WO2012073702A1 - Solar cell module and production method for same - Google Patents

Solar cell module and production method for same Download PDF

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Publication number
WO2012073702A1
WO2012073702A1 PCT/JP2011/076453 JP2011076453W WO2012073702A1 WO 2012073702 A1 WO2012073702 A1 WO 2012073702A1 JP 2011076453 W JP2011076453 W JP 2011076453W WO 2012073702 A1 WO2012073702 A1 WO 2012073702A1
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Prior art keywords
solar cell
conductive adhesive
electrode
tab wire
solar
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PCT/JP2011/076453
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French (fr)
Japanese (ja)
Inventor
貴啓 藤井
秀昭 奥宮
幸一 中原
須賀　保博
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ソニーケミカル＆インフォメーションデバイス株式会社
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Publication of WO2012073702A1 publication Critical patent/WO2012073702A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Definitions

  • the present invention relates to a solar cell module that connects a front / back electrode of a solar cell and a tab wire using a conductive adhesive film and a method for manufacturing the solar cell module.
  • a plurality of adjacent solar cells are connected by tab wires made of solder-coated ribbon-like copper foil.
  • One end of the tab wire is connected to the surface electrode of one solar battery cell, and the other end is connected to the back electrode of another adjacent solar battery cell, thereby connecting the solar battery cells in series.
  • connection between the solar battery cell and the tab wire is made up of a bus bar electrode formed by screen printing of silver paste on the light receiving surface of the solar battery cell, an Ag electrode formed on the back surface connection portion of the solar battery cell, and a tab.
  • the wires are connected by soldering.
  • Al electrodes are formed in regions other than the connection portion on the back surface of the solar battery cell.
  • connection process is performed at a high temperature of 200 ° C. or higher in soldering, the solar cell is warped, the internal stress generated in the connection portion between the tab wire and the front electrode and the back electrode, the residue of the flux, etc. There is a concern that the connection reliability between the front and back electrodes of the battery cell and the tab wire is lowered.
  • connection reliability may decrease when the solar cell module is used under severe conditions such as high temperature and high humidity. It was.
  • the present invention has been proposed in view of such conventional circumstances, and provides a solar cell module having high connection reliability and a method for manufacturing the solar cell module.
  • connection reliability can be improved by defining the glass transition point after curing of the conductive adhesive material.
  • the solar cell module according to the present invention is a tab wire between the front electrode of one solar cell and the back electrode of another solar cell adjacent to the one solar cell via a conductive adhesive material.
  • the glass transition point after curing of the conductive adhesive film is 130 to 180 ° C.
  • the manufacturing method of the solar cell module which concerns on this invention connects the surface electrode of one photovoltaic cell, and the back surface electrode of the other photovoltaic cell adjacent to this one photovoltaic cell via a conductive adhesive material.
  • the glass transition point after curing is 130 to 180 ° C. on the surface electrode of the one solar cell and the back electrode of the other solar cell. It has a temporary placement step of sticking a conductive adhesive film and temporarily placing a tab line on the conductive adhesive film, and a pressing step of pressing from the upper surface of the tab wire with a heating press head.
  • the manufacturing method of the solar cell module which concerns on this invention connects the surface electrode of one photovoltaic cell, and the back surface electrode of the other photovoltaic cell adjacent to this one photovoltaic cell via a conductive adhesive material.
  • the glass electrode transition after curing the surface electrode and the tab wire of the one solar cell cell and the back electrode and the tab wire of the other solar cell cell.
  • a temporary placement step in which a conductive adhesive material having a point of 130 to 180 ° C.
  • a sealing material and a protective base material are sequentially laminated on the upper and lower surfaces of the solar cell, and the upper surface of the protective base material And laminating and crimping with a laminating apparatus, curing the sealing material, and laminating and crimping to connect the front electrode and the tab wire and the back electrode and the tab wire.
  • the conductive adhesive material according to the present invention is a conductive adhesive film for electrically connecting the front or back electrode of the solar battery cell and the tab wire, and has a glass transition point after curing of 130 to 180 ° C. It is characterized by being.
  • the glass transition point after curing of the conductive adhesive film is in a predetermined range, high connection reliability can be maintained even under severe conditions such as high temperature and high humidity.
  • FIG. 1 is an exploded perspective view of a solar cell module to which the present invention is applied.
  • FIG. 2 is a cross-sectional view of the solar cell module.
  • 3A and 3B are cross-sectional views of the solar battery cell.
  • FIG. 4 is a cross-sectional view showing the configuration of the decompression laminator.
  • the solar cell module 1 to which the present invention is applied includes a single crystal silicon photoelectric conversion device, a crystalline silicon solar cell module using a polycrystalline photoelectric conversion device, a cell made of amorphous silicon, and microcrystalline silicon as a photoelectric conversion device. Or a thin-film silicon solar cell using a photoelectric conversion element in which cells made of amorphous silicon germanium are stacked.
  • the solar cell module 1 includes strings 4 in which a plurality of solar cells 2 are connected in series by tab wires 3 serving as interconnectors, and includes a matrix 5 in which a plurality of strings 4 are arranged. .
  • the solar cell module 1 is laminated together with the front cover 7 provided on the light receiving surface side and the back sheet 8 provided on the back surface side, with the matrix 5 sandwiched between the sealing adhesive sheets 6.
  • a metal frame 9 such as aluminum is attached to the periphery.
  • sealing adhesive for example, a translucent sealing material such as ethylene vinyl alcohol resin (EVA) is used.
  • EVA ethylene vinyl alcohol resin
  • surface cover 7 for example, a light-transmitting material such as glass or light-transmitting plastic is used.
  • back sheet 8 a laminated body in which glass or aluminum foil is sandwiched between resin films is used.
  • Each solar battery cell 2 of the solar battery module has a photoelectric conversion element 10 made of a silicon substrate, as shown in FIGS.
  • the photoelectric conversion element 10 is provided with a bus bar electrode 11 serving as a surface electrode on the light receiving surface side and a finger electrode 12 that is a collecting electrode formed in a direction substantially orthogonal to the bus bar electrode 11.
  • the photoelectric conversion element 10 is provided with an Al back electrode 13 made of aluminum on the back side opposite to the light receiving surface.
  • the photovoltaic cell 2 is electrically connected to the bus bar electrode 11 on the front surface and the Al back electrode 13 of the adjacent photovoltaic cell 2 by the tab wire 3, thereby constituting the strings 4 connected in series. To do.
  • the tab wire 3 is connected to the bus bar electrode 11 and the Al back electrode 13 by the conductive adhesive film 20.
  • the tab wire 3 can use the tab wire used in the conventional solar cell module.
  • the tab wire 3 is formed by using, for example, a ribbon-like copper foil having a thickness of 50 to 300 ⁇ m and performing gold plating, silver plating, tin plating, solder plating, or the like as necessary.
  • the conductive adhesive film 20 may be laminated on the tab wire 3 in advance, and may be further formed into a reel shape.
  • the bus bar electrode 11 is formed by applying Ag paste and heating.
  • the bus bar electrode 11 formed on the light receiving surface of the solar battery cell 2 is formed in a line shape with a width of 1 mm, for example, in order to reduce the area that blocks incident light and suppress shadow loss.
  • the number of bus bar electrodes 11 is appropriately set in consideration of the size and resistance of the solar battery cell 2.
  • the finger electrode 12 is formed over almost the entire light receiving surface of the solar battery cell 2 so as to intersect the bus bar electrode 11 by the same method as the bus bar electrode 11.
  • the finger electrodes 12 are formed with lines having a width of about 100 ⁇ m, for example, at a predetermined interval, for example, every 2 mm.
  • the Al back electrode 13 is an aluminum electrode formed on the back surface of the solar battery cell 2 by, for example, screen printing or sputtering.
  • the solar battery cell 2 does not necessarily need to be provided with the bus bar electrode 11.
  • the current of the finger electrode 12 is collected by the tab wire 3 that intersects the finger electrode 12.
  • an opening may be formed in the Al back electrode 13 to such an extent that it does not cause poor connection with the tab line, and thereby the adhesive strength may be ensured.
  • the shape of the conductive adhesive material is not limited to a film shape, and may be a paste.
  • the conductive adhesive film 20 in the present embodiment is obtained by dispersing conductive particles in a thermosetting binder resin.
  • the conductive particles of the conductive adhesive film 20 are not particularly limited, and examples thereof include metal particles such as nickel, gold, and copper, resin particles subjected to gold plating, and resin particles subjected to gold plating.
  • the outermost layer may be an insulating coating.
  • the glass transition point after curing of the conductive adhesive film 20 is preferably 130 to 180 ° C., and more preferably 140 to 180 ° C.
  • the glass transition point after curing is 130 ° C. or higher, high connection reliability can be maintained even under severe conditions such as high temperature and high humidity. Specifically, in the reliability test of the temperature cycle, it is possible to obtain a low conduction resistance value and to prevent peeling of the tab wire.
  • the glass transition point after curing may be higher than 180 ° C., the glass transition point before curing is also increased, and the connection reliability at the time of thermocompression bonding is deteriorated.
  • the viscosity of the conductive adhesive film 20 is preferably 10 to 10000 kPa ⁇ s, more preferably 10 to 5000 kPa ⁇ s near normal temperature.
  • the viscosity of the conductive adhesive film 20 is preferably 10 to 10000 kPa ⁇ s, more preferably 10 to 5000 kPa ⁇ s near normal temperature.
  • the composition of the binder resin is not particularly limited as long as the above-described characteristics are not impaired, but more preferably contains a film-forming resin, a liquid epoxy resin, a latent curing agent, and a silane coupling agent.
  • the film-forming resin corresponds to a high molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formation.
  • various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin can be used.
  • a phenoxy resin is preferably used from the viewpoint of the film formation state, connection reliability, and the like. .
  • the liquid epoxy resin is not particularly limited as long as it has fluidity at room temperature, and all commercially available epoxy resins can be used.
  • Specific examples of such epoxy resins include naphthalene type epoxy resins, biphenyl type epoxy resins, phenol novolac type epoxy resins, bisphenol type epoxy resins, stilbene type epoxy resins, triphenolmethane type epoxy resins, phenol aralkyl type epoxy resins.
  • Resins, naphthol type epoxy resins, dicyclopentadiene type epoxy resins, triphenylmethane type epoxy resins, and the like can be used. These may be used alone or in combination of two or more. Moreover, you may use it combining suitably with other organic resins, such as an acrylic resin.
  • the latent curing agent various curing agents such as a heat curing type and a UV curing type can be used.
  • the latent curing agent does not normally react but is activated by some trigger and starts the reaction.
  • the trigger includes heat, light, pressurization, etc., and can be selected and used depending on the application.
  • a latent curing agent made of imidazoles, amines, sulfonium salts, onium salts, or the like can be used.
  • silane coupling agent epoxy, amino, mercapto sulfide, ureido, etc. can be used.
  • an epoxy-type silane coupling agent is used preferably. Thereby, the adhesiveness in the interface of an organic material and an inorganic material can be improved.
  • rubber-based elastic particles such as acrylic rubber (ACR), butadiene rubber (BR), and nitrile rubber (NBR). Since the elastic particles can absorb internal stress and do not inhibit the curing, high connection reliability can be provided.
  • ACR acrylic rubber
  • BR butadiene rubber
  • NBR nitrile rubber
  • an inorganic filler may be contained.
  • an inorganic filler By containing an inorganic filler, the fluidity of the resin layer during pressure bonding can be adjusted, and the particle capture rate can be improved.
  • silica, talc, titanium oxide, calcium carbonate, magnesium oxide and the like can be used, and the kind of the inorganic filler is not particularly limited.
  • the conductive adhesive film 20 When manufacturing the conductive adhesive film 20 having such a configuration, conductive particles, a film-forming resin, a liquid epoxy resin, a latent curing agent, and a silane coupling agent are dissolved in a solvent.
  • a solvent As the solvent, toluene, ethyl acetate or the like, or a mixed solvent thereof can be used.
  • the electroconductive adhesive film 20 can be obtained by apply
  • the manufacturing method of the solar cell module 1 in the present embodiment is such that the glass transition point after curing is 130 to 180 ° C. on the bus bar electrode 11 of one solar cell 2 and the Al back electrode 13 of another solar cell 2.
  • a certain conductive adhesive film 20 is bonded, the tab wire 3 is temporarily arranged on the conductive adhesive film 20, and is pressed from the upper surface of the tab wire 3 by a heating press head.
  • the finger electrode 12 and the bus bar electrode 11 are formed on the surface of the photoelectric conversion element 10 by applying and baking Ag paste, and the Al back electrode 13 is formed on the connection portion of the tab wire 3 by Al screen printing on the back surface.
  • the Al back electrode 13 is formed on the connection portion of the tab wire 3 by Al screen printing on the back surface.
  • the conductive adhesive film 20 is attached to the bus bar electrode 11 on the surface of the photoelectric conversion element 10 and the Al back electrode 13 on the back surface, and the tab wire 3 is disposed on the conductive adhesive film 20.
  • the tab wire 3 is electrically connected to the bus bar electrode 11 and the Al back electrode 13 by heating and pressing from above the tab wire 3 with a predetermined pressure. At this time, the tab wire 3 is mechanically firmly connected to the bus bar electrode 11 because the binder resin of the conductive adhesive film 20 has good adhesiveness with the bus bar electrode 11 formed of Ag paste.
  • the tab wire 3 is electrically connected to the Al back electrode 13.
  • the temperature at the time of thermocompression bonding is appropriately set according to the conductive adhesive material, but is generally in the range of 120 to 200 ° C.
  • the solar cell module 1 is manufactured.
  • the temperature at the time of lamination is appropriately set according to the sealing adhesive, but is generally in the range of 120 to 160 ° C.
  • the conductive adhesive film in the present embodiment is not limited to the solar cell module manufacturing method described above, and is also used in a collective laminating pressure bonding method in which the sealing resin is cured and the electrode and the tab wire are connected simultaneously. be able to. According to this construction method, since thermal expansion and thermal contraction due to lamination after thermocompression bonding of the electrode and the tab wire are eliminated, a solar cell module having high connection reliability can be manufactured.
  • a front electrode of one solar cell and a back electrode of another solar cell adjacent to the one solar cell are electrically connected with a tab wire via a conductive adhesive material.
  • the front electrode and the tab wire of one solar cell and the back electrode and the tab wire of the other solar cell are temporarily fixed with the above-mentioned conductive adhesive material interposed.
  • the sealing material and the protective base material are sequentially laminated on the upper and lower surfaces of the solar battery cell, and the laminating apparatus is laminated and pressure-bonded from the upper surface of the protective base material, and the sealing material is cured and the front surface electrode, the tab wire, and the rear surface electrode. Connects the tab line.
  • FIG. 4 is a cross-sectional view showing the configuration of the decompression laminator.
  • the decompression laminator 30 includes an upper unit 31 and a lower unit 32. These units are detachably integrated through a seal member 33 such as an O-ring.
  • the upper unit 31 is provided with a flexible sheet 34 such as a silicon rubber.
  • the flexible sheet 34 divides the decompression laminator 30 into a first chamber 35 and a second chamber 36.
  • each of the upper unit 31 and the lower unit 32 has a pipe 37 so that each chamber can independently adjust the internal pressure, that is, can be decompressed, pressurized, and released to the atmosphere by a vacuum pump, a compressor, or the like. , 38 are provided.
  • the pipe 37 is branched in two directions of a pipe 37a and a pipe 37b by a switching valve 39
  • the pipe 38 is branched in two directions of a pipe 38a and a pipe 38b by a switching valve 40.
  • the lower unit 32 is provided with a stage 41 that can be heated.
  • the upper unit 31 and the lower unit 32 are separated, and a sealing material and a protective substrate (surface cover 7 and back sheet 8) are placed on the upper and lower surfaces of the solar cells on which the tab wires are temporarily fixed on the stage 41.
  • stacked in order is mounted.
  • the upper unit 31 and the lower unit 32 are integrated so as to be separable via the seal member 33, and then a vacuum pump is connected to each of the pipe 37a and the pipe 38a, and the inside of the first chamber 35 and the second chamber 36 is connected. Apply high vacuum. While the inside of the second chamber 36 is kept at a high vacuum, the switching valve 39 is switched to introduce air into the first chamber 35 from the pipe 37b. As a result, the flexible sheet 34 is spread toward the second chamber 36, and as a result, the laminate is pressed by the flexible sheet 34 while being heated by the stage 41.
  • the temperature at the time of thermocompression bonding is appropriately set according to the conductive adhesive material, but is generally in the range of 120 to 200 ° C.
  • the switching valve 40 is switched to introduce air into the second chamber 36 from the pipe 38b. Thereby, the flexible sheet 34 is pushed back toward the first chamber 35, and finally the internal pressures of the first chamber 35 and the second chamber 36 become the same.
  • a solar cell module having high connection reliability can be manufactured. Furthermore, since a conductive adhesive film having a glass transition point after curing of 130 to 180 ° C. is used, high connection reliability can be maintained even under severe conditions such as high temperature and high humidity.
  • Example> Examples of the present invention will be described below, but the present invention is not limited to these examples.
  • Example 1 As shown in Table 1, 22 parts by mass of phenoxy resin A (product name: YP50, manufacturer name: Nippon Steel Chemical Co., Ltd.), epoxy resin B (product name: RKB series, manufacturer name: Reginas Kasei Co., Ltd.) 15 parts by mass, acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation) 15 parts by mass, latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Corporation) 45 parts by mass, 2 parts by mass of a silane coupling agent (product name: A-187, manufacturer: Momentive Performance Materials Co., Ltd.), and conductive particles (product name: AUL704, manufacturer: Sekisui Chemical) 15 parts by mass, A resin composition for a conductive adhesive film was prepared. This was applied to the peeled PET using a bar coater and dried in an oven at 80 ° C. for 5 minutes to produce a conductive adhesive film having a thickness of 25 ⁇ m
  • the conductive adhesive film was cured, and the glass transition point (Tg) of the conductive adhesive film after curing was determined using dynamic viscoelasticity measurement measured according to JIS K7244-1 method. It was 132 ° C.
  • a 6-inch polycrystalline Si cell (dimensions: 15.6 cm ⁇ 15.6 cm, thickness: 180 ⁇ m) is bonded with a conductive adhesive film on the surface electrode portion made of Ag and the back electrode portion made of Al.
  • Cu tab wires (width: 2 mm, thickness: 0.15 mm) coated with solder were temporarily arranged on the film.
  • the tab wire was heated and pressurized with a heater head (180 ° C., 15 seconds, 2 MPa) to cure the conductive adhesive film, and an evaluation sample of Example 1 was produced.
  • Example 2 As shown in Table 1, 11 parts by mass of phenoxy resin A (product name: YP50, manufacturer: Nippon Steel Chemical Co., Ltd.) and 11 parts of phenoxy resin B (product name: jer604, manufacturer: Mitsubishi Chemical Corporation) 15 parts by mass of epoxy resin B (product name: RKB series, manufacturer name: Reginas Kasei Co., Ltd.), 15 parts by mass of acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation) 45 parts by weight of latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Co., Ltd.), silane coupling agent (product name: A-187, manufacturer name: Momentive Performance Materials Co., Ltd.) 2 parts by mass and 15 parts by mass of conductive particles (product name: AUL704, manufacturer name: Sekisui Chemical Co., Ltd.) were blended to prepare a resin composition of a conductive adhesive film.
  • phenoxy resin A product name: YP50, manufacturer
  • Example 2 Except for this preparation, an evaluation sample of Example 2 was produced in the same manner as Example 1. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 140 degreeC.
  • Example 3 As shown in Table 1, 5 parts by mass of phenoxy resin A (product name: YP50, manufacturer name: Nippon Steel Chemical Co., Ltd.) and 17 parts of phenoxy resin B (product name: jer604, manufacturer name: Mitsubishi Chemical Corporation) are used.
  • Example 3 an evaluation sample of Example 3 was produced in the same manner as Example 1. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 164 degreeC.
  • Example 4 As shown in Table 1, 22 parts by mass of phenoxy resin B (product name: jer604, manufacturer name: Mitsubishi Chemical Co., Ltd.) and 15 masses of epoxy resin B (product name: RKB series, manufacturer name: Resinas Kasei Co., Ltd.) Parts, 15 parts by mass of acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation), 45 masses of latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Corporation) 2 parts by mass of silane coupling agent (product name: A-187, manufacturer name: Momentive Performance Materials Co., Ltd.) and 15 conductive particles (product name: AUL704, manufacturer name: Sekisui Chemical Co., Ltd.)
  • the resin composition of the electroconductive adhesive film was prepared by blending parts by mass.
  • Example 4 Except for this preparation, an evaluation sample of Example 4 was produced in the same manner as Example 1. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 180 degreeC.
  • Comparative Example 1 A flux was applied to the surface electrode portion and the back electrode portion, and Cu tab wires coated with solder were temporarily arranged. The tab wire was connected by applying heat and pressure (200 ° C., 15 seconds, 2 MPa) with a heater head to produce an evaluation sample of Comparative Example 1.
  • Comparative Example 2 An evaluation sample of Comparative Example 2 was prepared in the same manner as Example 1 except for this preparation. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 125 degreeC.
  • Comparative Example 3 An evaluation sample of Comparative Example 3 was produced in the same manner as Example 1 except for this preparation. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 200 degreeC.
  • Table 1 shows the evaluation results for each sample.
  • the conduction resistance value on the front electrode is 40 ⁇ or less
  • the conduction resistance value on the back electrode is 15 ⁇ or less
  • tab peeling occurs on both the front and back electrodes. What was not observed by (circle) was set as (circle).
  • the conduction resistance value on the front electrode is 40 ⁇ or less
  • the conduction resistance value on the back electrode is 20 ⁇ or more
  • tab peeling is observed on either the front electrode or the back electrode. What was done was made into (triangle
  • the conduction resistance value on the front electrode was 50 ⁇ or more
  • the conduction resistance value on the back electrode was 25 ⁇ or more
  • tab peeling was observed on both the front electrode and the back electrode. The thing was made into x.
  • Example 1 peeling of the tab line on the back surface was observed in 1000 cycles of the temperature cycle test, but peeling of the surface was not seen even in 2000 cycles. Further, the change in conduction resistance was small in the temperature cycle test. In Examples 2 to 4, no peeling of the tab wire on the front surface or the back surface was observed even in 2000 cycles of the temperature cycle test, and the conduction resistance did not change.
  • connection reliability can be obtained by using a conductive adhesive film having a glass transition point after curing of 130 to 180 ° C. for a solar cell module.
  • a conductive adhesive film having a glass transition point after curing of 140 to 180 ° C. has particularly excellent connection reliability.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
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Abstract

Provided are a solar cell module with high connection reliability and a production method for same. A conductive adhesive film (20) with a glass transition temperature of 130°-180°C is pasted onto a bus bar electrode (11) in one solar cell (2) and an A1 rear surface electrode (13) in another solar cell, tab lines (3) are temporarily positioned on top of the conductive adhesive film (20), and a heating and pressing head presses from the top surface of the tab lines (3).

Description

太陽電池モジュール及びその製造方法Solar cell module and manufacturing method thereof
　本発明は、導電性接着フィルムを用いて太陽電池セルの表面／裏面電極とタブ線とを接続する太陽電池モジュール及びその製造方法に関する。本出願は、日本国において２０１０年１１月３０日に出願された日本特許出願番号特願２０１０－２６６９７６を基礎として優先権を主張するものであり、この出願を参照することにより、本出願に援用される。 The present invention relates to a solar cell module that connects a front / back electrode of a solar cell and a tab wire using a conductive adhesive film and a method for manufacturing the solar cell module. This application claims priority on the basis of Japanese Patent Application No. 2010-266976 filed on November 30, 2010 in Japan, and is incorporated herein by reference. Is done.
　従来、結晶シリコン系太陽電池モジュールでは、複数の隣接する太陽電池セルが、半田コートされたリボン状銅箔からなるタブ線により接続されている。タブ線は、その一端側を一の太陽電池セルの表面電極に接続され、他端側を隣接する他の太陽電池セルの裏面電極に接続することにより、各太陽電池セルを直列に接続する。 Conventionally, in a crystalline silicon solar cell module, a plurality of adjacent solar cells are connected by tab wires made of solder-coated ribbon-like copper foil. One end of the tab wire is connected to the surface electrode of one solar battery cell, and the other end is connected to the back electrode of another adjacent solar battery cell, thereby connecting the solar battery cells in series.
　具体的に、太陽電池セルとタブ線との接続は、太陽電池セルの受光面に銀ペーストのスクリーン印刷により形成されたバスバー電極及び太陽電池セルの裏面接続部に形成されたＡｇ電極と、タブ線とが半田処理により接続されている。なお、太陽電池セル裏面の接続部以外の領域はＡｌ電極が形成されている。 Specifically, the connection between the solar battery cell and the tab wire is made up of a bus bar electrode formed by screen printing of silver paste on the light receiving surface of the solar battery cell, an Ag electrode formed on the back surface connection portion of the solar battery cell, and a tab. The wires are connected by soldering. In addition, Al electrodes are formed in regions other than the connection portion on the back surface of the solar battery cell.
　しかし、半田付けでは２００℃以上の高温による接続処理が行われるため、太陽電池セルの反りや、タブ線と表面電極及び裏面電極との接続部に生じる内部応力、さらにフラックスの残渣等により、太陽電池セルの表面電極及び裏面電極とタブ線との間の接続信頼性が低下することが懸念される。 However, since the connection process is performed at a high temperature of 200 ° C. or higher in soldering, the solar cell is warped, the internal stress generated in the connection portion between the tab wire and the front electrode and the back electrode, the residue of the flux, etc. There is a concern that the connection reliability between the front and back electrodes of the battery cell and the tab wire is lowered.
　そこで、太陽電池セルの表面電極及び裏面電極とタブ線との接続に、比較的低い温度での熱圧着処理による接続が可能な導電性接着フィルムの使用が提案されている（例えば、特許文献１、２参照。）。 Then, use of the electroconductive adhesive film in which the connection by the thermocompression-bonding process at a comparatively low temperature is possible for the connection of the surface electrode of a photovoltaic cell, a back surface electrode, and a tab wire is proposed (for example, patent document 1). 2).
特開２００７－２１４５３３号公報JP 2007-214533 A 特開２００８－１３５６５２号公報JP 2008-135562 A
　しかしながら、導電性接着フィルムを用いて表面電極と裏面電極とを接続させた場合、高温多湿などの苛酷な条件下での太陽電池モジュールの使用に対して接続信頼性が低下してしまうことがあった。 However, when the front electrode and the back electrode are connected using a conductive adhesive film, the connection reliability may decrease when the solar cell module is used under severe conditions such as high temperature and high humidity. It was.
　本発明は、このような従来の実情に鑑みて提案されたものであり、高い接続信頼性を有する太陽電池モジュール及びその製造方法を提供する。 The present invention has been proposed in view of such conventional circumstances, and provides a solar cell module having high connection reliability and a method for manufacturing the solar cell module.
　本件発明者らは、鋭意検討を行った結果、導電性接着材料の硬化後のガラス転移点を規定することにより、接続信頼性を向上させることができることを見出した。 As a result of intensive studies, the present inventors have found that the connection reliability can be improved by defining the glass transition point after curing of the conductive adhesive material.
　すなわち、本発明に係る太陽電池モジュールは、一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させた太陽電池モジュールにおいて、前記導電性接着フィルムの硬化後のガラス転移点が１３０～１８０℃であることを特徴とする。 That is, the solar cell module according to the present invention is a tab wire between the front electrode of one solar cell and the back electrode of another solar cell adjacent to the one solar cell via a conductive adhesive material. In the electrically connected solar cell module, the glass transition point after curing of the conductive adhesive film is 130 to 180 ° C.
　また、本発明に係る太陽電池モジュールの製造方法は、一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させる太陽電池モジュールの製造方法において、前記一の太陽電池セルの表面電極及び前記他の太陽電セルの裏面電極に、硬化後のガラス転移点が１３０～１８０℃である導電性接着フィルムを貼り合わせ、該導電性接着フィルム上にタブ線を仮配置する仮配置工程と、前記タブ線の上面から加熱押圧ヘッドにより押圧する押圧工程とを有することを特徴とする。 Moreover, the manufacturing method of the solar cell module which concerns on this invention connects the surface electrode of one photovoltaic cell, and the back surface electrode of the other photovoltaic cell adjacent to this one photovoltaic cell via a conductive adhesive material. In the method for manufacturing a solar cell module to be electrically connected with a tab wire, the glass transition point after curing is 130 to 180 ° C. on the surface electrode of the one solar cell and the back electrode of the other solar cell. It has a temporary placement step of sticking a conductive adhesive film and temporarily placing a tab line on the conductive adhesive film, and a pressing step of pressing from the upper surface of the tab wire with a heating press head.
　また、本発明に係る太陽電池モジュールの製造方法は、一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させる太陽電池モジュールの製造方法において、前記一の太陽電池セルの表面電極とタブ線、及び前記他の太陽電池セルの裏面電極とタブ線とを、硬化後のガラス転移点が１３０～１８０℃である導電性接着材料を介在させて仮配置する仮配置工程と、前記太陽電池セルの上下面に封止材、保護基材を順に積層し、前記保護基材の上面からラミネート装置にてラミネート圧着させ、前記封止材を硬化させるとともに前記表面電極とタブ線及び前記裏面電極とタブ線とを接続させるラミネート圧着工程とを有することを特徴とする。 Moreover, the manufacturing method of the solar cell module which concerns on this invention connects the surface electrode of one photovoltaic cell, and the back surface electrode of the other photovoltaic cell adjacent to this one photovoltaic cell via a conductive adhesive material. In the method for manufacturing a solar cell module to be electrically connected with a tab wire, the glass electrode transition after curing the surface electrode and the tab wire of the one solar cell cell and the back electrode and the tab wire of the other solar cell cell. A temporary placement step in which a conductive adhesive material having a point of 130 to 180 ° C. is interposed, and a sealing material and a protective base material are sequentially laminated on the upper and lower surfaces of the solar cell, and the upper surface of the protective base material And laminating and crimping with a laminating apparatus, curing the sealing material, and laminating and crimping to connect the front electrode and the tab wire and the back electrode and the tab wire.
　また、本発明に係る導電性接着材料は、太陽電池セルの表面電極又は裏面電極と、タブ線とを電気的に接続させる導電性接着フィルムにおいて、硬化後のガラス転移点が１３０～１８０℃であることを特徴とする。 Further, the conductive adhesive material according to the present invention is a conductive adhesive film for electrically connecting the front or back electrode of the solar battery cell and the tab wire, and has a glass transition point after curing of 130 to 180 ° C. It is characterized by being.
　本発明によれば、導電性接着フィルムの硬化後のガラス転移点が所定範囲であることにより、高温多湿などの苛酷な条件下でも、高い接続信頼性を維持することができる。 According to the present invention, since the glass transition point after curing of the conductive adhesive film is in a predetermined range, high connection reliability can be maintained even under severe conditions such as high temperature and high humidity.
図１は、本発明が適用された太陽電池モジュールの分解斜視図である。FIG. 1 is an exploded perspective view of a solar cell module to which the present invention is applied. 図２は、太陽電池モジュールの断面図である。FIG. 2 is a cross-sectional view of the solar cell module. 図３Ａ及び図３Ｂは、太陽電池セルの断面図である。3A and 3B are cross-sectional views of the solar battery cell. 図４は、減圧ラミネーターの構成を示す断面図である。FIG. 4 is a cross-sectional view showing the configuration of the decompression laminator.
　以下、本発明の実施の形態について、図面を参照しながら下記順序にて詳細に説明する。
１．太陽電池モジュール
２．太陽電池モジュールの製造方法
３．実施例 Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings.
1. 1. Solar cell module 2. Manufacturing method of solar cell module Example
　以下、本発明が適用された太陽電池モジュール及びその製造方法について、図面を参照しながら詳細に説明する。本発明が適用された太陽電池モジュール１は、光電変換素子として、単結晶型シリコン光電変換素子、多結晶型光電変換素子を用いる結晶シリコン系太陽電池モジュールや、アモルファスシリコンからなるセルと微結晶シリコンやアモルファスシリコンゲルマニウムからなるセルとを積層させた光電変換素子を用いた薄膜シリコン系太陽電池である。 Hereinafter, a solar cell module to which the present invention is applied and a manufacturing method thereof will be described in detail with reference to the drawings. The solar cell module 1 to which the present invention is applied includes a single crystal silicon photoelectric conversion device, a crystalline silicon solar cell module using a polycrystalline photoelectric conversion device, a cell made of amorphous silicon, and microcrystalline silicon as a photoelectric conversion device. Or a thin-film silicon solar cell using a photoelectric conversion element in which cells made of amorphous silicon germanium are stacked.
　＜１．太陽電池モジュール＞
　太陽電池モジュール１は、図１に示すように、複数の太陽電池セル２がインターコネクタとなるタブ線３によって直列に接続されたストリングス４を有し、このストリングス４を複数配列したマトリクス５を備える。そして、太陽電池モジュール１は、このマトリクス５が封止接着剤のシート６で挟まれ、受光面側に設けられた表面カバー７及び裏面側に設けられたバックシート８とともに一括してラミネートされ、最後に、周囲にアルミニウムなどの金属フレーム９が取り付けられることにより形成される。 <1. Solar cell module>
As shown in FIG. 1, the solar cell module 1 includes strings 4 in which a plurality of solar cells 2 are connected in series by tab wires 3 serving as interconnectors, and includes a matrix 5 in which a plurality of strings 4 are arranged. . And the solar cell module 1 is laminated together with the front cover 7 provided on the light receiving surface side and the back sheet 8 provided on the back surface side, with the matrix 5 sandwiched between the sealing adhesive sheets 6. Finally, a metal frame 9 such as aluminum is attached to the periphery.
　封止接着剤としては、例えばエチレンビニルアルコール樹脂（ＥＶＡ）等の透光性封止材が用いられる。また、表面カバー７としては、例えば、ガラスや透光性プラスチック等の透光性の材料が用いられる。また、バックシート８としては、ガラスやアルミニウム箔を樹脂フィルムで挟持した積層体等が用いられる。 As the sealing adhesive, for example, a translucent sealing material such as ethylene vinyl alcohol resin (EVA) is used. Moreover, as the surface cover 7, for example, a light-transmitting material such as glass or light-transmitting plastic is used. Further, as the back sheet 8, a laminated body in which glass or aluminum foil is sandwiched between resin films is used.
　＜１．１　太陽電池セル＞
　太陽電池モジュールの各太陽電池セル２は、図２及び３に示すように、シリコン基板からなる光電変換素子１０を有する。光電変換素子１０は、受光面側に表面電極となるバスバー電極１１と、バスバー電極１１とほぼ直交する方向に形成された集電極であるフィンガー電極１２が設けられている。また、光電変換素子１０は、受光面と反対の裏面側に、アルミニウムからなるＡｌ裏面電極１３が設けられている。 <1.1 Solar cell>
Each solar battery cell 2 of the solar battery module has a photoelectric conversion element 10 made of a silicon substrate, as shown in FIGS. The photoelectric conversion element 10 is provided with a bus bar electrode 11 serving as a surface electrode on the light receiving surface side and a finger electrode 12 that is a collecting electrode formed in a direction substantially orthogonal to the bus bar electrode 11. In addition, the photoelectric conversion element 10 is provided with an Al back electrode 13 made of aluminum on the back side opposite to the light receiving surface.
　そして、太陽電池セル２は、タブ線３によって、表面のバスバー電極１１と、隣接する太陽電池セル２のＡｌ裏面電極１３とが電気的に接続され、これにより直列に接続されたストリングス４を構成する。タブ線３とバスバー電極１１及びＡｌ裏面電極１３との接続は、導電性接着フィルム２０によって行う。 And the photovoltaic cell 2 is electrically connected to the bus bar electrode 11 on the front surface and the Al back electrode 13 of the adjacent photovoltaic cell 2 by the tab wire 3, thereby constituting the strings 4 connected in series. To do. The tab wire 3 is connected to the bus bar electrode 11 and the Al back electrode 13 by the conductive adhesive film 20.
　タブ線３は、従来の太陽電池モジュールで使用されているタブ線を利用することができる。タブ線３は、例えば、５０～３００μｍ厚のリボン状銅箔を使用し、必要に応じて金メッキ、銀メッキ、スズメッキ、ハンダメッキ等を施すことにより形成される。また、タブ線３には予め導電性接着フィルム２０が積層されていてもよく、更にリール形状に成形されていてもよい。 The tab wire 3 can use the tab wire used in the conventional solar cell module. The tab wire 3 is formed by using, for example, a ribbon-like copper foil having a thickness of 50 to 300 μm and performing gold plating, silver plating, tin plating, solder plating, or the like as necessary. Moreover, the conductive adhesive film 20 may be laminated on the tab wire 3 in advance, and may be further formed into a reel shape.
　バスバー電極１１は、Ａｇペーストを塗布し、加熱することにより形成される。太陽電池セル２の受光面に形成されるバスバー電極１１は、入射光を遮る面積を小さくし、シャドーロスを抑えるために、例えば１ｍｍ幅でライン状に形成されている。バスバー電極１１の数は、太陽電池セル２のサイズや抵抗を考慮して適宜設定される。 The bus bar electrode 11 is formed by applying Ag paste and heating. The bus bar electrode 11 formed on the light receiving surface of the solar battery cell 2 is formed in a line shape with a width of 1 mm, for example, in order to reduce the area that blocks incident light and suppress shadow loss. The number of bus bar electrodes 11 is appropriately set in consideration of the size and resistance of the solar battery cell 2.
　フィンガー電極１２は、バスバー電極１１と同様の方法により、バスバー電極１１と交差するように、太陽電池セル２の受光面のほぼ全面に亘って形成されている。また、フィンガー電極１２は、例えば約１００μｍ程度の幅を有するラインが、所定間隔、例えば２ｍｍおきに形成されている。 The finger electrode 12 is formed over almost the entire light receiving surface of the solar battery cell 2 so as to intersect the bus bar electrode 11 by the same method as the bus bar electrode 11. The finger electrodes 12 are formed with lines having a width of about 100 μm, for example, at a predetermined interval, for example, every 2 mm.
　Ａｌ裏面電極１３は、アルミニウムからなる電極が例えばスクリーン印刷やスパッタ等により太陽電池セル２の裏面に形成される。 The Al back electrode 13 is an aluminum electrode formed on the back surface of the solar battery cell 2 by, for example, screen printing or sputtering.
　なお、太陽電池セル２は、バスバー電極１１を必ずしも設ける必要はない。この場合、太陽電池セル２は、フィンガー電極１２の電流が、フィンガー電極１２と交差するタブ線３によって集められる。また、Ａｌ裏面電極１３にタブ線と接続不良にならない程度に開口部を形成してもよく、これによって接着強度を確保してもよい。 The solar battery cell 2 does not necessarily need to be provided with the bus bar electrode 11. In this case, in the solar battery cell 2, the current of the finger electrode 12 is collected by the tab wire 3 that intersects the finger electrode 12. In addition, an opening may be formed in the Al back electrode 13 to such an extent that it does not cause poor connection with the tab line, and thereby the adhesive strength may be ensured.
　＜１．２　導電性接着材料＞
　次に、太陽電池セルの表面電極又は裏面電極とタブ線とを電気的に接続するための導電性接着材料について説明する。なお、導電性接着材料の形状は、フィルム形状に限定されず、ペーストであってもよい。 <1.2 Conductive adhesive material>
Next, the conductive adhesive material for electrically connecting the front surface electrode or back surface electrode of the solar battery cell and the tab wire will be described. The shape of the conductive adhesive material is not limited to a film shape, and may be a paste.
　本実施の形態における導電性接着フィルム２０は、熱硬化性のバインダ樹脂に導電性粒子が分散されてなるものである。導電性接着フィルム２０の導電性粒子としては、特に制限されず、例えば、ニッケル、金、銅などの金属粒子、樹脂粒子に金めっきなどを施したもの、樹脂粒子に金めっきを施した粒子の最外層に絶縁被覆を施したものなどを挙げることができる。 The conductive adhesive film 20 in the present embodiment is obtained by dispersing conductive particles in a thermosetting binder resin. The conductive particles of the conductive adhesive film 20 are not particularly limited, and examples thereof include metal particles such as nickel, gold, and copper, resin particles subjected to gold plating, and resin particles subjected to gold plating. The outermost layer may be an insulating coating.
　導電性接着フィルム２０の硬化後のガラス転移点は、１３０～１８０℃であることが好ましく、より好ましくは、１４０～１８０℃である。硬化後のガラス転移点が１３０℃以上であることにより、高温多湿などの苛酷な条件下でも、高い接続信頼性を維持することができる。具体的には、温度サイクルの信頼性試験において、低い導通抵抗値が得られるとともにタブ線の剥離を防止することができる。硬化後のガラス転移点は、１８０℃より大きくてもかまわないが、硬化前のガラス転移点も大きくなってしまい、熱圧着時の接続信頼性が悪化してしまう。 The glass transition point after curing of the conductive adhesive film 20 is preferably 130 to 180 ° C., and more preferably 140 to 180 ° C. When the glass transition point after curing is 130 ° C. or higher, high connection reliability can be maintained even under severe conditions such as high temperature and high humidity. Specifically, in the reliability test of the temperature cycle, it is possible to obtain a low conduction resistance value and to prevent peeling of the tab wire. Although the glass transition point after curing may be higher than 180 ° C., the glass transition point before curing is also increased, and the connection reliability at the time of thermocompression bonding is deteriorated.
　また、導電性接着フィルム２０の粘度は、常温付近で１０～１００００ｋＰａ・ｓであることが好ましく、さらに好ましくは、１０～５０００ｋＰａ・ｓである。導電性接着フィルム２０の粘度が１０～１００００ｋＰａ・ｓの範囲であることにより、導電性接着フィルム２０をテープ状のリール巻とした場合において、所謂はみ出しを防止することができ、また、所定のタック力を維持することができる。 The viscosity of the conductive adhesive film 20 is preferably 10 to 10000 kPa · s, more preferably 10 to 5000 kPa · s near normal temperature. When the conductive adhesive film 20 has a viscosity in the range of 10 to 10000 kPa · s, when the conductive adhesive film 20 is wound in a tape-like reel, so-called protrusion can be prevented, and a predetermined tack can be prevented. You can maintain power.
　バインダ樹脂の組成は、上述のような特徴を害さない限り、特に制限されないが、より好ましくは、膜形成樹脂と、液状エポキシ樹脂と、潜在性硬化剤と、シランカップリング剤とを含有する。 The composition of the binder resin is not particularly limited as long as the above-described characteristics are not impaired, but more preferably contains a film-forming resin, a liquid epoxy resin, a latent curing agent, and a silane coupling agent.
　膜形成樹脂は、平均分子量が１００００以上の高分子量樹脂に相当し、フィルム形成性の観点から、１００００～８００００程度の平均分子量であることが好ましい。膜形成樹脂としては、エポキシ樹脂、変性エポキシ樹脂、ウレタン樹脂、フェノキシ樹脂等の種々の樹脂を使用することができ、その中でも膜形成状態、接続信頼性等の観点からフェノキシ樹脂が好適に用いられる。 The film-forming resin corresponds to a high molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formation. As the film-forming resin, various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin can be used. Among them, a phenoxy resin is preferably used from the viewpoint of the film formation state, connection reliability, and the like. .
　液状エポキシ樹脂としては、常温で流動性を有していれば、特に制限はなく、市販のエポキシ樹脂が全て使用可能である。このようなエポキシ樹脂としては、具体的には、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノール型エポキシ樹脂、スチルベン型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ナフトール型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂などを用いることができる。これらは単独でも、２種以上を組み合わせて用いてもよい。また、アクリル樹脂など他の有機樹脂と適宜組み合わせて使用してもよい。 The liquid epoxy resin is not particularly limited as long as it has fluidity at room temperature, and all commercially available epoxy resins can be used. Specific examples of such epoxy resins include naphthalene type epoxy resins, biphenyl type epoxy resins, phenol novolac type epoxy resins, bisphenol type epoxy resins, stilbene type epoxy resins, triphenolmethane type epoxy resins, phenol aralkyl type epoxy resins. Resins, naphthol type epoxy resins, dicyclopentadiene type epoxy resins, triphenylmethane type epoxy resins, and the like can be used. These may be used alone or in combination of two or more. Moreover, you may use it combining suitably with other organic resins, such as an acrylic resin.
　潜在性硬化剤としては、加熱硬化型、ＵＶ硬化型などの各種硬化剤が使用できる。潜在性硬化剤は、通常では反応せず、何かしらのトリガーにより活性化し、反応を開始する。トリガーには、熱、光、加圧などがあり、用途により選択して用いることができる。液状エポキシ樹脂を使用する場合は、イミダゾール類、アミン類、スルホニウム塩、オニウム塩などからなる潜在性硬化剤を使用することができる。 As the latent curing agent, various curing agents such as a heat curing type and a UV curing type can be used. The latent curing agent does not normally react but is activated by some trigger and starts the reaction. The trigger includes heat, light, pressurization, etc., and can be selected and used depending on the application. When a liquid epoxy resin is used, a latent curing agent made of imidazoles, amines, sulfonium salts, onium salts, or the like can be used.
　シランカップリング剤としては、エポキシ系、アミノ系、メルカプト・スルフィド系、ウレイド系などを用いることができる。これらの中でも、本実施の形態では、エポキシ系シランカップリング剤が好ましく用いられる。これにより、有機材料と無機材料の界面における接着性を向上させることができる。 As the silane coupling agent, epoxy, amino, mercapto sulfide, ureido, etc. can be used. Among these, in this Embodiment, an epoxy-type silane coupling agent is used preferably. Thereby, the adhesiveness in the interface of an organic material and an inorganic material can be improved.
　また、その他の添加組成物として、アクリルゴム（ＡＣＲ）、ブタジエンゴム（ＢＲ）、ニトリルゴム（ＮＢＲ）などのゴム系の弾性粒子を配合することが好ましい。弾性粒子は、内部応力を吸収することができ、また、硬化阻害を起こさないため、高い接続信頼性を与えることができる。 Also, as other additive compositions, it is preferable to blend rubber-based elastic particles such as acrylic rubber (ACR), butadiene rubber (BR), and nitrile rubber (NBR). Since the elastic particles can absorb internal stress and do not inhibit the curing, high connection reliability can be provided.
　また、その他の添加組成物として、無機フィラーを含有させてもよい。無機フィラーを含有することにより、圧着時における樹脂層の流動性を調整し、粒子捕捉率を向上させることができる。無機フィラーとしては、シリカ、タルク、酸化チタン、炭酸カルシウム、酸化マグネシウム等を用いることができ、無機フィラーの種類は特に限定されるものではない。 Further, as other additive composition, an inorganic filler may be contained. By containing an inorganic filler, the fluidity of the resin layer during pressure bonding can be adjusted, and the particle capture rate can be improved. As the inorganic filler, silica, talc, titanium oxide, calcium carbonate, magnesium oxide and the like can be used, and the kind of the inorganic filler is not particularly limited.
　このような構成の導電性接着フィルム２０を製造する場合、導電性粒子と、膜形成樹脂と、液状エポキシ樹脂と、潜在性硬化剤と、シランカップリング剤とを溶剤に溶解させる。溶剤としては、トルエン、酢酸エチルなど、又はこれらの混合溶剤を用いることができる。そして、溶解させて得られた樹脂生成用溶液を剥離シート上に塗布し、溶剤を揮発させることにより、導電性接着フィルム２０を得ることができる。 When manufacturing the conductive adhesive film 20 having such a configuration, conductive particles, a film-forming resin, a liquid epoxy resin, a latent curing agent, and a silane coupling agent are dissolved in a solvent. As the solvent, toluene, ethyl acetate or the like, or a mixed solvent thereof can be used. And the electroconductive adhesive film 20 can be obtained by apply | coating the solution for resin production obtained by making it melt | dissolve on a peeling sheet, and volatilizing a solvent.
　＜２．太陽電池モジュールの製造方法＞
　次に、太陽電池モジュールの製造方法について、図３Ａ及び図３Ｂを参照して説明する。本実施の形態における太陽電池モジュール１の製造方法は、一の太陽電池セル２のバスバー電極１１及び他の太陽電セル２のＡｌ裏面電極１３に、硬化後のガラス転移点が１３０～１８０℃である導電性接着フィルム２０を貼り合わせ、導電性接着フィルム２０上にタブ線３を仮配置し、タブ線３の上面から加熱押圧ヘッドにより押圧するものである。 <2. Manufacturing method of solar cell module>
Next, the manufacturing method of a solar cell module is demonstrated with reference to FIG. 3A and 3B. The manufacturing method of the solar cell module 1 in the present embodiment is such that the glass transition point after curing is 130 to 180 ° C. on the bus bar electrode 11 of one solar cell 2 and the Al back electrode 13 of another solar cell 2. A certain conductive adhesive film 20 is bonded, the tab wire 3 is temporarily arranged on the conductive adhesive film 20, and is pressed from the upper surface of the tab wire 3 by a heating press head.
　具体的には、先ず、光電変換素子１０の表面にＡｇペーストの塗布、焼成によってフィンガー電極１２及びバスバー電極１１を形成し、裏面にＡｌスクリーン印刷等によってタブ線３の接続部にＡｌ裏面電極１３を形成し、太陽電池セルを作製する。 Specifically, first, the finger electrode 12 and the bus bar electrode 11 are formed on the surface of the photoelectric conversion element 10 by applying and baking Ag paste, and the Al back electrode 13 is formed on the connection portion of the tab wire 3 by Al screen printing on the back surface. To form a solar battery cell.
　次いで、光電変換素子１０表面のバスバー電極１１及び裏面のＡｌ裏面電極１３に導電性接着フィルム２０を貼着し、この導電性接着フィルム２０上にタブ線３を配設する。 Next, the conductive adhesive film 20 is attached to the bus bar electrode 11 on the surface of the photoelectric conversion element 10 and the Al back electrode 13 on the back surface, and the tab wire 3 is disposed on the conductive adhesive film 20.
　そして、タブ線３の上から所定の圧力で加熱押圧することにより、タブ線３とバスバー電極１１及びＡｌ裏面電極１３を電気的に接続する。このとき、タブ線３は、導電性接着フィルム２０のバインダ樹脂がＡｇペーストにより形成されたバスバー電極１１と良好な接着性を備えることから、バスバー電極１１と機械的に強固に接続される。また、タブ線３は、Ａｌ裏面電極１３と電気的に接続される。この熱圧着時の温度は、導電性接着材料に応じて適宜設定されるが、一般に１２０～２００℃の範囲である。 Then, the tab wire 3 is electrically connected to the bus bar electrode 11 and the Al back electrode 13 by heating and pressing from above the tab wire 3 with a predetermined pressure. At this time, the tab wire 3 is mechanically firmly connected to the bus bar electrode 11 because the binder resin of the conductive adhesive film 20 has good adhesiveness with the bus bar electrode 11 formed of Ag paste. The tab wire 3 is electrically connected to the Al back electrode 13. The temperature at the time of thermocompression bonding is appropriately set according to the conductive adhesive material, but is generally in the range of 120 to 200 ° C.
　この太陽電池セル２が接続されたマトリクス５を封止接着剤のシート６で挟み、受光面側に設けられた表面カバー７及び裏面側に設けられたバックシート８とともに一括してラミネートすることにより、太陽電池モジュール１が製造される。このラミネート時の温度は、封止接着剤に応じて適宜設定されるが、一般に１２０～１６０℃の範囲である。 By sandwiching the matrix 5 to which the solar cells 2 are connected between the sheets 6 of the sealing adhesive, and laminating together with the front cover 7 provided on the light receiving surface side and the back sheet 8 provided on the back surface side. The solar cell module 1 is manufactured. The temperature at the time of lamination is appropriately set according to the sealing adhesive, but is generally in the range of 120 to 160 ° C.
　本実施の形態では、硬化後のガラス転移点が１３０～１８０℃である導電性接着フィルムを用いることにより、太陽電池セルをラミネートする際の接続不良を低減させることができる。また、高温多湿などの苛酷な条件下でも、高い接続信頼性を維持することができる。 In this embodiment, by using a conductive adhesive film having a glass transition point after curing of 130 to 180 ° C., poor connection when laminating solar cells can be reduced. Moreover, high connection reliability can be maintained even under severe conditions such as high temperature and high humidity.
　また、本実施の形態における導電性接着フィルムは、前述した太陽電池モジュールの製造方法に限られず、封止樹脂の硬化と、電極とタブ線との接続とを同時に行う一括ラミネート圧着工法にも用いることができる。この工法によれば、電極とタブ線とを熱圧着した後のラミネートによる熱膨張や熱収縮が無くなるため、高い接続信頼性を有する太陽電池モジュールを製造することができる。 In addition, the conductive adhesive film in the present embodiment is not limited to the solar cell module manufacturing method described above, and is also used in a collective laminating pressure bonding method in which the sealing resin is cured and the electrode and the tab wire are connected simultaneously. be able to. According to this construction method, since thermal expansion and thermal contraction due to lamination after thermocompression bonding of the electrode and the tab wire are eliminated, a solar cell module having high connection reliability can be manufactured.
　この太陽電池モジュールの製造方法は、一の太陽電池セルの表面電極と、一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させる太陽電池モジュールの製造方法において、一の太陽電池セルの表面電極とタブ線、及び他の太陽電池セルの裏面電極とタブ線とを、前述した導電性接着材料を介在させて仮固定し、太陽電池セルの上下面に封止材、保護基材を順に積層し、保護基材の上面からラミネート装置にてラミネート圧着させ、封止材を硬化させるとともに表面電極とタブ線及び裏面電極とタブ線とを接続させるものである。 In this method of manufacturing a solar cell module, a front electrode of one solar cell and a back electrode of another solar cell adjacent to the one solar cell are electrically connected with a tab wire via a conductive adhesive material. In the manufacturing method of the solar cell module to be connected, the front electrode and the tab wire of one solar cell and the back electrode and the tab wire of the other solar cell are temporarily fixed with the above-mentioned conductive adhesive material interposed. In addition, the sealing material and the protective base material are sequentially laminated on the upper and lower surfaces of the solar battery cell, and the laminating apparatus is laminated and pressure-bonded from the upper surface of the protective base material, and the sealing material is cured and the front surface electrode, the tab wire, and the rear surface electrode. Connects the tab line.
　先ず、封止樹脂の硬化と、電極とタブ線との接続とを同時に行うラミネート装置について説明する。 First, a laminating apparatus that simultaneously cures the sealing resin and connects the electrodes and the tab wires will be described.
　図４は、減圧ラミネーターの構成を示す断面図である。減圧ラミネーター３０は、上部ユニット３１と下部ユニット３２とから構成される。これらのユニットは、Ｏリングなどのシール部材３３を介して分離可能に一体化される。上部ユニット３１には、シリコンラバーなどの可撓性シート３４が設けられており、この可撓性シート３４により、減圧ラミネーター３０が第１室３５と第２室３６とに区画される。 FIG. 4 is a cross-sectional view showing the configuration of the decompression laminator. The decompression laminator 30 includes an upper unit 31 and a lower unit 32. These units are detachably integrated through a seal member 33 such as an O-ring. The upper unit 31 is provided with a flexible sheet 34 such as a silicon rubber. The flexible sheet 34 divides the decompression laminator 30 into a first chamber 35 and a second chamber 36.
　また、上部ユニット３１及び下部ユニット３２のそれぞれには、各室がそれぞれ独立的に内圧調整、すなわち、真空ポンプやコンプレッサーなどにより、減圧、加圧、さらに大気開放も可能となるように、配管３７、３８が設けられている。配管３７は、切替バルブ３９により配管３７ａと配管３７ｂとの２方向に分岐しており、配管３８は、切替バルブ４０により配管３８ａと配管３８ｂとの２方向に分岐している。また、下部ユニット３２には、加熱可能なステージ４１が設けられている。 In addition, each of the upper unit 31 and the lower unit 32 has a pipe 37 so that each chamber can independently adjust the internal pressure, that is, can be decompressed, pressurized, and released to the atmosphere by a vacuum pump, a compressor, or the like. , 38 are provided. The pipe 37 is branched in two directions of a pipe 37a and a pipe 37b by a switching valve 39, and the pipe 38 is branched in two directions of a pipe 38a and a pipe 38b by a switching valve 40. The lower unit 32 is provided with a stage 41 that can be heated.
　次に、この減圧ラミネーター３０を用いた具体的な接続方法について説明する。先ず、上部ユニット３１と下部ユニット３２とを分離し、ステージ４１上に、タブ線が仮固定された太陽電池セルの上下面に封止材、保護基材（表面カバー７、バックシート８）を順に積層した積層物を載置する。 Next, a specific connection method using the decompression laminator 30 will be described. First, the upper unit 31 and the lower unit 32 are separated, and a sealing material and a protective substrate (surface cover 7 and back sheet 8) are placed on the upper and lower surfaces of the solar cells on which the tab wires are temporarily fixed on the stage 41. The laminated body laminated | stacked in order is mounted.
　そして、上部ユニット３１と下部ユニット３２とをシール部材３３を介して分離可能に一体化し、その後、配管３７ａ及び配管３８ａのそれぞれに真空ポンプを接続し、第１室３５及び第２室３６内を高真空にする。第２室３６内を高真空に保ったまま、切替バルブ３９を切り替えて、配管３７ｂから第１室３５内に大気を導入する。これにより、可撓性シート３４が第２室３６に向かって押し広げられ、結果、積層物がステージ４１で加熱されつつ、可撓性シート３４で押圧される。この熱圧着時の温度は、導電性接着材料に応じて適宜設定されるが、一般に１２０～２００℃の範囲である。 Then, the upper unit 31 and the lower unit 32 are integrated so as to be separable via the seal member 33, and then a vacuum pump is connected to each of the pipe 37a and the pipe 38a, and the inside of the first chamber 35 and the second chamber 36 is connected. Apply high vacuum. While the inside of the second chamber 36 is kept at a high vacuum, the switching valve 39 is switched to introduce air into the first chamber 35 from the pipe 37b. As a result, the flexible sheet 34 is spread toward the second chamber 36, and as a result, the laminate is pressed by the flexible sheet 34 while being heated by the stage 41. The temperature at the time of thermocompression bonding is appropriately set according to the conductive adhesive material, but is generally in the range of 120 to 200 ° C.
　熱圧着後、切替バルブ４０を切り替え、配管３８ｂから第２室３６内に大気を導入する。これにより、可撓性シート３４が第１室３５に向かって押し戻され、最終的に第１室３５及び第２室３６の内圧が同じとなる。 After the thermocompression bonding, the switching valve 40 is switched to introduce air into the second chamber 36 from the pipe 38b. Thereby, the flexible sheet 34 is pushed back toward the first chamber 35, and finally the internal pressures of the first chamber 35 and the second chamber 36 become the same.
　最後に、上部ユニット３１と下部ユニット３２とを引き離し、ステージ４１上から熱圧着処理された太陽電池モジュールを取り出す。これにより、封止樹脂の硬化と、電極とタブ線との接続とを同時に行うことができる。 Finally, the upper unit 31 and the lower unit 32 are pulled apart, and the solar cell module subjected to the thermocompression treatment is taken out from the stage 41. Thereby, hardening of sealing resin and the connection of an electrode and a tab wire can be performed simultaneously.
　このような太陽電池モジュールの製造方法によれば、電極とタブ線とを熱圧着した後のラミネートによる熱膨張や熱収縮が無くなるため、高い接続信頼性を有する太陽電池モジュールを製造することができる。さらに、硬化後のガラス転移点が１３０～１８０℃である導電性接着フィルムを用いているため、高温多湿などの苛酷な条件下でも、高い接続信頼性を維持することができる。 According to such a method for manufacturing a solar cell module, since thermal expansion and thermal contraction due to lamination after thermocompression bonding of the electrode and the tab wire are eliminated, a solar cell module having high connection reliability can be manufactured. . Furthermore, since a conductive adhesive film having a glass transition point after curing of 130 to 180 ° C. is used, high connection reliability can be maintained even under severe conditions such as high temperature and high humidity.
　＜４．実施例＞
　以下、本発明の実施例について説明するが、本発明はこれらの実施例に限定されるものではない。 <4. Example>
Examples of the present invention will be described below, but the present invention is not limited to these examples.
　［実施例１］
　表１に示すように、フェノキシ樹脂Ａ（品名：ＹＰ５０、メーカー名：新日鐵化学（株））を２２質量部、エポキシ樹脂Ｂ（品名：ＲＫＢシリーズ、メーカー名：レジナス化成（株））を１５質量部、アクリルゴム（品名：ＳＧ－８０－Ｈ、メーカー名：ナガセケムテックス（株））を１５質量部、潜在性硬化剤（品名：ＨＸ－３９４１、メーカー名：旭化成（株））を４５質量部、シランカップリング剤（品名：Ａ－１８７、メーカー名：モメンティブ・パフォーマンス・マテリアルズ（株））を２質量部、及び、導電性粒子（品名：ＡＵＬ７０４、メーカー名：積水化学工業）を１５質量部配合し、
導電性接着フィルムの樹脂組成物を調製した。これを、剥離処理されたＰＥＴにバーコーターを用いて塗布し、８０℃のオーブンで５分乾燥させ、厚さ２５μｍの導電性接着フィルムを作製した。 [Example 1]
As shown in Table 1, 22 parts by mass of phenoxy resin A (product name: YP50, manufacturer name: Nippon Steel Chemical Co., Ltd.), epoxy resin B (product name: RKB series, manufacturer name: Reginas Kasei Co., Ltd.) 15 parts by mass, acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation) 15 parts by mass, latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Corporation) 45 parts by mass, 2 parts by mass of a silane coupling agent (product name: A-187, manufacturer: Momentive Performance Materials Co., Ltd.), and conductive particles (product name: AUL704, manufacturer: Sekisui Chemical) 15 parts by mass,
A resin composition for a conductive adhesive film was prepared. This was applied to the peeled PET using a bar coater and dried in an oven at 80 ° C. for 5 minutes to produce a conductive adhesive film having a thickness of 25 μm.
　そして、導電性接着フィルムを硬化させ、ＪＩＳ Ｋ７２４４－１法に準拠して測定される動的粘弾性測定を用いて、硬化後の導電性接着フィルムのガラス転移点（Ｔｇ）を求めたところ、１３２℃であった。 Then, the conductive adhesive film was cured, and the glass transition point (Tg) of the conductive adhesive film after curing was determined using dynamic viscoelasticity measurement measured according to JIS K7244-1 method. It was 132 ° C.
　次に、６インチ多結晶Ｓｉセル（寸法：１５．６ｃｍ×１５．６ｃｍ、厚さ：１８０μｍ）のＡｇからなる表面電極部分及びＡｌからなる裏面電極部分に導電性接着フィルムを張り合わせ、導電性接着フィルム上にはんだが被覆されたＣｕタブ線（幅：２ｍｍ、厚さ：０．１５ｍｍ）を仮配置させた。タブ線をヒーターヘッドにより熱加圧（１８０℃、１５秒、２ＭＰａ）して導電性接着フィルムを硬化させ、実施例１の評価サンプルを作製した。 Next, a 6-inch polycrystalline Si cell (dimensions: 15.6 cm × 15.6 cm, thickness: 180 μm) is bonded with a conductive adhesive film on the surface electrode portion made of Ag and the back electrode portion made of Al. Cu tab wires (width: 2 mm, thickness: 0.15 mm) coated with solder were temporarily arranged on the film. The tab wire was heated and pressurized with a heater head (180 ° C., 15 seconds, 2 MPa) to cure the conductive adhesive film, and an evaluation sample of Example 1 was produced.
　［実施例２］
　表１に示すように、フェノキシ樹脂Ａ（品名：ＹＰ５０、メーカー名：新日鐵化学（株））を１１質量部、フェノキシ樹脂Ｂ（品名：ｊｅｒ６０４、メーカー名：三菱化学（株））を１１質量部、エポキシ樹脂Ｂ（品名：ＲＫＢシリーズ、メーカー名：レジナス化成（株））を１５質量部、アクリルゴム（品名：ＳＧ－８０－Ｈ、メーカー名：ナガセケムテックス（株））を１５質量部、潜在性硬化剤（品名：ＨＸ－３９４１、メーカー名：旭化成（株））を４５質量部、シランカップリング剤（品名：Ａ－１８７、メーカー名：モメンティブ・パフォーマンス・マテリアルズ（株））を２質量部、及び、導電性粒子（品名：ＡＵＬ７０４、メーカー名：積水化学工業）を１５質量部配合し、導電性接着フィルムの樹脂組成物を調製した。 [Example 2]
As shown in Table 1, 11 parts by mass of phenoxy resin A (product name: YP50, manufacturer: Nippon Steel Chemical Co., Ltd.) and 11 parts of phenoxy resin B (product name: jer604, manufacturer: Mitsubishi Chemical Corporation) 15 parts by mass of epoxy resin B (product name: RKB series, manufacturer name: Reginas Kasei Co., Ltd.), 15 parts by mass of acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation) 45 parts by weight of latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Co., Ltd.), silane coupling agent (product name: A-187, manufacturer name: Momentive Performance Materials Co., Ltd.) 2 parts by mass and 15 parts by mass of conductive particles (product name: AUL704, manufacturer name: Sekisui Chemical Co., Ltd.) were blended to prepare a resin composition of a conductive adhesive film.
　この調製以外は、実施例１と同様にして実施例２の評価サンプルを作製した。また、硬化後の導電性接着フィルムのガラス転移点は１４０℃であった。 Except for this preparation, an evaluation sample of Example 2 was produced in the same manner as Example 1. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 140 degreeC.
　［実施例３］
　表１に示すように、フェノキシ樹脂Ａ（品名：ＹＰ５０、メーカー名：新日鐵化学（株））を５質量部、フェノキシ樹脂Ｂ（品名：ｊｅｒ６０４、メーカー名：三菱化学（株））を１７質量部、エポキシ樹脂Ｂ（品名：ＲＫＢシリーズ、メーカー名：レジナス化成（株））を１５質量部、アクリルゴム（品名：ＳＧ－８０－Ｈ、メーカー名：ナガセケムテックス（株））を１５質量部、潜在性硬化剤（品名：ＨＸ－３９４１、メーカー名：旭化成（株））を４５質量部、シランカップリング剤（品名：Ａ－１８７、メーカー名：モメンティブ・パフォーマンス・マテリアルズ（株））を２質量部、及び、導電性粒子（品名：ＡＵＬ７０４、メーカー名：積水化学工業）を１５質量部配合し、導電性接着フィルムの樹脂組成物を調製した。 [Example 3]
As shown in Table 1, 5 parts by mass of phenoxy resin A (product name: YP50, manufacturer name: Nippon Steel Chemical Co., Ltd.) and 17 parts of phenoxy resin B (product name: jer604, manufacturer name: Mitsubishi Chemical Corporation) are used. 15 parts by mass of epoxy resin B (product name: RKB series, manufacturer name: Reginas Kasei Co., Ltd.), 15 parts by mass of acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation) 45 parts by weight of latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Co., Ltd.), silane coupling agent (product name: A-187, manufacturer name: Momentive Performance Materials Co., Ltd.) 2 parts by mass and 15 parts by mass of conductive particles (product name: AUL704, manufacturer name: Sekisui Chemical Co., Ltd.) were blended to prepare a resin composition of a conductive adhesive film.
　これ以外は、実施例１と同様にして実施例３の評価サンプルを作製した。また、硬化後の導電性接着フィルムのガラス転移点は１６４℃であった。 Other than this, an evaluation sample of Example 3 was produced in the same manner as Example 1. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 164 degreeC.
　［実施例４］
　表１に示すように、フェノキシ樹脂Ｂ（品名：ｊｅｒ６０４、メーカー名：三菱化学（株））を２２質量部、エポキシ樹脂Ｂ（品名：ＲＫＢシリーズ、メーカー名：レジナス化成（株））を１５質量部、アクリルゴム（品名：ＳＧ－８０－Ｈ、メーカー名：ナガセケムテックス（株））を１５質量部、潜在性硬化剤（品名：ＨＸ－３９４１、メーカー名：旭化成（株））を４５質量部、シランカップリング剤（品名：Ａ－１８７、メーカー名：モメンティブ・パフォーマンス・マテリアルズ（株））を２質量部、及び、導電性粒子（品名：ＡＵＬ７０４、メーカー名：積水化学工業）を１５質量部配合し、導電性接着フィルムの樹脂組成物を調製した。 [Example 4]
As shown in Table 1, 22 parts by mass of phenoxy resin B (product name: jer604, manufacturer name: Mitsubishi Chemical Co., Ltd.) and 15 masses of epoxy resin B (product name: RKB series, manufacturer name: Resinas Kasei Co., Ltd.) Parts, 15 parts by mass of acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation), 45 masses of latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Corporation) 2 parts by mass of silane coupling agent (product name: A-187, manufacturer name: Momentive Performance Materials Co., Ltd.) and 15 conductive particles (product name: AUL704, manufacturer name: Sekisui Chemical Co., Ltd.) The resin composition of the electroconductive adhesive film was prepared by blending parts by mass.
　この調製以外は、実施例１と同様にして実施例４の評価サンプルを作製した。また、硬化後の導電性接着フィルムのガラス転移点は１８０℃であった。 Except for this preparation, an evaluation sample of Example 4 was produced in the same manner as Example 1. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 180 degreeC.
　［比較例１］
　表面電極部分及び裏面電極部分にフラックスを塗布し、はんだが被覆されたＣｕタブ線を仮配置させた。タブ線をヒーターヘッドにより熱加圧（２００℃、１５秒、２ＭＰａ）して接続させ、比較例１の評価サンプルを作製した。 [Comparative Example 1]
A flux was applied to the surface electrode portion and the back electrode portion, and Cu tab wires coated with solder were temporarily arranged. The tab wire was connected by applying heat and pressure (200 ° C., 15 seconds, 2 MPa) with a heater head to produce an evaluation sample of Comparative Example 1.
　［比較例２］
表１に示すように、フェノキシ樹脂Ａ（品名：ＹＰ５０、メーカー名：新日鐵化学（株））を２２質量部、エポキシ樹脂Ａ（品名：ＥＰ８２８、メーカー名：三菱化学（株））を１５質量部、アクリルゴム（品名：ＳＧ－８０－Ｈ、メーカー名：ナガセケムテックス（株））を１５質量部、潜在性硬化剤（品名：ＨＸ－３９４１、メーカー名：旭化成（株））を４５質量部、シランカップリング剤（品名：Ａ－１８７、メーカー名：モメンティブ・パフォーマンス・マテリアルズ（株））を２質量部、及び、導電性粒子（品名：ＡＵＬ７０４、メーカー名：積水化学工業）を１５質量部配合し、導電性接着フィルムの樹脂組成物を調製した。 [Comparative Example 2]
As shown in Table 1, 22 parts by mass of phenoxy resin A (product name: YP50, manufacturer: Nippon Steel Chemical Co., Ltd.) and 15 parts of epoxy resin A (product name: EP828, manufacturer: Mitsubishi Chemical Corporation) 15 parts by mass of acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation), 45 parts of latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Corporation) 2 parts by mass of silane coupling agent (product name: A-187, manufacturer name: Momentive Performance Materials Co., Ltd.) and conductive particles (product name: AUL704, manufacturer name: Sekisui Chemical Co., Ltd.) A resin composition of a conductive adhesive film was prepared by blending 15 parts by mass.
　この調製以外は、実施例１と同様にして比較例２の評価サンプルを作製した。また、硬化後の導電性接着フィルムのガラス転移点は１２５℃であった。 An evaluation sample of Comparative Example 2 was prepared in the same manner as Example 1 except for this preparation. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 125 degreeC.
　［比較例３］
　表１に示すように、フェノキシ樹脂Ｃ（品名：ｊｅｒ１０３１Ｓ、メーカー名：三菱化学（株））を２２質量部、エポキシ樹脂Ｂ（品名：ＲＫＢシリーズ、メーカー名：レジナス化成（株））を１５質量部、アクリルゴム（品名：ＳＧ－８０－Ｈ、メーカー名：ナガセケムテックス（株））を１５質量部、潜在性硬化剤（品名：ＨＸ－３９４１、メーカー名：旭化成（株））を４５質量部、シランカップリング剤（品名：Ａ－１８７、メーカー名：モメンティブ・パフォーマンス・マテリアルズ（株））を２質量部、及び、導電性粒子（品名：ＡＵＬ７０４、メーカー名：積水化学工業）を１５質量部配合し、導電性接着フィルムの樹脂組成物を調製した。 [Comparative Example 3]
As shown in Table 1, 22 parts by mass of phenoxy resin C (product name: jer1031S, manufacturer name: Mitsubishi Chemical Corporation), and 15 masses of epoxy resin B (product name: RKB series, manufacturer name: Resin Kasei Co., Ltd.) Parts, 15 parts by mass of acrylic rubber (product name: SG-80-H, manufacturer name: Nagase ChemteX Corporation), 45 masses of latent curing agent (product name: HX-3941, manufacturer name: Asahi Kasei Corporation) 2 parts by mass of silane coupling agent (product name: A-187, manufacturer name: Momentive Performance Materials Co., Ltd.) and 15 conductive particles (product name: AUL704, manufacturer name: Sekisui Chemical Co., Ltd.) The resin composition of the electroconductive adhesive film was prepared by blending parts by mass.
　この調製以外は、実施例１と同様にして比較例３の評価サンプルを作製した。また、硬化後の導電性接着フィルムのガラス転移点は２００℃であった。 An evaluation sample of Comparative Example 3 was produced in the same manner as Example 1 except for this preparation. Moreover, the glass transition point of the electroconductive adhesive film after hardening was 200 degreeC.
　［評価試験］
　各評価サンプルについて、－４０℃～１００℃の温度サイクルを１０００サイクル、２０００サイクル繰り返した後、表面電極及び裏面電極における抵抗値を測定した。また、表面電極及び裏面電極におけるタブ線の剥離を目視で観察した。 [Evaluation test]
For each evaluation sample, a temperature cycle of −40 ° C. to 100 ° C. was repeated 1000 cycles and 2000 cycles, and then the resistance values of the front electrode and the back electrode were measured. Moreover, peeling of the tab wire on the front electrode and the back electrode was visually observed.
　表１に各サンプルの評価結果を示す。総合判定の指標として、初期～２０００サイクルまでの信頼性試験において、表面電極における導通抵抗の値が４０Ω以下、裏面電極における導通抵抗の値が１５Ω以下、タブの剥離が表面電極及び裏面電極の両方で観察されなかったものを○とした。また、初期～２０００サイクルまでの信頼性試験において、表面電極における導通抵抗の値が４０Ω以下、裏面電極における導通抵抗の値が２０Ω以上、タブの剥離が表面電極及び裏面電極のいずれか一方で観察されたものを△とした。また、初期～２０００サイクルまでの信頼性試験において、表面電極における導通抵抗の値が５０Ω以上、裏面電極における導通抵抗の値が２５Ω以上、タブの剥離が表面電極及び裏面電極の両方で観察されたものを×とした。 Table 1 shows the evaluation results for each sample. As an index for comprehensive judgment, in the reliability test from the initial stage to 2000 cycles, the conduction resistance value on the front electrode is 40Ω or less, the conduction resistance value on the back electrode is 15Ω or less, and tab peeling occurs on both the front and back electrodes. What was not observed by (circle) was set as (circle). In addition, in the reliability test from the initial stage to 2000 cycles, the conduction resistance value on the front electrode is 40Ω or less, the conduction resistance value on the back electrode is 20Ω or more, and tab peeling is observed on either the front electrode or the back electrode. What was done was made into (triangle | delta). In the reliability test from the initial stage to 2000 cycles, the conduction resistance value on the front electrode was 50Ω or more, the conduction resistance value on the back electrode was 25Ω or more, and tab peeling was observed on both the front electrode and the back electrode. The thing was made into x.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　比較例１は、温度サイクル試験の１０００サイクルで表面及び裏面の両面のタブ線の剥離が見られ、２０００サイクルで導通抵抗が上昇した。また、比較例２は、温度サイクル試験の１０００サイクルでタブ線の剥離が見られ、２０００サイクルで導通抵抗が上昇した。また、比較例３は、硬化前のガラス転移点が２００℃であるが、硬化前のガラス転移点も大きいため、温度サイクル試験の１０００サイクルでタブ線の剥離が見られ、良好な接続信頼性が得られなかった In Comparative Example 1, peeling of the tab wires on both the front and back surfaces was observed in 1000 cycles of the temperature cycle test, and the conduction resistance increased in 2000 cycles. In Comparative Example 2, peeling of the tab wire was observed in 1000 cycles of the temperature cycle test, and the conduction resistance increased in 2000 cycles. In Comparative Example 3, the glass transition point before curing is 200 ° C., but since the glass transition point before curing is also large, peeling of the tab wire is seen in 1000 cycles of the temperature cycle test, and good connection reliability. Could not get
　一方、実施例１は、温度サイクル試験の１０００サイクルで裏面のタブ線の剥離が見られたものの、２０００サイクルでも表面の剥離は見られなかった。また、温度サイクル試験において導通抵抗の変化は小さかった。また、実施例２～４は、温度サイクル試験の２０００サイクルでも、表面又は裏面のタブ線の剥離は見られず、また、導通抵抗の変化はなかった。 On the other hand, in Example 1, peeling of the tab line on the back surface was observed in 1000 cycles of the temperature cycle test, but peeling of the surface was not seen even in 2000 cycles. Further, the change in conduction resistance was small in the temperature cycle test. In Examples 2 to 4, no peeling of the tab wire on the front surface or the back surface was observed even in 2000 cycles of the temperature cycle test, and the conduction resistance did not change.
　以上の結果より、硬化後のガラス転移点が１３０～１８０℃である導電接着フィルムを太陽電池モジュールに用いることにより、優れた接続信頼性が得られることが分かった。
特に、硬化後のガラス転移点が１４０～１８０℃である導電接着フィルムは、特に優れた接続信頼性を有することが分かった。 From the above results, it was found that excellent connection reliability can be obtained by using a conductive adhesive film having a glass transition point after curing of 130 to 180 ° C. for a solar cell module.
In particular, it was found that a conductive adhesive film having a glass transition point after curing of 140 to 180 ° C. has particularly excellent connection reliability.
１　太陽電池モジュール、２　太陽電池セル、３　タブ線、４　ストリングス、５　マトリクス、６　シート、７　表面カバー、８　バックシート、９　金属フレーム、１０　光電変換素子、１１　バスバー電極、１２　フィンガ電極、１３　Ａｌ裏面電極、２０　導電性接着フィルム、３０　減圧ラミネータ、３１　上部ユニット、３２　下部ユニット、３３　シール部材、３４　可撓性シート、３５　第１室、３６　第２室、３７、３８　配管、３９、４０　切替バルブ、４１　ステージ 1 solar cell module, 2 solar cell, 3 tab wire, 4 strings, 5 matrix, 6 sheet, 7 surface cover, 8 back sheet, 9 metal frame, 10 photoelectric conversion element, 11 bus bar electrode, 12 finger electrode, 13 Al Back electrode, 20 conductive adhesive film, 30 decompression laminator, 31 upper unit, 32 lower unit, 33 sealing member, 34 flexible sheet, 35 first chamber, 36 second chamber, 37, 38 piping, 39, 40 switching Valve, 41 stage

Claims (8)

  1. 　一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着フィルムを介してタブ線で電気的に接続させた太陽電池モジュールにおいて、
    　前記導電性接着フィルムの硬化後のガラス転移点が１３０～１８０℃である太陽電池モジュール。     In a solar cell module in which a surface electrode of one solar cell and a back electrode of another solar cell adjacent to the one solar cell are electrically connected with a tab wire through a conductive adhesive film,
    A solar cell module having a glass transition point of 130 to 180 ° C. after curing of the conductive adhesive film.
  2. 　前記導電性接着フィルムの硬化後のガラス転移点が１４０～１８０℃である請求項１記載の太陽電池モジュール。 The solar cell module according to claim 1, wherein the glass transition point of the conductive adhesive film after curing is 140 to 180 ° C.
  3. 　前記太陽電池セルは、封止接着剤で挟まれ、表面シート及び裏面シートとともにラミネートされてなる請求項１又２記載の太陽電池モジュール。 The solar cell module according to claim 1 or 2, wherein the solar cell is sandwiched between sealing adhesives and laminated together with a front sheet and a back sheet.
  4. 　一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させる太陽電池モジュールの製造方法において、
    　前記一の太陽電池セルの表面電極及び前記他の太陽電セルの裏面電極に、硬化後のガラス転移点が１３０～１８０℃である導電性接着材料を貼り合わせ、該導電性接着材料上にタブ線を仮配置する仮配置工程と、
    　前記タブ線の上面から加熱押圧ヘッドにより押圧する押圧工程と
    　を有する太陽電池モジュールの製造方法。     Method for manufacturing solar battery module, wherein surface electrode of one solar battery cell and back electrode of other solar battery cell adjacent to the one solar battery cell are electrically connected by a tab wire via a conductive adhesive material In
    A conductive adhesive material having a glass transition point after curing of 130 to 180 ° C. is bonded to the front electrode of the one solar cell and the back electrode of the other solar cell, and a tab is formed on the conductive adhesive material. A temporary placement step of temporarily placing the line;
    And a pressing step of pressing from the upper surface of the tab wire with a heating press head.
  5. 　前記導電性接着フィルムの硬化後のガラス転移点が１４０～１８０℃である請求項４記載の太陽電池モジュールの製造方法。 The method for producing a solar cell module according to claim 4, wherein a glass transition point of the conductive adhesive film after curing is 140 to 180 ° C.
  6. 　前記タブ線の接続後、太陽電池セルを封止接着剤で挟み、表面シート及び裏面シートとともにラミネートする請求項４又は５記載の太陽電池モジュールの製造方法。 6. The method of manufacturing a solar cell module according to claim 4 or 5, wherein after connecting the tab wires, the solar cells are sandwiched with a sealing adhesive and laminated together with a front sheet and a back sheet.
  7. 　一の太陽電池セルの表面電極と、該一の太陽電池セルと隣接する他の太陽電池セルの裏面電極とを導電性接着材料を介してタブ線で電気的に接続させる太陽電池モジュールの製造方法において、
    　前記一の太陽電池セルの表面電極とタブ線、及び前記他の太陽電池セルの裏面電極とタブ線とを、硬化後のガラス転移点が１３０～１８０℃である導電性接着材料を介在させて仮配置する仮配置工程と、
    　前記太陽電池セルの上下面に封止材、保護基材を順に積層し、前記保護基材の上面からラミネート装置にてラミネート圧着させ、前記封止材を硬化させるとともに前記表面電極とタブ線及び前記裏面電極とタブ線とを接続させるラミネート圧着工程と
    　を有する太陽電池モジュールの製造方法。     Method for manufacturing solar battery module, wherein surface electrode of one solar battery cell and back electrode of other solar battery cell adjacent to the one solar battery cell are electrically connected by a tab wire via a conductive adhesive material In
    A conductive adhesive material having a glass transition point after curing of 130 to 180 ° C. is interposed between the front electrode and the tab wire of the one solar cell and the back electrode and the tab wire of the other solar cell. A temporary placement step for temporary placement;
    A sealing material and a protective base material are sequentially laminated on the upper and lower surfaces of the solar battery cell, laminated and pressure-bonded by a laminating apparatus from the upper surface of the protective base material, and the sealing material is cured and the surface electrode and the tab wire and A method for producing a solar cell module, comprising: a laminate crimping step for connecting the back electrode and the tab wire.
  8. 　太陽電池セルの表面電極又は裏面電極と、タブ線とを電気的に接続させる導電性接着材料において、
    　硬化後のガラス転移点が１３０～１８０℃である導電性接着材料。     In the conductive adhesive material that electrically connects the surface electrode or back electrode of the solar battery cell and the tab wire,
    A conductive adhesive material having a glass transition point of 130 to 180 ° C. after curing.
PCT/JP2011/076453 2010-11-30 2011-11-16 Solar cell module and production method for same WO2012073702A1 (en)

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