FI20085229L - New materials and procedures - Google Patents

New materials and procedures Download PDF

Info

Publication number
FI20085229L
FI20085229L FI20085229A FI20085229A FI20085229L FI 20085229 L FI20085229 L FI 20085229L FI 20085229 A FI20085229 A FI 20085229A FI 20085229 A FI20085229 A FI 20085229A FI 20085229 L FI20085229 L FI 20085229L
Authority
FI
Finland
Prior art keywords
nanoparticles
substrate
procedures
layer
order
Prior art date
Application number
FI20085229A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20085229A0 (en
Inventor
Juha Merta
Ari Kaensaekoski
Petri Pulkkinen
Heikki Tenhu
Jun Shan
Original Assignee
Keskuslaboratorio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keskuslaboratorio filed Critical Keskuslaboratorio
Priority to FI20085229A priority Critical patent/FI20085229L/en
Publication of FI20085229A0 publication Critical patent/FI20085229A0/en
Priority to PCT/FI2009/050207 priority patent/WO2009115643A2/en
Publication of FI20085229L publication Critical patent/FI20085229L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity

Abstract

The invention relates to nanoparticles having a metallic core and a protective wrapping attached to the core, said protective wrapping being derived from aliphatic amines. Using said nanoparticles conductive layers or patterns can be produced on the surface of a substrate by providing onto the substrate a layer of the nanoparticles and by subjecting the layer of nanoparticles to heat and pressure in order to remove protective wrappings of the nanoparticles and to fuse the cores of the nanoparticles in order to form a conductive pattern. The nanoparticles posses advantageous properties with respect to processability and usability.
FI20085229A 2008-03-18 2008-03-18 New materials and procedures FI20085229L (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20085229A FI20085229L (en) 2008-03-18 2008-03-18 New materials and procedures
PCT/FI2009/050207 WO2009115643A2 (en) 2008-03-18 2009-03-18 Novel materials and methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20085229A FI20085229L (en) 2008-03-18 2008-03-18 New materials and procedures

Publications (2)

Publication Number Publication Date
FI20085229A0 FI20085229A0 (en) 2008-03-18
FI20085229L true FI20085229L (en) 2009-09-19

Family

ID=39269524

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20085229A FI20085229L (en) 2008-03-18 2008-03-18 New materials and procedures

Country Status (2)

Country Link
FI (1) FI20085229L (en)
WO (1) WO2009115643A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009085342A1 (en) 2007-12-27 2009-07-09 Lockheed Martin Corporation Nano-structured refractory metals, metal carbides, and coatings and parts fabricated therefrom
WO2009111488A2 (en) 2008-03-04 2009-09-11 Lockheed Martin Corporation Tin nanoparticles and methodology for making same
US8900704B1 (en) 2008-08-05 2014-12-02 Lockheed Martin Corporation Nanostructured metal-diamond composite thermal interface material (TIM) with improved thermal conductivity
US9095898B2 (en) 2008-09-15 2015-08-04 Lockheed Martin Corporation Stabilized metal nanoparticles and methods for production thereof
US8486305B2 (en) 2009-11-30 2013-07-16 Lockheed Martin Corporation Nanoparticle composition and methods of making the same
US8105414B2 (en) 2008-09-15 2012-01-31 Lockheed Martin Corporation Lead solder-free electronics
US9072185B2 (en) * 2009-07-30 2015-06-30 Lockheed Martin Corporation Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas
US9011570B2 (en) 2009-07-30 2015-04-21 Lockheed Martin Corporation Articles containing copper nanoparticles and methods for production and use thereof
US10544483B2 (en) 2010-03-04 2020-01-28 Lockheed Martin Corporation Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same
US8834747B2 (en) 2010-03-04 2014-09-16 Lockheed Martin Corporation Compositions containing tin nanoparticles and methods for use thereof
US8911823B2 (en) 2010-05-03 2014-12-16 Pen Inc. Mechanical sintering of nanoparticle inks and powders
EP2812139B1 (en) 2012-02-10 2017-12-27 Lockheed Martin Corporation Nanoparticle paste formulations and methods for production and use thereof
WO2013120109A2 (en) 2012-02-10 2013-08-15 Lockheed Martin Corporation Photovoltaic cells having electrical contacts formed from metal nanoparticles and methods for production thereof
JP6487846B2 (en) * 2012-10-31 2019-03-20 ドンジン セミケム カンパニー リミテッド Copper paste composition for printed electronics
KR101842763B1 (en) * 2016-03-11 2018-05-14 경희대학교 산학협력단 preparation method of copper nano-structures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4834848B2 (en) * 2001-05-30 2011-12-14 Ｄｏｗａエレクトロニクス株式会社 Copper powder for low-temperature firing or copper powder for conductive paste
JP4414145B2 (en) * 2003-03-06 2010-02-10 ハリマ化成株式会社 Conductive nanoparticle paste
JP2005081501A (en) * 2003-09-09 2005-03-31 Ulvac Japan Ltd Metallic nano particle and its manufacturing method, metallic nano particle dispersion fluid and its manufacturing method, and metallic thin line, metallic membrane and their manufacturing method
KR100771393B1 (en) * 2003-10-20 2007-10-30 하리마 카세이 가부시키가이샤 Fine metal particles and fine metal oxide particles in dry powder form, and use thereof
JP4428085B2 (en) * 2004-02-26 2010-03-10 住友金属鉱山株式会社 Method for producing copper fine particles
KR100814295B1 (en) * 2006-10-10 2008-03-18 삼성전기주식회사 Method for manufacturing cupper nanoparticles and cupper nanoparticles manufactured using the same

Also Published As

Publication number Publication date
FI20085229A0 (en) 2008-03-18
WO2009115643A2 (en) 2009-09-24
WO2009115643A3 (en) 2009-11-26

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