) 2008-08-05 2014-12-02 Lockheed Martin Corporation Nanostructured metal-diamond composite thermal interface material (TIM) with improved thermal conductivity
US8486305B2 (en) 2009-11-30 2013-07-16 Lockheed Martin Corporation Nanoparticle composition and methods of making the same
US8105414B2 (en) 2008-09-15 2012-01-31 Lockheed Martin Corporation Lead solder-free electronics
US9095898B2 (en) 2008-09-15 2015-08-04 Lockheed Martin Corporation Stabilized metal nanoparticles and methods for production thereof
US9072185B2 (en) * 2009-07-30 2015-06-30 Lockheed Martin Corporation Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas
US9011570B2 (en) 2009-07-30 2015-04-21 Lockheed Martin Corporation Articles containing copper nanoparticles and methods for production and use thereof
US10544483B2 (en) 2010-03-04 2020-01-28 Lockheed Martin Corporation Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same
WO2011109660A2 (en) 2010-03-04 2011-09-09 Lockheed Martin Corporation Compositions containing tin nanoparticles and methods for use thereof
US8911823B2 (en) 2010-05-03 2014-12-16 Pen Inc. Mechanical sintering of nanoparticle inks and powders
WO2013120110A1 (en) 2012-02-10 2013-08-15 Lockheed Martin Corporation Nanoparticle paste formulations and methods for production and use thereof
US20130206225A1 (en) 2012-02-10 2013-08-15 Lockheed Martin Corporation Photovoltaic cells having electrical contacts formed from metal nanoparticles and methods for production thereof
KR102109427B1 (en) * 2012-10-31 2020-05-28 주식회사 동진쎄미켐 Copper paste composition for printed electronics
KR101842763B1 (en) * 2016-03-11 2018-05-14 경희대학교 산학협력단 preparation method of copper nano-structures

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356630A (en) * 2001-05-30 2002-12-13 Dowa Mining Co Ltd Copper powder for low-temperature baking or conductive paste
JP2004273205A (en) * 2003-03-06 2004-09-30 Harima Chem Inc Conductive nanoparticle paste
JP2005240088A (en) * 2004-02-26 2005-09-08 Sumitomo Metal Mining Co Ltd Copper fine-particle, method for producing same, and dispersion liquid of copper fine-particle
EP1666408A1 (en) * 2003-09-09 2006-06-07 Ulvac, Inc. Metal nanoparticle and method for producing same, liquid dispersion of metal nanoparticle and method for producing same, metal thin line, metal film and method for producing same
EP1683592A1 (en) * 2003-10-20 2006-07-26 Harima Chemicals, Inc. Fine metal particles and fine metal oxide particles in dry powder form, and use thereof
US20080138643A1 (en) * 2006-10-10 2008-06-12 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing copper nanoparticles and copper nanoparticles manufactured using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356630A (en) * 2001-05-30 2002-12-13 Dowa Mining Co Ltd Copper powder for low-temperature baking or conductive paste
JP2004273205A (en) * 2003-03-06 2004-09-30 Harima Chem Inc Conductive nanoparticle paste
EP1666408A1 (en) * 2003-09-09 2006-06-07 Ulvac, Inc. Metal nanoparticle and method for producing same, liquid dispersion of metal nanoparticle and method for producing same, metal thin line, metal film and method for producing same
EP1683592A1 (en) * 2003-10-20 2006-07-26 Harima Chemicals, Inc. Fine metal particles and fine metal oxide particles in dry powder form, and use thereof
JP2005240088A (en) * 2004-02-26 2005-09-08 Sumitomo Metal Mining Co Ltd Copper fine-particle, method for producing same, and dispersion liquid of copper fine-particle
US20080138643A1 (en) * 2006-10-10 2008-06-12 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing copper nanoparticles and copper nanoparticles manufactured using the same

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
A. KUMAR ET AL: "Phase transfer o silver nanoparticles from aqueous to organic solutions using fatty amine molecules", JOURNAL OF COLLOID AND INTERFACE SCIENCE, vol. 264, 2003, Elsevier, pages 396 - 401, XP002530296 *
D.V. LEFF, L. BRANDT AND J.R. HEATH: "Synthesis and Characterization of Hydrophobic, Organically-Soluble Gold Nanocrystals Functionalized with Primary Amines", LANGMUIR, vol. 12, 1996, pages 4723 - 4730, XP002530295 *
M. SASTRY ET AL: "Phase transfer of collodial gold particles into organic solutions containing fatty amine molecules", COLLOIDS AND SURFACES A, vol. 181, 2001, Elsevier, pages 255 - 259, XP002530297 *
NIRMALA GRACE ET AL: "Organically dispersible gold and platinum nanoparticles using aromatic amines as phase transfer and reducing agent and their applications in electro-oxidation of glucose", COLLOIDS AND SURFACES. A, PHYSICACHEMICAL AND ENGINEERING ASPECTS, ELSEVIER, AMSTERDAM, NL, vol. 302, no. 1-3, 11 May 2007 (2007-05-11), pages 113 - 120, XP022070876, ISSN: 0927-7757 *
RANE S B ET AL: "Influence of surfactants treatment on silver powder and its thick films", MATERIALS LETTERS, NORTH HOLLAND PUBLISHING COMPANY. AMSTERDAM, NL, vol. 57, no. 20, 1 June 2003 (2003-06-01), pages 3096 - 3100, XP004427708, ISSN: 0167-577X *

Also Published As

Publication number Publication date
WO2009115643A2 (en) 2009-09-24
FI20085229L (en) 2009-09-19
FI20085229A0 (en) 2008-03-18

Similar Documents

Publication Publication Date Title
WO2009115643A3 (en) Novel materials and methods
WO2010049771A3 (en) Composite material, method for producing a composite material and adhesive or binding material
EP2143551A4 (en) Process for formation of resin surface, process for production of articles having recesses different in size on the surface, such articles, process for production of gloves, and gloves
WO2011103304A3 (en) Nano-coatings for articles
WO2010091397A3 (en) Protective carbon coatings
WO2013032626A3 (en) Methods of forming wear resistant layers on metallic surfaces
WO2009130229A3 (en) An article and a method of making an article
EP2319643A4 (en) Metallic copper dispersion, process for producing the metallic copper dispersion, electrode, wiring pattern, and coating film formed using the metallic copper dispersion, decorative article and antimicrobial article with the coating film formed thereon, and processes for producing the decorative article and the antimicrobial article
WO2009120548A3 (en) Multilayer articles and methods of making and using the same
WO2011152959A3 (en) Methods of forming patterns on substrates
PL1993829T3 (en) Substrate comprising a stack of thin layers, the stack having thermal properties
TW200639204A (en) Polarizing layer with adherent protective layer
WO2011025149A3 (en) Method for manufacturing a semiconductor substrate and method for manufacturing a light-emitting device
WO2013019021A3 (en) Graphene laminate including dopant and manufacturing method thereof
EP2374612A4 (en) Surface metal film material, process for producing surface metal film material, process for producing metal pattern material, and metal pattern material
WO2012015740A3 (en) Resist fortification for magnetic media patterning
WO2009036966A3 (en) Security elements with tamper evident effect
WO2008149544A1 (en) Form, microprocessed article, and their manufacturing methods
EP1998222A3 (en) Coating compositions
TW201713184A (en) Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
WO2009030802A3 (en) Substrates containing a polymer layer and preparation methods therefor
EP2527047A4 (en) Method for producing resin substrate having hard coat layer, and resin substrate having hard coat layer
MX2011007380A (en) Method for corrosion protection treatment.
WO2011016651A3 (en) Photocurable resin composition for imprint lithography and method for manufacturing an imprint mold using same
WO2011064794A3 (en) An anti-counterfeit printed packaging material

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09721413

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09721413

Country of ref document: EP

Kind code of ref document: A2