WO2012075868A1 - 带u字型高阻抗表面金属条接地的天线及其无线通讯装置 - Google Patents

带u字型高阻抗表面金属条接地的天线及其无线通讯装置 Download PDF

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Publication number
WO2012075868A1
WO2012075868A1 PCT/CN2011/081837 CN2011081837W WO2012075868A1 WO 2012075868 A1 WO2012075868 A1 WO 2012075868A1 CN 2011081837 W CN2011081837 W CN 2011081837W WO 2012075868 A1 WO2012075868 A1 WO 2012075868A1
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WIPO (PCT)
Prior art keywords
impedance surface
antenna
impedance
shaped
metal strip
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PCT/CN2011/081837
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English (en)
French (fr)
Inventor
张莲
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Huizhou TCL Mobile Communication Co Ltd
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Huizhou TCL Mobile Communication Co Ltd
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Priority to ES11847282T priority Critical patent/ES2733736T3/es
Priority to EP11847282.8A priority patent/EP2650968B1/en
Priority to US13/810,795 priority patent/US9147941B2/en
Publication of WO2012075868A1 publication Critical patent/WO2012075868A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/008—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/245—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with means for shaping the antenna pattern, e.g. in order to protect user against rf exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H01Q15/008—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices having Sievenpipers' mushroom elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element

Definitions

  • the present invention relates to the field of antennas for wireless communication devices, and more particularly to improvements in an antenna having a U-shaped high impedance surface metal strip grounded and a wireless communication device therefor.
  • the radio waves emitted by the wireless communication device during the communication process expose the user to the measurable radio frequency electromagnetic radiation; if the mobile terminal such as a mobile phone itself is in a call, the head is often placed in the electromagnetic radiation field emitted by the mobile phone.
  • specific absorption rate SAR, Specific
  • Absorption Rate is an important evaluation parameter, which means the electromagnetic wave absorption ratio, which is the electromagnetic wave energy absorption ratio of mobile phones or wireless communication products; in layman's terms, it is to measure whether the influence of mobile phone radiation on the human body, especially the head, meets the standard.
  • This is also a unit for measuring the amount of radio frequency energy absorbed by the human body when using the mobile terminal, and is used as a standard for protecting the human body.
  • mobile terminals have been designed to be used within these extremely strict limits, and thus various devices and methods for reducing SAR are being developed; for example, adding electromagnetic wave absorbing materials to mobile terminals, or passing metal parts
  • the layout optimizes the RF induced current, and the complex antenna design is used to reduce the specific absorption rate, etc.
  • these design methods are often greatly influenced by the type of mobile terminal, and are not versatile and universally applicable.
  • the object of the present invention is to provide an antenna with a U-shaped high-impedance surface metal strip grounding and a wireless communication device thereof, which can reduce the radiation generated by the antenna to the human body without affecting the communication quality, and has universal applicability. .
  • an antenna with a U-shaped high-impedance surface metal strip grounding comprising an antenna radiating unit and a grounding plate thereof, wherein: a plurality of high-impedance surface units are arranged at intervals on the grounding plate; each high The impedance surface units are each formed by three high-impedance surface metal strips connected to form a U-shape; high-impedance surface vias are provided on the U-shaped bottom side; and high-impedance surface units are connected to each other via high-impedance surface vias.
  • the antenna with a U-shaped high-impedance surface metal strip grounded wherein: the ground plate is a printed circuit board; the high-impedance surface unit is located on the surface of the printed circuit board; and the high-impedance surface via is disposed through the printed circuit board.
  • the antenna with a U-shaped high-impedance surface metal strip grounded wherein: the high-impedance surface metal strip has a line width of 1 mm; the U-shaped high-impedance surface unit has a width of 6 mm; and the U-shaped high-impedance surface unit has a height 8 mm; the spacing between high impedance surface units is 0.5 mm.
  • the antenna with a U-shaped high-impedance surface metal strip grounded, wherein: the U-shaped high-impedance surface unit is arranged in a row on the ground plate.
  • the antenna with a U-shaped high-impedance surface metal strip grounded, wherein: the high-impedance surface metal strip of the U-shaped bottom side is disposed in parallel with the line formed by the high-impedance surface unit.
  • the antenna with a U-shaped high-impedance surface metal strip grounded, wherein: the U-shaped high-impedance surface unit is arranged in columns on the ground plate.
  • the antenna with a U-shaped high-impedance surface metal strip grounded, wherein: the high-impedance surface metal strip on both sides of the U-shape is disposed in parallel with the column formed by the high-impedance surface unit.
  • the antenna with a U-shaped high-impedance surface metal strip grounded, wherein: the corresponding high-impedance metal strips between the U-shaped high-impedance surface units are arranged in parallel.
  • the antenna with a U-shaped high-impedance surface metal strip grounded, wherein: the antenna radiating unit is a planar inverted F-type antenna.
  • a wireless communication device includes an outer casing and an antenna for communication; the antenna is disposed inside the outer casing, and includes an antenna radiating unit and a grounding plate thereof; wherein: a plurality of high-impedance surface units are arranged at intervals on the grounding plate; each high-impedance surface The units are connected by three high-impedance surface metal strips to form a U-shape; high-impedance surface vias are provided on the U-shaped bottom side; high-impedance surface units are connected to each other via high-impedance surface vias.
  • the invention provides a U-shaped high-impedance surface metal strip grounded antenna and a wireless communication device thereof, which are connected by a plurality of high-impedance surface vias and are connected by three high-resistance surface metal strips.
  • the high-impedance surface unit of the word type suppresses or prevents the surface wave from propagating along the surface thereof on the one hand, and reflects the plane wave incident on the surface perpendicularly on the other hand in the same phase; the surface of the surface wave is suppressed by the high-impedance surface, and is placed around the antenna.
  • the radiation to the direction of the human head is reduced, that is, the radiation of the antenna of the wireless communication device is reduced to the direction of the human body during operation, the radiant energy absorbed by the head is reduced, and the specific absorption rate is reduced; and the energy of the plane wave is not weakened, and the pair is avoided.
  • the signal strength has an effect, does not reduce the antenna radiation performance, does not affect the communication quality, and has versatility and universal applicability.
  • FIG. 1 is a perspective view of a U-shaped high-impedance surface metal strip grounding antenna structure of the present invention.
  • FIG. 2 is a schematic view of a U-shaped high-impedance surface unit disposed on a ground plate in the present invention.
  • FIG. 3 is a side elevational view of the U-shaped high impedance surface metal strip grounding antenna structure of the present invention.
  • FIG. 4 is a schematic view showing the operation principle of a U-shaped high-impedance surface unit provided on a ground plate in the present invention.
  • Fig. 5 is a schematic diagram showing an equivalent circuit of a U-shaped high-impedance surface unit provided on a ground plate in the present invention.
  • FIG. 6 is a comparison diagram of return loss test curves of an antenna with or without a U-shaped high-impedance surface unit in the wireless communication device of the present invention.
  • FIG. 7 is a comparison diagram of a specific absorption rate test curve of an antenna with or without a U-shaped high-impedance surface unit in the wireless communication device of the present invention.
  • An antenna with a U-shaped high-impedance surface metal strip grounded one of the specific embodiments, as shown in FIG. 1 , includes an antenna radiating unit 120 and a grounding plate 110 thereof; wherein, the grounding plate 110 is spaced apart A plurality of high-impedance surface units are provided; each high-impedance surface unit is connected by three high-impedance surface metal strips 130 to form a U-shape; a high-impedance surface is provided on the high-impedance surface metal strip 130 of the U-shaped bottom side Vias 160; high impedance surface metal strips 130 between high impedance surface elements are interconnected by high impedance surface vias 160 thereon.
  • the present invention also provides a wireless communication device based on the above-mentioned antenna with a U-shaped high-impedance surface metal strip 130 grounded.
  • One embodiment of the present invention includes an outer casing and an antenna for communication; the antenna is disposed inside the outer casing, including the antenna.
  • the high-impedance surface of the present invention refers to a surface structure constructed on the grounding plate 110 of the antenna to prevent electromagnetic wave propagation, that is, a high-impedance characteristic of a surface wave of a certain frequency band; specifically, one is The surface wave whose frequency is located within its stop band has an inhibitory effect, or does not support the propagation of a surface wave whose frequency band is within its stop band; the second is that the frequency perpendicular to its surface is within its stop band
  • the plane wave has the effect of in-phase reflection, that is, the phase of the reflected wave and the incident wave does not change.
  • the ground plane 110 referred to herein specifically refers to the entire printed circuit board, and the high impedance surface replaces the portion of the ground plane 110 located below the antenna.
  • the metal surface For a plane wave incident perpendicular to the metal surface, the metal surface causes a phase change of the phase of the plane wave by 180°. If the ground plate 110 of the antenna is a complete metal, the surface wave propagating on the surface thereof, regardless of whether the frequency is at its stop band or not The impedance of the surface wave is zero; compared with the antenna of the prior art which is grounded with a complete metal plate and the wireless communication device thereof, the antenna with the high impedance surface unit grounded and the wireless device thereof are provided.
  • the communication device suppresses or prevents surface waves from propagating along the surface thereof by using a plurality of U-shaped high-impedance surface units connected via high-impedance surface vias 160 and connected by three high-resistance surface metal strips 130.
  • the same phase reflects the plane wave incident on the surface of the vertical surface; the high-impedance surface is used to suppress the surface wave characteristics, and is placed around the antenna to reduce the radiation in the direction of the human head, that is, the antenna of the wireless communication device is reduced during operation.
  • the radiation in the direction of the human body reduces the radiant energy absorbed by the head and reduces the specific absorption rate; at the same time, it does not weaken the energy of the plane wave. , To avoid the influence on the signal strength without reducing the antenna radiation performance, it does not affect the communication quality, versatility and universal applicability.
  • the antenna radiating unit 120 is a planar inverted F-type antenna. As shown in FIG. 1, the antenna radiating unit 120 has two open-ended branches, and the working principle is quarter-wave resonance; the outer side has a relatively short length. It is a high-frequency branch, and the narrower inner length is a low-frequency branch.
  • the grounding leg 140 of the antenna radiating unit 120 and the feeding leg 150 of the antenna radiating unit 120 are connected to the radio frequency transceiver circuit of the printed circuit board.
  • the grounding plate 110 is a printed circuit board; the high-impedance surface unit is located on the surface of the printed circuit board.
  • High-impedance surface vias 160 are placed through the printed circuit board; U-shaped high-impedance surface metal strips 130 are formed using a copper-clad layer on the surface of the printed circuit board, and high-impedance surface vias are formed using vias on the printed circuit board 160.
  • the high-impedance surface via 160 is disposed through the printed circuit board, and the U-shaped high-impedance surface metal strip 130 passes through the high-impedance surface via 160 of its bottom side, with the printed circuit board.
  • the lower surface metal layer forms an electrical connection to achieve grounding of the high impedance surface unit.
  • the U-shaped high-resistance surface metal strip 130 is disposed on the upper surface of the printed circuit board, and the lower surface of the printed circuit board is composed of a complete metal layer.
  • the U-shaped high-impedance surface metal strip 130 is laid as flat as possible on the upper surface of the metal circuit board, particularly the lower area covered by the antenna radiating unit 120, to replace the original monolithic metal layer as a new connection of the antenna radiating unit 120.
  • the ground that is, the transition from a zero ohm ground plane to a ground plane with infinite impedance.
  • the line width B of the high-resistance surface metal strip 130 is 1 mm; the width W of the U-shaped high-impedance surface unit is 6 mm; and the height H of the U-shaped high-impedance surface unit is 8 mm; high impedance
  • the interval ⁇ between the surface units is 0.5 mm.
  • U-shaped high-impedance surface units are arranged in line on the ground plate 110; wherein the U-shaped bottom side high-resistance surface metal strip 130 is disposed in parallel with the line formed by the high-impedance surface unit.
  • U-shaped high-impedance surface units are arranged in a row on the ground plate 110; wherein the high-impedance surface metal strips 130 on both sides of the U-shape are disposed in parallel with the columns formed by the high-impedance surface unit.
  • the corresponding high-impedance metal strips between the U-shaped high-impedance surface units are arranged in parallel.
  • the high-impedance surface metal strip 130 on both sides and/or the bottom of the U-shaped high-impedance surface unit may also be disposed obliquely with the rows or columns formed by the high-impedance surface unit.
  • the length and width of the U-shaped metal strip and the gap between the U-shaped metal strips can be adjusted during design. To optimize the operating band of the high impedance surface unit so that it is within the transmit channel range of the communication system.
  • the equivalent circuit parameters are represented by a parallel resonant LC circuit, as shown in Figure 5, which acts as a two-dimensional electrical filter to prevent current from flowing along its surface.
  • the surface impedance is inductive below the resonant frequency, and the surface impedance is capacitive above the resonant frequency. Near the resonant frequency, the surface impedance is a large value, equivalent to infinity.
  • the broken line A is a return loss test curve of the planar inverted-F antenna in the case where the high-impedance surface unit is grounded
  • the solid line B is the echo of the planar inverted-F antenna in the case where the high-impedance surface unit is grounded.
  • the loss test curve; from the curve A, the U-shaped high-impedance surface metal strip 130 and the high-impedance surface via 160 have little effect on the return loss, thereby ensuring that the radiation performance is substantially unaffected.
  • the broken line A is a specific absorption rate test curve of the planar inverted F antenna in the case where the high impedance surface unit is grounded
  • the solid line B is the specific absorption of the planar inverted F type antenna in the case where the high impedance surface unit is grounded.
  • the antenna radiating unit 120 includes not limited to a planar inverted-F antenna, but also a multi-band antenna, etc., and all of these are added, subtracted, replaced, transformed or improved.
  • the technical solutions are all within the scope of the appended claims.

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Abstract

本发明公开了带U字型高阻抗表面金属条接地的天线及其无线通讯装置，天线设置在外壳内部，包括天线辐射单元及其接地板；在接地板上间隔设置有多个高阻抗表面单元；每个高阻抗表面单元均由三段高阻抗表面金属条连接组成U字型；在U字型底边上设置有高阻抗表面过孔，用于连接高阻抗表面单元之间的高阻抗表面金属条。由于采用了多个U字型高阻抗表面单元，一方面抑制或阻止了表面波沿其表面传播，另一方面同相位反射了垂直其表面入射的平面波；利用了高阻抗表面抑制表面波的特性，放置于天线周围，降低了对人头方向的辐射，减少了头部吸收的辐射能量，降低了比吸收率；同时不会降低天线辐射性能，不会对通讯质量产生影响，具有通用性和普遍适用性。

Description

带U字型高阻抗表面金属条接地的天线及其无线通讯装置
技术领域
本发明涉及无线通信装置的天线领域，更具体的说，改进涉及的是一种带U字型高阻抗表面金属条接地的天线及其无线通讯装置。
背景技术
无线通讯装置在通讯过程中所发射的无线电波，使用户暴露在可计量的射频电磁辐射中；如使用手机等移动终端本身在通话时，往往会使头部处于手机所发射的电磁辐射场内；为此，包括中国在内的各国政府均制定了全面而安全的准则和规范来管理和约束射频能源的暴露问题；其中，比吸收率(SAR，Specific Absorption Rate)就是很重要的一个评估参数，意为电磁波吸收比值，是手机或无线通讯产品的电磁波能量吸收比值；通俗地讲，就是测量手机辐射对人体尤其是头部的影响是否符合标准。这也是测量人体在使用移动终端时所吸收的射频能量的数量的单位，用作对人体保护的标准。
目前，移动终端已经被设计为能够在这些极为严格的限度内使用，因此各种用于减小SAR的装置和方法正被研发；例如，在移动终端上附加吸收电磁波的材料，或者通过金属件的布置优化射频感应电流，以及复杂的天线设计被用来降低比吸收率等等，但是，这些设计方法往往受到移动终端类型的影响很大，不具有通用性和普遍实用性。
因此，现有技术尚有待改进和发展。
发明内容
本发明的目的在于，提供一种带U字型高阻抗表面金属条接地的天线及其无线通讯装置，既可降低天线对人体产生的辐射又不会对通讯质量产生影响，还具有普遍适用性。
本发明的技术方案如下：一种带U字型高阻抗表面金属条接地的天线，包括天线辐射单元及其接地板，其中：在接地板上间隔设置有多个高阻抗表面单元；每个高阻抗表面单元均由三段高阻抗表面金属条连接组成U字型；在U字型底边上设置有高阻抗表面过孔；高阻抗表面单元之间经由高阻抗表面过孔相互连接。
所述的带U字型高阻抗表面金属条接地的天线，其中：接地板为印刷电路板；高阻抗表面单元位于印刷电路板表面；高阻抗表面过孔穿过印刷电路板设置。
所述的带U字型高阻抗表面金属条接地的天线，其中：高阻抗表面金属条的线宽为1mm；U字型高阻抗表面单元的宽度为6mm；U字型高阻抗表面单元的高度为8mm；高阻抗表面单元之间的间隔为0.5mm。
所述的带U字型高阻抗表面金属条接地的天线，其中：U字型高阻抗表面单元在接地板上成行设置。
所述的带U字型高阻抗表面金属条接地的天线，其中：U字型底边的高阻抗表面金属条与高阻抗表面单元形成的行相平行设置。
所述的带U字型高阻抗表面金属条接地的天线，其中：U字型高阻抗表面单元在接地板上成列设置。
所述的带U字型高阻抗表面金属条接地的天线，其中：U字型两侧边的高阻抗表面金属条与高阻抗表面单元形成的列相平行设置。
所述的带U字型高阻抗表面金属条接地的天线，其中：U字型高阻抗表面单元之间相对应的高阻抗金属条平行设置。
所述的带U字型高阻抗表面金属条接地的天线，其中：其特征在于：天线辐射单元为平面倒F型天线。
一种无线通讯装置，包括外壳和通讯用的天线；天线设置在外壳内部，包括天线辐射单元及其接地板；其中：在接地板上间隔设置有多个高阻抗表面单元；每个高阻抗表面单元均由三段高阻抗表面金属条连接组成U字型；在U字型底边上设置有高阻抗表面过孔；高阻抗表面单元之间经由高阻抗表面过孔相互连接。
本发明所提供的一种带U字型高阻抗表面金属条接地的天线及其无线通讯装置，由于采用了多个经由高阻抗表面过孔连接的且由三段高阻抗表面金属条连接组成U字型高阻抗表面单元，一方面抑制或阻止了表面波沿其表面传播，另一方面同相位反射了垂直其表面入射的平面波；利用了高阻抗表面抑制表面波的特性，放置于天线周围，降低了对人头方向的辐射，即降低了无线通讯装置的天线在工作时对人体方向的辐射，减少了头部吸收的辐射能量，降低了比吸收率；同时不会削弱平面波的能量，避免对信号强度产生影响，不会降低天线辐射性能，不会对通讯质量产生影响，具有通用性和普遍适用性。
附图说明
图1是本发明带U字型高阻抗表面金属条接地天线结构的立体示意图。
图2是本发明中设置在接地板上的U字型高阻抗表面单元示意图。
图3是本发明带U字型高阻抗表面金属条接地天线结构的侧视示意图。
图4是本发明中设置在接地板上的U字型高阻抗表面单元的工作原理示意图。
图5是本发明中设置在接地板上的U字型高阻抗表面单元的等效电路示意图。
图6是本发明无线通讯装置中的天线有无U字型高阻抗表面单元的回波损耗测试曲线对比图。
图7是本发明无线通讯装置中的天线有无U字型高阻抗表面单元的比吸收率测试曲线对比图。
具体实施方式
以下将结合附图，对本发明的具体实施方式和实施例加以详细说明，所描述的具体实施例仅用以解释本发明，并非用于限定本发明的具体实施方式。
本发明的一种带U字型高阻抗表面金属条接地的天线，其具体实施方式之一，如图1所示，包括天线辐射单元120及其接地板110；其中，在接地板110上间隔设置有多个高阻抗表面单元；每个高阻抗表面单元均由三段高阻抗表面金属条130连接组成U字型；在U字型底边的高阻抗表面金属条130上设置有高阻抗表面过孔160；高阻抗表面单元之间的高阻抗表面金属条130由其上的高阻抗表面过孔160相互连接。
基于上述带U字型高阻抗表面金属条130接地的天线，本发明还提出了一种无线通讯装置，其具体实施方式之一，包括外壳和通讯用的天线；天线设置在外壳内部，包括天线辐射单元120及其接地板110；其中，在接地板110上间隔设置有多个高阻抗表面单元；每个高阻抗表面单元均由三段高阻抗表面金属条130连接组成U字型；在U字型底边的高阻抗表面金属条130上设置有高阻抗表面过孔160；高阻抗表面单元之间的高阻抗表面金属条130由其上的高阻抗表面过孔160相互连接。
本发明所述的高阻抗表面，指的是在天线的接地板110上构建的可以阻止电磁波传播的表面结构，即对某一频段的表面波具有高阻抗特性；具体来说，一是对其表面传播的频率位于其阻带之内的表面波具有抑制作用，或者说不支持频段位于其阻带之内的表面波的传播；二是对垂直于其表面入射的频率位于其阻带之内的平面波具有同相位反射的效果，即反射波与入射波的相位没有发生变化。本文所说的接地板110具体指的是整个印刷电路板，而高阻抗表面替代的则是位于天线下方的部分接地板110。
而对于垂直于金属表面入射的平面波，金属表面会使该平面波的相位发生180°的相位变化，如果天线的接地板110是完整金属，对其表面传播的表面波，不管频率是否位于其阻带之内，其对表面波的阻抗为零；与现有技术中的以完整的金属板接地的天线及其无线通讯装置相比，本发明所提供的以高阻抗表面单元接地的天线及其无线通讯装置，由于采用了多个经由高阻抗表面过孔160连接的且由三段高阻抗表面金属条130连接组成U字型高阻抗表面单元，一方面抑制或阻止了表面波沿其表面传播，另一方面同相位反射了垂直其表面入射的平面波；利用了高阻抗表面抑制表面波的特性，放置于天线周围，降低了对人头方向的辐射，即降低了无线通讯装置的天线在工作时对人体方向的辐射，减少了头部吸收的辐射能量，降低了比吸收率；同时不会削弱平面波的能量，避免对信号强度产生影响，不会降低天线辐射性能，不会对通讯质量产生影响，具有通用性和普遍适用性。
假设天线辐射单元120是一种平面倒F型天线，如图1所示，天线辐射单元120上有两个终端开路的分支，其工作原理为四分之一波长谐振；外侧较宽长度较短的是高频分支，内侧较窄长度较长的是低频分支。通过天线辐射单元120的接地脚140和天线辐射单元120的馈入脚150与印刷电路板的射频收发电路相连接。
在本发明带U字型高阻抗表面金属条130接地的天线及其无线通讯装置的优选实施方式中，如图2所示，接地板110为印刷电路板；高阻抗表面单元位于印刷电路板表面；高阻抗表面过孔160穿过印刷电路板设置；利用印刷电路板表面上的覆铜层制作U字型高阻抗表面金属条130，以及利用印刷电路板上的通孔制作高阻抗表面过孔160。
较好的是，如图3所示，高阻抗表面过孔160穿过印刷电路板设置，U字型高阻抗表面金属条130通过其底边的高阻抗表面过孔160，与印刷电路板的下表面金属层形成电气连接，以实现高阻抗表面单元的接地。
具体的，U字型的高阻抗表面金属条130设置在印刷电路板的上表面，印刷电路板的下表面由完整的金属层组成。U字型高阻抗表面金属条130尽可能平铺在金属电路板的上表面，特别是天线辐射单元120所覆盖的下方区域，以替代原有的整块金属层作为天线辐射单元120新的接地面，即实现将零欧姆的接地面过渡到阻抗无穷大的接地面。
优选地，如图2所示，高阻抗表面金属条130的线宽B为1mm；U字型高阻抗表面单元的宽度W为6mm；U字型高阻抗表面单元的高度H为8mm；高阻抗表面单元之间的间隔δ为0.5mm。
进一步地，U字型高阻抗表面单元在接地板110上成行设置；其中，U字型底边的高阻抗表面金属条130与高阻抗表面单元形成的行相平行设置。以及，U字型高阻抗表面单元在接地板110上成列设置；其中，U字型两侧边的高阻抗表面金属条130与高阻抗表面单元形成的列相平行设置。优选地，U字型高阻抗表面单元之间相对应的高阻抗金属条平行设置。当然，U字型高阻抗表面单元中位于两侧和/或底部的高阻抗表面金属条130也可与高阻抗表面单元形成的行或列倾斜设置。
由于印刷电路板的介电常数以及厚度将会影响到U字型金属条的结构尺寸大小，所以在设计时可通过调整U字型金属条的长度、宽度以及U字型金属条之间的间隙，来优化高阻抗表面单元的工作频带，以使其位于通信制式的发射信道范围内。
本发明的天线及其无线通讯装置的接地所采用的U字型高阻抗表面金属条130，该结构的电磁特性可以用集总电路元件、电容和电感来描述。其等效电路参数表现为并联谐振的LC电路，如图5所示，其作用可看作一种二维电滤波器以阻止电流沿其表面流动。
如图4所示，当U字型金属条连同接地过孔与电磁波相互作用时，在U字型金属条上将产生感应电流，平行于顶部表面的电压作用，导致在U字型金属条的两端累积出电荷，因此可等效于电容效应。而电荷在金属过孔和印刷电路板的下表面之间来回流动形成电流环路，同电流联系在一起的是磁场和电感，其电容和电感的示意图如图4所示，其等效谐振电路如图5所示。
在低于谐振频率时表面阻抗呈现电感性，而在高于谐振频率时，表面阻抗呈现电容性，在谐振频率附近，表面阻抗是很大的值，等效为无穷大。设计过程中，若使U字型金属片连同过孔的单元结构谐振在通信制式的无线发射信道的频带内，则该结构将在此频带内形成无限大的阻抗，阻止射频表面电流的通过，从而减小该频带内的比吸收率。
如图6所示，虚线A为有高阻抗表面单元接地的情况下平面倒F型天线的回波损耗测试曲线图，实线B为无高阻抗表面单元接地的情况下平面倒F型天线的回波损耗测试曲线图；从曲线A上看，加载U字型高阻抗表面金属条130以及高阻抗表面过孔160对回波损耗的影响并不大，由此保证了辐射性能基本不受影响。
如图7所示，虚线A为有高阻抗表面单元接地的情况下平面倒F型天线的比吸收率测试曲线图，实线B为无高阻抗表面单元接地的情况下平面倒F型天线的比吸收率测试曲线图；从虚线A上看，加载U字型高阻抗表面金属条130以及高阻抗表面过孔160有效地降低比吸收率，较同频点的比吸收率均可下降30%左右。
应当理解的是，以上所述仅为本发明的较佳实施例而已，并不足以限制本发明的技术方案，对本领域普通技术人员来说，在本发明的精神和原则之内，可以根据上述说明加以增减、替换、变换或改进，例如，天线辐射单元120包括单不限于是平面型倒F型天线，也可以是多频段天线等，而所有这些增减、替换、变换或改进后的技术方案，都应属于本发明所附权利要求的保护范围。

Claims (10)

  1. 一种带U字型高阻抗表面金属条接地的天线，包括天线辐射单元及其接地板，其特征在于：在接地板上间隔设置有多个高阻抗表面单元；每个高阻抗表面单元均由三段高阻抗表面金属条连接组成U字型；在U字型底边上设置有高阻抗表面过孔；高阻抗表面单元之间经由高阻抗表面过孔相互连接。
  2. 根据权利要求1所述的带U字型高阻抗表面金属条接地的天线，其特征在于：接地板为印刷电路板；高阻抗表面单元位于印刷电路板表面；高阻抗表面过孔穿过印刷电路板设置。
  3. 根据权利要求1所述的带U字型高阻抗表面金属条接地的天线，其特征在于：高阻抗表面金属条的线宽为1mm；U字型高阻抗表面单元的宽度为6mm；U字型高阻抗表面单元的高度为8mm；高阻抗表面单元之间的间隔为0.5mm。
  4. 根据权利要求1所述的带U字型高阻抗表面金属条接地的天线，其特征在于：U字型高阻抗表面单元在接地板上成行设置。
  5. 根据权利要求4所述的带U字型高阻抗表面金属条接地的天线，其特征在于：U字型底边的高阻抗表面金属条与高阻抗表面单元形成的行相平行设置。
  6. 根据权利要求1所述的带U字型高阻抗表面金属条接地的天线，其特征在于：U字型高阻抗表面单元在接地板上成列设置。
  7. 根据权利要求6所述的带U字型高阻抗表面金属条接地的天线，其特征在于：U字型两侧边的高阻抗表面金属条与高阻抗表面单元形成的列相平行设置。
  8. 根据权利要求1所述的带U字型高阻抗表面金属条接地的天线，其特征在于：U字型高阻抗表面单元之间相对应的高阻抗金属条平行设置。
  9. 根据权利要求1至8中任一所述的带U字型高阻抗表面金属条接地的天线，其特征在于：天线辐射单元为平面倒F型天线。
  10. 一种无线通讯装置，包括外壳和通讯用的天线；天线设置在外壳内部，包括天线辐射单元及其接地板；其特征在于：在接地板上间隔设置有多个高阻抗表面单元；每个高阻抗表面单元均由三段高阻抗表面金属条连接组成U字型；在U字型底边上设置有高阻抗表面过孔；高阻抗表面单元之间经由高阻抗表面过孔相互连接。
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